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DM705
EQUIPMENT MANUAL
204-4069-30 rev. 30 Date: 6/10/2017
WARRANTY
This product is guaranteed to be free against manufacturing and raw material defects, during the period
specified in the sales receipt.
The warranty includes only the repair and replacement of components or defective parts, free of charge.
The warranty does not cover damages caused by any one of the following conditions: improper use,
energy failures, natural phenomena (lightning, for example), failure in devices connected to this product,
improper grounding or repairs done by DATACOM unauthorized personnel.
This warranty does not cover repairs done at the customer’s site. All products must be sent to DATACOM
to be repaired.
Although this document has been written with care, the company does not assume responsibility for
occasional mistakes and omissions in its content. Likewise, DATACOM is not liable for any damages that
may result from the use of the information contained in this manual. Specifications provided in this manual
are subject to changes without any previous notice and should not be construed as a commitment of any
kind by DATACOM.
CONTACTS
In order to contact the DATACOM technical support, or sales department:
Support
o E-mail: support@datacom.ind.br
Sales
o E-mail: sales@datacom.ind.br
Internet
o www.datacom.ind.br
Address
o DATACOM
Command or Button - Always that some reference to a command, a button or a software menu is
made, this indication will be in italic.
Table 1. Commands and messages from terminal screens are presented in not-
formatted text, preceded from #.
Notes give an explanation about some topic in the foregoing paragraph.
This symbol means that this text is very important and, if the orientations were not correct followed, it may
cause damage or hazard.
This symbols means that, case the procedure was not correctly followed, may exist electrical shock risk.
Indicates that an equipment or a part is ESDS (Electrostatic Discharge Sensitive). It should not be handled
without grounding wrist strap or equivalent.
IWEEE Directive Symbol (Applicable in the European Union and other European countries with separate
collection systems).This symbol on the product or its packaging indicates that this product must not be
disposed of with other waste. Instead, it is your responsibility to dispose of your waste equipment by
handing it over to a designated collection point for the recycling of waste electrical and electronic
equipment. The separate collection and recycling of your waste equipment at the time of disposal will help
conserve natural resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your consumer waste equipment for
recycling, please contact your local city recycling office or the dealer from whom you originally purchased
the product
TELECOMMUNICATION SAFETY
Telecommunication network interfaces are classified according to their circuit characteristics. The following
table lists the status of safety circuit characteristics of several standard interfaces. If the safety
characteristic of a given interface type differs from the standard one, a notice will be given in the
equipment manual.
Some SELV and TNV circuits use the same connectors. To avoid electrical shock, do not connecting
SELV to TNV circuits.
This is a Class A product. In a domestic environment, this product may cause radio interference in which
case the user may be required to take adequate measures
INDEX
1. GENERAL RECOMMENDATION .................................................16
2. Introduction ..................................................................................18
2.1. General Characteristics of DM705-SUB ............................................................... 18
2.1.1. CPU: ............................................................................................................................................ 18
2.1.2. Power supply ............................................................................................................................... 18
2.1.3. Dimensions: ................................................................................................................................. 18
2.2. General Characteristics of DM705 HW2 ............................................................... 18
2.2.1. CPU ............................................................................................................................................. 19
2.2.2. Power Supply............................................................................................................................... 19
2.2.3. Dimensions .................................................................................................................................. 19
2.3. Common Applications........................................................................................... 19
2.4. Accessories .......................................................................................................... 20
2.4.1. MA-10 .......................................................................................................................................... 20
2.4.2. MA-09 .......................................................................................................................................... 20
2.4.3. MA-04 .......................................................................................................................................... 21
2.4.4. MA-08 .......................................................................................................................................... 21
2.4.5. MA-05 .......................................................................................................................................... 22
3. Technical Specifications ...............................................................23
3.1. Environmental Conditions ..................................................................................... 23
3.2. Power Supply – FAL HW2 for DM705 HW2.......................................................... 23
3.3. Power Supply – FAL HW2 for DM705-SUB .......................................................... 24
3.4. Power Supply – PSU HW3 for DM705-SUB ......................................................... 26
3.5. Consumption Calculation ...................................................................................... 28
3.6. Supported Cards .................................................................................................. 29
3.7. Weight .................................................................................................................. 29
3.8. Dimensions of DM705-SUB Chassis .................................................................... 30
3.9. Dimensions of the DM705 HW2 Chassis .............................................................. 31
3.10. Description of CPU34, CPU64 and CPU128 ...................................................... 32
3.10.1. Light indicators........................................................................................................................... 33
4. General Operation ........................................................................34
4.1. Cross Connection Matrix ...................................................................................... 34
4.1.1. Example of Matrix Seizure ........................................................................................................... 35
4.2. System Clock ....................................................................................................... 36
4.2.1. Hierarchy Switching ..................................................................................................................... 36
4.2.2. Sync message switching ............................................................................................................. 37
4.3. Hot Restart ........................................................................................................... 37
5. CPU Redundancy ........................................................................40
5.1. Operating Characteristics ..................................................................................... 40
5.1.1. Redundant Operating Mode......................................................................................................... 40
5.1.2. Sync process ............................................................................................................................... 40
5.1.3. Switching Test ............................................................................................................................. 41
6. Electrical E1 Card - E1 .................................................................42
6.1. Electrical E1 Interface and its Indicators ............................................................... 43
6.2. Backup Line ......................................................................................................... 43
6.3. Pin-strap configuration.......................................................................................... 43
6.4. E1 Interface Tests ................................................................................................ 44
6.4.1. Front-end Loopback Test ............................................................................................................. 44
6.4.2. Local Analog Loopback Test - LAL .............................................................................................. 44
6.4.3. Local Digital Loopback Test – LDL (E1 HW1 only) ...................................................................... 45
7. Electrical E1 Card - E1Q ..............................................................46
7.1. General Information .............................................................................................. 46
7.2. Tests on the E1Q Interface ................................................................................... 46
7.2.1. Local Digital Loopback Test - LDL ............................................................................................... 46
7.2.2. Local Analog Loopback Test – LAL ............................................................................................. 47
7.2.3. Front End BERT Test .................................................................................................................. 47
7.2.4. Back End BERT Test ................................................................................................................... 47
8. Electrical E1 Card - E1-16 ............................................................49
8.1. General Information .............................................................................................. 49
8.2. Strapping .............................................................................................................. 51
8.3. Accessories .......................................................................................................... 52
8.3.1. RB-09 .......................................................................................................................................... 52
8.3.2. AD-TL64 ...................................................................................................................................... 53
8.4. Tests on the E1-16 Interface ................................................................................ 53
8.4.1. Local Digital Loopback Test - LDL ............................................................................................... 53
8.4.2. Local Analog Loopback Test - LAL .............................................................................................. 53
8.4.3. Front End BERT Test .................................................................................................................. 54
8.4.4. Back End BERT Test ................................................................................................................... 54
9. Optical E1 Card – FO/FO2 ...........................................................55
9.1. General Information .............................................................................................. 55
9.2. Optical modules available ..................................................................................... 56
9.3. Backup line........................................................................................................... 57
9.4. Tests on the FO/FO2 HW3 Interface .................................................................... 57
9.4.1. Local Digital Loopback Test on the E1 for Connection with the Matrix - LDL .............................. 57
9.4.2. Local Digital Loopback Test on the Physical Interfaces - LDL ..................................................... 57
9.4.3. Laser Tests .................................................................................................................................. 57
9.4.4. FO HW2 Card Tests .................................................................................................................... 58
10. G.shdsl – DSL2 / DSL2 HW2 / DSL8 Cards .................................59
10.1. Connection ......................................................................................................... 60
10.1.1. Pre-Activation (Handshake) ....................................................................................................... 60
10.1.2. Activation (Training) ................................................................................................................... 60
10.1.3. Data Mode ................................................................................................................................. 61
10.2. Operation Modes ................................................................................................ 61
10.2.1. Terminal Type ............................................................................................................................ 61
10.2.2. Frame Mode .............................................................................................................................. 61
10.2.3. Annex ........................................................................................................................................ 61
10.3. Performance ....................................................................................................... 62
10.4. Electrical Protection ............................................................................................ 62
10.5. Operation at 4 wires (DSL8 only) ........................................................................ 62
10.6. Accessories ........................................................................................................ 63
10.6.1. CB-24RJ45-T50F....................................................................................................................... 63
10.7. DSL Interface Tests ............................................................................................ 63
10.7.1. Local Digital Loopback Test – LDL ............................................................................................ 63
10.7.2. Front End BERT Test ................................................................................................................ 63
10.7.3. Back End BERT Test (DSL8 only) ............................................................................................. 64
10.7.4. TXRDL Test (DSL8 only) ........................................................................................................... 64
11. Voice Cards ..................................................................................65
11.1. DM705-FXS/FXS4/10 (Subscriber card) ............................................................. 65
11.2. DM705-FXO/FXO4/10 (Central Office card) ....................................................... 67
11.3. DM705-E&M ....................................................................................................... 69
11.3.1. Analog Signaling (physical connection) ..................................................................................... 70
11.3.2. Digital Signaling ......................................................................................................................... 72
11.4. Electrical Protection ............................................................................................ 73
11.5. Applications ........................................................................................................ 73
11.5.1. FXS – FXS/Omnibus (Hot Line) ................................................................................................. 73
11.5.2. FXO – FXS (CPTC – subscriber) ............................................................................................... 74
11.5.3. FXS – FXS (hot-line) .................................................................................................................. 74
11.5.4. FXO – FXO ................................................................................................................................ 74
11.5.5. E&M – at two or four wires: ........................................................................................................ 74
11.6. Accessories ........................................................................................................ 75
11.6.1. CO-TL50 .................................................................................................................................... 75
11.7. Voice Card Tests ................................................................................................ 75
11.7.1. Local Digital Loopback Test – LDL ............................................................................................ 75
11.7.2. BERT Test ................................................................................................................................. 76
11.7.3. FXS and FXO RING Test........................................................................................................... 76
11.7.4. FXS and FXO OFF HOOK Test ................................................................................................. 76
11.7.5. E and M signal Test ................................................................................................................... 76
12. Codirecional G.703 card - G64 .....................................................77
12.1. G.703 Codirectional Interface Configuration ....................................................... 77
12.2. G64 Interface Tests ............................................................................................ 78
12.2.1. Local Digital Loopback Test – LDL ............................................................................................ 78
12.2.2. BERT Test ................................................................................................................................. 78
13. Base Band Modem Card - MBB ..................................................79
13.1. Technical Specifications ..................................................................................... 79
13.1.1. Electrical Characteristics............................................................................................................ 79
13.1.2. Transmission Medium ................................................................................................................ 79
13.1.3. Receiver Characteristics ............................................................................................................ 79
13.1.4. Synchronism .............................................................................................................................. 79
13.1.5. Pinning ....................................................................................................................................... 80
13.2. Status Indicators................................................................................................. 80
13.2.1. Synchronism (LOS/SYNC/AIS) indicator: .................................................................................. 80
13.2.2. Line Quality Indicators: .............................................................................................................. 80
13.2.3. SLIP Indicators: ......................................................................................................................... 81
13.3. BASE BAND MODEM Interface Tests ................................................................ 81
13.3.1. Local Digital Loopback Test – LDL ............................................................................................ 81
13.3.2. BERT Test ................................................................................................................................. 81
13.3.3. Remote Digital Loopback Test - RDL ........................................................................................ 81
14. V.35D - V-35-V.36/V.11-V.28 card................................................82
14.1. Digital Interface Signals and its Indicators .......................................................... 82
14.1. X.21.................................................................................................................... 83
14.2. RS-232 ............................................................................................................... 84
14.3. RS-422 ............................................................................................................... 84
14.4. Low Speed Ports (X.50) ..................................................................................... 84
14.4.1. Configuring for X.50: .................................................................................................................. 84
14.4.2. Cares when configuring for X.50 (Groups): ............................................................................... 85
14.5. V.35 Interface ..................................................................................................... 86
14.6. V.28 Interface ..................................................................................................... 87
14.7. Interface V.36/V.11 ............................................................................................. 87
14.8. Structured V.35/V.36 Interface ........................................................................... 88
14.9. Configuring the Straps ........................................................................................ 88
14.10. V.35D Interface Tests ....................................................................................... 89
14.10.1. Local Digital Loopback Test – LDL .......................................................................................... 89
14.10.2. Local Analog Loopback Test – LAL ......................................................................................... 90
14.10.3. BERT Test ............................................................................................................................... 90
14.10.4. BERT in the Structured V.35.................................................................................................... 90
14.10.5. Remote Digital Loopback Test - RDL ...................................................................................... 91
14.10.6. Structured V.35 RDL. ............................................................................................................... 91
15. 6V35 - V.35-V.36/V.11-V.28 card .................................................92
15.1. Signals in the Digital Interface and its Indicators ................................................. 92
15.2. Pin-strap configuration........................................................................................ 96
15.3. Accessories ........................................................................................................ 97
15.3.1. DB44M – 3xDB25F .................................................................................................................... 97
15.3.2. RB-04 ........................................................................................................................................ 98
15.3.3. CB-DB44M-T50F ....................................................................................................................... 98
15.4. 6V35 Card Tests ................................................................................................ 99
15.4.1. Local Digital Loopback Test - LDL ............................................................................................. 99
15.4.2. Local Analog Loopback Test - LAL ............................................................................................ 99
15.4.3. BERT Test ................................................................................................................................. 99
15.4.4. Remote Digital Loopback Test - LDR ...................................................................................... 100
16. House Keeping Card ..................................................................101
16.1. General Information .......................................................................................... 101
16.2. Alarm Inputs Configuration ............................................................................... 102
16.3. Alarm Outputs Configuration ............................................................................ 103
16.4. RS232 Interface configurations ........................................................................ 103
16.5. Pin-strap configuration...................................................................................... 103
16.6. Tests on the HK interface ................................................................................. 105
16.6.1. Local Digital Loopback Test - LDL ........................................................................................... 105
16.6.2. Back BERT Test ...................................................................................................................... 105
17. House Keeping HW2 Card .........................................................106
17.1. General Information .......................................................................................... 106
17.2. Alarm Inputs Settings ....................................................................................... 108
17.3. Analog Measurement Input Settings ................................................................. 109
17.4. Alarm Outputs Settings..................................................................................... 109
17.5. RS-232 Interfaces Settings ............................................................................... 110
17.6. Straps configuration.......................................................................................... 110
17.7. Accessories ...................................................................................................... 112
17.7.1. MK-02 ...................................................................................................................................... 112
17.8. Tests on the HK HW2 interface ........................................................................ 113
17.8.1. Local Digital Loopback Test - LDL ........................................................................................... 113
17.8.2. Back BERT Test ...................................................................................................................... 114
18. Switch Card ................................................................................115
18.1. Front Panel ....................................................................................................... 115
18.2. Functionalities .................................................................................................. 116
