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A C ircu it for All Seasons

Behzad Razavi

The Cross-Coupled Pair—Part III

I
In this article, we study applications
of the cross-coupled pair (XCP) in
analog and RF circuits. The XCP can
serve as a negative resistance or a
negative impedance converter in
VCC VCC VDD

small-signal operation, or a regenera-


tive circuit in large-signal operation.

XCP as Negative Resistance


The XCP finds wide application as a (a) (b) (c)
negative resistance in the design of
oscillators [1]–[6]. It is interesting to Figure 1:  The evolution of oscillators from (a) multivibrator to (b) relaxation oscillator to
(c) today’s LC oscillator.
note how Abraham and Bloch’s multi-
vibrator [Figure 1(a)] evolved to the
“relaxation oscillator” [Figure 1(b)] gain, Vout /DI D, equal to 1.12 times the the gain. The key point here is that
and to today’s differential LC oscilla- gain under equilibrium (when DI D = 0) . the closer g m3, 4 R D is to unity, the
tor [Figure 1(c)]. While the first two It follows that less transconductance reduction can
operate with hysteresis, the last one be tolerated and the more nonlinear
g m3, 4 0.12 , (1)
need not. = 1.12 - the circuit.
g m3, 4, eq g m3, 4, eq R D
As a negative resistance, the XCP The cross-coupling loop of two
serves other purposes as well. For where g m3, 4, eq denotes the equilibrium transistors need not traverse their
example, as shown in Figure 2(a), transconductance of the XCP devices. gates and drains; the bulk can sup-
it can increase the voltage gain of This expression gives the drop in plant the gate as the controlling ter-
a differential pair. In this case, the g m3, 4 as the output approaches its minal. Illustrated in Figure 3(a) [7],
loop gain (g m3, 4 R D) 2, is chosen less 1-dB compression point. For exam- the idea is to return the drain volt-
than unity to avoid latch-up. Note ple, if g m3, 4, eq R D = 0.75, then g m3, 4 / age of one transistor to the bulk of
that the XCP also provides a path g m3, 4, eq = 0.96, i.e., only a 4% reduction the other so as to create a negative
for the bias current of M 1 and M 2, in g m leads to a 1-dB compression in resistance given by R eq = - 2/g mb,
allowing a higher value for R D, but
it does consume substantial voltage
headroom ^| VGS3, 4 |h. VDD VDD
In some applications, the XCP non- M3 M4
linearity may be of concern. We can RD RD −2 RD
quantify this effect with the aid of the
RD gm 3,4
equivalent circuit in Figure 2(b), where Vout
the input pair is assumed linear. We
M1 M2 Vout
can study the output compression Vin
by finding the condition under which
+∆I –∆I
Vout /DI falls by 1 dB (≈12%). Writ- Iss
ing Vout = DI D [(2R D) | | (- 2/g m3, 4)] =
DI D [2R D / (1 - g m3, 4 R D)], we set the (a) (b)

Digital Object Identifier 10.1109/MSSC.2014.2369332 Figure 2:  (a) The addition of XCP to raise the gain and (b) the equivalent circuit for small-
Date of publication: 11 February 2015 signal analysis.

10 w i n t e r 2 0 15 IEEE SOLID-STATE CIRCUITS MAGAZINE


where g mb ^. 0.2g mh denotes the
transconductance with respect to the VDD VDD = 0.5 V
body terminal. The two transistors Vb Vb
+ –
Vin
Vin Vb Vb
are, of course, placed in separate M1 M2 M3 M2 M4
M1
n -wells. Also, the drain voltages
must remain above approximately Vout
Req
VDD - 0.5 V to ensure the drain-well
(a) (b)
forward bias negligibly affects the
transistors’ performance.
Cross coupling through the bulk Figure 3:  (a) An XCP using the bulk terminal and (b) the first stage of an op amp using the
XCP.
proves useful in low-voltage designs.
Shown in Figure 3(b) is an amplifier
example [7], where VDD . 0.5 V and
the XCP raises the voltage gain. Here, VDD VDD
the input common-mode (CM) level
and Vb can be near zero while the four L1 L2 L1 L2
RL RL
transistors are accorded sufficient
VDS so as to operate in the saturation
+ – + –
region. (The CM feedback circuit [7] is Vin Vin Vin Vin
not shown.) We point out that, in the M1 M2 M1 M2
M3 M4
presence of mismatches, the XCP can
(a) (b)
regenerate and cause latch-up if its
loop gain is equal to unity or higher.
Figure 4:  (a) A simple PA output stage and (b) the use of XCP to reduce input capacitance.
The design in [7] employs a replica
loop to avoid this situation.

