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APW8823

System Power PWM Controller with Economy Standby Mode

Features Simplified Application Circuit


• Wide Input voltage Range from 5.5V to 25V VIN EN1 EN2

• Provide 5 Independent Outputs with ±1.0% Accu-


5.5V~25V

VLDO5 VLDO3
racy Over-Temperature LDO5 LDO3
Q1 Q3
- PWM1 Controller with Adjustable (2V to 5.5V) Out- VOUT1 L1 L2 VOUT2
put
PWM1 PWM2
- PWM2 Controller with Adjustable (2V to 5.5V) Out-
Q2 Q4
put Charge Pump
- 100mA Low Dropout Regulator (LDO5) with Fixed
5V Output C1 D2 D3 C3 D4 VCP

- 100mA Low Dropout Regulator (LDO3) with Fixed D1 C2 C4


3.3V Output
- 250kHz Clock Signal for 15V Charge Pump (Used General Description
PWM1 as Its Power Supply) The APW8823 integrates dual step-down, constant-on-
• Excellent Line/Load Regulations about ±1.5% over time, synchronous PWM controllers (that drives dual N-
temperature range at PWM Channels channel MOSFETs for each channel) and two low drop-
• Low Consumption in Standby Mode out regulators as well as various protections into a chip.
• 2Cells Input Battery Support The PWM controllers step down high voltage of a battery
• Built in POR Control Scheme Implemented to generate low-voltage for NB applications. The output
• Constant On-Time Control Scheme of PWM1 and PWM2 can be adjusted from 2V to 5.5V by
• Built in Soft Start for PWM Outputs and Soft Stop setting a resistive voltage-divider from VOUTx to GND.
for PWM Outputs and LDO Outputs The linear regulators provide 5V and 3.3V output for
• Integrated Bootstrap Forward P-CH MOSFET standby power supply. The linear regulators provide up
• High Efficiency over Light to Full Load Range to 100mA output current. When the PWMx output voltage
(PWMs) is higher than LDOx bypass threshold, the related LDOx
• Built in Power Good Indicators (PWMs) regulator is shut off and its output is connected to VOUTx
• 60% Under-Voltage and 115% Over-Voltage Protec- by internal switchover MOSFET. It can save power
tions (PWM) dissipation. The charge pump circuit with 250kHz clock
• Adjustable Current-Limit Protection (PWMs) driver uses VOUT1 as its power supply to generate ap-
- Using Sense Low-Side MOSFET’s RDS(ON) proximately 15V DC voltage.
• Over-Temperature Protection The APW8823 provides excellent transient response and
• 3mmx3mm Thin QFN-20 (TQFN3x3-20) package accurate DC output voltage in either PFM or PWM Mode.
• Lead Free and Green Device Available (RoHS In Pulse-Frequency Mode (PFM), the APW8823 provides
Compliant) very high efficiency over light to heavy loads with loading-
modulated switching frequencies. The Forced-PWM
Mode works nearly at constant frequency for low-noise
requirements. The unique ultrasonic mode maintains the
switching frequency above 25kHz, which eliminates noise
in audio application.

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.

Copyright  ANPEC Electronics Corp. 1 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

General Description (Cont.) Applications


The APW8823 has individual enable controls for each
• Notebook and Sub-Notebook Computers
PWM channels. Pulling both EN1/2 pin of APW8823A/
• Portable Devices
C/G low shuts down the all of outputs unless LDO3 output.
• DDR1, DDR2, and DDR3 Power Supplies
The LDO3 and LDO5 of APW8823B/D/E/F/H are always
• 3-Cell and 4-Cell Li+ Battery-Powered Devices
on standby power.The APW 8823 is available in a
• Graphic Cards
TQFN3x3-20 package.
• Game Consoles
• Telecommunications

Ordering and Marking Information

APW8823A Package Code


APW8823B QB: TQFN3x3-20
APW8823C Assembly Material Operating Ambient Temperature Range
APW8823D Handling Code I : -40 to 85 ° C
APW8823E Handling Code
Temperature Range
APW8823F TR : Tape & Reel
APW8823G Package Code Lead Free Code
APW8823H L : Lead Free Device G : Halogen and Lead Free Device

APW
APW8823A QB : 8823A XXXXX - Date Code
XXXXX

APW
8823B XXXXX - Date Code
APW8823B QB : XXXXX

APW
APW8823C QB : 8823C XXXXX - Date Code
XXXXX

APW
APW8823D QB : 8823D XXXXX - Date Code
XXXXX

APW
APW8823E QB : 8823E XXXXX - Date Code
XXXXX

APW
APW8823F QB : 8823F XXXXX - Date Code
XXXXX

APW
APW8823G QB : 8823G XXXXX - Date Code
XXXXX

APW
APW8823H QB : 8823H XXXXX - Date Code
XXXXX

Copyright  ANPEC Electronics Corp. 2 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Device VCLK A lwa ys ON- Soft- Start Curr ent


Swi tchin g Fr eque ncy SKIP Mod e
Number Function L DO Time L imit (I LIM)

APW882 3A Enab le by EN1 400K Hz / 4 75KHz Auto - Skip LDO3 0.9ms 50u A

APW882 3B Enab le by EN1 400K Hz / 4 75KHz Auto - Skip LDO3 & LDO5 0.9ms 50u A
Withou t VCLK Ultra-son ic / A uto Skip
APW 8823 C 400K Hz / 4 75KHz LDO3 0.9ms 50u A
Re place SKIPSEL Pin mo de se lectio n
APW 8823 D Enab le by EN1 400K Hz / 4 75KHz Auto - Skip LDO3 & LDO5 3.0ms 10u A

APW882 3E Enab le by EN1 300K Hz / 3 50KHz Ultra-son ic mod e LDO3 & LDO5 3.0ms 10u A

APW88 23F Enab le by EN1 300K Hz / 3 50KHz Auto - Skip LDO3 & LDO5 0.9ms 10u A

APW88 23G Enab le by EN1 300K Hz / 3 50KHz Auto - Skip LDO3 0.9ms 10u A

APW 8823 H Enab le by EN1 300K Hz / 3 50KHz Ultra-son ic mod e LDO3 & LDO5 0.9ms 10u A

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).

Pin Configuration
SKIPSEL
UGATE1
PHASE1

UGATE1
PHASE1
BOOT1

BOOT1
VCLK
EN1

EN1

20 19 18 17 16 20 19 18 17 16

ILIM1 1 15 LGATE1 ILIM1 1 15 LGATE1

FB1 2 APW8823A 14 BYP FB1 2 BYP


14
APW8823B
APW8823D
LDO3 3 Bottom
APW8823E
View 13 LDO5 LDO3 3 Bottom
APW8823C
View 13 LDO5
APW8823F
APW8823G
FB2 4 12 VIN FB2 4 12 VIN
APW8823H

ILIM2 5 11 LGATE2 ILIM2 5 11 LGATE2

6 7 8 9 10 6 7 8 9 10
POK

PHASE2

BOOT2

UGATE2

PHASE2

BOOT2

UGATE2
EN2

POK
EN2

TQFN 3X3-20
Top View

= GND and Thermal Pad (connected to GND plane for better heat dissipation)

Copyright  ANPEC Electronics Corp. 3 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Absolute Maximum Ratings (Note 1)