18.3. Interfaces ......................................................................................................... 116
18.3.1. Bridge ...................................................................................................................................... 116
18.3.2. Switch ...................................................................................................................................... 116
18.4. Ports ................................................................................................................. 116
18.5. Operating Modes .............................................................................................. 116
18.6. Tests ................................................................................................................ 117
19. IP 16E1 / 8E1 / 4E1 / 2E1 cards .................................................118
19.1. Front Panel ....................................................................................................... 119
19.2. Interfaces ......................................................................................................... 119
19.2.1. Ethernet (ETH)......................................................................................................................... 119
19.2.2. TDM ......................................................................................................................................... 119
19.3. Functioning Details ........................................................................................... 120
19.4. Application ........................................................................................................ 120
19.5. Tests ................................................................................................................ 121
20. CESOP 16E1 / 8E1 / 4E1 / 2E1 card ..........................................122
20.1. Front Panel ....................................................................................................... 123
20.2. Interfaces ......................................................................................................... 123
20.2.1. Ethernet (ETH)......................................................................................................................... 123
20.2.2. TDM (Bundle) .......................................................................................................................... 123
20.3. Operation details .............................................................................................. 123
20.4. Application ........................................................................................................ 124
20.5. Tests ................................................................................................................ 124
21. HS STM1 Interfaces ...................................................................126
21.1. DM705-HS-STM1E: STM-1 Electrical Interface ................................................ 126
21.1.1. LED indicators: ........................................................................................................................ 126
21.2. DM705-HS-FO: STM-1 Optical Interface .......................................................... 127
21.2.1. Optical Links Specification ....................................................................................................... 127
21.2.2. LEDs Indicators: ...................................................................................................................... 128
21.3. DM705-HS-FO SFP.......................................................................................... 129
21.3.1. LEDs Indicators: ...................................................................................................................... 130
21.4. HS Interface Tests ............................................................................................ 131
21.4.1. Connection E1 Tests: .............................................................................................................. 131
22. HS-E3E Interface .......................................................................133
22.1. DM705-HS-E3E: Electrical E3 Interface ........................................................... 133
22.1.1. Characteristics ......................................................................................................................... 133
22.1.2. Indication LEDs:....................................................................................................................... 133
22.2. Clock ................................................................................................................ 133
22.3. Backup ............................................................................................................. 133
22.4. Tests ................................................................................................................ 134
22.4.1. LDL .......................................................................................................................................... 134
22.4.2. Front End Loopback ................................................................................................................ 134
23. CPU Straps ................................................................................135
23.1. DM705-CPU34, DM705-CPU64 and DM705-CPU128 Card ............................. 135
23.1.1. Selection of the external clock input termination (strap E6): .................................................... 135
24. Network Interfaces .....................................................................137
25. Alarms ........................................................................................138
26. Hot Swap ....................................................................................139
26.1. Hot-Swap on the CPU Card.............................................................................. 139
26.2. Power Supply Card Hot Swap .......................................................................... 139
26.2.1. Procedures for safely inserting a POWER SUPPLY card ........................................................ 139
26.2.2. Removing Power Supply with Security .................................................................................... 140
26.3. Interface Card Hot Swap .................................................................................. 140
26.3.1. Interface cards that can be “hot swapped” ............................................................................... 140
26.3.2. Interface cards that can NOT be “hot swapped” (risk to the equipment and to the card) ......... 140
27. Annex - Applicable Standards ....................................................141
27.1. Applicable Standards........................................................................................ 141
28. Annex 2 - Safety Warnings .........................................................143
29. Anlage 2 - Sicherheitshinweise ...................................................148
FIGURE INDEX
Figure 1. MA-10 ...................................................................................................... 20
Figure 2. MA-09 ...................................................................................................... 21
Figure 3. MA-04 ...................................................................................................... 21
Figure 4. MA-08 ...................................................................................................... 22
Figure 5. MA-05 with the MA-08 panel and two CB-DB44M-T50F cables ............... 22
Figure 6. FAL HW 2 Panel - DM705 HW2 Chassis ................................................. 23
Figure 7. Front Panel of FAL HW2 for DM705-SUB chassis. .................................. 24
Figure 8. Straps Map of FAL HW2 .......................................................................... 26
Figure 9. PSU HW3 Front Panel ............................................................................. 27
Figure 10. Warning on Power Supply Top ............................................................ 27
Figure 11. DM705-SUB Chassis view. .................................................................. 31
Figure 12. DM705 HW2 Chassis view. ................................................................. 31
Figure 13. CPU34 Panel ....................................................................................... 32
Figure 14. CPU64 Panel ....................................................................................... 32
Figure 15. CPU128 Panel ..................................................................................... 32
Figure 16. Panel of the Electrical E1 interface card with RJ45 .............................. 42
Figure 17. Electrical E1 front panel with DB9 connector ....................................... 42
Figure 18. Electrical E1 interface strap map ......................................................... 44
Figure 19. Front-end loopback diagram on the electrical E1 ................................. 44
Figure 20. LAL Test diagram on the electrical E1 ................................................. 45
Figure 21. LDL Test diagram on the E1Q ............................................................. 45
Figure 22. E1Q Front Panel with BNC connectors ................................................ 46
Figure 23. E1Q Front Panel with RJ45 connectors ............................................... 46
Figure 24. LDL test diagram on the E1Q............................................................... 47
Figure 25. LAL test diagram on the E1Q ............................................................... 47
Figure 26. Front BERT Diagram on the E1Q ........................................................ 47
Figure 27. BERT Diagram on the E1Q .................................................................. 48
Figure 28. E1-16 Front panel (75 ohms) ............................................................... 49
Figure 29. E1-16 Front Panel (120 ohms) ............................................................. 49
Figure 30. Strap Map - E1-16 ............................................................................... 52
Figure 31. RB-09 BNC .......................................................................................... 52
Figure 32. AD-TL64 .............................................................................................. 53
Figure 33. LDL test diagram on the E1-16 ............................................................ 53
Figure 34. LAL test diagram on the E1-16 ............................................................ 53
Figure 35. Front BERT Diagram on the E1-16 ...................................................... 54
Figure 36. Back BERT Diagram on the E1-16 ...................................................... 54
Figure 37. FO HW3 Front Panel ........................................................................... 55
Figure 38. FO2 HW3 Front Panel ......................................................................... 55
Figure 39. LDL test diagram on the E1s of matrix connection on the FO/FO2 ...... 57
Figure 40. LDL test diagram on the physical interface at the FO/FO2 HW3 .......... 57
Figure 41. G.SHDSL card panel - DM705-DSL1 ................................................... 59
Figure 42. G.SHDSL card panel - DM705-DSL2 .................................................. 59
Figure 43. G.SHDSL panel – DM705-DSL2 HW2 ................................................. 59
Figure 44. G.SHDSL card panel - DM705-DSL8 ................................................... 60
Figure 45. CB-24RJ45-T50F................................................................................. 63
Figure 46. DSL Interface LDL Test Diagram ......................................................... 63
Figure 47. DSL Front End BERT Test diagram ..................................................... 63
Figure 48. DSL Back End BERT Test diagram ..................................................... 64
Figure 49. RDL Test Diagram DSL8 ..................................................................... 64
Figure 50. DM705-FXS Voice Card Panel ............................................................ 65
Figure 51. DM705-FXS4 Voice Card Panel .......................................................... 66
Figure 52. DM705-FXS10 Voice Card Panel ........................................................ 66
Figure 53. DM705-FXO Voice Card Panel ............................................................ 68
Figure 54. DM705-FXO4 Front Panel ................................................................... 68
Figure 55. DM705-FXO10 Front Panel ................................................................. 68
Figure 56. DM705-E&M Voice Card Panel............................................................ 69
Figure 57. E&M Signaling Types .......................................................................... 71
Figure 58. Strap location on the E&M card ........................................................... 72
Figure 59. Example of Application - FXO x FXS ................................................... 74
Figure 60. FXS x FXS Application Example .......................................................... 74
Figure 61. Example of Application - FXO x FXO ................................................... 74
Figure 62. Example of Application - E&M.............................................................. 75
Figure 63. CO-TL50 .............................................................................................. 75
Figure 64. LDL Test Diagram on the Voice Cards................................................. 75
Figure 65. BERT Test Diagram on Voice Cards.................................................... 76
Figure 66. RING and OFF-HOOK Tests on the Voice Cards ................................ 76
Figure 67. G.703 Interface card Panel - Co directional ......................................... 77
Figure 68. LDL Test diagram on the G64 .............................................................. 78
Figure 69. BERT Test diagram on the G64 ........................................................... 78
Figure 70. BASE BAND MODEM Front Panel ...................................................... 79
Figure 71. LDL Test diagram on the BASE BAND MODEM .................................. 81
Figure 72. BERT Test diagram on BASE BAND MODEM ..................................... 81
Figure 73. V.35 Dual interface card panel ............................................................. 82
Figure 74. Structured V.35 Example: Connecting Two Muxes .............................. 88
Figure 75. V.35 Dual Card Strap Map ................................................................... 89
Figure 76. LDL test diagram on V.35D .................................................................. 90
Figure 77. LAL test diagram on V.35D .................................................................. 90
Figure 78. BERT test diagram on V.35D ............................................................... 90
Figure 79. BERT test diagram on Structured V.35D ............................................. 91
Figure 80. V.35D RDL test diagram ...................................................................... 91
Figure 81. Remote digital loopback on Structured V.35 interface .......................... 91
Figure 82. 6V35 Interface card panel .................................................................... 92
Figure 83. 6V35 Card Strap Map .......................................................................... 97
Figure 84. CB-DB44M – 3xDB25F ........................................................................ 97
Figure 85. RB-04 .................................................................................................. 98
Figure 86. CB-DB44M-T50F ................................................................................. 98
Figure 87. LDLTest Diagram on the 6V35............................................................. 99
Figure 88. LAL Test Diagram on the 6V35 ............................................................ 99
Figure 89. BERT Test Diagram on the 6V35 ......................................................... 99
Figure 90. LDR Test Diagram on the 6V35 ......................................................... 100
Figure 91. HK Front Panel .................................................................................. 101
Figure 92. DB25 connector pin out for HK .......................................................... 102
Figure 93. Alarm input configurations ................................................................. 103
Figure 94. HK Card strap map ............................................................................ 104
Figure 95. LDL test diagram on the HK ............................................................... 105
Figure 96. Back BERT Diagram on the HK ......................................................... 105
Figure 97. DM705-HK HW2 Front Panel. ............................................................ 106
Figure 98. Number of pins in the DB44 connector for DM705-HK HW2 .............. 108
Figure 99. Alarm input settings. .......................................................................... 109
Figure 100. HK HW2 Card strap map ................................................................... 112
Figure 101. MK-02 with protection lid.................................................................... 113
Figure 102. MK-02 without protection lid. .............................................................. 113
Figure 103. LDL test diagram on the HK ............................................................... 114
Figure 104. Back BERT Diagram on the HK ......................................................... 114
Figure 105. Switch card front panel ...................................................................... 115
Figure 106. Operation on the Bridge mode ........................................................... 116
Figure 107. Operation on the Switch mode ........................................................... 117
Figure 108. Operation with VLANs ....................................................................... 117
Figure 109. DM705-IP 16E1 Front Panel .............................................................. 119
Figure 110. Topology of application for the IP Circuit Card ................................... 120
Figure 111. IP-Switch mode application topology ................................................. 121
Figure 112. DM705-CESoP 16E1 front panel ....................................................... 123
Figure 113. Topology of application for the CESoP Circuit Card ........................... 124
Figure 114. Examples of tests regarding the CESoP Circuit Card ........................ 125
Figure 115. HS-STM1E Panel .............................................................................. 126
Figure 116. HS-FO Panel ..................................................................................... 127
Figure 117. Panel DM705-HS-FO SFP ................................................................. 129
Figure 118. HS SPI Back End Loopback Diagram ................................................ 131
Figure 119. HS SPI Front End Loopback Diagram................................................ 131
Figure 120. HC VC-4 Front End Loopback Diagram ............................................. 131
Figure 121. Front End Loopback Diagram on the Connection E1 ......................... 132
Figure 122. HS-E3E Panel ................................................................................... 133
Figure 123. Local Digital Loopback Diagram ........................................................ 134
Figure 124. Front End Loopback Diagram ............................................................ 134
Figure 125. Basic Unit Strap Map ......................................................................... 136
Figure 126. Drawing Interface Card Connector with Hot Swap ............................. 140
Figure 127. Drawing Interface Card Connector without Hot Swap ........................ 140
TABLE INDEX
Table 1. Input Power - FAL HW2 for the DM705 HW2 Chassis. ............................ 24
Table 2. The Power Input – FAL HW2 for DM705-SUB chassis. ........................... 25
Table 3. Power Recommended Limits of FAL HW3 ............................................... 26
Table 4. Maximum Power Limits of FAL HW3 ....................................................... 27
Table 5. Input Power - PSU HW3 .......................................................................... 28
Table 6. Card Compatibility with the CPUs ............................................................ 29
Table 7. Weights. .................................................................................................. 30
Table 8. Dimensions of DM705-SUB Chassis ....................................................... 30
Table 9. Dimensions of DM705 HW2 Chassis ....................................................... 31
Table 10. RS232 Connector .................................................................................... 32
Table 11. DB9 Alarm connector pin out. .................................................................. 32
Table 12. Ethernet connector RJ45 ......................................................................... 33
Table 13. Matrix Seizure ......................................................................................... 35
Table 14. Example of Matrix Seizure ....................................................................... 36
Table 15. Unavailability times on Firmware upgrade – CPU34 ................................ 37
Table 16. Unavailability times on Firmware upgrade – CPU64 ................................ 38
Table 17. Unavailability times on Firmware upgrade – CPU128 .............................. 39
Table 18. RJ45 connector pin out for G.703 ............................................................ 42
Table 19. DB9 connector pin out for G.703 ............................................................. 42
Table 20. Straps of E1 card ..................................................................................... 43
Table 21. RJ48 connector pin out for E1Q ............................................................... 46
Table 22. Telco64 connector pin out. ...................................................................... 50
Table 23. Strapping - E1-16 .................................................................................... 51
Table 24. Optical interfaces characteristics ............................................................. 56
Table 25. G.SHDSL RJ45 interface connector pin out ............................................. 59
Table 26. G.SHDSL card range ............................................................................... 62
Table 27. FXS - RJ11 connector pin out .................................................................. 66
Table 28. FXS4 - Telco50 connector pin out............................................................ 66
Table 29. FXS10 - Telco50 connector pin out.......................................................... 67
Table 30. LEDs indication description – FXS/FXS4/FXS10 ..................................... 67
Table 31. FXO – RJ11 connector pin out................................................................. 68
Table 32. FXO4 – Telco50 connector pin out .......................................................... 68
Table 33. FXO10 – Telco50 connector pin out ........................................................ 69
Table 34. LEDs indication description – FXO/FXO4/FXO10 .................................... 69
Table 35. Straps configuration of E&M card ............................................................ 70
Table 36. RJ45 connector pin out for the E&M card ................................................ 71
Table 37. LEDs indication description – E&M .......................................................... 71
Table 38. G64 interface’s pin out ............................................................................. 77
Table 39. BASE BAND MODEM Interface pin out. .................................................. 80
Table 40. Description of the LED indications – BASE BAND MODEM..................... 80
Table 41. Pinout DB-25 to DB-15 adaptor ............................................................... 83
Table 42. V.35 pin out ............................................................................................. 86
Table 43. V.28 pin out ............................................................................................. 87
Table 44. V.36/V.11 pin out ..................................................................................... 87
Table 45. V.35 Straps.............................................................................................. 89
Table 46. Meaning of the 6V35 Card LEDs ............................................................. 92
Table 47. Port 1 Signals .......................................................................................... 93
Table 48. Port 2 Signals .......................................................................................... 93
Table 49. Port 3 signals ........................................................................................... 94
Table 50. Interface Signals Ordered by the DB44 Pin out ....................................... 95
Table 51. Straps ...................................................................................................... 96
Table 52. RJ45 connector pin out for HK ............................................................... 101
Table 53. DB25 connector pin out for HK .............................................................. 102
Table 54. RS232 Interface configuration ............................................................... 103
Table 55. Power supply configuration for alarm ports ............................................ 104
Table 56. Strap configurations for the alarm inputs ............................................... 104
Table 57. Number of pins in the RJ45 connector for DM705-HK HW2 .................. 106
Table 58. Number of pins in bank 1 for DM705-HK HW2 ...................................... 107
Table 59. Number of pins in bank 2 for DM705-HK HW2 ...................................... 108
Table 60. HK HW2 RS-232 interface configuration ................................................ 110
Table 61. Power supply configuration for alarm ports ............................................ 110
Table 62. Strap configurations for HK HW2 alarm inputs ....................................... 110
Table 63. Pin-strap configuration for each HK HW2 port ....................................... 111
Table 64. Meaning of the LEDs ............................................................................. 115
Table 65. RJ45 connector pin out .......................................................................... 115
Table 66. LED’s Meaning ...................................................................................... 119
Table 67. RJ 45 connector pin out for the IP ......................................................... 119
Table 68. CESoP LED’s Meaning.......................................................................... 123
Table 69. RJ45 connector pin out for the CESoP .................................................. 123
Table 70. Transmission power - DM705-HS-FO .................................................... 127
Table 71. Datacom SFP modules approved - DM705-HS-FO SFP........................ 130
1. GENERAL RECOMMENDATION
The installation of any electric equipment must be in accordance with the current law in the place where
this equipment will be installed. This includes adequate devices of protection, sizing and protection to the
capacities of the equipment.
