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Experimental and Numerical Study of Perforated Fin Heat Sinks Systems
Thesis · May 2014
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Republic of Iraq
Ministry of Higher Education and
Scientific Research
Foundation of Technical Education
Technical College-Baghdad
Experimental and Numerical Study

of Perforated Fin Heat Sinks Systems
A Thesis
Submitted to College Council of Technical
College-Baghdad / Foundation of Technical Education
In a Partial Fulfillment of the Requirements for the Degree of
Master of Technology in Thermal Engineering
Technology
By
Anmar Adnan Abbas Al-Turfi
Supervisors
Dr. Ahmed Q. Mohammed Dr. Ali Shakir Baqir

Asst. Prof Lecturer
March 2014 Jumada Al-Awwal 1435

‫بسم اهلل الرحمن الرحيم‬
‫ين يَ ْستَ ِمعُو َن الْ َق ْو َل فَ يَتَّبِعُو َن‬ ‫ذ‬‫(الَّ ِ‬

‫َ‬
‫اه ُم‬ ‫د‬ ‫ه‬ ‫ين‬ ‫ذ‬‫ِ‬ ‫َّ‬
‫ل‬ ‫ا‬ ‫ك‬ ‫ِ‬
‫َح َسنَهُ أ ُْولَئ َ‬
‫َ ََ ُ‬ ‫أْ‬
‫اب‪‬‬ ‫ك ُه ْم أ ُْولُوا ْاْلَلْبَ ِ‬ ‫ِ‬
‫الل ُ َ ْ َ‬
‫ئ‬‫َ‬‫ل‬‫ُو‬‫أ‬‫و‬ ‫ه‬ ‫َّ‬
‫صدق اهلل العلي العظيم‬

‫سورة الزمر‪81 /‬‬
‫اإلهـــــــداء‬
‫إىل النيب األمي الذي علم األمم‪ .....‬رسولنا الكريم‬
‫(صلى اهلل عليه واله وصحبه وسلم)‬
‫إىل كل عني بكت من خشيــــــــــة اهلل‬
‫إىل كل عني باتت حترس يف سبيـــــل اهلل‬
‫إىل الشموع احملرتقة ومناهل العلم ‪........‬أساتذتي األفاضل‬
‫إىل روح من علمين االخالص والوفاء‪،‬معلمي األول وقدوتي يف احلياة ‪ ........‬والــدي‬
‫إىل من غمرتين بفيض دعائها ‪،‬فيض احلنان ورمز العطاء ‪ .....‬امـــي‬
‫اىل القلوب اليت خفقت علي خوفاً ‪ .....‬اخوتي واخواتي‬
‫إىل من قامسين املشقة والعناء زوجيت واوالدي ‪ ...‬أمحد وحسني‬
‫إىل االيدي اليت امتدت الي واستنهضتين‪.............‬اصدقائي االوفياء‬
‫وبكل تواضع ‪ ...........‬اهدي اليكم مثـرة جهدي هذا‬

Acknowledgment
As I present this study, I want to present my gratitude to God in most

sincere thanks for success in my study and for supplying me with strength and
patience to complete it.
I feel obliged to present my great thanks and gratitude to those who have
kindly and patiently supported me in my research, first of all my supervisors
Dr. Ahmed Q. Mohammed and Dr. Ali Shakir Baqir for their valuable
supervision and helpful suggestions throughout the course of this study.
Special thanks go to the Dr Mudhaffar.S Al-Zuhairy Dean of Technical
College–Baghdad, Dr. Abdual Hadi N. Khalifa Deputy Dean for Postgraduate
studies and Scientific Research and Dr. Ahmed J. Hamad, Head of the
Engineering Techniques of Refrigeration and Air-conditioning Department.
Teaching Staff of higher studies in my college for their efforts make me proud
and grateful.
Also I would like to record my great appreciation to Southern Cement
State Company and Al-Kufa Cement Plant Administration for giving me
opportunity to complete my higher study.
In Technical College -Najaf, where I found salutation, aid and advice deep
gratitude goes to Dr.Alla M. Aljasany, Dr.Wisam A. Abd ALwahid , Mr. Basil
Noori Merzah, Mr. Bassam A. Mohammed and Laboratories staff.
My great thanks and appreciation go to my family for their patience and
sacrifice. Finally I wish to thank all friends for their cooperation.
Anmar Adnan
Abstract
This study investigated experimentally and numerically the pressure drop

reduction and heat transfer enhancement over staggered perforated pin fins in
rectangular channel with air cross flow. Experimentally, the channel had duct
cross section width (w) of 62 mm, cross section depth (l) of 167 mm and duct
length (L) of 1200 mm. The experimental work covers the following range:
Reynolds number 28000-113000, pin fins shape solid, horizontal/vertical (HV)
perforation and horizontal/ lateral / vertical (HLV) perforation pin fins.
Correlation equations were developed for the heat transfer and pressure drop.
Experimental results show that the Nusselt number of pins with
horizontal/vertical (HV) perforation is about 11% higher than that for solid pins
and with horizontal / lateral /vertical (HLV) perforation is about 21% higher than
that for the solid pins. Pressure drop with horizontal/vertical (HV) perforated is
reduced by about 23% compared with that in solid pins and with horizontal/
lateral / vertical (HLV) perforated is reduced by about 19% compared with that in
solid pins. In addition, experimental results show that pins with horizontal/ lateral
/vertical (HLV) perforation, have a good enhancement of heat transfer in addition
to the significant reduction in weight by about 21.65 %in comparison with solid
pins.
Numerical investigation done by using ANSYS-CFX-12.Its results showed
that the velocity vectors intensity for HLV pin fin are higher than for HV pin fin
because the lateral perforations provide lower pressure inside the horizontal
perforations and they allow the flow to pass inside them. Also, HLV perforation
pin fins gave a higher reduction in surface temperatures than that for solid pin
fins and HV perforation.
Finally, present numerical results are seen to be in excellent agreement with the
experimental results (i.e. for enhancement heat transfer with error ± 7% and for
pressure drop with ± 9%).
Contents
Subject Page
Supervisors Certification I
Committee Certification II
Acknowledgment III
Abstract IV
Contents V
Nomenclature VIII
List of Figure X
List of Table XII
Chapter One : Introduction
1.1 General 1
1.2 Heat Sink Systems 2
1.3 Perforated Fins 7
1.4 Aim of the Present Work 9
1.5 Organization of the Study 9
Chapter Two: Literature Review
2.1 General 01
2.2 Forced Convection through Heat Sink System 00
2.2.1 Experimental Studies 00
2.2.2 Numerical Studies 22
2.2.3 Experimental and Numerical Studies 29
2.3 Literature Review Summary 33
Chapter Three: Experimental Work
3.1 General 33
3.2 Experimental Setup 33
3.3 Thermal Conductivity (k) Measurement 47
3.4 Heat Sink Fabrication 48
3.5 Data Collection 51
3.5.1 Measurement Reliability and Calibration 51
3.5.2 Temperature Measurement 52
3.5.3 Velocity Measurement 52
3.5.4 Pressure Drop Measurement 52
3.5.5 Steady State Condition 53
3.6 Experimental Procedure and Measurements 53
3.6.1 Experimental Procedure 53
3.6.2 The Measurements Procedure 55
3.7 Data Processing and Analysis 56
Chapter Four: Numerical and Computational Analysis
4.1 General 60
4.2 CFD and Numerical Investigation 60
4.3 Governing Equations 61
4.4 Turbulence Models 63
4.4.1 Two Equation Turbulence Models 63
4.4.2 Shear Stress Transport (SST) 64
4.5 Finite Volume Method (FVM) 65
4.6 Geometry of Simulated Heat Sinks 66
4.7. Mesh Generation and Grid Computation 68
4.7.1 Mesh Generation 68
4.7.2 Grid Computation 69
4.7.2.1 Tetrahedral Mesh 70
4.7.2.2 Checking and Editing the Mesh 70
4.7.2.3 Mesh Quality and Mesh Dependency 71
4.7.2.4 Total Element Number 76
4.7.2.5 Generating the Input for the Solver 76
4.8 ANSYS CFX 76
4.8.1 Pre-CFX 78
4.8.2 Solver 80
4.8.3 CFD-Post 81
4.9 CFD-Post Tool Menu 82
Chapter Five : Results and Discussion
5.1 Experimental Results 83
5.1.1 Heat Transfer 83
5.1.2 Friction Factor ( f ) 84
5.1.3 Overall Thermal Efficiency (η) 84
5.1.4 Fin Effectiveness ( ) 84
5.1.5 Total Thermal Resistance ( ) 85
5.2 Numerical Results 90
5.2.1 Profiles Velocity and Pressure Drop Vectors and Contours 90
5.2.2 Thermal Dispersion Contour 91
5. 3Numerical Data Analysis 99
5.3.1 Heat Transfer 99
5.3.2. Friction Factor ( f ) 99
5.3.3. Overall Thermal Efficiency (η) 100
5.3.4 Total Thermal Resistance ( ) 100
5.3.5 Weight Reduction 100
5.4 Present Work Correlation and Validation 103
5.4.1 Enhancement of heat transfer and friction factor correlations 103
5.4.2 Validation 106
Chapter Six :Conclusions and Recommendations
6.1 Concluding Comments 108
6.2 Conclusions 108
6.3 Recommendations 110
References
References 111
Appendix
Appendix 116
Nomenclatures
Symbol Definition Units

As Heat transfer area m2
b Test section base length and width mm
c Clearance between the fin and duct mm
cp Specific heat at constant pressure J/kg.K
d Diameter of pin fins mm
dh Hydraulic diameter of the duct mm
dhp Horizontal perforation diameter mm
dlp Lateral perforation diameter mm
dvp Vertical perforation diameter mm
f Friction factor -
Gravitational acceleration component in x, y m /sec2
g x, y, z
and z directions respectively
H Height of the pin fins mm
h Heat transfer coefficient W/m2 K
k Thermal conductivity W/m.K
l Duct cross section depth mm
L Duct length mm
N Pin fins number -
Np Perforation number -
Nu Nusselt number -
P Pressure Pa
Re Reynolds number -
o
Total thermal resistance c/W
S Pitch mm
o
T Temperature c
u Components of velocity vector in x direction m/s
V Average inlet velocity m/s
v Components of velocity vector in y direction m/s
w Duct cross section width mm
w Components of velocity vector in z direction m/s
Greek Symbols
Symbol Definition Units

β Coefficient of thermal expansion (compressibility) -
∆P Pressure drop Pa
fin effectiveness -
Thermal efficiency Pa -1
ρair Density of air kg m-3
Viscosity of air kg m-1 s-1
Φ Dissipation function -
Subscripts
Symbol Definition
av Average
base Refer to the fin base
HLV Horizontal/lateral/vertical perforation
HV Horizontal/vertical perforation
in Inlet
m Mean
out Outlet
s Smooth
∞ Free stream
Superscripts
Symbol Definition
‫ــــ‬ Average
Abbreviation
Symbol Definition
2D Two dimension
3D Three dimension
CFD Computational Fluid Dynamics
HLV Horizontal/lateral/vertical perforation
HV Horizontal/vertical perforation
List of Figures
Figure Caption Page

1-1 Epoxy-bonded fin heat sinks 5
1-2 Pin-Fin heat sinks 6
1-3 Folded fin heat sinks 6
1-4 Heat sink types, manufacturing and its pros and cons. 8
2-1 Diagram description of the pin-fin arrays 11
2-2 Square pin fins array. 14
2-3 The arrangements of fins on plate 15
2-4 heat sinks geometry (a) plate fin (b) pin fin (in line) (c) pin fin (staggered) 16
2-5 Perspective view of heat exchanger 18
2-6 plate-fin and pin-fin heat sinks 19
2-7 Solid and perforated fin arrays 20
2-8 Experimental Set-up 20
2-9 Pin fin arrays with different perforations 21
2-10 Schematic diagram of heat sinks 22
(a) Cross-sections of pin fins selected for comparison, (b) Elliptical cross-
2-11 23
section parameters constituting input optimization variables
2-12 Heat-Sink with Perforated Rectangular Ribs Model 24
2-13 Computational domain for solid and perforated fin arrays 25
2-14 Computational domain for solid and perforated fin arrays 26
2-15 Pin fin heat sink arrangement 27
Pins with different perforation number, horizontal diameters and vertical
2-16 29
diameters
2-17 Pin-fins and fins arrangements 30
Geometries, dimensions and simulated channels (a) Plain fin heat sink, (b)
2-18 32
Pin fin heat sink
3-1 Experimental Setup 35
3-2 Schematic diagram of the Experimental Setup 36
3-3 (a) bell shape income (b) flow straighter 47
3-4 Centrifugal ventilator 47
3-5 Heating element and thermocouples location 37
3-6 Computer Control System 39
3-7 Diaphragm differential pressure gauge 41
3-8 Pitot static tube 41
3-9 Digital differential manometer and certification 42
3-10 Digital anemometer. 43
3-11 Wattmeter, voltmeter and ammeter 43
3-12 Variable transformer 44
3-13 (a) digital ovometer (b) digital clamp meter 44
3-14 Thermal imaging camera 46
3-15 (a) Apparatus of thermal conductivity measurement (b) Test specimen 47
3-16 Design of tested heat sinks 49
Figure Caption Page
3-17 perforation drill jig 50
3-18 (a)Sample of pin fin model and (b) heat sink base 50
(a)solid pin fin array, (b) pin fin array with horizontal / vertical (HV)
3-19 perforations and (c) pin fin arrays with horizontal/lateral/vertical (HLV) 51
perforations.
3-20 heating element power control 55
(a) Isometric view of channel ,(b) back of channel ,(c) solid pin fin, (d) pin
4-1 67
fin with HV perforations and (e) pin fin with HLV perforations .
4-2 Three type perforation and the air flow direction through pin fin heat sink. 68
4-3 Solid domain (Aluminium) meshing. 72
4-4 Fluid domain (Air) 72
4-5 Inlet and outlet region (volume mesh) 73
4-6 Variation of Base temperature with total element number. 74
4-7 Variation of Duct Pressure Gradient with total element number 74
4-8 Variation of Mesh fineness with total element number. 77
Temperature distribution field of A: solid pin fin array, B: pin fin array
5-1 with horizontal /vertical (HV) perforations and C: pin fin arrays with 86
horizontal/lateral/vertical (HLV) perforations.
Variation of Nusselt number with Re for solid pin fin, HV perforations and
5-2 87
HLV perforations.
Variation of duct friction factor with Re for solid pin fin,
5-3 87
Variation of thermal efficiency with Re for solid pin fin, HV perforation
5-4 88
and HLV perforation.
Variation of overall enhancement ratio with Re for solid pin fin,
5-5 88
Variation of fin effectiveness with Re for solid pin fin, HV perforation
5-6 89
Variation of total thermal resistance with Re for solid pin fin, HV
5-7 89
perforation and HLV perforation
3-D Velocity vectors for fluid flow through solid pin fins, HV pin fins and
5-8 92
HLV pin fins at the two values of inlet velocity 5 m/s and 20 m/s
2-D Velocity contour for fluid flow through solid pin fins, HV pin fins and
5-9 93
HLV pin fins at inlet velocity 5 m/s.
2-D Velocity contour for fluid flow through solid pin fins, HV pin fins and
5-10 94
2-D pressure contour for fluid flow through solid pin fins, HV pin fins and
5-11 95
2-D pressure contour for fluid flow through solid pin fins, HV pin fins and
5-12 96
3-D temperature contour for solid pin fins, HV pin fins and HLV pin fins at
5-13 97
inlet velocity 5 m/s.
Fig (5.14) 2-D temperature contour for solid pin fins, HV pin fins and HLV pin fins at
5-14 98
Variation of Nusselt number with Re for solid pin fin, HV perforation and
5-15 101
HLV perforation.
Figure Caption Page
5-16 Variation of duct friction factor with Re for solid pin fin, HV perforation
101
Variation of thermal efficiency with Re for solid pin fin, HV perforation
5-17 102
and HLV perforation
Variation of overall enhancement ratio with Re for solid pin fin, HV
5-18 102
Variation of total thermal resistance with Re for solid pin fin, HV
5-19 103
Heat transfer enhancement factor as a function of equivalent Reynolds
5-20 105
number for three shapes.
Duct Nusselt number vs. Reynolds number for present experimental and
5-21 numerical results with various interfin spacing ratio and clearance ratio for 106
Sara 2003.
Average Nusselt number vs. Reynolds number for present experimental
5-22 107
and numerical results
Friction factor vs. Reynolds number for present experimental and
5-23 107
numerical results.
List of Table
Table Caption Page