Symbol Param eter Ra ting Unit
VIN Inp ut Po we r Vol tag e (VIN to GND) - 0.3 ~ 28 V

V BOOT B OOT Supp ly Voltage (B OOT to PHASE) -0.3 ~ 7 V


VBOOT-GND B OOT Supp ly Voltage (B OOT to GND) - 0.3 ~ 35 V
UGATE Voltage (UGATE to PHASE)
-5 ~ VBOOT +5
V UG-PHASE <20 ns pu lse width V
-0.3 ~ VBOOT +0.3
>20 ns pu lse width
L GATE Voltage ( LGATE to GND)
-5 ~ V LDO5 +5
V LG-GN D <20 ns pu lse width V
-0.3 ~ V LDO5 +0.3
>20 ns pu lse width
P HASE Voltage (PHA SE to G ND)
- 5 ~ 35
VPHASE <20 ns pu lse width V
- 0.3 ~ 28
>20 ns pu lse width
A ll Oth er Pins (FBx, BY P, LDO5, LDO3, VCLK, ENx, IL IMx to
-0.3 ~ 6 V
GND)
o
TJ Maximum Junction Temp erature 1 50 C
o
T STG Storag e Temp erature -6 5 ~ 150 C
o
T SDR Maximum Lea d Sold ering Tempera tu re, 1 0 S econds 2 60 C

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.

Thermal Characteristics (Note 2)


Symbol Parameter Typical Value Unit
θJA Thermal Resistance -Junction to Ambient 65
o
θJC Thermal Resistance -Junction to Case 10 C/W

Note 2: θJA and θJC are measured with the component mounted on a high effective the thermal conductivity test board in free air. The
thermal pad of package is soldered directly on the PCB.

Recommended Operating Conditions


S ymbol Pa ram ete r Range Unit
V IN PWM1/2 Converter Input Vo ltag e 5.5 ~ 25 V
V OUT1 PWM1 Converter Ou tp ut Voltage 2 ~ 5 .5 V
V OUT2 PWM2 Converter Ou tp ut Voltage 2 ~ 5 .5 V
VLIMx I LIMx A djustment Ran ge (VILIMx-GN D) 0.2~2 V
C IN PWM1/2 Converter Input Ca pacito r ( ML CC) 10 ~ µF
C LDO LDO Ou tpu t Capacitor (MLCC) 1.0 ~ µF
o
TA Ambi ent Temper atu re -4 0 ~ 85 C
o
TJ Junction Tem perature -40 ~ 1 25 C

Copyright  ANPEC Electronics Corp. 4 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Electrical Characteristics
Refer to the typical application circuits. These specifications apply over VIN=12V and TA= -40 ~ 85oC, unless otherwise
specified. Typical values are at TA=25oC.
APW882 3
S ymbol P arame ter Test Conditions Unit
Min Typ Max

INPUT SUPPLY POWER


S uppl y curren t1, BYP=0V,
- 280 4 00 µA
E N1 =E N2 =5V, VFB1 = VFB2 = 2.05V
S uppl y curren t2, BYP=5V,
- 10 -
E N1 =E N2 =5V, VFB1 = VFB2 = 2.05V
I VIN VIN Sup ply Curr ent
Stand by curre nt1 , BYP=0 V,
- 20 - µA
E N1 =E N2 =0V (For APW88 23A /C/G )
Stand by curre nt2 , BYP=0 V,
- 40 -
E N1 =E N2 =0V (For APW88 23B /D/E /F/H)
UNDER VOLTAGE LOCK OUT PROTECTION (UV LO)
Rising Edge, PWM1/2 e nabl e 4.2 4.3 4.4 V
L DO5 UV LO thresho ld
Hyste resis - 0.1 - V
Rising Edge 2.9 3.0 3.1 V
L DO3 UV LO thresho ld
Hyste resis - 0.1 - V
Rising thresh old1, LDO3 ena ble
- 3.8 - V
(For APW8 823A /C/G)
Rising thresh old2, LDO3 & LDO5 en able
VIN POR th reshol d - 3.8 - V
(For APW8 823B /D/E/F/H)
Fall ing th reshold , LDOx sh utd own with
- 3.7 - V
soft stop
P WM CONTROLLERS
o o
V FB FBx Re fe rence Voltage T A = -40 C to 8 5 C 1.9 8 2.0 2.02 V
o
I FB FBx inpu t curren t V FBX=2.0V, T A=25 C -20 - 20 nA
E Nx Hi gh to V OU T 95% Regu lation,
- 0.9 - ms
L DO 5=5 V (For APW 8823 A/B/C/F/G /H)
T SS Soft-Start Tim e
V OUT 0% to 9 5% Regul ati on,
- 3.0 - ms
L DO 5=5 V(For A PW88 23D/E )
Soft-Stop Time E Nx low to VFBX<0 .1 V - 3.0 - ms
PW M1 S witchin g Fre quency
F SW1 V IN =20 V, PW M1 =5V 320 4 00 480
(For APW8 823A/B/C/D)
kHz
PW M2 S witchin g Fre quency
F SW2 V IN =20 V, PW M2 =3.33 V 380 4 75 570
(For APW8 823A/B/C/D)
PW M1 S witchin g Fre quency
F SW1 V IN =20 V, PW M1 =5V 240 3 00 360
(For APW8 823E/F/G/H)
kHz
PW M2 S witchin g Fre quency
F SW2 V IN =20 V, PW M2 =3.33 V 280 3 50 420
(For APW8 823E/F/G/H)
UGATEx Min imum O ff-Time 200 3 00 400 ns

Copyright  ANPEC Electronics Corp. 5 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Electrical Characteristics(Cont.)
Refer to the typical application circuits. These specifications apply over VIN=12V and TA= -40 ~ 85oC, unless otherwise
specified. Typical values are at TA=25oC.
APW882 3
S ymbol Parame ter Test Conditions Unit
Min Typ Max

LOW DRO UPUT LINE AR RE GULATO RS (LDO 5/LDO 3)