Always observe the instructions of security during the installation, operation or maintenance of this
product. Installation, adjustment or maintenance must be carried through only by qualified, trained and
authorized people.
The power supply, where the supply cable is connected, must be positioned near the equipment and be on
an easily accessible location, because the equipment is turned on and off through it.
To prevent risks of electric shock, before binding the equipment or connecting some card or cable of
interface, connected the ground.
Follow attentively every guidance included in this manual. In case of doubts, please contact the authorized
technical support.
All slots that are not occupied with cards must be closed with a blind panel. Thus, you avoid the exposure
to the energized parts inside the equipment. This procedure must be performed only by trained and
authorized people.
When installing, always tighten screws and knurling screws until the end of their thread and until they are
completely tightened.
The described equipment in this manual is sensible to the static electricity. Before handling any described
equipment in this manual, verify if using devices of protection against static electricity, and if these are
functioning correctly.
Totally modular supports up to eight tributaries, two HS, two power supplies and two CPU cards. All cards
have hot swap capability.
Compatible with the following DATACOM products: DM704C, DM704S, DM705, DM706C, DM991C,
DM991S, DmSTM-1.
2.1.1. CPU:
Allows the use of 1 or 2 cards in redundant operation.
Tributaries:
o 2048 kHz external clock with input through a BNC connector available at the CPU card;
When the DM705-HS module is used, the clock recovering from the G.SHDSL and V.35 interfaces is not
possible. Using the DM705 - FO/FO2 HW3 recovering the clock is not possible as well when the "Frame
20M" mode is used.
2.1.3. Dimensions:
175 mm (4U) x 440 mm x 154 mm (Height x Width x Depth, without mounting brackets for rack).
This totally modular rack holds up to eight tributary units, two power supply units and a CPU. It also
features hot swap for its circuit cards, except DM705-CPU32.
2.2.1. CPU
Supports one card (CPU34 and CPU32).
Tributary:
o 2048 kHz external clock with connection through the BNC input in the CPU card;
In the DM705 - FO/FO2 HW3 cards it is not possible to regenerate interface clocks when “Frame 20M” is
used.
The status of the power supplies is based on the power supply to the equipment, the status "not present"
sources, indicated by the CPU, which means the source is missing or that is present, but not energized.
2.2.3. Dimensions
87 mm (2U) x 432 mm x 280 mm (Height x Width x Depth, without mounting brackets).
Traffic consolidation from different sub-used channels into one unique channel. A port data (DM705-E1,
DM705-FO, DM705-DSL, DM705-MBB, DM705-V.35D, G.703 64 kbit/s, DM705-FXO / DM705-FXS /
DM705-E&M, voice cards, RS232 and Ethernet¹ ²) may be mapped in any timeslot from another port
through a 64 kbit/s (Grooming) cross connection, making it possible to choose another port to serve as an
aggregate. DM705-CPU64 and DM705-CPU128 can also concentrate tributary in 2 Mbit/s channels
mapped to the STM-1 aggregate.
CAS (Channel Associated Signaling) cross connection, generated from mapping among voice, optical and
E1 interfaces. Using the DM705-CPU64 or DM705-CPU128 it is also possible to establish a CAS cross-
connection with interfaces DM705-DSL, DM705-STM-1 (2 Mbits/s channels), DM705-FO HW3 (2 Mbit/s
channels) and structured DM705-V.35D.
The telesupervision system is capable of monitoring different elements, such as external stations and
cabinets, through the DM705-HK and DM705-HK HW2¹ ² cards. The monitoring points are included
through telesignals (digital inputs), telemeasures (analog inputs to measure the AC and DC voltage,
current and temperature) and telecommands (digital outputs). Operating in collaboration with the
management software that allows visualization of events in real time, logs and measure graphs through
the web interface.
Convergence among TDM and ETH networks through the DM705-CESoP¹ ² card that allows TDM traffic
transport through a Metro Ethernet network, using the CESoPSN or SAToP protocol, being capable of
regenerate clock and operate in the framed mode without CAS, framed with CAS or unframed.
(¹) These functionalities are not available for units equipped with DM705-CPU32.
(²) These functionalities are not available for units equipped with DM705-CPU34.
2.4. Accessories
2.4.1. MA-10
The MA-10 cooling unit aims at cooling the chassis of the DM705-SUB, allowing the operation of certain
cards in more severe thermal conditions. Two alarm outputs available in one DB9, allowing the equipment
CPU to be directly connected with a straight DB9-DB9 cable.
Features a full range power supply unit, i.e.: accepts any power supply tension from 100 to 240 VAC or 48
to 60 VDC.
Same width and depth as DM705 and 1.5U height (approximately 67mm).
Figure 1. MA-10
2.4.2. MA-09
Passive heat deflector. Used to deflect heat out of the rack. Dimensions: 2U height and 350mm deep.
2.4.3. MA-04
1U 19” shelf to accommodate cables. With openings to fit cables and ventilate the rack.
Figure 3. MA-04
2.4.4. MA-08
Attachment panel for CB-xxxxxx-T50F cables Telco50 connector. Offers space for attaching 2 cables per
panel. Used with MA-05.
2.4.5. MA-05
Allows attaching up to 8 MA-08 panels on the DM705-SUB rear. In the picture, the accessory is shown
with the MA-08 panel and two CB-DB44M-T50F cables.
Figure 5. MA-05 with the MA-08 panel and two CB-DB44M-T50F cables
The equipment can be connected directly to any voltage within specification, without the need of any
manual selection. This is automatically set by the equipment for both the main and backup power supply.
The backup supply is optional.
In order to scale the protection system and the energy supply system, the working power of each card to
be installed must be considered, as shown in Table 1.
Other higher-capacity configurations are possible. Please refer to technical support for any doubts.
The equipment can be powered with any voltage within the range specified below, without any kind of
manual selection. This is automatically done by the equipment, for both the main supply and the optional
back-up power supply. Two supplies can be installed, for redundant operation. The supplies can be hot-
swapped.
In order to scale the protection system and the energy supply system, the working power of each card to
be installed must be considered, as shown in Table 2.
There are other possible configurations. If that is the case, please contact our Technical Support.
The FAL is equipped with configuration straps, showed on Figure 8. They connect the card's grounding to
the protection (energy connector ground pin). There are two options:
The factory default strap position for all power supply units is 0-1 (grounds interconnected).
Before connecting any cable to the equipment, make sure that the grounding system is functional.
Power is supplied to the equipment through a power cord terminated with a three-prong plug. This cable
can be connected to any type of AC outlet, within the specified voltage limits. If using DC power, the AC
plug must be cut from the power cord. Use the wire corresponding to the central pin as the protection
ground and the other two for DC power, regardless of polarity. The equipment chassis is connected to the
protection ground. The PSU has a LED that indicates operation, presenting only two situations, ON when
it's being supplied and OFF when it's not.
The equipment can be powered with any voltage within the range specified below, without any kind of
manual selection. This is automatically done by the equipment, for both the main supply and the optional
back-up power supply. Two supplies can be installed, for redundant operation. The supplies can be hot-
swapped.
Recommended Voltage
Frequency Power Current
Limits Power Type
(Hz) max. (W) max (A)
min (V) max (V)
48 60 DC - 240 5
100 240 AC 50/60 240 2,5
Table 3. Power Recommended Limits of FAL HW3
The limits of Table 4 do not have to be exceeded in hypothesis some. The parameters of consumption of
the equipment also meet in this table.
The power supply, where the supply cable is connected, must be positioned near the equipment and have
easy access, because the equipment is turned on and off through it.
In case of using DC voltage, you must be careful so that the equipment protection ground cable (green
cable with yellow line related to the central socket pin) matches the system protection ground cable. This
cable must be connected before any other connection. The metallic structure of the equipment is
connected to the protection ground cable.
The equipment supports 6.3 A fuses, type T (delay), 250 V. If necessary, replace them only for other ones
of the same type and value.
The quantity and type of cards installed must be taken in consideration when dimensioning both energy
and protection systems, as showed on Table 5.
o If the power supply source is in AC, only use W column for cooling dimensioning
(airconditioning). To all other conditions it must use VA column.
Sum every card power consumption
Consumption Calculation: if total power is 60W while using DC-W and 93 VA when using AC-VA, it must
be considered 93 VA as total power.
Refrigeration Calculation: if total power is 60 W in DC-W and 53 W in AC-W (for each energy supply font),
take the higher value into consideration.
(**) When using DM705IP – 16E1 with CPU64, only 8 x E1 will be available.
3.7. Weight
The relative weight to each one of the components of the equipment is made use on Table 7.
Height 87 mm (2U)
432 mm without the frame attachment lugs
Width
480 mm with the frame attachment lugs
Depth 280 mm
103 TD
Pin on
Port Description
DB9
Common 7
External Alarm1
Input 8
Common 3
External Alarm2
Input 4
Common 5
External Alarm3
Input 9
Common 6
The alarm output interfaces can lead to signs of 0,3A at 100Vdc. The inputs are designed to operate in dry
contact.
RS232 Connector: it connects the MUX serial communication cable between the equipment and
the user terminal (see Table 10).
User must be sure there is no voltage difference between the Mux DB9 pin 5 (signal ground) and pin 5 of
the DB9 (or DB25 pin 7) for the PC or terminal. If this happens it will damage the Mux and the PC or
terminal serial interfaces. To check that there is no voltage difference, use an AC voltmeter to check the
voltage between these pins. If there is a voltage difference, check if the MUX and the PC are properly
grounded and connect the signal ground to the MUX protective ground. This should solve the problem. If
the above conditions are met, then the serial cable can be connected without turning off the equipment.
ALARM Connector: it has the alarm input and output connections (see Table 11).
If the CPU is in standby mode, the ALARM LED indicates that the card cannot take control and have lost
its synchronism with the main CPU. The main CPU ALARM LED shows 3 different critical alarms (Critical,
High or Low). If the LED is on (red light) it means Critical alarm. If it blinks twice and fast, it means High
and if it blinks in intervals longer than 1 second it means Low alarm.
When the CPU is active, the FAIL LED will turn on whenever there is a hardware fail happening.
Otherwise, it will be kept off.
The TEST LED indicates that there is a test going on. It will be kept on while any test is being executed in
any interface.
When the CPU is active, the LED ETH_LINK turned on will indicate that the front panel Ethernet Link
(10/100BaseT) is active. Otherwise, the LED will turn off in normal conditions.
THE CPU_ACTIVE LED indicates if the CPU is on (LED on) or is in standby (LED off) mode.
The main characteristic of the DM705-SUB is its capability of directly cross connecting data from a PDH
network, incoming from its tributaries, to data incoming from an SDH network (HS interfaces).
The CPU cross connection matrix links the PDH tributaries and the HS interfaces.
In CPU128 the matrix is composed of 257 data lines and three lines dedicated to management channels,
each one with 2 Mbit/s rate carrying 32 timeslots of 64 kbit/s.
Each timeslot of a matrix line can be mapped to any timeslot of any other line, performing also the CAS
cross connect whenever applicable.
The connection of a tributary interface to the matrix occurs independently of user action, however, for the
HS interfaces, the connection will be performed when the user maps data from a VC-12 to the connection
E1 interface.
When considering HS interfaces, the matrix connection will be established whenever the user maps the
VC-12 Data to the E1 connection interface.
Each of the equipment cards transferring data will use at least one line in that matrix. See Table 13 for
further details. The matrix use should always be taken into account when designing a network with the
DM705-SUB, for the matrix has limited capacity.
(*) When the connection E1 is protected, only one matrix line is used for both E1s. The maximum number
of connection E1s per HS is 32 (16 if using up to firmware version 2).
An example of matrix use is now presented, showing the use of Table 14.
Considering that data will be mapped for VC-12 and then transferred to the other SDH network
equipments, data will be distributed in the following way (for example):
E1_1 (KLM111): data from slot H (2*512 kbit/s), from slot E (6*128 kbit/s) and from slot C (64
kbit/s);
E1_4(KLM211): data from slot B, port 1 (1024 kbit/s), data from slot A (640 kbit/s);
From this evaluation it is possible to conclude that 7 matrix lines will be needed to place data incoming
from the PDH network.
In this example 20 matrix lines were needed. There would still be lines available for timeslot cross
connecting (64 kbit/s) STM-1 ring VCs or for future network expansion.
The user can define up to six clock hierarchies for the equipment, corresponding to the interfaces that are
capable of providing clock. There are two switching methods that the equipment can employ: hierarchy
switching and sync messages switching.
For both methods the non-reversible mode can be used, avoiding an intermittent clock reference from
affecting the system. Alternatively, the user can use the reversible mode, allowing the system to switch to
its best configured clock source that can provide system clock at that moment.
The six hierarchies each have a priority, where the lowest numbered hierarchy is the highest priority, being
used whenever possible.
The operation of this method is simpler, but it does not guarantee that the best available reference is being
employed.
The quality indicators are used to evaluate the quality of the clock received at each hierarchy and, based
on that quality, provide information so the equipment can choose the best clock available.
Within the STM-1 network, the clock quality indicators travel in the S1 byte of the multiplexing section and
are changed by the equipments as failures are detected in sync sources or switching in the network occur.
The user can then individually configure, for each clock hierarchy, the quality of the input to be considered,
and also the output quality to be sent to the STM-1 links (in the S1 byte) when each of these sources is
being used. The output quality, however, cannot be greater than the input quality.
When the input quality is configured for the automatic mode, the quality of the reference will be obtained
from the message received in S1. When the output quality is configured for the automatic mode, the
equipment will copy the input quality value to the clock output quality.
Using automatic input clock quality has application only for sync sources that have a valid quality indicator,
that is, only for the sync sources derived from the STM-1 lines.
The process comprises storing the main equipment information before it is being reset and using this data
later on, thus avoiding unnecessary reprogramming and reconfiguring of the cards already inserted in the
equipment.
Whenever a firmware upgrade is performed, the unsaved configurations will be saved to ensure that the
equipment will restart with the configuration that was active before the upgrade.
Whenever there is an equipment restart, the protected links will try to follow the path configured as the
work path, leading to data loss of around 50ms in these links, if they are operating within the protection
section.
The equipment will try to use the best available sync source. The blocked reference status is not kept
when the equipment is restarted. Data losses of up to one second can occur when the equipment operates
with regenerated clock.
Besides the unavailable time described on the previous paragraphs, the unavailability will also be a
function of the used cards and of the present firmware versions, the Table 15, Table 16 and Table 17
indicate the expected unavailable times for each CPU during the upgrading process, considering use of
internal clock and all links active in the work section.
