Technical Publication: Hispeed Dual, Prospeed Fii Theory of Operation

GE Healthcare
gehealthcare.com
Technical 
Publication
5116384
Revision 11
HiSpeed Dual, ProSpeed FII

Theory of Operation
Copyright © 2004-2012 by General Electric Company
Operating Documentation
HiSpeed Dual, ProSpeed FII
GE HEALTHCARE THEORY OF OPERATION
REV 9 5116384
警告 • 本维修手册仅提供英文版本。
(ZH-CN) • 如果维修服务提供商需要非英文版本，客户需自行提供翻译服务。
• 未详细阅读和完全理解本维修手册之前，不得进行维修。
• 忽略本警告可能对维修人员，操作员或患者造成触电、机械伤害或其他形式的
伤害。
VÝSTRAHA • Tento provozní návod existuje pouze v anglickém jazyce.

• V případě, že externí služba zákazníkům potřebuje návod v jiném jazyce, je
(CS) zajištění překladu do odpovídajícího jazyka úkolem zákazníka.
• Nesnažte se o údržbu tohoto zařízení, aniž byste si přečetli tento provozní
návod a pochopili jeho obsah.
• V případě nedodržování této výstrahy může dojít k poranění pracovníka
prodejního servisu, obslužného personálu nebo pacientů vlivem elektrického
proudu, respektive vlivem mechanických či jiných rizik.
ADVARSEL • Denne servicemanual findes kun på engelsk.

• Hvis en kundes tekniker har brug for et andet sprog end engelsk, er det
(DA) kundens ansvar at sørge for oversættelse.
• Forsøg ikke at servicere udstyret medmindre denne servicemanual har været
konsulteret og er forstået.
• Manglende overholdelse af denne advarsel kan medføre skade på grund af
elektrisk, mekanisk eller anden fare for teknikeren, operatøren eller patienten.
WAARSCHUWING • Deze onderhoudshandleiding is enkel in het Engels verkrijgbaar.

• Als het onderhoudspersoneel een andere taal vereist, dan is de klant
(NL) verantwoordelijk voor de vertaling ervan.
• Probeer de apparatuur niet te onderhouden voordat deze
onderhoudshandleiding werd geraadpleegd en begrepen is.
• Indien deze waarschuwing niet wordt opgevolgd, zou het
onderhoudspersoneel, de operator of een patiënt gewond kunnen raken als
gevolg van een elektrische schok, mechanische of andere gevaren.
WARNING • This Service Manual is available in English only.

• If a customer's service provider requires a language other than English, it is the
(EN) customer's responsibility to provide translation services.
• Do not attempt to service the equipment unless this service manual has been
consulted and is understood.
• Failure to heed this warning may result in injury to the service provider,
operator, or patient, from electric shock or from mechanical or other hazards.
HOIATUS • Käesolev teenindusjuhend on saadaval ainult inglise keeles.

• Kui klienditeeninduse osutaja nõuab juhendit inglise keelest erinevas keeles,
(ET) vastutab klient tõlketeenuse osutamise eest.
• Ärge üritage seadmeid teenindada enne eelnevalt
käesoleva teenindusjuhendiga tutvumist ja sellest aru saamist.
• Käesoleva hoiatuse eiramine võib põhjustada teenuseosutaja, operaatori või
patsiendi vigastamist elektrilöögi, mehaanilise või muu ohu tagajärjel.
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VAROITUS • Tämä huolto-ohje on saatavilla vain englanniksi.

• Jos asiakkaan huoltohenkilöstö vaatii muuta kuin englanninkielistä materiaalia,
(FI) tarvittavan käännöksen hankkiminen on asiakkaan vastuulla.
• Älä yritä korjata laitteistoa ennen kuin olet varmasti lukenut ja ymmärtänyt
tämän huolto-ohjeen.
• Mikäli tätä varoitusta ei noudateta, seurauksena voi olla huoltohenkilöstön,
laitteiston käyttäjän tai potilaan vahingoittuminen sähköiskun, mekaanisen
vian tai muun vaaratilanteen vuoksi.
ATTENTION • Ce manuel de service n'est disponible qu'en anglais.

• Si le technicien du client a besoin de ce manuel dans une autre langue que
(FR) l'anglais, c'est au client qu'il incombe de le faire traduire.
• Ne pas tenter d'intervenir sur les équipements tant que le manuel service n'a
pas été consulté et compris
• Le non-respect de cet avertissement peut entraîner chez le technicien,
l'opérateur ou le patient des blessures dues à des dangers électriques,
mécaniques ou autres.
WARNUNG • Diese Serviceanleitung existiert nur in Englischer Sprache.

• Falls ein fremder Kundendienst eine andere Sprache benötigt, ist es aufgabe
(DE) des Kunden für eine Entsprechende Übersetzung zu sorgen.
• Versuchen Sie nicht diese Anlage zu warten,
ohne diese Serviceanleitung gelesen und verstanden zu haben.
• Wird diese Warnung nicht beachtet, so kann es zu Verletzungen des
Kundendiensttechnikers, des Bedieners oder des Patienten durch
stromschläge, Mechanische oder Sonstige gefahren kommen.
ΠΡΟΕΙ∆ΟΠΟΙΗΣΗ • Το παρόν εγχειρίδιο σέρβις διατίθεται στα αγγλικά μόνο.

• Εάν το άτομο παροχής σέρβις ενός πελάτη απαιτεί το παρόν εγχειρίδιο σε
(EL) γλώσσα εκτός των αγγλικών, αποτελεί ευθύνη του πελάτη να παρέχει
υπηρεσίες μετάφρασης.
• Μην επιχειρήσετε την εκτέλεση εργασιών σέρβις στον εξοπλισμό εκτός εαν
έχετε συμβουλευτεί και έχετε κατανοήσει το παρόν εγχειρίδιο σέρβις.
• Εαν δε λάβετε υπόψη την προειδοποίηση αυτή, ενδέχεται να προκληθεί
τραυματισμός στο άτομο παροχής σέρβις, στο χειριστή ή στον ασθενή από
ηλεκτροπληξία, μηχανικούς ή άλλους κινδύνους.
FIGYELMEZTETÉS • Ezen karbantartási kézikönyv kizárólag angol nyelven érhető el.

(HU) • Ha a vevő szolgáltatója angoltól eltérő nyelvre tart igényt, akkor a vevő
felelőssége a fordítás elkészíttetése.
• Ne próbálja elkezdeni használni a berendezést, amíg a karbantartási
kézikönyvben leírtakat nem értelmezték.
• Ezen figyelmeztetés figyelmen kívül hagyása a szolgáltató, működtető vagy a
beteg áramütés, mechanikai vagy egyéb veszélyhelyzet miatti sérülését
eredményezheti.
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AÐVÖRUN • Þessi þjónustuhandbók er eingöngu fáanleg á ensku.

• Ef að þjónustuveitandi viðskiptamanns þarfnast annas tungumáls en ensku, er
(IS) það skylda viðskiptamanns að skaffa tungumálaþjónustu.
• Reynið ekki að afgreiða tækið nema að þessi þjónustuhandbók
hefur verið skoðuð og skilin.
• Brot á sinna þessari aðvörun getur leitt til meiðsla á þjónustuveitanda,
stjórnanda eða sjúklings frá raflosti, vélrænu eða öðrum áhættum.
AVVERTENZA • Il presente manuale di manutenzione è disponibile soltanto in inglese.

• Se un addetto alla manutenzione richiede il manuale in una lingua diversa, il
(IT) cliente è tenuto a provvedere direttamente alla traduzione.
• Si proceda alla manutenzione dell'apparecchiatura solo dopo aver consultato il
presente manuale ed averne compreso il contenuto
• Il non rispetto della presente avvertenza potrebbe far compiere operazioni da
cui derivino lesioni all'addetto, alla manutenzione, all'utilizzatore ed al paziente
per folgorazione elettrica, per urti meccanici od altri rischi.
警告 • このサービスマニュアルには英語版しかありません。
(JA) • サービスを担当される業者が英語以外の言語を要求される場合、翻訳作業は
その業者の責任で行うものとさせていただきます。
• このサービスマニュアルを熟読し理解せずに、装置のサービスを行わないで
ください。
• この警告に従わない場合、サービスを担当される方、操作員あるいは患者さ
んが、感電や機械的又はその他の危険により負傷する可能性があります。
경고 • 본 서비스 지침서는 영어로만 이용하실 수 있습니다 .

(KO) • 고객의 서비스 제공자가 영어 이외의 언어를 요구할 경우 , 번역 서비스를 제공
하는 것은 고객의 책임입니다 .
• 본 서비스 지침서를 참고했고 이해하지 않는 한은 해당 장비를 수리하려고 시
도하지 마십시오 .
• 이 경고에 유의하지 않으면 전기 쇼크 , 기계상의 혹은 다른 위험으로부터 서비
스 제공자 , 운영자 혹은 환자에게 위해를 가할 수 있습니다 .
BRDINJUMS • Šī apkalpes rokasgrāmata ir pieejama tikai angļu valodā.

• Ja klienta apkalpes sniedzējam nepieciešama informācija citā valodā, nevis
(LV) angļu, klienta pienākums ir nodrošināt tulkošanu.
• Neveiciet aprīkojuma apkalpi bez apkalpes rokasgrāmatas izlasīšanas un
saprašanas.
• Šī brīdinājuma neievērošana var radīt elektriskās strāvas trieciena, mehānisku
vai citu risku izraisītu traumu apkalpes sniedzējam, operatoram vai pacientam.
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ĮSPĖJIMAS • Šis eksploatavimo vadovas yra prieinamas tik anglų kalba.

• Jei kliento paslaugų tiekėjas reikalauja vadovo kita kalba – ne anglų, numatyti
(LT) vertimo paslaugas yra kliento atsakomybė.
• Nemėginkite atlikti įrangos techninės priežiūros, nebent atsižvelgėte į šį
eksploatavimo vadovą ir jį supratote.
• Jei neatkreipsite dėmesio į šį perspėjimą, galimi sužalojimai dėl elektros šoko,
mechaninių ar kitų pavojų paslaugų tiekėjui, operatoriui ar pacientui.
ADVARSEL • Denne servicehåndboken finnes bare på engelsk.

• Hvis kundens serviceleverandør trenger et annet språk, er det kundens ansvar
(NO) å sørge for oversettelse.
• Ikke forsøk å reparere utstyret uten at denne servicehåndboken er lest og
forstått.
• Manglende hensyn til denne advarselen kan føre til at serviceleverandøren,
operatøren eller pasienten skades på grunn av elektrisk støt, mekaniske eller
andre farer.
OSTRZEŻENIE • Niniejszy podręcznik serwisowy dostępny jest jedynie w języku angielskim.

• Jeśli dostawca usług klienta wymaga języka innego niż angielski, zapewnienie
(PL) usługi tłumaczenia jest obowiązkiem klienta.
• Nie próbować serwisować wyposażenia bez zapoznania się i zrozumienia
niniejszego podręcznika serwisowego.
• Niezastosowanie się do tego ostrzeżenia może spowodować urazy dostawcy
usług, operatora lub pacjenta w wyniku porażenia elektrycznego, zagrożenia
mechanicznego bądź innego.
ATENÇÃO • Este manual de assistência técnica só se encontra disponível em inglês.

• Se qualquer outro serviço de assistência técnica, que não a gems, solicitar
(PT-BR) estes manuais noutro idioma, é da responsabilidade do cliente fornecer os
serviços de tradução.
• Não tente reparar o equipamento sem ter consultado ecompreendido este
manual de assistência técnica.
• O não cumprimento deste aviso pode por em perigo a segurança do técnico,
operador ou paciente devido a choques elétricos, mecânicos ou outros.
ATENÇÃO • Este manual de assistência técnica só se encontra disponível em inglês.

• Se qualquer outro serviço de assistência técnica, que não a gems, solicitar
(PT-PT) estes manuais noutro idioma, é da responsabilidade do cliente fornecer os
serviços de tradução.
• Não tente reparar o equipamento sem ter consultado ecompreendido este
manual de assistência técnica.
• O não cumprimento deste aviso pode colocar em perigo a segurança do
técnico, do operador ou do paciente devido a choques eléctricos, mecânicos
ou outros.
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ATENŢIE • Acest manual de service este disponibil numai în limba engleză.

• Dacă un furnizor de servicii pentru clienţi necesită o altă limbă decât cea
(RO) engleză, este de datoria clientului să furnizeze o traducere.
• Nu încercaţi să reparaţi echipamentul decât ulterior consultării şi înţelegerii
acestui manual de service.
• Ignorarea acestui avertisment ar putea duce la rănirea depanatorului,
operatorului sau pacientului în urma pericolelor de electrocutare, mecanice sau
de altă natură.
ОСТОРОЖНО! • Данное руководство по обслуживанию предлагается только на английском

языке.
(RU) • Если сервисному персоналу клиента необходимо руководство не на
английском, а на каком-то другом языке, клиенту следует самостоятельно
обеспечить перевод.
• Перед обслуживанием оборудования обязательно обратитесь к данному
руководству и поймите изложенные в нем сведения.
• Несоблюдение требований данного предупреждения может привести к
тому, что специалист по обслуживанию, оператор или пациент получат
удар электрическим током, механическую травму или другое
повреждение.
UPOZORENJE • Ovo servisno uputstvo je dostupno samo na engleskom jeziku.

• Ako klijentov serviser zahteva neki drugi jezik, klijent je dužan da obezbedi
(SR) prevodilacke usluge.
• Ne pokušavajte da opravite uredaj ako niste procitali i razumeli ovo servisno
uputstvo.
• Zanemarivanje ovog upozorenja može dovesti do povredivanja servisera,
rukovaoca ili pacijenta usled strujnog udara ili mehanickih i drugih opasnosti.
UPOZORNENIE • Tento návod na obsluhu je k dispozícii len v angličtine.

• Ak zákazníkov poskytovateľ služieb vyžaduje iný jazyk ako angličtinu,
(SK) poskytnutie prekladateľských služieb je zodpovednosťou zákazníka.
• Nepokúšajte sa o obsluhu zariadenia skôr, ako si neprečítate návod na obluhu
a neporozumiete mu.
• Zanedbanie tohto upozornenia môže vyústiť do zranenia poskytovateľa
služieb, obsluhujúcej osoby alebo pacienta elektrickým prúdom, do
mechanického alebo iného nebezpečenstva.
ATENCION • Este manual de servicio sólo existe en inglés.

• Si el encargado de mantenimiento de un cliente necesita un idioma que no sea
(ES) el inglés, el cliente deberá encargarse de la traducción del manual.
• No se deberá dar servicio técnico al equipo, sin haber consultado y
comprendido este manual de servicio.
• La no observancia del presente aviso puede dar lugar a que el proveedor de
servicios, el operador o el paciente sufran lesiones provocadas por causas
eléctricas, mecánicas o de otra naturaleza.
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VARNING • Den här servicehandboken finns bara tillgänglig på engelska.

• Om en kunds servicetekniker har behov av ett annat språk än engelska
(SV) ansvarar kunden för att tillhandahålla översättningstjänster.
• Försök inte utföra service på utrustningen om du inte har läst och förstår den
här servicehandboken.
• Om du inte tar hänsyn till den här varningen kan det resultera i skador på
serviceteknikern, operatören eller patienten till följd av elektriska stötar,
mekaniska faror eller andra faror.
DIKKAT • Bu servis kilavuzunun sadece ingilizcesi mevcuttur.

• Eğer müşteri teknisyeni bu kilavuzu ingilizce dişinda bir başka lisandan talep
(TR) ederse, bunu tercüme ettirmek müşteriye düşer.
• Servis kilavuzunu okuyup anlamadan ekipmanlara müdahale etmeyiniz.
• Bu uyariya uyulmamasi, elektrik, mekanik veya diğer tehlikelerden dolayi
teknisyen, operatör veya hastanin yaralanmasina yol açabilir.
ПРЕДУПРЕЖДЕН • Това упътване за работа е налично само на английски език.

• Ако доставчикът на услугата на клиента изиска друг език, задължение на
ИЕ клиента е да осигури превод.
(BG) • Не използвайте оборудването, преди да сте се консултирали и разбрали
упътването за работа.
• Неспазването на това предупреждение може да доведе до нараняване на
доставчика на услугата, оператора или пациент в резултат на токов удар
или механична или друга опасност.
警告 • 本服務手冊僅提供英文版本。
(ZH-HK) • 倘若客戶的服務供應商需要英文以外之服務手冊，客戶有責任提供翻譯服務。
• 除非已參閱本服務手冊及明白其內容，否則切勿嘗試維修設備。
• 不遵從本警告或會令服務供應商、網絡供應商或病人受到觸電、機械性或其他
的危險。
警告 • 本維修手冊僅有英文版。
(ZH-TW) • 若客戶的維修廠商需要英文版以外的語言，應由客戶自行提供翻譯服務。
• 請勿試圖維修本設備，除非您已查閱並瞭解本維修手冊。
• 若未留意本警告，可能導致維修廠商、操作員或病患因觸電、機械或其他危險
而受傷。
UPOZORENJE • Ovaj servisni priručnik dostupan je na engleskom jeziku.

