Quadra User Manual Guide V3

Quadra X-ray Microscope
Users Guide
V3.0
August 2017
Dage
Important Information
for
Our Customers
Nordson DAGE Support Options
Dear Customer,
Congratulations on your purchase of your Nordson DAGE X-ray inspection system.
Nordson DAGE is committed to excellent service World-wide and our goal is to provide you with
professional assistance in the use of our Test & Measurement Equipment, wherever you are
located.
Nordson DAGE offices are located in six strategic centers in the USA, Asia & Europe and the
company’s customer service & support is acknowledged to be ‘the best in the business’.
We trust that you find our product an invaluable tool & hope that you will pass on any comments
you may have so that we can continue to enhance the product and service to you.
Our Web address is: www.nordsondage.com.
Foreword
The product described in this guide is subject to continuous development and improvement.
Consequently, there may be minor variations in specifications, facilities or operation that are not
covered in this guide.
The machine must be operated and maintained only by suitably trained and qualified personnel.
Every effort has been made to ensure that the information provided in this guide is accurate at
the time of going to print. If any errors or omissions are noticed, please notify Nordson DAGE
Ltd.
Copyright
© 2017 Nordson DAGE Ltd. All rights reserved.
No part of this publication may be reproduced, transmitted, stored in a retrieval system, or
translated into any language in any form by any means without the prior written permission of
Nordson DAGE Ltd.
Trademarks
All trademarks are acknowledged as belonging to their respective companies.
Patents
Please note that Nordson DAGE products are patent protected and covered by the patents
listed at www.nordson.com/dagepatents.
Contact information
Dage Precision Industries Limited,
25 Faraday Road,
Rabans Lane Industrial Area,
Aylesbury,
Buckinghamshire,
HP19 8RY,
United Kingdom.
Regional offices
Sales Customer Service
globalsales@nordsondage.com
UK DPI-customerservicex@nordsondage.com
+44 1296 317800
sales.de@nordsondage.com
Germany ServiceDageGermany@nordsondage.com
+49 89 2000 338 200
South East sales.sg@nordsondage.com
DS-customerservice@nordsondage.com
Asia +65 6552 7533
sales.jp@nordsondage.com
Japan Contact Sales
+81 3 3599 5920
sales.ch@nordsondage.com
China chinaservicex@nordsondage.com
+86 512 6665 2008
sales@nordsondage.com
Americas serviceUSA@nordsondage.com
+1 760 930 3307
globalsales@nordsondage.com
Taiwan DPI-customerservicex@nordsondage.com
+886 2 2902 1860
Note: For any issue regarding the use, service or radiation safety of the machine please contact
your local Nordson DAGE representative.
Dage Precision Industries Limited Software License - EULA
1. You, the end user, are granted a non-exclusive and non-transferable license to use the
software accompanying Dage Precision Industries Limited products only in connection with
those products. No license is granted for any other purpose. There is no right granted to
copy, redistribute, reverse engineer, or modify of the software.
2. The software, including any source code, documentation, appearance, structure and
organization, are proprietary products of Dage Precision Industries Limited and are
protected by copyright and other laws.
3. This license is not a sale. Title and copyrights to the software, including source code,
documentation, appearance, structure, organization and any copies made by you remain
with Dage Precision Industries Limited.
4. This Agreement is effective until terminated. Failure to comply with the terms and conditions
of this Agreement will result in the automatic termination of this Agreement and will make
available to Dage Precision Industries Limited any and all legal remedies. Upon termination
of this license you must immediately destroy the software programs and all back-up copies
thereof.
About this manual
This guide describes the operation of the following machines, and their associated options and
accessories:
 Nordson DAGE Quadra 7 X-ray machine
 Nordson DAGE Quadra 5 X-ray machine
It is intended for use by suitably-qualified and trained operators.
For installation and maintenance instruction, refer to the Installation and Maintenance Guide.
Document version: V3 August 2017.
The English version of this document is considered to be the original instructions.
The following documents are associated with this guide:
 Quadra Installation and Maintenance Guide
 Third-party documents for:

 PC system
 Monitor
Design variations
Due to slight design variations between the Quadra 7 and the Quadra 5 models, some of the
illustrations provided in this document may differ from the actual machine you are working on.
However, most of these variations are cosmetic and do not impact on the associated procedure
steps. Any major differences will be mentioned, where applicable.
i
Contents
1. Reference 7
1.1. Compliance 7
2. Safety information 9
2.1. Document signal words 9
2.2. Labels 10
2.3. Operators safety rules 13
2.4. Hazardous Energies 13
2.5. Moving the machine 14
2.6. Sample handling 14
2.7. Safety interlocks 14
2.8. Lock Out - Tag Out procedures 15
2.9. Re-establishing the supplies 17
2.10. X-ray safety 17
2.11. Statutory regulations 18
2.12. Local safety rules 19
2.13. Hazardous materials 19
2.14. High voltage hazard 19
2.15. Safe disposal instructions 20
3. Machine overview 21
3.1. Machine layout 21
3.2. Interior layout 25
3.3. Operating software 27
3.4. Software interface 28
3.4.1. Right-click menu 29
3.4.2. Right hand control panel 30
3.4.3. Menu functions 31
3.4.4. Mini tabs 34
3.4.5. Video processing and other function buttons 35
3.4.6. Machine controls 35
3.4.7. Low Resolution Monitor Option 37
3.4.8. Second Monitor Option 37
3.4.9. More options screen 38
ii Quadra User Guide
4. Getting started 41
4.1. Setting up the workstation 41
4.2. Switching the machine on 42
4.3. Warming-up the X-ray tube 44
4.4. Loading/unloading a sample 44
4.5. Sample holders 46
4.6. Maximizing magnification 47
4.7. Switching the machine off normally 48
4.8. Switching the machine off in an emergency 49
5. Inspecting a sample 51
5.1. Selecting user 51
5.2. Switching the X-rays on 52
5.3. Getting an image 52
5.4. Adjusting what you see 53
5.4.1. Moving the image around 53
5.4.2. Changing the magnification 54
5.4.3. Viewing at an angle 54
5.4.4. Iso-centric oblique angle viewing 56
5.4.5. Setting the height 56
5.5. Switching the X-rays off 57
6. Adjusting for the best image 59

6.1. Manual image settings 59
6.2. Gray scale equalization 60
6.3. Adding additional image enhancements 62
6.3.1. Image controls 63
6.3.2. Noise reduction 66
6.3.3. Image averaging 66
6.3.4. Automatic image processing 67
6.3.5. Adjusting the contrast 67
6.3.6. Live Image Smoothing 68
Contents iii
7. Using the Board Image tools 69

7.1. Making a navigation map 70
7.2. Marking defects on the navigation map 71
7.3. Using the map 72
8. Using Annotations 75
8.1. Using annotations to mark faults 75
8.2. Using the annotation tools 76
9. Using the Image Processing tools 79

9.1. Adjusting the histogram 81
10. Using the Image Enhancement tools 83

10.1. Adding image filtering and enhancements 85
10.2. Creating a filter pipeline 85
11. Using Image Recipes 89
12. Using the Analysis tools 93

12.1. Outline Measurements 94
12.1.1. Measuring ball grid arrays (BGA) manually 97
12.1.2. Getting ready 97
12.1.3. Measuring ball outlines 99
12.1.4. Finding the ball outline 100
12.2. Using the automation wizard 101
12.2.1. Starting, saving and running an automated routine 102
12.2.2. Creating automatic measurement routines 103
12.2.2.1. Creating a BGA routine 103
12.2.2.2. Creating a void measurement routine 108
12.2.2.3. Creating an auto wire sweep routine 109
12.2.2.4. Creating a Quad Flat Pack No-Leads routine - Quadra 112
12.2.2.5. Creating a solder pads analysis routine 116
12.2.3. Executing a routine 118
12.2.4. Deleting a routine 120
12.3. Drawing Tools 120
12.3.1. Drawing tools - basic operation 121
12.4. Void Measurements 122
12.4.1. Void measurement controls 123
12.4.2. Threshold detection 129
12.4.3. Blob Detector 132
12.4.4. Exporting Data 136
12.5. User Drawn Void Measurements 138
12.5.1. Adding and removing void areas manually 139
iv Quadra User Guide
12.6. Template Based Analysis 139

12.6.1. Creating a Template Based Analysis 139
12.6.2. Selecting and Running the Template Based Analysis 140
12.7. CAD Template Editor 141
12.7.1. CAD editor controls 141
12.7.2. Creating a CAD template 150
12.7.3. Importing an existing CAD template 152
13. Using the Measurement tools 155
14. Using the Automatic Inspection Routine tools 165

14.1. Automatic Inspection Routine Controls 166
14.2. Defining the inspection steps 180
14.3. Inspecting die, BGA and general voids automatically 181
14.3.1. Part location and alignment 181
14.3.2. Operator reference image and prompts 185
14.3.3. Operator grading and viewing options 187
14.4. Creating or editing an Automated Inspection Routine 188
14.4.1. Creating a new routine using the Automatic Inspection Routine (AIR) wizard 189
14.4.2. Defining inspection steps within an automated routine 197
14.4.3. Editing inspection steps within an automated routine 199
14.4.4. Grading options - logging passes and failures during automated inspection 202
Contents v
14.5. Using automatic inspections 204

14.6. Importing and using CAD data 211
14.7. Data storage 214
14.8. Viewing an automated inspection routine report off-line 214
14.9. Results 216
15. Using the Expert Image Wizard 223

15.1. How the wizard works 224
16. Using the Image Optimization tools 227
17. Using X-Plane® 233

17.1. X-Plane® Operation 237
17.2. X-Plane® Viewer 239
18. Printing and Saving the image 243
19. Using the Video tools 245

