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FEATURES GBL
• Plastic package has Underwriters Laboratory 20.7 - 20.9
20.7×45
O
10.4 - 10.7
Glass passivated chip junction
1.5 - 2.03
• High case dielectric strength
• Typical IR less than 0.1 A + ~ ~ ~
1.9 - 2.5
• High surge current capability 2.03 - 2.41
17 - 18.2
• Ideal for printed circuit boards
• High temperature soldering guaranteed:
260℃/10 seconds, 0.375”(9.5mm) lead length 0.9 - 1.1 4.8 - 5.3
5lbs.(2.3kg) tension
0.80 - 1.08
0.46 - 0.56
3.25 - 3.56
MECHANICAL DATA
• Case: molded plastic body over passivated junctions
• Terminal: Plated leads solderable per MIL-STD-750
Method 2026 Dimensions in inches and (millimeters)
• Mounting position: Any
• Weight: 0.071 oz, 2.0g
P.C.B. Mounting, T A
CURRENT,(A)
(IF(AV))
60
1
40
0.5
20
0 1 CYCLE
0 25 50 75 100 125 150 0
1 100
INSTANTANEOUS REVERSE
TA =125℃
10 10
CURRENT, (A)
CURRENT, (A)
1 1
0.1 0.1
TA =25℃
0.01 0.01
0.6 1 1.4 1.8 2.2 2.6 3 3.4 0 20 40 60 80 100
10
(℃/W)
10 1
0.1
1 0.01
0.1 1 10 100 0.01 0.1 1 10 100