Design and implementation of a

3-phase, 2-Level
Voltage Source Converter
(Using discrete IGBTs)

PEEMD, Research Group, IIT-Delhi

Version V. 1.0 Jun 2017

Edition: V. 1.0, June 2017

PEEMD, Research Group,

IIT-Delhi, India.

Legal Disclaimer

The information given in this report is meant for educational and research purpose only.
However, all the data provided is considered non-binding and shall not create liability for us.
All component data referred in this report is subject to further research and development and
therefore, is to be considered exemplary only.

The publisher reserves the right not to be responsible for the accuracy, completeness or
topicality of any direct or indirect reference to or citation from law, regulations or directives
in this publication.

Edited by:

Martin Cheerangal J,

Sritam Jena,

Dr. Anandarup Das,

Faculty & Students of PEEMD Research Group, IIT-Delhi.

2
 ABSTRACT

In this report, step by step design of a 2-level, 3-phase Voltage Source Converter (VSC) is
explained. A 10kVA, 415V 3-phase VSC has been designed, fabricated and tested in the labs
in IIT Delhi. The design of VSC constitutes the gate driver circuit, gate pulse divider circuit,
power circuit, rectifier unit including DC-bus capacitor and the heat sink mounting. Every
chapter is included with the schematic diagrams, PCB layouts (with track widths) and bill of
materials (BOM). Detailed pictures of each circuit design and implementation have been
presented in the report.

The report is mainly intended for students and researchers to develop and fabricate a VSC on
their own in the lab.

3
Contents
1 CHAPTER – 1: VOLTAGE SOURCE CONVERTER.....................................9

1.1 INTRODUCTION............................................................................................................................. 9
1.2 VSC SPECIFICATIONS................................................................................................................. 9
1.3 OVERVIEW OF VSC DESIGN............................................................................10

2 CHAPTER – 2: GATE DRIVERS CIRCUIT..................................................11

2.1 INTRODUCTION.......................................................................................................................... 11
2.2 PROTECTIONS IN GATE DRIVER IC.....................................................................11
2.2.1 Active miller clamping protection........................................................11
2.2.2 Desaturation protection.........................................................................11
2.2.3 /Fault, /Reset & Ready pin functions....................................................12
2.3 FEATURES OF GATE DRIVER IC..........................................................................13
2.4 GATE DRIVER CIRCUIT DESIGN............................................................................................. 14
2.4.1 Boot-strap capacitor & diode rating.....................................................14
2.4.2 DESAT capacitor for blanking time.....................................................14
2.5 COMPONENTS & BOM......................................................................................14
2.6 PICTURES SHOWING GATE DRIVER BOARD IN VSC............................................17
2.7 PCB LAYOUT OF GATE DRIVER CIRCUIT........................................................................... 18

3 CHAPTER – 3: GATE PULSE DIVIDER CIRCUIT.....................................21

3.1 INTRODUCTION.......................................................................................................................... 21
3.2 FUNCTION OF GATE PULSE DIVIDER CIRCUIT................................................................... 21
3.3 SIGNALS IN AND OUT OF GATE PULSE DIVIDER CIRCUIT.............................................. 22
3.4 PROTECTION CIRCUIT.............................................................................................................. 23
3.4.1 Fault protection.....................................................................................23
3.4.2 Reset function.......................................................................................24
3.5 COMPONENTS & BOM......................................................................................24
3.6 PICTURES SHOWINGOF GATE DIVIDER BOARD IN VSC.......................................25
3.7 PCB LAYOUT OF GATE DIVIDER CIRCUIT......................................................................... 27

4 CHAPTER – 4: POWER CIRCUIT.................................................................29

4.1 INTRODUCTION.......................................................................................................................... 29
4.2 SIGNALS IN AND OUT OF POWER CIRCUIT......................................................................... 29

4
4.3 COMPONENTS OF POWER CIRCUIT....................................................................................... 30
4.4 COMPONENTS & BOM......................................................................................30
4.5 PICTURES SHOWINGOF POWER CIRCUIT BOARD IN VSC....................................31
4.6 PCB LAYOUT OF POWER CIRCUIT....................................................................................... 32

5 CHAPTER– 5: HEAT SINK DESIGN.............................................................33

5.1 INTRODUCTION.......................................................................................................................... 33
5.2 LOSSES IN VSC.................................................................................................33
5.2.1 Conduction losses.................................................................................33
5.2.2 Switching losses...................................................................................35
5.3 PICTURES OF HEAT SINK.......................................................................................................... 36

6 CHAPTER– 6: RECTIFIER UNIT & DC BUS CAPACITOR.....................37

6.1 INTRODUCTION.......................................................................................................................... 37
6.2 RIPPLE CURRENTS IN CAPACITOR........................................................................................ 37
6.3 POWER CAPACITOR & BRIDGE RECTIFIER......................................................................... 38
6.4 COMPONENTS & BOM......................................................................................39
6.5 TOTAL COST OF VSC.........................................................................................40
6.6 PICTURE SHOWING CAPACITOR & BRIDGE RECTIFIER.................................................. 40

7 CHAPTER– 7: PICTURES OF COMPLETE VSC SETTINGS..................42

7.1 CAPACITOR MOUNTING & DC BUS PLATES...................................................................... 42

7.2 VARIOUS LUGS USED IN VSC............................................................................43
7.3 DC BUS CONNECTION WITH RECTIFIER............................................................................. 44
7.4 COMPLETE VSC.................................................................................................45

7.5 EXPERIMENTAL RESULTS OF VSI.......................................................................47

7.6 PCB SPECIFICATIONS.............................................................................................................. 49
7.6.1 Gate driver circuit.................................................................................49
7.6.2 Gate pulse divider circuit......................................................................49
7.6.3 Power circuit board...............................................................................50