BYP=GND, 7V<VIN<25V,
L DO5 Output Vo lta ge 4.9 5.0 5.1 V
I LDO5<100mA
L DO3 Output Vo lta ge 7V <V IN <25V, I LDO3<100mA 3 .26 7 3.300 3 .3 33 V
VTHBYP5 L DO5 Bypass Thresho ld for VOUT1 Reg ulation Voltage Rising 4.55 4.7 4.85 V
VOUT1-to-LDO5 S witch On Hys. - 150 - mV
VOUT1-to-LDO5 S witch On
VOUT1 =5V, 50 mA - 1.5 3 Ω
Resista nce
VIN or BYP-to -LDO3 Input Switch
VIN=5 V or BYP=5V, 50mA - 1.5 3 Ω
On Re sistance
L DOx Curre nt Limi t VOUTx=G ND, LDOx = GND 15 0 200 2 50 mA
L DOx Disch arge O n Re sistance I LDOX=5 mA - 50 1 00 Ω
CHARGE P UMP CLOCK
o
V CLKH High l eve l vol tag e I VCLK=-10mA, LDO5 =5V, T A=25 C - 4 .9 2 -
V
VCL KL L ow level voltage I VCLK=10mA, LDO5=5V, TA=25 oC - 0 .0 6 -
o
FC LK Clock fre quen cy T A=2 5 C - 250 - kHz
P WM1/2 P ROTECTIONS
Ove r Vol tag e P rotecti on Thr eshold VFBX Risin g 110 115 1 20 %
Ove r Vol tag e Fa ult Pr opaga tio n
Delta vo lta ge=10mV - 3 - µs
Dela y
o
VILIMx=1 V, T A = 25 C
- 50 - µA
(For APW88 23A/B/C)
I LIM o
Curr ent L imit Curre nt So urce VILIMx=1 V, T A = 25 C
- 10 - µA
(For APW88 23D/E/F/G/H)
o o
On the ba sis of 2 5 C - 45 00 - ppm/ C
VILIMx =5V, Setting Curren t Limit
Maximum settin g voltage 20 5 250 - mV
Thresh pld
Curr ent l imit compara tor
(V IL IMx-GND-V PGND -PHASEx ), VILIMx=9 20mV -8 0 8 mV
o ffse t
Zero -Crossing Th reshold VPGND – PHASE -5 0 5 mV
Und er-Voltage Protectio n Thre sh old 55 60 65 %
Und er-Voltage Protectio n De bounce
- 25 - µs
Interval
From EN sig nal go hig h to PO K goes
- 1.4 -
Und er-Voltage Protectio n E nabl e hig h (For APW 8823A /B /C/F/G /H)
ms
Blanking Tim e From EN sig nal go hig h to PO K goes
- 4.7 -
hig h (For APW 8823 D/E)
Ove r-Temper atu re Protection T J Rising - 160 - o
C
Thre shold Hystere sis - 25 -

Copyright  ANPEC Electronics Corp. 6 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Electrical Characteristics(Cont.)
Refer to the typical application circuits. These specifications apply over VIN=12V and TA= -40 ~ 85oC, unless otherwise
specified. Typical values are at TA=25oC.
APW882 3
S ymbol Parame ter Test Conditions Unit
Min Typ Max

POWER G OOD
POK in fro m L owe r ( POK g oes h igh) 87 90 93

POK Thresho ld POK hyster esis - 10 - %


POK Upper Thresho ld (POK g oes
110 115 1 20
low)
From EN sig nal go hig h to PO K goes
- 1.4 -
hig h (For APW 8823A /B /C/F/G /H)
POK En able Delay ms
From EN sig nal go hig h to PO K goes
- 4.7 -
hig h (For APW 8823 D/E)
POK Sin k curren t VPOK = 500mV 2.5 7.5 - mA
POK Lea ka ge Curren t VPOK = 5V - 0.1 1 µA
LOGIC LEVE LS

En able - - 1.5
ENx In put Vo ltag e Thre shold V
shutdown 0.4 - -
ENx In put l eakage curre nt VEN =5V - 0.1 1 µA

SKIPSEL Input Volta ge Au to Skip with Ultraso nic - - 1.5 V


(For APW8 823C) Au tom atic PFM/PW M Mode 2.7 - - V
G ATE DRIVERS
UG Pull -Up Resistance VBOOTx – V UGATEx=250mV - 3 5 Ω
UG Sink Resistance VUGATEx – V PHASEx=25 0mV - 1.7 2.5 Ω
LG Pull-Up Resistance VLD O5 – V LGATEx=250m V - 3 5 Ω
LG Sink Resista nce VLGATEx – V PGN D=2 50mV - 1.0 2 Ω
UG fall ing to LG r isi ng - 20 - ns
Dea d Time
L G fa lling to UG r isi ng - 20 - ns
BO OTSTRAP S WITCH

VF Forwar d Vo lta ge VL DO5 – V BOOTx-GND, IF = 10mA - 0 .1 5 0.25 V


VBOOTx-GND = 30V, V PH ASEx = 25 V, V LDO5
IR Reverse Le akage - - 0.5 µA
= 5V

Copyright  ANPEC Electronics Corp. 7 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Pin Description
PIN
FUNCTION
NO . NAME

Cu rrent L imit Adju stment. Ther e is a n in ter nal 10µA curre nt source from LDO5 to ILIM1 a nd co nnected a
resistor from IL IM1 to G ND to set th e cu rrent l imit threshol d. The PGND-PHASE1 curre nt- limit thresho ld
1 ILIM1
is 1/8th th e vol ta ge set at ILIM1 ove r a 0 .2 to 2V ran ge. The lo gic curre nt limit th reshold is default to
250mV valu e if IL IM1 is 5 V.
Ou tpu t voltage feedb ack pin (PWM1) . It can use a resistive divider from VOUT1 to G ND to a djust the
2 FB1
outpu t fr om 2 V to 5.5V .
3.3V Li near Regu lato r Output. LDO3 can p rovide a to tal of 100mA , 3.3V exte rnal loa ds. Bypass to
3 LDO3
GND with a minimum of 1 .0u F ceramic capacitor fo r stabili ty.
Ou tpu t voltage feedb ack pin (PWM2) . It can use a resistive divider from VOUT2 to G ND to a djust the
4 FB2
outpu t fr om 2 V to 5.5V .
Curren t Limit Adjustment. There is an interna l 10 µA curren t source fro m L DO 5 to ILIM2 an d con necte d
a resistor from ILIM2 to GND to set the curren t limit thresh old. The PG ND- PHASE 2 cu rrent-limit
5 ILIM2 th
threshol d is 1/8 th e voltag e set at ILIM2 o ve r a 0.2 to 2V rang e. The logi c curren t limit thresh old is
defau lt to 250mV value if ILIM2 is 5V .
6 E N2 PWM2 En able. PWM2 is ena bled when E N2 =1. When EN2=0, PWM2 is in shutdown.
Po wer -Good O utput Pin of Both P WMs (Log ic A ND). POK is an open -drain o utp ut use d to ind ica te the
7 P OK
sta tus of the PWMx o utput voltag e. Conn ect th e POK in to +5V thro ugh a pull -high resistor.
Juncti on Poin t of The High -Side MOS FE T Sou rce, Ou tpu t Filter In ducto r a nd Th e Low-Sid e MO SFET
Dra in fo r PWM2. Conn ect this pin to the Sour ce of th e h igh-sid e MOSFET. PHAS E2 serves as th e
8 PHASE2
l ower su pply rail for the UGATE2 high -side gate driver. P HA SE2 is the curr ent-sense input fo r the
P WM2.
Sup ply Inp ut for Th e UGATE2 Ga te Driver and a n internal level- sh ift circu it. Co nnect to an exte rnal
9 B OOT2
ca pacito r to create a boosted volta ge suita ble to d rive a lo gic-level N-channe l MO SFET.
Ou tpu t of The High -Sid e MOS FET Driver for PWM2. Conn ect this pin to Gate of the h igh-side
10 UG ATE2
MOSFET.
Outpu t of The Lo w-Side MOSFET Dr ive r for PWM2. Connect this pin to G ate of the low-side MOSFET.
11 L GATE2
S wings fro m PGND to LDO5.
Ba ttery vo lta ge input pin. VIN powers line ar regu lators a nd is also used for th e co nstant on-time PWM
12 VIN on-time on e-shot circuits. Conne ct VIN to the b attery inpu t and b ypass with a 1µF capacitor fo r n oise
interferen ce.
5V Li near Regu lator Output. L DO 5 ca n p rovide a tota l of 100mA, 5V exte rnal loa ds. Whe n L DO5 is at
5V an d P WM1 output voltag e is over bypass thre shold and POK is in hi gh state and PW M1 is not in
13 LDO5
curren t limit con dition , the interna l L DO will shut down, a nd LDO5 ou tpu t pin con nects to VO UT1
throug h a 1.5 Ω switch . Bypass to GND with a minimum of 1.0u F ceramic capacitor fo r stability.
BYP is the input pin of switchover vo lta ge for the L DO5. This pin makes a di rect measureme nt of th e
14 BYP
PWM1 outpu t vo ltage.
Outpu t of The Lo w-Side MOSFET Dr ive r for PWM1. Connect this pin to G ate of the low-side MOSFET.
15 L GATE1
S wings fro m PGND to LDO5.
Ou tpu t of The High -Sid e MOS FET Driver for PWM1. Conn ect this pin to Gate of the h igh-side
16 UG ATE1
MOSFET.
Sup ply Inp ut for Th e UGATE1 Ga te Driver and a n internal level- sh ift circu it. Co nnect to an exte rnal
17 BOOT1
ca pacito r to create a boosted volta ge suita ble to d rive a lo gic-level N-channe l MO SFET.
Juncti on Poin t of The High -Side MOS FE T Sou rce, Ou tpu t Filter In ducto r a nd Th e Low-Sid e MO SFET
Dra in fo r PWM1. Conn ect this pin to the Sour ce of th e h igh-sid e MOSFET. PHAS E1 serves as th e
18 PHASE1
l ower su pply rail for the UGATE1 high -side gate driver. P HA SE1 is the curr ent-sense input fo r the
P WM1.
VCLK 250 kHz Cl ock Outpu t for 15V Charge Pump. ( Fo r APW8 823A/B/D/E/F/G/H)
19 PWM1 and 2 Controlle r Opera tio n Mod e Co ntrol. Con nect SKIP SEL to GND for auto skip mo de with
SKIPSEL
Ultra- so nic, an d to LDO3 or LDO5 for au to skip mo de with out u ltra -sonic. (For APW 8823 C)
20 EN1 PWM1 En able. PWM1 is ena bled when E N1 =1. When EN1=0, PWM1 is in shutdown.
Therma l Pad GND Sig nal Gro und for Th e IC.

