HEMPS 9.

005
Engineering Material and DATE 05 Apr., 2000
Process Specification
PAGE 1 OF 2

TITLE: Epoxy Bonding Of Wear Resistant Inserts Into Choke Bean REVISION A
Carriers SUPPLEMENT

1. SCOPE
1.1 This specification establishes the requirements for the epoxy bonding of wear resistant inserts in choke
bean carrier components. The epoxy materials specified in this document are used for the bonding of choke
components into place and are not intended for structural purposes. The epoxy bond is suitable for expo-
sure to well bore fluid environments up to 250°F continuous service and 300°F intermittent service.
1.2 This specification has been revised and reformatted from the previous revision. Due to the number and
the nature of the revisions, this specification will not be annotated with indices in the margin to denote the
revisions. This revision includes the provisions of Amendment B of this specification.

2. BONDING MATERIALS
The epoxy bonding materials used for the bonding of these choke bean carrier components shall be chosen from
one of the following materials and shall be used without substitution unless authorized by Hydril engineering.

2.1 Bakerline Formula "C" Bakerlok (product no. 199-50).

2.2 Armstrong Adhesive Formula A-2/A.

3. BONDING PROCEDURE
3.1 Surface Cleaning
All surfaces to be epoxy bonded shall be thoroughly solvent cleaned. Surfaces that are rusted shall be blast
cleaned and solvent degreased. All surfaces shall be free of oils, greases, cutting fluids, rust, scale and
other foreign material.

3.2 Mixing and Pot Life

The epoxy components are to be mixed in accordance with the manufacturer's instructions. The
temperature of the work area shall be in the 50° to 100°F range during mixing and application. The pot life of
the epoxy components, after initial mixing, shall not exceed the manufacturers’ recommendations.

3.3 Application
Using a suitable tool, apply a coating of epoxy bonding material over the region of the cemented carbide
insert and the insert carrier to be bonded. Position the insert into place in the insert carrier and wipe off any
excess epoxy. The bonded assembly shall be left undisturbed in the bonded upright position for at least 2
hours. Care must be exercised in handling of the bonded assembly until it is fully cured (see Section 3.4).

3.4 Curing Time

Full strength cure times shall conform to the limitations as shown in the manufacturers’ specifications for the
adhesive used.
 REVISION A SUPPLEMENT HEMPS 9.005

DATE 05 Apr., 2000 PAGE 2 OF 2

4. INSPECTION
All surfaces shall be visually examined for cleanliness prior to epoxy bonding. The bonded insert shall be visually
inspected immediately after application of the bonding agent for excess epoxy and placement of the insert.