3-1 Geometric description of tested heat sinks 49
3-2 Time required to reach steady state condition 53
4-1 Dimensions of pin fin heat sink 66
4-2 Mesh Dependency Assessment and Results Accuracy 73
Fineness of the Mesh part as a ratio to the standard element
4-3 76
size
4-4 Domain Physics 78
4-5 Boundary Physics 79
4-6 Solver control 81
Chapter One
Introduction
Chapter One Introduction
Chapter One
Introduction
1.1 General
Electronic equipment has made its way practically through every aspect of
modern life, from toys and appliances to high power computers. The reliability of
electronics of a system is a major factor in the overall reliability of the system.
Electronic components depend on the passage of electric current to perform their
duties, and they become potential sets for excessive heating, since the current
flow through a resistance is accompanied by heat generation. Continued
miniaturization of electronic system has resulted in a dramatic increase in the
amount of heat generated per unit volume. Unless properly designed and
controlled, high rate of heat generation results in high operating temperatures for
electronic equipment, which threatens its safety and reliability.
The failure rate of electronic equipments increases exponentially with

temperature. Also, the high thermal stress in the solder joints of electronic
components mounted on circuit boards resulting from temperature variation are
major causes of failure. Therefore, thermal controls have become increasingly
important in the design and operation of electronic equipments. [1]
During the past few years, the electronics industry has been demanding
more and more efficient heat exchanger designs. In particular, the speed of
electronic chips is seriously bounded by the thermal power that the chips
produce. As a consequence, electronics chips have to be intensively cooled using
specially designed heat exchangers submerged into air or water flow as in printed
circuit board, central processor unit, uninterrupted power supplies (UPS),
1
telecommunications systems, airplanes, satellite, space vehicles, ships,

submarines and missiles.
In electronic equipments, total system dissipated power levels are

increasing with every new design. Increase in power levels combined with the
market expectation of reduced package sizes leads to heat problem. This problem
if uncontrolled can significantly shorten the life of the electronic components.
Although this "increased power- decreased size" development has been

prevalent for many decades, the industry's ability to make smaller electronic
components reduces cooling components size. Market demands have shifted
attention to decreasing the volume and increasing thermal efficiency. For some
electronics components, UPS and telecommunications systems, the market also
demands reduced floor space and puts sever limitations on acoustic noise. These
limitations force designs toward more expensive heat removal techniques.
Total power level is not the only problem. Heat density or Watts per square
centimeter, at the semiconductor is a growing problem, too. This is the result of
dense electronics and increased clock frequencies. High heat flux densities
combined with high overall power levels are the main problems for thermal
management. These thermal challenges can cause failure even if the heat sink
surface area and air flow are sized correctly.
The constant demand for speed and performance in electronics is unfortunately

accompanied by ever increasing thermal dissipation. Air heat exchanger or "heat
sink" (HS) continues to be the most feasible thermal solution for the electronic
industry primarily because of low cost and high reliability.
1.2 Heat Sink Systems
According to a U.S. Air Force study [2] the four primary sources of stresses
that cause failures in avionics systems are temperature (55%), vibration (20%),
excessive humidity (19%) and dust (6%).Humidity is also a temperature related
2
phenomena. Therefore, a total of (74%) of break down results from thermal over
stressing. Therefore, removal of heat by an effective cooling technique is often
required. Cooling for electronic system is usually needed to maintain the
component temperature lower than 50ºC in order to achieve prolonged mean life
between failure and replacements. Fins are frequently used in heat exchanging
devices to increase the heat transfer rate from surface and the surrounding fluid.
Various types of fin geometry employed include rectangular, cylindrical, square,
elliptical, diamond and tapered pin-fin configurations. [3,4]
The pin-fin array system’s heat transfer characteristics have been the
subject of extensive investigation because of its importance. Commonly used heat
sink is pin-fin type. A pin-fin is an element attached perpendicular to a wall
against the fluid flow. There are various parameters characterizing the pin-fins
are, by shape, height, diameter and height to diameter ratio. In addition to the
physical geometry, pin-fins are positioned in arrays either inline or staggered
with respect to the flow direction. The pin-fin finds variety of engineering
applications like compact heat exchangers and the cooling of advanced gas
turbine blades and electronic devices. For a given base plate temperature, heat
transfer rate could be enhanced based on the Newton‘s law of cooling by altering
the values of heat transfer coefficient or surface area and while limiting the
temperature difference. An increase in heat transfer coefficient can be achieved
via forced convection or changing fluid (not practicable always). The alternate is
by changing the geometry of the heat sink to enhance the heat transfer.
Heat sink for electronics depends on conduction from the electronic package
to the heat sink base, followed by conduction into the extended surfaces and
convection to the cooling fluid. The rate of heat dissipation depends on the (i)
temperature distribution in pin-fins and its assembly (ii) pin-fin geometry (iii)
pin-fin arrangement (iv) fluid flow rate and (v) Tip clearance (vi) fluid flow
direction. [5]
3
A unique feature of heat exchanger used in electronics is the possibility that

the flow can bypass the heat exchanger core entirely, and leak from the core to
the bypass duct.
Increasing power density in electronic systems increase the cooling design

of electronic package. In particular, since the use of complex geometric heat
sinks is prevalent in the cooling of all computers (from laptops to mainframes),
the need for effective modeling tools which are preferably well integrated with a
mechanical design tool is very important. These models, if used appropriately,
will significantly reduce the time required for new products.
Where the heat exchanging structures are isothermal, the heat exchangers in
the electronics industry consist mostly of highly conducting materials. This
further complicates numerical calculations as well as experimental work due to
the conjugate nature of heat transfer.
The use of heat sinks to improve the heat transfer rate from a module has to be
implemented with great care. The increased surface area usually requires an
increase in the air pressure drop in that region, and if there are other paths for the
air to flow through at a lower pressure drop, the resulting air starvation in
"enhanced" region may actually result in a lower heat transfer rate. Careful
analysis or testing is therefore necessary under the actual system condition to
ensure effectiveness of the design.
Flow through heat sinks refers to heat sinks wherein the flow enters the
heat sinks from one end and travels more or less in a straight line to exit from the
other end. One of the simplest and most cost-effective heat sink designs used is
the linearly extruded aluminum heat sink. Aluminum has many characteristics
that make it an excellent heat sink material such as its high thermal conductivity
(150 -237) (W/m K), it is easily in fine detail machining with inexpensive tools.
4
Aluminum alloys (6063 or 6061) are most common, followed by copper

(which is 4-6x more expensive, 3x as heavy, by having 2x the conductivity).
Fig. (1-1) Epoxy-bonded fin heat sinks.
These heat sinks consist of an extruded or machined base, which is flat on

the module-facing side and grooved on the fin side. The fins are then epoxies into
the grooves. The epoxy interface does, however, add a thermal resistance to the
system. This difficulty can be overcome by brazing or soldering the fins to the
base, resulting in reduced overall resistance at a higher cost [6,7]. Both aluminum
and copper can be used to construct this type of heat sink, depending on the
system requirements and allowable overall weight.
Pin-fin heat sinks are also commonly used and have the added advantage
of not requiring specific positioning relative to flow direction. Pin-fin heat sinks
can be manufactured either by starting with a linearly extruded parallel plate heat
sink and then cutting the plates to form the pins, or by building them using more
costly specialized techniques such as epoxy bonding, brazing and soldering.
5
Round pins or other cross-section shapes can also be manufactured using casting
as shown in Fig. (1-2).
Fig. (1-2) Pin-Fin heat sinks.
Other commonly used heat sinks include folded-fin heat sinks where sheet
metal (0.005) to (0.08) cm is corrugated to form fins as in Fig. (1-3).
Fig. (1-3) Folded fin heat sinks.
6
For parallel plate heat sinks it is important to design the heat sink
accounting for all air flow paths, since the air can by-pass the heat sink if other
low-resistance paths exist.
Manufacturing of heat sinks widely spreads to provide thermal solutions for

fast development in electronics production (growing energy and declining
volume).
Heat sink types, manufacturing and its pros and cons are illustrated in Fig.(1-4)
1.3 Perforated Fins
The presence of perforations in the extended surfaces (fins) have many

benefits. Therefore many researchers and manufacturer adopted them as that
lead to increasing the overall convection area and good thermal management of
the electronics, decreasing the pressure drop across heat sink, reduction of fin’s
weight significantly which leads to saving material effectively in heat sinks
manufacturing as well as lighter assembly. Perforation holes act like cavities and
the flow is confined inside the perforations .The use of perforated fins explains
cost and energy benefit of utilization of the new design for perforated fins.
Therefore, the present study is concerned with heat sink systems having
perforated pin fin which are used to dissipate thermal energy from electronic
devices.
7
Available at: www.qats.com Advanced Thermal Solution Inc. USA
Fig. (1-4) Heat sink types, manufacturing and its pros and cons.
8
1. 4 Aim of the Present Work
The main purpose of the present work is to gain a deeper insight about
perforated pin fin heat sink systems through studying temperature and velocity
distribution of four configurations of pin fin heat sinks at different inlet velocity
and heat flux by using experimental and numerical techniques .that can be
achieved through:
1- Numerical investigation of the fluid dynamics and heat transfer process of

three–dimensional (3-D) model of multiple configuration perforated pin fin
heat sinks by using (ANSYS-CFX- 12.0).
2- Experimental investigation of the fluid dynamic and heat transfer process for
perforated fin heat sink.
3- Identifying and studying the effect of variation of the non-dimensional

parameters governing the flow and heat transfer for perforated fin heat sink.
1.5 Organization of the Study
This chapter introduces the topic and explained the motivation for the
work. The following chapters provide background information and outline the
proposed research method as well as present results and conclusions. Chapter 2 is
an extensive review of the research of flow behavior of fluid flow through non-
perforated and perforated pin fins in laminar flows including those conducted in a
backward facing step. Chapter 3 provides a description of the research facility,
the setup for selected measurement techniques and analysis procedures. Chapter 4
provides the theory and computational analysis related to particle flow. Results
are shown and discussed in Chapter 5 followed by summary, conclusions and
recommendations in Chapter 6.
9
Chapter Two
Literature Review
Chapter Two Literature Review
Chapter Two
Literature Review
2.1 General
Heat transfer enhancement techniques are broadly classified into three

different categories; Passive Techniques, Active Techniques and Compound
Techniques. Passive Techniques do not require any direct input of external power
rather; they use it from the system itself which ultimately leads to an increase in
fluid pressure drop. Surface or geometrical modifications are generally used to
flow channel by incorporating inserts or additional devices. They promote higher
heat transfer coefficients by disturbing or altering the existing flow behavior
except for extended surfaces.
Heat transfer enhancement by these techniques can be achieved by using

treated surfaces, rough surfaces, extended surfaces, displaced enhancement
devices, coiled tubes, additives for liquids, and additives for gases.
Active Techniques In these cases, external power is used to facilitate the

desired flow modification and the concomitant improvement in the rate of heat
transfer. Augmentation of heat transfer by this method can be achieved by
mechanical aids, surface vibration, fluid vibration, electrostatic fields, injection,
suction and jet impingement.
The last one is compound techniques in which any two or more of these
techniques are employed simultaneously to obtain enhancement in heat transfer
that is greater than that produced by either of them when used individually. This
technique involves complex design and has limited applications.[8]
01
There have been many experimental, theoretical and numerical

investigations regarding heat transfer enhancement and pressure drop reduction in
channels with heat sink system. In this study passive techniques are used to
enhance heat transfer through heat sink system by using extended surfaces with
geometrical modifications to achieve higher values of the product of heat transfer
coefficient and heat transfer surface area.
An extensive review of the conducted researches related to flow behavior

through the heat sink system includes.
2.2 Forced Convection through Heat Sink System
2.2.1 Experimental Studies
Sparrow and Ramsey (1978) [9] and Sparrow et al. (1980) [10] presented
the earliest experimental study for the flow and heat transfer between the fin
array .They conducted experimental studies on in-line and staggered pin-fin
arrays, with various pin-tip clearances as shown in fig.(2-1). The pressure drop
was measured across the arrays, and the heat transfer was measured by applying
the analogy between heat and mass transfer to mass transfer coefficients
measured via the Naphthalene sublimation technique.
Fig. (2-1) Diagram description of the pin-fin arrays [9], [10].
00
The open circles depict the deployment of the cylinders that comprise the in-
line arrays studied here while the black circles depict the deployment of
staggered array. The quantities (ST, SL and D) are identical for the two arrays,
with (ST/D=3), (SL/D= 3 2 ) (ST/D≈ 2.6), (D=0.556) cm. The experiments
encompassed h/H ratio of (0.29), and (0.875) with (H=1.91) cm. For most of the
cases studied, the row-by-row heat transfer coefficient was found to vary only in
the initial rows, and attained a fully developed heat transfer coefficients also
found to be insensitive to the pin height, that is to tip clearance. The coefficients
increased moderately as the fin height increased (and thus the clearance
decreased).The pressure drop was very sensitive to the fin height; it was also
found that in-line arrays had a lower heat transfer coefficient, but also had a
lower associated pressure drop across the heat sink, probably due to the increase
in air by-pass.
Sara , et al.(2000) [11] studied the thermal performances of solid and

perforated rectangular blocks attached to a flat surface in a rectangular duct with
respect to the heat transfer from the same plate without blocks by using the heat
transfer enhancement efficiency as a performance criterion . They obtained
experimentally the data used in the performance analyses for varying flow and
geometrical conditions. They found that the solid blocks generate a net energy
loss despite significantly enhanced heat transfer due to the increased heat transfer
surface area. When they perforated the blocks, the loss in the net energy was
recovered and depending on the geometrical and flow conditions, a net gain in
energy, up to 20%, was achieved. Also, they found for both the solid and the
perforated blocks increase in Reynolds number led to decreases in the
performance. For the perforated blocks, the higher the perforation diameter,
perforated area open area ratio, and inclination of the perforation holes towards
the surface of the plate, the better their heat transfer enhancement performance.
Increases in the number of blocks leads to a better performance for the perforated
blocks, but for the solid blocks, it makes no difference.
01
Ho Chul Ryu, et al. (2002) [12] analyzed experimentally heat transfer and
fluid flow in square pin fin heat sinks . They tested twenty aluminum square pin
fin heat sinks having a 101.43mm x 101.43 mm base size with inlet velocity
ranging from (1-5) m/s . In each test, the heat sink was heated uniformly at the
bottom. They investigated the effects of heat sink height and the ratio of the
spacing between the adjacent fins to the fin pitch on the pressure drop across the
heat sink and the thermal resistance of the heat sink. They concluded that
increasing the inlet velocity leads to increasing pressure drop across a heat sink,
decreasing the thermal resistance of a heat sink. Increasing the fin height
increases the pressure drop across a heat sink to an asymptotic value and the
thermal resistance of a heat sink decreases . They found that as surface porosity
(εx) or perforation increases, the pressure drop across a heat sink decreases and
the thermal resistance of a heat sink increases .
Sara (2003) [4] analyzed convective heat transfer through a rectangular

channel with square cross section pin fins attached to a flat surface as shown in
fig.(2-2). The heat transfer and friction characteristics and performance were
studied. The pin fins were arranged in a staggered manner. The effects of the flow
and geometrical parameters such as clearance ratios (C=H) and interfin distance
ratios (Sx=D) were studied. He analyzed performance under a constant pumping
power constraint. The experimental results show that the use of square cross-
section pin fins may leads to an advantage on the basis of heat transfer
enhancement. For higher thermal performance, lower interfin distance
ratio(higher number of pin fins) and clearance ratio(longer pin fins) and
comparatively lower Reynolds numbers should be preferred for the staggered
arrangement, while the friction factor increases with decreasing clearance ratio
and interfin distance ratio. The Nu was higher for the staggered pin fins
arrangement than that for an inline arrangement for all values of C=H, especially
at lower Reynolds number. The heat transfer enhancement factor Nu * was higher
01
than unity for all investigated conditions. He found that the use of pin fins leads
to an advantage on the basis of heat transfer enhancement.
Fig. (2-2) Square pin fins array. [4]
Akyol and Bilen (2006) [13] investigated experimentally the heat transfer
and friction loss characteristics in a horizontal rectangular channel having
attachments of hollow rectangular profile fins over one of its heated surface as
shown in fig (2-3). The Reynolds number based on the flow averaged inlet
velocity and the hydraulic diameter, ranged from 3000 to 32,000. They mounted
hollow rectangular profile fins in 10 cm height and (a · b =2cm · 4 cm)
dimensions with a thickness of 0.2 cm on a heating surface vertically. Reynolds
number, fin arrangement and fin pitch in the flow direction were the experimental
parameters. They studied both in-line and staggered fin arrangements for one-
fixed spanwise (Sx/a = 3) and four different streamwise (Sy/b = 1.5, 1.875, 2.5 and
3.75) distances. Correlation equations for Nu, friction factor f and thermal
performances were determined for fin configurations and the straight channel
case without fins. They concluded that both in-line and staggered fin
arrangements significantly enhance the heat transfer in comparison to the surface
without fins, Nu increases with increasing Re both on the basis of the total
01
surface area and the projected area for in-line and staggered arrangements, since
increasing Re decreases the boundary layer over the surface. A slightly better
heat transfer was achieved for the staggered array than for the in-line
arrangement on the basis of total surface area due to the increase of the
turbulence and better mixing of the flow. For staggered arrangement, increase in
Re increases the pressure drop and corresponding friction factor. For the
staggered array, the dependence of the variation of Nu with fin spacing was
smaller than the in-line arrangement on the basis of total surface area, because
more space between fins was needed to provide a better mixing of the flow for in-
line arrangement. For the in-line array, the dependence of the variation of f on
fin spacing was smaller than the staggered arrangement. In the calculation of
performance efficiency based on the total surface area,  was greater than unity
only at Sy/b = 3.75 for the in-line array, and the values of  were less than unity
for the remaining ratios in both arrangements. For both in-line and staggered
arrangements based on the projected area, the performance efficiency  was
greater than unity for all fin spacings and Reynolds numbers.
Fig. (2-3) The arrangements of fins on plate [13]
Kai-Shing Yang, et al. (2007) [14] conducted a comparative study of pin

