You are on page 1of 3

View Article Online / Journal Homepage / Table of Contents for this issue

TECHNICAL NOTE www.rsc.org/loc | Lab on a Chip

Rapid, cost-efficient fabrication of microfluidic reactors in thermoplastic


polymers by combining photolithography and hot embossing†
Jesse Greener,a Wei Li,‡a Judy Ren,a Dan Voicu,a Viktoriya Pakharenko,a Tian Tangb
and Eugenia Kumacheva*a
Received 11th September 2009, Accepted 11th November 2009
First published as an Advance Article on the web 1st December 2009
DOI: 10.1039/b918834g
Published on 01 December 2009. Downloaded by Reprints Desk on 7/24/2018 7:41:13 AM.

We report a cost-efficient and easy to implement process for fabricating microfluidic reactors in
thermoplastic materials. The method includes (i) the fabrication of an imprint template (master), which
consists of a photoresist deposited on a metal plate; (ii) the thermoembossing of the reactor features
into polymer sheets; (iii) the activation of the embossed and planar thermoplastic surfaces; and (iv) the
low-temperature bonding of these surfaces. The generality of the method is established by fabricating
microfluidic reactors with a complex geometry in a range of thermoplastic polymers, including
cycloolefin, polycarbonate, and UV-transparent acrylic polymers and by the multiple, high-fidelity use
of the master.

Introduction transition temperatures, e.g., poly(methyl methacrylate). These


drawbacks limit the implementation of HE for the production of
Chemical reactions performed in microfluidic reactors are char- microfluidic reactors.
acterised by efficient mixing, enhanced heat and mass transfer, We overcame the limitations listed above by using photoli-
protection from contamination, and the ability to perform multi- thography to directly generate inexpensive and robust masters,
step reactions in a continuous mode.1–5 There is a growing which consisted of the two-layer patterned photoresist film
interest in rapid and cost-efficient fabrication of microreactors applied to a metal plate. The imprint template was sufficiently
with the purpose of high-throughput screening and optimization robust to be used to imprint the features of a microfluidic reactor
of formulations or increased productivity of microfluidic for the synthesis of polymer particles at least 40 times. No
synthesis. noticeable degradation or change in pattern fidelity was
Hot embossing (HE) is a promising technique for the fabri- observed, important in the scaled up synthesis of polymer
cation of microfluidic reactors with channel dimensions on the microbeads with narrow size distribution.23 Following the HE
order of tens to hundreds of micrometres and high aspect ratio step, a microfluidic reactor was produced by bonding the
features.6–12 This method requires relatively low heating patterned thermoplastic sheet with a planar thermoplastic sheet.
(in comparison with e.g., injection molding), thereby reducing The method was utilized to fabricate microfluidic reactors in
residual thermal stress in the fabricated device.11 a range of thermoplastic materials with the glass transition
Commercially available imprint templates (i.e., stamps or temperature, Tg, in the range 113  C # Tg # 149  C using
masters) for HE are usually fabricated from metals, e.g., from a standard temperature-controlled hydraulic press.
nickel, by using mechanical machining,13 laser ablation,14 or We selected the following thermoplastic materials for the
electroforming.15 These methods suffer from high cost and long fabrication of microreactors by HE: a cycloolefin polymer
production times. Stamps based on patterned silicon wafers are (COP), a UV-transparent acrylic polymer, and polycarbonate
fragile and prone to breaking, especially with repeated use.16 (PC). The use of a COP had advantages over the two other
Similarly, masters produced from silicon wafers coated with polymers owing to the combination of high transmission in the
a patterned photoresist are not robust, and they frequently suffer UV-Vis, relatively low viscosity at elevated temperatures, low
from poor adhesion of the photoresist to the wafer in the de- water absorption, low fluorescence background, and its ability to
embossing step.17–20 Imprint templates based on epoxy and activate its surface by O2 plasma treatment.24–27 Therefore,
polyester resins21,22 have been generated in a multi-step process whereas both the acrylic polymer and PC were successfully used
by replicating a primary mold (usually, fabricated in poly- for the fabrication of microreactors, most of the results reported
(dimethylsiloxane)) and, to the best of our knowledge, they have in the current paper are presented for the fabrication of micro-
only been used to pattern materials with relatively low glass reactors in COP.