19.1. Setting the video capture options 246
20. Database viewer 249
21. System configuration 253

21.1. Settings on the options screen 253
21.2. User access 257
21.3. User names 258
21.4. Licensed Functionality 259
22. Technical reference 261

22.1. Understanding Filters 261
22.2. Report export formats 264
22.3. Setting the operating language 266
22.4. Radiation measurements and units 271
23. Principles of operation 273

23.1. X-ray generation 273
23.2. Imaging with X-rays 278
24. Index 281

vi Quadra User Guide
7
1. Reference
1.1. Compliance
As declared in the accompanying CE Declaration of Conformity both the Nordson
DAGE Quadra 7 and Quadra 5 X-ray machines comply with the following directives:
 Machinery Safety Directive 2006/42/EC
 Electromagnetic Compatibility Directive 2014/30/EU
This equipment has been designed and manufactured to meet the following
transposed harmonised European standards:
 BS EN ISO 12100:2010 - Safety of Machinery - General principles for design.
Risk assessment and risk reduction
 BS EN 349:1993+A1:2008 - Safety of Machinery - Minimum gaps to avoid
crushing parts of the human body
 BS EN ISO 13850:2015 - Safety of Machinery - Emergency stop function.
Principles for design
 BS EN 60204-1:2006+A1:2009 - Safety of Machinery - Electrical equipment of
machines. General requirements
 BS EN 61000-6-2:2005 - Electromagnetic compatibility (EMC). Generic
standards. Immunity for industrial environments
 BS EN 61000-6-4:2007+A1:2011 - Electromagnetic compatibility (EMC).
Generic standards. Emission standard for industrial environments
This equipment complies with the following:
 RoHS (2002/95/EC) - Note: Lead is used for radiation shielding
 SEMI (S2 & S8)
 US Federal Regulation 21 CFR 1020.40 for cabinet X-ray systems
 UL listed or recognised components are used for key critical components
This equipment complies with the essential Health and Safety requirements of the
Machinery Safety Directive, the protection requirements of the EMC Directive and
with the principal elements of the safety objectives of the Low Voltage Equipment
Directive 2014/35/EU.
The CE Mark was first applied in 2016.
Dage Precision Industries Limited operates a Quality Management System that has
been assessed against and accredited to BS EN ISO 9001:2008
FCC - Radio and television interference

This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.
© 2017 Nordson Dage Ltd.

8 Quadra User Guide
Environmental impact statement

The environmental impact of the Quadra X-ray machine while in use is the typical
consumption of 1kW electrical power. Refer to the De-commissioning the machine
section of the Installation and Maintenance Guide for the end of use product
recycling.

9
2. Safety information
2.1. Document signal words
The following Signal Words are used in this document. All safety related notes and
reminders are marked by an appropriate symbol and the text highlighted in RED.
Please read them carefully:
Symbol Meaning
DANGER indicates an imminently hazardous

situation which, if not avoided, will result in death or
serious injury.
WARNING indicates a potentially hazardous
situation which, if not avoided, could result in death
or serious injury.
CAUTION indicates a potentially hazardous situation
which, if not avoided, may result in minor or
moderate injury. It may also be used to alert against
unsafe practices.

10 Quadra User Guide
2.2. Labels
Safety labels are attached to the machine to indicate potential hazards.
It is very important you take note of these safety labels, and follow the specified
safety procedures and instructions printed on them.
Label Meaning
For the purposes of this unit indicates that X-rays are emitted
when the X-ray tube is energized. X-rays are harmful to the
human body.
To comply with local and national regulations additional text may
be required to accompany the radiation trefoil. Due to variations in
local requirements this will need to be supplied locally.
Label Meaning
This indicates that X-rays are emitted

when the X-ray tube is energized.
X-rays are harmful to the human
body.
This indicates that equipment
surfaces are hot.
Always turn-off and lockout the
equipment and leave for one hour
before servicing.
There is a risk of severe burn if you
attempt to handle a hot surface.
Label Meaning
This indicates that you should read and understand the

equipment manuals prior to opening or gaining internal
access to the equipment.
Failure to follow the stated operating instructions and
procedures could result in personal injury to yourself or
others, or equipment malfunction.

Safety information 11
This indicates the presence of high voltages within the

equipment after machine lockout.
Always isolate the supply at the facility before accessing.
High voltages can cause death or serious injury.
This indicates the presence of a high voltage on an

equipment connector.
Do not apply power to the equipment without the connector
correctly fitted and terminated.

This indicates the presence of compressed air.

Always isolate and lockout the pneumatic supply before
servicing.
Compressed air can cause serious injury.
This indicates the presence of high voltages within the

equipment.
Three formats of this label may be fitted to the machine.
This indicates the presence of high

voltages within the equipment after
Emergency shut down.
High voltages can cause death or serious
injury.
Two formats of this label may be fitted to
the machine.
This indicates the presence of residual high voltage after power off and electrical
lockout. High voltages can cause death or serious injury.
These two labels indicate the equipment is a heavy object. Always use lifting aids
and proper lifting techniques. Incorrect lifting can cause muscle strain or back
injury.

