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Data brief
Features
• Input voltage from 35 VAC (50 VDC) to 280 VAC (400 VDC)
• STGD6M65DF2 IGBTs power stage featuring:
– V(BR)CES = 650 V
– VCE(sat) = 1.55 V @ IC = 6 A
• Overcurrent threshold set to 5.5 Apeak
• Dual footprint for IGBT/MOSFET package:
– DPAK
– PowerFlat 8x8 HV
• Single-shunt current sensing, suitable for:
– Sensored or sensorless 6-step algorithm
– Sensored or sensorless single-shunt vector (FOC) algorithm
• Smart shutdown overcurrent protection
• Digital Hall sensors and encoder input
• Bus voltage sensing
• 15 V VCC and 3.3 V VDD supplies
• Embedded ST-LINK/V2-1
• Easy user interface with buttons and trimmer
• RoHS compliant
Description
The EVSPIN32F06Q1S1 board is a 3-phase complete inverter based on the
STSPIN32F0601 controller, which embeds a 3‑phase 600 V gate driver and a
Cortex®-M0 STM32 MCU. The power stage features STGD6M65DF2 IGBTs, but
can be populated with any IGBT or Power MOSFET in DPAK or powerFLAT 8x8 HV
package.
The board has a single-shunt sensing topology, and both FOC and 6‑step control
algorithms in either sensored or sensorless mode can be implemented. This allows
driving permanent magnet synchronous motors (PMSMs) and brushless DC (BLDC)
motors.
The evaluation board is compatible with a wide range input voltage from 35 VAC
(50 VDC) to 280 VAC (400 VDC), and includes a power supply stage with the
VIPER06XS in flyback configuration to generate +15 V and +3.3 V supply voltage
required by the application.
Debug and configuration of FW can be performed with standard STM32 tools through
the detachable STLINK‑debugger. SWD and UART TX‑RX connectors are also
available.
Warning:
During assembly, testing, and operation, the evaluation board poses several inherent hazards,
including bare wires, moving or rotating parts and hot surfaces.
Danger:
There is danger of serious personal injury, property damage or death due to electrical shock and
burn hazards if the kit or components are improperly used or installed incorrectly.
The kit is not electrically isolated from the high-voltage supply AC/DC input. The evaluation board is
directly linked to the mains voltage. No insulation is ensured between the accessible parts and the high
voltage. All measuring equipment must be isolated from the mains before powering the board. When
using an oscilloscope with the demo, it must be isolated from the AC line. This prevents shock from
occurring as a result of touching any single point in the circuit, but does NOT prevent shock when
touching two or more points in the circuit.
All operations involving transportation, installation and use, and maintenance must be performed by skilled
technical personnel able to understand and implement national accident prevention regulations. For the purposes
of these basic safety instructions, “skilled technical personnel” are suitably qualified people who are familiar with
the installation, use and maintenance of power electronic systems.
Danger:
Do not touch the evaluation board when it is energized or immediately after it has been
disconnected from the voltage supply as several parts and power terminals containing potentially
energized capacitors need time to discharge.
Do not touch the boards after disconnection from the voltage supply as several parts like heat
sinks and transformers may still be very hot.
The kit is not electrically isolated from the AC/DC input. The USB interface of the board does not
insulate host computer from high voltage. When the board is supplied at a voltage outside the ELV
range, a proper insulation method such as a USB isolator must be used to operate the board.
3. Personal Safety
– Always wear suitable personal protective equipment such as, for example, insulating gloves and safety
glasses.
– Take adequate precautions and install the board in such a way to prevent accidental touch. Use
protective shields such as, for example, insulating box with interlocks if necessary.
2 Schematic diagrams
1
2
3
4
D1 5
D2 TP 17 2
N.M. R2
Q1
Q1A
S TGD6M65DF2
S WD_CLK 10R N.M.
BAT54J GH3 1 GH3 1
S WD_IO R3
Boot from: SPI1_NSS/PROC J1 C4 TP 4
R5 3 2 3 4
CLOSED 2-3 Flash SPI1_MOSI/GPIO CP OUT C3 100R 100k
N.M.
VDD CLOSED 1-2 System/SRAM SPI1_MISO/GPIO
1uF/50V OUT3
SPI1_CLK/COMM TP 3
4
3
2
1
VCC VCC 5 OUT3
TP 2 D4 TP 18 2
R10
1 UART1_TX LVG3 Q3
TP 1 Q3A
UART1_RX VCC S TGD6M65DF2
10R 1 N.M.