5
 LIST OF FIGURES

FIG. 1-1: OVERVIEW OF VOLTAGE SOURCE CONVERTER DESIGN.......................................................... 10

FIG. 2-1: ACTIVE MILLER CLAMPING CIRCUIT TO PREVENT TURN ON DURING TURN OFF..............12
FIG. 2-2: DESAT & ACTIVE MILLER CLAMPING PROTECTION IN GATE DIVIDER CIRCUIT.............12
FIG. 2-3: PROTECTION EMPLOYED IN GATE DRIVER CIRCUIT................................................................... 13
FIG. 2-4: FIGURE OF THE CORELESS TRANSFORMER EMPLOYED IN GATE DRIVER IC..................13
FIG. 2-5: GATE DRIVER CIRCUIT PCB........................................................................................17
FIG. 2-6: FRONT VIEW OF VSC SHOWING THREE GATE DRIVER PCB’S.............................................. 17
FIG. 2-7: FRONT VIEW OF SINGLE GATE DRIVER PCB MOUNTED ON MICA BOARD......................... 17
FIG. 2-8: TOP VIEW OF GATE DRIVER WITH HEAT SINK SEEN BEHIND................................................... 18
FIG. 2-9: SIDE VIEW OF THE GATE DRIVER PCB SETUP ON THE HEAT SINK........................................ 18
FIG. 2-10: PCB LAYOUT OF COMPONENTS USED IN GATE DRIVER CIRCUIT........................................ 18
FIG. 2-11: TOP COPPER LAYER ROUTING OF GATE DRIVER PCB.................................................19
FIG. 2-12: BOTTOM COPPER LAYER ROUTING OF GATE DRIVER PCB.........................................19
FIG. 2-13: TOP COPPER LAYER OF GATE DRIVER PCB (WITH COPPER FILL)...............................20
FIG. 2-14: BOTTOM COPPER LAYER OF GATE DRIVER PCB (WITH COPPER FILL)........................20
FIG. 3-1: SCHEMATIC CIRCUIT OF GATE-PULSE DIVIDER CIRCUIT.......................................................... 21
FIG. 3-2: FRC CONNECTOR (MALE) PIN CONFIGURATION........................................................................ 23
FIG. 3-3: FAULT TRIP COMMAND TO ALL DRIVER IC..................................................................23
FIG. 3-4: RESET CIRCUIT IN GATE PULSE DIVIDER CIRCUIT PCB...............................................24
FIG. 3-5: FRONT SIDE OF GATE PULSE DIVIDER CIRCUIT PCB....................................................25
FIG. 3-6: BACK SIDE OF GATE PULSE DIVIDER CIRCUIT PCB.....................................................26
FIG. 3-7: SIDE VIEW OF GATE DIVIDER PCB SHOWING THE MOUNTING ON ACRYLIC SHEET.........26
FIG. 3-8: GATE DIVIDER CIRCUIT PCB AS SEEN IN THE FRONT OF VSC SETUP.................................26
FIG. 3-9: REVERSE SIDE OF THE GATE DIVIDER PCB SHOWING THE ACRYLIC SHEET......................26
FIG. 3-10: PCB LAYOUT OF COMPONENTS USED IN GATE PULSE DIVIDER CIRCUIT PCB............27
FIG. 3-11: TOP COPPER AND BOTTOM COPPER LAYER OF GATE DIVIDER PCB............................27
FIG. 3-12: TOP COPPER LAYER OF GATE DIVIDER PCB (WITH COPPER FILL).............................28
FIG. 3-13: BOTTOM COPPER LAYER OF GATE DIVIDER PCB (WITH COPPER FILL)......................28
FIG. 4-1: SCHEMATICS OF POWER CIRCUIT.................................................................................................... 29
FIG. 4-2: COMPONENTS IN POWER CIRCUIT PCB......................................................................31
FIG. 4-3: BACK SIDE OF POWER CIRCUIT PCB...........................................................................31
FIG. 4-4: POWER CIRCUIT PCB MOUNTED ON HEAT SINK......................................................................... 31

6
FIG. 4-5: POWER CIRCUIT PCB SEEN WITH GATE DRIVER BOARD.......................................................... 32
FIG. 4-6: TOP COPPER LAYOUT OF POWER CIRCUIT PCB...........................................................32
FIG. 4-7: POWER CIRCUIT PCB ROUTING OF BOTTOM COPPER LAYER................................................. 32
FIG. 5-1: OUTPUT CHARACTERISTICS OF IGBT SWITCH........................................................................... 34
FIG. 5-2: FORWARD CURRENT & VOLTAGE CHARACTERISTICS OF POWER DIODE............................. 34
FIG. 5-3: FIGURE SHOWING THE SWITCHING ENERGY LOSS IN AN IGBT SWITCH AND DIODE......34
FIG. 5-4: AVERAGE POWER DISSIPATION OF THREE-PHASE DIODE BRIDGE RECTIFIER.....................34
FIG. 5-5: THERMAL RESISTANCE OF SWITCH & DIODE.............................................................................. 35
FIG. 5-6: THERMAL RESISTANCE INCLUDING DIODE BRIDGE RECTIFIER.............................................. 35
FIG. 5-7: OVERALL THERMAL RESISTANCE FROM JUNCTION TO AMBIENT......................................... 36
FIG. 5-8: HEAT SINK WITH HOLE DRILLED FOR IGBT SWITCHES........................................................... 36
FIG. 6-1: FIGURE SHOWING VSC, WITH DIFFERENT CURRENTS IN THE CIRCUIT...............................37
FIG. 6-2: THE NORMALIZED RMS EQUIVALENT CENTERED DC BUS CURRENT HARMONICS FOR
SPWM, 1ST CENTERED CARRIER FREQUENCY, 2ND, 3RD & 4TH MULTIPLE CARRIER FREQUENCY
..........................................................................................................................................38
FIG. 6-3: SEMIKRON’S POWER CAPACITOR & DIODE BRIDGE RECTIFIER......................................... 40
FIG. 6-4: CAPACITOR STAND............................................................................................................................... 40
FIG. 6-5: CAPACITOR STAND FIXED ON THE HEAT SINK.............................................................................. 41
FIG. 6-6: DIODE RECTIFIER & IGBT SWITCHES MOUNTED ON HEAT SINK.......................................... 41
FIG. 7-1: POWER CAPACITORS ALONG WITH THE POWER CIRCUIT BOARD........................................... 42
FIG. 7-2: DC BUS PLATES WITH THE SERIES CONNECTED POWER CAPACITORS..................................42
FIG. 7-3: LUGS USED IN VSC’S INTERNAL CONNECTION.......................................................................... 43
FIG. 7-4: STEEL STRIP USED AS AN EXTENSION OF –VE DC BUS PLATE............................................... 44
FIG. 7-5: DC BUS PLATES SEEN WITH BRIDGE RECTIFIER.......................................................................... 44
FIG. 7-6: DC BUS PLATE SEEN IN TOP VIEW................................................................................................... 44
FIG. 7-7: FRONT VIEW OF VSC.................................................................................................45
FIG. 7-8: SIDE VIEW OF VSC.....................................................................................................45
FIG. 7-9: TOP VIEW OF VSC......................................................................................................46
FIG. 7-10: ACRYLIC SHEET TO COVER VSC...............................................................................46
FIG. 7-11: COMPLETE 2-LEVEL VSC WORKING SETUP............................................................................. 46
FIG. 7-12: EXPERIMENTAL SETUP OF VSI FED INDUCTION MOTOR DRIVE......................................... 47
FIG. 7-13: EXPERIMENTAL RESULTS OF VSI DRIVING AN INDUCTION MOTOR................................. 47
FIG. 7-14: RESULTS OBTAINED FOR AN INPUT DC VOLTAGE OF 586V.......................................48
FIG. 7-15: RESULTS OBTAINED FOR A MAXIMUM LINE CURRENT OF IM.....................................48
7
 List of tables