a
Fabrication of the imprint template
Department of Chemistry, University of Toronto, 80 St. George Street,
Toronto, Ontario, M5S 3H6, Canada. E-mail: ekumache@chem. Fig. 1 shows the schematic of the fabrication of the master. A
utoronto.ca; Fax: +1 416-978-3576; Tel: +1 416-978-3576
b
seed layer of SU-8 3050 (MicroChem Corp. USA) with a thick-
EV Group, Inc., 7700 S. River Parkway, Tempe, Arizona, 85284, USA
† Electronic supplementary information (ESI) available: Experimental ness of approximately 40 mm was spin-coated on a square copper
details. See DOI: 10.1039/b918834g base sheet with dimensions of 76  76  1 mm. The photoresist
‡ Co-first author was subsequently cross-linked using UV irradiation (MA6 mask

522 | Lab Chip, 2010, 10, 522–524 This journal is ª The Royal Society of Chemistry 2010
View Article Online

The details of the embossing and de-embossing processes as well


as the low-temperature bonding of the imprinted and patterned
surfaces are given in ESI†.

Results and discussion


To assess the quality of the imprinting, we focused on the highest
aspect ratio element of the reactor: the orifice region of the
droplet generator.29 Fig. 3a and b show optical microscopy
images (top view) of the master and of the patterned COP sheet,
respectively. The embossed features in the polymer were the
Published on 01 December 2009. Downloaded by Reprints Desk on 7/24/2018 7:41:13 AM.

exact inverse of the features of the master used for HE. In Fig. 3a
defocused vertical microgrooves (the result of polishing of the
copper sheet) are seen through the transparent photoresist layer.
The fidelity of the imprinting process was examined by
comparing the dimensions of the orifice on the mask, the master,
and the imprinted pattern in COP. Fig. 3c shows a typical profile
(acquired using optical profilometry) of the cross-section of the
orifice in a master and the COP sheet embossed at Te ¼ 166  C and
Fig. 1 Fabrication of a Cu/SU-8 HE imprint template (see text). de-embossed at Td ¼ 125  C. The side walls in both fabrication steps
had the wall angle of 3.9  0.5 from the normal. The imprinted
orifice had a 3 mm smaller width compared to the master, which led
aligner, SUSS Microtech) and baked at 90  C (Fig. 1a). A second
to the 6% decrease in its volume. We note that the fidelity in the HE
layer of SU-8 3050 with a thickness of 75–110 mm was spin-
process benefited from the closer match of SU-8 thermal expansion
coated on top of the primary layer and soft baked at 95  C for
coefficient (a ¼ 52 ppm K1) to that of the thermoplastic polymers
40 min (Fig. 1b). The hardened SU-8 was then selectively cross-
used (see ESI†), compared to templates made from silicon (a ¼
linked by placing a mask (resolution of 5080 dpi) with micro-
3.3 ppm K1)30 or Ni (a ¼ 14.4 ppm K1).31
reactor features on top of the second photoresist layer and
The HE process conducted with the SU-8/Cu master had high
exposing the system to UV irradiation (Fig. 1c). After removing
fidelity of imprinting over the course of many cycles. Using
the uncross-linked photoresist with SU-8 Developer (Microchem
Corp.), the remaining photoresist was hardened at 175  C for 2 h
(Fig. 1d) and the imprint template was ready for use.
In the present work, the thermoembossed microfluidic reactor
had the topography of a planar flow-focusing droplet gener-
ator,29 followed by the polymerization compartment (the wavy
downstream channel). Fig. 2 shows the imprint template and the
sealed microfluidic reactor. The height of the channels was
106 mm and the total area of the embossed features was 230 mm2.

Fig. 3 Optical microscopy images (top view) of the orifice region on the
two-layer SU-8/Cu master (a) and the corresponding patterned COP
sheet (b). The scale bar represents 200 mm. (c) The profile of the cross-
Fig. 2 (a) A photograph of the imprint template (master) comprising section of the orifice acquired from the master (solid line) and the
a two-layer SU-8 film applied to a copper base plate and the fabricated patterned COP sheet (dotted line). The profile of the cross-section of the
microfluidic reactor for the synthesis of polymer particles (b). In (b) the master is presented upside down, in order to compare it with the channel
emulsification compartment (i) and reaction compartment (ii) are high- cross-section. Vertical dashed lines in (a) and (b) show the locations
lighted with dashed boxes. The scale bar represents 1 cm. To enhance the where measurements were taken. (d) The profile of the orifice cross-
visibility of the features of the master in (a) they have been coated with section on the imprint template before (solid line) and after (dotted line)
ink.28 The reactor channels in (b) were filled with a green food dye. 40 HE cycles.