Firmwares (time in s)
Card
19.1/20.1 20.1/21.1 21.1/22.1
E1 0 0 22
E1-FO 0 0 24
E1Q 23 0 22
DSL2 HW2 90* 90* 90*
E&M 10 0 15
FXO 0 0 1
FXS 0 0 1
G64 0 0 23
MBB 22 0 23
V.35D 0 0 19
Firmwares (time em s)
Card
13/14 14/15 15/16.1 16.1/17.1 17.1/18.1 18.1/19.1 19.1/20.1 20.1/21.1 21.3/22.1
E1 0 0 0 0 0 0 0 0 0
E1-FO 0 1 15 0 0 3 0 0 0
E1Q 0 0 0 0 13 0 23 0 0
E1-16 0 0 0 0 13 0 25 0 0
DSL2 HW2 - - - - - 90* 90* 90* 72*
DSL8 60* 90* 90* 90* 90* 90* 90* 90* 52*
E&M 0 0 0 0 0 0 10 0 0
FXO 0 0 0 0 0 0 0 0 0
FXO4 0 0 0 0 0 0 0 0 0
FXO10 0 0 0 0 0 0 0 0 0
FXS 0 0 0 0 0 0 0 0 0
FXS4 0 0 10 0 0 0 0 0 0
FXS10 0 0 10 20 0 0 0 0 0
G64 0 0 0 0 0 0 0 0 0
MBB 0 0 11 0 0 0 22 0 0
V.35D 0 3 0 0 1 2 0 0 0
6V35 0 0 0 3 1 1 1 1 0
Switch 0 0 0 0 0 0 85 0 0
HK HW2 - - - - - - 1 1 0
IP 0 0 0 0 0 0 107 0 0
CESoP 6 - 0 0 0 0 70 0 0
HS-FO 8 0 7 0 0 0 1 0 0
HS-E3E 5 2 4 0 1 0 1 0 0
HS-STM1E 6 1 7 0 0 1 0 0 0
HS-FO SFP - - - - - - - - -
To minimize equipment unavailability time caused by hardware failures and possible equipment firmware
problems, the DM705-SUB allows using two CPU cards operating in redundant mode.
In this way, the strategic client services will be safe against problems in the CPU card, so that a defective
card will cause only some seconds of down time, even if the defective card takes days to be replaced.
It is only possible redundancy between equal models of CPU, two CPU128, for example. In case that a
CPU64 is installed together with a CPU128, it will not have CPU redundancy.
Once redundancy is enabled, there are two possible roles for each of the equipment CPUs:
Active: all data pass through the active CPU. This is the only CPU directly accessible to
management, and only if it fails or if there is user intervention it will leave this state.
Standby: the role of the standby CPU is to reestablish data flow after a failure or if the active CPU
issues a request.
Choosing the role to assign to each CPU occurs during system initialization. This is not configurable and it
does not depend on the slot in which the card is inserted.
Note that whenever the standby CPU becomes active, data errors will appear in the interfaces in use, for
the switching matrix is stored in the CPU. The unavailable time depends upon the reason for the card
switching and goes from 3 seconds to 4 minutes.
To ensure that the standby CPU can be in charge of the equipment data, the active CPU starts the system
sync process whenever it detects the standby CPU. This sync process occurs whenever the configuration
or the equipment firmware is changed.
From the moment that the standby CPU has its database in sync, it will be prepared to take control of the
equipment and will do so if necessary. If any sync problem arises, the standby CPU sync failure alarm will
become active and user action will be requested to restart the process. If sync problems occur, it is usually
a hardware failure.
The user can switch from the active CPU to the standby CPU, in this way being able to servicing in an
active CPU.
When this procedure is performed, there will be data loss, even if the standby CPU is in sync. In this case
the errors will last few seconds only. If the standby CPU is not ready, the user should not switch, for it
could lead to permanent failure in the client data links.
DM705-E1 HW3 circuit card has an E1 interface of 75 ohms or 120 ohms impedance chosen in the same
model (BNC connector for 75 ohms impedance and RJ45 for 120 ohms impedance). DM705-E1 HW1
(obsolete) has in its pattern a DB9 connector.).
Frame structure (transparent or structured) as defined by ITU-T Recommendation G.704. The number of
timeslots available for the user, in the framed mode, is at most 31, for timeslot 0 is used for frame sync.
For telephony applications using Channel Associated Signaling (CAS), there are only 30 timeslots
available, for timeslot 16 transports CAS signaling.
A backup link can be configured in one of the following operation modes: off, automatic, semi-automatic.
a. Off: means that the equipment will not switch to the backup interface when there is a failure in the
main link. This option is generally used to force the main link operation, even if it is not operating
adequately.
b. Automatic: switches data to the backup link. Data flows back through the main link only after this
link remains stable and operating for around two minutes, or if the backup link goes down when
the main link is on.
c. Semi-automatic: makes that after a failure data continue flowing through the backup link unless
the backup link fails.
E2
E3
BNC connector for 75 ohms impedance. RJ48 connector for 120 ohms impedance.
Frame structure (transparent or not) as defined by ITU-T Recommendation G.704. The number of
timeslots available for the user, when in framed mode, is at most 31, for timeslot 0 is used for frame
synchronism. For CAS telephony applications, only 30 timeslots are available, for timeslot 16 carries CAS
signaling.
Rate of up to 2048 kbit/s for each interface, uses HDB3 coding, as defined by Recommendation G.703.
The E1Q interface can use a backup link (as showed on item 6.2).
When used with the CPU64, eight out of the sixteen E1 interfaces will be available for use.
Frame structure (transparent or structured) as defined by ITU-T recommendation G.704. The number of
time slots available for the user, when on the framed mode, is maximum 31, because time slot 0 is used
for the frame synchronization. On telephony applications with CAS, only 30 timeslots are available, as time
slot 16 conveys the CAS signaling.
Speed at 2048 kbit/s on each interface, using the HDB3 encoding, as defined by recommendation G.703.
The E1-16 interface may use a backup link (as showed on item 6.2).
8.3. Accessories
8.3.1. RB-09
1U height patch panel for 19’’ rack installation.
Presents 16 E1 interfaces, available in 3 models BNC, IEC (75 Ω) or RJ45 (120 Ω) with a Telco64
connector that allows the connection with DM705 - E1-16.
When configured as Frame 20M the card is compatible with the DM4E1S. On this mode, a configuration of
up to 4 connection E1s with the matrix is allowed on any position of Frame 20M.
On the Single E1 configuration the cards follow the ITU-T recommendation G.704. In this instance, it is
possible to choose one of the 4 connection E1s with the matrix in order to be directly connected to the
optical interface. On this configuration, the FO HW3 and FO HW2 cards operate in the same way.
When configured as "Frame 20M81" it is allowed to configure up to 8E1s of connection to the matrix in any
position of the "Frame 20M8E1". Also compatible to the DM4E1S.
The Optical E1 interface module may be regarded as an Electrical E1 module. The essential difference is
the connection means, therefore, there is no line impedance configuration such as on the Electrical E1
interface.
The FO HW3 is provided in two models, differentiating from one another by the quantity of interfaces
available. One model presents one optical interface (FO HW3) and the other two (FO2 HW3).
The FO2 HW3 card may have its ports configured independently to operate as Frame 20M or Single E1.
However, using "Frame 20M8E1" mode, the configuration must be for both configured ports. The
management of the remote equipment can only be done via "Frame 20M", the management via E1C is not
available while the circuit card is configured in the "Frame 20M81" mode.
A synchronization status indication LED is made available for each optical interface. This status is
indicated both on the Frame 20M mode and Single E1 mode.
The FO HW3 card front panel is illustrated in Figure 37. And the FO2 HW3 card panel is illustrated in
Figure 38.
Transmitter: Laser Diode of 1310 nm or 1550 nm, with power options between 0 and -15 dBm.
-9
Receiver: Use a PIN photodiode. Minimum level of -34 dBm for BER of 10 on single mode.
The range may vary in view of the link quality and environmental conditions (grounding, EMI). The
equipment leaves the plant with at least the specified power. It is common place that the power is several
dB above the minimum power (e.g. -10 dBm on a short range card).
The transmitter has a circuit which offsets variations of the laser characteristics in view of the temperature
and ageing.
The optical signal encoding is proprietary, ensuring that BER (Bit Error Rate) levels are kept regardless of
the data sent.
The DM705-FO HW2 and DM705-FO/FO2 HW3 optical cards do not offer the option to mix the optical
signal (scrambler), therefore, it will operate against cards with older HW versions only in case these are
configured so as to not mix the optical signal.
Presented in two models: Single mode and Multi mode, with options for different wavelengths and range.
Two optical fibers (one for Tx and the other for Tx) - TWO FIBERS: May send and receive at 1310nm.
They may optionally be supplied with Tx and Rx at 1550nm.
One optical fiber (Tx and Rx on the same fiber) – SINGLE FIBER. Sends at 1310nm and receives at
1550nm over the same fiber or vice-versa (sends at 1550nm and receives at 1310nm).
The laser transmission power can also be selected, characterizing the card as short or long range.
The optical cards are always supplied with SC-PC connectors, including in case of cards for use with
bidirectional fiber – single fiber.
The FO2 HW3 card optical interface may use a backup link (as shown is item 9.3).
The backup may be configured in one of the following operating modes: OFF, automatic or semiautomatic.
OFF: Means that the equipment will not divert to the backup mode when a fault occurs on the
main link. In general this option is used in order to force the operation of the main link, even if this
is not operating properly.
Automatic: Causes the data to be switched over to the backup link and only return to the main link
after keeping stable and operating for (approximately) 2 minutes or when the backup link drops
(in case the main link is operating).
Semiautomatic: Causes the data to not travel again through the main link unless the backup link
fails.
It is also possible to use a backup link for the E1 for connection with the matrix (as showed on item 6.2).
9.4.1. Local Digital Loopback Test on the E1 for Connection with the Matrix - LDL
This loopback is used to test the external link and the two data directions.
Figure 39. LDL test diagram on the E1s of matrix connection on the FO/FO2
Figure 40. LDL test diagram on the physical interface at the FO/FO2 HW3
LASER ON: Forces the laser to remain ON, regardless of existing fibers connected on the card.
Using more than 6 DM705-DSL8 cards on equipment having the HW1 power supply is not recommended.
The power supplies from the HW2 do not present any limitation as to the number of cards supported.
The connections take place via a RJ45 pin out as showed on Table 25.
Signal RJ45
TIP 4
RING 5
The equipment G.SHDSL ports can transport from 1 to 32 timeslots with channel alignment.
Each port may reach 2048 kbit/s on an independent way. However, on a DSL8 card, operating at 4 wires,
the speed will be 2048 kbit/s for each pair of ports making up the link.
The TC-PAM coding assures spectral compatibility with other service types, like ADSL and ISDN. The
achieved range is 15 to 20% greater than for modems that use 2B1Q coding in the same speed. It gets
rates 35 to 45% greater for the same distance.
The DSL8 card, when operating at 4 wires, makes it possible for an even greater range.
The power of the signal sent is 13,5 dBm for rates lower than 2048 kbit/s and 14,5 dBm for 2048 kbit/s.
The G.shdsl interface allows information on CAS (Channel Associated Signaling) to be sent, when there is
band available, that is, when at least one 64 kbit/s timeslot is idle.
The DLS interfaces may constitute one backup link (as indicated in item 6.2).
10.1. Connection
The connection takes place through 3 basic stages:
During this stage, the two equipments change data and negotiate the parameters that will be used for the
connection.
The ends implement a 12 kHz DPSK modem for the NTU and a 20 kHz one for the LTU to perform the
handshake. The standard predefined messages are exchanged and define the common operation mode.
In this phase the final transmission rate is determined, as the Annex to be used (A or B). The type of
information that will be transported (TPS-TC), the transmission frame (plesiochronous or synchronous) and
many other parameters are also set.
If the interfaces do not agree on a common configuration, the two equipments abort transmission and do
not go to the next stage, they try again after some time.
For the DM705-DSL1/DSL2/DSL8 cards, the implementation was performed so that the subscriber
equipment (NTU) will always accept the configuration sent to it by the office equipment (LTU), easing their
installation process.
In the handshake, the interface LED remains off, blinking once a second.
During the training, the equipments use the normal line coding (TC-PAM) and do not use DPSK anymore.
First, both modems test the line. Then they exchange the pre coder coefficients that will be used during
data transmission.
In the activation phase, the interface LED remains on for half a second and off for half a second.
When the interface is in sync, the status LED will remain on.
When the modem is configured as LTU, it will determine during the handshake all the connection
parameters, as which Annex to be used, number of channels, clock scheme (synchronous or
plesiochronous), etc. It is not possible to recover clock from the interface when configured in this mode.
When the modem is configured as NTU, the Annex configurations and clock scheme (Frame Mode) are
mandatorily automatic, for it must accept any configuration set by the LTU.
It is not possible to interconnect two equipments configured for the same type of terminal, for the
handshake only occurs between LTU and NTU.
When in plesiochronous mode, the transmission and reception clocks are independent from the line clock,
which is generated by the LTU. The line clock precision is 32 ppm, as set by G.991.2. Periodically 4 stuff
bits are automatically inserted to adequate the data clock to the line clock. This procedure is essential for
the equipments to remain in sync.
When configured in synchronous mode, the line clock is the same as the data clock. The precision of the
data clock is, then, the clock precision chosen as the equipment sync source. Recommendation G.991.2
specifies that the clock precision should be 32 ppm, independently of the selected clock scheme, so it is
up to the user to configure a clock with such a precision to operate according to the standard (or to use a
clock of lesser precision operating outside the standard bounds). In this mode the stuff bits stb1 and stb2
are always present, while stb3 and stb4 are not transmitted.
In the automatic selection mode, the LTU will use the mode selected by the NTU. If the NTU accepts any
mode (automatic configuring), the synchronous mode will be used.
10.2.3. Annex
The Annexes specify small deviations of the standard to best adequate the equipment to the used line.
Annex A determines the regional specifications regarding the lines operating under the conditions typically
found in U.S.A. networks.
Annex B determines the regional specifications regarding the lines operating under conditions typically
found in European networks.
10.3. Performance
The interface performance is directly related to the transmission line characteristics.
The gauge and length of the wire, the noise and the susceptibility to micro-interruptions to which the line is
submitted determine which is the greatest available transmission rate.
The range also diminishes if the line presents a great number of splices and bifurcations. The length of the
bifurcations also alter the line characteristics, for they can increase signal reflections and cause noise.
In a 0,4mm noiseless line, the maximum distance can be 3600 meters when working with rates of 2048
kbit/s. With the modem configured with 192 kbit/s it is possible to reach 6.300 m.
Table 26 displays expected ranges for some rates in noiseless artificial line, having the protective ground
connected to the equipment signal ground.
It is not convenient to use varistors as G.SHDSL lines protection devices, for they introduce a high
capacitance that can significantly reduce the interface performance. The same care should be taken with
inductive type protections.
On the operation at 4 wires, two physical ports per interface are used. In this way, if port 1 is configured to
operate at 4 wires, port 2 will be automatically configured as a complement to port 1 (presenting the other
pair of wires).
The number of time slots on the 4-wire operation is always even, that is, if the configuration is odd, an
additional time slot will be used.
10.6.1. CB-24RJ45-T50F
Cable which allows adapting the outputs of up to 3 cards DM705-DSL8 or 12 DM705-DSL2, from RJ-45
connector to a Telco50 connector, which becomes available in the rear of the unit through the panel MA-
05. It is modular in order to adapt one to 24 DSL interfaces. Length 60cm.
It may be necessary to enable RDL reception; otherwise the remote equipment may not enter in test
mode.
In this case, DSL8 accepts LDR requests from the remote device, entering in RXRDL mode.
There are three (3) voice card options: FXO (central), FXS (user) and E&M (Tie-line). E&M is equipped
with four (4) RJ45 ports. FXO and FXS are available in three (3) different models: FXS4/FXO4 with four (4)
RJ-11 ports; FXS4/FXO4 with Telco50 connectors; FXS10/FXO10 with ten ports (Telco50).
The interfaces have user-configurable nominal impedance, selectable as 600 or 900 ohms.
They have “on-hook” transmission capability, allowing data to flow through the link even when the
telephone is on hook.
The channel signaling transfer is done through CAS (channel associated signaling) according to G.704.
The equipment can be directly connected to a PABX, or it can be directly multiplexed in an E1 link along
with other voice cards or E1 trunks.
The E&M interface accepts only dual-tone multi frequency tones (DTMF).