fin heat sinks having circular, elliptic, and square cross-section as shown in
fig.(2-4). They made a total of twelve pin fin heat sinks with inline and staggered
arrangements and tested them. They examined effect of fin density on the heat
transfer performance. For an in-line arrangement, the circular pin fin showed an
01
appreciable influence of fin density whereas no effect of fin density was seen for

square fin geometry. This was associated with the unique flow deflection pattern
accompanied the in-line circular fin configuration. For the staggered arrangement,
the heat transfer coefficient increased with the rise of fin density for all the three
configurations. The elliptic pin fin showed the lowest pressure drops. For the
same surface area at a fixed pumping power, the circular pin fin had the smallest
thermal resistance at an inline arrangement. One of the reasons for superior
performance of circular pin fin under in-line arrangement was associated with the
unique flow deflection. For a staggered arrangement where deflection flow
pattern vanishes, the elliptic pin fin produced slightly better performance than
circular pin fin surface and the elliptic pin fin had the smallest thermal resistance
for the staggered arrangement.
Fig. (2-4) heat sinks geometry (a) plate fin
(b) pin fin (in line) (c) pin fin (staggered) [14]
01
Sahin and Demir (2008)[15] and [16] reported the heat transfer
enhancement and corresponding pressure drop over a flat surface equipped with
circular [15] and square[16] cross section perforated pin fins (separately) with in-
line arrangement in a rectangular channel. The channel had a cross section area of
100–250 mm2.Their experiments cover the following ranges: (13500< Re
>42,000, clearance ratio (C/H) 0, 0.33 and 1 and interfin spacing ratio (Sy/D)
1.208, 1.524, 1.944 and 3.417 as shown in fig. (2-5). Also, they developed
correlation equations for the heat transfer, friction factor and enhancement
efficiency. The experimental results show that the use of circular cross section pin
fins leads to heat transfer enhancement. Enhancement efficiency varied between
(1.4 to 2.6) depending on clearance ratio and interfin spacing ratio. Each goal was
optimized separately. Then, all the goals were optimized together, considering the
priority of the goals, and the optimum results were found to be Reynolds number
of 42,000, fin height of 50 mm and streamwise distance between fins of 51 mm.
They concluded that, Nu calculated on the basis of projected area increases

with decreasing clearance ratio and interfin spacing ratio, the friction factor f
increases with increasing clearance ratio and the span wise interfin separation
distance, Enhancement efficiency increases with decreasing Reynolds number,
The most important parameters affecting the heat transfer are Reynolds number,
fin height and fin spacing (pitch). The maximum heat transfer rate was observed
at 42,000 Reynolds number, 75 mm fin height and 3.417 Sy/D. The most
effective parameter on the friction factor is found to be fin height. The minimum f
was observed at 50 mm fin height, 42,000 Reynolds number and 3.417 pitch.
When all the goals were taken into account, they obtained optimum results at
42,000 Reynolds number, 50 mm fin height and 3.417 Sy/D pitch.
01
Fig. (2-5) Perspective view of heat exchanger
and a single perforated pin configuration [15] and [16].
Dhanawade and Dhanawade (2010) [17] studied experimentally the

heat transfer enhancement in rectangular fin arrays with circular perforation
equipped on horizontal flat surface in horizontal rectangular duct as shown in
fig(2-6). They obtained experimentally the data used in performance analyses by
varying flow, different heat inputs and geometrical conditions. Their experiments
covered Reynolds number range from 3000-6000, based on the flow average inlet
velocity and hydraulic diameter. They obtained Nusselt and Reynolds number for
various heat inputs and flow rates values. The results of perforated fin arrays
were compared with the external dimensionally equivalent solid fin arrays. Their
analysis of turbulent heat flow and convective heat transfer of solid fin arrays and
new design perforated fin arrays of two different sizes of perforations showed
that the enhancement in the heat transfer with perforated fins is higher than that
with the solid fins for all heat inputs as well as for whole tested range of
Reynolds number and for all sizes of perforation. Finally, benefits of utilization
of perforated fins, increases the rate of heat dissipation, reduction of fin weight;
low weight means saving material of fin and at the same time decrease the
expenditure on the fin material and related equipment.
01
Fig. (2-6) Solid and perforated fin arrays [17].
Karthikeyan and Rathnasamy (2011) [18] and [19] studied

experimentally forced convection heat transfer from the array of circular[18]
and square [19] pin-fins attached to a rectangular-horizontal base plate
maintained at 50o C placed in a rectangular channel forming the passage for flow
of air as shown in fig.(2-7). Their study involves the effect of pin-fins spacing in
both stream and span wise directions on the performance of heat sink as well as
tip clearance effect. The cylindrical fins were arranged in array either in-line or
staggered manner. They studied the parameters, i) Reynolds number range
between 2000 to 25000 ii) inter fin distance varying from (12 to 228 mm) in both
the stream wise (Sy) and span wise(Sx) directions and iii) clearance ratio (C/H)
0.0, 0.5 and 1.0. The dependence of Nusselt number and friction factor on the
above parameters is proved and they were concluded that the in-line pin-fin array
significantly enhances heat transfer as a result of increased heat transfer surface
area and turbulence at the expense of higher pressure drop in the wind tunnel.
Nuav increased with decreasing (C/H) and inter-fin distance ratio. Nuav
increases with increasing Re. For a given Re, the pin-fin array with smaller inter
fin distance gives higher performance than those at higher inter fin distances. f
01
increases with decreasing (C/H) and inter-fin distance ratio. The staggered pin-fin
array significantly enhances heat transfer as a result of turbulence at the expense
of higher pressure drop in the wind tunnel .Square pin-fin array performance is
slightly higher than the cylindrical array with the penalty of pressure drop.
(a) (b)
Fig. (2-7) (a) Ensemble of pin fin with shroud
(b) Pin fin assembly arrangement [18].
Ganorkar and Kriplani (2012) [20] studied the overall performance of

suitably designed lateral perforated fins in a rectangular channel and analyzed
with passive heat transfer augmentation technique. They used different types of
perforated fins in the rectangular channel as shown in fig. (2-8). They analyzed
effect of perforated fins in a rectangular channel for different Re Numbers. The
convective heat transfer coefficient and Nusselt number were analyzed.
Fig. (2-8) Experimental Set-Up [20].

11
The conclusion can be drawn that the ratio (Nu perforated/Nu solid) increases
with increasing Re, increasing holes , increasing diameter of hole and the
enhancement of (Nu perforated/Nu solid) is not significant with increase in number of
holes as well as with diameter of holes. However the weight of the fin is reduced
and hence this is an advantage.
Ji Jinn Foo and Chee Seng Tan (2012) [21] investigated experimentally
staggered perforated pin fins to enhance the rate of heat transfer while subjected
to a vertical impinging flow as shown in fig(2-9).They studied the effect of
vertical perforation diameters on each pin. Results show that Nu for pin fins with
5 numbers of horizontal perforation of 3mm vertical and horizontal perforation
diameter was about 46% higher than that of the solid pins at Re Dh=3.5×104 .
Further increasing the vertical perforation diameters leads to a significant drop in
thermal dissipation. This was due to the reduction in axial heat conduction along
the pins. More importantly, the pressure drop with vertical perforation diameter
of 1mm, 3mm, 4mm and 5mm recorded a reduction by 3%, 14%, 17% and 35%,
respectively, compared with that in solid pins. They concluded that perforated pin
fin array is able to enhance thermal dissipation at a lower pressure drop and care
should be taken while designing perforated pins in order to balance between the
heat transfer performance and pressure drop.
Fig. (2-9) Pin fin arrays with different perforations [21].

10
2.2.2 Numerical Studies
Soodphakdee, et al. (2001) [22] compared the heat transfer performance of

various commonly used realistic, manufacturable fin geometries to minimize
thermal resistance at moderate laminar air velocities and pressure gradients.
These consist of plate fins or pin fins of round, elliptical and square cross- section
as shown in fig.(2-10). They used parallel plates or staggered plate fins and inline
or staggered arrays pin fins. The basis of comparison was chosen to be a circular
array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width of the other
geometries was chosen to provide equal ratios of fin cross-sectional area to base
area. The pitch was fixed to provide the same wetted area per unit volume as that
of the nominal case. They carried out CFD simulations on a two-dimensional
computational domain bounded by planes of symmetry parallel to the flow. Air
approach velocity was in the range of 0.5 to 5m/s. They found in their
comparison of heat transfer performance and pressure drop that rounded
geometries outperform similar sharp-edged fin shapes. In all cases, staggered
geometries perform better than inline one. At lower values of pressure drop and
pumping power, elliptical fins work best. At higher values, round pin fins offer
highest performance. They performed numerical simulations using FLUENT V.5,
based on Finite Volume Method approach (FVM) and SIMPLEC velocity-
pressure coupling algorithm .
Fig. (2-10) Schematic diagram of heat sinks [22].

11
Sahiti, et al. (2007) [23] carried out extensive work to select and optimize
pin fin elements for increased heat transfer. Performance diagram provides
performance comparisons of pin fins shown in fig.(2-11) with respect to two
operating parameters; heat transfer rate per unit base surface area and power
input for the same area. It is shown that elliptical cross-sections offer the best
performance compared with all other investigated cross-sections of pin fins. Their
work demonstrated that the heat exchanger performance plot allows also the
selection of the best elliptical cross-section design within the initial design set
(design set obtained numerically) in analogy with the Pareto-optimality approach.
They deduced the real optimal geometry of the elliptical cross-section from
commercial optimization software, mode FRONTIER. It is shown that by
subsequent use of the virtual solutions from the response surface modeling
(RSM) of that software and their validation with Star-CD, a complete ‘‘Pareto-
frontier solution’’ can be obtained.
Fig. (2-11) (a) Cross-sections of pin fins selected for comparison, (b) Elliptical
cross-section parameters constituting input optimization variables [23].
Khoshnevis, et al. (2009) [24] investigated numerically the effects of

attached perforated ribs on heat-transfer enhancement of a rectangular 3-D
channel. They examined different open-area ratio of perforation (number and
diameter of holes), perforation inclination angle, number of ribs for Reynolds
range of 6000 up to 40000. Equations were solved by FLUENT® (ver.6.3), using
standard k-ω turbulence model. Results show significant augmentation in heat
11
transfer enhancement by applying perforations shown in fig.(2-12), as flow

injected through dead-zone thermal traps between the ribs. Increasing inclination
angle enhances thermal performance while insignificant in pressure-drop, heat
transfer enhancement and friction factor generally decreases with increasing Re
for both solid and perforated ribs. Increasing perforation diameter improved both
heat transfer and pressure drop over the channel, decreasing the distance between
the perforated ribs (increasing number of the ribs), more enhancement was
achieved in both heat transfer and pressure drop. Good agreement between their
study and earlier experimental studies proves the results of simulation.
Fig. (2-12) Heat-Sink with Perforated Rectangular Ribs Model [24].
Shaeri and Yaghoubi (2009) [25] investigated numerically three -

dimensional fluid flow and convective heat transfer from an array of solid and
perforated fins mounted on a flat plate shown in fig.(2-13). Incompressible air as
working fluid was modeled using Navier–Stokes equations and RNG based k-ε
turbulent model was used to predict turbulent flow parameters. Temperature field
inside the fins was obtained by solving Fourier’s conduction equation. They
solved conjugate differential equations for both solid and gas phase
simultaneously by finite volume procedure using SIMPLE algorithm.
Perforations such as small channels with square cross section arranged
streamwise along the fin’s length and their numbers varied from 1 to 3. They
presented flow and heat transfer characteristics for Re (20000 to 40000) based on
the fin length and Prandtl number taken as 0.71. They also, validated numerical
11
computations with experimental studies of the previous investigators and good

agreements were observed.
Fig. (2-13) Computational domain for solid and perforated fin arrays [25].
They found that perforated fins have higher contact area with fluid in
comparison with solid fin and the average friction drag for perforated fins is
higher compared to solid fin and also it increased by adding perforations, higher
fin effectiveness than solid fin and it increased remarkably by adding more
perforations. Total drag was highest for solid fin and it decreased by increasing
perforations. They obtained the same result for average drag coefficient. Weight
reduction was considerable and this economical gain was along with more
enhancement of heat transfer rate (temperature drop from fin base to fin top
surface increased).
Shaeri, et al. (2009) [26] investigated numerically the fluid flow and
conjugate conduction-convective heat transfer from a three-dimensional array of
rectangular perforated fins with square windows (different numbers and two
various perforation size ) arranged in lateral surface of fins shown in fig. (2-14).
11
They carried out computations for Re (2000–5000) based on the fin

thickness and Pr = 0.71. New kinds of perforated fins have higher total heat
transfer, higher fin efficiency, lower drag force and considerable weight reduction
in comparison with solid fins. They also proposed two correlations for large and
small size windows for practical applications.
Fig. (2-14) Computational domain for solid and perforated fin arrays [26].
Sunil Chamoli et al. (2011) [27] conducted (CFD) study to investigate the
heat transfer and friction loss characteristics in a horizontal rectangular channel
11
having attachments of circular profile fins over one of its heated surface as shown
in fig.(2-15).
The Re number based on the flow averaged inlet velocity and the hydraulic
diameter, ranged from 5000 to 30,000. They considered circular profile fins of 5
cm height and diameter of 2 cm dimensions mounted on a heating surface
vertically. Reynolds number, fin arrangement (in-line and staggered) and fin
pitch in the flow direction were the numerical parameters. In addition to one
fixed span wise (Sx/d = 3) and four different stream wise (Sy/d = 3, 3.75, 5 and
7.5) distances. They used different turbulent models for the analysis and their
results are compared. k-ε model based results found a good agreement and thus
this model was used to predict the heat transfer and friction factor in the duct.
They also calculated overall enhancement ratio in order to discuss the overall
effect of fin spacing and operating parameters. A maximum value of
enhancement ratio was found 1.2 for the range of parameters investigated.
Fig. (2-15) Pin fin heat sink arrangement [27].
Shaeri and Tien-Chien Jen (2012) [28] investigated numerically the

effects of size and number of perforations on laminar heat transfer characteristics
of an array of perforated fins at the highest porosity of the study of Shaeri and
Yaghoubi [22]. They showed that at a specific porosity, the thermal entrance
length of each perforation of a fin with a lower number of perforations was larger
11
than that of each perforation of a fin with a higher number of perforations and for
laminar flow, at a constant porosity, a fin with fewer perforations (larger in
perforation sizes) was more efficient to enhance the heat transfer rate compared
with a fin with more perforations ,in such a manner that by using perforated fins
with one perforation, the heat transfer rate was enhanced nearly 80%.Perforated
fins have higher friction drag (due to having more floors and ceilings because of
the extra perforations , since the velocity in laminar flow was low inside the
perforations, the difference in friction drag was not sensible in low Reynolds
numbers between two perforated fins at the same porosity) and lower pressure
drag with respect to solid fins (the pressure drag remains almost the same due to
the same frontal area for all perforated fins). Total drag, including both friction
and pressure drags remains almost unchanged among all types of fins, including
solid and perforated fins.
Ji-Jinn Foo et al. (2012) [29] investigated numerically the use of

staggered perforated pin fins to enhance the rate of heat transfer while subjected
to a vertical impinging flow and the number of horizontal perforations and the
vertical and horizontal diameters of perforation on each pin as shown in fig.
(2-16) . Nu max of pins (pin fin array with 5 perforations, 3mm horizontal
perforation diameter, and 3mm of vertical perforation) was about 9% higher than
that for the solid pins and it increased with the number of horizontal perforations.
Pressure drop across the heat sink was smaller with increasing number of
perforation and perforation diameter. In all cases, perforated pin fin array
performed better than the solid pins and required less pumping power (by about
10% compared with that in solid pins) than the solid pins for the same thermal
performance. They found that further increasing the perforation diameters result
in significant drop in thermal dissipation, and pin fins with vertical and horizontal
perforations were preferred for heat sink facing an oncoming vertical flow. They
11
also, concluded that Nu increases with the increasing (i) number of perforation,
(ii) horizontal perforation diameter, and (iii) coupling horizontal and vertical
perforation diameters. Further increasing the perforation diameters resulted a
reduction in thermal dissipation. Finally, while designing a perforated pin
fin array ,the balance between the perforation number and diameter should be
carefully taken into consideration.
Fig. (2-16) Pins with different perforation number,
horizontal diameters and vertical diameters [29].
2.2.3 Experimental and Numerical Studies
Farouq H. Ali. (2005) [30] carried out experimental and theoretical