2.3. Operators safety rules

To avoid damage to the machine as well as avoid the risk of personal injury:
Always read this guide to become fully acquainted with all aspects of using the
machine
Always observe all relevant local regulations and follow normal operational good
practice for handling compressed air
Always follow the maintenance shutdown procedure to isolate the supplies and
lock-out/tag-out the isolators before carrying out any maintenance work
Always maintain the machine as prescribed in the Installation and Maintenance
Guide
Always adhere to Local Rules when operating or maintaining the machine to
ensure there is no risk due to radiation leakage
Always follow the recommended cleaning procedures and clean the machine on
a regular basis
Always move and/or lift the machine in accordance with the instructions
contained in the Installation and Maintenance Guide
Always use Dage-approved replacement parts to service the machine as
alternatives may result in increased radiation or degradation of the
safety features
Do not place magnetic samples inside the machine as this will cause tube
damage and invalidate the warranty.
Do not attempt to operate the machine, or carry out maintenance work on the
machine if you are unqualified, or unfit to do so
Do not defeat any of the machine's safety features
Do not use the machine if it is damaged or faulty in any way
Do not use the machine for any purpose other than as specified in this guide
Do not attempt to operate the machine with the doors open by overriding the
interlocks
Do not compromise the integrity of the cabinet's lead shielding
Do not make any modifications to the machine without the express permission
of Nordson DAGE.
2.4. Hazardous Energies

Once the machine has been connected to the relevant services, the following
hazardous energies are present within the equipment:
 Electricity
 Compressed air
And when energised:
 X-ray ionising radiation

2.5. Moving the machine

The machine is extremely heavy due to its rigid
construction and lead lining.
Attempting to move the machine could result in
serious damage to the machine, or injury to
individuals. The machine should only be moved in
accordance with the instructions contained in the
Installation and Maintenance Guide.
2.6. Sample handling

The maximum sample tray weight that may be loaded in the machine is 5kg (11lb).
However, Semi S8 guidelines suggest that for manual two-handed material handling
of loads in excess of 4.5kg (10lb) the task is analysed ergonomically to ensure the
safety of the operator.
Therefore, Nordson DAGE recommend that all manual sample handling tasks are
reviewed to ensure that the task is not hazardous to the operator.
2.7. Safety interlocks

The machine can be powered up only when:
 The Emergency Stop pushbutton located on the keyboard tray (1) is in the
released position.
 The key is inserted into the key-operated switch (2) and turned to either of the
'on' positions (Power Enable or X-Ray Enable).
Note: The Power Enable position does not allow X-rays to be generated, or the
system manipulator to be moved.

X-rays can only be generated when the machine is powered up, and the interlocks
on both the main access and sample access doors are closed.
Note: These interlocks are a double-redundant, self-monitoring systems designed for
safety critical applications.
The sample access door is locked by a latch that is electrically released under
software control and cannot be opened unless a request is made by the operator via
the operator interface. This lock system:
 Prevents uncontrolled opening of the door with the X-rays on, which is
extremely hazardous to health.
 Turns the X-rays off.
 Allows the system to bring all motion to a controlled stop and position the
manipulator to facilitate a sample load/unload sequence.
2.8. Lock Out - Tag Out procedures

Always complete the following procedures if
maintenance work is to be carried out on the
machine.
Electrical isolation and lockout

Main incoming electrical supply to the main
isolator is always live, unless the main facility
supply to the machine is disconnected and
isolated.
The main isolator and associated components are
located under a separate protective cover.
1. Ensure local approval and permission has been authorized and obtained.
2. Switch off the X-rays.
3. Close the Gensys application.
4. Wait for the manipulator movements to cease.
5. Close any other running applications.
6. Log-off and power down the control computer PC system.
7. Switch off the monitor(s).
8. Turn the key-switch (1) to the Power Off position and remove the key.
9. Turn the main isolator switch (2) to the Off position indicated by O.
10. Fit lockout padlock(s) and a lockout tag to the main isolator.

11. If any work is to be carried out on electrical systems within the main transformer
compartment (located at the rear of the electrical panel), the mains supply
should be isolated from the machine.
12. If any work is to be carried out on the pneumatic systems, the pneumatic lockout
must be applied.
13. Verify that the electrical system has been de-energized. All illuminated
indicators should be extinguished and the machine controls and PC should be
inactive.
14. Carry out service and maintenance work on electrical and mechanical
components, as required.
Pneumatic isolation and lockout

Main incoming pneumatic supply is always
pressurised, unless the main facility supply to the
machine is disconnected and isolated. Therefore,
if any work is to be carried out on the air regulator
unit itself, the machine must be disconnected and
isolated from the main supply.
Depending on system build variant, the pneumatic regulator unit is located either:
 Internally, within the control computer compartment. It can be mounted either on
the rear wall, or the central wall.
 Externally, on the rear wall of the enclosure.
1. Ensure local approval and permission has been authorised/obtained.
2. Perform an electrical lockout.
3. Rotate the orange knob on the shut-off valve (1) counter-clockwise to close the
valve and de-pressurise the downstream circuit.
4. Fit lockout padlock(s) and a lockout tag to the shut-off valve.
5. Verify that the system has been de-pressurised. The gauge (2) on the regulator
unit should read zero.
6. Carry out service and maintenance work, as required.