Signal is coded using A-Law, according to G.711. The cards are also compatible with the G.712, G.713,
G.714, G.715 recommendation.
The voice cards use signaling according to the Telebras 220-550-704 or ITU-T Q.421/Q.422 standards,
but they can also communicate to equipments using different patterns. Besides Telebras standard
signaling, there are three other CAS configuration options:
Invert CAS bits A and B: in this case the information that usually goes through bit A is transmitted by bit B,
and vice-versa;
These three operations, done in CAS bits, refer to the Telebras signaling standard. Thus, when all these
operations are disabled, the signaling will be set to Telebras or Q.421 pattern. (disabling all others).
The pattern Q.421 is available only for DM705-FXS4 and DM705-FXS10 voice card.
Card features: ring, decadic pulse dialing and one LED per interface (for off hook telephone identification).
Connector pin out related to FXS card ports may be checked in Table 27, Table 28 and Table 29.
Pins that are not shown in FXS/FXS4/FXS10 tables, are not connected.
This card supports public telephones, with billing selectable as polarity inversion, 12 kHz or 16 kHz tone.
The FXO card was designed to be installed next to the central office, preferably in the same building. To
obtain information about applications with the FXO card installed farther from the office, please check with
tech support.
Card features: ring, decadic pulse dialing and one LED per interface (for off hook telephone identification).
Connector pin out related to FXS card ports may be checked in Table 31, Table 32 and Table 33.
Pins that are not shown in FXS/FXS4/FXS10 tables, are not connected.
11.3. DM705-E&M
The DM705-E&M card is a Tie Line Equipment that communicates to the E&M interface of an central office
or PABX through an interface of up to 8 wires. The PABX provides the M signal and receives the E signal.
Similarly, the E&M card generates the E signal, and receives the M signal.
It can be configured for E&M signaling types I, II, IV or V, for pulse or continuous modes. Each card
interface can transmit voice over 2 or 4 wires and it can be individually configured (through management
software).
The nominal voltage used is –48VDC, and the signals are generated by applying the ground potential
against this voltage, so as to generate a current increase that is felt in the remote equipment, indicating the
presence of the E&M signal.
The E&M interface accepts only dual-tone multi frequency tones (DTMF).
The E&M interface operates at dangerous voltage level. Installation and configuration procedures must be
followed carefully in order to avoid risk of electrical shock to the user, failure of the equipment’s operation
or even permanent damage.
Type I: For interface E&M type I, the E&M card generates the E signal for the PABX by grounding
the E pin, such that the PABX detects the E signal variation due to the current increase in this
wire. Similarly, the PABX generates the M signal applying a current through this wire. The E&M
card detects the M signal due to the increase in current in the M wire. This requires common
ground, which is provided by the SG wire.
Type II: In the type II interface each signal has its own return and, so, it does not require a
common ground. To generate the E signal, the E&M card closes the circuit, allowing the PABX
current to pass through, returning through the SG wire to the PABX ground. To generate the M
signal, the PABX closes the M wire circuit, allowing current to pass through this wire, which
returns through SB to the E&M card detection circuit.
Type IV: The interface type IV is symmetric and does not require common ground. The
connection is established in the same way as for signaling type II.
Type V: The interface type V is also symmetric, being a simplification of type IV. In this
configuring the signals do not have a return path, so the common ground potential is needed,
being provided by the SG wire.
To use type V signaling without SG wire as a common grounding, the following conditions must be
respected: E1 strap of the E&M must be placed in the position 0-2; the grounding signal and protection
provided by the supplying for the DM705 and for the equipment linked through E&M interface must be the
same, so there can be no difference in potential between them.
Straps Position
Port 1 Port 2 Port 3 Port 4
Type E1 E3 E4 E6 E7 E9 E10 E11 E13
I 0-2 0-2 0-1 0-2 0-1 0-2 0-1 0-2 0-1
II X 0-2 0-2 0-2 0-2 0-2 0-2 0-2 0-2
IV X 0-2 0-2 0-2 0-2 0-2 0-2 0-2 0-2
V X 0-1 0-1 0-1 0-1 0-1 0-1 0-1 0-1
Table 35. Straps configuration of E&M card
The E1 strap in the 0-2 position connects signal ground to the Mux protective ground
CAS
o Continuous mode:
In the continuous signaling mode, the E and M signals are on while the PABX and the E&M card
have an established connection. The signals are turned off only to indicate that one of the sides wants to
end the connection, and the remote side confirms disconnection by turning its signal off.
o Pulsed mode:
In the pulse signaling mode two types of signals are used: a short one (lasting 150 30 ms) and a
long one (lasting 600 120 ms). To complete the call, a short signal is sent, and to indicate disconnection
a long signal is sent. For the remaining time, even when the call is in progress, the signals are turned off.
Any signal out of this normal sequence is ignored by the DM705-E&M card.
Allows the DM705-E&M card to send data through its voice channel, using 2 or 4 wires. It can be
individually configured per port. With this option enabled, the E&M interface ignores the incoming CAS
signaling and keeps the established connection status (the E and M wires can be used or not). This option
allows the E&M card to be connected directly to a modem, for example.
Transparent
In this configuration the E&M works only as a signaling converter, so only pass the signaling of
the analog interface to the digital interface, and vice versa. In this situation the signaling is not analyzed
and is not implemented any calling Finite State Machine (FSM), turning the E&M card into a totally
transparent mode for the signaling protocol. It is important to emphasize, for the proper working of the
application is necessary that the signaling of the PBX connected to the E&M interface and the signaling of
the central office connected to the digital interface to be compatible.
Proprietary
In this configuration the E&M works as the continuous mode, but the E wire is disabled after call is
established, if it was started by the equipment connected to the digital interface.
Passthrough
In this configuration the E&M works same as the Transparent mode, but the RX CAS filter delay is
2ms instead of 20ms, thus preventing a deviation of the E signal with respect of the M signal that may not
work in certain scenarios.
When the FXS, FXO or E&M cards analog lines pass through media that can suffer influence of electrical
or atmospheric discharges, it is recommended to add primary protection devices to these lines, like gas
sparklers and/or varistors.
In the case of interfaces FXS, FXO or E&M, varistors they are efficient and they can be used without
problems. Cares must be taken when using them in lines that pass through signals with high frequencies
(former: E1, ISDN, xDSL), had to the fact of its capacitance to distort such signals.
The FXS interface cards had, in the first versions, sparklers as input lines primary protection. It is important
to stress that this protection device is not used anymore in the present versions of the FXS card.
Therefore, an external protection device must be used in these card lines.
11.5. Applications
In the FXS card, Omnibus is available in port 1 only. If activated, it will block the use of all other ports.
In FXS4/FXO4/FXS10/FXO10 cards, Omnibus is available in port 1 and 2, simultaneously or not. All other
ports will keep operating.
A new call can only be done after all telephones are replaced on hook.
In the other end of the E1 Link, the FXS card generates ring and signaling as detected by the card
connected to the CPTC. It reads hook status as well, sending it to the FXO card.
11.6. Accessories
11.6.1. CO-TL50
Telco50 connector for crimping cables, FXS10 / FXO10 / FXS4 / FXO4. (120 Ohms). Used in conjunction
with cards that has a Telco50 connector. (120 Ohms)
The BERT test pattern is generated towards the Mux cross connect device, so it can be redirected to any
of the equipment interfaces. Figure 65 shows this test.
When the RING test is run in the FXS card, the RING signal is directly sent to the subscriber line, so that
the telephone set connected to it will ring.
When the RING test is run in the FXO card, the RING signaling is sent through CAS (channel associated
signaling) using the “link” between the DM705. The FXS card will forward this signaling to the telephone
subscriber, so that the telephone set rings.
When the OFF HOOK test is run in the FXO card, the off-hook signal is directly sent to the central office
line.
When the OFF HOOK test is run in the FXS card, the off-hook signaling is sent through CAS (channel
associated signaling) using the “link” between the DM705. The FXO card will forward this signaling to the
central office.
The voice card will stay off-hook until the user deactivates the OFF HOOK test.
Through the control software it is possible to read the status of these lines.
The G.703 co directional interface card has six independent interfaces, operating at rates of 64, 128 or 256
kbit/s.
The connections for each port are available through RJ45 (RJ48C) connectors with 120 ohms impedance
in the G.703 interface.
The receiver can operate in distances of up to 1000 m over 0,4 mm twisted pair at 64 kbit/s.
The G.703 Co directional module has 6 LEDs in its front panel indicating the carrier status of each link: off
indicates that the interface has no carrier, blinking indicates carrier detected, but AIS (all bits in mark - “1”)
is being received and on indicates that the carrier is being detected and there is data variation.
Pin Signal
Function Signal
(RJ45) source
Transmit data wire + 4 Tx + Mux
Transmit data wire - 5 Tx - Mux
Receive data wire+ 1 Rx + G.703
Receive data wire - 2 Rx - G.703
Protective ground 3e6 FGND GND
Other pins are not connected
It is possible to configure the Rx equalization for each port through the extended range option. By enabling
this option, the equipment operates in ‘long link’ mode, while if it is left disabled, it operates in ‘short link’
mode.
In ‘short link’, the receiver uses the equalization vastly employed in other DATACOM equipments. The
receiver operates up to 300 meters when using twisted pair with 0,40 mm gauge.
In ‘long link’, the receiver uses special equalization, operating at distances of 0 to 1000 meters, using
twisted pair with 0,40 mm gauge.
For applications where the distances are less than 300 meters, it is recommended to choose ‘short link’,
for greater noise immunity.
Note that the transmission pulse mask is standardized and that Recommendation G.703 specifies that the
receiver should support up to 3 dB attenuation at 128 kHz. Therefore, it should always be checked if the
receiver of the equipment to which the G.703-64 module is being connected also supports the ranges of
the intended connection.
The DM705-BASE BAND MODEM (Base Band Modem) card has six independent base band interfaces to
operate in 4-wire duplex mode over type B private data lines. The modem can be configured to operate in
the rates of 64, 128 or 256 kbit/s.
Each modem interface has an RJ45 (RJ48C) connector, with 150 ohms impedance.
The card front panel has six LEDs indicating each interface status.
Bad or missing FGND can cause BASE BAND MODEM interface performance degrading. The tests for
the above cited ranges were done connecting FGND and DGND.
13.1.4. Synchronism
The DM705-BASE BAND MODEM card cannot be used to regenerate the system clock. This means that
the Mux clock cannot be recovered from the BASE BAND MODEM interface card.
The inability to regenerate clock from the base band modem interfaces leads to:
Base band modem ports residing in different equipments (DM705) cannot be interconnected, for
neither one can regenerate the system clock.
13.1.5. Pinning
Each modem interface operates in 4-wire full-duplex mode over private type B data lines. The Telebras
recommendation 225-540-713 of 4 of July of 1992 specifies the LPCDs.
Pin Signal
Function Signal
(RJ45) Source
Transmit Data + 4 Tx + Mux
Transmit Data - 5 Tx - Mux
Receive Data + 1 Rx + LPCD
Receive Data - 2 Rx - LPCD
Protective Ground 3e6 FGND GND
Other pins are not connected
LOS indicates that the modem is not identifying carrier (the HDB3 signal) in the analog line.
AIS indicates that the modem is recovering data, but there is no data variation, meaning that the interface
is receiving mark only (All Ones).
The SYNC indication means that the modem is recovering data and it is changing (there is data transition
in the interface). This is the normal equipment operation.
Status LED
LOS Off
AIS Blinking (1 Hz)
SYNC On
The BERT test pattern for the BASE BAND MODEM interface is generated towards the outside of the Mux.
The outputs of the interface card are compatible with Recommendations V.35 - V.36/V.11 and V.28 (at
64kbit/s), strap selectable. It can also be configured to operate using a proprietary data structure.
The V.35 Dual has two ports capable of transporting data. The operational rates are multiples of 64kbit/s
(Nx64 kbit/s, N from 1 to 32). Each port can individually reach the rate of 2048 kbit/s. Note, however, that
when using old cards (hardware version 3) the two ports will share the 2048 kbit/s rate.
Data signal and clock signal are differential-balanced type according to ITU-T V.11 recommendation.
Signals CT107, CT108, CT109, CT140, CT141 e CT142 follows the characteristics of V.28
recommendation (compatible to V.10 recommendation). Control signals CT105 and CT106 can be
configured to follow the characteristics of V.28 recommendation (for V.35) or V.11 (for V.36/V11).
The V.35 Dual interface circuit card has four LEDs in its front panel, two for each port. There are the LEDs
of transmitted data (103) and the LEDs of received data (104).
CT103 (TD) is the DTE-provided data signal (the Mux will always be considered as being a DCE)
and it can be observed through LED 103 located in the digital interface card panel. If the CT106
signal is OFF, mark will be transmitted.
CT104 is the DTE-provided data signal. Represented in the corresponding LED 104 in the digital
interface card panel. If the CT109 signal is OFF, mark will be transmitted to the DTE.
CT106 is a DTE-generated control signal, indicating that the Mux is ready to send. For the
DM705, CT106 follows CT105, with delay lower than 2ms, unless a test which alters its behavior
is running.
CT107 is a DTE-generated control signal, indicating that it is ready to operate. Under normal
operation, it remains on. When a BERT sequence or a RDL test is running, it goes off.
CT108 is a DTE-generated control signal, indicating that the terminal is ready (DTR). It can be
configured to be taken into account or ignored (forced ON).
CT113 is the DTE-provided transmission clock. The DM705 can be configured to use this signal.
If the port in use is the Mux clock source, it will automatically use this signal.
CT114 is the card transmission clock, and it is in sync with the DM705 transmission clock or to
the DTE-provided clock (CT113).
CT115 is the receive clock regenerated from the system clock (clock source). Its rate depends on
the rate configured for the digital interface.
CT128 is the external clock for digital interface data reception. This mode is always available and
when there is no interface clock, it will automatically switch to CT115. It can be used or disabled
(forced OFF).
CT140 is a Digital Remote Loopback request generated by the DTE. The activation of this signal
generates a loopback request for the remote interface data. Data incoming from CT103 loops
back to the CT104, going through the entire system. This signal can be taken into account or
ignored (forced OFF).
CT141 is a DTE-generated cross connect loopback (LAL) request. The signal activation starts the
test, where data incoming from CT103 are redirected for CT104. This signal can be taken into
account or ignored (forced OFF).
CT142 remains activated while the card is under test. Its direction is from the Mux to the digital
interface (DTE).
14.1. X.21
The X.21 recommendation defines physical characteristics and call control procedures in the connection
between DTC and DCE employing synchronous transmission and balanced signals. The X.21 has
electrical characteristics in according to X.27 (V.11), and the standard ISO 4093 (DB15) is recommended
to the physical connection.
To operate in according to X.21 recommendation it is necessary to set the card strapping to V.11, as well
as an adaptor from DB-25 connector to DB-15. The adaptor pinout can be seen in Table 41:
V.11/V.36 X.21
Signa
CT Function Signal ISO 2110 DB15 ISO Source
Amd. 1 4903
101 Protective Ground P. Gnd 1 1
102 Signal Groung S. Gnd 7 8
TDa 2 2
103 Transmited Data ETD
TDb 14 9
RDa 3 4
104 Received Data ECD
RDb 16 11
RTSa 4 3
105 Rquest to Send ETD
RTSb 19 10
DCDa 8 5 ECD
109 Remote Interface Status
DCDb 10 12 ECD
TCa 15 6
114 Transmission clock ECD
TCb 12 13
Table 41. Pinout DB-25 to DB-15 adaptor
14.3. RS-422
This recommendation defines electrical characteristics of balanced voltage digital interface circuits that is
equivalent to V.11 (ITU-T). Characteristic such as pinout and connector are defined by other standards as
RS530 (DB25). To operate in according to this recommendation it is necessary to set the card strapping to
V.11.
The low-speed ports can be grouped in the same 64 kbit/s aggregate, group. In a mux, up to 8 different
X.50 groups can coexist, and each group is completely independent.