This journal is ª The Royal Society of Chemistry 2010 Lab Chip, 2010, 10, 522–524 | 523
View Article Online

a single SU-8/Cu master, we imprinted 40 microfluidic reactors in authors thank Professor H. Naguib (University of Toronto) for
COP with the average orifice width at the bottom and the top of the use of a temperature-controlled hydraulic press.
44.8 mm  1.0 mm and 58.5 mm  2.1 mm, respectively. The
tapering angle was in the range of 2.5–5.4 , with an average of
3.7  1.3 . The tapering angle depended on the embossing Notes and references
temperature and pressure and it was minimised for Te $ 155  C
and Pe ¼ 600 kPa. The SU-8/Cu imprint template was durable: 1 H. R. Sahoo, J. G. Kralj and K. F. Jensen, Angew. Chem., Int. Ed.,
2007, 46, 5704–5708.
after 40 HE cycles, the features of the template did not noticeably 2 D. M. Ratner, E. R. Murphy, M. Jhunjhunwala, D. A. Snyder,
change (Fig. 3d). We attribute the durability of the imprint K. F. Jensen and P. H. Seeberger, Chem. Commun., 2005,
template to four factors minimising stresses in the de-embossing 578–580.
3 A. J. deMello, Nature, 2006, 442, 394–402.
step: (i) matched thermal expansion coefficients (a) of the master
Published on 01 December 2009. Downloaded by Reprints Desk on 7/24/2018 7:41:13 AM.