(HR) • Ako davatelj usluge klijenta treba neki drugi jezik, klijent je dužan osigurati
prijevod.
• Ne pokušavajte servisirati opremu ako niste u potpunosti pročitali i razumjeli
ovaj servisni priručnik.
• Zanemarite li ovo upozorenje, može doći do ozljede davatelja usluge,
operatera ili pacijenta uslijed strujnog udara, mehaničkih ili drugih rizika.
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OPOZORILO • Ta servisni priročnik je na voljo samo v angleškem jeziku.

(SL) • Če ponudnik storitve stranke potrebuje priročnik v drugem jeziku, mora
stranka zagotoviti prevod.
• Ne poskušajte servisirati opreme, če tega priročnika niste v celoti prebrali in
razumeli.
• Če tega opozorila ne upoštevate, se lahko zaradi električnega udara,
mehanskih ali drugih nevarnosti poškoduje ponudnik storitev, operater ali bolnik.
DAMAGE IN TRANSPORTATION
All packages should be closely examined at time of delivery. If damage is apparent write “Damage In Shipment” on ALL
copies of the freight or express bill BEFORE delivery is accepted or “signed for” by a GE representative or hospital receiving
agent. Whether noted or concealed, damage MUST be reported to the carrier immediately upon discovery, or in any event,
within 14 days after receipt, and the contents and containers held for inspection by the carrier. A transportation company
will not pay a claim for damage if an inspection is not requested within this 14 day period.
To file a report:
Fill out a report on http://egems.med.ge.com/edq/home.jsp
Contact the local service coordinator.
CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

All electrical Installations that are preliminary to positioning of the equipment at the site prepared for the equipment shall be
performed by licensed electrical contractors. In addition, electrical feeds into the Power Distribution Unit shall be performed
by licensed electrical contractors. Other connections between pieces of electrical equipment, calibrations and testing shall
be performed by qualified GE Medical personnel. The products involved (and the accompanying electrical installations) are
highly sophisticated, and special engineering competence is required. In performing all electrical work on these products,
GE will use its own specially trained field engineers. All of GE’s electrical work on these products will comply with the
requirements of the applicable electrical codes.
The purchaser of GE equipment shall only utilize qualified personnel (i.e., GE’s field engineers, personnel of third-party
service companies with equivalent training, or licensed electricians) to perform electrical servicing on the equipment.
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REV 9 5116384
IMPORTANT! . . . X-RAY PROTECTION

X-ray equipment if not properly used may cause injury. Accordingly, the instructions herein contained should be thoroughly
read and understood by everyone who will use the equipment before you attempt to place this equipment in operation. The
General Electric Company, Medical Systems Group, will be glad to assist and cooperate in placing this equipment in use.
Although this apparatus incorporates a high degree of protection against x-radiation other than the useful beam, no practical
design of equipment can provide complete protection. Nor can any practical design compel the operator to take adequate
precautions to prevent the possibility of any persons carelessly exposing themselves or others to radiation.
It is important that anyone having anything to do with x-radiation be properly trained and fully acquainted with the
recommendations of the National Council on Radiation Protection and Measurements as published in NCRP Reports
available from NCRP Publications, 7910 Woodmont Avenue, Room 1016, Bethesda, Maryland 20814, and of the
International Commission on Radiation Protection, and take adequate steps to protect against injury.
The equipment is sold with the understanding that the General Electric Company, Medical Systems Group, its agents, and
representatives have no responsibility for injury or damage which may result from improper use of the equipment.
Various protective materials and devices are available. It is urged that such materials or devices be used.
LITHIUM BATTERY CAUTIONARY STATEMENTS
CAUTION
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by the manufacturer. Discard used batteries according to the manufacturer’s
instructions.
OMISSIONS & ERRORS

Customers, please contact your GE Sales or Service representatives.
GE personnel, please use the GEMS CQA Process to report all omissions, errors, and defects in this publication.
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REV 11 5116384
LIST OF EFFECTIVE PAGES
Tab - Section Page REV 3 (Table/Gantry) i 1
Title page 11 General Description 1-1 to 1-3 1

-
Title page rear blank Sub-Assembly Description 2-1 to 2-16 1
(Warning and other 4 (DAS/Detector) i 3
a toh 9
important information)
General Description 1-1 1
(Revision Information) A to B 11
Detector 2-1 to 2-6 3
1 (System) i 1 Data Acquisition System (MDAS) 3-1 to 3-12 10
General Description 1-1 to 1-8 4 Data Acquisition System (GDAS) 4-1 to 4-12 10
Power Distribution 2-1 to 2-10 1
5 (X-ray Generator) i 1
Scan Operation 3-1 to 3-9 1
General Description - I 1-1 to 1-2 1
2 (Operator Console) i 9 General Description - II 2-1 to 2-5 6
General Description 1-1 to 1-7 9 Typical Signals 3-1 1
Host Processor 2-1 to 2-7 9
Appendix
Connector Boards 3-1 to 3-6 1 Symbols and Classification A-1 to A-4 2
Other OC Components 4-1 1 - Blank/Rear cover -
A
REV 11 5116384
REVISION HISTORY
REV Date Primary Reason for Change
11 06/12/12 Appendix Updated storage humidity to 10~90%.
10 06/02/11 System -
OC -
Table/Gantry -
Update the number of converter board (A, B) for MDAS. (Sec. 3)

DAS/Detector
Update the number of converter board (A, B) for GDAS. (Sec. 4)
X-ray Generator -
9 11/03/10 Warning Added four Languagewarnings for HongKong, Taiwan, Croatian and Slovenian.
OC Added Advantech PC contents. (Sec. 1, Sec. 2)
8 12/29/08 Added new languages for PT-BR (Portuguese-Brazil) and SR (Serbian).

Warning
Renamed PT to PT-PT (Portuguese-Portugal).
Updated Figure for DAS Signal Connection (Flex Cables & Connectors) according to
DAS/Detector
PQR13206154. (Sec. 3 & Sec. 4)
7 10/24/07 OC Added HP8400 information. (Sec. 1 & Sec. 2)
6 04/16/07 OC Updated OC Block Diagram. (Sec. 1)
X-ray Generator Updated illustration of Jedi Generator / Packaging Architecture. (Sec. 2)
5 09/11/06 Updated VSPL Board as an option in 5114678-3 & 5114679-2 in Illustration 1-1 Operator Console
OC
Block Diagram (Sec. 1)
4 05/14/06 System Updated Illustration 1-2 System Block Diagram for GDAS (Sec. 1)
3 03/04/06 System Updated Illustration 1-1 System Block Diagram (Sec. 1)
Added: Illustration of Detector Channel Distribution for GDAS (Sec. 2)

DAS/Detector
Added: A sec for GDAS (Sec. 4)
2 07/25/05 OC Add HPxw8200 Host CPU contents in OC section 2.
1 10/15/04 Initial Release.
B
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SYSTEM
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 SYSTEM OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-3 SYSTEM SPECIFICATIONS AND DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
1-4 SYSTEM OPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
SECTION 2 - POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 POWER DISTRIBUTION UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-1-1 Power On/Off Timing Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2-2 SAFETY LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 WARM-UP SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 AXIAL SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-2 Scan Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3-2-3 Asymmetric Scan. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3-2-4 Twin Cine Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3-2-5 Auto mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3-3 SCOUT SCANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
1 SYSTEM
2 SYSTEM
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SECTION 1 - GENERAL DESCRIPTION
1-1 INTRODUCTION
The features of this CT (Computed Tomography) system, one of the CT scanners of this series, include the
following:
Workstation type information processing system,
Solid-state x-ray intensity detector,
Continuous rotation type gantry with slip rings and high frequency coupling.
This CT system is comprised of the following main components (called subsystems):
• Operator Console (called OC)
• Scanning Gantry (called gantry)
This subsystem further includes the following subsystems:
- DAS/Detector
- X-ray Generator (called XG)
• Patient Table (called table)
• Power Distribution Unit (called PDU)
The system may include some of the following customer option equipments:
• Advantage Windows Image Workstation
• Image Camera
1-2 SYSTEM OVERVIEW

Illustration 1-1 and Illustration 1-2 shows the system block diagram.
The operator console (OC) controls the entire system, according to the operator’s operations. The OC sends
instructions to the processor of the TGP board, which then controls the gantry and table subsystems according to
the instructions.
The TGP board processor also passes the OC instructions to the processor of the OGP board which is equipped on
the gantry rotative frame. The OGP board controls the DAS subsystem, the collimator aperture, or positioning lights
according to the passed instructions.
The OGP board processor also passes the instructions from the TGP board to the processor of the x-ray generator
subsystem. The XG processor controls the x-ray generator according to the instructions (originally from the OC).
Reversely, the OC receives status information from the TGP board or other processors (via the TGP board).
1-1 SYSTEM
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Illustration 1-1 System Block Diagram (for system with MDAS)
Tube
High Voltage PDU
JEDI
SR
AC115
Auxiliary Unit Power Unit
XG Power
AC308-480
Temperature Gantry
Control
Rotational
Twin Detector
TG/OC Axial Drive

Twin DAS AC115 AC200
HSDCD HSDCD
DCP2
Transmitter Receiver
Step Motor Z axial Photo Sensor Slip Ring Servo Servo Motor
Cover Tilt Pot. Amp.
Boards Azimuth Encode
Twin Collimator
TGP SUB Cover Switch

Board Board Pump/Value
Step Motor Aperture Encoder for Gantry tilt
Gantry
OGP
Board Stationary
Step Motor DASIFN

Power Step Motor
Driver Cradle
Supply Monitor DBPCI 0
Encoder DBPCI 1
Host Processor
Speaker Table Key B'd SCSI1
Table Touch Sensors
Connector
Board
Foot SW Board
Latch Switch SCSI0-00 SCSI0-01
Pump/Value for
System Raw Data
Table Elevation Rear CN HDD
Pot. For HDD
Horizontal DASM
DVD
Table OC 5" MOD (Option)
1-2 SYSTEM
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Illustration 1-2 System Block Diagram (for system with GDAS)
Tube
High Voltage PDU
JEDI
SR
AC115
Auxiliary Unit Power Unit
XG Power
AC308-480
Temperature Gantry
Control
Rotational
Twin Detector
TG/OC Axial Drive
AC115 AC200
Twin DAS DCP2 HSDCD HSDCD

Transmitter Receiver
Slip Ring
Step Motor Z axial Photo Sensor Servo Servo Motor

Cover Tilt Pot. Amp.
Boards Azimuth Encode
Twin Collimator
TGP SUB Cover Switch

Board Board Pump/Value
Step Motor Aperture Encoder for Gantry tilt
Gantry
OGP
Board Stationary
Step Motor DASIFN

Power Step Motor
Driver Cradle
Supply Monitor DBPCI 0
Encoder DBPCI 1
Host Processor
Speaker Table Key B'd SCSI1
Table Touch Sensors
Connector
Board
Foot SW Board
Latch Switch SCSI0-00 SCSI0-01
Pump/Value for
System Raw Data
Table Elevation Rear CN HDD
Pot. For HDD
Horizontal DASM
DVD
Table OC 5" MOD (Option)
1-3 SYSTEM
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1-3 SYSTEM SPECIFICATIONS AND DATA

The following tables describe system specifications and data.
Table 1-1 Scan Time
Scan Time [sec]

-
0.7 (Half scan)
1.0
1.5
2.0
3.0
5.0
Table 1-2 Scan/Recon/Cal FOV
Scan/Recon FOV Cal FOV

P-Head (18) Small (25)
Head (25) Small (25)
Body (43) Large (43)
Table 1-3 Image Spatial Resolution Related
No. of Actual Scan Views No. of Detector

Recon Matrix
Full Scan Half Scan Active Channels
512 X 512
972 635 685 X 2
256 X 256
1-4 SYSTEM
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1-3 SYSTEM SPECIFICATIONS AND DATA (CONTINUED)
Table 1-4 KV-MA Stations
KV MA
10, 20, 30, 40, ..., 180, 190, 200
120
(in 5 mA increments)
10, 20, 30, 40, ..., 140, 150, 160
140
(in 5 mA increments)
Table 1-5 Slice Thickness
Slice Thickness [mm]

1i mode (1 image/rota- 2i mode (2 images/rota-
tion) tion), or helical mode
1.2*, 2, 4, 6, 10 0.6*, 1, 2, 3, 5, 7, 10
Note *: available with 1.2mm or 0.6mm Option.
Table 1-6 Other Specifications
Exposure Start Angle (Axial

Scan)
0/90/180/270 deg.
1-5 SYSTEM
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1-4 SYSTEM OPTIONS
Table 1-7 Main System Options
Category Name Description

• 90 sec Helical
Helical scan -
• 120 sec Helical
Scan/Recon
• 0.6 mm Slice thickness
Collimator -
• Asymmetric scan
Magnetic optical
• 5 inch MOD 5” MOD
disk drive (MOD)
Storage Device
• LCD monitor
Monitor -
• 22 inch CRT monitor
• DASM VDB (Analog interface)
Filming Laser camera -
• DASM LCAM (Digital interface)
Network Ethernet • Advantage Windows -
• 3D Imaging
• Denta Scan
Software • SmartRecon -
• SmartPrep
• Navigator
Others • Remote Tilt -
1-6 SYSTEM
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SECTION 2 - POWER DISTRIBUTION
Note
PDU stands for Power Distribution Unit. The part No. of it is 2298849 (400V) or 2298852 (200V).
2-1 POWER DISTRIBUTION UNIT

The power distribution unit (PDU) provides powers to all the subsystems.
Two types of PDUs are available: 400VPDU and 200VPDU. Either one of two types is used according to the mains
voltage (main power from the power distribution box of sites). (200VPDUs are used in Japan only.)
See Illustration 2-1 (400VPDU) or 2-2 (200VPDU). These illustrations describe the following:
• All the powers except ‘XG Power’ are output from the system transformer on the PDU.
(200VPDUs generate ‘XG Power’ by a step-up transformer.)
• ‘XG Power’ powers the x-ray generator (XG) equipped on the gantry rotational block. Powers for x-ray
tube high voltage, x-ray tube anode rotation, XG control circuit boards, etc. are derived from this power.
However, the fan and pump for the x-ray tube are powered by ‘SR115/120.’
• ‘SR115/120’ powers all the components equipped on the gantry rotational block except the x-ray
generator.
• ‘TG115’ powers all the components equipped on the gantry stationary block except the axial motor. The
gantry tilt pump also is operated by this power. ‘TG115’ also powers the table subsystem.
• ‘TG200’ powers the axial motor which rotates the gantry rotational block.
• ‘OC115’ supplies power to the operator console.
2-1 SYSTEM
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2-1 POWER DISTRIBUTION UNIT (CONTINUED)
Illustration 2-1 Power Distribution to Subsystems (400VPDU)
Mains Slip Rings

XG Power (AC 380 ~ 480 V)
X-ray
AC 380 V Generator
SR115 (AC 115 V/120 V)
∼480V Sys BRK1 Rotational Block
tem
Trans TG115 (AC 115 V) (Stationary
former SW1
Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
400VPDU
BRK2
Axial
Motor
Gantry
Table
To Internal
CB1 Noise and External
Filter components
To DC Power
Suppliers
Operator Console (Big OC)
2-2 SYSTEM
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2-1 POWER DISTRIBUTION UNIT(CONTINUED)
Illustration 2-2 Power Distribution to Subsystems (200VPDU)
Main s Step-up Slip Rings

Trans XG Power (AC 400V)
fo rmer X-ray
AC 200 V Generat or
SR115 (AC 115V/120V)
Sys BRK1 Rotational Bloc k
tem
Trans TG115 (AC 115 V) (Stationary
fo rmer SW1
Block)
TG200 (AC 200 V)
OC115 (AC 115 V)
200VPDU BRK2
Axial
Motor
Gantry
Table
CB1 Noise To internal