These characteristics are only available for cards having “HW3” stamped in the panel.
The low-speed ports can operate synchronously or asynchronously. It is also possible to configure port 2
of any V.35 card as the 64kbit/s aggregate link, also called the “main port”.
When a port is configured as X.50, it will also be able to generate system clock, except if it is configured as
“main port”.
Clock Source: indicates that the port will use as its clock the equipment clock source (DM705);
External (CT113): indicates that the port will use the interface CT113 signal as the data input clock;
CT104 Controlled: causes data sent through CT104 to use the CT113 signal as synchronism, this is, the
CT104 signal is sent linked to CT113.
Phase (Phase 1 / Phase 2): selects the phase in which data incoming from this port will be inserted in the
X.50 frame. There are five available phases (numbered from 1 to 5). When the rate is 19200 bit/s, it is
necessary to use two phases (for the quantity of data is not supported by a single phase). In this case,
phase 2 will be available and must be configured.
Octet: indicates in which octet of the selected phase data will start to be inserted. There are eight possible
octets available for configuring (numbered from 1 to 8) and the configurable values depend upon the
selected rate.
Gateway (Use as group gateway): this option indicates that the port will act as gateway for the X.50 link,
that is, the port will represent the input and output link signals. This indication selects which card will have
an available timeslot for configuring in the “timeslot configuration” table. Each group can only have a single
port as gateway.
Port main (Use as group main): this option indicates that the port will act as main X.50 link port, that is, this
port will be configured for 64 kbit/s and the X.50 link will be transmitted through this port and no longer by
the “timeslot configuration” table.
Group: indicates which cards operate together in a cascading link (drop-insert). All the group cards will
operate in the same aggregate link. Eight groups are possible (numbered from 1 to 8).
Division: selects the structure type to be used in the X.50 frame. The possible values are 2 and 3. When
the 1200 bit/s rate is selected, only division 2 will be available, for division 3 does not accept rates lower
than 2400 bit/s.
Cascading (Drop insert unused channels): when enabled, allows that a port operates performing drop
insert in the group link. Whenever disabled, the card will insert IDLE (Idle byte) in the unused data link
octets.
When there is more than a card pertaining to a group, the ‘Drop insert unused channels’ option should be
enabled.
There can be only a single Main port. When there is one, it will also be a Gateway port. Only port
2 of the X.50 cards can be the Main port;
If there is more than one card in the group, the Drop Insert option should be enabled.
If the above conditions are observed, each port may be configured independently. And one may if it will
work on a synchronous or asynchronous, way as well as their clock and control configurations.
DB25 M34
Signal
CT Function Signal ISO 2110
ISO 2593 Source
Amd. 1
101 Protective grounds P. Gnd 1 A
102 Signal ground S. Gnd 7 B
TDa 2 P
103 Transmit data ETD
TDb 14 S
RDa 3 R
104 Receive data Mux
RDb 16 T
105 Request to send RTS 4 C ETD
106 Ready to send CTSa 5 D Mux
107 Modem ready DSR 6 E Mux
108 Terminal ready DTR 20* H ETD
Remote Interface
109 DCD 8 F Mux
Status
DTE Trasmission XTCa 24 U
113 ETD
Clock XTCb 11 W
TCa 15 Y
114 Transmission Clock Mux
TCb 12 a/AA
RCa 17 V
115 Receive Clock Mux
RCb 9 X
Digital Remote
140 21 N ETD
Loopback Request
Local Analogue
141 18 L ETD
Loopback
142 Test Indicator 25 n/NN Mux
ERCa 22 / 20*
128 External Receive clock ETD
ERCb 23*
DB25 Signal
CT Function Signal
ISO 2110 Source
101 Protective ground P. Gnd 1
102 Signal ground S. Gnd 7
103 Transmit data Td 2 ETD
104 Receive data Rd 3 Mux
105 Request to send RTS 4 ETD
106 Ready to send CTS 5 Mux
107 Modem ready DSR 6 Mux
109 Remote interface status DCD 8 Mux
113 DTE transmit clock XTC 24 ETD
114 Transmit clock TC 15 Mux
115 Receive clock RC 17 Mux
DB25 DB37
CT Function Signal ISO 2110 Signal souce
ISO 4902
Amd. 1
101 Protective ground P. Gnd 1 1
102 Signal ground S. Gnd 7 19
TDa 2 4
103 Transmit data ETD
TDb 14 22
RDa 3 6
104 Receive data Mux
RDb 16 24
RTSa 4 7
105 Request to send ETD
RTSb 19 25
CTSa 5 9
106 Ready to send Mux
CTSb 13 27
107 Modem ready DSR 6 11 Mux
108 Terminal ready DTR 20* 12 ETD
DCDa 8 13
109 Remote interface status Mux
DCDb 10 31
XTCa 24 17
113 DTE Transmission clock ETD
XTCb 11 35
TCa 15 5
114 Transmission clock Mux
TCb 12 23
RCa 17 8
115 Receive clock Mux
RCb 9 26
Digital remote
140 21 14 ETD
Loopback request
Local Analog
141 18 10 ETD
Loopback request
142 Test Indicator 25 18 Mux
128 External receive clock ERCa 22 / 20* ETD
ERCb 23*
This way, the V.35 signal can be understood as a frame carrying a sync timeslot and N data timeslots. The
number of available data timeslots depends on the configured interface rate. Note that each timeslot has 8
bits. Taking the V.35 rate divided by 64 kbit\s gives the total number of interface timeslots. Subtracting the
sync timeslot gives the number of timeslots available for data (N).
Structured V.35, when enabled, automatically creates the sync timeslot (TS0), leaving the rest of the
selected available bandwidth available for the user.
When the user wishes to use a Structured V.35 at a rate such that the number of data timeslots is less
than available, the unused timeslots will be automatically filled with idle signal (mark). Example: A V.35 at
rate of 512 kbit/s, where 4 data timeslots will be used, will have: 1 sync timeslot, 4 data timeslots and 3 idle
timeslots.
The Structured V.35 does not need to be connected directly to another Structured V.35. It can
intercommunicate without problems with other V.35 and pass through E1 links, as long as the other end is
equipped to another Structured V.35 interface for frame disassembly.
The user should be aware that the Structured V.35 cannot be directly connected to G.703 equipment due
to the physical and electrical differences between the two standards.
‡ When straps E18 and E39 do not exist, only the CT128 signal may be used.
(*) When straps E43 and E44 are not available, the V.35 card will only be compatible with the CPU08 card.
However, the HW3 version cards, even if straps E43 and E44 are not available, will be compatible with the
CPU32, CPU34, CPU64 and CPU128 cards.
The BERT test pattern is generated towards the Mux cross connect device, so that it can be redirected to
any of the equipment interfaces.
This test can be used together with a cross connect loopback, a digital remote loopback or a physical
connection. It is also possible to activate BERT for two interfaces that communicate to each other. In this
case, each receiver will monitor the pattern sent by the transmitter of the other equipment (remember that
the pattern transmitted by both equipments should be the same).
The BERT test pattern is generated towards the card V.35 interface, so it can be used to test the card data
link.
The remote device will only enter in test will have been qualified for this test (through the configuration
software when the option will be qualified to accept asked for of LDR).
DM705-V.35D does not accept this test when configured for X.50.
The 6V35 card presents interfaces compatible with V.35, V.36/V.11 and V.28 recommendations. Six ports
are available (via two DB44 female connectors, with three ports on each), capable of transporting data,
and all of them can operate on any of the three modes referred to.
Each port may indvidually reach the rate of 2048 kbit/s and all ports may operate at the rate concurrently,
that is, the sum of all ports may reach 12.288 kbit/s.
The 6V35 card can operate in according to X.21, RS-232 e RS-422, more information in Erro! Fonte de
referência não encontrada., Erro! Fonte de referência não encontrada. and Erro! Fonte de
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The 6V35 circuit card can also operate in BUS mode. This mode allows to create a bus Master/Slave with
rates from 64 kbit/s until 1024 kbit/s in each port. Further information can be obtained from Installation and
Operation Manual.
In case the desired standard for the ports are the ISO2110 (at DB25), it is possible to connect the
DATACOM RB-04 accessory, an adaptive ruler (which adapts the DB44 connector for 3 DB245 female
connectors with the ISO standard 2110 Amd.1 pin out).
There are six LEDs on its front panel, with each LED indicating the status of one of the interfaces.
DB25_1
Signal
CT Function Signal DB44 ISO 2110
Source
Amd. 1
101_2 Protective ground FGND 31 1
102_2 Signal ground DGND 32 7
TDa 24 2
103_2 Transmit data ETD
TDb 9 14
RDa 23 3
104_2 Receive data MUX
RDb 8 16
105_2 Request to send RTS 34 4 ETD
106_2 Ready to send CTS 37 5 MUX
107_2 Modem ready DSR 40 6 MUX
109_2 Remote interface status DCD 43 8 MUX
XTCa 25 24
113_2 DTE Transmission Clock ETD
XTCb 10 11
TCa 22 15
114_2 Transmission Clock MUX
TCb 7 12
RCa 21 17
115_2 Receive Clock MUX
RCb 6 9
The pin out presented refer to connector 1 (DB44 located on the left of the card seen from its front). The
pin out for connector 2 follows exactly the same standard, however, they connect ports 4, 5 and 6 (port 4 is
equivalent to port 1 in the tables, port 5 is equivalent to 2 and port 6 is equivalent to 3).
CT104 is the data signal provided for the ETD. If the CT109 signal is OFF, a mark will be
transmitted to the ETD.
CT105 is a control signal generated by the ETD, which indicates a request to send. It may be
configured to be either considered or ignored (always ON).
CT106 is a control signal generated by the equipment, indicating that the Mux is ready to send.
On the DM705, the CT106 follows the CT105, with a delay shorter than 2ms, unless some test
which changes its behavior is enabled.
CT107 is a control signal generated by the equipment, indicating it is ready to operate. When in
regular operation, it remains active, except when the BERT sequence is enabled or when a
request to activate the remote device loopback by the Mux side is received.
CT109 is a control signal generated by the equipment, indicating that a carrier is being detected
on the interface which is connected to the V.35 (via cross connect table, internally in the Mux),
and the receiver is synchronized. When there is no synchronization on some of the structures
enabled, the CT109 remains OFF and the CT104 remains locked on a mark.
CT113 is the transmission clock provided by the ETD. The DM705 may be configured in order to
use this signal. If the port used is the source of the Mux clock, it will start to use this signal
automatically.
CT114 is the transmission clock used by the card, being synchronized with the DM705
transmission clock or with the clock provided by the ETD (CT113).
CT115 is the receiving clock regenerated from the system clock (clock source). Its rate depends
on the digital interface speed configuration.
When changing the strap configuration, the DmView management software configuration should also be
changed.
15.3. Accessories
15.3.3. CB-DB44M-T50F
Allows adapt the 6V35 card outputs of the DB44 connector to a Telco50 90° female connector. It can be
supplied in the rear section of the equipment, through an MA-05 panel, supporting up to 3 V.35 outputs per
cable. Length: 60cm.
The BERT test standard is generated towards the Mux cross connect device and, therefore, may be
directed to any one of the interfaces present on the equipment.
This test may be used jointly with a loopback on the cross connect, a remote digital loopback or some
physical connection. It is also possible to activate a BERT on two interfaces communicating with each
other. In this instance, each receiver will monitor the standard sent by the transmitter of the other
equipment (remember that the standard transmitted by the two equipment should be the same).
The remote device will only go into the test mode if it is enabled for this test (via configuration software,
when the option to accept the LDR request is enabled).
Each connector (pack) has a selection by strap to indicate whether the power used will be internal or
external. In case the external power is used, this should not exceed 60 V.
Presents 4 housekeeping outputs (alarm or remote command) on a dry contact. They can have enabling,
input propagation condition and equipment alarm propagation configurable.
The house keeping inputs and outputs are provided on two DB25 connectors. The connector pin out is
presented in Table 53.
Commum 22
(b) Voltage: Alarms* when the voltage difference between A and B is between 20 V and 60 V. Input A
should be more positive.
(*)Situations with an alarm condition configured to CLOSED, when configured to OPEN, the operation is
inverse.
The hold off time, which represents the time between the event detection and permanence until the alarm
indication, may also be configured assuming values between 0 and 60 s.
It is also possible to configure the outputs for propagation of the equipment alarms, in this case, the output
is activated if the equipment has some alarm enabled.
It is necessary to be careful in order to not connect an external power supply to a bank while the straps
are configured for internal supply. This procedure may cause irreparable damages to the card.
Table 56 presents the strap configurations for the alarm inputs, where xx represents the input selected
(between 1 and 16).
Features 18 opto-isolated housekeeping inputs (external alarm/telemetry), configurable by strap to: dry
contact, input voltage and open collector. They feature severity configuration, alarm condition and holdoff
time (time between detection and permanence of the event up to the indication of alarm).
Each connector (bank) features detection by strap to indicate if the supply used is internal or external. In
case of an external power supply, it cannot exceed 60 V.
Features 4 Housekeeping outputs (alarm or telecommand) in dry contact. They may be enabled, in
conditions for input propagation and alarm propagation for configurable equipment.
Features 6 analog inputs, which may monitor the 4-20 mA, typical of transducers. Here are some
examples of the measures that may be taken with the MK-02 accessory: AC voltage, DC voltage,
temperature and DC current.
The housekeeping inputs and outputs are provided in two DB44 connectors. The number of pins in the
connector and the accessory cable and MK-02 are shown in Table 58 and Table 59.
It features 2 RS-232 interfaces in RJ45 connectors. It allows for the asynchronous communication between
two devices with RS-232 interfaces, transporting oversampled data in N 64 kbit/s channels. Interface
connection is made through commuting matrix. The number of pins in the RJ45 connector is shown on
Table 57.
Table 57. Number of pins in the RJ45 connector for DM705-HK HW2
Figure 98. Number of pins in the DB44 connector for DM705-HK HW2
(b) Voltage: Alarms* when the voltage difference between A and B are between 20V and 60V. Input A
must be positive.
(*)Situation of alarm condition configured as CLOSE, when is configured as OPEN, its operation is
inverted.
Variation measurements statistics of the DM705-HK HW2 analog interfaces can also be stored in a history
of one-year logs. This graphics are stored in a server responsible for collecting statistics.
The transducer for which the DM705-HK HW2 card was designed to operate are included in the MK-02
accessory.
Allows the configuration of 4 thresholds for each port, each threshold has an associated alarm or an
associated event according to the configured severity. Two of the four thresholds are referred to above
normal measurements and the other two are referred to below normal measurements, there is also a non-
configurable critical alarm if a measurement exceeds the configured range.
It is also possible to configure outputs for the propagation of equipment's alarm, in this case the output is
activated if the equipment is alarmed.
Straps position
Power
Bank 1 Bank 2
E2 E3 E28 E29
External supply 0-2 0-2 0-2 0-2
Internal supply 0-1 0-1 0-1 0-1
It is extremely important not to connect the external power supply to the bank while the straps are
configured to internal power supply. It may cause irreparable damage to the card.
Table 62 shows the strap configurations for alarm inputs, in which xx represents the digital input chosen
(between 1 an 18).
Example: to configure port 07 as tension, straps E22 and E23 must be in position 0-1 and strap E24 in
position 0-2.
Table 63 presents the digital input ports and their strap configuration.
17.7. Accessories
17.7.1. MK-02
The MK-02 accessory was developed to optimize the installation of the telesupervision in cabinets and
transmission stations. MK-02 allows the installation of 18 digital inputs, 6 analog inputs and 4 digital
outputs. It is ideal for telesupervision of places where there is a three-phase power network available, as
well as data broadcast stations and others.
The MK-02 is 434.9 mm wide, 160.95 mm (with lid) and 5U high (approximately 221.2 mm).
