Application guide:

Parallel Delayering

The following guide is intended to be used as a reference for recipe development

and process characterization. The parameters offer the baseline for sample recipe
development and has been effective on many devices. Modifications to this recipe
are expected based on different device metallization/dielectrics and routing/layout
to achieve maximum uniformity.

NOTE: These parameters were derived using new polishing cloths after each
polished layer.

Material Paste or Polishing Polish X/Y Feed

Force RPM # of Passes Pattern Overlap Z-Limit
Type Slurry Cloth Outline Rate
1 µm As many as Left
Passivation Diamond Final X 0.5 – 1 N 5000 needed to remove Off -to- 60 % 2 mm/s 10-20 µm
Paste the layer Right
1 µm As many as Left
Metal Layer Diamond Final X 0.5 – 1 N 5000 needed to remove Off -to- 60 % 2 mm/s 10-20 µm
Paste the layer Right
0.04 µm As many as Left
ILD/IMD Colloidal Final X 0.5 – 1 N 5000 needed to remove Off -to- 60 % 2 mm/s 10-20 µm
Silica the layer Right

Notes:

• Definition of Region – Planar (2D) Workflow – Visible Region/Object:

– Define the region such that approximately 40-50% of polishing tool diameter travels off the die edge. In
the case of a 10 mm x 10 mm die, using a 9 mm polishing mount, set top-left point 4 mm – 4.5 mm off
the die corner, and the bottom-left corner an equal amount.
• Leveling:
– Use a 1 mm polishing mount with an X-Pad II cloth secured to the tip to avoid damage to the
passivation/top level metal.
– Use CUSTOM LEVELING POINTS to maximize the leveling area by setting the leveling points in
approximately 0.7 mm from the die edges.
• This will improve perpendicularity of the polishing tool to the sample and give the best possible
uniformity.
– Leveling Tolerance = 0.5 µm
• Z-Control Mode/Polishing Tool Selection:
– Use “Position Force” Mode
– The diameter (Ø) of the polishing tool should be as near in size as possible to the smallest
X/Y dimension of the sample (NOT THE DEFINED POLISHING REGION)
• Number of Passes:
– The number of passes chosen must be determined for each sample individually.
– The count will generally be high because of the ratio of the tool size to X/Y region
– Characterization is necessary to develop a methodology that is repeatable on subsequent samples of the
same layout/structure.
– Package rigidity and stability (mounting) will influence the polishing rate.
– Check the polishing cloth for signs of wear and replace when/if it becomes noticeably worn. It’s best to
change the cloth after each layer.
– Other polishing cloths of similar physical characteristics may be substituted – use firm flocked or porous
urethane-synthetic cloths.

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Parallel Delayering - REV A - Jun2017.docx
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