Copyright  ANPEC Electronics Corp. 8 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Typical Operating Characteristics

Efficiency vs. Output Current Efficiency vs. Output Current


100 100
VOUT1=5V VOUT2=3.3V
98

96 95

94
90
Efficiency (%)

Efficiency (%)
92

90 85

88
80
86
VIN=7.4V VIN=7.4V
84
75 VIN=12V
VIN=12V
82
VIN=20V VIN=20V
80 70
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10

Output Current (A) Output Current (A)

Load Reguretion Load Reguretion


5.15 3.40
VOUT1=5V
VOUT2=3.3V

5.10
3.35
Output Voltage (V)

Output Voltage (V)

5.05

5.00 3.30

4.95

VIN=7.4V 3.25 VIN=7.4V


4.90
VIN=12V VIN=12V
VIN=20V VIN=20V
4.85 3.20
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Output Current (A) Output Current (A)
Line Regulation Line Regulation
5.15 3.40
VOUT1=5V VOUT2=3.3V

5.10

3.35
Output 1 Voltage (V)

Output 2 Voltage (V)

5.05

5.00

3.30
4.95

4.90
3.25

4.85 IOUT1=0A IOUT2=0A


IOUT1=6A IOUT2=7A
4.80 3.20
5 10 15 20 25 5 10 15 20 25
Input Voltage (V) Input Voltage (V)

Copyright  ANPEC Electronics Corp. 9 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Typical Operating Characteristics


Switching Frequency vs. Output Switching Frequency vs. Output
Current Current
600 600
VIN=7.4V VIN=7.4V

VIN=12V 500 VIN=12V

Switching Frequency (kHz)


500
Switching Frequency (kHz)

VIN=20V VIN=20V

400 400

300 300

200 200

100 100

VOUT1=5V VOUT2=3.3V
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Output Current (A) Output Current (A)

Switching Frequency vs. Input


Voltage Switching Frequency vs. Input
600 Voltage
600

500
Switching Frequency (kHz)

500
Switching Frequency (kHz)

400
400

300
300

200
200

100
VOUT1=5V 100
IOUT1=6A VOUT2=3.3V
0 IOUT2=7A
0
5 10 15 20 25
5 10 15 20 25
Input Voltage (V)
Input Voltage (V)

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Rev. A.3 - Sep., 2016
APW8823

Operating Waveforms

Enable Shutdown

VEN1=VEN2 VEN1=VEN2

1 1

VOUT1
VOUT1
2 2

VOUT2 VOUT2
3 3
VPOK VPOK
4 4

CH1: VEN1=VEN2, 5V/Div CH1: VEN1=VEN2, 5V/Div


CH2: VOUT1, 2V/Div CH2: VOUT1, 2V/Div
CH3: VOUT2, 2V/Div CH3: VOUT2, 2V/Div
CH4: VPOK, 5V/Div CH4: VPOK, 5V/Div
Time: 200us/Div Time: 1ms/Div

Output 1 Ripple Voltage Output 2 Ripple Voltage

VOUT1 VOUT2
1 1

VPHASE2
VPHASE1

2 2

IL1
IL2

3
3
CH1: VOUT2, 50mV/Div, AC
CH1: VOUT1, 50mV/Div, AC CH2: VPHASE2, 5V/Div
CH2: VPHASE1, 5V/Div CH3: IL2, 5A/Div
CH3: IL1, 5A/Div Time: 1us/Div
Time: 1us/Div

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Rev. A.3 - Sep., 2016
APW8823

Operating Waveforms

Line Transient Current Limit, R ILIM=15kΩ

VIN
VEN1
1
VOUT1
VOUT1 2
1
2
VOUT2
3 VPHASE 1
3
IL1

I L1
4 4

CH1: VIN, 5V/Div CH1: VEN1 , 5V/Div


CH2: VOUT1, 100mV/Div, AC CH2: VOUT1, 50mV/Div
CH3: VOUT2, 50mV/Div, AC CH3: VPHASE1, 5V/Div
CH4: IL1, 2A/Div CH4: IL1 , 10A/Div
Time: 1ms/Div Time: 200us/Div

Load Transient Load Transient

VIN=7.4V VIN=7.4V

VOUT1 VOUT2
1 1

2 IOUT1=0.6A~5.4A
2 IOUT2=0.7A~6.3A

CH1: VOUT1, 100mV/Div, AC CH1: VOUT1, 100mV/Div, AC


CH2: IOUT1, 2A/Div CH2: IOUT2, 2A/Div
Time: 100us/Div Time: 100us/Div

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Rev. A.3 - Sep., 2016
APW8823

Operating Waveforms

Over Voltage Protection Under Voltage Protection

VPOK

VPOK
1
VOUT1 1
VPHASE1
4
VOUT1
2 2
VPHASE1
3
IL1
3

IL1
4

CH1: VPOK, 5V/Div CH1: VPOK, 5V/Div


CH2: VOUT1, 2V/Div CH2: VOUT1, 2V/Div
CH3: VPHASE1, 10V/Div CH3: VPHASE1, 10V/Div
CH4: IL1, 10A/Div CH4: IL1, 10A/Div
Time: 100us/Div Time: 20us/Div

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Rev. A.3 - Sep., 2016
APW8823