TAB. 1-1: VOLTAGE SOURCE CONVERTER SPECIFICATIONS....................................................................... 9

TAB. 2-1: BOM & LIST SHOWING THE COMPONENTS USED IN GATE DRIVER CIRCUIT..................16
TAB. 3-1: SIGNALS FROM GATE PULSE DIVIDER CIRCUIT......................................................................... 22
TAB. 3-2: BOM & LIST SHOWING THE COMPONENTS USED IN GATE DRIVER CIRCUIT...................25
TAB. 4-1: SIGNALS FROM POWER CIRCUIT PCB........................................................................29
TAB. 4-2: BOM & LIST SHOWING THE COMPONENTS USED IN POWER CIRCUIT...............................30
TAB. 6-1: BOM & LIST OF COMPONENTS USED IN RECTIFIER UNIT & OTHER PARTS OF VSC. . .39
TAB. 6-2: TOTAL COST OF VOLTAGE SOURCE CONVERTER SETUP........................................................ 40
TAB. 7-1: LUGS CONNECTING VARIOUS TERMINALS................................................................................... 43

8
1 Chapter – 1: VOLTAGE SOURCE CONVERTER

1.1 INTRODUCTION

Voltage Source Converter (VSC) is an indispensable part of a variety of power

electronic systems. It finds application in motor drives, power factor correcting equipment,
grid integration of renewable energy sources etc. Among other types of inverters, Voltage
Source Inverter (VSI) is more efficient, more robust and gives faster dynamic response. Due
to these reasons, VSC finds a suitable place in most industrial applications.

Two-level VSC’s are mostly used in low voltage, low power applications and in some
medium voltage applications. In order to obtain a better understanding of VSC, a two-level
VSC has been designed and implemented in the following report. The main idea behind
building the inverter is to get a hands-on experience in designing a gate-driver circuit, power
circuit, DC-link bus capacitor, and heat sink which forms the main constituents of a VSC.

1.2 VSC SPECIFICATIONS

S No Ratings Values

1 Inverter kVA 10kVA

2 DC bus voltage 600V

3 Output line voltage 415V rms

4 Output Current 15A rms

5 Switching Frequency 20KHz (max)

6 𝑉𝐶𝐸𝑆 (IGBT rating) 1200V

7 𝐼𝐶 (IGBT rating) 25A @ 100°C

Tab. 1-1: Voltage Source Converter specifications

9
1.3 OVERVIEW OF VSC DESIGN

Fig. 1-1: Overview of Voltage Source Converter design

10
2 Chapter – 2: GATE DRIVERS CIRCUIT

2.1 INTRODUCTION
Gate driver circuit contains a gate driver IC 2ED020I12-F2 (Infineon), with a boot-
strap technique to drive a half bridge of the power circuit. It is an interface circuit between
gate pulse divider circuit and power circuit. This Infineon make IC is chosen as it provides
protection features like IGBT desaturation protection and active miller clamping protection.

On the left side of the driver IC, the signals are exchanged between the gate divider
circuits. This includes the input gate signal to the non-inverting terminal of driver IC,
inverting shutdown logic signal input, ready, /fault,/reset pins corresponding to the high side
and low side of the driver IC. On right is the bootstrap capacitor, diode, protections and
exchange of signals between the IGBT power circuit and driver IC.

2.2 PROTECTIONS IN GATE DRIVER IC

2.2.1 Active miller clamping protection

Active miller clamping protection circuit as shown Fig. 2-1 is employed in gate driver
circuit to prevent parasitic turn-on of IGBT switch during turn off process. During turn off,

due to the sudden rise inVCE , gate voltage rises due to the miller capacitance. When voltage
reaches the IGBT threshold, a dynamic turn on of the power switch occurs. To avoid this, the
clamp pin monitors gate voltage during turn off state. It activates additional discharge path as
the gate voltage sinks 2V below 𝑉𝐸𝐸2𝑋𝑋.

2.2.2 Desaturation protection

Desaturation protection is employed by the DESAT pin. This pin monitors the VCE
voltage to detect desaturation caused by short circuits. If the monitored voltage is above 9V,
and a certain blanking time has expired, the desaturation protection is activated by sending an
active low signal in the /FAULT pin (refer gate pulse divider circuit for further explanation)
and the IGBT is switched off. Blanking time is adjustable by external capacitor. Desaturation
and active miller clamping protections used in the gate driver circuit is shown in Fig. 2-2.

11
 Fig. 2-1: Active miller clamping circuit to prevent turn on during turn off

Fig. 2-2: DESAT & Active miller clamping protection in gate divider circuit

2.2.3 /Fault, /Reset & Ready pin functions

Active low /FAULT signal triggers the inverting shutdown input logic, which switches
off the power IGBT switch. For /RESET function, refer gate divider circuit. READY pin
gives a high and low signal depending on the DESAT pin. A high signal is given for normal
working operation (Green LED is connected) and it gives a low signal during fault condition
(Red LED is connected). Fig. 2-3 shows the functionality of above pin functions in the gate
driver circuit. All the explanation is applicable to both high side and low side circuit.

12
 Fig. 2-3: Protection employed in gate driver circuit

2.3 FEATURES OF GATE DRIVER IC

The gate drive IC 2ED020I12-F2 has an added feature compared to the existing opto-
coupler and level shifter circuit required for isolation. It is the presence of coreless
transformer isolation provided between the input and output side of the driver IC as shown in
Fig. 2-4.

The galvanic isolation is employed in both high side and low side of the driver IC.
This increases the reliability of driver IC compared to the aging of opto-coupler isolation
method and the requirement of level shifter for isolation in output side.