investigation ,compared the heat transfer performance of various common fin
geometries ( extruded fins, staggered square pins, and staggered cylinderical pins
in forced convection air flow environments) shown in fig.(2-17) by studying the
temprature and velocity distribution.His study covered air velocity (2- 6) m/s to
and heat flux (20- 40) Watt to obtain the range of temprature.
11
A software packages (ANSYS 5.4) was used to carry out the theoretical
study. with the aid of this software package a 3-d model was built by putting
horizontal orintation only. The model boundary condition can be easily varied
through (ANSYS 5.4), including all ranges used in the study. Navier-Stocks
equations and continuity equation were solved. A two-equation K- model
(turbulence model) was also solved by this program. He presented a comparision
of thermal resistance, relatave thermal resistance, heat transfer coefficient,
velocity and temprature distribution for three types of heat sincks.He
also,concluded that the straight fin experiences the lowest amount of flow by-
pass over the heat sink, and for this particular application, where the heat source
is localized at the bottom of the heat sink base plate, the overall thermal
resistance of the straight fin is lower than the other two designs mainly because
fins have large area of convection.
Fig. (2-17) Pin-fins and fins arrangements [30].
His results show that longitudinal fin heat sink geometry performs better
than cylindrical and square pin-fin heat sink geometries when it has the same area
of conduction because the longitudinal fin provides high exposed area .The
cylindrical pin-fin heat sink has the lower relative thermal resistance than that
11
longitudinal and square pin-fin, this explains why cylindrical pin-fin has higher
performance for the same area of convection.It was shown also, that with
increasing Re the flow thermal saturation decreases. He found very high
difference in the air behavior between longitudinal fin and staggered pins. For
longitudinal fin heat sink, maximum velocity occures at the core center of heat
sink while for staggered pins the maximum velocity occures at the two sides of
the heat sink in addition to variation in overall thermal resistance in total area,
therefore there are important differences between the heat transfer coefficients for
longitudinal fin and pins. His calculations also verify that the developed
numerical yields like ANSYS Program sufficiently accurate results to be
applicable.
Andrea Diani, et al. (2013) [31] reviewed experimental results and

numerical studies during turbulent air forced convection through extended
surfaces as shown in fig.(2-18). They evaluated the thermal and hydraulic
behavior of a reference trapezoidal finned surface, experimentally in an open-
circuit wind tunnel, and compared it with numerical simulations carried out by
using the commercial CFD software COMSOL Multiphysics. The model was
validated; numerical simulations had been extended to other rectangular finned
configurations, in order to study the effects of the fin thickness, fin pitch and fin
height on the thermo-hydraulic behavior of the extended surfaces. Several pin fin
surfaces have been simulated in the same range of operating conditions
previously analyzed. they compared numerical results of heat transfer and
pressure drop, both for plain finned surfaces and for pin fin surfaces with
empirical correlations from the open literature, and they developed more accurate
equations which are used as an easy-to-implement calculation approach for heat
sink design in electronic thermal management.
10
Fig. (2-18) Geometries, dimensions and simulated channels
(a) Plain fin heat sink, (b) Pin fin heat sink [31].
They concluded that heat transfer coefficient increases when decreasing

fin pitch and when increasing fin thickness, whereas it does not depend on the fin
height. The finned surface efficiency increases when decreasing fin height. The
pressure drop increases when decreasing fin pitch and when increasing fin
thickness, whereas it is weakly affected by the fin height. The effects of the
dimensionless ratios T/d, S/d and H/d on the performance of pin fin surfaces have
been numerically studied. The streamwise direction dimensionless pin spacing
and the dimensionless pin length have a weak effect on the heat transfer
coefficients, whereas the heat transfer performance increases when decreasing the
transverse dimensionless pin spacing. The surface finned efficiency increases
when decreasing the dimensionless pin height, and when increasing the spanwise
direction (dimensionless pin spacing). The dimensionless pin height does not
affect the hydraulic behavior, whereas decreasing streamwise and transverse
direction dimensionless pin spacings results in higher pressure drops.
11
Finally, they proposed two new correlations for the estimation of the
thermal and hydraulic performance.
2. 3 Literature Review Summary

Most studies related to the experimental and numerical investigations of
the dynamics and heat transfer process of heat sink (HS) investigate optimum
design parameters maximizing heat transfer coefficient and thermal
dissipation from the array of finned heat sink as well as minimizing the
pressure drop across it. Numerous relations were proposed to calculate
performance criteria for the optimized model depending on the fins
arrangements, cross section, length, stream line pitch ,stream line pitch and
other design parameters. Material used to fabricate (HS) was Aluminum for its
advantages mentioned previously.
More benefits were obtained from this review of literature to design
present study model and environment to achieve the aim of the study
attaining highest thermal and dynamic performance such as implementing the
staggered arrangement for fin arrays , tradeoff optimized geometrical
parameters , using round (circular) pin fin and making significant
modification with horizontal, vertical and lateral (HLV) perforations for
increasing heat transfer area and dynamic behavior improvement of the flow,
in addition to considerable weight reduction for single perforated pin fin array
in comparison with that of solid pin fin and the whole heat sink system
weight.
It has been noted that little experimental works were done on forced
convection through perforated pin fin heat sink with horizontal air flow and
neither experimental nor numerical studies provide knowledge about the
effect of coupling the three types of (HLV) perforation with limited heat flux
and velocity range on the heat sink performance .
11
Chapter Three
Experimental
Work
Chapter Three Experimental Work
Chapter Three
Experimental Work
3.1 General
The major objective of the experimental study is to introduce the

experimental work for this study. It involves three parts, in its first part the
experimental setup of the heat sink and the instruments that were used. The second
part describes thermal conductivity measurement and heat sinks fabrication and
preparation for test .The third part explains experimental procedure and
measurements.
3.2 Experimental Setup

The schematic diagram of the test rig is shown in fig. (3-1), fig. (3-2) shows
the experimental rig which consists mainly of:
1. Air tunnel (duct) 2. Centrifugal ventilator 3. Heating element (heat sink)
4. Temperature Sensors 5. Pressure take 6. Computer Control System
7. Measurement devices.
3.2. 1 Air Tunnel (Duct)

The vertical air tunnel (duct) of stainless steel of rectangular section (65 x
170 mm.) and 1200 mm in length. It is resistant to the corrosion. It is so
constructed that the air temperature and velocity can be readily measured. This
tunnel has a rectangular central opening of 130 x 130 mm. , that is good to insert
the different configurations of pin fin arrays(17 pin fin for each heat sink) of
known dimensions .It is exposed to the air stream to carry out the applicable
experiments. The boards are retained in their positions by two stainless steel
supports .The conduct is installed upon the entrance of a powerful centrifugal
ventilator. Likewise, all the equipment is supported by anodized aluminum profiles
34
structure that can be mounted on a worktable. The air tunnel opening is equipped
with converging shaped entrance of stainless steel, resistant to the corrosion
followed by flow straightener (honeycomb) ensuring laminar flow of air stream
incoming to the air tunnel as shown in Fig.(3-3).
3.2.2 Centrifugal Ventilator

The air stream passing through the conduct is produced by a centrifugal
ventilator (Power =0.75 kW, Air speed up to 25 m/sec) that draws air from inside
the conduct and expels it outside. The air current through the ventilator and the
conduct is controlled by a speed variator that will let us control the air volume
through the tunnel. Fig (3-4) shows the ventilator and its support-stands.
Fig. (3-1) Experimental Setup
35
Item Description
Air
1 Mouth
1 2 Flow straightner
2 3 Inlet Pitot tube(Pressure in)
3 4 Inlet temp. thermocouple(T in)

5 Insulated duct
4
6 Heat sink insulation
5
7 Heater (constant heat flux)
6
8 Heat sink base T ave thermocouples
7 9 Heat sink insulated base
8 11 Outlet Pitot tube( Pressure out)
9 11 Outlet temp. thermocouple(Tout)

16 12 Digital differential manometer
17 13 Control interface box
0 18 14 Computer
12 15 Variable speed blower
13 16 Test section (pin fin array heat sink)
14 17 Wattmeter, voltmeter, ammeter
11 18 Variable transformer
11 19 Mounting Structure
Air
15
19
Line Description
Thermocouple wire
Pressure measurement line
Heater wire
Fig. (3-2) Schematic diagram of the Experimental Setup
36
(a) (b)
Fig. (3-3) (a) bell shape entrance (b) flow straighter
Fig (3-4) Centrifugal ventilator

3.2.3 Heating Element
In the tunnel, there is an electric resistance for heating the base of the heat
sink and providing an approximately uniform heat flux q". There are three types of
pin –fin arrays configurations attached by screw its end to the heat sink base and
face the air stream inside the tunnel. In the bases of the heat sink we set nine
thermocouples to measure the temperature that the base of the heat sink reached.
Thermocouples
Fig (3-5) Heating element and thermocouples location
37
3.2.4 Temperature Sensors.

There are two spiral-shaped tap on the side of the air tunnel one on the entry
and another one on the exit that allows us to connect the temperature sensor
(thermocouples) to carry out the appropriate measurements of cold air at the entry
and hot air at the exit in addition to temperature distribution in the heat sink
various locations.
3.2.5 Pressure Tap.
The sensor that measures the drop of pressure (differential pressure sensor
0- 7000 Pa. is placed on the upper profile, close to the entry of the tunnel. This
profile will serve as support .An orifice at that height on the backside of the tunnel
will allow evaluate the pressure inside the tunnel with respect to the outside
pressure. The measured differential pressure insures air stream velocity
measurement which is readily indicated on the computer screen after the signal
processing in the control interface box and data acquisition board.
3.2.6 Computer Control System

This system is shown in Fig. (3-6) and consists of three parts, the first is the
control interface box with process diagram in the front panel and with the same
distribution that the different elements are located in the unit. All sensors, with
their respective signals, are properly manipulated from (-10 to +10) volt computer
output.
The unit control elements (heating element, centrifugal ventilator,
differential pressure sensor and thermocouples ) are continuously computer
controlled and have simultaneous visualization in the computer of all parameters
involved in the process, calibration of all sensors involved in the process, real time
curves representation of system responses, storage of all the process data and
results in a file, graphic representation in real time of all the process/system
responses, all the actuators and sensors values and their responses are shown on
one computer screen, shield and filtered signals to avoid external interferences,
38
open control allows modifications at any time and in a real time of parameters
involved in the process simultaneously.
The second part is the Data Acquisition Card (National Instruments) is a
multifunction card, which basically implies that through a single connector all the
inputs and output, both analog and digital are provided. This model uses a SCSI
III-V (M-F) cable. The DAQ card is connected to PC in a free PCI slot secured
with the appropriate screw and then the SCSI cable female end is connected to the
card and the male end to equipment interface. Acquisition Card must be installed
in a PCI slot in the motherboard of PC.
After data acquisition card installation in the PC the last(third) part in the
computer control system is the data management which is achieved through the
SACED software ,including NI-DAQ (data acquisition card NI-6221) drivers
software which includes all the libraries for the PC to communicate with the data
acquisition card also the installer of the control software is included.
Fig. (3-6) Computer Control System
39
3. 2.7 Complementary Measurement Devices:

To facilitate the experimental work and the measurements some of the
mentioned devices are used to achieve this work, while others perform as
calibration instruments these devices are illustrated below:
A. Thermocouples (J type) B. Differential pressure diaphragm

C. Pitot static tube. D. Digital differential manometer
E. Standard Mercury Thermometer (SMT) F. Digital Anemometer
G. Digital wattmeter, voltmeter, ammeter H. Variable Transformer
I. Electric Power digital multimeter. J. Thermal Camera.
K. Vernier Caliper L. Electronic Scale.
A. Thermocouples
Type J, Iron (+) vs. Constantan (nickel-45%copper) (-) are used to measure
the temperature of air at entry and exit of the tunnel in addition to different heat
sink locations. These thermocouples are suitable for use in vacuum, air,
reducing, or oxidizing atmospheres to 760° C in the heavier gage sizes. Their
resolution is (0.1) oC. Calibration of these thermocouples is detailed in Appendix.
[32]
B. Diaphragm differential pressure gauge

One of the aneroid gauge types uses deflection of a flexible membrane that
separates regions of different pressure. The amount of deflection is repeatable for
known pressures so the pressure can be determined by using calibration. The
deformation of a thin diaphragm is dependent on the difference in pressure
between its two faces. The reference face can be open to atmosphere to measure
gauge pressure, open to a second port to measure differential pressure. The
deformation can be measured using mechanical techniques. Metallic diaphragms
are used. Fig. (3-7) shows this gauge and its location in the tunnel.
40
Fig. (3-7) Diaphragm differential pressure gauge
C. Pitot static tube

A standard ellipsoidal nosed Pitot - static tube shown in Fig. (3-8) is used to
measure static pressure in tunnel easier, faster and more accurate than using
manometer tubes alone; it has a magnetic flange and directional arrow for hands
free use and to ensure proper positioning and optimal performance. It is ideal for
use with precision manometers (used in our work) and air velocity gauges, it is
constructed from corrosion resistant stainless steel for a lifetime of service.
Precision crafted tip configuration allows air to pass smoothly with minimum
turbulence for consistent, reliable readings.
Fig (3-8) Pitot static tube
41
D. Digital differential manometer

This is a portable, rugged dual-port manometer designed especially for
HVACR field service technicians. It measures air pressure on the inlet (P1) and
outlets (P2) with the standard 3/16” fittings or the included adapters for 5/16” ports
take static pressure measurements across a blower and get the pressure differential
with the push of a button to check drafts. It includes a zero adjust button of the face
of the meter, a rugged rubber boot, a magnet on the back for hanging the meter
during service, and the Auto Power-Off function conserves battery life. This
manometer measures pressure between -15000 Pa and 15000 Pa. It also measures
P1 or P2 pressure readings and calculates the difference between P1 and P2. Take
static pressure measurements using the resolution mode of 1 Pa and Accuracy of
1.5% FS.
Its range, resolution and accuracy make HVAC/R field service easier and
faster to measure the HVAC applications. Fig (3-9) shows digital differential
manometer and certification
Fig. (3-9) Digital differential manometer and certification
E. Standard mercury thermometer

Standard mercury in glass thermometer type was used to measure air
temperature and for thermocouples calibration.
42
F. Digital Anemometer
It is used to measure the average air velocity at entry and exit of the test section.
It is a vane-type (model DA40) probe portable anemometer which provides fast
and accurate readings, with digital readability and the convenience of a remote
sensor separately, as shown in Fig (3-10). The low friction ball bearing design
allows free vane movement, resulting in accuracy at both high and low velocities.
The sensitive balanced vane wheel rotates freely in response to airflows. The
accuracy of the anemometer is (± 1%).
Fig. (3-10) Digital anemometer.

G. Digital wattmeter, Voltmeter, Ammeter
The electrical power supplied to the heating element was measured by
digital Wattmeter WD2250B (MCP Lab. Electronic Company) which has
accuracy of about ± 2% at the full current and voltage scale. Voltage and current
also can be measured by this device which is shown in Fig. (3-11).
Fig. (3-11) Wattmeter, voltmeter and ammeter
43
H. Variable Transformer
The heater was powered with electricity by an Voltage Regulator (Logicstat
variable transformer supplying alternating voltage between 0 to 270 volts with
maximum capacity of 8 amp.) to control the heat flux supplied to heater after that
to the heat sink by using Variable Transformer to overcome voltage fluctuating
during power switching from electrical net and the diesel generator and vice versa
during the experiments shown in Fig. (3-12).
Fig. (3-12) Variable transformer

I. Electric Power digital Multimeter
A digital Voltmeter(CT 9860)was used to measure the voltage ,current
supplied to the heater in addition to electrical resistance of the heater (heating
element) as shown in Fig (3-13-a).A digital clamp meter (MT 87) was used to
measure the current supplied to the heater, as revealed in Fig.(3-13-b).
Fig (3-13) (a) digital ovometer (b) digital clamp meter
44
J. Thermal Imaging Camera