Filter com ponent s
Monitor
CB2 External
com ponent s
Operator Console (Small OC)
2-3 SYSTEM
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Illustration 2-3 (400VPDU) or 2-4 (200VPDU) shows the simplified circuit diagram of the PDU.
As shown;
• (400VPDU):
The voltage of mains power should be within a range of 380 V ∼ 480 V. The system transformer provides
terminals for 380 V, 400 V, ... , 480 V to connect power to the nearest voltage terminal.
• (200VPDU):
The system transformer provides a terminal for 200 V to connect the mains power.
• The ‘SR115/120’ output is not controlled by any relay contacts; the power is always present in the CT
system unless circuit breakers CB2 or CB5 are turned off.
• The relay K1 is turned on some delay time later after K11 is turned on.
The resisters connected to the relay K11 suppress rush currents.
• Circuit breakers CB1, CB2, ... , CB6 can turn OFF powers, as written below:
- CB1: XG Power
- CB2: TG200, TG115, SR115/120, OC115
- CB3: TG200
- CB4: TG115
- CB5: SR115
- CB6: OC115
- CB7: PS
2-4 SYSTEM
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Illustration 2-3 Inside of PDU (400VPDU)
Mains (3 Phase,
380 ~ 480 V) K1 XG Power
CB1 K11 F1
System
CB2 Transformer
480
CB3 K2 TG200
200
460
440 120
CB5 SR115/120
415 115
400
380 CB4 K2 TG115
0
0
CB6 K3 OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
K19 K1
From
OC E-OFF-O RMT CNT K7 K3
Board
RST-EM K6 K2
SAFE-O
K5 K11
SAFE-G
From (The above means: for example,
RST-EMG When K6 is turned on, then K2
Gantry
E-OFF-G is turned on.)
2-5 SYSTEM
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Illustration 2-4 Inside of PDU (200VPDU)
Mains (3 Phase,
200 V) K1 XG Power
Step-up
Transformer
CB1 K11 F1
System
CB2 Transformer
200
CB3 K2 TG200
200
120 CB5 SR115/120

115
CB4 K2 TG115
0
0
CB6 K3 OC115
CB1 ~ CB6: Circuit Breakers
P-ON
FAN AL
K19 K1
From
OC E-OFF-O RMT CNT K7 K3
Board
RST-EM K6 K2
SAFE-O
K5 K11
SAFE-G
From (The above means: for example,
RST-EMG When K6 is turned on, then K2
Gantry
E-OFF-G is turned on.)
2-6 SYSTEM
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2-1-1 Power On/Off Timing Chart

The power on/off controls of ‘XG Power’, ‘TG200’, ‘TG115’, etc. shown in Illustration 2-1 or 2-3 (or, 2-2 or 2-4, for
200VPDU) are shown in Illustration 2-5.
In the illustration;
‘E-OFF’ turns ‘close’ or ‘open’ when either ‘E-OFF-O’ or ‘E-OFF-G’ turns ‘close’ or ‘open.’
That ‘Safety Loop’ turns ‘close’ or ‘open’ means the system safety loop is closed or opened, including both ‘SAFE-
O’ and ‘SAFE-G’ turns ‘close’ or ‘open.’ (See the ‘Safety Loop’ (2-2) description)
‘Reset Emergency’ turns ‘close’ or ‘open’ when either ‘RST-EM’ or ‘RST-EMG’ turns ‘close’ or ‘open.’
2-7 SYSTEM
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Illustration 2-5 Power On/Off Timing Chart
INPUT Control
PON SW
E-OFF
Safety-Loop
RESET Emer
FAN ALA
OUTPUT Control
OC115(K3)
XG400(K1)
Resistor(k11)
Pins 1 and 2 of JP1 are shorted on the RMT board

Timer1(Smart Gantry) Pins 1 and 2 of JP2 are shorted on the RMT board
TG115(K2)
TG200(K2)
Timing2(general)
TG115(K2)
TG200(K2)
Note
‘Safety Loop’ is always closed in normal conditions after the system is switched ON or reset; this
means that ‘XG Power’ is always supplied to the gantry in normal conditions.
2-8 SYSTEM
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2-2 SAFETY LOOP

Illustration 2-6 shows a diagram of the system safety loop.
As shown, components on the gantry rotational block are not involved in the safety loop.
Illustration 2-6 Safety Loop
TGP
Switch on the Board
Gantry Rear Base
SAFE-G
Gantry
RMT CNT PDU

Board Operator Console
Host
Processor
REAR CN1
Board PCI Bus
SAFE-O DBPCI
Board
K5
Relays K1 XG Power
2-9 SYSTEM
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2-2 SAFETY LOOP (CONTINUED)
Open of Safety Loop

The safety loop can be opened by any of the following:
• Switch equipped on the gantry rear base.
• Control by the TGP board:
The TGP board opens the safety loop in any of the following cases:
- When the TGP board receives from the OGP board a safety loop open demand due to an
overtime of x-ray exposure.
- When the TGP board detects abnormal communication with the OGP board or the operator
console (host processor) during x-ray exposure.
• Control by the host processor (i.e., system software):
The host processor opens the safety loop in any of the following cases:
- When the host processor receives a safety loop open demand from the TGP board.
- When the host processor detects an overtime of x-ray exposure.
- When the host processor detects an extra scan (other than scans which the host processor
instructed the TGP board to perform) performed.
• Control by the DBPCI board:
While an x-ray exposure is performed, the board opens the safety loop to terminate the exposure if the
board detects that the host processor does not normally respond to interrupts issued by the board.
• Signals such are ‘E-OFF’, ‘FAN AL’, etc.
2-10 SYSTEM
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SECTION 3 - SCAN OPERATION
3-1 WARM-UP SCANS

The system requires the ‘Warm–up’ scans to warm–up the x–ray tube prior to starting the first scan after power–on,
or when more than two hours have elapsed since the last scan.
The warm–up scans also have to be performed before performing phantom calibration which updates the calibration
files (CAL files), if more than three hours have elapsed since the last scan.
The operator selects either the Tube Warm–up or Daily Calibration warm–up scans, as listed in Table 3-1.
Table 3-1 Warm-up Scans
Type Purpose No. of Scans

Tube Warm-up for x-ray tube warming (Until the tube case temperature reaches 10%.)
for x-ray tube warming (Until the tube case temperature reaches 30%.)
13 (Max.)
- Including 8 scans (calibration) + 5 scans (X–ray alignment)
for calibration and x-ray - Calibration scans contain 10mm, 7mm, 5mm, 3mm, 2mm,
alignment 1mm, 0.6mm, and Asymmetric scans. (0.6mm and Asymmetric
are optional.)
Daily Calibration - Using 7 mm scan data, warm–up error is analyzed.
6
for system diagnostics - 1 scan for Offset Mean and SD
(IQ Performance Mea- - 3 scans for Ratio
surement Scan) - 1 scan for A/B ratio
- 1 scan for Z–axis collimatorstep operation
The ‘Tube Warm–up’ type scans or the first series of scans of ‘Daily Calibration’ warm–up the x–ray tube.
This means that Tube Warm–up only warms the x–ray tube.
During the scans for calibration (eight scans) the system collects data to analyze it, and update CAL files:
The system stores the data and checks whether the data falls within the specified range. If the data is out of range,
the system reports a ‘WARM–UP ERROR.’ If the data is within range, the system compares the data with the pre-
vious warm–up data and calculates correction factors for CAL files, and updates them.
During the scans for x–ray alignment (three scans), the system collects data to analyze the x–ray alignment.
IIllustration 3-1 shows the warm-up scan sequence.
3-1 SYSTEM
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3-1 WARM-UP SCANS (CONTINUED)
Illustration 3-1 Warm-up Sequence
Start
Tube warm-up
scans
Error Message
Error & Yes

Error code Any error?
No Raw Data Disk
Scans &
Data collection
Raw data
files
Data check
Error Message
Warm-up No Within
Error range?
CAL
Yes files
Calculates
correction
factors System Disk
CAL files
correction
End
3-2 SYSTEM
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3-1 WARM-UP SCANS (CONTINUED)
IQ Performance Measurement Scan

During the IQ Performance Measurement scans the system collects data to analyze it, and displays the result in
the ‘Status’ column.
Analyzed data: Offset mean, Offset SD, Stability of air calibration, mA–dependent DAS linearity variation, Scan
time–dependent DAS linearity variation, A/B ratio.
For details, refer to the ‘Home’ descriptions, in Section ‘Service Tool’, System tab, of the Diagnostics manual.
Warm–up Error Analysis

The analysis for detecting warm–up error is performed using 7 mm scan data:
Analysis Items Descriptions Specifications

Ref Count Reference count after offset file correction 3000 ~ 60000
SD/MEAN SD/Mean value after offset file and reference corrections 0 ~ 0.03
Mean after offset file and reference correction / Mean at last
Ratio 0.95 ~ 1.05
daily calibration
HPF (Ratio) HPF of Ratio – 0.01 ~ 0.01
Ratio between [Channel data at the 1/4 intervals from 1st
Aperture Check 0.5 ~ 1.5
view] and [Mean value of all views]
When you analyze a warm–up calibration file, convert the related vector file into the Mean file, then use the Generic
System Analyzer of the Service tool.
3-3 SYSTEM
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3-2 AXIAL SCANS
3-2-1 General
Prior to the actual x-ray exposure, the system collects 256 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system performs a full 360 deg. scan (clockwise direction only) during 1.0, 1.5, 2.0, 3.0 or 5.0 sec. These are
called scan speeds or scan times, and not all of the them are available to all the systems; the available scan speeds
or times vary according to system models or options installed on the systems.
During a scan, the system collects 972 views of data. A view period differs according to the scan speed. The
following table shows this relation:
Scan Speed (sec) View Period (µsec/view)

1.0 1029
1.5 1543
2.0 2058
3.0 3086
5.0 5144
The view period is synchronized with the azimuth encoder pulse.

Axial scans are initiated from either 0 deg. or 180 deg. azimuth angle except for helical scans; during helical scans,
scans can be initiated from any azimuth angle.
The system knows gantry azimuth position by azimuth encoder pulse counts and the Gantry Pulse which indicates
that the gantry azimuth is at this moment at 0 deg., (i.e., home position).
3-2-2 Scan Sequence

Illustration 3-2 shows the axial scan sequence.
3-4 SYSTEM
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3-2 AXIAL SCANS (CONTINUED)
Illustration 3-2 Axial Scan Sequence
Parameters (Yes)
change?
Scan parameters setting (KV, MA, Slice Thickness, Scan Time, Slice Interval)
(No)
Cradle positioning (Patient is moved into the gantry scan plane)
Rotor start (The rotor is accelerated to operation speed)
Gantry acceleration (Gantry is accelerated to the constant scan speed)
Offset data collection (256 views of offset DAS data are collected )
High Voltage ON (Start x-ray exposure)
Das enable (DAS is enabled to collect data)
Data collection (972 views of actual DAS data are collected;

view period is synchronized with gantry azimuth position)
High Voltage OFF
Gantry deceleration
(Yes)
Next scan?
(No)
End
3-5 SYSTEM
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3-2-3 Asymmetric Scan
Asymmetric Mode
In scanning, you can choose either symmetric or asymmetric slices from the twin-detector.
There are three choices in the Asymmetric Mode.
• [OFF] mode: (Symmetric is OFF) acquires slices with the same thickness (symmetric).
• [10:1] mode: acquires slices with different thickness (asymmetric).
- [10:1]: provides 10mm and 1mm slices.
- [10:2]: provides 10 mm and 2 mm slices.
- [6:1]: provides 6 mm and 1 mm slices.
Illustration 3-3 shows how asymmetric slices are obtained.
In Asymmetric Mode, the slice, whose thickness is shown at the Axial Thickness field, asymmetrically straddles the
center of the twin-detector. This slices is called “fused”, whereas the other thinner slices is derived from one detec-
tor.
3-6 SYSTEM
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Illustration 3-3 Asymmetric Slice
Asymmetric slices of [10:1]

Collimator
Radiation area
Center between
detectors A and B
1mm slice
9mm
Detector A Detector B
10mm slice

Collimator
Radiation area
Center between
detectors A and B
2mm slice
8mm
10mm slice

Collimator
Radiation area
Center between
detectors A and B
1mm slice
5mm
6mm slice
3-7 SYSTEM
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3-2-4 Twin Cine Scan

In Cine Scan, continuous multiple 360-degree data acquisition is achieved without table travel or at the same loca-
tion.
In Twin Cine Scan, images are displayed in the 1i mode during prospective recon; on the other hand, in retrospective
recon, images from Detector A and images from Detector B can be displayed alternately (2i mode).
The 1i mode display is also possible in retrospective recon.
3-2-5 Auto mA
The Auto mA feature enables the system to reduce mA and patient dose with negligible effect on image quality. The
system varies mA according to patient shape and a predetermined algorithm for scan location.
The Auto mA feature requires one Scout scan, either AP or LAT in the illustration below, to obtain necessary infor-
mation on X-ray attenuation. (The last scout scan data is used for the Auto mA scan.)
The system automatically increases mA at the scan locations where X-ray attenuation is relatively high and decreas-
es mA at the scan locations where X-ray attenuation is relatively low. In the example below, the mA is set low at the
start scan location (lung area), then the mA will increase at the location of liver area, and then it will decline at the
location of abdomen area.
Illustration 3-4 Auto mA
0–degree Scout (AP)
Tube
Patient 90–degree Scout (LAT)

Tube
Start End
mA
0 Scan location
Start End
3-8 SYSTEM
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3-3 SCOUT SCANS

Prior to the actual x-ray exposure, the system collects 64 views of offset data generated from the DAS. The offset
data is used to correct actual x-ray data.
The system advances the cradle and collects data from 685 active channels. The cradle speed is 75 mm/sec, and
data collection timing is synchronized with the cradle encoder pulse.
Illustration 3-5 shows the scout scan sequence.
Illustration 3-5 Scout Scan Sequence

Scan parameters setting (KV, MA, Scan Range)
Cradle positioning (Cradle is moved to the Start + 20 mm position)
Rotor start (The rotor is accelerated to operation speed)
Offset data collection (64 views of offset DAS data are collected )
Cradle acceleration (Cradle is accelerated to the constant scan speed)
High Voltage ON (Start x-ray exposure)
Das enable (DAS is enabled to collect data)
Data collection (Actual DAS data are collected;

view period is synchronized with cradle position)
High Voltage OFF
Cradle Stop Start

position
Cradle
move start Cradle stop
High DAS
Voltage enable
ON
Data collection
Cradle
acceleration
3-9 SYSTEM
3-10 SYSTEM
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OPERATOR CONSOLE
TABLE OF CONTENTS
SECTION PAGE

1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 MAIN COMPONENT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1-3 OPERATIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
SECTION 2 - HOST PROCESSOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
SECTION 3 - CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 CONNECTOR BOARDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 REAR CN1 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2-1 Filter Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2-2 Audio Mixer Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
SECTION 4 - OTHER OC COMPONENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4-1 KEYBOARD, MOUSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4-2 DISPLAY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4-3 NAA1 (NP AUDIO AMPLIFIER) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
i OPERATOR CONSOLE
ii OPERATOR CONSOLE
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1-1 OVERVIEW
The information processing system (operator console) is based on the Intel 32 bit architecture.
The host processor of the operator IA console is a Linux computer, which is on the market.
(You connect it to a monitor, keyboard, and mouse to configure a working system.)
Illustration 1-1 shows a block diagram of the operator console of this CT system.
IA Host System Software

‘IA Host System Software’ is the standard Linux operating system software for the IA Host that come on the system
disk and on the DVD that you use in the event of a system crash.
PCI Bus
‘PCI’ stands for Peripheral Component Interconnect - a bus specification. The PCI bus is a high-performance local
bus used to connect peripherals to memory and a microprocessor. A wide range of vendors make devices that plug
into the PCI bus.
The PCI bus can be operated at its intended high-performance by using DMA transfers.
To perform DMA transfers with the PCI bus, a DMA controller should be equipped on the connected peripheral.
Address Map
For a PCI bus based computer system, memory address mapping and I/O address mapping of PCI devices are
determined during Configuration Cycle which the host processor generates when the system is powered on. Each
of the PCI devices requests its required address space size from the host processor during the cycle.
The PCI devices also (such are DBPCI, others) within this operator console are relocatable in the PCI address
space. This means that address mappings of the PCI devices are not fixed. The physical addresses assigned by
the host processor can be known by reading a set value on a base address register within configuration registers of
each PCI device. (With a VME bus, base addresses are determined by dip switches.)
1-1 OPERATOR CONSOLE

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Illustration 1-1 Operator Console Block Diagram (HP8000)
HIS/RIS
10/100/1000 Mbps SCSI1

Analog
RGB
Video Card
DBPCI 0#
Monitor
DBPCI 1#
PS/2
Moxa Multi-port RS-232C
Mouse Serial Card
PS/2 Laser Camera
Host Processor 5" MOD DVD Interface (DASM)
PDU (Option)
SCSI0-00 SCSI0-01
SCSI Tower
System Raw Data