Fig. 2-4: Figure of the coreless transformer employed in gate driver IC

13
2.4 GATE DRIVER CIRCUIT DESIGN
2.4.1 Boot-strap capacitor & diode rating

𝐼𝑄2𝑀𝐴𝑋 ∗ 𝑡𝑃 + 𝑄𝐺_𝑀𝐴𝑋 6 𝑚𝐴 ∗ 1.5𝑚𝑠 + 155 𝑛𝐶

𝑪 =
𝑩𝑺 ∆𝑉𝐵𝑆 = ≅ 𝟏𝟎 𝝁𝑭 𝒂𝒕 𝟐𝟓 𝑽
1𝑉

𝑰𝑸𝟐_𝑴𝑨𝑿 = 𝑄𝑢𝑖𝑒𝑠𝑐𝑒𝑛𝑡 𝐶𝑢𝑟𝑟𝑒𝑛𝑡 𝑂𝑢𝑡𝑝𝑢𝑡 𝐶ℎ𝑖𝑝 𝑖𝑛 𝑔𝑎𝑡𝑒 𝑑𝑟𝑖𝑣𝑒𝑟 𝑑𝑎𝑡𝑎𝑠ℎ𝑒𝑒𝑡

𝒕𝑷 = 𝑀𝑎𝑥𝑖𝑚𝑢𝑚 𝑆𝑤𝑖𝑡𝑐ℎ𝑖𝑛𝑔 𝑝𝑒𝑟𝑖𝑜𝑑

𝑸𝑮_𝑴𝑨𝑿 = 𝑀𝑎𝑥𝑖𝑚𝑢𝑚 𝑡𝑜𝑡𝑎𝑙 𝑔𝑎𝑡𝑒 𝑐ℎ𝑎𝑟𝑔𝑒 𝑣𝑎𝑙𝑢𝑒 𝑜𝑓 𝐼𝐺𝐵𝑇 𝑠𝑤𝑖𝑡𝑐ℎ
∆𝑽𝑩𝑺 = 𝑉𝑜𝑙𝑡𝑎𝑔𝑒 𝑑𝑟𝑜𝑝 𝑎𝑐𝑟𝑜𝑠𝑠 𝑏𝑜𝑜𝑡𝑠𝑡𝑟𝑎𝑝 𝑐𝑎𝑝𝑎𝑐𝑖𝑡𝑜𝑟

Boot-strap diode rating: Fast recovery diode, 1200V and 1A.

2.4.2 DESAT capacitor for blanking time

𝐼𝐷𝐸𝑆𝐴𝑇 ∗ 𝑇𝐷𝐸𝑆𝐴𝑇𝐵𝐿𝐴𝑁𝐾 550𝜇𝐴 ∗ 3𝜇𝑠

𝑪 𝑫𝑬𝑺𝑨𝑻= = ≅ 220pF
𝑉𝑅𝐸𝐹_𝐷𝐸𝑆𝐴𝑇 9

𝑻𝑫𝑬𝑺𝑨𝑻𝑩𝑳𝑨𝑵𝑲 = 𝑅𝑒𝑞𝑢𝑖𝑟𝑒𝑑 𝑏𝑙𝑎𝑛𝑘𝑖𝑛𝑔 𝑡𝑖𝑚𝑒

𝑰𝑫𝑬𝑺𝑨𝑻 = 𝐼𝑛𝑡𝑒𝑟𝑛𝑎𝑙 𝑐𝑢𝑟𝑟𝑒𝑛𝑡, 𝑡𝑎𝑘𝑒𝑛 500𝑢𝐴
𝑽𝑹𝑬𝑭_𝑫𝑬𝑺𝑨𝑻 = 𝐷𝐸𝑆𝐴𝑇 𝑟𝑒𝑓𝑒𝑟𝑒𝑛𝑐𝑒 𝑣𝑎𝑙𝑢𝑒, 𝑠𝑒𝑡 𝑖𝑛𝑡𝑒𝑟𝑛𝑎𝑙 𝑎𝑠 9𝑉

2.5 COMPONENTS & BOM

PACK MOUSER QT UNIT ORDER

S COMPONENT VALUE
AGE PART NO. Y PRICE PRICE
NO
THICK FILM 0Ω, 603-
SMD-
RESISTOR, AC1206JR- 4 2.52 10.08
1 1/4W, 5% 1206
SMD 070RL

14
 THICK FILM 10Ω, 603-
SMD-
2 RESISTOR, RC1206JR- 1 1.26 1.26
1/4W, 5% 1206
SMD 0710RL
THICK FILM 50Ω, 603-
SMD-
3 RESISTOR, RC1206FR- 2 1.68 3.36
1/4W, 1% 1206
SMD 0749R9L
THICK FILM 603-
100Ω, SMD-
4 RESISTOR, RC1206FR- 2 1.68 3.36
1/4W, 1% 1206
SMD 07100RL
THICK FILM 603-
270Ω, SMD-
5 RESISTOR, RC1206JR- 5 1.26 6.30
1/4W, 5% 1206
SMD 07270RL
THICK FILM 603-
820Ω, SMD-
6 RESISTOR, RC1206FR- 1 1.68 1.68
1/4W, 1% 1206
SMD 07820RL
THICK FILM 603-
1KΩ, SMD-
7 RESISTOR, RC1206FR- 2 1.68 3.36
1/4W, 1% 1206
SMD 071KL
THICK FILM 603-
10KΩ, SMD-
8 RESISTOR, RC1206FR- 9 1.26 11.34
1/4W, 5% 1206
SMD 071KL
MULTILAYER
77-
CERAMIC 220pF, SMD-
9 VJ1206Y221K 2 2.17 4.34
CAPACITOR, 50V, 10% 1206
XACBC
SMD
MULTILAYER
77-
CERAMIC 100nF, SMD-
10 VJ1206Y104K 8 2.31 18.48
CAPACITOR, 10V, 10% 1206
XQCBC
SMD
MULTILAYER
1uF, 77-
CERAMIC SMD-
11 VJ1206Y105K 3 4.62 13.86
CAPACITOR, 10V, 10% 1206
XQTBC
SMD
MULTILAYER
10uF, 581-
CERAMIC SMD-
12 12063C106KA 4 15.40 61.6
CAPACITOR, 25V, 10% 1206
T2A
SMD