Thermal imaging is the use of cameras constructed with special sensors that
capture thermal energy emitted from an object. Thermal or infrared energy is light
that is not visible to the human eye because its wavelength is too long to be
detected. It is the part of the electromagnetic spectrum that we perceive as heat.
Infrared allows seeing what our eyes cannot. Thermal imaging cameras produce
images of invisible infrared or “heat” radiation. Based on temperature differences
between objects, thermal imaging produces a clear image.
It is a new art technology used to evaluate average surface temperature of
(convective area) of pin fin heat sink which was tested experimentally, it is an
excellent and more suitable tool for thermal imaging of solid objects where the
handling and fixing of numerous thermocouples represent a major difficulty in
many compact, inaccessible and complex geometry due to their effect on flow
pattern of the fluid. The (FLIR E 30 bx) imaging camera shown in Fig. (3-14) has
many marvelous advantages which help to measure about (60) alternative spot
temperature instead of thermocouple fixing problems. Its technical specifications
are:
 Thermal image quality: 160x120 pixels
 Thermal sensitivity: <0.1°C.
 High accuracy of ± 2% or ± 2 °C of reading.
 Temperature range: -20°C to +350°C.
 Spotmeter: 1.
 1 box with min./max./average.
 Built-in 2 Mpixels camera.
K. Vernier Caliper
It is a simple instrument used for measuring the dimension of different
assembled pin- fin heat sinks and dimensions adopted in this work.
45
L. Electronic Scale
It is used to determine the weight of each model of pin fin and compare
between them.
Fig. (3-14) Thermal imaging camera
3.2.8 Electrical Power of the System
The stability of power voltage is of a great significance to get a constant heat

flux on the heating surface in the experiments .The power supplied to the heater is
an AC current 220 volts, while the main power voltage measured was 175-190
volts and diesel generator voltage measured as 210 volts . The main voltage
regulator is connected to the circuit to insure that there was no fluctuation in the
voltage within the readings. The voltage regulator worked to change the voltage
supplied to the heater according to the desired heat flux. A digital voltmeter used to
monitor the voltage entering to the voltage regulator, was connected with circuit in
parallel. A digital wattmeter was used to guarantee that the power out from voltage
regulator was 220 volts. It is measured the current, voltage and the power supplied
to the heater accurately, whereas the digital clamp meter was used to monitor the
46
electrical current and voltage through the heater as a supplementary checking and
calibration device for the wattmeter.
3.3 Thermal Conductivity (k) Measurement
The thermal conductivity (k) of the material (Aluminum) used for

manufacturing heat sinks was measured by apparatus shown in Fig. (3-15).
The apparatus was manufactured by Cussons Technology Ltd. (England).
The heat conducted was measured from the equation:
……………………………………………..……….………….… (3-1)
Where:
: Weight of collected water per time, kg/sec.
: Specific heat capacity, J /kg.K.
: Temperature difference between inlet water temperature and outlet water
temperature, (K).
Fourier Law is used to measure thermal conductivity (k) as shown below:
…………………………………………………………. (3-2)
Where: q; Heat flow (W) [measured from eq. (3-1)]. A; Area perpendicular
to heat flow (m2).ΔT/ΔX; Temperature gradient, and k; Thermal conductivity.
(a) (b)
Fig. (3-15) (a) Apparatus of thermal conductivity measurement (b) Test specimen
47
By taking the average value of measured thermal conductivity, the resulting

value of k was 192 Watt /m.oC.
3.4 Heat Sink Fabrication

The base of the heat sink and the pin fin attached to it is made of aluminum
for the many reasons mentioned previously. The base is a block attached to the part
from which heat must be removed to maintain it is temperature below desired level
in order to continue its work properly.
The lower face adjacent to the electronic component is filled with interface
conductive paste to overcome as much as possible as the contact resistance
between them. The face exposed to the air which is improved by using extended
surfaces of various cross section represents the surface which does its job by
dissipate the heat must be removed steadily .
The multiple manufactured pin fin and the base block overcomes contact
resistance by using interface conductive paste .Each pin fin in the three tested heat
sink is fastened closely by screw in its tip to the base in a vertical position. Another
means used to manufacture heat sink is detailed previously in chapter one.
Each pin fin is manufactured according to specification detailed in fig.(3-16)
and Table (3-1) as follows:
1- Cutting by lathe the solid aluminum shaft (its outer diameter =10mm) into
small pieces according to required fin length.
2- Making screw at pin lower tip according to hole screw in the base by using
threads die.
3- Making required perforation (number, diameter and direction) by using a
drill jig designed and made especially for this work by fixing this die shown
in fig. (3-17) on a bench and inserting the pin solid fin in the main drill jig
hole and fastening it then drilling process is achieved carefully.
4- Polishing process is done by using sand paper in different grit sizes after
each pin is fixed in the electric drill.
48
5- Finally each set of pin fin shown in fig (3-18-a) is tied up closely to the base
of heat sink fig. (3-18-b) by using drill head adapter shown in fig. (3-24) lined
with thin layer of rubber.
Table (3-1) Geometric
description of tested heat sinks
Parameter symbol value

Base length and width b 98 mm
Fins number N 17
Diameter of the circular pin fin d 10mm
Height of the circular pin fin H 50mm
Clearance between the fin and C 12mm
the duct
Transversal pitch Sx 23mm
Longitudinal pitch Sy 21mm
Lateral perforation diameter dlp 3mm
Horizontal perforation dhp 3mm
diameter
Vertical perforation diameter dvp 3mm
Duct length L 1200mm
Duct cross section width w 62mm
Duct cross section depth l 167mm
Perforation number per pin fin Np 5
Duct cross section
Perforated pin fin array (front view) Perforated pin fin array (side view)
Pin fin array (top view)
Fig. (3-16) Design of tested heat sinks
49
Fig. (3-17) perforation drill jig
a b
Fig.( 3-18) (a)Sample of pin fin model and (b) heat sink base
Each model of three types pin fin heat sink shown in fig. (3-19) is used
independently, to study performance and heat dissipation of heat sinks by studying
the velocity and temperature distribution and estimation of the heat transfer
coefficient for different air velocities and specified heat flux in addition to
evaluation of the pressure drop and friction factor for tested heat sinks and
determine the best type in thermal performance and efficiency.
50
Each heat sink is inserted in the tunnel and exposed to air stream which has
several inlet velocities (5, 10, 15 and 20) m/s through centrifugal fan and heat flux
up to 150 Watt.
b c
Fig. (3-19) (a)solid pin fin array, (b) pin fin array with horizontal / vertical (HV)
perforations and (c) pin fin arrays with horizontal/lateral/vertical (HLV)
perforations.
3.5 Data Collection

3.5.1 Measurement Reliability and Calibration
To make sure that the measured variables (temperature, velocity and
differential pressure) monitored by PC are accurate, the calibration process must be
accomplished thermocouples calibration is accomplished too.
51
Velocity is examined through vane-type portable digital anemometer

(DA40) mounted at the tunnel entry as shown in fig.(3-1) exactly in front of
diaphragm differential pressure sensors and Pitot static tube and it show a good
conformity over studied velocity range. The differential pressure is examined with
two different digital manometers and a good agreement was found.
All variables measured in this study are calibrated and explained in
Appendix.
3.5.2 Temperature Measurement

Nine readings of base temperature were recorded (their positions are
distributed in equal distances at the base of the heat sink).Thermocouple type (J) is
used because it covers temperature range of the study. The average of these
temperatures is represented by Tbase .
Surface temperature of the pin fin and convective area of the base are
measured using thermal imaging camera (FLIR E30 bx) by selecting 60 different
spots distributed well through the convective area of the fin array, then Tsurface is
determined. Temperature of air at entry and exit of tunnel is monitored in PC and
designated Tin and Tout respectively.
3.5.3 Velocity Measurement

Frontal velocity is considered in this study as a reference velocity, it is
measured through diaphragm differential pressure transducer which is processed
through computer control system and monitored in the PC.
3.5.4 Pressure Drop Measurement

Pressure drop measured through digital differential manometer as referred to
previously, the reading for each state fluctuates for some time it is left until
stabilized and the average of five readings is taken and described as ∆P in Pa.
52
3.5.5 Steady State Condition

To start with experiments time required the steady state must be determined
to verify that all experiments will be in steady state condition, selecting an
arbitrary state of the studied case .starting with experiment and recording data as
shown in Table (3-2) until the monitored temperature of the heat sink base does not
change with time and stabilizes. It is clear that (55) minute is a good time to reach
steady state condition. Therefore all collected data are recorded after (55) min.
Table (3-2) Time required to reach steady state condition
3.6 Experimental Procedure and Measurements

3.6.1. Experimental Procedure
There are three types of heat sink tested through experiments as mentioned
previously
A: solid pin fin array, B: pin fin array with horizontal / vertical (HV) perforations
C: pin fin arrays with horizontal/lateral/vertical (HLV) perforations.
For each type (4) ranges of air velocity and constant heat flux were
conducted, generally (12) experimental runs were done in the same procedure.
For a specified type of heat sink in the test section, the following procedure
was used to carry out each experiment run:
53
1. The air conditioning system of the laboratory is switched on. Room

temperature is adjusted in its front panel (T room) to be 25˚C.Waiting for
period of time till (T room) is stable as mentioned above by checking it with (T
room thermocouple).
2. The electrical power for the UPS is switched on then (PC) and Interface box
will start up and then the user interface program will be start to record .
3. The electrical power for the heater is switched on then the red light of the
variable transformer is illuminated and the voltmeter will indicate the voltage
of the power supplied (i.e. main power or diesel generator).
4. The digital differential manometer is switched on, select higher sensitivity
unit mm water (mmWC), pressure drop (ΔP) will be measured to be zero if
not calibrate the reading to be zero by pressing zero button.
5. The centrifugal ventilator is switched on to inhale air inside the duct through
the test section. The actuator knob will move until the air velocity at the
entrance will reaches specified value and will be constant.
6. The variable transformer selector is adjusted for the required input power to
the heater by monitoring current, voltage and power in the digital wattmeter
to give the required heat flux. Extra checking through the clamp meter is
done by enclosing single heater wire where (P = I *V) as clear through Fig.
(3-20).
7. To establish steady state condition, the apparatus is left for about (55)
minutes.
8. The air velocity is measured every 10 minutes to insure its stability. The
thermocouples readings are also taken at the same period until the reading
becomes constant, a final set of measurements are then recorded.
54
To heating element From main power socket
Fig. (3-20) heating element power control
3.6.2 Measurements Procedure

During each test run, the following data are recorded:
1.The average heat sink base temperature Tbase read from the outputs of the 10
thermocouples distributed in it.
2.The inlet and outlet air bulk temperature through thermocouple at the
entrance and exit section respectively.
3.The air surrounding temperature (Troom) taken by reading T room
thermocouple.
4.The new pressure drop (ΔP) between the inlet and outlet will be accurately
measured.
5. The heater current and voltage are recorded instantaneously through the
clamp meter and ovometer.
55
3.7 Data Processing and Analysis
The heat transfer mode in the present work is conduction, convection,

radiation through the air. The magnitude of each mode depends on the temperature
of pin fin array base, the geometry and the flow rate [26]. Steady state heat transfer
from pin fin array base is:
....................................................................... (3-3)
where is heat convection through the pin fin array and the steady state
heat transfer from pin fin array base is equal of electrical heat input and is
calculated from the electrical potential and current supplied to the pin fin array
base. The radiation heat loss can be neglected. The conductive heat losses through
the back sidewall of pin fin array base are measured and it is about 10 % of the
amount of the electrical heat input.
The heat transfer by convection from pin fin array surface including base
plate is given by:
……………………………(3-4)
Hence average convective heat transfer coefficient , can be found out as

follows:
……………………………………..………………(3-5)
where is the outlet airflow temperature that was determined by the

averaging of the three k-type thermocouples measured at the downstream of test
section. is the inlet airflow temperature that is determined by the averaging of
the four k-type thermocouples measured at the upstream of test section. is the
average pin fin array test section surface of reading for various pin fin array
surfaces measured and recorded by using thermal imaging infrared camera (FLIR
E30). is the surface area of pin fin array including the base of test section and
56
can be expressed by the following equations (all the parameters below are
mentioned in Table (3-1) :
........ (3-6)
where b, d, H, N, Np, , and are base length, diameter of pin fin,

pin fin height, pin fin number, perforation number, diameter of horizontal
perforation, diameter of lateral perforation and diameter of vertical perforation
respectively.
The dimensionless groups, Nusselt number and Reynolds number
are calculated as follows:
................................................................................................. (3-7)
.................................................................................................. (3-8)
Where , , and are hydraulic diameter for channel, thermal

conductivity, density and viscosity of air respectively.
The pressure drops over the test section in the model were measured. The
pressure drop can be arranged in dimensionless form by using the following
relation [15]:
...................................................................................................(3-9)
Here is the pressure drop of the airflow across the test pin fin array; V is
the mean input channel velocity over the channel cross section. can be
expressed as:
.......................................................................................... (3-10)
Where and inlet and outlet pressure respectively. The related
thermo physical properties of the working fluid are obtained using the mean
temperature, which is: [29], [3], [16] and [31]
57
...................................................................................... (3-11)
Defining the overall thermal efficiency is defined as follows [29];

........................................................................................ (3-12)
Overall thermal efficiency describes the rate of heat transfer achieved by a

certain pumping power (pressure drop).
Overall enhancement ratio (thermal performance) is defined by the

following expression [26], [27], and [33];
................................................. (3-13)
where and are experimental results of the average Nusselt number

and friction factor of the smooth channel.
The average Nusselt number for smooth channel (without pin fins) was found by
Sara et al. [34] as follows;
.................................................................... (3-14)
And the friction factor for smooth channel (without pin fins) was found by Blasius
[34] as follows;
............................................................................. (3-15)
For the constant test section base temperature, fin performance is the ratio
of heat transfer from fin to heat transfer from fin base without fin, as fin
effectiveness [26],[35] and is defined as follows for solid, horizontal/vertical (HV)
and horizontal/lateral, vertical (HLV) :
58
............................................................. (3-16)
................................................................ (3-17)
............................................................... (3-18)
where is the free stream temperature, base flat plate convection

heat transfer coefficient, base area of flat pale and is the base
temperature of flat plate.
The total thermal resistance is primary thermal performance parameter
for the pin fin heat sink which is considered in this study as:
……................................................................................ (3-19)
59
Chapter Four
Numerical and
Computational
Analysis
Chapter Four Numerical and Computational Analysis
Chapter Four
Numerical and Computational Analysis
4.1 General
Numerical investigation try to solve different engineering problems in the

life, industry and researches and makes good benefit from computational fluid
dynamics and the rapid development of the CFD packages that solve the
governing equations related these problems and establish a good solution for
difficult, costly and time consuming problems, in addition to introducing a new
idea, design and facilities for new products.
Computational Fluid Dynamics (CFD) uses numerical methods to solve the

governing equations for fluid flow and heat transfer. CFX, STAR-CD, and
FLUENT are the most widely used commercial CFD codes both in industry and
in academia.
In this chapter theoretical basis of heat transfer and fluid flow of pin fin
heat sink systems is discussed minutely, and the main details concerning with
design and analysis of cfd modeling are discussed to introduce a good solution
for the present design and to be easier guide for future similar work.
4.2 CFD and Numerical Investigation
ANSYS CFX is used in CFD Modeling .It can simulate laminar and
turbulent flows in complex geometries. Meshes generated by other meshing
software can be imported. Complicated models can be created and meshed using
a package called GAMBIT, a meshing pre-processor in the CFX package.
Comprehensive modeling capabilities of CFX enable researchers to investigate a
06
wide range of engineering flow problems including Newtonian or non-Newtonian

flows, viscous or non-viscous flows, incompressible or compressible flows,
laminar or turbulent flows, single-phase or multi-phase flows, etc. Moreover,
both steady-state and transient simulations can be performed. Various modeling
features are available to apply CFX to specific applications. These include porous
media model, lumped parameter models (fan, pump, and porous jump), and
Boussinesq approximation. Heat transfer can also be modeled with natural,
forced, and mixed convection. Multiphase flow and free surface flow can also be
modeled using CFX. These capabilities are very important in the analysis of
vapor-liquid flows in the nuclear systems which use water as coolant. The
applications of multiphase flows include boiling, condensation, sprays,
separation, and cavitation. However, multiphase CFD is very computationally
costly and far from mature due to the limitation of the models in the commercial
CFD codes.[36]
CFX is a very powerful tool to investigate the multi-dimensional flow and

heat transfer phenomena in numerous engineering applications and it is used to
achieve the numerical investigation of the influence of pin fin perforation and
their arrangement on the final performance of pin fin heat sink systems presented
in this chapter.
4.3 Governing Equations
ANSYS CFX solves the governing equations numerically for fluid flow
using finite volume methods. Mass transport equation and three-dimensional
momentum transport equations are the fundamental governing equations solved
in the CFD code. Energy equation is included for problems involving heat
transfer. Turbulence models require the transport equations for the turbulence
flow variables in addition to the Navier-Stokes equations. The governing
equations solved for the flow field are the continuity (mass conservation), The
06
Navier-Stokes equations of motion (momentum conservation) and energy

equations in three dimensions for the fluid domain (air).
A significant assumption should be considered according to the fluid and

solid properties as well as the experimental environments as following:
(3D), Turbulent flow, steady-state (time independent), incompressible fluid

( = constant and β= 0), continuum and Newtonian fluid (air), constant viscosity,
constant conductivity fluid, negligible nuclear, electromagnetic and radiation
energy transfer, negligible dissipation (Φ=0), convective heat transfer of
staggered and perforated pin fins.
Final forms of continuity, momentum and energy equations are as follows;
….…………………..……….………………….. (4-1)
………. (4-2)
……… (4-3)
..…. (4-4)
………...... (4-5)
The governing equation of the solid domain (heat sink) is only the right
side of the energy equation (Heat conduction equation for the channel walls and
pins)
….…………..……………………….. (4-6)
06
4.4 Turbulence Models
Turbulence models are used to predict the effects of turbulence in fluid

flow without resolving all scales of the smallest turbulent fluctuations.
There are different methods for the treatment of turbulent flows. The need
for a model results from the inability of CFD simulations to fully resolve all time
and length scales of a turbulent motion. In classical CFD methods, the Navier-
Stokes equations are usually time- or ensemble averaged, reducing the resolution
requirements by many orders of magnitude.
4.4.1 Two Equation Turbulence Models
Two-equation turbulence models are very widely used, as they offer a good
compromise between numerical effort and computational accuracy. Two-
equation models are much more sophisticated than the zero equation models.
Both the velocity and length scale are solved using separate transport equations .
The and two-equation models use the gradient diffusion

hypothesis to relate the Reynolds stresses to the mean velocity gradients and the
turbulent viscosity. They offer a good compromise between complexity, accuracy
and robustness. The turbulent viscosity is modeled as the product of a turbulent
velocity and turbulent length scale.
In two-equation models, the turbulence velocity scale is computed from the

turbulent kinetic energy, which is provided from the solution of its transport
equation. The turbulent length scale is estimated from two properties of the
turbulence field, usually the turbulent kinetic energy and its dissipation rate. The
dissipation rate of the turbulent kinetic energy is provided from the solution of its
transport equation.
An important weakness of standard two-equation models is that they

are insensitive to streamline curvature and system rotation. Particularly for
06
swirling flows, this can lead to an over-prediction of turbulent mixing and to a

strong decay of the core vortex. There are curvature correction models available,
but they have not been generally validated for complex flows.
The standard two-equation models can also exhibit a strong build-up of

turbulence in stagnation regions, due to their modeling of the production terms.
Several modifications are available to reduce this effect, for instance by Kato and
Launder [37]. They should be used for flows around rods, blades, airfoils, et
cetera.[38]
4.4.2 Shear Stress Transport (SST)
The flow of air in the domain is expected to be turbulent. The