Scan Panel Disk Disk
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP
Gantry Mic NAA1 OC Speaker
Table Speaker Includes Rear CN1 Board, Rear CN2

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber

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Illustration 1-2 Operator Console Block Diagram (HP8200)
HIS/RIS
10/100/1000 Mbps SCSI1

Analog
RGB
Video Card
DBPCI 0#
Monitor
DBPCI 1#
PS/2 Host Processor
Mouse Serial Card
Laser Camera
Serial Port 5" MOD DVD Interface (DASM)
PDU (Option)
SCSI0-00 SCSI0-01
SCSI Tower
System Raw Data

PS/2
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber

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Illustration 1-3 Operator Console Block Diagram (HP8400 / Advantech)
HIS/RIS
10/100/1000 Mbps SCSI1

Analog
RGB
Video Card
DBPCI2 0#
Monitor
DBPCI2 1#
PS/2 Host Processor
Mouse Serial Card
Laser Camera
Serial Port 5" MOD DVD Interface (DASM)
PDU (Option)
SATA-00 SATA-01
SCSI Tower
System Raw Data

PS/2
103 Keyboard
Keyboard
Service Key
Modem
Scan Room
TGP

Board
DAS
DASIFN 2
Heart Gate
Trigger
Optical
Fiber

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1-2 MAIN COMPONENT DESCRIPTION
Host Processor
The host computer performs all of the following operations:
User interface
Image processings/display
Communication
Database control
Raw data/image data flow control
Image storage
Scan/recon control
Recon operation
System Disk
HP8000/HP8200
SCSI, within the Host Processor
The Host Processor includes two ports. SCSI0-00 is connected to a hard disk drive which is used as the system
disk.
HP8400 / Advantech
SATA, within the Host Processor
The Host Processor includes two ports. SATA-00 is connected to a hard disk drive which is used as the system disk.
This system disk mainly stores the followings:

System and application software
Images
Calibration files
System parameters
• HP8000/HP8200 Capacity: 73 GB
Image Storage: >100000 images
• HP8400 Capacity: 146 GB
• Advantech Capacity: 500 GB

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1-2 MAIN COMPONENT DESCRIPTION (CONTINUED)
DVD Drive (IDE; Outside the Host Processor by using SCSI Tower)
DVD drive is connected to the SCSI card through an SCSI to IDE Adapter.
Raw Data Disk (SCSI/SATA; within the Host Processor)

SCSI0-01/SATA-01 is connected to a hard disk drive which is a high-speed one for storing raw data.
• For HP Capacity: 146 GB
Raw Data Storage: >5000 Groups
• For Advantech Capacity: 500 GB
Raw Data Storage: >5000 Groups
DBPCI (DAS Buffer for PCI Bus) (two pieces for Dual slice, one piece for one slice)
This is a circuit board, serving as a ring buffer whose capacity is 4 MB. This buffer temporarily stores DAS data.
This board also includes control registers for the OC keyboard, safety loop, others.
DASIFN2 (DAS Interface for NP)

This is a circuit board which converts raw data sent from the gantry in optical serial signals into electric parallel
signals. During conversion, this board performs transfer error corrections.
This board also includes one channel for receiving Heart Gate Trigger inputs.
REAR CN1
This is a circuit board which mainly has two functions: Signal filtering and Audio control.
This board is connected to OC external components such are keyboard, TGP board on the gantry, or Power
Distribution Unit (PDU), and is also connected to OC internal components such are DBPCI board, NAA1 board, or
others.
Archive Equipment (MOD)

5” MOD is an option, it is used for archiving images.
• Capacity: >2.3 GB
Images: DICOM format

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1-3 OPERATIONAL DESCRIPTION
Scan Data Main Flow

Illustration 1-4 shows:
Raw data acquired during scans is first buffered by DBPCI;

The raw data is then stored to a hard disk drive which is a high-speed type and exclusively used for raw data storage;
recon processing is performed to generate images.
The reconstructed images are then read by the host processor which converts the image data to video signal, as
well as stores the image data to the system disk, which also stores system software.
As shown, raw data and image data are mainly transferred over the PCI bus.
Illustration 1-4 Scan Data Main Flow
Monitor
Video Signal
Video Card
System/Image Host
Disk Processor
Image Data
PCI Bus
SCSI/SATA Bus
Raw Data
Raw Data DBPCI # 0/1

Disk
Raw Data from DAS


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SECTION 2 - HOST PROCESSOR
2-1 OVERVIEW
The host processor is a Linux computer.
The host processor is the central unit within the operator console, performing various operations such are described
below:
• Controls data transfer between data storage units and memory devices, etc.
• Controls the entire scan sequence; it sends necessary instructions to relevant devices, and receives
status information from those devices.
• Recon operation.
• Performs graphics operations.
The host processor includes a DC power supply (>450 watts); it requires AC 115 V power input.

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2-1 OVERVIEW (CONTINUED)

Table 2-1 and 2-2 shows main specifications of the host processor.
Table 2-1 Host Processor Specifications (HPxw8000)
Component Specification
Central Processor Model Two Inter Xeon
Operating Frequency 2.66G
Cache Memory 512 KB L2 Advanced Transfer Cache
Other 533MHz System Bus
Hyper Threading Technology
Main Memory Capacity (standard) 2 GB (512 MB X 4)
Type DDR 266, with ECC
Hard Disk Drive Capacity 73GB (10K rpm) SCSI
(System Disk)
DVD Type Super format: DVD+R, DVD+RW, DVD-RAM, CD-R,
ATAPI/E-IDE
Graphics Card Resolution Integrated Geometry Engine
128-MB DDR memory; AGP 8X
Built-in Graphics N/A
Built-in I/O - PC (PS/2) compatible keyboard and mouse
(Input/Output) 1 x Serial 460 kbps (DB-9)
1284 Parallel (C miniature)
One 10/100/1000 Ethernet standard (RJ-45)
5 PCI slot
1AGP slot
Built-in Audio - Analog stereo input/output (YES)
Operating System - CTT Linux 1.8.12 or later

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Central Processor Model Two Intel R XeonTM processor
Operating Frequency 3.2GHz
Cache Memory 1MB
Main Memory Capacity (standard) 2 GB (512 MB X 4)
Type DDR-2 400MHz SDRAM, with ECC
Hard Disk Drive Capacity 73GB (10K rpm) SCSI
(System Disk)
RawData Disk Drive Capacity 146GB(10K rpm)SCSI
Graphics Card Resolution NVIDIA Quadro FX 1400 (PCI-E)

BIOS 5.41.02.17.24
Built-in I/O - Front: Headphone, microphone, and 2 USB 2.0, 1 IEEE 1394
(Input/Output) Rear: 6 USB, 1 standard serial port, 1 parallel port,
PS/2 keyboard and mouse, 1 RJ-45, 1 audio in, 1 audio out,
1 IEEE 1394
Central Processor Model Intel 510 Dual 2.0 GHz Dual core Xeon” woodcrest
Cache Memory 4MB Shared L2 Cache
Main Memory Capacity (standard) 2 GB (1GB X 2)
Type DDR-2 667MHz, with ECC
Hard Disk Drive Capacity 146GB (7200 rpm) SATA
(System Disk)
RawData Disk Drive Capacity 146GB (7200 rpm) SATA
Graphics Card Resolution NVIDIA Quadro FX 1500 (PCI-E)
Built-in I/O - Front: Headphone, microphone, and 2 USB 2.0, 1 IEEE 1394
(Input/Output) Rear: 6 USB, 1 standard serial port, 1 parallel port,
PS/2 keyboard and mouse, 1 RJ-45, 1 audio in, 1 audio out,
1 IEEE 1394

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Table 2-4 Host Processor Specifications (Advantech)
Central Processor Model Intel Xeon L5410 (with Intel 5100MCH chipset, support 2*Xe-
on)
Cache Memory 12M L2
Other FSB 1333MHz, Quad Core PCE-7214 SHB 1.3 industrial SBC
Main Memory Capacity (standard) 2 GB
Type DDR-2 800 ECC+R
Hard Disk Drive Capacity 500GB (7200 rpm) SATA
(System Disk)
RawData Disk Drive Capacity 500GB (7200 rpm) SATA
Graphics Card Resolution NVIDIA Quadro FX 1800 (PCI-E) Gfx Card
Built-in I/O - Front: 2 USBs 2.0
(Input/Output) Rear: 4 USBs 2.0, 1 standard serial port, PS/2 keyboard and
mouse, 2 RJ-45, 1 audio in, 1 audio out

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2-2 BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION

The host processor has input/output ports for the following:
Display Card (Graphics Card)

DVI signals are output from this port.
Keyboard/Mouse
A PS/2 keyboard and a mouse are connected these ports, respectively.
10/100/1000 Ethernet
A diagnostic console, an independent console, or an HIS/RIS is connected to this port.
DICOM compatible; the operator console can send (push) images to those devices using DICOM protocols at a 10
Mbits/sec maximum (the transfer speed varies according to receiver models, the size of transfer data, protocols,
etc.).
SCSI (for HP8000 / HP8200)

• SCSI 0
This port is connected to the System Disk (00) and Raw Data Disk (01).
• SCSI 1
This port is connected to external SCSI Tower.
SATA (for HP8400 / Advantech)

• SATA-00
This port is connected to harddisk.
• SATA-01
This port is connected to harddisk.

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2-2 BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION (CONTINUED)
Built-in Audio
Audio in and Audio out is connected to RCN1 board.
PCI Bus Slot (HPxw8000 only)

The host processor is equipped with 5 PCI slots.
PCI 0 (32bit/33M) DBPCI #1

PCI 1 (32bit/33M) DBPCI #0
PCI-x 2 (64bit/133M) empty
PCI-x 3 (64bit/100M) MOXA multi-port serial card
PCI-x 4 (64bit/100M) empty

The host processor is equipped with 7 PCI slots.
Slot1 PCI DBPCI#1

Slot2 PCI-Express X16 Graphic card
Slot3 PCI DBPCI# 0
Slot4 PCI-Express X4 empty
Slot5 PCI-X133 empty
Slot6 PCI-X100 MOXA multi-port serial card
Slot7 PCI-X100 empty

The host mainboard is equipped with 7 PCI slots.
Slot1 PCI Moxa Multi-Port Serial Card

Slot2 PCI-Express X16 Graphic card
Slot5 PCI-X133 SCSI Card
Slot6 PCI-X100 DBPCI 2
Slot7 PCI-X100 DBPCI 2

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2-2 BUILT-IN I/O (INPUT/OUTPUT) DESCRIPTION (CONTINUED)
PCI Bus Slot (Advantech only)

The host mainboard is equipped with 10 PCI slots.
Slot1 PCI empty

Slot2 PCI Moxa Multi-Port Serial Card
Slot3 PCI empty
Slot4 PCI empty
Slot5 PCI SCSI Card
Slot6 PCI empty
Slot7 PCI DBPCI 2
Slot8 PCI DBPCI 2
Slot9 PCI Audio Card
Slot10 PCI USB Port


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SECTION 3 - CONNECTOR BOARDS
3-1 CONNECTOR BOARDS

All the signal cables connected between the operator console (OC) and subsystems/components outside the OC
run through these connector boards.
The connector boards mainly include filters for each signal line to improve the EMC (Electro-Magnetic Compatibility)
performance of the OC. The REAR CN1 board also includes an audio mixer, relay for the safety loop, a video
amplifier for slave monitors, and others.
3-2 REAR CN1 BOARD

Illustration 3-1 (or Illustration 3-2) shows a block diagram of the REAR CN1 board.
The REAR CN1 board is connected to a slot of the connector box of the OC, and as shown in Illustration 3-1 (or
Illustration 3-2) , the board is connected to OC external components such are the keyboard, TGP board on the
gantry, or the Power Distribution Unit (PDU), and is connected to OC internal components such are DBPCI board,
NAA1 board, or others.
The board functionally consists of the following two blocks:
• Filter Block
• Audio Mixer Block
3-2-1 Filter Block

As shown in Illustration 1-1, this block includes the following interface circuits:
• Keyboard Interface:
Mainly interfaces between the keyboard (including the scan buttons) and the host processor.
• TGP Interface:
Mainly interfaces RS232/RS422 communications and Direct Lines between the TGP board located on
the gantry and the host processor or keyboard.
• PDU Interface:
Mainly interfaces Power On/Off, Emergency, Safety Loop, or other signals between the Power
Distribution Unit (PDU) and the keyboard or the FRONT PNL board of the OC.

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3-2 REAR CN1 BOARD (CONTINUED)
Illustration 3-1 REAR CN1 Block Diagram (Linux Computer)
REAR CN1
RS232
RS232 MOXA Multi-port serial card
Scan RS232
Panel PCI Bus
KB R eset
Emergenc y Stop/Rest Filter Block Host
Keyboard PS/2
Direc t Line Processor
PS/2
Fan Alarm Ther mal
Guard
from/to Patient,
Gantry Auto Voice, Foot Power On PCI Bus
SW, X-ray On Front
Shut down Panel
Direc t Line
TGP Reset KB R eset
TGP Bo ard
X-ray On Safety Loop
Shut dow n
RS422 DBPCI DBPCI
TGP Reset Board Board
NAA2 X-ray LED
from Patient X-ray On
to Patient Al ert On
CSA/WRA
Speak er on T abl e Talk On ACKA
Fan Alarm Addres s (4:0)
Data (7:0)
Emergency Stop/Rest
PDU Audi o Mix
Safety Loop er Bloc k
Line OUT
Power On
Line IN
External from Patient CD Line OUT
Speak er DVD Drive
(opt ion)
from Patient NAA1

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3-2-2 Audio Mixer Block

The audio mixer block of the REAR CN1 board Includes registers for audio function, and also includes an audio
amplifier for headphones or external speakers (which are not the OC speaker which is driven by the NAA1 board).
See Illustration 3-2.
As shown, audio signals from several sources are mixed in this block.
• Audio Input Sources:
- Microphone on the gantry (Intercom: From Patient)
- Microphone on the OC keyboard (Intercom: To Patient)
- Audio output on the host processor (Auto Voice play)
- Synthesized sounds on the REAR CN1 board (X-ray On, Alert)
These are generated using a programmable timer which is controlled by software.
• Audio Output Destinations:
- Speaker on the gantry
- Speaker on the OC
- Audio input on the host processor (for recording Auto Voice messages)

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Audio Input Switch

As shown in Illustration 3-2, analog switches are used to switch audio input sources, and are controlled by the ‘Talk
On’ button on the keyboard or a foot switch connected to the keyboard.
• An intercom function is provided between the OC room and the gantry room. The ‘Talk On’ button on
the keyboard switches communication direction, as described below:
- While ‘Talk On’ is pressed, communication of “OC room → gantry room” is enabled; and both of
Auto Voice (both in the OC room and the gantry room) and sound from the CD-ROM drive (both
in the OC room and the gantry room) are disabled.
- While ‘Talk On’ is released, communication of “gantry room → OC room” is enabled.
If a foot switch is provided, this also serves as the ‘Talk On’ button.
• The X-ray On sound and alert sounds in the OC room are always enabled, even when ‘Talk On’ is
pressed.
• Auto Voice messages can be recorded by using the microphone equipped on the keyboard while
pressing the ‘Talk On’ button.
While Auto Voice is being played, communication of “gantry room → OC room” can be disabled. This
prevents Auto Voice sound degradation on the OC side, because: Auto Voice is played both in the OC
room and the gantry room. If communication of “gantry room → OC room” is enabled, the Auto Voice
messages are doubled on the OC side, which degrades the sounds.
Volume Control
The following two kinds of volume control are provided.
• The following can be adjusted with the manual volumes on the keyboard:
- Volume of communication of “OC room → gantry room” (through the keyboard microphone)
- Recording level of Auto Voice messages (through the keyboard microphone)
- Auto Voice volume in the gantry room
- Volume of communication of “gantry room → OC room” (through the gantry microphone)
• The electronic volumes are controlled by software, controlling the following:
- Auto Voice volume in the OC room
- Sound volume from the CD-ROM drive both in the gantry room and the OC room
- Alert sounds in the OC room
- X-ray On sound in the OC room

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Illustration 3-2 Audio Mixer Block
Stereo Signal Analog Switch

from/to DBPCI Monaural Signal
X-ray On/Off OP. Amp.
Alert On X-ray
Sound
Address (4:0) Programmable Modu
Timer lation
Data (7:0)
Frequency &
Alert pulse Alert Sound
width controller (one shot)
Electronic
Volume
Sound Volume to Electronic
Control Register volume control
from CD Drive
from Host Processor
Line OUT
from Gantry Mic
from OC Mic
to Patient Volume
from Patient Volume Lowpass