2.9. Re-establishing the supplies

To prevent unintended restoration of the supplies,
this procedure should be carried out under the
exclusive supervision of the person carrying out the
work on the machine.
1. Ensure all maintenance tasks have been completed as specified.
2. Ensure all machine fixings are secure.
3. Tidy-up and replace any items, panels and covers removed for access.
4. Ensure that all enclosures and compartments are closed and secure.
5. If work has been carried out on the pneumatic system:
 Release safety lock and remove lockout tag from pneumatic shut-off valve.
 Push the valve down and rotate clockwise to re-establish the air supply.
 Check there are no leaks from any disturbed/replaced items. Rectify as
necessary.
6. Remove any lock or tag fitted to the main electrical isolator and rotate from Off
to On.
7. Check the Emergency Power Off button is released.
8. Depress the Power On push-button.
9. For continued X-ray protection, perform an X-ray leakage test if:
 The integrity of the shielding has been affected by the work undertaken.
 The X-ray tube or its associated HVPSU has been repaired/replaced.
 Any interlock or safety component has been repaired/replaced.
 Any shielding has been repaired/replaced.
However, the above list is not definitive and you should always perform an X-ray
leakage test if you suspect that the work undertaken may have affected any
aspect of the machine's radiation protection and safety systems and their
associated components.
10. Verify that the equipment is restored back to normal operation and in particular
the functioning of any part serviced or replaced.
11. Inform all affected parties about lockout tag removal and that the equipment is
restored to full use.
2.10. X-ray safety
Ionizing radiation
The machine produces X-rays which are
harmful to the human body.
The X-ray source is completely contained in the shielded cabinet, with interlocking
access doors preventing accidental exposure in normal use. When the interlocks are
activated, or during an electrical lockout, there is no possibility of any residual
ionizing radiation remaining inside the shielded cabinet. X-rays cease to be
produced as soon as the power is removed from the X-ray tube.

Illuminated X-ray On indicators are provided on the front, side and rear panels of the
cabinet.
An underlying principle of radiation protection is that the radiation from the machine
should be limited to 'As Low As Reasonably Achievable'. This principle is embodied
in the machine design, but this is also a requirement of the machine users, and
appropriate guidance should be given in the local rules.
The machine must be checked at regular intervals to verify that
X-ray leakage from the shielded cabinet during operation is no
higher than 1μSv/H. Refer to the Installation and Maintenance
Guide for details.
If radiation is detected above this level or a fault suspected,
switch off the machine immediately.
Shielding methods
The machine is lined with lead or lead glass in all areas where X-rays could
otherwise escape through the cabinet. The thickness of the lead-lining varies
according to the power of the expected radiation. Generally, the lead-lining is thicker
at the top of the cabinet.
The cabinet doors are also lead-lined and overlap the aperture in the cabinet to
ensure complete prevention of X-ray leakage. Shield bars are used extensively
around the opening to reduce/eliminate radiation leakage.
X-ray On indicators
The cabinet is fitted with a total of five long-life LED indicators that are illuminated
when X-rays are being generated within the cabinet. They are located around the
upper panels of the machine and provide easy visibility of X-ray generation from all
four sides.
Each indicator is clearly marked with X-ray On.
The front indicators are actuated by the system, while the side and rear indicators
are actuated by the X-ray tube controller directly. In addition, the X-ray on status is
also displayed on the system software monitor screen.
Measurement methods
Radiation leakage should be measured using either a Geiger Muller or CW tube
suitable for the measurement of 30-160kV radiation and capable of detecting
radiation at levels of less than 1μSv/h.
Note: A full leakage check procedure should be performed according to local safety
rules. Refer to the Installation and Maintenance Guide for details.
2.11. Statutory regulations

The cabinet has been designed to comply with the appropriate US standards and
UK legislation. However, the purchaser must take due account of any radiation
protection legislation in their own countries. The following section reflects the
requirements of UK legislation, which may or may not be appropriate in other
countries.
Within the UK, please refer to 'Information to UK customers - Radiological Protection
Information for X-ray Inspection System'. This document is available from Nordson
DAGE UK upon request.