C1 C2 BAT54J GL3 GL3 1
100nF/25V 220nF/25V 2
R109 R13
VCC C7 TP 25
R14 3 2 3 4
JP1 0R 100R 100k
EXP
TP 5 N.M.
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
3 CLOS ED 2-3 S ENS E
ZCR
R15
EP AD
BOOT0
P B7
P B6
P B5
P B4
P B3
P A15
P A14
P A13
P A12
RES 3
RES 2
RES 1
RES 5
VCC
1 27R
2 RES 6 HV HV
3 P B8
4 VS S 53
VDD VDD BOOT3 D6 5
GP IO_BEMF 5 52 D7 TP 19 2
6 P C13 HVG3 51 N.M. R16
P C14 Q4
P C14 OUT3 Q4A
7 S TGD6M65DF2
P C15 P C15 10R N.M.
8 BAT54J GH2 1 GH2 1
9 P F0 47
P F1 BOOT2 R18
X1 10 S TS P IN32F0601Q 46 C13 TP 7
NRS T NRS T HVG2 R19 3 2 3 4
11 45
VS S A OUT2 C12 100R 100k
12 N.M.
VDD VDDA 1uF/50V OUT2
P A0 13
P A0 OUT2
C10 8MHz C11 14 40
P A1 P A1 BOOT1
10pF/50V 10pF/50V 15 39 5
P A2 P A2 HVG1
16 38 D9 TP 20 2
P A3 OUT1 R27
17 LVG2 Q6
Temp_fdbk P A4 Q6A
P GND
18 S TGD6M65DF2
RES 4
LVG1
LVG2
LVG3
GND
1 GL2 1
CIN
BAT54J GL2
OD
VDD
R30
C17
U1 R31 3 TP 24 2 3 4
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
1
0R15-2W-1%
0R15-2W-1%
Ioc_max=6.3A 1nF/25V
C32 N.M. C30 C31
R34
R36
U3
100nF/25V 4.7uF/10V
TS 3021ILT
R58 0R S ENS E_N 1 2
V+
+ CP OUT
- R59 0R
V-
CURRENT_REF R60 33k
R61 C35
10M 100nF/25V
VDD
HALL PWR
JP2 VDD
OP EN
3
2 R4
B+/H2 B+/H2_C P A1_Hall
3 R70 1.8k 1M
Z+/H3 R6 R7 Q2
4 1
VDD Z+/H3_C P A2_Hall BC817-25 or Equivalent
GND
5 R71 1.8k
R8 180k 180k
OUT3
R9 D3
0R C5 C6
2
R73 0R R74 R75 R76 R11 P A2_BEMF
C37 C38 C39
N.M. N.M. N.M. 1k 2.7k
10pF/10V 10pF/10V 10pF/10V S TTH1L06A N.M. 4.7pF/50V
R12
D5 10k
GP IO_BEMF
BAT54J
J P 11
2
+5V 5V
VDD VDD
4
3
R17
1M
R21 R20 1 Q5
P A0 BC817-25 or Equivalent
VDD 2 R22 180k 180k
R48 OUT2
P A0_BEMF 1 3 P A0_Hall R24 D8
0R C14 C15
2
39k R25 P A1_BEMF
BEMF1
1k 2.7k
RESET JP3 S TTH1L06A N.M. 4.7pF/50V
S W1
CLOS ED 1-2 R28
3 1 R54
NRS T P A1 D10 10k
4 2 2
100R GP IO_BEMF
C34 P A1_BEMF P A1_Hall
430483025816 1 3 BAT54J
3.3NF/25V
BEMF2
JP4
CLOS ED 1-2
P A2
2 VDD VDD
P A2_BEMF 1 3 P A2_Hall
BEMF3 HALL
3
R43
JP5
1M
CLOS ED 1-2 R45 R46 1 Q8
LD1 BC817-25 or Equivalent
R47
YELLOW OUT1 180k 180k
VDD
R62
0R R50 D14 P A0_BEMF
C28 C29
2
R51
120R
1k 2.7k
S TTH1L06A N.M. 4.7pF/50V
USER2 R53
S W2
10k
3 1 R66 D15
P C15
4 2 GP IO_BEMF
100R HV
C36 BAT54J
430483025816
1nF/25V
R67
470k
VDD
J P 10
Q11 +5V
VCC OP EN
R69 D19 2 3S TF1640 3
470k BAT54J
VDD
R112
VBUS _fdbk 8k2 1
LD2
1
R79 CLOS ED 1k
3 1
P C14 Temp_fdbk
4 2
100R
C42
430483025816
1nF/25V C41
R81
4.7k
100nF/25V
1
F1A N.M.