Output Stage
VDD
In this article, we
study applications RD RD
Vout
of the cross-coupled
M1 M2
pair in analog and X Y
RF circuits.
Vin

M3 M4
The XCP has also been used to
improve the performance of RF CC
power amplifiers (PAs). In the simple
output stage shown in Figure 4(a), M 1
and M 2 are wide enough to carry a NIC
high current, thus presenting a large
input capacitance. The preceding Figure 5: The use of NIC to increase bandwidth in a broadband transmitter.
stage therefore tends to consume a
high power. This issue can be alle-
viated if some of the input capaci-
tance is driven by the output port, Termination
i.e., if a portion of W 1, 2 is reconfig- Resistors
ured as an XCP [Figure 4(b)] [8]. In
the limit, M 3 and M 4 form an oscil-
lator along with L 1 and L 2 that is
ESD

ESD

injection-locked to the input signal M1 M2


[8]. Such an arrangement provides
efficient amplification for constant- CC
envelope signals. Interestingly, the
XCP also helps create CM stability
here by presenting a CM impedance
equal to 1/ (2g m3, 4) to ground. Figure 6: The use of NIC to increase bandwidth of I/O interfaces.

IEEE SOLID-STATE CIRCUITS MAGAZINE w i n t e r 2 0 15 11


of C C must therefore be chosen low
VDD enough to avoid these effects.
Another interface exhibiting a high
L1 L2 capacitance occurs at I/O pads that
incorporate electrostatic discharge
X Y protection and hence limit the band-
M1 M2 width. As shown in Figure 6, an NIC
M3 M4
can be tied to these pads, cancelling
CC
part of the capacitance. This circuit
can be combined with a T-coil for fur-
ther bandwidth enhancement [10].
The NIC finds other interesting
applications, for example, in digi-
Figure 7: The use of NIC as a fine tuning element.
tally controlled oscillators requir-
ing a fine frequency step size [11].
XCP as Negative Impedance performance. If only C GS is consid- Consider the arrangement shown in
­Converter ered, the admittance presented by Figure 7, where M 1 and M 2 act as an
As mentioned in the first article in the NIC emerges as [9] oscillator, and M 3 and M 4 as an NIC
this series, the XCP can operate as an [11]. It is possible to “attenuate” the
impedance negator [a.k.a. a negative C GS s effect of C C at X and Y by a large
impedance converter (NIC)]. The sim- 1- factor, thus providing fine frequency
gm
YNIC = - . (2)
C GS
plicity of this topology makes it supe- ( + 2) 1 + 1
rior to conventional NICs that employ CC gm CC s
op amps. A common application is to The XCP finds wide
create a negative capacitance that For frequencies well below the tran- application as a
can cancel the positive capacitance sistors’ fT (. 2rg m /C GS ), the second negative resistance
seen at a port, thereby improving the term in the numerator is negligible, in the design of
speed. Figure 5 depicts an example in yielding a capacitance equal to - C C oscillators.
broadband transmitter design [9]. in series with a resistance equal to
With the high current necessary - (C GS /C C + 2) /g m . The key point
in the output stage, M 1 and M 2 tend here is that C GS raises the magni- tuning. This can be seen by express-
to be wide, exhibiting a large input tude of the series resistance and ing the NIC admittance from (2), with
capacitance. The NIC cancels some hence lowers the Q of the negative C GS = 0, as
of this capacitance, thus increasing capacitance.
the bandwidth at X and Y. Second, in Figure 5, the NIC can - 2g m C 2C ~ 2
YNIC (j~) =
The NIC design entails two issues. form a relaxation oscillator with R 1 4C 2C ~ 2 + g 2m

First, at high speeds, the capaci- and R 2 or at least cause significant g 2m jC C ~
- 2 2 2 ,
(3)
tances of M 3 and M 4 affect the NIC ringing in broadband data. The value 4C C ~ + g m

and choosing 4C 2C ~ 2 & g 2m so that


VDD
gm g 2m
YNIC (j~) . - + . (4)
2 4jC C ~
RL RL In these equations, g m denotes the
CL transconductance of M 3 and M 4 . We
CL
X Y observe that the NIC presents two
parallel impedances equal to - 2/g m
2
M3 M4 and 4jC C ~/g m , with the latter serv-
Vin1 Vin2
ing as a large inductor. If this induc-
M1 M2 tance is much greater than L 1 and L 2
in Figure 7, then moderate steps in
C C translate to small steps in the
CK CK oscillation frequency. Another inter-
M5 M6
pretation is to write the second term
as jC C ~ [g m / (2C C ~)] 2 and conclude
that the value of C C is reduced by a
Figure 8:  Regenerative amplification provided by the XCP. factor of [g m / (2C C ~)] 2 [11].