2.12. Local safety rules

The operator and any other personnel in the vicinity of the machine must observe all
local safety rules in addition to the safety precautions and procedures given in the
Installation and Maintenance Guide.
Appointed safety personnel

Safety personnel must be appointed in accordance with local safety rules.
The rules may also require the appointment of an on-site Radiation Protection
Supervisor and an external Radiation Protection Advisor.
Routine checks of X-ray cabinet

X-ray leakage from the shielded cabinet during X-ray generation must not exceed
1µSv/h.
The cabinet must be checked for radiation leakage according to the procedure
prepared locally by the Radiation Protection Supervisor and agreed by the Radiation
Protection Advisor. A suitably calibrated device must be used.
In the absence of any locally-prepared procedure, that detailed in X-ray leakage
check should be performed at the stated intervals. Refer to the Installation and
Maintenance Guide for details.
2.13. Hazardous materials
Lead
Lead is a poisonous metal that is harmful to the human body. As it may be absorbed
through the skin it is important to wash hands after touching any part of the lead-
lining of the cabinet. The lining is not accessible during normal use.
Lead remains in the body and the effects are cumulative.
Lead can be harmful to the human body. Parts of the
cabinet are lined with lead. Care must be taken when
handling lead as it may be absorbed through the skin,
or ingested by transference. After contact wash hands
thoroughly using soap or detergent.
2.14. High voltage hazard

The X-ray tube installed in this machine uses high voltages to generate an X-ray
beam. Residual high voltage may still be present on the HT connecting cable long
after the machine has been switched off. Wait for at least five minutes after power
off before dismantling either of the HT connectors, and always discharge the metal
tip of the connector to earth before handling to ensure that no residual voltage
remains.
High voltages can kill.
Extremely high voltages (up to 162kV) are present in
this equipment. To avoid electric shocks, equipment
panels or covers should be removed only by qualified
personnel.

2.15. Safe disposal instructions

Local regulations/legislation may require additional specialist Waste Disposal of the
following lubricants or consumables used during routine maintenance. Please
consult your local Health and Safety/Environmental Officer for further advice if
necessary.
Material or Substance Area of Use Disposal
Dow Corning DC4 Electrical Wipes contaminated during Contaminated

Compound cleaning/lubricating material - Specialist
process of the HT Disposal
Connections.
Alcohol Wipes Wipes contaminated during Contaminated
cleaning/lubricating material - Specialist
process of the HT Disposal (Refer to
Connections. MSDS regarding
storage fire risk.)
Uncleaned packaging Completely empty
the container. Pass it
on to an approved
waste disposal
company.
For specialist disposal we recommend you contact either the responsible authority
or an approved and /or licensed waste disposal company, which will advise you on
the disposal of special waste.
Removal of the X-ray tube and HVPSU from the machine should only be undertaken
by trained personnel.

21
3. Machine overview
The equipment has been designed to inspect and determine the quality of electronic
components. It enables, for example, the detection of:
 Joints where the solder has not flowed successfully.
 Joints where the solder has bridged the gap between two or more pads.
 Voids within soldered joints.
 Wires bent or broken by encapsulation.
The principal elements of the machine and their functions are outlined below.
3.1. Machine layout

The Quadra X-ray machine has the following main functional parts:

Part Function
1 Flat panel monitor(s) The machine can support single- or dual-monitor

configuration.
Connected directly to the control computer PC
system, the monitors display the operating
software and the X-ray images of the sample.
They provide the means of performing all normal
operating functions, including positioning the
sample, controlling the viewing angle and
adjusting the X-ray image.
The second monitor (when fitted, depending on
configuration) typically allows for a larger sized
scan map to be displayed at all times, and for
some features display the inspection results.
2 X-ray warnings The illuminated X-RAY ON warning signs on the
front, side and rear walls of the machine indicate
when X-rays are actually on (red).
The front signs are controlled from the operating
software. The side and rear signs are controlled
directly from the X-ray tube controller.
3 Machine control panel This panel includes the following operator
controls:
4 Key-switch The three key-switch position functions are:
Power Off - all functions of the machine are
disabled. The key can be removed in this position
to prevent unauthorized use.
Power Enable - the control computer is enabled,
but all motion and X-ray systems are disabled.
The key can be removed in this position to
prevent unauthorized use.
X-Ray Enable - all functions of the machine
become operational. The key cannot be removed
in this position.
5 Main electrical isolator This lockable rotary control is used to connect or
disconnect the main electrical supply to the
machine.
6 Power-on button This button must be pressed in order to start the
machine. It is used with the key-switch above.