The Switch tributary is a card which purpose is to send traffic of Ethernet ports via the CPU cross connect
matrix. For such, it has 8 physical ports which traffic crosses some multiplex and switching levels until
reaching the matrix. These ports operate on the Half-Duplex or Full-Duplex modes (IEEE 802.3).
The card supports level 2 switching, with VLAN functionalities (IEEE 802.1Q), service classes with packet
classification by port, VLAN or DSCP tag (RFC 2474). It also supports band control and Half-Duplex flow
control with the back-pressure or Full-Duplex method via Pause frames.
It is possible to map Ethernet signals for any data interface, including on the PDH payload, allowing for
access to the PDH networks via fractionated E1 interfaces (G.704).
When used jointly with the HS cards, then it is possible to perform a mapping of Ethernet signals on the
SDH payload.
It is not recommended the use of more than 6 DM705-Switch plates in equipment that possesses the
source of feeding HW1. The sources of feeding from the HW2 do not present any limitation how much
number of plates supported.
Each one of the LEDs (1 to 8) represents the status of the respective interface (see Table 64).
Status Meaning
Off Link Failure
On Link OK
Blinkinh Data Traffic
CoS - Class of service configurations may define the priority ratios in the packet switching inside
the switch.
18.3. Interfaces
The card may operate both on the bridge mode and the switch mode, with support for 802.1q VLAN. It
follows the Ethernet 10/100 Mbit/s standard (auto-negotiable), being capable of a rate of up to 2 Mbit/s per
port.
18.3.1. Bridge
On the bridge mode the card operates as a converter of Ethernet interfaces - Nx64 kbit/s.
18.3.2. Switch
On the switch mode the card allows for the switching of the Ethernet traffic and for any ETH or WAN
interface, including support for VLANs.
18.4. Ports
ETH - 8 ports - All called Ethernet or MAC ports. These are physical ports to which the user has
access, corresponding to the connectors present on the panel.
WAN - 16 ports - These are ports which, together with the ETHs, are connected to the card
Switch. Just like the LANs, they have a VLAN and CoS configuration, however, they have no
physical Ethernet configuration.
These ports have no relationship with CPU card management WAN ports.
18.6. Tests
This card has no tests available.
The IP circuit card can be found in two models, HW1 and HW2. The IP-HW1 stop the transmission for few
minutes if there is a hot-swap between the active CPU and the stand By CPU. However, the IP-HW2 just
drops some packets.
DM705 IP card converts PPP data protocols coming from remote routers (connected to a TDM network)
into Ethernet, in one of the two available ETH interfaces, allowing Metro Ethernet and TDM Network
integration.
It allows the tagging of Ethernet quality of service (802.1p) according to the customer (TDM) or DSCP and
maps each customer into a different VLAN, allowing the separation and prioritization of the packets into the
Metro-Ethernet networks. The MTU supported is 1522 Bytes.
Looking for the optimization in the use of the Ethernet ports of Metro-Ethernet networks, the DM705-IP
allows the data aggregation of up to 3 circuit cards (100 Mbit/s) into just one port using the interface ETH
stacking.
DM705 - IP 16E1 up to 512 TDM channels, reaching up to 32 Mbit/s data per card.
DM705 - IP 8E1 up to 256 TDM channels, reaching up to 16 Mbit/s data per card.
DM705 - IP 4E1 up to 128 TDM channels, reaching up to 8 Mbit/s data per card.
In case of using the DM705 - IP 16E1 with a CPU64, only 256 channels are available, adding up a
maximum of 16 Mbit/s per card.
DM705-IP can be configured by user to operate in DM705-IP-Switch mode, so it assumes the function of
packet switching between its interfaces, TDM and/or ETH, operating as a layer 2 switch .
The number of ports supported by DM705-IP-Switch varies according to its model. There are 4 DM705-IP-
Switch card models with distinct capacities as shown below:
DM705 - IP 16E1 allows up to 512 TDM channels, reaching up to 32 Mbits/s data traffic per card;
each group (broadcast domain) supports up to 127 interfaces.
DM705 - IP 8E1 allows up to 256 TDM channels, reaching up to 16 Mbits/s data traffic per card;
each group (broadcast domain) supports up to 127 interfaces.
DM705 - IP 4E1 allows up to 128 TDM channels, reaching up to 8 Mbits/s data traffic per card;
each group (broadcast domain) supports up to 127 interfaces.
DM705 - IP 2E1 allows up to 64 TDM channels, reaching up to 2 Mbits/s data traffic per card;
each group (broadcast domain) supports up to 66 interfaces.
(*) Only 66 channels are available for the DM705-IP 2E1 card.
Each LED (1 and 2) represents its interface status (see Table 66).
Status Meaning
Off Link Failure
On Link Operating
Blinking Data Traffic
Ethernet ports have automatic MDI/MDIX selection, allowing them to be connected to any Ethernet port
via strait or cross cable.
19.2. Interfaces
All ports have rate auto negotiation (10/100/1000 Mbit/s), Half/Full duplex mode and MDI/MDIX options.
19.2.2. TDM
Each TDM channel can operate in Nx64 kbit/s (from 64 kbit/s to 2 Mbit/s). The enlace protocol used by the
TDM channels can be PPP according to the RFC 1661 and 1662 or Bridge, compatible with DATACOM
converters (DM991CE, DM704CE, others).
Allows PPP interface traffic to be mapped into VLANs (802.1q) in Ethernet ports. Classifies packets in two
(2) different methods: automatic: mapping between the type of IP service (DSCP) and the Ethernet
(802.1p) network quality service; Fixed – not considering the type of IP service; the Ethernet network
quality depends on the user configuration only.
Using VCAT and GFP technologies, it allows to aggregate the data from one of its Ethernet interfaces in a
TDM channel of up to 30 Mbit/s (NxVC12) towards the SDH network in a transparent mode. The VCAT
and GFP technologies follow respectively ITU-T G.707 and G.7041 standards.
LCAS (Link Capacity Adjustment Scheme): it is possible to configure LCAS protocol for the GFP channel;
A second VLAN TAG can be added when using Nx64(bridge) protocol if Q-in-Q is chosen. It is also
possible to set the VLAN TAG removing feature (TAGs that come from the Ethernet interface).
Selection of interfaces that will be used by the client – Ethernet and VLAN;
Configuration indicating which priority tagging will be performed in the Ethernet network
(automatically from the IP packet DSCP from TDM channels or per fixed values);
Configuration of the IP of the connected router from the TDM or Ethernet network;
Configurations of QoS functionalities in both PPP and Bridge Nx64 kbit\s protocols are optional.
The Stacking mode may be activated in any port. It aggregates data from many interfaces. When turned
on, the staking mode allows data to pass through both non-used VLAN Ethernet interfaces. Ethernet ports
have MDI/MDIX automatic selection, making it possible to connect them to any Ethernet port using straight
or cross cable.
A management VLAN may be configured, allowing alarm verification and Firmware update directly from
Ethernet network. This card`s users are the same of those from the CPU connected to it.
19.4. Application
19.5. Tests
This card has no tests available for both operation modes (DM705-IP and DM705-IP-Switch).
The CESoP circuit card can be found in two models, HW1 e HW2. The CESoP-HW1 stop the
transmission for few minutes if there is a hot-swap between the active CPU and the standby CPU.
However, the CESoP-HW2 just drops some packets.
DM705 - CESoP (Circuit Emulation Services over Packet) has its main function TDM data conversion
(consolidated in a BUNDLE). Thus it is possible to send data from any interface of the equipment in a
transparent way over IP networks to be converted again into TDM data in the remote equipment, what
makes the DM705-SUB more flexible. It allows the communication between different TDM networks
through PSN (Packet Switching Network).
This circuit card enables as well the configuration of Ethernet Quality of Service (802.1p) according to the
client (bundle) and DSCP (layer 2 and layer 3), allowing the separation and prioritization of the packets into
Metro Ethernet networks. The MTU supported is 1526 Bytes.
According to IEEE 802.3, there are two (2) Ethernet 10/100/1000 Mbit/s ports and number of channel
according to the model of the card.
There are four (4) DM705 CESoP models with different capacities:
DM705 - CESoP 16E1 up to 512 bundles, reaching up to 32 Mbit/s data per card.
DM705 - CESoP 8E1 up to 256 bundles, reaching up to 16 Mbit/s data per card.
DM705 - CESoP 4E1 up to 128 bundles, reaching up to 8 Mbit/s data per card.
Each channel can be configured in Nx64 kbit/s (from 64 kbit/s to 2 Mbit/s) and can operate in framed mode
without CAS, framed with CAS or Unframed, and can be identified by:
Timeslot in traffic;
Can recover the clock from any of the channels to use as clock reference to the equipment.
In case of using the DM705 - CESoP 16E1 with a CPU64, only 256 bundles are available, adding up a
maximum of 16 Mbit/s per card.
Each one of the LEDs (1 and 2) shows the state of the respectively interface (look up for the meaning of
the LEDs on Table 68 ).
Status Meaning
Off Link Failure
On Link Operating
Blinking Data Traffic
Table 68. CESoP LED’s Meaning
Connectors pin out can be seen on Table 69.
The Ethernet ports have the functionality of automatic MDI/MDIX selection that allows it to be connected
to any Ethernet port using a cross-cable or a straight-cable.
20.2. Interfaces
The ports have the facility of rate auto negotiation (10/100/1000 Mbit/s) operational mode (Half/Full duplex)
and MDI/MDIX.
TDM payload's size of a bundle depends on the number of timeslots, packet delay, and CAS mode set.
Besides that, operational configurations can be set using unframed mode (32 TS), framed (TS1 to TS31)
and framed with CAS (TS1 to TS30).
20.4. Application
20.5. Tests
LDL (Local Digital Loopback): Returns traffic to its origin, TDM and PSN.
Front End BERT : Inserts a sequence of BERT 2E9 towards the PSN network.
Back End BERT : Inserts a sequence of BERT 2E9 towards the TDM network.
Round Trip Delay (Front End Bert)*: Calculate the time required to complete a packet turnover
towards the PSN network.
Round Trip Delay (Back End Bert)*: Calculate the time required to complete a data flow turnover
towards the TDM network.
(*) This test interrupts the data flow and the link needs a loopback at the destination interface.
Aggregate STM-1 electrical interface module. It allows interconnecting a DM705 equipment to an SDH
network by an electrical STM-1 interface installed in a high speed (HS) slot. In this way the STM-1
aggregate interfaces can be used to connect to an STM-1 ring or for point-to-point connection with 1+1
protection.
It allows cross connection of up to 32 VC-12 and VC-3 pass-thru for the aggregate interfaces. The 155
Mbit/s interface follows ITU-T Recommendation G.703.
The 63 VC-12 cross connection requires CPU128 and minimum firmware 13. CPU64 and CPU128 with
firmware older than 13 allows 32 VC-12 cross connection only.
- Connectors: BNC
The electrical interface has short range if compared to the optical interface, so it is adequate to
interconnect equipments residing in the same site
Aggregate STM-1 optical interface module. It allows interconnecting a DM705 equipment to an SDH
network by an optical STM-1 interface installed in a high speed slot. In this way the STM-1 aggregate
interfaces can be used to connect to an STM-1 ring or for point-to-point connection with 1+1 protection.
It allows cross connection of up to 63 VC-12 and VC-3 pass-thru. The optical STM-1 interface follows ITU-
T Recommendations G.707 and G.783.
The cross connection of 63 VC-12 requires the CPU128 and firmware 13 (or higher). Both CPU64 and
CPU 128, when operating with firmware older then 13, allow the cross connection of 32 VC-12.
The optical cards are always provided with SC-PC connectors, even for bidirectional fiber – MONOFIBER -
cards.
o Two fibers (RX and TX) - They can transmit and receive at 1310 nm. Optionally they can
transmit and receive at 1550 nm.
o Monofiber (RX and TX in the same fiber) - They can transmit at 1310 nm and receive at
1550 nm over the same fiber or vice-versa.
Laser transmission power, directly implying in the link range (as seen in the table below).
Laser TX
Aggregate STM-1 SFP (Small Form-factor Pluggable) optical interface module. It allows interconnecting a
DM705 equipment to an SDH network by an optical SFP STM-1 interface installed in a high speed slot. In
this way the STM-1 aggregate interfaces can be used to connect to an STM-1 ring or for point-to-point
connection with 1+1 protection.
It allows cross connection of up to 63 VC-12 and VC-3 pass-thru. The optical STM-1 interface follows ITU-
T Recommendations G.707 and G.783.
The cross connection of 63 VC-12 requires the CPU128 and firmware 13 (or higher). Both CPU64 and
CPU 128, when operating with firmware older then 13, allow the cross connection of 32 VC-12.
The SFP (Small Form-factor Pluggable) module is used on the SFP port equipment, used as transceiver
between the card and the means of communication (optical fiber).
Modules without approval does not guarantee correct operation of the equipment. Please contact technical
support for information about the risks of using unapproved modules.
Laser TX
a. Laser Force Off: Forces the laser to turn off, regardless of other conditions.
b. Laser Force On: Forces the laser to turn on, regardless of the presence of fibers connected to the
card.
The interface optical module uses invisible laser radiation transmitters. Never look straight at the laser
terminals or to the optical fiber – exposure to laser emission can cause partial or total vision loss.
MSP Protection Test: Enables the user to switch from the work link to the protection link (or vice-
versa). It can be manually performed, or forced. It is used when operating in terminal mode.
SNC Protection Test: Enables the user to switch from the work link to the protection link (or vice-
versa). It can be manually performed, or forced.
The electrical E3 aggregate consists of a physical E3 interface and 16 connection E1s (virtual) and all E1s
may be connected to the CPU matrix.
The operation of the connection E1s for the E3 aggregate is analog to the operation of the connection E1s
for the other HS interfaces.
22.1.1. Characteristics
Connectors: BNC
Encoding: HDB3
22.2. Clock
The card allows a clock of any connection E1, however, it is not possible to regenerate the physical
interface clock.
22.3. Backup
HS-E3E interface allows the tributary backup made by the matrix on the connection E1s.
22.4.1. LDL
When disconnected, the clock can be cascaded to many equipment (using T type connectors).
The user must make sure that there is a termination placed at the last T connector of the chain, otherwise
noises or reflections that will alter the clock signal can appear, hampering the equipment performance.
DM705-CPU34, DM705-CPU64 and DM705-CPU128 card has 24 wide area network interfaces (WAN),
also called hdlc, and a 10/100BaseTx Ethernet LAN interface.
The LAN interface can operate with or without auto negotiation, allowing the user to choose between half
or full duplex mode and 10 or 100 Mbit/s rate.
Each of the WAN interfaces can be configured for a nx64 kbit/s rate, as long as the total rate does not
exceed 2048 kbit/s, and can be cross connected to any physical interface carrying data.
Frame Relay: with link control protocol (lmi) following ANSI, ITU-T Q.933 Annex A standards or
none;
The equipment performs routing between any of its interfaces following its routing table, which can be built
as follows:
The equipment network configuration can be done via management software, terminal, TELNET or SSH.
However, hdlc interfaces physical mapping to data timeslots can only be done through management
software.
The DM705-SUB has three inputs for external alarms and one equipment alarm output. The alarm inputs
and output have configurable severity and enabling.
The inputs and output are available in a DB9 connector located in front of the CPU card. The pin out is
given in Table 11.
The alarm output is showed by three different levels: Critical, Major and Minor.
Severities of alarms:
Critical - These are the most severe equipment alarms. These alarms directly impact equipment
basic operation and cause temporary data loss in the protected links or permanent data loss in
unprotected links. Examples: physical failures in the aggregate links, equipment hardware
failures, etc.
Major - (High priority alarms) – Alarms that impact unprotected link operation, causing temporary
data loss in the protected links. Examples: regenerating section TIM alarm, unprotected tributary
link failures, etc.
Minor - (Low priority alarms) – Alarms that do not cause major equipment operation problems. As
minor alarm examples: remote equipment alarm (RDI), etc.