MULTILAYER SMD- 81-

4.7uF, 10% 1 15.89 15.89
13 CERAMIC 1206 GRM31CR71E

15
 CAPACITOR, 475KA88
SMD
ALUMINIUM
6.3X6. 647-
ELECTROLYTI 100uF,
14 3X7.7 UUA1C101M 1 20.65 20.65
C CAPACITOR, 16V, 20%
mm CL1GS
SMD
SCHOTTKY 750mA, 726-
SOD-
15 DIODE-BAT BAT165E6327 8 20.44 163.52
40V 323-2
165 HTSA1
STTH112U –
FAST 1A, 511-
16 SMB 3 30.10 90.30
RECOVERY 1200V STTH112U
DIODE
604-
GREEN LED- 62.5mW, SMD-
17 APTR3216SG 4 6.65 26.60
SMD 20mA 1206
C
75mW, SMD- 604-
18 RED LED-SMD 2 7.21 14.42
20mA 1206 APT3216EC
TERMINAL
19 2P,5mm DIL 651-1888687 4 70.5 282.00
BLOCK
FRC
653-XG2A-
20 CONNECTOR- 26 Pin DSC 205.1 205.1
2601
MALE

TOTAL ₹ 957.50

For 3 Gate
₹ 2872.50
Drivers IC’s
Tab. 2-1: BOM & List showing the components used in Gate driver circuit

16
2.6 PICTURES SHOWING GATE DRIVER BOARD IN VSC

Fig. 2-5: Gate driver circuit PCB

Fig. 2-6: Front View of VSC showing three
gate driver PCB’s
 Three FRC connector cable to power
divider circuit can be seen in Fig. 2-6
Fig. 2-7: Front View of single gate driver
PCB mounted on mica board
 Two Screws are used to place the
mica board on heat sink and it can be
seen in Fig. 2-7

17
 Fig. 2-8: Top View of gate driver with heat Fig. 2-9: Side View of the gate driver PCB
sink seen behind setup on the heat sink
Length of mica board on which 3 gate driver PCB’s are mounted: 24cmX10cm

2.7 PCB LAYOUT OF GATE DRIVER CIRCUIT

Fig. 2-10: PCB layout of components used in gate driver circuit

18
 Fig. 2-11: Top copper layer routing of gate driver PCB

Fig. 2-12: Bottom copper layer routing of gate driver PCB

19
 Fig. 2-13: Top copper layer of gate driver PCB (with Copper fill)

Fig. 2-14: Bottom copper layer of gate driver PCB (with Copper fill)

20
3 Chapter – 3: GATE PULSE DIVIDER CIRCUIT

3.1 INTRODUCTION
Gate pulse divider circuit is the interface between dead band circuit and the half
bridge gate driver circuit. This divider circuit segregates the gating pulse required for three
gate driver circuits along with the short circuit fault protection.

Fig. 3-1: Schematic circuit of Gate-pulse divider circuit

3.2 FUNCTION OF GATE PULSE DIVIDER CIRCUIT

This circuit receives gating signals from dead band circuit and fault signal input (if
any) from the gate driver circuit. The six gating signals are sent to three individual gate driver
circuit through FRC cable and three sets of regulated +5V DC and +15V DC as well. There is
a reset button to reset IGBT switches after fault. The circuit schematics is shown in Fig. 3-1.
3.3 SIGNALS IN AND OUT OF GATE PULSE DIVIDER CIRCUIT
This circuit gets input from the DSP for gating signals, +5V, +15V DC from regulated
power supply and fault signal input (if any) from the gate driver PCB. The output from this
circuit are individual FRC connector for each driver PCB, three sets of regulated +5V DC and
+15V DC to each gate driver PCB and a reset command to the gate driver IC to reset all the
switches. Following tables explains the signals in and out of the gate-pulse divider PCB.

In & Out signals of Gate pulse divider Circuit PCB

From DSP through dead band – 6 gating signals

(A,/A, B,/B, C,/C)

In
Regulated +5V and +15V DC Power supply

Fault signal input (active low) from the gate driver IC

( During short circuit – low signal is sent from driver IC )

26 pin FRC (male) connector to each driver PCB

Out +5V and +15V DC supply to each gate driver PCB

Reset command signal to driver IC to switch off all switches

(Included in the individual FRC pin port)

Tab. 3-1: Signals from Gate pulse divider circuit

In Fig. 3-2, the FRC connector on left side is the six gating pulse required to drive the
switches and on right are the three FRC connectors to three individual gate driver circuits.
The pin description of FRC is shown in Fig. 3-2.On left - A, /A, B, /B, C, /C are the six
gating pulse and on right is the signal given to individual gate driver IC with fault protection
and reset option. INT+X (T-Top switch input, B-Bottom switch input in a leg) is the non-
inverting input of the driver IC and INT-X is the inverting input. Here, gating signals are
given to the non- inverting inputs.

2
 Fig. 3-2: FRC connector (male) pin configuration

3.4 PROTECTION CIRCUIT

3.4.1 Fault protection

Active low fault pin (/FLT) in FRC connector to each driver IC is activated whenever
there is a huge current flow due to short circuit problem. Short circuit in the load or arm rises
the collector emitter voltage of the IGBT switches. DESAT pin of the driver IC senses this
voltage and triggers an active low signal (/FLT) if the voltage goes beyond 9V. As shown in
Fig. 3-3, all the three /FLT pin from three driver IC is given to the input of NAND gate and
the output is given to the inverting input of all three driver IC. This compliments the gating
logic of switches and turns off the IGBT.

Fig. 3-3: Fault trip command to all driver IC

2
3.4.2 Reset function

Active low reset button (/RST) in the gate divider circuit resets the driver IC, when it
has previously received a fault input. During normal working it gets ‘+5V’ from the
following reset circuit shown in Fig. 3-4.

Fig. 3-4: Reset circuit in Gate pulse divider circuit PCB

3.5 COMPONENTS & BOM

The components used and BOM used in the Gate pulse divider circuit PCB are shown
in the following table.

