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Note : EN 1 6 BP
GND 2 GND 2 5 NC
RichTek Pb-free and Green products are : VIN 3 4 VOUT
`RoHS compliant and compatible with the current require- EN 3 4 BP
RT9193
VIN VIN VOUT VOUT
CIN COUT
1uF/X7R GND 1uF/X7R
Chip Enable EN BP
CBP
22nF
EN Shutdown VIN
Quick and
Start Logic Control
BP VREF
+
MOS Driver
-
Error
Amplifier VOUT
Current-Limit
and
Thermal
Protection
GND
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, CBP = 22nF, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Units
Output Voltage Accuracy ΔVOUT IOUT = 1mA −2 -- +2 %
Current Limit ILIM RLOAD = 1Ω 360 400 -- mA
Quiescent Current IQ VEN ≥ 1.2V, IOUT = 0mA -- 90 130 μA
IOUT = 200mA, VOUT > 2.8V 170 200
Dropout Voltage (Note 5) VDROP mV
IOUT = 300mA, VOUT > 2.8V -- 220 300
VIN = (VOUT + 1V) to 5.5V,
Line Regulation ΔVLINE -- -- 0.3 %
IOUT = 1mA
Load Regulation ΔVLOAD 1mA < IOUT < 300mA -- -- 0.6 %
Standby Current ISTBY VEN = GND, Shutdown -- 0.01 1 μA
EN Input Bias Current IIBSD VEN = GND or VIN -- 0 100 nA
Logic-Low Voltage VIL VIN = 3V to 5.5V, Shutdown -- -- 0.4
EN Threshold V
Logic-High Voltage VIH VIN = 3V to 5.5V, Start-Up 1.2 -- --
10Hz to 100kHz, IOUT = 200mA
Output Noise Voltage eNO -- 100 -- μVRMS
COUT = 1μF
Power Supply f = 100Hz -- −70 --
PSRR COUT = 1μF, IOUT = 10mA dB
Rejection Rate f = 10kHz -- −50 --
Thermal Shutdown Temperature TSD -- 165 -- °C
To be continued
DS9193-09 March 2007 www.richtek.com
3
RT9193
Parameter Symbol Test Conditions Min Typ Max Units
Thermal Shutdown Temperature
ΔTSD -- 30 -- °C
Hysteresis
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θ JA is measured in the natural convection at T A = 25°C on a low effective thermal conductivity test board
(Single Layer, 1S) of JEDEC 51-3 thermal measurement standard.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
85
1.6
80
1.5
75
1.4
70
1.3 65
1.2 60
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
200
PSRR (dB)
-20
TJ = 25°C
150
-40
TJ = -40°C
100
ILoad = 100mA
-60
50 ILoad = 10mA
0 -80
10
0.01 100
0.1 1K
1 10K
10 100K
100 1M
1000
0 0.05 0.1 0.15 0.2 0.25 0.3
Load Current (A) Frequency (kHz)
(Hz)
1.25 0
Output Voltage
1
2
(V)
1
0.75
0
0.5
-50 -25 0 25 50 75 100 125 Time (500μs/Div)
Temperature (°C)
Load Current
Load Current
(mA)
(mA)
50 200
0 0
Deviation (mV)
Output Voltage
Deviation (mV)
Output Voltage
20 50
0 0
-20 -50
5 5
4 4
Deviation (mV)
Deviation (mV)
Output Voltage
Output Voltage
10 10
0 0
-10 -10
Noise Noise
VIN = 4.5V RT9193-30CB VIN = 4.5V RT9193-15CU5
CIN = COUT = 1uF, X7R ILoad = 50mA CIN = COUT = 1uF, X7R ILoad = 50mA
200 200
100 100
Noise (μV)
Noise (μV)
0 0
-100 -100
-200 -200
Start Up
VIN = 5V RT9193-28CU5
EN Pin Voltage
0
Output Voltage
2
(V)
Time (10μs/Div)
1
1.00 resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
Stable
0.10 junction to ambient. The maximum power dissipation can
be calculated by following formula :
0.01
PD(MAX) = ( TJ(MAX) − TA ) /θJA
RT9193-15CU5
Simulation Verify CIN = COUT = 1uF, X7R
0.00
Where T J(MAX) is the maximum operation junction
0 50 100 150 200 250 300 temperature 125°C, TA is the ambient temperature and
Load Current (mA) the θJA is the junction to ambient thermal resistance.
Figure 1
500
SOT-23-5
400
SC 70-5
300
200
100
0
0 25 50 75 100 125 150
Ambient Temperature (°C)
H
D
L
C B
A
A1
e
H
D
L
C B
A
A1
e
D D2
E E2
SEE DETAIL A
1
e
b 2 1 2 1
A
A3
A1
DETAIL A
Pin #1 ID and Tie Bar Mark Options