D20 E3V3 1
+
NTC1 GBU805 VDD 2
R82
3V3_STLINK 3
C44 C44A 330R
1 2 3 2
J4
AC MAINS ~
JP7 D21
1 F1 10A/277V s low CLOS ED 1-2 3V3 N.M.
150uF/420V N.M.
2R2 RV1
-
LD3
2 N.M.
RED
4
Vcc_F VCC
Vcc_F 1
VCC 2
J2
3
3 OUT1 GND +
OUT1 C45
JP8 22uF/25V
OUT2 2 OUT2 CLOS ED 1-2
OUT3 1 OUT3
U4
LD1117S 33CTR
HV T1 D22 E3V3
2 1 3 2
R83 0R Vin Vout
8 GND
S TP S 0560Z
+
C46 C47 C48
R110 C66 1
470uF/10V 100nF/25V 10uF/10V
220K 1/3W 220pF/630V 3
5 Vcc_F
D23
1
1 2 1
4
D25
S TP S 1150A
S TTH1L06A +
C49 R84
2 47uF/25V 36k
2
10
U5
DRAIN
DRAIN
DRAIN
DRAIN
DRAIN
VIP ER06XS
D24
3 2 R85
LD4
LIM VDD
COMP
GREEN
GND
10R
BAT54J
FB
+
C50
10uF/35V
R88
5
1.5k
1/4W
R86 R87
22k 22k
C51 R89
820pF/25V 10k
C52
680nF/10V
VUS B
C53
3V3_S TLINK
100nF/25V
R90
10k
J5 65100516121
U7
U6 US BLC6-2S C6 3V3_S TLINK
3
6
7 S HELL US B_VCC
1
2
D- 1 6 US B_DM Q10 1
R91 US B_RENUM
VUS B LD3985M33R
S HELL US BDM I/O1#1 I/O1#6 1 5
8 3 BC847B VIN OUT TP 15
S HELL US BDP 100R
9
S HELL ID
4 D+ 2
GND VBUS
5
3
C58
2
5 INHIBIT C56
US B_GND US B_DP R93
3 4 100nF/25V 1uF/10V
I/O2#3 I/O2#4 36k 4 2
C54 C55 BYP AS S GND
R92 1.5k
1uF/10V 100nF/25V
C57
10nF/25V
VDD
VDD
R94
4.7k
U8 S TM32F103CBT6
T_NRS T R96
10 18
P A0-WKUP P B0 2.7k
11 19
R95 0R S TLINK_TX 12 P A1 P B1 20
T_J TCK UART1_RX P A2 P B2/BOOT1
S WD_CLK S TLINK_RX 13 39
R98 UART1_TX P A3 P B3/J TDO
R97 0R R99 0R 14 40
4.7k T_J TCK P A4 P B4/J NTRS T
15 41
16 P A5 P B5 42
RX TX R100
1
2
3V3_S TLINK 17 P A6 P B6 43
T_J TMS P A7 P B7 4.7k
S WD_IO
R101 0R J6 29 45
J7 S TRIP 1x2 LED_S TLINK P A8 P B8
30 46
1 31 P A9 P B9 21
2 FM_S WCLK US B_DM 32 P A10 P B10 22
3 US B_DP 33 P A11 P B11 25 T_J TMS
4 FM_S WDIO 34 P A12 P B12 26 T_J TCK
P A13 P B13 R102
37 27 S WDIO
J8 US B_RENUM 38 P A14 P B14 28
S TRIP 1x4 P A15 P B15 100R
CLOS ED
STLINK FW LOAD 5 2 R103 10k
6 OS CIN/P D0 P C13-TAMP ER-RTC 3
X2
1
2
C61 VDD_3 VS S _3
JP9
C62 C63 C64 C65 9 8
OP EN VDDA VS S A
3V3_S TLINK 100nF/50V
100nF/25V 100nF/25V 100nF/25V 100nF/25V
1
R107 100R
K2 A2
LED_S TLINK A1 K1
R108 100R
LD5
RED-GREEN
3 Bill of materials
WURTH
C50 10uF/35V SMD Aluminum Elect. Capacitor 5x5.4 mm 865230542002
ELEKTRONIK
C51 820pF/25V SMT Ceramic Capacitor Size 0603
WURTH
C52 680nF/10V SMT Ceramic Capacitor Size 0603 885012206025
ELEKTRONIK
WURTH
C54, C58 1uF/10V SMT Ceramic Capacitor Size 0603 885012206026
ELEKTRONIK
WURTH
C57 10nF/25V SMT Ceramic Capacitor Size 0603 885012206065
ELEKTRONIK
WURTH
C61 100nF/50V SMT Ceramic Capacitor Size 0603 885012206095
ELEKTRONIK
C66 220pF/630V SMT Ceramic Capacitor Size 1206 Multicomp MC1206N221J631CT
WURTH
C68 4.7uF/50V SMT Ceramic Capacitor Size 1206 885012208094
ELEKTRONIK
Turbo 2 Ultrafast High-Voltage
D1, D6, D11 N.M. SMA STMicroelectronics STTH1L06A
Rectifier
D2, D4, D5, D7,
D9, D10, D12,
40V, 300mA Small signal
D13, D15, D16, BAT54J SOD-323 STMicroelectronics BAT54JFILM
Schottky SMT Diode
D17, D18, D19,
D24
Turbo 2 Ultrafast High-Voltage
D3, D8, D14, D25 STTH1L06A SMA STMicroelectronics STTH1L06A
Rectifier
Taiwan