S PACK MOUSER QT UNIT Order

COMPONENT VALUE
NO AGE PART NO Y Price Price

1 Diode-1N4001 50V,1A DO-41 821-1N4001 1 ₹ 10.43 10.43

CARBON FILM 10KΩ, 603-CFR-

2 DO-41 3 ₹ 2.52 7.56
RESISTOR 0.25W, 5% 25JR-5210K

CAPACITOR - 140-50V5-
3 100nF, 10V DIL 1 ₹ 19.6 19.6
CERAMIC 104Z-RC

CAPACITOR -
4 1uF, 50V DIL 105CKE100M 1 ₹ 7.10 7.1
ELECTROLYTIC

CAPACITOR - ECA-
5 4.7uF,25V DIL 1 ₹ 11.2 11.2
ELECTROLYTIC 1HM47RI

CAPACITOR – 100uF, ECE-

6 DIL 1 ₹ 17.5 17.5

2
 ELECTROLYTIC 16V A1CKA101

SPST
7 RESET SWITCH DIL 1 ₹ 27.5 27.5
(LEADS)

TERMINAL
8 2P,5mm DIL 651-1888687 9 ₹ 70.5 634.5
BLOCK

FRC
653-XG2A-
9 CONNECTOR- 26 Pin DSC 4 ₹ 205.1 820.4
2601
MALE

595-
10 NOT GATE 14 Pin DIL 1 ₹ 37.8 37.8
SN74HC14N

3 I/P NAND 595-

11 14 Pin DIL 1 ₹ 53.2 53.2
GATE SN74LS10N

TOTAL ₹ 1646.7

Tab. 3-2: BOM & List showing the components used in gate driver circuit

3.6 PICTURES SHOWINGOF GATE DIVIDER BOARD IN VSC

Fig. 3-5: Front side of Gate pulse divider circuit PCB

2
Fig. 3-6: Back side of Gate pulse divider
circuit PCB
Fig. 3-8: Gate divider circuit PCB as seen in
the front of VSC setup.
 FRC connector cable is seen coming
out of the gate divider circuit, Also
three individual FRC cables can be
seen connected to three gate driver
Fig. 3-7: Side view of gate divider PCB
showing the mounting on acrylic sheet
circuit inside
Fig. 3-9: Reverse side of the gate divider
PCB showing the acrylic sheet
 Gate divider circuit is mounted on the
front part of the acrylic sheet that
covers the whole VSC
3.7 PCB LAYOUT OF GATE DIVIDER CIRCUIT

Fig. 3-10: PCB layout of components used in gate pulse divider circuit PCB

Fig. 3-11: Top copper and bottom copper layer of gate divider PCB
 Fig. 3-12: Top copper layer of gate divider PCB (With Copper fill)

Fig. 3-13: Bottom copper layer of gate divider PCB (With Copper fill)

2
4 Chapter – 4: POWER CIRCUIT

4.1 INTRODUCTION
Power circuit includes the three leg of the conventional two level voltage Source
Converter. It contains 6 discrete IGBT’s and the output AC three phase power leads(R, Y, B)
as shown in the schematics Fig. 4-1.

Fig. 4-1: Schematics of Power circuit

4.2 SIGNALS IN AND OUT OF POWER CIRCUIT

In & Out signals of Power Circuit PCB

From Gate driver PCB – 6 sets of gate signal wires for

In each IGBT (blue, yellow pair of wires)

From DC-link Capacitor – 4 connectors for +Vdc (red)

& 1 connector for –Vdc (black)

3-phase output power lead (R, Y, B) taken from the

Out mid-point of 3 legs (Red, Yellow, Blue connector)

Tab. 4-1: Signals from power circuit PCB

2
4.3 COMPONENTS OF POWER CIRCUIT
 IGBT switches are placed at the back side of the PCB shown in Fig. 4-3. In Fig. 4-2,
the AC output leads are the corresponding R, Y, B colored banana connectors.
 The lower set of banana connectors are for the DC-link capacitor voltage terminals,
+Vdc and –Vdc connection (4 connectors for +Vdc and 1 connector for -Vdc).
 Back to back zener diode is placed to avoid the gate emitter voltage of IGBT’s to go
beyond certain value during short circuit conditions. Here, 20V zener diode is
selected. (For more information, please refer Application note AN4507 in the
appendix)

4.4 COMPONENTS & BOM

The components used and BOM used in the power circuit PCB are shown in the
following table.

S PACK QT UNIT Order

COMPONENTS VALUE PART NO.
NO AGE Y Price Price

ZENER DIODE, 512-

1 20V,10mA DO-41 12 ₹ 10.50 126
ZD1-12 BZX85C20

TO- 726-
2 IGBT’s 1200V, 25A 6 ₹ 429.10 2574.6
247 IKW25T120

CARBON FILM 1KΩ, 0.25W, 603-CFR-

3 DO-41 6 ₹ 2.52 15.12
RESISTOR 5% MCF 25JR-521K

POWER BANANA
4 DIL 548-31602-0 8 ₹ 161.00 1288
CONNECTOR CONNECTOR

TOTAL ₹ 4003.72
Tab. 4-2: BOM & List showing the components used in power circuit

3
4.5 PICTURES SHOWINGOF POWER CIRCUIT BOARD IN VSC

Fig. 4-2: Components in Power circuit PCB

Fig. 4-3: Back side of Power circuit PCB

Fig. 4-4: Power circuit PCB mounted on heat sink

3
 Fig. 4-5: Power circuit PCB seen with gate driver board

4.6 PCB LAYOUT OF POWER CIRCUIT

Fig. 4-6: Top copper layout of Power circuit PCB

Fig. 4-7: Power circuit PCB routing of bottom copper layer

3
5 Chapter– 5: HEAT SINK DESIGN

5.1 INTRODUCTION
In the operation of power semiconductor switches, part of the electric energy is being
transformed into heat energy. In order for any devices to operate within desired temperature
limits, power dissipation performance must be well understood. Power dissipation or losses in
any power semiconductor switches can be classified as conduction loss and switching loss.

5.2 LOSSES IN VSC

5.2.1 Conduction losses

Conduction power loss occurs when the switch is in on position. Eq-4.1&4.2 gives the
conduction loss in an IGBT switch [Refer: AN of IGBT power loss calculation].

PCT  uCEO  ICavg  rC  (4.1)

2
ICrms

P u
1 ma cos1  2  1 ma (4.2)
I  r cos
1 
I 
CT CEO O
8  C O 8 3
2
   

Conduction loss in power diode is given in the equation Eq-3&4.