4 Microreactors: New Technology for Modern Chemistry, ed. W.


and thermoplastic polymers, (ii) smooth template walls, (iii) the Ehrfeld, V. Hessel and H. L€ owe, Wiley-VCH Verlag Gmbh,
existence of a seed protoresist layer and (iv) strong adhesion of Weinheim, Germany 2000, 1–288.
the photoresist to the copper base. The selection of copper (a ¼ 5 A. Gunther and K. F. Jensen, Lab Chip, 2006, 6, 1487–1503.
6 N. S. Cameron, H. Roberge, T. Veres, S. C. Jakeway and
18.0 ppm K1)32 as the base material also made it superior to e.g., H. J. Crabtree, Lab Chip, 2006, 6, 936–941.
silicon, owing to the closer match of thermoexpansion properties 7 P. W. Leech, J. Micromech. Microeng., 2009, 19, 1–5.
of copper and SU-8. Low surface roughness of the walls of the 8 Y. Chen and A. Pepin, Electrophoresis, 2001, 22, 187–207.
9 B. D. Gates, Q. B. Xu, J. C. Love, D. B. Wolfe and G. M. Whitesides,
master minimised friction between the template and the ther- Annu. Rev. Mater. Res., 2004, 34, 339–372.
moplastic polymer during de-embossing (see ESI†). The seed 10 H. Becker and C. Gartner, Electrophoresis, 2000, 21, 12–26.
photoresist layer increased the adhesion of the patterned SU-8 11 D. G. Yao, P. Nagarajan, L. Li and A. Y. Yi, Polym. Eng. Sci., 2007,
layer to the master base and prevented its peeling during de- 47, 530–539.
12 M. Heckele and W. K. Schomburg, J. Micromech. Microeng., 2004,
embossing. Furthermore, based on shear force tests, adhesion of 14, R1–R14.
SU-8 3050 to copper is the strongest compared to any other 13 T. Schaller, L. Bohn, J. Mayer and K. Schubert, Precis. Eng., 1999,
substrate, including silicon.33 23, 229–235.
In the next step, we bonded the patterned and planar sheets of 14 P. P. Shiu, G. K. Knopf, M. Ostojic and S. Nikumb, J. Micromech.
Microeng., 2008, 18, 025012.
the thermoplastic polymer by exposing them to either vapours of 15 T. Shibata, Y. Takahashi, T. Kawashima, T. Kubota, M. Mita,
methylcyclohexane (MCH), or to O2 plasma followed by sealing T. Mineta and E. Makino, Microsyst. Technol., 2008, 14,
via the application of pressure and temperature lower than Tg 1359–1365.
16 T. Nielsen, D. Nilsson, F. Bundgaard, P. Shi, P. Szabo, O. Geschke
(see ESI†).26,27,34 In both cases bonding was strong (e.g., when and A. Kristensen, J. Vac. Sci. Technol., B, 2004, 22, 1770–1775.
MCH activation was used, we were able to achieve flow rates in 17 J. Zhang, K. L. Tan, G. D. Hong, L. J. Yang and H. Q. Gong,
excess of 160 mL h1) and the channel dimensions were not J. Micromech. Microeng., 2001, 11, 20–26.
noticeably altered. Finally, we utilized the fabricated devices for 18 A. Bhattacharyya and C. M. Klapperich, Anal. Chem., 2006, 78,
788–792.
the emulsification of polar and non-polar liquids, namely, an 19 M. B. Esch, S. Kapur, G. Irizarry and V. Genova, Lab Chip, 2003, 3,
aqueous solution of N-isopropyl acrylamide, a photoinitiator, 121–127.
and a crosslinking agent and a mixture of tripropylene glycol 20 A. Mathur, S. S. Roy, M. Tweedie, S. Mukhopadhyay, S. K. Mitra
and J. A. McLaughlin, Curr. Appl. Phys., 2009, 9, 1199–1202.
diacrylate (ESI†).
21 T. Koerner, L. Brown, R. X. Xie and R. D. Oleschuk, Sens. Actuators,
B, 2005, 107, 632–639.
Summary and outlook 22 G. S. Fiorini, G. D. M. Jeffries, D. S. W. Lim, C. L. Kuyper and
D. T. Chiu, Lab Chip, 2003, 3, 158–163.
We used photolithographically generated imprint templates 23 W. Li, J. Greener, D. Voicu and E. Kumacheva, Lab Chip, 2009, 9,
2715–2721.
(masters) for the HE-based fabrication of microfluidic reactors in
24 M. Yamazaki, J. Mol. Catal. A: Chem., 2004, 213, 81–87.
a range of thermoplastic polymers. Our work has two important 25 C. G. Koh, W. Tan, M. Q. Zhao, A. J. Ricco and Z. H. Fan, Anal.
implications: fast fabrication of robust, low-cost SU-8/Cu Chem., 2003, 75, 4591–4598.
masters (4 stamps in 6–8 h) and the subsequent high-fidelity 26 C. W. Tsao and D. L. DeVoe, Microfluid. Nanofluid., 2009, 6,
1–16.
fabrication of thermoplastic microreactors (ca. 2 h per reactor). 27 Hartmut Steffen, K. Schr€ oder, B. Busse, A. Ohl and K. D. Weltmann,
The imprint template is durable in multiple imprinting steps. Plasma Processes Polym., 2007, 4, S392–S396.
These features are beneficial in rapid prototyping of microfluidic 28 J. W. Jung, Y. J. Lee, M. S. Shin, H. R. Kim and J. H. Kim, Mol.
reactors. Further improvements of the fabrication process Cryst. Liq. Cryst., 2007, 470, 183–190.
29 S. L. Anna, N. Bontoux and H. A. Stone, Appl. Phys. Lett., 2003, 82,
include automated temperature and pressure control and 364–366.
vacuum capabilities. 30 H. Watanabe, N. Yamada and M. Okaji, Int. J. Thermophys., 2004,
25, 221–236.
31 T. G. Kollie, Phys. Rev. B: Solid State, 1977, 16, 4872.
Acknowledgements 32 T. A. Hahn, J. Appl. Phys., 1970, 41, 5096–5101.
33 http://www.microchem.com/products/pdf/SU-8-Adhesion-Results.pdf.
The authors acknowledge financial support from NSERC Can- 34 P. Kettner, R. L. Pelzer, T. Glinsner, S. Farrens and D. Lee, J. Phys.
ada and Ontario Ministry of Research and Innovation. The Conf. Ser., 2006, 34, 65–71.

524 | Lab Chip, 2010, 10, 522–524 This journal is ª The Royal Society of Chemistry 2010

You might also like