Machine overview 23
Part Function
7 Electrical control panel The main electronic systems of the machine are
fitted inside a front-accessible cabinet
compartment behind a hinged door. On some
systems (depending on build variant), this panel
is interlocked with the main isolator.
Further compartments (not shown) are fitted on
both sides of the cabinet. They hold system
components such as the control computer, media
converter, air pressure regulator, toroidal
transformer and a power supply. Additional
accessories and/or controls are typically installed
in these compartments.
All cabinet compartments are secured when
closed with allen key screws.
8 USB port(s) A USB port used typically for connection to a
memory 'stick' or similar device, is located on the
rear panel of the workstation tray.
Other USB ports are available on the rear panel
of the monitor(s) and the control computer.
A printer can be connected to any USB port and
used to produce printed copies of the X-ray
images, with or without added captions.
9 Emergency Stop Mounted on the rear panel of the workstation
pushbutton (E/Stop) tray, the Emergency Stop pushbutton is provided
as a safety feature to be used in a hazardous
situation/emergency.
Operating the stop instantly removes all power
except the EMO control circuitry.
Note: To reset the E/Stop, rotate the red button
top clockwise
10 Workstation tray This is mounted on a fully adjustable arm. It

supports the monitor(s) and the keyboard and
mouse of the control computer PC system. The
keyboard and mouse are used to operate all
software-controlled functions of the machine.
11 Main cabinet door This door provides full access to the interior of
the lead-lined X-ray compartment. It is secured
when closed with two front-mounted bolts.
12 Cabinet feet An adjustable foot is fitted at each corner of the
cabinet.

Part Function
13 Sample access door This provides easy access to the sample holder.
It is locked by a latch that is electrically released
under software control.
The lock prevents accidental opening of the
sample access door. In the unlikely event that the
door opens, the X-ray system is turned off by an
interlock system.
14 Services conduit One or two metal conduits run up the rear wall of
the cabinet. They can be configured to allow
mains power and air to enter from either above or
below the machine. The number and position of
these conduits depend on the system build
variant.
15 Cooling fan and vents A cooling fan is fitted to the rear wall of the
cabinet. Separate cooling vents are fitted to the
side walls of the cabinet. The fan and vents must
not be obstructed.
16 Air regulator This lockable control regulates the air supply for
the pneumatic anti-vibration mounts. It is
mounted either inside a side-accessible cabinet
compartment (typically on the inside rear wall), or
on the outside of the enclosure depending on
system build variant.

Machine overview 25
3.2. Interior layout

The Quadra X-ray machine has the following main functional parts located inside the
cabinet:
Part Function
1 Detector carrier This is a pivoting semi-circular frame that

enables the sample to be examined from any
angle within the hemisphere above it.
The detector is moved around the inside of the
carrier by a servomotor driving along a fixed belt
This moves the detector in an arc from side-to-
side of the machine.
A second servomotor and belt mechanism pivots
the carrier on its bearings. This moves the
detector in an arc from the back to the front of the
machine.
Throughout all movements in both axes, the
detector remains pointed towards the X-ray
source.
2 Image detector This is a CMOS Flat Panel Detector (FPD). The
resolution of the detector is dependant on the
machine type.
3 Access door interlocks There is a minimum of two safety key-operated

Part Function
interlocks:
 The first provides a safety interlock with an
additional solenoid that automatically locks
when either the sample access or main
access door is closed. This can only be
opened under software control.
 The other immediately breaks the X-ray
supply circuit as soon as a door is opened,
this is part of the machine safety systems.
An optional third interlock may be fitted
(depending on build) on the left hand side of the
main access door.
4 Sample holder This plate is positioned on the sample
manipulator using two reference pins, and is
completely removable. The sample being
examined is simply placed on the upper plate
surface.There are three types:
 A flat aluminum plate insulated on the
underside.
 A carbon fiber plate which is very transparent
to X-rays.
 A steel calibration plate - do not use this for
examination purposes as it will block almost
all X-rays.
Further custom-manufactured sample trays are
also available, please discuss your requirements
with your Nordson DAGE representative.
5 Sample manipulator This assembly carries the sample holder and
moves the sample for examination:
 Horizontal movement (X-Y) allows different
areas of the sample to be viewed.
 Vertical movement (Z) controls the
magnification level of the X-ray image.
The three moving assemblies of the manipulator
are mounted on precision slides, each driven by
an individual servomotor and lead screw.
6 Anti-vibration mount These pneumatic mounts support the main
carrier frame and reduce the transmission of
floor-based vibration to the X-ray imaging system
components.
An independent anti-vibration mount is fitted to
each corner of the main carrier frame. They
include a height sensor/adjuster that provides for
automatic self-leveling of the carrier frame under
changing load conditions.

Machine overview 27
Part Function
The air for the mounts is supplied from an air

regulator (not shown) fitted in a side-accessible
cabinet compartment.
7 Servo drive motor Several servomotors are fitted within the cabinet,
each driving an individual axis. All servomotor
drive movements are governed by the control
computer via the servo controllers.
8 X-ray tube and controller The tube provides the source of X-rays and is
fixed to the main carrier frame.
The tube controller is mounted on the front of the
tube and contains the electronics required to
control and monitor such functions as focus,
voltage, and power levels. It communicates with
the control computer via an optical cable link and
an optical to Ethernet media converter.
9 Main carrier frame This is a rigid aluminium frame that supports the
X-ray tube, sample manipulator and detector
carrier.
10 High-voltage PSU This unit generates the high-voltage supply for
the X-ray tube. The power supply is variable up
to the tube maximum, under control of the X-ray
application software, via the tube controller.
3.3. Operating software

The Quadra X-ray machine hardware is controlled directly from the Gensys™
operating software that runs on the control computer PC system.
Gensys is displayed on the PC flat panel monitor (or monitors) mounted on the
machine workstation and supports typical Microsoft Windows™ functionality.
Connection to an SQL database is required to support Automatic Inspection
Routines.