Filter
Auto Voice Volume
Scan Keyboard
Volumes to Host Processor to Gantry to OC Speaker
Line IN Speaker

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Audio Register Address Map

Illustration 3-3 shows an address map of audio control registers.
The addresses shown are mapped at an area within the DBPCI Input/Output address space of the host processor.
Registers mapped within the I/O register bases $50 ∼ $7F are located on the DBPCI board. These are controlled
by the host processor, and control signals only are sent from DBPCI to the REAR CN1 board.
Registers mapped within the I/O register bases $80 ∼ $FF are located on the REAR CN1 board. These registers
and the DBPCI board are connected via a dedicated bus.
Illustration 3-3 Audio Register Address Map
D7 D0
$b4
$b0 CD GA Volume Register
$ac CD OC Volume Register
$a8 AV OC Volume Register
$a4 Alert Volume Register
$a0 X-ray Volume Register
PIT1 Register
$90
PIT0 Register
$80
AUX0 Note:
$60 Auto Voice Playback Register CD: CD-ROM Drive
GA: Gantry
OC: Operator Console
AV: Auto Voice
PIT: Sound Pulse Width Control
$54 Alert Sound Register
$50 X-ray On Sound Register

IO Register Base

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SECTION 4 - OTHER OC COMPONENTS
4-1 KEYBOARD, MOUSE

The keyboard used for this operator console integrates the following components:
• 103 Keyboard, Mouse:
This 103 keyboard and the mouse have a PS/2 interface for connecting themselves to the host
processor.
• Scan Keys, Microphone:
Keys used for scanning, and a microphone used for an intercom are incorporated into the keyboard.
These keys are connected to the host processor via RS-232C.
The keyboard and the TGP board are connected by ‘Direct Lines’ for the remote cradle and gantry tilt control.
4-2 DISPLAY
• CRT (22” color monitor): The resolution used for the CRT Display is 1280 x 1024 matrix. The refresh
rate used is 75 Hz.
• LCD (18”): The resolution used for LCD Displayis 1280x1024 matrix. The refresh rate used is 60-75 Hz.
4-3 NAA1 (NP AUDIO AMPLIFIER)

This is an amplifier board for the OC speaker. See the following block diagram.
Illustration 4-1 NAA1 Block Diagram
Power Amplifier
Preamplifier
+
+
CN2 OUT OUT CN1
- -
From REAR CN1 To OC Speaker
Muting
Voltage Regulator

blank

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TABLE/GANTRY
TABLE OF CONTENTS
SECTION PAGE

1-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 COMPONENTS INTERCONNECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1-3 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
SECTION 2 - SUB-ASSEMBLY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 STATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-2-1 TGP board Service Switches. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2-2-2 TGP Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2-3 ROTATIONARY GANTRY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
2-4 SLIP RING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2-4-1 MECHANISM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
2-5 TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
i TABLE/GANTRY
ii TABLE/GANTRY
REV 1 5116384
1-1 INTRODUCTION
The TGP (Table Gantry Processor) board is the main controller of the Table/Gantry subsystem. The TGP board
receives command from the Operator Console and sends control commands to Table, Stationary Gantry and
Rotating Gantry including OGP (On Gantry Processor), DAS and X-ray Generator. Although the DAS/Detector and
X-ray Generator are in the Gantry, they are not explained in this subsystem.
The Table/Gantry consists of the following components:
• TGP board
• OGP board
• SUB board
• Table board
• Servo Amp/Servo Motor
• Gantry Display
• Gantry Switch
• Collimator
• Positioning Light
• Hydraulic System (Gantry Tilt and Table elevation)
• Touch Sensors
• Cradle drive system
1-1 TABLE/GANTRY
REV 1 5116384
1-2 COMPONENTS INTERCONNECTION

The illustration 1-1 shows the components of the Table/Gantry.
Illustration 1-1 Table/Gantry
GANTRY
SWITCH GANTRY DISPLAY
PANEL
TILT POTENTIOMETER AXIAL MOTOR
TABLE HEIGHT TGP BOARD TILT HYDRAULIC

POTENTIOMETER OGP BOARD SYSTEM
CRADLE POSITION SUB BOARD APERTURE
POTENTIOMETER SERVO AMP/MOTOR MOTOR
STEPPING MOTOR
DRIVER CRADLE
CRADLE ENCODER MOTOR
TABLE BOARD
CRASDLE DRIVER TABLE VALVE
AZIMUTH ENCODER
SOLENOID
TABLE HY
GANTRY PULSE DRAULIC SYSTEM
TABLE TOUCH SENSORS LOOK GUIDE
GANTRY TOUCH SENSORS APERTURE SENSORS
LATCH SWITCHES EMERGENCY SWITCHES
FOOT SWITCHES
Z–AXIS LIMIT SENSORS

DAS
Z–AXIS MOTOR
1-2 TABLE/GANTRY
REV 1 5116384
1-3 SPECIFICATIONS
The specifications of the Table/Gantry is as follows:
Gantry Rotation Speed

• 1.0, 1.5, 2.0, 3.0, 5.0 sec/rot.
Tilt Angle
• 20 deg. ± 1.0 deg.
Tilt Speed
• Approx. 1 deg / sec.
Table Height
• 400 ~ 900 mm
UP/Down Speed
• From 400 mm to 900 mm height: 24 -6+10 sec.
Cradle Speed
• Slow 20 mm/sec
Fast 100 mm/sec
Scout 75 mm/sec
Home 100 mm/sec
1-3 TABLE/GANTRY
1-4 TABLE/GANTRY
REV 1 5116384
SECTION 2 - SUB-ASSEMBLY DESCRIPTION
2-1 OVERVIEW
The Table/Gantry consists of table and Gantry. The Gantry is divided into Stationary Gantry and Rotationary Gantry.
The communication between stationary and rotationary Gantry is made by slip-ring, a rotation mechanism that
permits electrical power and signals exchange.
The illustration 2-1 shows the Table/Gantry block diagram.
Illustration 2-1 Table/Gantry Block Diagram
GANTRY
STATIONARY GANTRY ROTATIONARY GANTRY

PDU
POWER
GANTRY
OC DISPLAY
TGP BOARD
GANTRY COLLIMATOR
SWITCH
OGP BOARD
POSITIONING
GANTRY LIGHT
SUB BOARD TILT
VALVE
SLIP
RING
SERVO DAS XG
SERVO AMP MOTOR
TABLE
CRADLE
IN/OUT
TABLE MAT
BOARD SWITCH
TOUCH
SENSORS
TABLE ELEVATION /
GANTRY TILT PUMP
AND TABLE VALVE
2-1 TABLE/GANTRY
REV 1 5116384
2-2 STATIONARY GANTRY

The stationary Gantry is mainly controlled by the TGP (Table Gantry Processor) board. The Illustration 2-2 shows
the main components of the stationary Gantry.
The TGP board communicates with Operator Console and Table via cables and with the OGP board located in
rotationary Gantry via cable and slipring.
Illustration 2-2 Stationary Gantry main components
OGP
(SLIP RING) MICROPHONE
GANTRY SWITCH
115VAC
PS1 DISPLAY BOARD
TOUCH SENSOR
FCV
PS2
BOARD BREATH NAVI
PS 3 EMERGENCY SWITCH
OC
TGP BOARD MICROPHONE
GANTRY SWITCH
TABLE
XDISP BOARD
TOUCH SENSOR
RCV
BOARD BREATH NAVI
EMERGENCY SWITCH
GANTRY TILT
PUMP & VALVE
TABLE ELEVATION
PUMP & VALVE SIDE COV-
SUB BOARD ER
SWITCHES
AXIAL
M
MOTOR
FRONT AND
REAR
COVER
SWITCHES
The functions of the parts of the stationary Gantry are as follows:
PS1 and PS2

Supply power to TGP board and SUB board. PS1 supplies +5V, +12V and -12V. PS2 supplies +24V.
2-2 TABLE/GANTRY
REV 1 5116384
2-2 STATIONARY GANTRY (CONTINUED)
FCV (Front Cover) Board RCV (Rear Cover) Board

Contains connection circuitry to display board, touch sensors, breath navis and emergency switches.
See Illustration 2-3 and 2-4.
Illustration 2-3 FCV Block Diagram
FCV BD ASSY
CN1 CN2
TGP DISP
+24V,+5V,GND,SHIELD,XLED,PLLED,
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2 GNTDISP
TGP BD
BD ASSY
ASSY
(CN8)
CN5
+24V,+5V,SHIELD,FLED,SLED LG
CUNTL0,CUNTL1, FLG BD
CUNTL2,CUNTL3, 7seg DECORD La,Lb,Lc,Ld,Le,Lf,Lg,
ASSY
& DRIVE Ha,Hb,Hc,Hd,He,Hf,Hg
CUNTH0,CUNTH1, CIRCUIT
CUNTH2,CUNTH3
CN3
LSW
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED
+5V +5VSW LSW BD
SWENBL* ASSY
K1
CN4
RSW EMERGENCY SW
INR,OUTR,FAST,IMSR,INLMR,EXLMR,RANGE,
UPR,DNR,FWDR,BWDR,POSL,PRACTICE
EMERGENCY
CN6
TSW
TCH* TOUCH SW
TSNS,CONECTOR TOUCH
DETECT
SW ASSY
CIRCUIT
CN8 CN7
MICOUT MIC
NAA2
MIC+,MIC-,MICGND MIC
ASSY
ASSY
(CN2)
2-3 TABLE/GANTRY
REV 1 5116384
Illustration 2-4 RCV Block Diagram
R CV BD ASSY
CN1 CN2
TGP +24V,+5V,GND,SHIELD,XLED,PLLED, DISP
A0,A1,B0,B1,B2,B3,SL0,SL1,SL2
CN8
TGP BD XDISP
ASSY +24V,XLED,PLLED XDISP
(CN9) BD ASSY
CN5
+24V,+5V,SHIELD,FLED,SLED LG
CUNTL0,CUNTL1, RLG BD
CUNTL2,CUNTL3, 7seg DECORD La,Lb,Lc,Ld,Le,Lf,Lg,
ASSY
& DRIVE Ha,Hb,Hc,Hd,He,Hf,Hg
CUNTH0,CUNTH1, CIRCUIT
CUNTH2,CUNTH3
SHIELD,FWDLED,BWDLED,EXLMLED,IMSLED CN3
RSW
+5VSW
+5V TEMP+5V
SWENBL*
K2 K1 CN4
RENBL LSW
POSL,INLMR,RANGE,PRACTICE (+5VSW)
INR,OUTR,FAST,EXLMR,UPR,DNR,FWDR,BWDR (TEMP+5V)
CN10
E-OFF
SW
EMERGENCY
CN6
TSW
TCH* TOUCH SW
TSNS,CONECTOR TOUCH
DETECT
SW ASSY
CIRCUIT
CN9 CN7
MICOUT MIC
NAA2
MIC+,MIC-,MICGND MIC
ASSY
ASSY
(CN3)
2-4 TABLE/GANTRY
REV 1 5116384
Display Board and XDISP board

Display board is the display located at middle upper side of the Gantry front cover.
XDISP board is the smaller display located at middle upper side of the Gantry rear cover.
Gantry Switches
Located at center of the front Gantry cover. These switches are used to tilt manage Gantry tilt, table and cradle
movement and positioning light.
Gantry Microphone
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side.
Touch Sensor
Located at front and at rear upper side of the Gantry cover to protect patient during tilt. When touch sensor at the
front cover hit something during forward tilt, the tilt stops. When touch sensor at the rear cover hit something during
backward tilt, the tilt stops.
Breath Navi
Located at upper portion of the entrance of the Gantry opening, at the front and the rear side to notify patient to
breath, hold breath and show remaining scan time.
Emergency Switch
Located at left and right of both front Gantry cover.
SUB Board
The SUB board contains control circuitry for Gantry tilt, table elevation and servo amp for axial motor. Control these
functions according to the command received from TGP board. Contains also connection to Gantry cover switches.
See Illustration 2-5.
2-5 TABLE/GANTRY
REV 1 5116384

Illustration 2-5 SUB Board Block Diagram
GANTRY TILT(BWD)
TABLE UP & GANTRY
TILT(FWD) PUMP
TABLE DOWN
VALVE
VALVE
2-6 TABLE/GANTRY
REV 1 5116384
TGP BOARD
There are three micro processors on the TGP Board. One controls the GANTRY Rotation, one controls the Table
and the other controls the arbitration of commands from the gantry processor, table processor, scan processor
(located on the OGP board) and the OC. See Illustration 2-6.
• Processor A for GANTRY CONTROL (GP)
• Processor B for TABLE CONTROL (TP)
• Processor C for MANAGEMENT (MP)
The Management processor communicates with the OC through serial links. The other processors (Gantry
Processor and Table Processor) communicate with the Management Processor, and can receive commands from
the OC via the Management Processor. The Gantry Processor and Table Processor also contain a serial
communication port which is not used for communication between OC or other Processors, but rather is used for
Data correction from the sensor switches.
The TGP Board issues commands to and receives status from the components it controls. The TGP oversees the
following functions:
• AXIAL Drive control
• TILT Drive control
• CRADLE IN/OUT Drive control
• TABLE Elevation Drive control
• GANTRY Display control
• Breath Navi Display control
• GANTRY panel switch
• Error Detection
2-7 TABLE/GANTRY
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Illustration 2-6 TGP Block Diagram
TGP Bd
PDU Emergency
Rot Safe
PDU Safety Gantry
Loop Processor G-Pulse
(uPD78310) Rot Count C
12bit
SRAM DAC Azimuth M
Servo
Rotate AMP Enc
Flash Control
Memory
Dual
Test 0,1 Port RAM
Reset SW G Test
SW Slice Count C
Reset Status
Patarn LED DAS Slip
Trig Ring
Management
OC Comm Processor
OC (uPD78310) 9600bps Slip
unication Ring
SRAM SIO
OC OC Direct CT Lock
Line &Alarm Relay
Flash
Memory Control
OC
Breath
Flash Navi Breath
Memory Control Navi
Dual
Port RAM Service
SW
M Test Flash
SW Add Cont
Status
LED HIT Pot
Table TILT Pot

Processor 12bit
(uPD78310) ADC Cradle Pot
SRAM
Cradle
Cradle Motor
Flash Control M
Driver
Memory
Table Enc
T Test Control Up/Dwn
SW Relay P,V
Tilt
Status Control Tilt P,V
LED Relay
Display Gantry
Control Display
T/G SW Gantry
Port SW
Table
Flash SW
Add Cont
Fluoro
Mat SW SW
Audio Mic
Amp
Spk
2-8 TABLE/GANTRY
REV 1 5116384
2-2-1 TGP board Service Switches

There are five service switches at right upper side of the TGP board which are used to control the Gantry Rotation
manually.
Illustration 2-7 TGP Board Service Switches
SYS ABT SPD2 FAST CNT
HOME
SPD1
OFF
MID
SVE
MNL FIX SPD0 SLOW 90DEG
TGP BOARD
GANTRY LEFT SIDE
SYS : System Position. When the switch is in this position, the Gantry is controlled by the
SYS Operator Console.
OFF Disable the Gantry rotation. Servo Amplifier is disabled and Static brake activated.
OFF
MNL Manual Position. When the switch is in this position, the Gantry rotation is controlled
MNL
manually, by the other switches described below.
ABT : Arbitrary Mode. This switch is a spring loaded switch that enables Gantry rotation
ABT
toward the direction selected by the rotation Direction switch (CNT/HOME/90DEG),
by the fixed speed of XXX seconds per revolution.
SVE
SVE : Servo Enable. Servo Amplifier is enabled and voltage command is 0 volts, that
FIX means there is no rotation at this position.
FIX : Rotates Gantry according to the selection of the Speed Selection switches
(SPD2/SPD1/SPD0 and FAST/MID/SLOW) and Direction switch (CNT/HOME/90DEG).
2-9 TABLE/GANTRY
REV 1 5116384
2-2-1 TGP board Service Switches (continued)

SPD2 FAST
SPD1
These two switches sets the rotation speed
MID
and See table below
SPD0 SLOW
SPD2/SPD1/SPD0 SPD2 SPD2 SPD2 SPD1 SPD1 SPD1 SPD0 SPD0 SPD0
FAST/MID/SLOW FAST MID SLOW FAST MID SLOW FAST MID SLOW
SPEED (sec/rot) 1.0 1.0 1.0 1.5 2 3 5 10 15
CNT
CNT : Clockwise rotation
HOME
HOME: Home position (X-ray tube at zero degree position)

90DEG 90DEG: 90 degree position (X-ray tube at 90 degree position)
2-2-2 TGP Processors

The TGP board contains three processors:
Management Processor (MP)