Block Diagram

BOOT2 ADAPTIVE PWM FREQUENCY ADAPTIVE BOOT1


DEAD-TIME CONTROL DEAD-TIME
DIODE DIODE
EMULATION PHASE2 PHASE1 EMULATION
PWM/PFM TON PWM/PFM
UGATE2 Generator UGATE1
TRANSITION TRANSITION

PHASE2 PHASE1

ZC2 ZC1
SMPS2 SMPS1
PWM2 PWM2
LDO5 CONTROLLER LDO5
CONTROLLER
LGATE2 LGATE1

PGND

VIN
LDO UVLO
LDO3 LDO3 LDO5

THERMAL
LDO5
SHUTDOWN

BYP VIN

EN ENABLE
POWER ON SEQUENCE
CLEAR FAULT LATCH
EN2

EN1

PHASE1 PHASE2

ILIM2
CURRENT LIMIT VTHBYP5 BYP
CONTROLLER
ILIM1

SOFT START CHARGE PUMP


POK OSCILLATOR
VCLK

POK2 POK1

90% VFB2 90% VFB1

125% VFB2 125% VFB1


OV2 OV1
FAULT
LATCH
LOGIC
FB2 FB1
UV2 UV1

70% VFB2 70% VFB1

SOFT SOFT
LGATE2 LGATE1
STOP EN2 EN1 STOP
GND

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Rev. A.3 - Sep., 2016
APW8823

Typical Application Circuit


For APW8823A/B/D/E/F/G/H
VIN : 5.5V to 25V

LDO5 VIN LDO3


CLDO5 CLDO3
1µF 1µF
POK
RPOK
CIN1 200k CIN2
10µF BOOT1 BOOT2 10µF
Q1 RBOOT1 RBOOT2 Q3
APM4810 0 0 APM4810
LOUT1 UGATE1 UGATE2 VOUT2
VOUT1 CBOOT1 CBOOT2 LOUT2
4.7µH 2.2µH 3.3V/11A
5V/7A 0.1µF 0.22µF
PHASE1 PHASE2
COUT1 COUT2
Q2 Q4
330µF/10V
330µF/6.3Vx2
APM4810 APM4810 4m ohm
9m ohm LGATE1 LGATE2
GND GND
RTOP1 RTOP2
30k 13k
BYP

FB1 FB2

ILIM1 ILIM2
RILIM1 RILIM2
40k 40k
RGND1 ON ON RGND2
20k EN1 EN2 20k
OFF OFF
GND GND

VCLK
CCP3 VCP
CCP1 D2 100nF 15V
100nF
CCP4
CCP2 D3 D4
D1 1µF
100nF

For APW8823A/B/D/E/F/G/H(COUT used pure MLCC)

VIN : 5.5V to 25V

LDO5 VIN LDO3


CLDO5 CLDO3
1µF 1µF
POK
RPOK
CIN1 200k CIN2
10µF BOOT1 BOOT2 10µF
Q1 RBOOT1 RBOOT2 Q3
APM4810 0 0 APM4810
LOUT1 UGATE1 UGATE2 VOUT2
VOUT1 CBOOT1 CBOOT2 LOUT2
4.7µH 2.2µH 3.3V/11A
5V/7A 0.1µF 0.22µF
PHASE1 PHASE2
COUT1 COUT2
Q2 Q4
22µF/25V*4
22µF/25Vx4
APM4810 APM4810 MLCC
MLCC LGATE1 LGATE2
GND GND
RTOP1 RTOP2
30k 13k CFB2
BYP 100p
CFB1
100p

FB1 FB2

ILIM1 ILIM2
RILIM1 RILIM2
40k 40k
RGND1 ON ON RGND2
20k EN1 EN2 20k
OFF OFF
GND GND
VCLK
CCP3 VCP
CCP1 D2 100nF 15V
100nF
CCP4
CCP2 D3 D4
D1 1µF
100nF

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Rev. A.3 - Sep., 2016
APW8823

Typical Application Circuit


For APW8823C
VIN : 5.5V to 25V

LDO5 VIN LDO3


CLDO5 CLDO3
1µF 1µF
POK
RPOK
CIN1 200k CIN2
10µF BOOT1 BOOT2 10µF
Q1 RBOOT1 RBOOT2 Q3
APM4810 0 0 APM4810
LOUT1 UGATE1 UGATE2 VOUT2
VOUT1 CBOOT1 CBOOT2 LOUT2
4.7µH 2.2µH 3.3V/11A
5V/7A 0.1µF 0.22µF
PHASE1 PHASE2
COUT1 COUT2
Q2 Q4
330µF/10V
330µF/6.3Vx2
APM4810 APM4810 4m ohm
9m ohm LGATE1 LGATE2
GND GND
RTOP1 RTOP2
30k 13k
BYP

FB1 FB2

ILIM1 ILIM2
RILIM1 RILIM2
40k 40k
RGND1 ON ON RGND2
20k EN1 EN2 20k
OFF OFF
GND GND
SKIPSEL

PFM

Ultrasonic

For APW8823C (COUT used pure MLCC)

VIN : 5.5V to 25V

LDO5 VIN LDO3


CLDO5 CLDO3
1µF 1µF
POK
RPOK
CIN1 200k CIN2
10µF BOOT1 BOOT2 10µF
Q1 RBOOT1 RBOOT2 Q3
APM4810 0 0 APM4810
LOUT1 UGATE1 UGATE2 VOUT2
VOUT1 CBOOT1 CBOOT2 LOUT2
4.7µH 2.2µH 3.3V/11A
5V/7A 0.1µF 0.22µF
PHASE1 PHASE2
COUT1 COUT2
Q2 Q4
22µF/25V*4
22µF/25Vx4
APM4810 APM4810 MLCC
MLCC LGATE1 LGATE2
GND GND
RTOP1 RTOP2
30k 13k CFB2
BYP 100p
CFB1
100p

FB1 FB2

ILIM1 ILIM2
RILIM1 RILIM2
40k 40k
RGND1 ON ON RGND2
20k EN1 EN2 20k
OFF OFF
GND GND
SKIPSEL

PFM

Ultrasonic

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Rev. A.3 - Sep., 2016
APW8823