Shear Stress Transport (SST) turbulence model with automatic wall function
treatment will be used because of its highly accurate predictions of flow
separation. To take advantage of the (SST) model, the boundary layer should be
resolved with at least 10 mesh nodes In order to reduce computational time.
The SST (Shear Stress Transport) model of Menter [39] is an eddy-

viscosity model which includes two main novelties:
1. It is a combination of a model (in the inner boundary layer) and

model (in the outer region and outside the boundary layer);
2. A limitation of the shear stress in adverse pressure gradient regions is

introduced.
The model has two main weaknesses: it over-predicts the shear

stress in adverse pressure gradient flows because of too large length scale and
requires near-wall modification (i.e. low-Re number damping functions/terms)
Since this equation is used for the outer part of the boundary layer, the
viscous part in the last term is omitted.
06
In the SST model the coefficients are smoothly switched from

values in the inner region of the boundary layer and values in the outer
region.[40]
4.5Finite Volume Method (FVM)
This method directly utilizes the conservation laws and the integral
formulation of the Navier-Stokes/Euler equations. It was first employed by
McDonald for the simulation of 2-D inviscid flows. FVM discretises the
governing equations by first dividing the physical space into a number of
arbitrary polyhedral control volumes. The surface integral is then approximated
by the sum of the fluxes crossing the individual faces of the control volume.
The accuracy of the spatial discretisation depends on the particular scheme
with which the fluxes are evaluated. There are several possibilities of defining the
shape and position of the control volume with respect to the grid. Two basic
approaches can be distinguished; i) Cell-centered scheme in which the flow
quantities are stored at the centroids of the grid cells. Thus, the control volumes
are identical to the grid cells. ii) Cell-vertex scheme in which the flow variables
are stored at the grid points. The control volume can then either be the union of
all cells sharing the grid point, or some volume centered on the grid point. In the
former case there is an overlapping control volumes, in the second case of dual
control volumes.
The main advantage of FVM is that the spatial discretisation is carried out
directly in the physical space. Thus, there are no problems with any
transformation between coordinate systems, as in the case of FDM.
Compared to the finite differences, one further advantage of FVM is

that it is very flexible , it can be rather easily implemented on structured as
well as on unstructured grids. This renders FVM particularly suitable for the
treatment of flows in complex geometries. Since the FVM is based on the direct
06
discretisation of the conservation laws, mass, momentum and energy are also
conserved by the numerical scheme. This leads to another important feature of
the method, namely the ability to compute weak solutions of the governing
equations correctly. However, in the case of the Euler equations, one additional
condition has to be fulfilled. As a further consequence of the conservative
discretisation, the Rankine- Hugoniot relations, which must hold across a solution
discontinuity (such as a shockwave or a contact discontinuity), are satisfied
directly. It is interesting to note that under certain conditions, FVM can be
shown to be equivalent to FDM, or to a low-order FEM. Because of its
attractive properties, FVM is nowadays very popular and in wide use. [41]
4.6 Geometry of Simulated Heat Sinks
There are three pin fin geometry simulations according to those which
experimentally tested in the heat sink systems in the heat transfer laboratory at
controlled room environments as described in the chapter three .The channel and
these models are shown in Fig. (4-1).
The numerical model constructed to represent the arrangement and

dimensions of pin fin heat sink geometry tested experimentally and shown in
Table (4-1) and the Design Modeller in ANSYS workbench was used to achieve
this task.
Table (4-1) Dimensions of pin fin heat sink
00
(a) (b)
(c ) (d) (e)
Fig.(4-1) (a) Isometric view of channel ,(b) back of channel ,(c) solid pin fin, (d)
pin fin with HV perforations and (e) pin fin with HLV perforations .
06
4.7 Mesh Generation and Grid Computation
4.7.1 Mesh Generation
After drawing all the geometrical details of heat sink, the mesh should be
generated by using ANSYS ICEM CFD which provides advanced geometry
acquisition, mesh generation, mesh optimization, and post-processing tools to
meet the requirement for integrated mesh generation and post processing tools for
today’s sophisticated analyses.
Fig. (4-2) Three type perforation and the air flow
direction through pin fin heat sink.
It is important to notice that the three type of perforation; horizontal, lateral

and vertical shown in Fig. (4-2) are named according to vertical single pin fin
stood vertically to heat sink base, not related with test rig arrangement and the
keynote in perforation name is that the horizontal perforation (H) is parallel with
air stream flow direction.
06
4.7.2 Grid Computation
Standard CFD methods require a mesh that fits the boundaries of the
computational domain. The generation of computational mesh that is suitable for
the discretized solution of three dimensional Navier-Stokes equations has always
been the subject of intensive research. This kind of problem covers a wide range
of engineering applications. This makes it impractical to find a single general
mesh generation technique that fits the whole range of problems. Therefore, it is
rather preferred to employ a suitable technique that is best adapted to the
considered type of application.
For a complex geometry, the generation of such a mesh is time consuming

and often requires modifications to the model geometry. There are mainly two
types of approaches in volume meshing, structured and unstructured meshing.
In structured mesh, the governing equations are transformed in to the
curvilinear coordinate system aligned with the surface. It is trivial for simple
shapes. However, it becomes extremely in efficient and time consuming for
complex geometries. Therefore, it has been excluded in the present study as the
geometry being considered extremely complex and contains many details.
In the unstructured approach, the integral form of governing equations is

discretized and either a finite-volume or finite-element scheme is used. The
information regarding the grid is directly incorporated into the discretization.
Unstructured grids are in general successful for complex geometries.
However, the quality of these grids deteriorates the complex shapes. In addition,
there is a large computational overhead owing to a large number of operations per
node. There are different options to create an element through CFD simulation
used for creating different element types such as Point Element by Node, Line
Element by Bar, Surface Element by Triangular element(Tri) and Quadrilateral
element(Quad) .While volume can be represented through a Tetrahedral
element(Tetra) which has four tri faces( may be used in surface mesh) , a Prism
06
element has two tri faces and three quad faces, Pyramid element has four tri faces
and one quad face. A hexahedral element has six quad faces (Hexa). [42]
4.7.2.1 Tetrahedral Mesh

In the present work unstructured mesh will be a feasible option to create
mesh of models in interest.There are many possibilities to generate unstructured
meshes to be used in CFD analysis; many researchers have been focused on a
tetrahedral element to generate unstructured mesh as the Tetra mesher is suitable
for complex geometries, and offers several advantages, including:
The important benefit from using tetrahedral mesh is that the ratio of
elements to nodes is approximately 5:1 for a tetrahedral mesh. For example, if 5
million tetrahedral elements are in a mesh, then there are approximately 1 million
nodes. This is in contrast to a hexahedral mesh where the ratio of elements to
nodes approaches 1:1 as the grid becomes large. [43]
Memory required for a tetrahedral mesh is about 0.4 times the memory
required for a hex mesh of the same number of elements. Alternatively a
tetrahedral mesh has about 2 times the required memory of a hexahedral mesh
with the same number of nodes.
Solid Domain modelling of (HLV) Perforated Pin fin is shown in Fig.(4-3)
4.7.2.2 Checking and Editing the Mesh
After tetrahedral mesh is generated there are some problems needed to be

diagnosed and fixed with aid editing tools in ANSYS ICEM CFD to improve the
mesh quality. A number of manual and automatic tools are available for
operations such as conversion of element types, refining or coarsening the mesh,
smoothing the mesh, etc.
The process typically involves the following:

66
 Checking the mesh for problems such as holes, gaps, overlapping elements
using the diagnostic checks available and fixing the problems using the
appropriate automatic or manual repair methods.
 Checking the elements for bad quality and use smoothing to improve the
mesh quality. If the mesh quality is poor, it may be appropriate to fix the
geometry instead or recreate the mesh using more appropriate size
parameters or a different meshing method. Then the mesh is then ready to
apply loads, boundary conditions, etc., and for writing to the desired
solver.
4.7.2.3 Mesh Quality and Mesh Dependency
To ensure that accurate results can be successfully obtained from a

numerical solution it is very important to evaluate this mesh for quality and
dependency prior to run. A good mesh should be fine enough with high quality
tetrahedral element and a good distribution of these tetra is necessary.
Furthermore, the mesh should not have more elements than the available
computer resources can handle.
Defining the global element scale factor, global element seed size and part
mesh specification through global mesh setup is a very significant consideration

to create a good mesh that achieves the duty mentioned above.
66
Fig. (4-3) Solid domain (Aluminium) meshing
Fig. (4-4) Fluid domain (Air) surface mesh
66
INLET
OUTLET
Fig. (4-5) Inlet and outlet region (volume mesh)
After specifying max element in global element seed size variation of

global element scale factor is a suitable approach for assessment of mesh
dependency and variation of the monitored parameters such as T base and duct
pressure drop with total element number. This assessment comprise the three pin
fin model (Solid, HV Perforation, HLV Perforation).Table (4.2) explains mesh
dependency for an arbitrary case within the study area .
Table (4-2) Mesh Dependency Assessment and Results Accuracy.
Number of elements Base temperature Duct pressure

Mesh
( Tetrahedra ) (K) Drop (Pa)
I 200,106 343.1 122.10
II 260,776 342.2 114.83
III 336,609 340.3 104.44
IV 482,756 338.6 95.41
V 770,848 335.8 85.28
VI 1,377,909 329.5 74.93
VII 1,789,650 327.7 73.79
VIII 2,431,524 326.5 72.75
IX 2,928,427 325.9 72.25
66
Fig.(4- 6 ) Variation of Base temperature with total element number.
Fig.(4-7 ) Variation of Duct Pressure Gradient with total element number.
66
As mentioned previously tetrahdral element applied to generate voluome

and surface mesh and the totale element number has been chosen according to the
results of mesh dependency assessment which clearly indicate that there are nine
mesh sizes studied for HLV Perforated pin fin and the corresponding values
of T base and duct pressure drop illustrated in Table(4-2). As can be seen from
this table and observing Fig.(4-6) and Fig.(4-7) after mesh (VIII) the difference in
the result value is very small and make no signification therefore, and for more
accuracy the (VIII) mesh has been chosen. Mesh improvement has been made to
find out the appropriate mesh size that gives highly accurate independent
solution.It is appropriate to mention here that the mesh (I) has not been illustrated
in Fig.(4-8 ) as it seen distorted and it does not seem convenient to describe the
cylindrical pin fin as that is clear from observing the figures corresponding to the
different mesh sizes .
For other pin fin models the same scale factor and mesh part maximum
size corresponding to the (VIII) mesh is chosen .
Now the confusing question is about the required fineness element should
be adopted through the two domain (solid and fluid) and where will be the results
accurate and vastly affect and using equal element size in the whole domain
would lead to an enormous number of elements which may be out of memory of
the available computer.
More fineness required near viscosity affected regions (in both thermal and
hydraulic boundary layer) like pin surface and pin perforation (a finer mesh is
generated there) and less at insignificant regions. That is why it was important to
use a fine mesh in certain regions and coarse mesh in another.[ 42 ]
Table (4-3) describe the mesh fineness and the ratio of the part mesh to the
standarad maximum element size where the small ratio indicate more fineness
66
(high quality) mesh especially in the fin and fin perforation and the adjacent mesh
for fluid domain (air).
Table (4-3) Fineness of the Mesh part as a ratio to the standarad element size
Part Base Base wall Fin Perforation Heat flux Inlet Outlet Wall
Ratio 0.5 0.5 0.2 0.1 0.5 0.8 0.8 1
4.7.2.4 Total Element Number

Important feature of a good mesh is that, it should have enough number of
elements for a good resolution but memory requirements increase as the number
of elements increases. Available computers resources do not allow one to solve
more than 3 million cells on a single processor on Windows 32-bit platforms. If
so an average of (2.43) million elements is applied to generate a good mesh.
4.7.2.5 Generating the Input for the Solver.
ANSYS ICEM CFD includes output interfaces to various flow and

structural solvers, producing appropriately formatted files that contain complete
mesh and boundary condition information. After selecting the solver, modifying
the solver parameters, writing the necessary input files is possible.
4.8 ANSYS CFX
To understand the general approach taken when working with an existing

mesh. there are three main steps when solving a problem. There are defining a
simulation using General Mode in CFX-Pre, obtaining a solution using CFX-
Solver Manager and viewing the results in CFD-Post.
60
(II) (III)
(IV) (V)
(VI ) (VII)
(VIII) (IX)
Fig.(4- 8) Variation of Mesh fineness with total element number.
66
4.8.1 Pre-CFX
The main steps which depict physics-definition of the problem to the

pre-processor for ANSYS CFX are generally, listed below:
 Creating a New Case and starting using General Mode.

 Importing a Mesh from ANSYS ICEM CFD.
 Plotting and Evaluating an Expression (model).
 Modifying Material Properties
 Creating the Domain , Inlet and Outlet Boundary Conditions
 Setting Heat Transfer mode and Fluid Flow Boundary Conditions.
 Setting Solver Control and writing the CFX-Solver Input File.
The following are the Domain Physics and Boundary Physics for a certain
case (HLV Perforated Pin Fin).
Table (4-4) Domain Physics
1. Domain – AIR Type : Fluid Analysis Type: Steady state

Materials: Air at 25 C
Fluid Definition Material Library
Morphology Continuous Fluid
Buoyancy Model Non Buoyant

Reference Pressure 1.0000e+00 [atm]
Heat Transfer Model Total Energy
Turbulence Model SST

Turbulent Wall Functions Automatic
2. Domain - FINBODY Type : Solid (Aluminium )
Domain Motion Stationary
Domain Interface - Default Fluid Solid Interface

Boundary List1 Default Fluid Solid Interface Side 1
Boundary List2 Default Fluid Solid Interface Side 2
66
Interface Type Fluid Solid
Interface Models General Connection
Mesh Connection Automatic
Table (4- 5 ) Boundary Physics
Domain: AIR
Boundary - INLET
Location INLET
Flow Regime Subsonic
Heat Transfer Static Temperature
Static Temperature 2.5000e+01 [∘C]
Mass And Momentum Normal Speed
Normal Speed 5.0000e+00 [m s^-1]
Turbulence Medium Intensity and Eddy Viscosity Ratio
Boundary - Default Fluid Solid Interface Side 1
BASE_1, Primitive 2D AT, Primitive 2D AU, Primitive 2D AV, Primitive
2D AW, Primitive 2D AX, Primitive 2D AY, Primitive 2D AZ, Primitive 2D
BA, Primitive 2D BB, Primitive 2D BC, Primitive 2D BD, Primitive 2D BE,
Primitive 2D BF, Primitive 2D BG, Primitive 2D BH, Primitive 2D BI,
Primitive 2D BJ, Primitive 2D CB, Primitive 2D CC, Primitive 2D CD,
Location
Primitive 2D CE, Primitive 2D CF, Primitive 2D CG, Primitive 2D CH,
Primitive 2D CI, Primitive 2D D, Primitive 2D E, Primitive 2D F, Primitive
2D G, Primitive 2D H, Primitive 2D I, Primitive 2D J, Primitive 2D K,
Primitive 2D L, Primitive 2D M, Primitive 2D N, Primitive 2D O, Primitive
2D P, Primitive 2D Q, Primitive 2D R, Primitive 2D S, Primitive 2D T
Heat Transfer Conservative Interface Flux
Mass And Momentum No Slip Wall
Wall Roughness Smooth Wall
Boundary - OUTLET
Location OUTLET
Flow Regime Subsonic
Mass And Momentum Average Static Pressure
Pressure Profile Blend 5.0000e-02
Relative Pressure 0.0000e+00 [Pa]
Pressure Averaging Average Over Whole Outlet
66
Boundary - WALL
Location WALL
Heat Transfer Adiabatic
Mass And Momentum No Slip Wall
Wall Roughness Smooth Wall
Domain: FIN
Boundary - Default Fluid Solid Interface Side 2

BASE_2, Primitive 2D AA, Primitive 2D AB, Primitive 2D AC, Primitive 2D
AD, Primitive 2D AE, Primitive 2D AF, Primitive 2D AG, Primitive 2D AH,
Primitive 2D AI, Primitive 2D AJ, Primitive 2D AK, Primitive 2D AL,
Primitive 2D AM, Primitive 2D AN, Primitive 2D AO, Primitive 2D AP,
Primitive 2D AQ, Primitive 2D AR, Primitive 2D AS, Primitive 2D BK,
Location Primitive 2D BL, Primitive 2D BM, Primitive 2D BN, Primitive 2D BO,
Primitive 2D BP, Primitive 2D BQ, Primitive 2D BR, Primitive 2D BS,
Primitive 2D BT, Primitive 2D BU, Primitive 2D BV, Primitive 2D BW,
Primitive 2D BX, Primitive 2D BY, Primitive 2D BZ, Primitive 2D CA,
Primitive 2D U, Primitive 2D V, Primitive 2D W, Primitive 2D X, Primitive
2D Y, Primitive 2D Z
Heat Transfer Conservative Interface Flux
Boundary - BASE_WALL
Location BASE_WALL
Heat Transfer Adiabatic
Boundary - HEAT_FLUX
Type WALL
Location HEAT_FLUX
Heat Transfer Heat Flux
Heat Flux in 8.0000e+03 [W m^-2]
4.8.2 Solver
CFX-Solver Manager is a graphical user interface that enable user to set

attributes for CFD calculation, control the CFX-Solver interactively, and view
information about the emerging solution. It is generally used to view the plotted
data and convergence history during problem solving and obtaining a Solution.
Table (4- 6 ) explain CFX-Solver Manager options used to produce required
numerical results.
66
Table (4- 6) Solver control