12 w i n t e r 2 0 15 IEEE SOLID-STATE CIRCUITS MAGAZINE


The XCP is an integral part of the middle, then the latch decision [4] M. A. Sanduleanu and J. P. Frambach,
“1GHz tuning range, low phase noise LC
comparators and will be studied in is “smeared.” oscillator with replica biasing common-
that role in the next issue. 2) A divide-by-two circuit incor- mode control and quadrature outputs,” in
Proc. European Solid-State Circuits Conf.,
porates two instances of a CML Sept. 2001, pp. 506–509.
Questions for the Reader latch with inductive peaking. Can [5] M. Soyuer, J. K. A. Burghartz, and M. D.
1) Can we use the NIC in a PA pre- the resistance in series with the Hulvey, “A 3-V 4-GHz nMOS voltage-con-
trolled oscillator with integrated reson-
driver to cancel the input capaci- inductors be reduced to zero? ator,” IEEE J. Solid-State Circuits, vol. 37,
tance of the output stage? With a zero resistance, the pp. 2042–2045, Dec. 2002.
[6] A. Mazzanti and P. Andreani, “Class-C har-
2) How does the thermal noise contrib- divider reduces to an injection- monic CMOS VCOs, with a general result
uted by M 1 and M 2 in Figure 3(b) locked quadrature LC oscillator, on phase noise,” IEEE J. Solid-State Circuits,
vol. 43, no. 12, pp. 2716–2729, Dec. 2008.
to Vout compare to that by a regu- potentially operating at a higher [7] S. Chatterjee, Y. Tsividis, and P. Kinget, “0.5-V
lar XCP? speed but with a much more limited analog circuit techniques and their applica-
tion in OTA and filter design,” IEEE J. Solid-
You can share your thoughts by lock range. State Circuits, vol. 40, pp. 2373–2387, Dec.
sending me e-mail. 2005.
[8] K. C. Tsai and P. R. Gray, “A 1.9-GHz, 1-W
CMOS class-E power amplifier for wire-
Answers to Last Issue’s Questions References less communications,” IEEE J. Solid-State
[1] P. Basedeau and Q. Huang, “A 1-GHz 1.5-V Circuits, vol. 34, pp. 962–970, July 1999.
1) Must we turn off M 1 and M 2 in monolithic LC oscillator in 1-μm CMOS,” [9] S. Galal and B. Razavi, “10-Gb/s limiting
in Proc. European Solid-State Circuits amplifier and laser/modulator driver in
Figure 8 as we activate the XCP Conf., Sept. 1994, pp. 172–175. 0.18um CMOS technology,” IEEE J. Solid-State
even if the circuit is to operate as [2] B. De Muer, M. Borremans, M. Steyaert, Circuits, vol. 38, pp. 2138–2146, Dec. 2003.
an amplifier rather than as a latch? and G. Li Puma, “A 2-GHz low-phase-noise [10] S. Galal and B. Razavi, “40-Gb/s ampli-
integrated LC-VCO set with flicker noise fier and ESD protection circuit in 0.18 μm
An input that is changing at a upconversion minimization,” IEEE J. Solid- CMOS technology,” IEEE J. Solid-State Cir-
high rate may affect the decision State Circuits, vol. 35, pp. 1034–1038, July cuits, vol. 39, pp. 2389–2396, Dec. 2004.
2000. [11] L. Fanori, A. Liscidini, and R. Castello, “3.3GHz
made by the latch if M 1 and M 2 are [3] W. De Cock and M. Steyaert, “A CMOS DCO with a frequency resolution of 150Hz for
not turned off. For example, if Vin1 is 10GHz voltage controlled LC-oscillator all-digital PLL,” in Int. Solid-State Circuits Conf.
with integrated high-Q inductor,” in Proc. Dig. Tech. Papers, Feb. 2010, pp. 48–49.
less than Vin2 at the beginning of the European Solid-State Circuits Conf., Sept.
clock transition but exceeds Vin2 in 2001, pp. 498–501. 

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