Function Description
Where FSW is the nominal switching frequency of the con-
Constant-On-Time PWM Controller with Input Feed-For-
verter in PWM mode. Similarly, the on-time of ultrasonic
ward
mode is the same with PFM mode.
The constant-on-time control architecture is a pseudo- The load current at handoff from PFM to PWM mode is
fixed frequency with input voltage feed-forward. This ar- given by:
chitecture relies on the output filter capacitor’s effective
series resistance (ESR) to act as a current-sense resistor,
1 VIN − VOUT
so the output ripple voltage provides the PWM ramp signal. ILOAD(PFM to PWM) = × × TON −PFM
In PFM operation, the high-side switch on-time controlled 2 L
by the on-time generator is determined solely by a one- VIN − VOUT 1 V
= × × OUT
shot whose pulse width is inversely proportional to input 2L F SW VIN
voltage and directly proportional to output voltage. In PWM
operation, the high-side switch on-time is determined by Linear Regulator (LDO3 and LDO5)
a switching frequency control circuit in the on-time gen-
The LDO3 and LDO5 regulators can supply up to 100mA
erator block. The switching frequency control circuit
for external loads. Bypass to GND with a minimum of 1uF
senses the switching frequency of the high-side switch
ceramic capacitor for stability. For APW8823A/C, When
and keeps regulating it at a constant frequency in PWM
VIN reaches POR rising threshold, only the VLDO3 is fixed
mode. The design improves the frequency variation and
3.33V in standby mode. For APW8823B/D/E, When VIN
is more outstanding than a conventional constant-on-
reaches POR rising threshold, the VLDO3 is fixed 3.33V
time controller, which has large switching frequency varia-
and the VLDO5 is fixed 5V in standby mode. Let’s see the
tion over input voltage, output current and temperature.
table2 “Power-Up Control Logics” for the detail descrip-
Both in PFM and PWM, the on-time generator, which
tion about standby mode. For all of APW8823 series, When
senses input voltage on VIN pin, provides very fast on-
PWM1 output voltage is over whose bypass threshold,
time response to input line transients.
and POK is in high state and PWM1 is not in current limit
Another one-shot sets a minimum off-time (typ.300ns).
condition , the internal LDO5 to VOUT1 switchover is
The on-time one-shot is triggered if the error comparator
active. These actions change the current path to power
is high, the low-side switch current is below the current-
the loads from the PWM regulator voltage, rather than
limit threshold, and the minimum off-time one-shot has
from the internal linear regulator.
timed out.
Power -On-Reset
Pulse-Frequency Modulation (PFM) Mode
A Power-On-Reset (POR) function is designed to prevent
In PFM mode, an automatic switchover to pulse-frequency wrong logic controls. The POR function continually moni-
modulation (PFM) takes place at light loads. This tors the supply voltage on the LDO5 pins. LDO5 POR
switchover is affected by a comparator that truncates the circuitry inhibits wrong switching. When the rising VLDO5
low-side switch on-time at the inductor current zero voltage reaches the rising POR threshold (4.3V typical),
crossing. This mechanism causes the threshold between the PWM output voltages begin to ramp up. When the
PFM and PWM operation to coincide with the boundary LDO5 voltage is lower than 4.2V(typ.) or LDO3 voltage is
between continuous and discontinuous inductor-current lower than 2.9V(typ.), both switch power supplies are shut
operation (also known as the critical conduction point). off. This is non-latch protection. LDO5 POR threshold
The on-time of PFM is given by: could reset the under-voltage, over-voltage.

1 V
TON - PFM = × OUT
FSW VIN

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Rev. A.3 - Sep., 2016
APW8823

Function Description (Cont.)


Soft Start Soft-Stop (PWMs)
The APW8823 integrates soft-start circuit to ramp up the In the event of PWM under-voltage or shutdown, the chip
PWMx output voltage of the converter to the programmed enables the soft-stop function. The soft-stop function dis-
regulation set point at a predictable slew rate. The slew charges the PWM output voltages to low voltage by the
rate of PWMx output voltage is internally controlled to limit soft stop method. The reference remains active to pro-
the inrush current through the output capacitors during vide an accurate threshold and to provide over-voltage
soft start process. When the ENx pin is pulled above the protection.
rising threshold voltage, the related PWM initiates a soft-
start process to ramp up the output voltage. The soft-start
Power Good Indicator (PWMs)
interval is 0.9ms(typical)(APW8823A/B/C/F/G/H) and in-
dependent of the UGATE switching frequency. When the junction temperature increases above the ris-
ing threshold temperature 160oC, the IC will enter the
Enable Controls over temperature protection (OTP). When the OTP occurs,
The APW8823 has two independent enable controls for LDO and PWM controllers circuitry shuts down. It is non-
PWM part. When the ENx pin is high at standby mode, the latch protection.
PWMx initiates a soft-start process to ramp up the output
voltage. The PWM1 and PWM2 are controlled individually
Current Limit (PWMs)
by EN1 and EN2. When EN1 and EN2 are both low, the
chip is in its low-power standby state. The APW8823A/C/ The current limit circuit employs a "valley" current-sens-
G only consumes 20µA of current while in standby mode. ing algorithm (See Figure 1). The APW8823A/B/C/D/E
When the EN1 is high, the clock signal becomes avail- uses the low-side MOSFET’s RDS(ON) of the synchronous
able from VCLK pin. Both PWM outputs are discharged to rectifier as a current-sensing element. If the magnitude
low voltage by the soft stop method and both LDO out- of the current-sense signal at PHASE pin is above the
puts are discharged to 0V through a 50Ω switch in soft current-limit threshold, the PWM is not allowed to initiate
stop state. Driving EN1 and EN2 (logic AND) below low a new cycle. The actual peak current is greater than the
threshold clears the over-voltage, and under-voltage fault current-limit threshold by an amount equal to the inductor
latches. ripple current. Therefore, the exact current-limit charac-
teristic and maximum load capability are a function of the
sense resistance, inductor value, and input voltage.
Charge Pump(For APW8823A/B/D/E/F/G/H)

The condition of the 250kHz clock signal can be used is IPEAK


INDUCTOR CURRENT

that the EN1 is high. When VOUT1 regulates at 5V and the


clock signal uses VOUT1 as its power supply, the charge IOUT ΔI
pump circuit can generate 15V DC voltage approximately.
The example of charge pump circuit is shown in typical ILIMIT
application circuit.

0 Time

Figure 1. Current Limit algorithm

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Rev. A.3 - Sep., 2016
APW8823

Function Description (Cont.)


Current Limit (PWMs)(cont.)

Both PWM controllers use the low-side MOSFETs on- Where VILIMX is the voltage at the ILIMx pin. RDS(ON) is the
resistance RDS(ON) to monitor the current for protection low side MOSFETs conducive resistance. ILIMIT is the set-
against shorted outputs. The MOSFET’s RDS(ON) is varied ting current limit threshold. ILIMIT can be expressed as IOUT
by temperature and gate to source voltage, the user minus half of peak-to-peak inductor current.
should determine the maximum RDS(ON) in manufacture’s The PCB layout guidelines should ensure that noise and
datasheet. DC errors do not corrupt the current-sense signals at
The current Limit threshold of APW8823A/B/C/D/E is ad- PHASE. Place the hottest power MOSEFTs as close to
justed with an external resistor. The current-limit thresh- the IC as possible for best thermal coupling. When com-
old voltage is 1/8th the voltage at ILIMx pin. As shown in bined with the under-voltage protection circuit, this cur-
Figure 2, The ILIMx pin can source 50µA(APW8823/A/B/ rent-limit method is effective in almost every circumstance.
C). The voltage at ILIMx pin is equal to 50µA x RILIM. The
logic current limit threshold is default to 250mV value if ILIM

voltage at ILIMx pin is above 2V. The relationship between


the sampled voltage VILIM and the current limit threshold
VILIM RILIM
ILIMIT is given by:
50uA
1
× VILIMX = ILIMIT × RDS( ON) TO CURRENT
8 7R
LIMIT LOGIC

Figure 2. Current-Limit Setting Block Diagram

Table 1. Operating Mode Truth Table

MO DE CONDITION COMMENT
Run ENx = 1 PWM is in no rmal opera tio n.
PWMx is i n shutdown with soft stop, and th en LDO5 is also in
Stan dby APW8 823A /C/G E Nx = 0 shutdown with discharge function a fter soft sto p function in
& PWMx is completed. LDO3 is a ctive.
S oft Sto p PWMx is in shutdown with so ft sto p function. L DO 3 a nd L DO 5
APW8 823B /D/E/F/H E Nx=0
are active.
The soft stop function wi ll enable to pul l lo w outpu t voltage.
Either VOUT1, or VOUT2 < 60% of nomina l o utput LDOx is active. Reset by tog gling E N1 and EN2 (log ic AND).
UVP
vo lta ge This acti on will re-start LDO5 a t the same time. (For
APW8 823A/C/G).
LGATE of th e PWM ch anne l, which occurs OVP e ven t is fo rced
high , the othe r PW M cha nnel is in shutdown with soft stop.
Either VOUT1 a nd V OU T2>115% of no rmal output
OVP LDOx is active. Reset by tog gling E N1 and EN2 (log ic AND).
vo lta ge
This acti on will re-start LDO5 a t the same time. (For
APW8 823A/C/G).
o All circuitry off. It is non-l atch pr ote ctio n after the juncti on
OTP T J > +160 C o
tempera tur e coo ls by 25 C.