CFX-Solver Control
Advection Scheme High Resolution
Maximum Iteration 500
Reference Pressure 1.0000e+00 [atm]

Time Scale Control Auto Time Scale
Convergence Criteria
Residual Type RMS
Residual Target 1.E-5

Continuity
Energy
Equation Class
Momentum
Run Definition
Run definition type Full
Run mode Serial
Run priority Standard
4.8.3 CFD-Post
CFD-Post is a flexible, state-of-the-art post-processor. It is designed to

allow easy visualization and quantitative analysis of the results of CFD
simulations. Below are some of its main features:
 A graphical user interface that includes a viewer pane in which all

graphical output from CFD-Post is plotted.
 Support for a variety of graphical and geometric objects used to create

post-processing plots, to visualize the mesh, and to define locations for
quantitative calculation.
 Standard interactive viewer controls (rotate, zoom, pan, zoom box),
multiple viewports, stored views/figures.
 Extensive reports, including charting (XY, time plots).
66
 Supports transient data, including moving mesh. Node locations are

repositioned based on the position for the current time step.
 Imports/exports ANSYS data, generic data, and generic geometry.
 Generating a variety of graphical and geometric objects to which you can
apply colors and textures. These objects are used to create post-processing
plots and to define locations for quantitative calculations.
 Outputs to PostScript, JPEG, and PNG, various bitmap formats, and VRM,
as well as animation (key frame) and MPEG file output.
4.9 CFD-Post Tool Menu
It is offers access to quantitative analysis utilities, the animation editor, and

the time step selector for results shown in CFD-Post. This menu has the
following functions:
Timestep Selector, Animation, Quick Editor, Probe, Function Calculator,

Macro Calculator, Mesh Calculator, Case Comparison, Command Editor
The main tool enables one to achieve the present study was Function
Calculator which is used to provide quantitative information about the results by
selecting the function to evaluate from the list, choosing the location for the
calculation and that could be done for multiple cases so that the calculation is
performed using the absolute values of the variable. The other tool is Case
Comparison which enables one to compare results from two distinct cases,
single transient case (with results available for at least two time steps) and multi-
configuration case , so that results for two or more steps are available through
the time step selector.
Two dimension and Three dimension contour for temperature, velocity
and velocity vector, Two dimension and Three dimension contour for pressure
distribution and results of numerical investigation are shown and discussed in the
next chapter.
66
Chapter Five
Results
and
Discussion
Chapter Five Results and Discussion
Chapter Five
Results and Discussion
The experimental and numerical results are presented in four parts. The first
category deals with the experimental results of heat transfer enhancement and
pressure drop reduction. The second category deals with numerical results of heat
transfer enhancement and pressure drop reduction for SST Turbulent model. The
third category deals with optimum design for heat sink. The fourth category deals
with experimental correlations for enhancement of heat transfer and friction factors
and the present work validation.
5.1 Experimental Results

Based on the FLIR thermal imaging measurement it was determined after
steady state that the maximum, minimum and average temperature of the
monitored box area was various as shown in Fig. (5-1). The boundary conditions of
all images in Fig. (5-1) are 3 m/s input velocity, 90 W input power and 18 °C inlet
air temperature. It is clearly shown that the maximum, minimum and average
temperature for box area are lowered for HV and HLV perforations pin fin arrays
than that of the solid pin fin arrays. In addition, the temperature distribution bar for
three thermal images in Fig. (5-1) on the right hand side gives a clear impression of
perforations effectiveness. These images within the channel have the 60 cm in
wide, 40 cm in height and 100 cm in length. Vertical, horizontal and lateral
perforations have the higher temperature due to the unattached flow.
5.1.1 Heat Transfer

Figure (5-2) shows the pin fin array Nusselt number as a function of
Reynolds number for solid, horizontal/vertical (HV) perforations and
horizontal/lateral/vertical (HLV) perforations considered in the present work. It is
83
clearly shown that the perforations have influence on the rate of average heat
transfer. Adding 5 lateral perforations to the pin fin array increases the surface area
in direct contact with working fluid. The results of the HLV perforations are show
a better enhancement for HV perforations and the solid pin fin array.
5.1.2 Friction Factor ( f )

In Fig. (5-3) it is clearly shown that the friction factor for the duct with solid
pin fins array is higher than that for HV and HLV pin fin array and also
substantially higher than that for the smooth duct. Solid pin fin array presents a
higher-pressure drop of the airflow across the test pin fin array than HV and HLV
perforated pin fins. The results of HLV perforated pin fin array friction factor are
found effectively good.
5.1.3 Overall Thermal Efficiency (η)

Fig (5-4) shows the variation of the overall thermal efficiency for solid, HV
and HLV perforated pin fin arrays. It is clearly shown that the HLV perforated pin
fin array has a higher overall thermal efficiency than that solid and HV perforated
pin fin array. This can be attributed to the fact that the HLV perforated pin fin
array has a higher contact surface area with the working fluid than that in solid and
HV pin fin array (high thermal dissipation) and lower pressure drop relative to that
in solid pin fin array. Fig (5-5) shows the overall enhancement ratio (represents the
quantity of heat transfer per unit pumping power) of solid, HV and HLV pin fin
arrays with Reynolds number. Overall enhancement ratio is based on the
experimental data of the Nusselt numbers and friction factors of those channels. It
has been found that overall enhancement ratio for both HV and HLV perforated
pin fin array is greater than solid pin fin array.
84
5.1.4 Fin Effectiveness ( )

For constant base section temperature (63 oC). Fig. (5-6) shows the variation
of fin effectiveness with Reynolds number for solid, HV and HLV perforated pin
fin array. It is clearly shown that for the three types of pin fin arrays, fin
effectiveness decreases as Reynolds number increases. In addition, fin
effectiveness for HV and HLV perforated pin fin array is higher than for solid pin
fin array.
5.1.5 Total Thermal Resistance ( )

Also, for a constant base section temperature, Fig. (5-7) shows the variation
of total thermal resistance with Reynolds number for solid, HV and HLV
perforated pin fin arrays. The results show that the thermal resistance of solid pin-
fin array is higher than the thermal resistance for HV and HLV perforated pin fin
array. This is because the velocity distribution has more disturbances through the
HV and HLV perforated pin fin array due to HLV perforation which increases the
heat transfer coefficient and decreases the base temperature and decreases the
thermal resistance.
85
Maximum temperature point.
Minimum temperature point.
Fig. (5-1) Temperature distribution

field of A: solid pin fin array,
B: pin fin array with horizontal
/vertical (HV) perforations and
C: pin fin arrays with
horizontal/lateral/vertical
(HLV) perforations.
86
600
Solid pin fins

HV Perforation
550
HLV Perforation
500
Nu
450
400
350
300
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-2): Variation of Nusselt number with Re for solid pin fin,
HV perforations and HLV perforations.
0.16 Solid pin fins

HV Perforation
0.14 HLV Perforation
Smooth Channel
0.12
Friction factor, f
0.1
0.08
0.06
0.04
0.02
0
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-3) Variation of duct friction factor with Re for solid pin fin,
87
20
18 Solid pin fins

HV Perforation
16 HLV Perforation
14
12
Thermal efficiency, ƞ
10
0
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-4) Variation of thermal efficiency with Re for solid pin fin,
HV perforation and HLV perforation.
2.6
2.4 Solid pin fins

HV Perforation
2.2 HLV Perforation
Overal Enhancement Ratio
1.8
1.6
1.4
1.2
0.8
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-5) Variation of overall enhancement ratio with Re for solid pin fin,
88
Solid pin fins

8 HV Perforation
HLV Perforation
7
Fin Effectivness
3
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-6) Variation of fin effectiveness with Re for solid pin fin,
0.45
0.4 Solid pin fins

HV Perforation
HLV Perforation
0.35
Total thermal resistance
0.3
0.25
0.2
0.15
0.1
2 3 4 5 6 7 8 9 10 11 12
Re 4
x 10
Fig. (5-7) Variation of total thermal resistance with Re for solid pin fin,
89
5.2 Numerical Results

Under the operating conditions and physical properties mentioned in chapter
four, 3D dynamic simulation for a staggered pin-fin heat sink were performed. The
heat dispersion studies in this study were carried out with aluminum pin fins and
its aluminum base heat source (device). The physical properties of the materials are
assumed to be constant within the operation temperature range. The simulations
were performed using ANSYS CFX. This software has a simple and robust
graphical user interface that makes it easy to set up a PDE model with boundary
conditions. Besides, through the software one can visually set up meshes in the 3D
model and easily control the accuracy of the simulation results.
5.2.1 Profile of Velocity, Pressure Drop Vectors and Contours.

Figure (5.8) shows 3-D velocity vectors for fluid flow through solid pin fins,
HV pin fins and HLV pin fins at the two values of inlet velocity 5 m/s and 20 m/s.
The intensity velocity vectors (i.e. denoted by solid and dashed circle) for fluid
inlet velocity at 5 and 20 m/s across HV perforation pin fin and HLV perforation
pin fins are clearly shown. The intensity velocity vectors for HLV pin fin are
higher than for HV pin fin because the lateral perforations provided lower pressure
inside the horizontal perforations and it allow the flow to pass inside it.
Figures (5.9) and (5.10) show the 2-D fluid flow velocity contour for fluid
flow through solid pin fins, HV pin fins and HLV pin fins at the two values of inlet
velocity 5 m/s and 20 m/s. it is clearly shown that the maximum fluid flow velocity
occurs on the input side of horizontal perforations for HLV perforation pin fins. It
is expected that, the magnitude of velocity is increased inside the inlet horizontal
perforations due to pressure drop inside caused by lateral perforations.
90
Figures (5.11) and (5.12) show the 2-D fluid flow pressure contour through
solid pin fins, HV pin fins and HLV pin fins at inlet velocity 5 m/s and 20 m/s. it is
clearly shown that or could be expected that the HLV perforation pin fins have a
higher pressure drop than that for HV and solid pin fins. This is due to the lateral
perforation area effects on the fluid flow. Also, it is clearly shown that the
magnitude of pressure at the inlet horizontal perforation for HLV perforation pin
fins denoted by arrows has the smallest values compared with that for HV and
solid perforation pin fins and this is due to the lateral perforations.
5.2.2 Thermal dispersion contour

Figure (5.13) shows the temperature contour distribution for the staggered
solid, HV, HLV perforations pin fins arrangements taken on the 3-D. For the
present analysis inlet air temperature was kept constant at 25 °C, inlet fluid flow
velocity 5 m/s and the base section surface was kept as wall boundary with a
constant heat of 90 W and outlet pressure was assumed to be zero. It is clearly
shown that the lateral perforations have effects on pin fins temperature reductions.
HLV perforation pin fins gave a higher reduction in surface temperatures.
Figure (5.14) shows the thermal dispersion by fluid flow of solid pin fins,
HV and HLV perforation pin fins. It is clearly shown that or could be expected that
the amount of thermal dispersion from pin fin surfaces for HLV perforation pin
fins is the largest compared with that in solid pin fins and HV perforation pin fins.
Therefore, HLV gave the largest thermal dispersion as convection area was
increased.
91
Solid pin fin

Solid pin fin
Inlet velocity=20 m/s
HV pin fin
HV pin fin Inlet velocity=20 m/s
HLV pin fin HLV pin fin

Inlet velocity=5 m/s Inlet velocity=20 m/s
Fig.( 5.8) 3-D Velocity vectors for fluid flow through solid pin fins, HV pin fins and HLV pin fins at
the two values of inlet velocity 5 m/s and 20 m/s
92
Maximum fluid velocity
Fig.(5.9) 2-D Velocity contour for fluid flow through solid pin fins, HV pin fins and HLV pin fins at
93
Maximum fluid velocity
Fig. (5.10) 2-D Velocity contour for fluid flow through solid pin fins, HV
pin fins and HLV pin fins at inlet velocity 20 m/s.
94
Solid pin fin

HV pin fin
HLV pin fin

Fig. (5.11) 2-D pressure contour for fluid flow through solid pin fins, HV pin
fins and HLV pin fins at inlet velocity 5 m/s.
95
Solid pin fin

HV pin fin
HLV pin fin

Fig. (5.12) 2-D pressure contour for fluid flow through solid pin fins,
HV pin fins and HLV pin fins at inlet velocity 20 m/s.
96
Fig.( 5.13) 3-D temperature contour for solid pin fins, HV pin fins and HLV pin
fins at inlet velocity 5 m/s.
97
Thermal dispersion
Fig (5.14) 2-D temperature contour for solid pin fins, HV pin fins and HLV
pin fins at inlet velocity 5 m/s.
98
5. 3 Numerical data analysis
In this part further performance criteria such as heat transfer enhancement ,

friction factor reduction ,maximizing overall thermal efficiency and minimizing
total thermal resistance will be discussed to clarify the optimum model according
to numerical output resulting from numerical analysis. Introducing more than one
performance criteria makes a good and clear vision about the optimum design for
different considerations and important factor effect on the manufacturer and
consumer preference (maximum heat dissipation, lower pumping power, weight
and cost).
5.3.1 Heat Transfer
In Fig. (5-15) variation of Nusselt number with Re for solid pin fin, HV
perforation and HLV perforation show that there is a good enhancement for heat
transfer if horizontal and vertical perforation are added and more enhancement is
achieved through coupling of three perforation types, horizontal ,lateral and
vertical. That what proved experimentally as mentioned previously because of
increasing the convection area of the pin fin array and penetration of the cold air
inside perforation made the pin fin more exposed for the air stream.
5.3.2. Friction Factor ( f )

Friction factor variation with Re for solid pin fin,HV perforation and HLV
perforation shown in Fig. (5-16). Numerical results with respect to the pressure
drops, gave different results with those from observation in the experimental
results. Possible explanation for this difference to the mismatch of the
hydrodynamic side in the sst model that used in present numerical analysis.
Although, the portion of thermal analysis was gave a similar results with the
experimental side of this study.
99
5.3.3. Overall Thermal Efficiency (η)
It is clear from fig. (5-17) that the higher thermal efficiency was achieved in
the HV perforated pin fin as the lower pressure drop resulted from the flow. as
known that the heat transfer enhancement was the gain upon what payed to force
the flow through the channel(pumping power).hence increasing in pumping power
not result same gain in Nu as the flow has little time to carry much heat from the
pin fin array .that is what explain decreasing thermal efficiency with Re increasing.
From above HV perforated pin fin had higher enhancement in heat transfer
(Nu/Nus) in addition to lower friction factor as comparing with smooth channel (f
/fs) make it the preferred model for pin fin if compared with solid and (HLV)
perforated pin fin array. That shows Fig. (5-18) which explain Variation of overall
enhancement ratio with Re for solid pin fin,HV perforation and HLV perforation.
5.3.4 Total Thermal Resistance ( )
Lower base temperature of heat sink, means more safety operation for
electronics is what preferred through heat sink design. in Fig. (5-19) total thermal
resistance with Re for mentioned models was plotted and show that lower thermal
resistance was achieved by using HLV perforated pin fin for its higher heat transfer
enhancement as discussed in (5.3.1 ) as compared to another model.
5.3.5 Weight reduction

Cost is a vital important factor investigated from manufacturer for
economical consideration and from user for easily transport and mobility. For a
better performance (if not the same) make a consider reduction in weigh that what
proved experimentally and numerically during this study and will be explain in the
next chapter.
100
520
Solid Pin Fin
HV Perforated Pin Fin
500
HLV Perforated Pin Fin
480
460
440
Nu
420
400
380
360
340
320
2 3 4 5 6 7 8 9 10 11 12
Re x 10
4
Fig. (5-15) Variation of Nusselt number with Re for solid pin fin,
0.14
Solid Pin Fin
0.12 Smooth Channel
0.1
Friction Factor , f
0.08
0.06
0.04
0.02
2 3 4 5 6 7 8 9 10 11 12
Re x 10
4
Fig. (5-16) Variation of duct friction factor with Re for solid pin fin,
101
25
Solid Pin Fin
20
Thermal efficiency, ƞ
15
10
0
2 3 4 5 6 7 8 9 10 11 12
Re x 10
4
Fig. (5-17) Variation of thermal efficiency with Re for solid pin fin,
3
Solid Pin Fin
2.5
Overall Enhancement Ratio
1.5
0.5
2 3 4 5 6 7 8 9 10 11 12
Re x 10
4
Fig. (5-18) Variation of overall enhancement ratio with Re for solid pin fin,
102
0.5
Solid Pin Fin
0.45
0.4
Thermal Resistance (Rth.)
0.35
0.3
0.25
0.2
2 3 4 5 6 7 8 9 10 11 12
Re x 10
4
Fig. (5-19) Variation of total thermal resistance with Re for solid pin fin,
5.4 present work correlations and validation.