The Management Processor oversees the functions of the Table/Gantry. It communicates with OC and according
to the message received from OC, sends corresponding commands to Gantry processor, Table processor and OGP
board.
The main functions of the Management processor are:
• Communication with OC - serial link
• Communication with OGP - serial link through slipring
• X-ray ON LED (on Gantry panel) control
• Positioning Light ON LED (on Gantry panel) control
• Look guide control
• Practice Switch (for look guide) control
• Tilt position, table height and cradle position adjustment. There is a ROM connected to management
processor that contains adjustment data. The management processor reads this data, compares with
the current positions and make adjustment as needed.
2-10 TABLE/GANTRY
REV 1 5116384
2-2-2 TGP Processors (continued)
Gantry Processor (GP)

The Gantry processor control the following functions:
• Positioning light switch
• Gantry rotation
Table Processor (TP)

The table processor control the following functions:
• Cradle In/Out
• Gantry Tilt
• Table Up/Down
• Gantry Display
• Gantry Switch
• Interlock
2-11 TABLE/GANTRY
REV 1 5116384
2-3 ROTATIONARY GANTRY

The Illustration 2-8 shows the main components of the rotationary Gantry.
The functions of the parts of the stationary Gantry are as follows:
OGP Board
The OGP (On Gantry Processor) performs the following functions:
• X-ray exposure on/off control
• DAS data transfer timing
• Collimator control
• Beam Tracking Control
• Positioning light control
• Scan control
• The automatic shut-off of the Tube Fan/Pump Power Supply after 30 minutes when the OC has been
powered down.
Illustration 2-8 Rotationary Gantry main components
PHOTO
DAS SENSOR
MOTOR
MOTOR
DRIVER
GPLS
MOTOR
DRIVER MOTOR
TO TGP COLLIMATOR
(SLIP
RING) ENOCODER
OGP BOARD
POSITIONING
LIGHT
PHOTOSENSOR
RELAY
SWITCHING
POWER
SUPPLY
TEMP
CONT
115VAC ASSY
TO DAS BUFFER DCP2 DAS/DETECTOR

RF XMT
2-12 TABLE/GANTRY
REV 1 5116384
2-3 ROTATIONARY GANTRY (CONTINUED)
Switching Power Supply

Supply power to the OGP board, DCP2 board, RF transmitter, Temp cont, DAS, and positioning light.
Supply power to the DAS and Temperature Control Box.
Collimator
Located at the exposure window of the X-ray tube, controls the aperture of the X-ray beam by moving the blades.
The aperture can be 0.6, 1, 2, 3, 5, 7 or 10 mm in 2i mode.
Motor Driver
Generates five phase pulses to control the stepping motor of the collimator. Receives pulse command from OGP
board and convert it to other type of pulses.
Encoder
Sends the feedback pulse to the OGP to show the moved amount of the blades.
Photo Sensor
Detects when the collimator blades are in 1mm aperture
DAS
Data Acquisition System. Processes the data received from detector and send it to operator console. The detailed
explanations are in the DAS/Detector sections.
Temp Cont Assy

Device that controls the Detector temperature
DCP2
Receives parallel data from DAS and convert them to serial data. The detailed explanations are in the DAS/Detector
sections.
RF XMT
Converts Serial signal from DCP2 to RF signal.
GPLS
Notify TGP and OGP board when the Gantry is at zero degree tube position.
2-13 TABLE/GANTRY
REV 1 5116384
2-4 SLIP RING

The SLIP RING transfers the following signals;
• DAS Data
• DAS Trigger
• TGP and OGP Communication message
• Safety Loop
2-4-1 MECHANISM
This Gantry slip ring system utilizes:
• Nine 480VAC power brushes (3 power lines x3 brushes)
• Four 115VAC power brushed (2 power lines x2 brushes)
• Three ground brushes (1 ground line x3 brushes)
• Twenty-four signal brushes (6 signal lines x 4 brushes)
• RF transmitter / receiver modules
Every slip ring has a corresponding terminator located on the opposite side of the transmitter terminal. See
illustration 2-9.
TERMINATE
RESISTOR
SIGNAL
SLIP
RING
Illustration 2-9 Slip Ring Terminator

The characteristic Impedance should be less than or equal to approx. 50 Ω .
2-14 TABLE/GANTRY
REV 1 5116384
2-5 TABLE
The Illustration 2-10 shows the main components of the table.
The description of the parts of the Table follows:
Table board
This is an interface board between TGP board and servo amp, stepping motor driver, and table CONN board.
TBL CONN board

This is an interface between Table board and potentiometers, touch sensors and latch switches.
This board has only connectors. For detail information, see schematic diagrams.
Illustration 2-10 Table
HEIGHT
POTENTIOMETER
PUMP
FROM
SUB
BOARD VALVE
TABLE UP/DOWN &

GANTRY TILT
HYDRAULIC
SYSTEM MAT SWITCHES
FROM
TGP
BOARD
TABLE TABLE
BOARD CONN
BOARD
LATCH SWITCHES
TOUCH SENSORS
SPEAKER
E
STEP ENCODER
MOTOR
FROM (CRADLE)
GANTRY M
NF2 SW STEP MOTOR
P.S. DRIVER ENCODER
POTENTIOMETER
2-15 TABLE/GANTRY
REV 1 5116384
2-5 TABLE (CONTINUED)
Hydraulic System
Consists of pump, hose and cylinder. it is used for Table Up/Down and Gantry Tilt.
Cradle
Portion of the Table that executes longitudinal movement. It is controlled by step motor and motor driver.
Latch Switches
Positioned at both right and left sides of the Table, these switches release or latch the cradle. When both switches
are pressed, the cradle is latched. When one of the switches is depressed, the cradle is released. They are for safety
purpose.
Potentiometers
There are three potentiometers: Height potentiometer and Encoder (tilt) potentiometer. They are used for feedback
purpose.
Touch Sensors
Located at under surface of the Table. They are for safety purpose.
Mat Switches
Located at both right and left sides of the table base. The Gantry panel switch can be available with the mat switch
ON.
2-16 TABLE/GANTRY
REV 3 5116384
DAS/DETECTOR
TABLE OF CONTENTS
SECTION PAGE

1-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
SECTION 2 - DETECTOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-3 HILIGHT DETECTOR MODULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-4 CHANNEL DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-5 DAS/DETECTOR CONNECTOR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2-6 QCAL CHANNELS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2-7 AFTER GLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2-8 HEATER AND TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - MDAS. . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3-2 DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3-3 DCP2 BOARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3-3-1 DCP2 Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3-3-2 DCP2 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3-4 CONVERTER BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
SECTION 4 - DATA ACQUISITION SYSTEM (DAS) - GDAS . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4-1 OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4-2 DATA FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4-3 DCP CARD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4-3-1 DCP Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
4-3-2 DCP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4-4 CONVERTER BOARD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
i DAS/DETECTOR
ii DAS/DETECTOR
REV 1 5116384
1-1 OVERVIEW
DAS/Detector subsystem consists of Solid State Detector and Data Acquisition System (DAS) that are located on
the rotationary Gantry. X-ray data acquired by the detector is converted to light, then to electrical signal in the
detector and then sent to DAS. The DAS digitizes, serializes and performs offset corrections on the signal and sends
to the Operator Console for image reconstruction.
The X-ray exposure through the scanning object is detected by these modules, converted to light, then converted
to electrical signal and sent to the DAS. The DAS digitizes and sends this data by slipring and fiber optics to the
Operator Console, where it is processed for image reconstruction.
Illustration 1-1 X-ray Exposure and Data Flow Block Diagram
OBJECT
X-RAY
DATA DATA
X-RAY DETECTOR ACQUISITION DAS Data PROCESSING
TUBE SYSTEM UNIT
Illustration 1-2 X-ray Exposure and DAS/Detector
X-RAY TUBE
X-RAY BEAM
DETECTOR
DAS
1-1 DAS/DETECTOR
1-2 DAS/DETECTOR
REV 3 5116384
SECTION 2 - DETECTOR
2-1 OVERVIEW
The detector consists of housing, collimator and detector modules. The detector module is made of scintillator
(lumex crystal), photo-diode and connector. When the X-ray exposure is performed, the X-ray enters through the
collimator and hits the scintillator. The scintillator is made of a material that emits light when hit by X-ray. The
scintillator is in contact with photo-diode so that the light generated by X-ray is converted into electrical current. The
generated current is sent to the DAS (Data Acquisition System) to be processed.
2-2 SPECIFICATIONS
Distance from Focus to ISO: 541 mm.
Distance from Focus to Detector surface: 949.075 mm.
Detector Channel Pitch: 1.15 mm.
Detector Channel angle: 0.06946 degree.
View Number:
• Offset: 256 views
• Active: 972 views
Channel Distribution:
MDAS GDAS
Slice A Slice B Slice A Slice B Slice
Active Channel 685 685 685 685
Reference Channel 9+9 9+9 3+3 3+3
QCAL Channel 3 3 3 3
2-1 DAS/DETECTOR
REV 3 5116384
2-3 HILIGHT DETECTOR MODULE

The module consists of Scintillator cells, Collimator, Photo Diode, Reflex Films and Connector (illustration 2-1). The
X-ray enters through the collimator (tungsten plates) and is absorbed by the Scintillator. The Scintillator is made of
Lumex Crystal, the material that emits light when absorbs X-ray radiation. The Scintillator is optically coupled with
Photo Diode which converts light to electrical current. The Photo Diode is electrically connected to DAS through
the connector.
Illustration 2-1 DETECTOR MODULE
COLLIMATOR (IN THE

DETECTOR HOUSING)
X–RAY
HILIGHT MODULE LUMEX CRYSTAL
LIGHT
PHOTO DIODE
Slice B
Slice A
CONNECTOR (TO DAS)
2-2 DAS/DETECTOR
REV 3 5116384
2-4 CHANNEL DISTRIBUTION

The illustration 2-2 shows the channel distribution.
Illustration 2-2 DETECTOR CHANNEL DISTRIBUTION
MDAS
J01 J05 J06 J07 J08 J44 J45 J46 J47 J51
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
Detector
1 MOD 17~19 20~32 33~35 36~48 49~51 52~61 62~64 65~640 641~656 657~672 673~688 689~704 1 MOD
CH CH CH CH CH CH CH CH CH CH CH CH
1~3CH 4~12 13~19 GND REF REF REF

QCAL REF GND
3CH 3 3 3 4CH 3CH 13+ 3 13+ 3 10 3 576CH 16 12+ 4 2+ 14 +10 6 7 3 3 3
1:1 3:1 3:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 3:1 3:1
DAS
A Slice
1:1 3:1 3:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 3:1 3:1
B Slice
CH: 3 1 1 1 2 8 8 5 3 576 14 2 8 2 3 1 2
3:1 Three detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the three detector channel current.
2:1 Two detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the two detector channel current.
2-3 DAS/DETECTOR
REV 3 5116384
2-4 CHANNEL DISTRIBUTION (CONTINUED)
Illustration 2-2 DETECTOR CHANNEL DISTRIBUTION (CONTINUED)
GDAS
J01 J05 J06 J07 J08 J44 J45 J46 J47 J51
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
1 MOD
Detector
1 MOD 17~19 20~32 33~35 36~48 49~51 52~61 62~64 65~640 641~656 657~672 673~688 689~704 1 MOD
CH CH CH CH CH CH CH CH CH CH CH CH
1~3CH 4~12CH NC REF REF REF

QCAL REF
NC NC
3CH 3 3 3 4CH 3CH 13+ 3 13+ 3 10 3 576CH 16 12+ 4 2+ 14 10 6 7 3 3 3
1:1 3:1 1:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 NC 3:1 1:1 3:1
DAS
$6OLFH
1:1 3:1 1:1 3:1 2:1 2:1 2:1 1:1 1:1 2:1 3:1 3:1 3:1 NC 3:1 1:1 3:1
%6OLFH
CH: 3 1 3 1 8 8 5 3 576 14 2 8 2 1 1 3 1
3:1 Three detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the three detector channel current.
2:1 Two detector channels are connected in parallel into one DAS channel.
DAS channel current is the sum of the two detector channel current.
2-4 DAS/DETECTOR
REV 3 5116384
2-5 DAS/DETECTOR CONNECTOR

The detector module consists of 32 channels(A slice and B slice). The illustration 2-3 shows the flexible PWB that
connects detector modules to the DAS Converter Board and its pin configuration.
Illustration 2-3 DAS/DETECTOR CONNECTOR
48 PIN A B C D
CONNECTOR
1 2SG 2SG 2SG 2SG
D C B A
2 2SG 2SG 2SG 2SG
1
2 3 A–1ch B–1ch A–16ch B–16ch
3
5
7
6 A–4ch B–4ch A–13ch B–13ch
8
9
10
FLEXIBLE 11
PWB 8 A–6ch B–6ch A–11ch B–11ch
12
11 FG FG FG FG
12 FG FG FG FG
Note
SG: Signal Ground
FG: Frame Ground
2-5 DAS/DETECTOR
REV 3 5116384
2-6 QCAL CHANNELS

The X-ray exposure can move along the Z-axis. It can be due to mechanical adjustment or to tube temperature (the
angle of the X-ray output can vary according to the temperature). There is three channels in the left most positioned
detector module that is used for Z-axis data correction. The outputs of the three channels are tied together so that
only one data is taken for three channels. The corresponding intensity according to the position of the X-ray
exposure along the Z-axis is detected (as can be seen at right side of the illustration 2-4), so that the system
recognizes the current X-ray position (along the Z-axis). There is a remaining data for Z-axis data correction in the
system. Therefore, the correction is made according to the data acquired by the Q-CAL channels.
Illustration 2-4 Q-CAL CHANNELS
Q–CAL CHANNELS
A Slice X–RAY INTENSITY

A Slice
DETECTED AC-
X–RAY
CORDING TO THE X–RAY EXPOSURE
B Slice BEAM POSITION EXPOSURE
B Slice
Z ALONG THE Z–AXIS
Q–CAL CHANNELS
X
2-7 AFTER GLOW

The Lumex crystal scintillator has a property represented in the illustration 2-5. The scintillator continues emitting
light even after the X-ray radiation is stopped. This phenomenon is called AFTER GLOW. This remaining scintillation
provides incorrect data, but the system performs the error correction to eliminate this portion.
Illustration 2-5 AFTER GLOW
X–RAY ON
scintillation
X–RAY OFF
2-6 DAS/DETECTOR
REV 3 5116384
2-8 HEATER AND TEMPERATURE CONTROL

The detector comprises a heater unit. The heater keeps the detector temperature constant, what is needed for
detector accuracy. The heater is controlled by the Temperature Control Box which supplies power to the heater. The
detector also comprises a thermistor that feeds back the temperature information to the Temperature Control box.
Approximately three hours is needed after turning ON the power to the Temperature Control box to stabilize the
detector temperature. The temperature is controlled to 35 ± 0.5 °C. The illustration 2-6 shows its block diagram.
Illustration 2-6 TEMPERATURE CONTROL BLOCK DIAGRAM
Thermistor DETECTOR
Heater DC24V 60W
INPUT POW
ER 24V DC
Driver for
Heater
PS
PS (+12V -> +5V)
(+24V -> +12V)
(OP Amp CPU ROM

Coparato)
Switch LED indication
TEMPERATURE CONT BOX
2-7 DAS/DETECTOR
REV 10 5116384
SECTION 3 - DATA ACQUISITION SYSTEM (DAS) - MDAS
3-1 OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
• RBB - 2 Converter Boards

• CBB - 6 Converter Boards
• LBB - 2 Converter Boards
The Illustration 3-1 shows the DAS boxes.
Illustration 3-1 DAS (RBB, CBB, LBB)
Co rd #1
rter
CONNECTER
nve
Boa verter
10
(TO DETECTOR)
a
Co rd #6
rter
o
rd #
B
Boa verter
nve
Con
a
rd #
o
B
B
RB
Con
LBB Co rd #2
rter
Boa verter
9
nve
Co rd #7
rd #
rter
a
Boa verter
Bo
4
Con
nve
rd #
Converter
Converter
a
Board #8
Board #3
DCP2 ASSY
o
Con
CBB
DAS CONTROL BOARD
The DAS channels number is as follows:
Slice A Slice B Slice

Active Channel 685 685
Reference Channel 9+9 9+9
QCAL Channel 3 3
GND Channel 14 14
3-1 DAS/DETECTOR
REV 10 5116384