PCD  uDO  IDavg  rD  IDrms2 (4.3)

P u
1 ma cos1   1 ma (4.4)
I    I 2 1 
cos
O  
CD DO r O  D 8 3
2 8
   
Where,

𝒖𝑪𝑬𝑶 = IGBT on-state zero-current CE voltage (0.75 V)

𝒖𝑫𝑶 = on-state zero-current voltage drop across diode (1.25 V)

𝛥𝑢𝑐𝑒
𝒓𝒄 = CE on state resistance = ⁄𝛥𝐼 (0.045 Ω)
�
𝒓𝑫 = Diode on state resistance =
3
�
𝛥𝑢𝐷
⁄𝛥𝐼 (0.025 Ω)

𝑰𝒐 = √2 . 𝐼𝑜𝑟𝑚𝑠 (rms value of output current) (10 A)

𝑴𝒂 = Amplitude modulation index (0.98)

3
 𝐜𝐨𝐬 𝜱𝟏 = Motor displacement factor (1)

In order to find the u

CEO & rC , the output characteristics of IGBT is to be studied. Fig. 5-1

shows the output characteristics of Infineon IKW25T120 IGBT switch

Fig. 5-1: Output characteristics of IGBT Fig. 5-2: Forward current & voltage
switch characteristics of power diode

Similarly, uDO & rD , can be obtained from the forward current and forward
voltage characteristics of power diode as shown in Fig. 5-2.

Fig. 5-3: Figure showing the switching Fig. 5-4: Average power dissipation of
energy loss in an IGBT switch and diode three-phase diode bridge rectifier

3
5.2.2 Switching losses

Switching loss in both IGBT switch and anti-parallel power diode can be found using the
energy loss graph as shown in Fig. 5-3 . Average power dissipation in the diode bridge
rectifier can be found from the datasheet as shown in Fig. 5-4.

Total power loss,

= PCT + PCD Prectifier
PT
+
PT  130W
Thermal dissipation from junction to ambient is given by the Eq-4.5

JA
TJ TA (4.5)
 PT

RJA  110O  30O

0.615 OC / W (4.6)
130W 
Now the thermal resistance of IGBT & diode between junction and case as given in
datasheet would be parallel connected and the effective thermal resistance is 0.3939OC /W
as shown in Fig. 5-5.
Now, the thermal resistance of paste (1.5°C/W) used in the sink is added to get
1.8939°C/W (1.5 + 0.3939). Six such parallel IGBT’s are pasted onto the sink and thus the
overall thermal resistance is considered to be in parallel and it is 1.8939 / 6  0.31565OC / W .
Thermal resistance of the three-phase diode bridge included with the above resistance is
0.288°C/W as shown in Fig. 5-6.

Fig. 5-5: Thermal resistance of switch & Fig. 5-6: Thermal resistance including
diode diode bridge rectifier
Overall junction to ambient thermal resistance is shown in Fig. 5-7 and the sink to ambient
thermal resistance is taken for 10A current case.
 The volume of the heat sink is found from the following equation,
𝑉𝑜𝑙𝑢𝑚𝑒 𝑅𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (𝐶𝑚 2 °𝐶 /𝑊) 800
Volume = = = 1980 𝐶𝑚3 , @ 0.4043 °𝐶/𝑊
𝑇ℎ𝑒𝑟𝑚𝑎𝑙 𝑟𝑒𝑠𝑖𝑠𝑡𝑎𝑛𝑐𝑒 (°𝐶 /𝑊) 0.4043

Two heat sinks of volume 15X13X7.5cms are mounted on 32X30X2.5cms iron base plate.

Fig. 5-7: Overall thermal resistance from junction to ambient

5.3 PICTURES OF HEAT SINK

Fig. 5-8: Heat sink with hole drilled for IGBT switches

3
6 Chapter– 6: RECTIFIER UNIT & DC BUS CAPACITOR

6.1 INTRODUCTION
Selection of DC-link capacitor is an important part of designing the Voltage Source
Converter (VSC) circuit. In this section, a description of DC-link capacitor design and diode
bridge rectifier have been explained. In order to select a DC-link capacitor, the knowledge of
ripple currents flowing through the capacitor is necessary.

6.2 RIPPLE CURRENTS IN CAPACITOR

In the VSC circuit shown in Fig. 6-1, the ripple currents flowing in the DC-bus
capacitor can be divided into two categories. They are low frequency ripple of 300Hz ( Irh )

and high frequency ripple of multiple carrier frequencies ( Iih ). These ripple currents in DC-
bus depends on modulation index, load power factor, PWM strategy employed, PWM-VSC
carrier frequency and grid frequency [1]. Low frequency ripple ( Irh ) is found to be 5A from
Eq-1.

Irh  Pload /10Vphrms (1)

Irh  12103 = 5A
10 415
3

Where,
Ploa is rated load power (12KW) & Vphrms is the per phase grid voltage rms value.
d

3
Fig. 6-1:
Figure
showing
VSC, with
different
currents in
the circuit

3
 To calculate high frequency ripple current, double FFT 3-D graphics used in [2] is
used for the various operating points (shown in Fig. 6-2). For the selected operating point of

modulation index mi =0.78 and pf =0.86 and assuming motor load current of 25A (peak), the

high frequency ripple current I obtained is 8.075A. The total ripple current rating of DC-bus
ih

capacitor is found to be 9.5A using the Eq-2.

IC  I rhih
2 I2
(2)
IC  52  8.0752 =9.5A

The DC-bus capacitance value is 1390µF using the Eq-3.

CDC  Pload / (240Vripple Vphrms  fre )

(3)
12103
CDC  0.5 415 = 1390uF
240 600 50
100 3

Where, Vripple is 0.5% of VDC (600V) and fre is grid frequency

6.3 POWER CAPACITOR & BRIDGE RECTIFIER

The capacitor used is SEMIKRON’s SKC 3M3-40A-1, 10.1A, which is a 3300µF,

400V, 10.1A ripple current inverter grade capacitor. Two such capacitors are connected in
series to form the required capacitance. Three-phase diode bridge rectifier used is VS-
36MT120 rated for 1200V and 35A.

Fig. 6-2: The normalized rms equivalent centered DC bus current harmonics for SPWM, 1st
centered carrier frequency, 2nd, 3rd & 4th multiple carrier frequency

3
6.4 COMPONENTS & BOM
The component used and BOM of power circuit PCB is shown in the following table.