5.4.1: Enhancement of heat transfer and friction factor correlations.
The average Nusselt number and friction factor for the staggered perforated
array of pins like fins were correlated as a function of Reynolds number and
Prandtl number by using LAB Fit program and the following expressions were
obtained:
For solid pins like fins:
, (5.1)
, (5.2)
For horizontal /vertical (HV) perforations;
, (5.3)
, (5.4)
And for horizontal/vertical/lateral (HVL) perforations;
103
(5.5)
(5.6)
One of the performance evaluation criterions (sparrow 1980, Sara 2003) is to

compare the heat transfer coefficient for constant pumping power for the channel
with finned surface with that for the smooth surface. The pumping power is
proportional to f Re3, and the relationship between the finned and smooth duct for
the same pumping power is expressed by (Sara 2003):
(5.7)
Where f and Re are the values for the finned duct, and fs and Res are those for the
smooth duct and the friction factor for smooth channel (without pin fins) was
found by Blasius equation as follows;
(5.8)
According to the constant pumping power constraint, the mass flow rates (or
Reynolds number) passing through the finned and reference smooth channel
cannot be the same, since the mass flow rate for the smooth channel must be
increased to keep the fluid pumping power constant. Using eq. 5.7 to expressed
Res.
In the present study, define heat transfer enhancement factor, Nu *, was used
to appraise the possible benefits of using perforation pin fins (Sara 2003):
(5.9)
Where is the average Nusselt number for the smooth channel with Res
at which the pumping power is the same as that occurring in the finned channel.
can be calculated from the following correlation (Sara et al. 2001)
(5.10)
Figure (5-20) shows the heat transfer enhancement factor denoted in eq.
5.9 as a function of equivalent Reynolds number Res for three shapes. It is clearly
shown that the HLV perforation shape give a higher heat transfer enhancement
104
factor. Also, all enhancement factors for all shapes are higher than unity. This is an
advantage to use a perforation pin fins in the heat transfer enhancement. In
addition, for all shapes, the channels with pin fin arrays give higher enhancement
factor at lower Reynolds number than those at higher Reynolds number (Sara
2003).
2.8
2.6 Solid pin fins

HV Perforation
2.4 HLV Perforation
2.2
2
Nu*
1.8
1.6
1.4
1.2
1
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Res 5
x 10
Fig. (5-20) Heat transfer enhancement factor as a function of
equivalent Reynolds number for three shapes.
105
5.4.2 Validation
Figure (5-21) shows the present experimental and numerical results
comparing with Sara’s experimental results for various interfin spacing ratios and
clearance ratios. It is clearly shown the same trend for present experimental and
numerical results with Sara’s results in spite of the different Reynolds number.
650
600
550
500
Duct Nusselt number
450
400
350
Sara 2003, C/H=0
300 Sara 2003, C/H=1.0
Sara 2003, Sx/D=4.17
250
Sara 2003, Sx/D=1.58
Present experemintal result
200
Present numerical result
150
0 2 4 6 8 10 12
Re 4
x 10
Fig. (5-21) Duct Nusselt number vs. Reynolds number for present
experimental and numerical results with various interfin
spacing ratio and clearance ratio for Sara 2003.
From fig. (5-22) a good agreement were seen for heat transfer enhancement
with error ± 7% between the present experimental and numerical results.
Also, It is clearly shown from fig.(5-23) that when comparing friction factor
for present experimental and numerical results there is a good agreement with
error ± 9% .
106
Fig. (5-22) Average Nusselt number vs. Reynolds number for present
experimental and numerical results.
. Fig. (5-23) Friction factor vs. Reynolds number for present

experimental and numerical results.
107
Chapter Six
Conclusions
and
Recommendations
Chapter Six Conclusions and Recommendations
Chapter Six
Conclusions and Recommendations
6.1 Concluding Comments
It is hoped that the information included in the present study will help
engineers to become more familiar with the various options available through
the use of perforation pin fins heat sink systems. The methods of analysis
outlined here, and the correlations included, should facilitate this although
designs can be performed for many types of systems with the computer
approach outlined. Hopefully, designers will recognize the significant
performance improvements possible for many applications with the use of
perforation pin fins heat sink systems.
6.2 Conclusions
In this study, the overall heat transfer, friction factor, thermal efficiency,
overall enhancement ratio, fin effectiveness and thermal resistance are
investigated experimentally and numerically. The effects of the working fluid
flow and horizontal/lateral/vertical perforated pin fin array on the overall heat
transfer, friction factor, thermal efficiency, overall enhancement ratio, fin
effectiveness and thermal resistance are determined. The conclusions are
summarized as:
1- Average Nusselt number increases with increasing perforations like lateral

perforations.
2- Friction factor decreases with increasing contact surface area due to
perforations.
108
3- HLV perforated pin fin array has a highly thermal dissipated and lower
pressure drop relative to solid and HV perforated pin fin arrays
4- Maximum overall enhancement ratio is obtained with a minimum value of
Reynolds number and it is a higher value for HLV perforated pin fin
array.
5- Nusselt number of pins with horizontal/vertical (HV) perforation is about
11% higher than that for solid pins and with horizontal /vertical/lateral
(HLV) perforation is about 21% higher than that for the solid pins.
6- Pressure drop with horizontal/vertical (HV) perforation is reduced by
about 23% compared with that in solid pins and with
horizontal/vertical/lateral (HLV) perforation reduced by about 19%
compared with that in solid pins
7- The weight reduction for the single HV perforated pin fin is 15.4%
relative to that in solid pin fin and the weight reduction for the single
HLV pin fin is 21.65 % relative to solid pin fin .That means HLV
perforated pin fin is lighter than solid and HV. HLV perforated pin fin
array. This is achieved in economically.
8- Intensity velocity vectors for HLV pin fin are higher than for HV pin fin
because the lateral perforations provide lower pressure inside the
horizontal perforations and it allows the flow to pass inside it.
9- HLV perforation pin fins gave a higher reduction in surface temperatures
than solid pin fins and HV perforation.
109
6.3 Recommendations
The recommendations for future research on this topic are as follows:
1. Treating the problem as three dimensional problems and natural

convection, however the gravity of air and mixed convection is significant
and should be taken into account.
2. Considering the time effect and the inclusion of the unsteady-state term in
the governing equation should be considered.
3. Studying the same problem experimentally and numerically for the
condition of impingement of flow.
4. Studying the difference between staggered and in-line perforated pin-fin
heat sinks.
5. Studying the optimization of perforated fin spacing and gaps between heat
sinks to maximize heat transfer from an array of heat sinks.
6. Studying the effect of perforation orientation with flow direction to
maximize heat transfer from an array of perforated pin fin heat sinks.
7. Studying Turbulence modelling of pin fin heat sink systems numerically.
110
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Appendix
Appendix Calibration
Appendix
Calibration
An automated control is possible thanks to the so-called “transducers” or
“sensors” placed along the process that is sought to control. These sensors allow
transforming a “physical” sign into an electric sign establishing a “linear” relation
between the intensity of the electrical sign and the intensity of the physical magnitude.
It is known that a transducer is a device that is able to transform a physical

magnitude into an electric sign (current, voltage, frequency, etc.). The mechanisms used
to obtain this relation are many and varied, having infinity of different sensors at the
moment with different operational principles. In all of them obtaining a linear answer to
the measured physical magnitude was required to have a low hysteresis and to be stable
in a wide range of temperatures.
Calibration Basis
Electric sign generated by the sensor is transformed, by conditioning cards, into a

voltage, in volts, that is able of being interpreted by the computer (acquisition card) or,
failing that, to digital indicators (display). This electric sign, itself, does not have any
meaning if it is not related with a physical magnitude .This relation between the electric
sign and the physical magnitude is the basis of the calibration.
Therefore, the calibration consists on having an alternative method that allows

relating the electric sign with the physical measure. For example, calibrations of
thermocouples require a mercury thermometer that provides the temperature and relate
this measure with the sign provided by the sensor. Taking different temperature
measures and their corresponding sign in volts, carrying out a representation like one
shown in fig. (I) to obtain a linear relation as following:
Y =a +b*X
Where: a and b are constants of linear relation for measured parameter.
Fig. ( I ) Thermocouples reading and linear relation
It must be understood that the base of a good operation of an automated industrial

plant is mainly due to the adjustment or calibration that has been carried out with the
sensors. The same electric sign can correspond with different temperatures in function
of the constants values, a and b. For it, it is important to make an effort in obtaining
good values of a and b.
Up to now, we have supposed that the relation between the electric sign and the
physical magnitude is linear, that is, it is only necessary to determine parameters a and
b. Sometimes the sensors can have a linear behavior in a range and a behavior that is far
away from linearity in another. In these cases, the sensor calibration should be carried
out by an adjustment of a polynomial of superior order.
Thermocouple Calibration
Mercury thermometer is used for calibration whereas the thermal junction of the
thermocouple and the thermometer probe is placed in an ice pool once of zero degree
and then in a boiling water of 100 degree. Figure (II) show the ice pool of 0∘c and
boiling distilled water of 100 ∘c used to calibrate thermocouples. It was found that the
error was  0.05 .
(A) (B)
Fig. (II) (A) Ice pool of 0∘c, (B) boiling distilled water of 100 ∘c
Air Velocity Calibration
Before starting with experimental work, air velocity should be measured carefully
in order to obtain results with high accuracy.
Air velocity passing through the channel measured via diaphragm differential
pressure gauge measure the differential pressure between the air pressure inside the
channel and the outer atmospheric pressure then the air velocity was calculated and
displayed in the computer.
To ensure that the measured velocity of the fluid is accurate, calibrated digital
anemometer of (± 1% FS) accuracy was used.
Numerous reading for air velocity measured via digital anemometer and
corresponding value monitored through computer to obtain the linear relation of
velocity measurement .Then, the relation constants a and b were calculated as shown in
fig.( III ). It was found that the error was  0.04 .
Fig. (III) Air velocity and linear relation.

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‫المقطع العرضي للقناة (‪ 26 )w‬ملم‪،‬عمق المقطع العرضي (‪ 721 )l‬ملم و طول القناة ( ‪ 7611 ) L‬ملم‪.‬‬
‫غطت التجارب النطاق التالي ‪ :‬عدد رينولدز ‪ ،28000-113000‬وزعانف دبوسية ذات اشكال‬
‫صلبة ‪ ،‬زعانف دبوسية ذات ثقب أفقي‪/‬عمودي)‪ (HV‬وزعانف دبوسية ذات ثقب أفقي‪/‬جانبي‪/‬عمودي‬
‫(‪.)HLV‬‬
‫تم ايجاد معادالت تجريبية النتقال الحرارة وهبوط الضغط‪ .‬اظهرت النتائج أن عدد نسلت‬
‫للزعانف الدبوسية ذات التثقيب أفقي‪/‬عمودي ( ‪ ) HV‬هو أعلى بحوالي ‪ ٪ 11‬عما هو للدبابيس الصلبة‬
‫وللزعانف الدبوسية ذات التثقيب أفقي‪/‬جانبي‪ /‬عمودي (‪ )HLV‬هو أعلى بحوالي‪ ٪ 21‬عما هو‬
‫للدبابيس الصلبة‪ .‬تم تخفيض هبوط الضغط للزعانف الدبوسية ذات التثقيب أفقي‪/‬عمودي بنحو ‪٪ 62‬‬
‫مقارنة مع ما هو للزعانف الدبوسية الصلبة و للزعانف الدبوسية ذات ثقب أفقي‪/‬جانبي‪/‬عمودي )‪(HLV‬‬
‫تم تخفيضه بنحو ‪ ٪ 71‬مقارنة مع ماهو للدبابيس الصلبة‪ .‬باإلضافة إلى ذلك‪ ،‬اظهرت النتائج التجريبية‬
‫بأن الزعانف الدبوسية ذات التثقيب أفقي‪/‬جانبي‪/‬عمودي (‪ )HLV‬تعزز عملية انتقال الحرارة بصورة‬
‫جيدة عالوة على ذلك االنخفاض الكبير في الوزن حوالي ‪ % 67.22‬مقارنة مع الزعانف الدبوسية‬
‫الصلبة‪.‬‬
‫اظهرت النتائج العددية التي استنتجت باستخدام برنامج ‪ ANSYS-CFX-12‬أن كثافة متجهات‬
‫السرعة للدبابيس ذات التثقيب أفقي‪/‬جانبي‪/‬عمودي )‪ (HLV‬هي أعلى مما في الزعانف الدبوسية ذات‬
‫التثقيب أفقي ‪/‬عمودي (‪ )HV‬ألن الثقوب الجانبية سببت انخفاضا للضغط داخل الثقوب األفقية وانها‬
‫سمحت للجريان ان يتدفق داخلها‪ .‬كما ان الزعانف الدبوسية ذات التثقيب أفقي‪/‬جانبي‪/‬عمودي )‪(HLV‬‬
‫أظهرت انخفاضا اكبر في درجات حرارة السطح مما للزعانف الدبوسية الصلبة و الدبابيس ذات التثقيب‬
‫أفقي ‪/‬عمودي (‪.)HV‬‬
‫ختاما ً فقد اظهرت النتائج العددية الحالية ت ََوافُقا ممتازا مع النتائج التجريبية (مع نسبة خطأ ‪1 ±‬‬
‫‪ ٪‬لتعزيز انتقال الحرارة و لهبوط الضغط بنسبة خطأ ‪. ) ٪ 1 ±‬‬
‫جمهورية العراق‬
‫وزارة التعليم العالي والبحث العلمي‬
‫هيئة التعليم التقني‬
‫الكلية التقنية ‪ -‬بغداد‬
‫دراسة تجريبية وعددية‬

‫ألنظمة المغاطس الحرارية ذات الزعانف المثقبة‬
‫دراسة مقدمة‬
‫الى مجلس الكلية التقنية‪ -‬بغداد‪/‬هيئة التعليم التقني وهي جزء من متطلبات نيل درجة‬
‫الماجستير التقني في تقنيات هندسة الحراريات‬
‫من قبل المهندس‬

‫انمار عدنان عباس الطرفي‬
‫بأشراف‬
‫د‪ .‬علي شاكر باقر‬ ‫د‪ .‬احمد قاسم محمد‬

‫مدرس‬ ‫أستاذ مساعد‬
‫جمادى االولى ‪ 0235‬ه‬ ‫اذار ‪ 4102‬م‬
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Experimental and Numerical Study of Perforated Fin Heat Sinks Systems

Thesis · May 2014

Anmar Adnan Ali Shakir Baqir

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Experimental and Numerical Study

Anmar Adnan Abbas Al-Turfi

Dr. Ahmed Q. Mohammed Dr. Ali Shakir Baqir

March 2014 Jumada Al-Awwal 1435

‫ين يَ ْستَ ِمعُو َن الْ َق ْو َل فَ يَتَّبِعُو َن‬ ‫ذ‬‫(الَّ ِ‬

‫صدق اهلل العلي العظيم‬

‫إىل النيب األمي الذي علم األمم‪ .....‬رسولنا الكريم‬

‫(صلى اهلل عليه واله وصحبه وسلم)‬

‫إىل كل عني بكت من خشيــــــــــة اهلل‬

‫إىل كل عني باتت حترس يف سبيـــــل اهلل‬

‫إىل الشموع احملرتقة ومناهل العلم ‪........‬أساتذتي األفاضل‬

‫إىل روح من علمين االخالص والوفاء‪،‬معلمي األول وقدوتي يف احلياة ‪ ........‬والــدي‬

‫إىل من غمرتين بفيض دعائها ‪،‬فيض احلنان ورمز العطاء ‪ .....‬امـــي‬

‫اىل القلوب اليت خفقت علي خوفاً ‪ .....‬اخوتي واخواتي‬

‫إىل من قامسين املشقة والعناء زوجيت واوالدي ‪ ...‬أمحد وحسني‬

‫إىل االيدي اليت امتدت الي واستنهضتين‪.............‬اصدقائي االوفياء‬

‫وبكل تواضع ‪ ...........‬اهدي اليكم مثـرة جهدي هذا‬

As I present this study, I want to present my gratitude to God in most

This study investigated experimentally and numerically the pressure drop

Symbol Definition Units

Symbol Definition Units

Figure Caption Page

Table Caption Page

The failure rate of electronic equipments increases exponentially with

telecommunications systems, airplanes, satellite, space vehicles, ships,

In electronic equipments, total system dissipated power levels are

Although this "increased power- decreased size" development has been

The constant demand for speed and performance in electronics is unfortunately

1.2 Heat Sink Systems

A unique feature of heat exchanger used in electronics is the possibility that

Increasing power density in electronic systems increase the cooling design

Aluminum alloys (6063 or 6061) are most common, followed by copper

Fig. (1-1) Epoxy-bonded fin heat sinks.

These heat sinks consist of an extruded or machined base, which is flat on

Fig. (1-2) Pin-Fin heat sinks.

Fig. (1-3) Folded fin heat sinks.

Manufacturing of heat sinks widely spreads to provide thermal solutions for

1.3 Perforated Fins

The presence of perforations in the extended surfaces (fins) have many

Available at: www.qats.com Advanced Thermal Solution Inc. USA

1. 4 Aim of the Present Work

1- Numerical investigation of the fluid dynamics and heat transfer process of

3- Identifying and studying the effect of variation of the non-dimensional

1.5 Organization of the Study

Heat transfer enhancement techniques are broadly classified into three

Heat transfer enhancement by these techniques can be achieved by using

Active Techniques In these cases, external power is used to facilitate the

There have been many experimental, theoretical and numerical

An extensive review of the conducted researches related to flow behavior

2.2 Forced Convection through Heat Sink System

2.2.1 Experimental Studies

Fig. (2-1) Diagram description of the pin-fin arrays [9], [10].

Sara , et al.(2000) [11] studied the thermal performances of solid and

Sara (2003) [4] analyzed convective heat transfer through a rectangular

Fig. (2-2) Square pin ﬁns array. [4]

Fig. (2-3) The arrangements of fins on plate [13]