The Illustration 3-2 shows DAS block diagram.
The data coming from the detector is taken by the Converter Boards, sequentially channel by channel, digitized,
converted to parallel, then sent to the Operator Console. The DCP2 receives control and timing signals, and
generates the timing signals for data gathering. The DCP2 Board also generates the test pattern.
Illustration 3-2 DAS/Detector Structure
#45 #35 #34 #27 #26 #19 #18 #11 #10 #1
#10 #5 #9 #4 #8 #3 #7 #2 #6 #1 Converter
DC+/-12V Analog Boards
POWER DC+/-5V Analog
SUPPLY
DC+5V
Digital
Data Flow
Data Flow
DCP2 Data Flow
BOARD
Control Signal
3-2 DAS/DETECTOR
3-1
REV 10
RBB
JP1 1-1 JP4
JP1
GE HEALTHCARE
2-2
Illustration 3-3
......
8-8
JP4
CBB
OVERVIEW (CONTINUED)
JP3 1-1 JP5
JP3
2-2
......
8-8
JP5
CN80
2A +12V ANALOG
L
DAS Power Connection
AC + 4 6 6
+/- 12 V ANALOG GND
110V AC COM 5 7 7
3-3
ANALOG -12V ANALOG 8
N AC - 6 8
+5V ANALOG
1 3 3
ANALOG GND
2 4 4 LBB
-5V ANALOG
3 5 5
1A +5V DIGITAL
7 1 1
AC + DIGITAL GND
8 2 2
+/- 5 V COM
AC ANALOG -
CN81
4
5 DCP2
1A 6
AC +
+5V 1
DIGITAL 2
AC -
3
7
8
DAS/DETECTOR
5116384
THEORY OF OPERATION
REV 10 5116384
Illustration 3-4 DAS Signal Connection
LBB ASSY
FC45
OGP ASSY
J51 CN45
FC44
Converter J47 CN44
Board #10
DCP2 ASSY
Converter
Board #5 FC35
J38 CN35
JS4
CBB ASSY Converter

JS3 FC34
Board #9
J37 CN34
4onverter
Board #4
DETECTOR
Converter
Board #8
Converter
Board #3
Converter
Board #7 FC11
CN11
Converter J14
Board #2 JS2
RBB ASSY
JS1
FC10
J13 CN10
Converter
Board #6
Converter FC2
Board #1 J5 CN2
FC1
J1 CN1
3-4 DAS/DETECTOR
REV 10 5116384
3-2 DATA FLOW

The illustration 3-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to to DCP2 board where it is converted
back to serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 3-5 DAS block diagram
DAS
FPGA
Electrical Analog
Current Data A/D
DETECTOR Data
Converter
Control
DCP Board
3-5 DAS/DETECTOR
REV 10 5116384
3-3 DCP2 BOARD
3-3-1 DCP2 Functions

The DCP2 board performs the following functions:
• Interfaces with the OGP for Rx reception and scan completion via RS422 bus
• Sets up gain and offset trim and controls the converter cards, via the converter CAN interface
• Receives triggers and starts acquisitions with the converter cards
• Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering
• Adds Forward Error Correction (FEC) to the channel data and sends it across the slipring to the Scan
Reconstruction Unit (SRU) via the high-speed serial data interface
• Detects jitter and timeouts in the view trigger signal
• Monitors the power supply voltages to make sure they are within the software programmable limits
• Acquires the kV and mA values for each scan
• Monitors the DAS subsystem for various faults
• Makes the DAS data to 972view/rot format
• Z-axis beam tracking: controls the X-ray intensity between the Converter’s A and B Slices
3-6 DAS/DETECTOR
REV 10 5116384
3-3-2 DCP2 Interface

The DCP2 is the main control board for Data Acquisition System (DAS). It packages all the converter card data into
a single high-speed serial data stream, compatible with the receive function on the DASIFN2 on OC. Illustration 3-
6 shows the interface of DCP2.
Illustration 3-6 DCP2 Interface
DCP2
Fiber Optical
Cable
BW LMT
FW LMT
FW+
FW-
BW+
BW-
Collimator & Driver
3-7 DAS/DETECTOR
REV 10 5116384
3-3-2 DCP2 Interface (Continued)

Inputs
From Converter Boards:
• Inner Row Serial Data Streams
• Outer Row Serial Data Streams
• Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information
• Converter Board Fault Line
From OGP:
• RS422 Bus communication for scan control information
• Input View Triggers
• Input gantry home position trigger
• Input X-ray on/off signal
• Input DAS enable signal
• Input Offset scan and active scan signal
• Input reset signal
From JEDI:
• KV & MA analog signals
From Collimator
• Forward Limited positive signal
• Backward Limited positive signal
3-8 DAS/DETECTOR
REV 10 5116384
3-3-2 DCP2 Interface (Continued)

Outputs
To Converter Boards:
• Shift clock
• Trigger signal
• Converter CAN Bus communication for control information
• Reset signal
• Analog test voltage (for MDAS compatibility) or external reference current (for GDAS compatibility)
To OGP:
• RS422 Bus communication for DAS status, error, or scan complete information
To Slip-ring (and then on to the Scan Reconstruction Unit (SRU) ):
• High-speed serial data stream containing the view data with embedded FEC CRC.
To Collimator
• Forward Pulse output positive signal
• Forward Pulse output negative signal
• Backward Pulse output positive signal
• Backward Pulse output negative signal
3-9 DAS/DETECTOR
3-3
REV 10
GE HEALTHCARE
Illustration 3-7
FPGA
LUT
Data Serial
Serial Serial To Parallel Data
Adder Receiver FEC TAXI
DCP2 BOARD (CONTINUED)
Parallel Output
Dual Port
Control RAM
Trig FEC
Control
Dual Port
Control
Converter
A/D Data
Interface
Collimator
DCP2 board block diagram
3-10
Control
Data & Address & Signal Bus
A/D
AT 55800A AT 55800A
Collimator
Bus Interface Core Controller
OGP Pre AMP
Interface
KV mA
DAS/DETECTOR
5116384
THEORY OF OPERATION
REV 10 5116384
3-4 CONVERTER BOARD

The Converter board performs the following functions:
• Conversion of electrical current signals from the detector to voltage signals.
• Signal level conditioning
• Analog to Digital conversion
• Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.
Illustration 3-8 Preamplifier Architecture
150 pF
C_EXI V_Ref A_GND

C_EXO
72 pF
36 pF
18 pF
9 pF
R_N_red
-
A_IN -
+ R_h C_h A_OUT
+
TEST_V_IN 18 pF
From 7
A_GND Other
OP_COM Channel
Outputs
S_GND A_GND
3-11 DAS/DETECTOR
REV 10 5116384
3-4 CONVERTER BOARD (CONTINUED)
Illustration 3-9 Converter Board Block Diagram
VOLTAGE 2
TEST_V +/- Diff. Rcvr & Filter
REFERENCES (2)
PREAMPLIFIERS 2
I
O N ADC's
Chan_1 Anti-Alias FPA's
U 2 P
Odd # Channels Filter T U ANALOG
P T FLOATING
2 4 TO
Chan_127 Resetable U POINT
M DIGITAL
Integrator T AMPLIFIERS
Chan_2 2 U CONVERTERS
With S/H X 4
M (4) S_DAT
Even # Channels E
U (4)
(16 X 8 CH.) X S
Chan_128
D_IN_ODD +/-
PECL D_OUT_ODD +/-
D_IN_EVN +/- PECL 4
SEQUENCER Differential
Differential D_OUT_EVN +/-
S_TRIG +/- Receivers Drivers
SH_CK +/- (FPGA or ASIC)
X_PRG*
CV_FLT*
CV_RST
CVB_ADDR
6
I2C
TEMPERATURE
CON_HI CONVERTER 2 SENSOR
MICROCONTROLLER
CON_LO I/F SCC I2C I/F
I2C
SERIAL
WR_PRTCT
EEPROM
3-12 DAS/DETECTOR
REV 10 5116384
SECTION 4 - DATA ACQUISITION SYSTEM (DAS) - GDAS
4-1 OVERVIEW
The DAS consists of the following boxes: RBB (Right Back Board), CBB (Center Back Board), and LBB (Left Back
Board). Each box contains the set of boards as follows:
•RBB - 2 Converter Boards

•CBB - 6 Converter Boards
•LBB - 2 Converter Boards
The Illustration 4-1 shows the DAS boxes.
Illustration 4-1 DAS (RBB, CBB, LBB)
Co rd #1
rter
CONNECTER
Y
SS
nve
(TO DETECTOR)
a
Boa verter
Co rd #6
rter
o
10
PA
B
rd #
nve
Boa verter
DC
a
Con
o
5
B
RB
B
rd #
Con
LBB Co rd #2
rter
Boa verter
9
nve
Co rd #7
rd #
rter
a
Boa verter
Bo
4
DAS CONTROL BOARD

Con
nve
rd #
Converter
Converter
a
Board #8
Board #3
o
Con
CBB
The DAS channels number is as follows:
GDAS
Slice A Slice B Slice
Active Channel 685 685
Reference Channel 3+3 3+3
QCAL Channel 3 3
GND Channel 26 26
4-1 DAS/DETECTOR
REV 10 5116384

The illustration 4-2 shows DAS block diagram.
The data coming from the detector is taken by the Converter boards, sequentially channel by channel, digitized,
converted to parallel, go through offset correction, then sent to the Operator Console. The DCP Card is an interface
with OGP (On Gantry Processor) receiving control and timing signals, and generates the timing signals for data
gathering. The DCP Card performs offset correction and generates the test pattern.
Illustration 4-2 DAS/Detector Structure
#45 #35 #34 #27 #26 #19 #18 #11 #10 #1
#10 #5 #9 #4 #8 #3 #7 #2 #6 #1 Converter
POWER
Boards
DC+/-5V Analog
SUPPLY
DC+5V
Digital
Data Flow
Data Flow
DCP Data Flow
Card
Control Signal
4-2 DAS/DETECTOR
4-1
REV 10
RBB
JP1 1-1 JP4
JP1
GE HEALTHCARE
2-2
Illustration 4-3
......
8-8
JP4
CBB
OVERVIEW (CONTINUED)
JP3 1-1 JP5
JP3
2-2
......
8-8
JP5
CN80
15A
DAS Power Connection
L 4 6 6
110V AC 5 7 7
4-3
N 6 8 8
+5V ANALOG
1 3 3
ANALOG GND
2 4 4 LBB
-5V ANALOG
3 5 5
+5V DIGITAL
7 1 1
AC + DIGITAL GND
8 2 2
+/- 5 V COM
AC ANALOG -
AC +
+5V
DIGITAL
AC -
DAS/DETECTOR
5116384
THEORY OF OPERATION
REV 10 5116384
Illustration 4-4 DAS Signal Connection

Collimator Driver
Collimator
LBB ASSY
FC45
J51 CN45
FC44
OGP
J47 CN44
DCP
Converter
Board #10
Converter
FC35
Board #5 J38 CN35
JS4
CBB ASSY Converter

JS3
Board #9 FC34
J37 CN34
4onverter
Board #4
DETECTOR
Converter
Board #8
Converter
Board #3
Converter
Board #7
FC11
CN11
Converter J14
Board #2 JS2
RBB ASSY
JS1
FC10
J13 CN10
Converter
Board #6
Converter
FC2
Board #1 J5 CN2
FC1
J1 CN1
4-4 DAS/DETECTOR
REV 10 5116384
4-2 DATA FLOW

The illustration 4-5 shows the data flow. The Detector generates an electrical current proportional to X-ray intensity.
The electrical current is converted to voltage signal in the Converter board. The voltage signal is amplified to an
appropriate level, converted to digital data (serial). The data is then sent to DCP Card where it is converted back to
serial, conditioned and then sent to Operator Console through the RF Slipring.
Illustration 4-5 DAS block diagram
DAS Offset
Trim
DAC
FPGA
Electrical
Current Fold
DETECTOR DCP Board
Control
4-5 DAS/DETECTOR
REV 10 5116384
4-3 DCP CARD
4-3-1 DCP Functions

The DCP Card performs the following functions:
• Interfaces with the OGP for Rx reception and scan completion via RS422 bus.
• Sets up gain and offset trim and controls the converter cards, via the converter CAN interface.
• Receives triggers and starts acquisitions with the converter cards.
• Performs serial-to-parallel conversion on data streams from the converter cards, does parity checking
on the data, and runs it through a translation table for view data ordering.
• Adds Forward Error Correction (FEC) to the channel data and sends it across the slip ring to the OC via
the high speed serial data interface.
• It provides the A/D converter chip, it acquires the kV and mA values for each scan.
• Monitors the DAS subsystem for various faults.
• Communication with Detector Heater Control Board to monitor the Detector Temperature.
• Trigger jitter detection.
4-6 DAS/DETECTOR
REV 10 5116384
4-3-2 DCP Interface

The DCP is the main control board for Data Acquisition System (DAS). It is applicable for GDAS converter cards.
It packages all the converter cards data into a single high speed serial data stream to OC, compatible with the re-
ceive function on the DASIFN at 95/110 Mbps slip ring communication. Illustration shows the interface of DCP.
Illustration 4-6 DCP Interface
SDCOM/+- CAN_LO
DSCOM/+- CAN_HI
DATA 2_ODD/+-
DASTRIG/+- DATA 2_EVEN/+-
OGP GPLS2/+- DATA 1_ODD/+-
XRON/+- DATA 1_EVEN/+-
AC/OFF/+- STRIG/+- DAS
RESET/+- DCP SH_CK/+-
DASENABLE/+- CN_FLT CVTR
CN_RST
X-PROG
RAW+5VA W-PRTCT
RAW-5VA IREF.EXT
POWER RAW+5VL AGND
SUPPLY AGND
LGND
Fibre Optical
Cable
Slip Ring
KV Signal
From JEDI
0~10V mA Signal
BW LMT
FW LMT
FW+
FW-
BW+
BW-
Collimator & Driver
4-7 DAS/DETECTOR
REV 10 5116384
4-3-2 DCP Interface (Continued)
Inputs
From Converter Boards:
• 2 Inner Row Serial Data Streams (Differential Pairs)
• Converter CAN Bus communication for status, faults, chassis temperature readings, and serial number
information (CAN)
• Converter Board Fault Line (TTL)
From OGP:
• Input View Triggers (Optical Isolated)
• Active/Offset (Optical Isolated)
• High Voltage on to X-ray tube (Optical Isolated)
• DAS enable signal (Optical Isolated)
• Gplus2 signal (Optical Isolated)
• OGP reset to DCP (Optical Isolated)
• TG CMD send/receive serial port (Optical Isolated)
From Collimator:
• Collimator forward and backward position limit feedback (TTL)
From Generator (JEDI):
• KV & MA analog signals
From Backplane:
• Power Supply
Outputs
To Converter Boards:
• Shift clock (Differential Pairs)
• Trigger signal (Differential Pairs)
• Converter CAN Bus communication for control information (CAN Differential Pairs)
• Reset signal (TTL)
• External reference current (Analog)
To OGP:
• TG CMD transmits serial port (RS422)
4-8 DAS/DETECTOR
REV 10 5116384
4-3-2 DCP Interface (Continued)

To Collimator:
• Beam tracking control pulse output (Differential pairs)
To Slip-ring (OC):
• High-speed serial data stream containing the view data with embedded FEC (High speed optical fiber
link).
Illustration 4-7 DCP Card block diagram
GDAS DCP CLK

32MHz Fiber
CARD ASSY Reset
ARM
ARM RAM
JTAG RAM
AT91
TG com
Flash-ROM
PLL CLK
30MHz
FEC
TAXI
Pulse/
status FPGA CY9689A
Cyclone
CAN
CFG JTAG
ADC LVDS LVDS Iref

AD977 Mx9129 Ds032 Ref200
+5V_Logic
+5V_Analog
-5V_Analog
KV/mA
DHCBCollimator OGP JEDI CVTR Power Supply

Left Backplane Board
4-9 DAS/DETECTOR
REV 10 5116384
4-4 CONVERTER BOARD

The Converter board performs the following functions:
• Conversion of electrical current signals from the detector to voltage signals.
• Signal level conditioning
• Analog to Digital conversion
• Generation of the timing signals for data gathering
The signal from the detector with the level proportional to the X-ray intensity is fed to the Converter board. The
signal go through the electrical current to voltage signal conversion and conditioning circuits then is fed to the
Analog/Digital(A/D) converter. The A/D converts analog signal to 16 bits digital serial data.
Illustration 4-8 Preamplifier Architecture
4-10 DAS/DETECTOR
REV 10 5116384
4-4 CONVERTER BOARD (CONTINUED)
Illustration 4-9 Converter Board Block Diagram
2
IREF_INT VOLTAGE
REFERENCE
IREF_EXT
GDAS ASIVS (2)
..
Chan_1
Odd # Chan
Chan_127
. Anti_Alias
Filter CHARGE TO
DIGITAL
CONVERTERS
..
Chan_2
Even # Chan
Chan_128
. (2 x 64 CH.) D0:D9
10
ASIC/FPGA INTERFACE
10
2.5 VOLT BANK
LVDS D_OUT_ODD +/-