Every DM705-SUB alarm generates trap for management and a log input, the equipment could be
configured to have its traps acknowledge by the management system. The alarms are filtered to avoid
signaling redundant problems, and the highest hierarchy alarm is reported.
If an alarm is activated and deactivated many times in a short period of time, an instability situation is
noticed. The alarm is then activated up to the point where the instability does not persist anymore. This
situation is properly reported in the equipment log and by management traps.
For more details please contact DATACOM. There is a table describing the most relevant alarms in the
Installation and Operation Manual.
The DM705 is capable of operating normally when interface cards are added or taken from its slots,
without need to turn off the power supply.
However, some precautions must be taken so that no equipment problem occurs during the process of
insertion or extraction of cards with the equipment under operation.
Hot Swap procedures must be done by expert technicians trained to operate this equipment. Any other
person can get hurt by electric shocks.
The card must be inserted correctly. It must slide into the slot smoothly. Never force the insertion of a
card. In case of difficulties, stop the insertion and check if there is something blocking the slot, then try
again.
Never leave DM705 SUB without no hardware CPU: this will generate error in the data of all the interfaces
that could exactly not be reestablished after insertion of new CPU. It always connects the new CPU before
removing the first one.
For redundant operation, bear in mind that extracting the CPU will always cause client data error. If the
standby CPU is in sync and ready to operate, this error should be less than 5s. For the DSL card, where a
resynchronization process could occur, there can be data loss of around 1 minute. If the standby CPU is
not in sync, this procedure should not be done.
It is only possible redundancy between equal models of CPU. Two CPU128, for example. In case of a
CPU64 is installed with a CPU128, it will not have CPU redundancy.
Insert the supply in its appropriate slot and push it nearly to the end (it is important that its front
panel reaches approximately 1cm from the edge of the chassis).
Completely insert the supply card in the equipment and screw it tightly.
The POWER SUPPLY card has “live” connections (with outlet voltage and other higher voltage levels) in
many places. So, if the above procedure is not followed, the user will be exposed to electrical shocks and
may also cause interruption in the equipment operation or even equipment damage.
26.3.2. Interface cards that can NOT be “hot swapped” (risk to the equipment and to
the card)
If part of the edge card connector is slanted (according to Figure 127), the card should not be “hot-
swapped” for it can damage the equipment and/or the card itself.
All these procedures can cause equipment damage and harm to the people conducting them. So, when in
doubt, please call tech support for more details.
o V.35, V.36, V.11, V.24, V.28, T.50, X.50, X.21, G.652, G.703, G.704, G.706,
G.707
o G.781, G. 783, G.806, G.811, G.813, G.821, G.823, G.825, G.826, G.841, G.955,
G.957
Telebras:
o 225-100-509
o 220-550-704
o 225-100-722
o 225-100-723
o 225-540-730
o 225-540-740
o 225-740-750
Ethernet:
o IEEE 802.3
o IEEE 802.1D
o IEEE 802.1Q
EN 60950-1 (2006)
Safety
IEC 60950 Product Safety
This symbol means that this text is very important and, if the orientations were not correct followed, it may
cause damage or hazard.
The power supply, where the supply cable is connected, must be positioned near the equipment and be on
an easily accessible location, because the equipment is turned on and off through it .
Follow attentively every guidance included in this manual. In case of doubts, please contact the
authorized technical support.
When installing, always tighten screws and knurling screws until the end of their thread and until they are
completely tightened.
The power supply, where the supply cable is connected, must be positioned near the equipment and
have easy access, because the equipment is turned on and off through it.
In case of using DC voltage, you must be careful so that the equipment protection ground cable (green
cable with yellow line related to the central socket pin) matches the system protection ground cable. This
cable must be connected before any other connection. The metallic structure of the equipment is
connected to the protection ground cable.
The equipment supports 6.3 A fuses, type T (delay), 250 V. If necessary, replace them only for other ones
of the same type and value.
This unit has more than one power supply cord. Disconnect all power supply cords to completely remove
power from this unit.
To comply with EMC requirements, use only good quality cables and connectors approved for this
purpose, according the following interfaces.
To ensure compliance with EMC standards, when operating in 120 ohms, shielded cables connecting to
ground (GND) are required.
To ensure compliance with EMC standards, when selected to operate in 75 ohms, shielded cables
connecting to ground are required, i.e., straps E1 and E2 shall be in the position 0 – 1 (GND).
To ensure compliance with EMC standards, shielded cables connecting to ground (GND) are required.
To ensure compliance with EMC standards all input and output shielded cables connecting to ground is
required, i.e., all straps shall be in the grounded position.
The use of more than 6 DM705-DSL8 cards on equipment having the HW1 power supply is not
recommended. The power supplies from the HW2 do not present any limitation as to the number of cards
supported.
When the FXS, FXO or E&M cards analog lines pass through media that can suffer influence of electrical
or atmospheric discharges, it is recommended to add primary protection devices to these lines, like gas
sparklers and/or varistors.
To ensure compliance with EMC standards, shielded cables connecting to ground (GND) are required.
Bad or missing FGND can cause BASE BAND MODEM interface performance degrading. The tests for
the above cited ranges were done connecting FGND and DGND.
When connected to external lines, external protection must be installed to avoid damages to the
equipment.
The use of more than 6 DM705-DSL8 cards on equipment having the HW1 power supply is not
recommended. The power supplies from the HW2 do not present any limitation as to the number of cards
supported.
It is necessary to be careful in order to not connect an external power supply to a pack while the straps
are configured for internal power. This procedure may cause irreparable damages to the card.
It is not recommended the use of more than 6 DM705-Switch plates in equipment that possesses the
source of feeding HW1. The sources of feeding from the HW2 do not present any limitation how much
number
The card must be inserted correctly on the guides, and run easily. If there is something blocking the fitting,
do not force it. Remove the card, check what could be preventing the proper fitting and try again.
Never leave DM705 SUB without no hardware CPU: this will generate error in the data of all the interfaces
that could exactly not be reestablished after insertion of new CPU. It always connects the new CPU before
removing the first one.
This symbols means that, case the procedure was not correctly followed, may exist electrical shock risk.
Always observe the instructions of security during the installation, operation or maintenance of this
product. Installation, adjustment or maintenance must be carried through only by qualified, trained and
authorized people.
To prevent risks of electrical shock, before binding the equipment or connecting some card or cable of
interface, connected the ground.
Before connecting any cable to the equipment, make sure that the grounding system is functional.
The POWER SUPPLY card has “live” connections (with outlet voltage and other higher voltage levels) in
many places. So, if the above procedure is not followed, the user will be exposed to electrical shocks and
may also cause interruption in the equipment operation or even
The hot swap procedure must be performed only by qualified technicians with specific training in this
equipment. The non-compliance with this requirement may expose the person performing this procedure to
electrical shocks.
Indicates presence of laser radiation. If the instructions are not followed and the direct exposure to eyes
and skin is not avoided, it may cause damages to the skin or vision.
Some equipment in this manual has laser emitting optical modules. Avoid exposure to eyes and skin.
The optical interface module uses transmitters with non visible laser radiation. Never look directly at the
laser terminals or the optical fiber. Exposure to laser emission may cause partial or total loss of vision.
The interface optical module uses invisible laser radiation transmitters. Never look straight at the laser
terminals or to the optical fiber – exposure to laser emission can cause partial or total vision loss.
Indicates that equipment or a part is ESDS (Electrostatic Discharge Sensitive). It should not be handled
without grounding wrist strap or equivalent.
The described equipment in this manual is sensible to the static electricity. Before handling any described
equipment in this manual, verify if using devices of protection against static electricity, and if these are
functioning correctly.
Dieses Symbol zeigt an, dass der hier enthaltene Text sehr wichtig ist und dass Beschädigungsrisiko
besteht. Der Text muss sorgfältig gelesen werden und kann große Schwierigkeiten vermeiden.
Dies ist ein Produkt der Klasse A. Bei der Verwendung dieses Produkts im Haus- oder Wohnungsbereich
kann es zu Funkstörungen kommen. In diesem Fall muss der Benutzer u. U. angemessene Maßnahmen
ergreifen.
Die Energiequelle, an die das Einspeisekabel angeschlossen wird, muss sich in der Nähe der Anlage
befinden und leicht zugänglich sein, da die Anlage durch sie ein- und ausgeschaltet wird.
Aufmerksam alle in diesem Handbuch enthaltenen Hinweise befolgen. Im Zweifelsfall einen zugelassenen
technischen Service kontaktieren.
Während der Installation immer alle Schrauben und Rändelschrauben bis zum Gewindeende und bis sie
vollkommen eingeschraubt sind anziehen.
Die Energiequelle, an die das Einspeisekabel angeschlossen wird, muss sich in der Nähe der Anlage
befinden und leicht zugänglich sein, da die Anlage durch sie ein- und ausgeschaltet wird.
Wenn Gleichstrom verwendet wird, darauf achten, dass die Schutzerdung der Anlage (grüne Leitung mit
gelbem Streifen, der sich auf den Steckdosenmittelstift bezieht) der Systemschutzerdung entspricht. Diese
Leitung muss vor allen anderen Verbindungen angeschlossen werden. Die Metallstruktur der Anlage wird
an die Schutzerdung angeschlossen.
Die Anlage arbeitet mit Sicherungen 6,3 A, Typ T (Verzögerung), 250 V. Sie dürfen nur durch Sicherungen
vom gleichem Typ und mit gleichem Wert ersetzt werden.
Es muss darauf geachtet werden, das keine Potentialdifferenz zwischen den DB9-Stift 5 des Mux
(Signalerde) und den DB9-Stift 5 (oder den DB25-Stift 7) des PCs entsteht, da dies die seriellen Mux-und
PC-Schnittstellen beschädigen könnte. Um sich zu vergewissern, dass dies nicht vorkommt, muss die
Spannung zwischen diesen beiden Stiften mit einem AC-Voltmeter gemessen werden. Sollte eine
Potentialdifferenz festgestellt werden, Erdung der Anlagen überprüfen. Wenn die obigen Bedingungen
eingehalten werden, braucht die Anlage zum Anschluss des seriellen Kabels nicht ausgeschaltet zu
werden.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, benutzen Sie nur geprüfte und
zugelassene Kabel und Stecker, die zu diesem Zweck genehmigt sind, entsprechend den folgenden
Schnittstellen.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, ist bei einer 120 ohm Benutzung, die
Erdung (GND) der abgeschirmten Kabel erforderlich.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, ist bei einem Widerstand von 75 Ohm
die Erdung (GND) der abgeschirmten Kabel erforderlich, d.h. Jumper E1 und E2 in der Position 0 - 1
(Erde).
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, müssen die abgeschirmten Kabel an
Erde (GND) angeschlossen werden.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, müssen alle abgeschirmten Kabel ,
Eingang und Ausgang, an Erde (GND) angeschlossen werden, d.h. alle Jumper in der geerdeten Position.
Bei Anlagen, die die Einspeisequelle HW1 besitzen, ist es nicht empfehlenswert, mehr als 6 DM705-DSL8-
Platten zu verwenden. Bei Einspeisequellen ab HW2 gibt es keinerlei Begrenzung für die Plattenzahl
mehr.
Wenn die Analoglinien der Platten FXS, FXO oder E&M durch Mittel führen, die von elektrischen oder
atmosphärischen Entladungen beeinflusst werden können, ist es empfehlenswert, primäre
Schutzvorrichtungen wie Gasfunkenstrecken und/oder Varistoren hinzuzufügen.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, müssen die abgeschirmten Kabel an
Erde (GND) angeschlossen werden.
Das Fehlen (oder die schlechte Qualität) der Erdung kann die Leistung der BASE BAND MODEM-
Schnittstelle beeinträchtigen. Die Tests für die oben genannten Reichweiten wurden mit an die
Signalerdung angeschlossenen Schutzerdungen durchgeführt.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, müssen die abgeschirmten Kabel an
Erde (GND) angeschlossen werden.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, muss das abgeschirmte Kabel wie
folgt an Erde (GND) angeschlossen werden:. DB44, Stift 31, angeschlossen an Schild und metallisches
Teil des Steckers. Jedes DB25, Stift 1, angeschlossen an Schild und metallisches Teil des Steckers.
Aufpassen, dass eine externe Quelle nicht an eine Bank angeschlossen wird während die Kontakte für
interne Einspeisung konfiguriert sind. Diese Vorgehensweise kann permanente Plattenschäden
verursachen.
Bei Anlagen, die die Einspeisequelle HW1 besitzen, ist es nicht empfehlenswert, mehr als 6 DM705-
Switch-Platten zu verwenden. Bei Einspeisequellen ab HW2 gibt es keinerlei Begrenzung für die
Plattenzahl mehr.
Um eine Sicherstellung gemäss EMC Standards zu gewährleisten, muss das abgeschirmte Kabel an
Erde (GND) angeschlossen werden, d.h. Jumper E1 in Position 0 - 1 (Erde).
Der DM705 SUB muss immer an einer CPU angeschlossen sein, da sonst Fehler in Daten aller
Schnittstellen verursacht werden. Diese können dann auch nach Aufschaltung einer neuer CPU nicht
wieder hergestellt werden. Immer zuerst die neue CPU anschließen, bevor die alte entfernt wird.
Stromkabel nicht ans Netz anschließen bevor die Quelle im Slot positioniert ist.
Zeigt an, dass Risiko von elektrischen Schlägen besteht, wenn die Vorgehensweisen nicht korrekt befolgt
werden.
Einige SELV und TNV Stromkreise benutzen die gleichen Stecker. Um einen elektrischen Schlag zu
vermeiden, nicht SELV an TNV Stromkreis anschließen.
Um das Risiko von elektrischen Schlägen zu vermeiden, muss die Schutzerdung installiert werden bevor
die Anlage eingeschaltet oder eine Platte oder ein Schnittstellenkabel angeschlossen wird.
Alle nicht belegten Slots müssen mit einer Blindplatte abgedeckt werden. Auf diese Weise wird der Kontakt
mit spannungsführenden Teile im Innern der Anlage vermieden. Dieser Vorgang darf nur von geschultem
und autorisiertem Personal durchgeführt werden.
Bevor irgendein Kabel an die Anlage angeschlossen wird, sich vergewissern, dass das Erdungssystem
korrekt funktioniert.
Die Platte der Einspeisungsquelle besitzt an verschiedenen Punkten lebende Verbindungen (mit
Netzspannungen und andere höhere Spannungen). Wenn also die obige Vorgehensweise nicht beachtet
wird, wird der Verbraucher elektrischen Schlägen ausgesetzt sein. Außerdem kann die Anlage beschädigt
oder ihre Funktion unterbrochen werden.
Alle diese Verfahren kônnen Schaden zur Ausrûstung oder zum Benutzer verursachen. Falls Sie im
Zweifel sind, Rufen Techunterstûtzung fûr mehr Detailinformationen an.
Zeigt das Vorhandensein von Laser-Strahlung an. Wenn die Instruktionen nicht beachtet werden, können
die Augen und die Haut im Fall einer direkten Aussetzung beschädigt werden.
Das optische Schnittstellenmodul verwendet Sender mit nicht sichtbarer Laserstrahlung. Niemals direkt in
die Lasersender oder Glasfaser blicken. Wenn die Augen den Laserstrahlen ausgesetzt werden, kann das
Augenlicht ganz oder teilweise verlorengehen.
Das optische Schnittstellenmodul verwendet Sender mit nicht sichtbarer Laserstrahlung. Niemals direkt in
die Lasersender oder Glasfaser blicken. Wenn die Augen den Laserstrahlen ausgesetzt werden, kann das
Augenlicht ganz oder teilweise verlorengehen.
Zeigt an, dass die Anlage oder ein Teil der Anlage empfindlich gegen statische Elektrizität ist. Sie darf
deshalb nicht ohne Schutzvorrichtungen wie Erdungsband oder ähnliche berührt werden.