S PACK MOUSER QT UNIT Order

COMPONENT VALUE
NO AGE PART NO Y Price Price
ALUMINIUM
ELECTROLYTIC 3300uF, 871-
EPCOS
1 CAPACITOR – 400V, B43456A9 2 5168.8 10337.6
/TDK
SCREW 11A 338M
TERMINAL
BRIDGE
35A, 844-
2 RECTIFIER – D-63 1 872.9 872.9
1200V 36MT120
3PHASE
BLEEDER 588-
25KΩ, Chassis
3 RESISTOR- WIRE GW13J25 2 374.5 749
13W mount
WOUND K0E
0.22uF, 871-
SNUBBER FILM Lug
4 1250V B32656S72 2 648.9 1297.8
CAPACITOR - PP type
DC 24K564
BANAN
POWER A 548-31602-
5 DIL 11 161 1771
CONNECTORS CONNE 0
CTOR
RING 571-
8 LUG 30 15.47 464.1
TYPE 324955
ACRYLIC BOX &
7 INSULATION 1500
SHEET
THERMAL
9 500
SHEET
METAL BASE &
10 1000
FOR CAPACITOR

TOTAL ₹ 19,492.40
Tab. 6-1: BOM & List of components used in rectifier unit & other parts of VSC

4
6.5 TOTAL COST OF VSC
S No Circuit Cost

1 Gate driver 2,872.50

2 Gate pulse divider 1,646.79

3 Power Circuit 4,003.73

4 Rectifier, Capacitor Units & others 19,492.40

Total ₹ 28,015.41

Tab. 6-2: Total cost of Voltage Source Converter Setup

6.6 PICTURE SHOWING CAPACITOR & BRIDGE RECTIFIER

Fig. 6-3: SEMIKRON’s power capacitor & diode bridge rectifier

Fig. 6-4: Capacitor stand

4
 Fig. 6-5: Capacitor stand fixed on the heat sink

Fig. 6-6: Diode rectifier & IGBT switches mounted on heat sink

4
7 Chapter– 7: PICTURES OF COMPLETE VSC SETTINGS

7.1 CAPACITOR MOUNTING & DC BUS PLATES

Fig. 7-1: Power capacitors along with the power circuit board

Fig. 7-2: DC bus plates with the series connected power capacitors

4
7.2 VARIOUS LUGS USED IN VSC

Fig. 7-3: Lugs used in VSC’s internal connection

Lug Purpose – Connecting terminals

a Connecting banana connectors in power circuit & DC bus plates

b Bridge rectifier to DC bus plates & banana connectors

c Capacitor voltages (+ve, mid-point and -ve )

Tab. 7-1: Lugs connecting various terminals

4
7.3 DC BUS CONNECTION WITH RECTIFIER

Fig. 7-4: Steel strip used as an extension of –ve DC bus plate

Fig. 7-5: DC bus plates seen with bridge rectifier

Fig. 7-6: DC bus plate seen in top view

4
7.4 COMPLETE VSC

Fig. 7-7: Front view of VSC

Fig. 7-8: Side view of VSC

4
 Fig. 7-9: Top view of VSC

Fig. 7-10: Acrylic sheet to cover VSC

Fig. 7-11: Complete 2-Level VSC working setup

4
7.5 EXPERIMENTAL RESULTS OF VSI

Fig. 7-12: Experimental setup of VSI fed Induction motor drive

Fig. 7-13: Experimental results of VSI driving an Induction Motor

4
Fig. 7-14: Results obtained for an input DC voltage of 586V

Fig. 7-15: Results obtained for a maximum line current of IM

4
7.6 PCB SPECIFICATIONS
7.6.1 Gate driver circuit
Board Title:
Size (length x width):
Shape:
Number of Layers:
Component Type:
Hole diameter:
Minimum Trace Width/Gap:
Minimum Hole Size:
Board Surface Finish
Solder mask:
Electrical Test:
Special Info/Instructions:
Quantity:
7.6.2 Gate pulse divider circuit
Board Title:
Size (length x width):
Shape:
Material:
Number of Layers:
Component Type:
Hole diameter:
Minimum Trace Width/Gap:
Minimum Hole Size:
Solder mask:
Electrical Test:
HALF BRIDGE GATE DRIVER BOARD
99.9mm X 77.69mm/ As per Gerber file
Rectangular
2
As per Gerber file
Finished hole size
As per Gerber file
As per Gerber file
ENIG Immersion Gold RoHS
SMOBC. Green on both sides
Required
1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A-
6012 Class 2
3
GATE PULSE DIVIDER CIRCUIT BOARD
152.4mm X 88.9mm/ As per Gerber file
Rectangular
0.063" +/- [10%] high Tg FR4
2
As per Gerber file
Finished hole size
As per Gerber file
As per Gerber file
SMOBC. Green on both sides
Required
5
 Special Info/Instructions: 1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A-
6012 Class 2
Quantity: 1

7.6.3 Power circuit board

Board Title: INVERTER POWER CIRCUIT BOARD

Size (length x width): 255mm X 75.8mm/ As per Gerber file
Shape: Rectangular
Material: 0.063" +/- [10%] high Tg FR4
Number of Layers: 2
Component Type: As per Gerber file
Hole diameter: Finished hole size
Minimum Trace Width/Gap: As per Gerber file
Minimum Hole Size: As per Gerber file
Copper Thickness 2oz. Cu all layers
Solder mask: SMOBC. Green on both sides
Electrical Test: Required
Special Info/Instructions: 1. PCB Manufacturing process must be lead-free and
RoHS compliant.
2. PCB Manufacturing must be compliant with IPC-A-
6012 Class 2
Quantity: 1

5
 Reference
[1] A.M. Hava, U. Ayhan, V.V Aban, “A DC bus capacitor design method for various inverter
applications,” IEEE Energy Conversion Congress and Exposition (ECCE), Sep 2012.

[2] U. Ayhan, A.M. Hava, “Analysis and characterization of DC bus ripple current of two-
level inverter using the equivalent centered harmonic appraoch,” IEEE Energy Conversion
Congress and Exposition (ECCE), Sep 2011

[3] Final datasheet of Infineon’s EiceDRIVER 2ED020I12-F2, Dual IGBT Driver IC

[4] Datasheet of Infineon’s discreet IGBT IKW25T120 series

[5] Infineon AN-2006-01: Application Note for driving IGBT’s with unipolar gate voltage

[6] Infineon AN-2014-06 1EDI Compact family: Application Note for Gate driver IC.

[7] Infineon Application Note on “Explanation of discrete IGBTs’ datasheet.

[8] Infineon AN-2013-12: Application Note on “Recommendation for screw tightening

torque for IGBT discrete devices”.

[9] Infineon AN, V1.1, Jan 2009, “IGBT Power losses calculation using the datasheet
parameters” – Refer three phase AC motor drive.

[10] “How to select heat sink” by Seri Lee.

[11] Texas Instruments’ App Report SLVA462-May 2011, “Understanding thermal

dissipation & design of a heat sink”.

[12] Datasheets of all the discrete components used in VSC circuit.