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Rev. A.3 - Sep., 2016
APW8823

Function Description (Cont.)

Table 2. Power-Up Control Logics


For APW8823A/G

VEN1 VEN2 LDO5 LDO3 PWM1 PWM2 VCLK*


Low Low OFF ON OFF OFF OFF

High High ON ON ON ON ON

High Low ON ON ON OFF ON

Low High ON ON OFF ON OFF

For APW8823C

VEN1 VEN2 LDO5 LDO3 PWM1 PWM2


Low Low OFF ON OFF OFF
High High ON ON ON ON
High Low ON ON ON OFF
Low High ON ON OFF ON

For APW8823B/D/E/F/H

VEN1 VEN2 LDO5 LDO3 PWM1 PWM2 VCLK*


Low Low ON ON OFF OFF OFF

High High ON ON ON ON ON

High Low ON ON ON OFF ON

Low High ON ON OFF ON OFF

*. Need connected the correct charge pump circuit on VCLK pin.

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Rev. A.3 - Sep., 2016
APW8823

Application Information
Output Voltage Selection ripple current occurs at the maximum input voltage. A
The output voltage of PWM1 can be adjusted from 2V to good starting point is to choose the ripple current to be
5.5V with a resistor-driver at FB1 between VOUT1 and approximately 30% of the maximum output current.
GND. Using 1% or better resistors for the resistive di- Once the inductance value has been chosen, selecting
vider is recommended. The FB1 pin is the inverter input an inductor is capable of carrying the required peak cur-
of the error amplifier, and the reference voltage is 2V. rent without going into saturation. In some types of
Take the example, the output voltage of PWM1 is deter- inductors, especially core that is made of ferrite, the ripple
mined by: current will increase abruptly when it saturates. This will
be result in a larger output ripple voltage.

Output Capacitor Selection


 R 
VOUTI = 2 ×  1 + TOP1 
 Output voltage ripple and the transient voltage de-
 R GND1 
viation are factors that have to be taken into consid-
Where RTOP1 is the resistor connected from VOUTI to VFB1 eration when selecting an output capacitor. Higher
and RGND1 is the resistor connected from FB1 to GND. capacitor value and lower ESR reduce the output ripple
Similarly, the output voltage of PWM2 can be alsoadjusted and the load transient drop. Therefore, selecting high
from 2V to 5.5V. performance low ESR capacitors is intended for switch-
ing regulator applications. In addition to high frequency
Output Inductor Selection
noise related MOSFET turn-on and turn-off, the output
The duty cycle of a buck converter is the function of the voltage ripple includes the capacitance voltage drop and
input voltage and output voltage. Once an output voltage ESR voltage drop caused by the AC peak-to-peak current.
is fixed, it can be written as: These two voltages can be represented by:
VOUT
D= IRIPPLE
VIN ∆VCOUT =
8COUTFSW
The inductor value determines the inductor ripple current ∆VESR = IRIPPLE × RESR
and affects the load transient reponse. Higher inductor
These two components constitute a large portion of the
value reduces the inductor’s ripple current and induces
total output voltage ripple. In some applications, multiple
lower output ripple voltage. The ripple current can be
capacitors have to be paralleled to achieve the desired
approxminated by:
ESR value. If the output of the converter has to support
VIN - VOUT VOUT another load with high pulsating current, more capaci-
IRIPPLE = ×
FSW × L VIN tors are needed in order to reduce the equivalent ESR
Where FSW is the switching frequency of the regulator. and suppress the voltage ripple to a tolerable level. A
Increasing the inductor value and frequency will re- small decoupling capacitor in parallel for bypassing
duce the ripple current and voltage. However, there is a the noise is also recommended, and the voltage rating
tradeoff between the inductor’s ripple current and the of the output capacitors must also be considered.
regulator load transient response time. To support a load transient that is faster than the
A smaller inductor will give the regulator a faster load switching frequency, more capacitors have to be used
transient response at the expense of higher ripple to reduce the voltage excursion during load step change.
current. Increasing the switching frequency (FSW ) also Another aspect of the capacitor selection is that the
reduces the ripple current and voltage, but it will total AC current going through the capacitors has to be
increase the switching loss of the MOSFETs and the less than the rated RMS current specified on the ca-
power dissipation of the converter. The maximum pacitors to prevent the capacitor from over-heating.

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Rev. A.3 - Sep., 2016
APW8823

Application Information (Cont.)


Input Capacitor Selection (CRSS) and maximum output current requirement. The
losses in the MOSFETs have two components: conduc-
The input capacitor is chosen based on the voltage rating
tion loss and transition loss. For the high-side and low-
and the RMS current rating. For reliable operation, select
side MOSFETs, the losses are approximately given by
the capacitor voltage rating to be at least 1.3 times higher
the following equations:
than the maximum input voltage. The maximum RMS
2
current rating requirement is approximately IOUT/2, where Phigh-side = IOUT (1+ TC)(RDS(ON))D + (0.5)( IOUT)(VIN)( tSW)FSW
2
IOUT is the load current. During power up, the input capaci- Plow-side = IOUT (1+ TC)(RDS(ON))(1-D)
tors have to handle large amount of surge current. In low-
Where
duty notebook appliactions, ceramic capacitors are
I is the load current
OUT
remmended. The capacitors must be connected between
TC is the temperature dependency of RDS(ON)
the drain of high-side MOSFET and the source of low-
FSW is the switching frequency
side MOSFET with very low-impeadance PCB layout.
tSW is the switching interval
MOSFET Selection D is the duty cycle
The application for a notebook battery with a maximum volt- Note that both MOSFETs have conduction losses while
age of 24V, at least a minimum 30V MOSFETs should the high-side MOSFET includes an additional transi-
be used. The design has to trade off the gate charge with tion loss. The switching internal, t SW , is the function
the RDS(ON) of the MOSFET: of the reverse transfer capacitance CRSS. The (1+TC) term
is to factor in the temperature dependency of the R DS(ON)
• For the low-side MOSFET, before it is turned on, the
and can be extracted from the “RDS(ON) vs Temperature”
body diode has been conducted. The low-side MOSFET
curve of the power MOSFET.
driver will not charge the miller capacitor of this
MOSFET. Layout Consideration
• In the turning off process of the low-side MOSFET, In any high switching frequency converter, a correct layout
the load current will shift to the body diode first. The is important to ensure proper operation of the regulator.
high dv/dt of the phase node voltage will charge the With power devices switching at higher frequency, the
miller capacitor through the low-side MOSFET driver resulting current transient will cause voltage spike across
sinking current path. This results in much less the interconnecting impedance and parasitic circuit
switching loss of the low-side MOSFETs. The duty elements. As an example, consider the turn-off transition
cycle is often very small in high battery voltage of the PWM MOSFET. Before turn-off condition, the
applications, and the low-side MOSFET will con- MOSFET is carrying the full load current. During turn-off,
duct most of the switching cycle; therefore, the less current stops flowing in the MOSFET and is freewheeling
the RDS(ON) of the low-side MOSFET, the less the power by the lower MOSFET and parasitic diode. Any parasitic
loss. The gate charge for this MOSFET is usually a inductance of the circuit generates a large voltage spike
secondary consideration. The high-side MOSFET during the switching interval. In general, using short and
does not have this zero voltage switching wide printed circuit traces should minimize interconnect-
condition, and because it conducts for less time ing impedances and the magnitude of voltage spike. And
compared to the low-side MOSFET, the switching signal and power grounds are to be kept separating and
loss tends to be dominant. Priority should be given finally combined to use the ground plane construction or
to the MOSFETs with less gate charge, so that both single point grounding. The best tie-point between the
the gate driver loss and switching loss will be signal ground and the power ground is at the negative
minimized. side of the output capacitor on each channel, where there
The selection of the N-channel power MOSFETs are de- is less noise. Noisy traces beneath the IC are not
termined by the RDS(ON), reversing transfer capacitance recommended. Below is a checklist for your layout:

Copyright  ANPEC Electronics Corp. 22 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Application Information (Cont.)


Layout Consideration (Cont.)
3mm
• Keep the switching nodes (UGATEx, LGATEx, BOOTx,
and PHASEx) away from sensitive small signal nodes
(ILIMx, and FBx) since these nodes are fast moving
signals. Therefore, keep traces to these nodes as 0.5mm *
short as possible and there should be no other weak 0.2mm
signal traces in parallel with theses traces on any layer.

1.66 mm
The signals going through theses traces have both
high dv/dt and high di/dt, with high peak charging and 3mm

discharging current. The traces from the gate drivers 0.4mm

to the MOSFETs (UGATEx and LGATEx) should be short 1.66 mm 0.17mm


and wide.

0.5mm
Place the source of the high-side MOSFET and the
drain of the low-side MOSFET as close as possible.
Minimizing the impedance with wide layout plane be-
* Just Recommend
tween the two pads reduces the voltage bounce of TQFN3x3-20
the node.
• Decoupling capacitor, the resistor dividers, boot
capacitors, and current-limit stetting resistor should
be close to their pins. (For example, place the
decoupling ceramic capacitor near the drain of the
high-side MOSFET as close as possible. The bulk
capacitors are also placednear the drain).
• The input capacitor should be near the drain of the
upper MOSFET; the high quality ceramic decoupling
capacitor can be put close to the VCC and GND pins;
the output capacitor should be near the loads. The
input capacitor GND should be close to the output ca-
pacitor GND and the lower MOSFET GND.
• The drain of the MOSFETs (VIN and PHASEx nodes)
should be a large plane for heat sinking. And PHASEx
pin traces are also the return path for UGATEx. Con-
nect these pins to the respective converter’s upper
MOSFET source.
• The controller used ripple mode control. Build the re-
sistor divider close to the FB1 pin so that the high
impedance trace is shorter when the output voltage is
in ad justable mode. And the FB1 pin traces can’t be
close to the switching signal traces (UGATEx, LGATEx,
BOOTx, and PHASEx).
• The PGND trace should be a separate trace, and in-
dependently go to the source of the low-side MOSFETs
for current-limit accuracy.

Copyright  ANPEC Electronics Corp. 23 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Package Information
TQFN3x3-20

D A

b
E
Pin 1

A1
A3
NX
aaa C

S TQFN3x3-20
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 0.70 0.80 0.028 0.031
A1 0.00 0.05 0.000 0.002
A3 0.20 REF 0.008 REF
b 0.15 0.25 0.006 0.010
D 2.90 3.10 0.114 0.122

D2 1.50 1.80 0.059 0.071


E 2.90 3.10 0.114 0.122
E2 1.50 1.80 0.059 0.071
e 0.40 BSC 0.016 BSC
L 0.30 0.50 0.012 0.020
K 0.20 0.008
aaa 0.08 0.003
Note : 1. Followed from JEDEC MO-220 WEEE

Copyright  ANPEC Electronics Corp. 24 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Carrier Tape & Reel Dimensions


OD0 P0 P2 P1 A

E1
F

W
B0

K0 A0 A
OD1 B
B

SECTION A-A

T
SECTION B-B

d
H
A

T1

Application A H T1 C d D W E1 F
12.4+2.00 1 3.0+0 .50
330±2.00 50 MIN. 1.5 MIN. 20 .2 MIN. 1 2.0 ±0 .3 0 1 .7 5±0.10 5.5±0.05
-0.00 -0 .20
TQFN3x3 -20 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 8 .0 ±0 .1 0 2.0±0.05 1.5 MIN. 3 .30 ±0 .2 0 3.30±0.20 1 .0 0±0.2 0
-0.00 -0.40

(mm)

Devices Per Unit


Package Type Unit Quantity
TQFN3x3-20 Tape & Reel 3000

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Rev. A.3 - Sep., 2016
APW8823

Taping Direction Information


TQFN3x3-20

USER DIRECTION OF FEED

Classification Profile

Supplier Tp≧Tc
User Tp≦Tc

TC

TC -5oC
Supplier tp User tp

Tp TC -5oC
Max. Ramp Up Rate = 3oC/s tp
Max. Ramp Down Rate = 6oC/s
Temperature

TL
t
Tsmax Preheat Area

Tsmin

tS

25
Time 25oC to Peak
Time

Copyright  ANPEC Electronics Corp. 26 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Classification Reflow Profiles


Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
100 °C 150 °C
Temperature min (Tsmin)
150 °C 200 °C
Temperature max (Tsmax)
60-120 seconds 60-120 seconds
Time (Tsmin to Tsmax) (ts)

Average ramp-up rate


3 °C/second max. 3 °C/second max.
(Tsmax to TP)
Liquidous temperature (TL) 183 °C 217 °C
Time at liquidous (tL) 60-150 seconds 60-150 seconds
Peak package body Temperature
See Classification Temp in table 1 See Classification Temp in table 2
(Tp)*
Time (tP)** within 5°C of the specified
20** seconds 30** seconds
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.


* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles (Cont.)


Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
3 3
Package Volume mm Volume mm
Thickness <350 ≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
3 3 3
Package Volume mm Volume mm Volume mm
Thickness <350 350-2000 >2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C

Reliability Test Program


Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
HBM MIL-STD-883-3015.7 VHBM≧2KV
MM JESD-22, A115 VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA

Copyright  ANPEC Electronics Corp. 27 www.anpec.com.tw


Rev. A.3 - Sep., 2016
APW8823

Customer Service

Anpec Electronics Corp.


Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050

Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

Copyright  ANPEC Electronics Corp. 28 www.anpec.com.tw


Rev. A.3 - Sep., 2016

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