8A Glass Passivated Single-
D20 GBU805 GBU Semiconductor or GBU805 or GBU806
Phase Bridge Rectifier
Diodes Incorporated
D21 N.M. ZENER 3V3 SOD-123
D22 STPS0560Z 60V, 0.5A Schottky rectifier SOD-123 STMicroelectronics STPS0560Z
D23 STPS1150A 150V, 1A Power Schottky rectifier SMA STMicroelectronics STPS1150A
SURFACE MOUNT ZENER
D26 DDZ9690T SOD523 DIODES Incorporated DDZ9690T-7
DIODE
Time Lag radial lead Micro Fuse,
F1A N.M. RST-BELFUSE belfuse 0697-xx
250Vac
Suface Mount Fuse, Time-Lag T, UMT250-
F1 10A/277V slow Schurter 3403.0176.24
250Vac125Vdc SHURTER
JP1 CLOSED 2-3 SMT Jumper Soldering pad
JP2, JP10 OPEN SMT Jumper Soldering pad
JP3, JP4, JP5 CLOSED 1-2 SMT Jumper Soldering pad
JP6 CLOSED SMT Jumper Soldering pad
WURTH
JP7, JP8 CLOSED 1-2 Strip connector 3 pos, 2.54 mm 1x3 pins 61300311121
ELEKTRONIK
JP9 OPEN SMT Jumper Soldering pad
JP11 CLOSED 2-4 SMT Jumper Soldering pad
WURTH
J1, J7, J9 STRIP 1x4 Strip connector 4 pos, 2.54 mm 1x4 pins 61300411121
ELEKTRONIK
MORSV-508-3 Connector terminal block T.H. 3 3 poles, Pitch WURTH
J2 691213510003
P_screw positions 5.08 mm 5.08 ELEKTRONIK
WURTH
J3 STRIP 1x5 Strip connector 5 pos, 2.54 mm 1x5 pins 61300511121
ELEKTRONIK
Warning
The kit is not electrically isolated from the AC/DC input. The USB interface of the board does not insulate
host computer from high voltage. When the board is supplied at a voltage outside the ELV range, a proper
insulation method such as a USB isolator must be used to operate the board.
Revision history
Contents
1 Safety and operating instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 General terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Intended use of evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Installing the evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Operating the evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4 Layout and component placements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
List of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
List of figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
List of tables
Table 1. EVSPIN32F06Q1S1 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
List of figures
Figure 1. EVSPIN32F06Q1S1 schematic – Driver output stages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. EVSPIN32F06Q1S1 schematic – Feedback network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. EVSPIN32F06Q1S1 schematic – Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. EVSPIN32F06Q1S1 schematic – STLINK debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. EVSPIN32F06Q1S1 - functional blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. EVSPIN32F06Q1S1 – Layout (component placement top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. EVSPIN32F06Q1S1 – Layout (top layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 8. EVSPIN32F06Q1S1 – Layout (bottom layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17