Differential D_OUT_EVN +/-
D_IN_ODD +/- LVDS Drivers
D_IN_EVN +/- 4
Differential 3.3 GAB 3.3
S_TRIG +/-
SH_CK +/-
Receivers V V
O (FPGA or ASIC) O
L L CV_FLT*
T T
7 1.5V Core
CVB_ADDR B 2.5, 3.3 VIO B
A A 2
N N I C I/F 2
I C
K K TEMPERATURE
CAN_HI CAN 2 SENSOR
CAN_LO I/F
3.3 VOLT BANK
DSP INTERFACE
Flash Boot
SDRAM SHARC DSP
Prom
CPLD
INTERFACE
CV_RST CPLD 14 Pin JTAG
HEADER
4-11 DAS/DETECTOR
4-12 DAS/DETECTOR
REV 1 5116384
X-RAY GENERATOR
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 - GENERAL DESCRIPTION - I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

1-1 GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 JEDI HIGH LEVEL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
SECTION 2 - GENERAL DESCRIPTION - II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2-1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 STANDARD FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-3 APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2-4 ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-1 Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-2 Options Depending on the Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2-4-3 A Packaging Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
SECTION 3 - TYPICAL SIGNALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3-1 JEDI TYPICAL SIGNALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
i X-RAY GENERATOR
ii X-RAY GENERATOR
REV 1 5116384
SECTION 1 - GENERAL DESCRIPTION - I
1-1 GLOSSARY
Glossary of terms used in this document:
Term Definition
ABC Automatic Brightness Control. Regulation loop which makes the
measured brightness equal to brightness demand
AEC Automatic Exposure Control. Exposure cut off technique which uses
the brightness signal to cut the exposure
CAN Controller Area Network. A network used for localized control.
CPU Control Processor Unit. Microprocessor and peripherals which run
the software/firmware
EPLD Erasable Programmable Logic Device.
EMC Electro Magnetic Compatibility. The EMC function prevents the gen-
erator from polluting the power source.
FPGA Field Programmable Gate Array. It is programmed by the CPU core
after the reset and handles all the exposure control logic including
the system interface real–time lines.
HV Ripple High voltage variations due to inverter current pulses. Typically a
few percent.
State Machine Software or hardware function which handles the state of a system
and authorize to go to the next state upon reception of specific
events.
IGBT Insulated gate bipolar transistor. A type of power switch
Ilp HV power inverter parallel resonant current; current in the parallel
inductor
Ilr HV power inverter serial resonant current; current in the serial
inductor.
MOS Metal Oxide Semiconductor. A type of power switch
OGP On Gantry Processor. Unit which drives the generator in CT sys-
tems
PDU Power Distribution Unit
RMS Root Mean Square
1-1 X-RAY GENERATOR

1-2
JEDI GENERATOR / TWIN FUNCTIONAL ARCHITECTURE REV 1
GE HEALTHCARE
System System Control Bus Illustration 1-1

Interface
Low Voltage
kV Control Heater heater supply Rotation
Power
JEDI HIGH LEVEL BOLCK DIAGRAM
bus
Supply
DC Bus
AC/DC
1-2
rotation phases
Jedi Generator / TWIN Functional Architecture
High Voltage High Voltage HV Cables

EMC Inverter Tank
Filter
X-Ray Tube 1
1 phase
3 phase power
tube cooling
input
input
X-RAY GENERATOR
5116384
THEORY OF OPERATION
REV 6 5116384
SECTION 2 - GENERAL DESCRIPTION - II
2-1 INTRODUCTION
Jedi is the engineering name for a family of compact high frequency X-Ray generators. This generator
family covers a wide range of applications from mobile equipment up to vascular systems:
• JEDI 12-25 kW: Mobile applications
• JEDI 24-48 kW: CT applications
• JEDI 32-50 kW: RAD applications
• JEDI 50-65-80 kW: RF applications
• JEDI 100 kW: VASCULAR applications
2-2 STANDARD FEATURES

Jedi is a family of 150 kV generators operating from 12 kW up to 100 kW for all the major radiological,
fluoroscopic and CT applications. The family handles 1 ms to continuous exposures with tube currents
ranging from 0mA up to 1000 mA.
The generators feature the very latest technology available:
• Constant potential independent of line voltage variations
• Power generation by a high-frequency converter (High voltage ripple: 40 kHz-140 kHz)
• Distributed micro-processor controlled functions (CAN bus)
Other features include:
• Single phase, three phase or battery power source
• Very low kV and mA ripple, excellent accuracies and dose reproducibility
• Compatible with a wide range of tubes, high speed or low speed, can supply up to 3 different tubes.
Thermal load interactive integrator ensuring optimum use of the heat protection curve of the x-ray
tube
• Available in various packaging configurations: gantry, under-table, cabinet
• Serviceability: high reliability, fast installation (no generator calibration), application error codes
ensure fast troubleshooting
• Meets CE marking (and in particular EMC), IEC, UL, CSA, MHW regulations (if required)
• Optional pulsed fluoroscopy
2-1 X-RAY GENERATOR

REV 6 5116384
2-3 APPLICATIONS
RAD Surgery RF Vascular/ CT

Cardiac
3 Points Mode x x x
2 Points Mode x x x
1 Point Mode x x x
0 Point Mode x x
AEC x x x
Tomography x x
AET x x
Continuous/Pulsed Fluoros- x x x
copy
Rad Exposures x
Cinema 30 fr/s x
Cinema 90 fr/s x
ABC x x
Variable mA Scans x
Low mA Fluoroscopy x
Legend:
- AEC - Automatic Exposure Control
- AET - Automatic Tomographic Exposure
- ABC - Automatic Brightness Control in fluoroscopy
2-2 X-RAY GENERATOR

REV 6 5116384
2-4 ARCHITECTURE
The Jedi family is composed of 3 elements:
2-4-1 Kernel
• High voltage chain composed of kV control, HV power inverter and HV tank
• Anode rotation function
• Tube filaments heater function
• Control bus for communication between the functions
• DC bus for power distribution to each function
• Input voltage to DC conversion: AC/DC function
• Low voltage power supply
• Application software, running on the kV control board
These functions are the Jedi core. They are present in all versions of the generator.
A function can be unique for all products, or can have several different releases based on product spec-
ification.
Examples:
The anode rotation function is available in 2 releases:
• low speed rotation for applications where the tube has a max rotation of 3000 rpm
• high speed/low speed rotation for applications where at least one of the tubes can use
8000-10000 rpm
The control bus is unique.
2-4-2 Options Depending on the Application

• A System Interface which can be:
- CT interface
- RAD interface (console interface, room interface, AEC management present or not)
- ATLAS interface
• EMC function
• Grid function (RF, vascular)
• Bias function (RF, vascular)
• Tube management (2 tubes or 3 tubes option)
2-3 X-RAY GENERATOR

REV 6 5116384
2-4-3 A Packaging Architecture

The packaging architecture consists in a set of boxes which can be put together in several ways to make
Jedi fit either in a cabinet, or a console foot, or a table foot. The boxes can also be split in 2 units distant
of several meters (example: CT gantry).
The boxes normally consist of the following:
Auxiliaries Box
• Rotation function
• Heater function
• Low voltage power supply (which can also be in the AC/DC box)
This box is always present.
Power Box
• HV tank
• HV power inverter
• kV control
• System interface (for the less complex system interface)
AC/DC Box
• MC filter (optional)
• AC/DC function
• Low voltage power supply (which can also be in the auxiliaries box)
2-4 X-RAY GENERATOR

REV 6 5116384
Illustration 2-1 Jedi Generator / Packaging Architecture
Inverter Assembly
Dual Snub
AC/DC
Tube Board
Gate Command
HV Board
+ -
KV Measure HV Tank Rectifier

Block
CT
Inter KV Control Board
face
EMC Filter
POWER BOX AC/DC BOX
LVPS Rotation Board

Heater Board Board
Rotation Rotation
Capacitor Capacitor
AUXILIARIES BOX
2-5 X-RAY GENERATOR

2-6 X-RAY GENERATOR

REV 1 5116384
SECTION 3 - TYPICAL SIGNALS
3-1 JEDI TYPICAL SIGNALS

The following table describes the main signals of the generator. For each of them, typical values are pre-
sented for the main applications:
Signal/Application PoSpeed AII/EII/FII Values

Anode Rotation:
Phase P current during high speed run 2 A peak / 144 Hz
Phase A current during high speed run 2 A peak / 144 Hz
Filament Drive:
Inverter current in standby 2.5 A 3.3 A peak / 35 kHz
Heater DC input voltage in standby 160V
kV Control:
DC bus measure at 400 VAC 560 V
ILR at full power at 400 VAC 300 A peak / 50 kHz
ILR at min power at 400 VAC 80 A peak / 25 kHz
ILP at full power at 400 VAC 150 A peak / 50 kHz
ILP at min power at 400 VAC 150 A peak / 25 kHz
3-1 X-RAY GENERATOR

3-2 X-RAY GENERATOR

REV 2 5116384
APPENDIX A - SYMBOLS AND CLASSIFICATION
Symbol Publication Description

417-5032 Alternating Current
335-1 Three-phase Alternating Current

3
335-1 Three-phase Alternating Current with neutral

conductor
3N
Direct Current
417-5019 Protective Earth (Ground)
348 Attention, consult ACCOMPANYING DOCUMENTS
417-5008 OFF (Power: disconnection from the mains)
417-5007 ON (Power: connection to the mains)
Warning, HIGH VOLTAGE
Emergency Stop
A-1
REV 2 5116384
Symbol Publication Description
Type B
417-5339 X-ray Source Assembly Emitting
417-5009 Standby
Start
Table Set
Abort
Intercom
(on Operator Console)

Power On: light on
Standby: light off
Warning sign :
Radiation of Laser Apparatus
A-2
REV 2 5116384
Symbol Description
Microphone (Mic)
Contrast
Brightness
50C System storage prior to installation:

Maintain storage temperature between -10 C and +50 C
-10C
System storage prior to installation:

Maintain non-condensing storage
humidity within 10~90%
DO NOT store system longer than 90 days
Humidity 10-90%
Excluding Condensation
Air Pressure System storage and shipment:

Maintain Air Pressure between 700 and 1060hPa
700-1060hPa
A-3
REV 2 5116384
CLASS 1 EQUIPMENT
Any permanently installed equipment containing operator or patient accessible surfaces must provide backup
protection against electric shock,in case the BASIC INSULATION fails. In addition to BASIC INSULATION,Class1
equipment contains a direct connection to a PROTECTIVE(EARTH) CONDUCTOR which prevents shocks when a
person touches a broken piece of equipment or touches two different equipment surfaces simultaneously.
TYPE B EQUIPMENT
CLASS I, II, or III EQUIPMENT or EQUIPMENT with INTERNAL ELECTRICAL POWER SOURCES provide an
adequate degree of protection against electric shock arising from (allowable) LEAKAGE CURRENTS or a
breakdown in the reliability of the protective earth connection.
ORDINARY EQUIPMENT
Enclosed EQUIPMENT without protection against the ingress of water.
OPERATION 0f EQUIPMENT
CONTINUOUS OPERATION WITH INTERMITTENT LOADING.
Operation in which EQUIPMENT is connected continuously to the SUPPLY MAINS.The stated permissible loading
time is so short that the long term on-load operating temperature is not attained.The ensuing interval in loading is,
however, not sufficiently long for cooling down to the long term no-load operating temperature.
EQUIPMENT not suitable for use in the presence of a FLAMMABLE ANESTHETIC MIXTURE WITH AIR or WITH
OXYGEN or NITROUS OXIDE
CLEANING
The system is NOT WATERPROOF. It is NOT designed to protect internal components against the ingress of
liquids.Clean external system surfaces(Gantry,table,consoles and accessories)with a soft cloth dipped in hot water
and wrung DAMP/DRY. (NOT dripping!) IF NECESSARY, use only mild (dish washing liquid) soap to remove dirt.
NOTICE
Avoid damage to equipment! Some îspray and wipeîcleaners etch and permanently cloud
clear plastic surfaces!! Use only warm water and mild liquid soap to clean surfaces.
A-4
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GE Healthcare

HiSpeed Dual, ProSpeed FII

Copyright © 2004-2012 by General Electric Company

VÝSTRAHA • Tento provozní návod existuje pouze v anglickém jazyce.

ADVARSEL • Denne servicemanual findes kun på engelsk.

WAARSCHUWING • Deze onderhoudshandleiding is enkel in het Engels verkrijgbaar.

WARNING • This Service Manual is available in English only.

HOIATUS • Käesolev teenindusjuhend on saadaval ainult inglise keeles.

VAROITUS • Tämä huolto-ohje on saatavilla vain englanniksi.

ATTENTION • Ce manuel de service n'est disponible qu'en anglais.

WARNUNG • Diese Serviceanleitung existiert nur in Englischer Sprache.

ΠΡΟΕΙ∆ΟΠΟΙΗΣΗ • Το παρόν εγχειρίδιο σέρβις διατίθεται στα αγγλικά μόνο.

FIGYELMEZTETÉS • Ezen karbantartási kézikönyv kizárólag angol nyelven érhető el.

AÐVÖRUN • Þessi þjónustuhandbók er eingöngu fáanleg á ensku.

AVVERTENZA • Il presente manuale di manutenzione è disponibile soltanto in inglese.

경고 • 본 서비스 지침서는 영어로만 이용하실 수 있습니다 .

BRDINJUMS • Šī apkalpes rokasgrāmata ir pieejama tikai angļu valodā.

ĮSPĖJIMAS • Šis eksploatavimo vadovas yra prieinamas tik anglų kalba.

ADVARSEL • Denne servicehåndboken finnes bare på engelsk.

OSTRZEŻENIE • Niniejszy podręcznik serwisowy dostępny jest jedynie w języku angielskim.

ATENÇÃO • Este manual de assistência técnica só se encontra disponível em inglês.

ATENÇÃO • Este manual de assistência técnica só se encontra disponível em inglês.

ATENŢIE • Acest manual de service este disponibil numai în limba engleză.

ОСТОРОЖНО! • Данное руководство по обслуживанию предлагается только на английском

UPOZORENJE • Ovo servisno uputstvo je dostupno samo na engleskom jeziku.

UPOZORNENIE • Tento návod na obsluhu je k dispozícii len v angličtine.

ATENCION • Este manual de servicio sólo existe en inglés.

VARNING • Den här servicehandboken finns bara tillgänglig på engelska.

DIKKAT • Bu servis kilavuzunun sadece ingilizcesi mevcuttur.

ПРЕДУПРЕЖДЕН • Това упътване за работа е налично само на английски език.

UPOZORENJE • Ovaj servisni priručnik dostupan je na engleskom jeziku.

OPOZORILO • Ta servisni priročnik je na voljo samo v angleškem jeziku.

CERTIFIED ELECTRICAL CONTRACTOR STATEMENT

IMPORTANT! . . . X-RAY PROTECTION

LITHIUM BATTERY CAUTIONARY STATEMENTS

OMISSIONS & ERRORS

LIST OF EFFECTIVE PAGES

Tab - Section Page REV 3 (Table/Gantry) i 1

Title page 11 General Description 1-1 to 1-3 1

Update the number of converter board (A, B) for MDAS. (Sec. 3)

OC Added Advantech PC contents. (Sec. 1, Sec. 2)

8 12/29/08 Added new languages for PT-BR (Portuguese-Brazil) and SR (Serbian).

7 10/24/07 OC Added HP8400 information. (Sec. 1 & Sec. 2)

6 04/16/07 OC Updated OC Block Diagram. (Sec. 1)

X-ray Generator Updated illustration of Jedi Generator / Packaging Architecture. (Sec. 2)

3 03/04/06 System Updated Illustration 1-1 System Block Diagram (Sec. 1)

Added: Illustration of Detector Channel Distribution for GDAS (Sec. 2)

2 07/25/05 OC Add HPxw8200 Host CPU contents in OC section 2.

1 10/15/04 Initial Release.

SECTION 1 - GENERAL DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

SECTION 2 - POWER DISTRIBUTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

SECTION 3 - SCAN OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

SECTION 1 - GENERAL DESCRIPTION

1-2 SYSTEM OVERVIEW

Illustration 1-1 System Block Diagram (for system with MDAS)

TG/OC Axial Drive

TGP SUB Cover Switch

Step Motor DASIFN

Table OC 5" MOD (Option)

Illustration 1-2 System Block Diagram (for system with GDAS)

Twin DAS DCP2 HSDCD HSDCD

Step Motor Z axial Photo Sensor Servo Servo Motor

TGP SUB Cover Switch