3.4. Software interface

The Gensys software user-interface can display the following screens, each
providing the controls, options and tools associated with its particular function.
 Inspect  Engineer  Options
 X-Plane®  Calibration  Database Viewer
 Users  System Setup  Log Viewer
When operating the machine, the majority of time is spent using the Inspect screen
as it provides all the tools necessary to display and manipulate the X-ray image. By
default, the Inspect screen is shown when the system is started.
The following topics describe the Inspect screen functionality in detail. Descriptions
of the alternative screens are covered in individual sections later in this guide.
The Inspect screen is split into three main panes with a range of buttons and mini
tabs providing access to further controls and functions, as illustrated:
Item Description
1 Left hand control panel. You can hide this panel if you need to view a larger
image area.
2 X-ray image display area. A right click menu is available in this area providing
access to a range of functions.
3 Right hand control panel. You can hide this panel if you need to view a larger
image area.
4 Menu button. This provides access to a list of top-level function headings.

Machine overview 29
Item Description
5 Message window. This displays any system-generated messages and

instructions.
6 Mini tabs. These provide access to a range of functions.
7 Settings area. This changes to display various controls and fields depending
on which mini tab is selected.
8 Image capture, image enhancement and video recording controls,
manipulator position dartboard.
9 X-ray ON/OFF controls, voltage and power indicators. Sample door open
button.
Typically, many of the controls, buttons and mini tabs within the various panels do
not have displayed names. However, hovering the mouse pointer over an item
displays its function in a tooltip.
Some of the buttons on the Inspect screen have colored status lights. These
indicate whether the selected process is waiting, or complete.
 Yellow indicates waiting.
 Green indicates complete.
If a button or control is 'greyed out' this means it cannot be used.
What tabs and controls you see or can use in the Inspect screen is controlled by:
 Your user access level:
 Operator
 Supervisor
 Engineer
 The settings made on the Menu > Screens > Options tab screen.
 The settings made on the Menu > Setup > More Options... screen. This screen
also controls a range of presentation parameters such as font type and color,
line color, label positioning and so on.
3.4.1. Right-click menu

Right click in the main X-ray image display area to show a further menu that
provides the following functions:
Option Description
The following are 'toggle operation' controls, click to select or de-select as

required. When selected a tick or radio button is shown against the respective
control.
Mouse Drag Sets the mouse cursor mode within the image display to drag (see
page 53).
Mouse Sets the mouse cursor mode within the image display to joystick
joystick (see page 53).
Show left Shows or hides the left hand control panel. When the panel is
hand control hidden, the image is adjusted so parts previously hidden by the

Option Description
panel panel are revealed.

Show right As above, but for the right hand panel (see page 30).
hand control
panel
Annotation Shows or hides the annotation tools pop-up window in the image
Tools display (see page 76).
Histogram Shows or hides the histogram window in the image display (see
page 81).
The following controls provide access to further screens, or functions.

Screens > Shows the list of alternative screens, such as Users, Engineer,
Options and so on.
Measure > Shows the list of measurement functions (see page 155).
Recipe Displays the recipe tool bar (see page 89).
Options
3.4.2. Right hand control panel

The right hand control panel gives access to some of the features used for general
inspection.
Item Description
1 Selects the Frame Average from Live to 4096.

2 Selects Live Image Smoothing ON or OFF.
3 Selects the required Live Image filter.
4 Selects the required Live Image dynamic Stretch
Contrast.
5 Turns on the fixed Stretch Contrast.
6 Histogram of viewed image. The green line can
be grabbed and adjusted in order to modify the
image.
7 Brightness and Contrast sliders.
8 Dartboard.

Machine overview 31
All the features are duplicated on the standard left hand control panel and either set
of controls performs the same functions. This panel can be turned off if you require a
larger image area.
3.4.3. Menu functions

The Inspect screen > Menu button provides access to the following top-level function
headings.
Access
Displays a list of user levels. Click to select as appropriate:
 Operator
 Supervisor
 Engineer
 Factory
Option Description
Password Click to select to set a password for the Supervisor and Engineer
user-access levels (see page 257).
Clear Click to select to carry out a clear password operation using the
Passwords Clear Passwords disk generated at system installation (see page
257).
Tube
Option Description
Centre Click to centre the tube coils at the current voltage.

Warmup Click to start a built-in warm-up routine that gradually increases the
voltage on the X-ray tube, monitors for arcing caused by any
contamination and resets the voltage when needed (see page 44).
Setup
Option Description
Set Start Click to set a position to move to once the sample access door has
Position been closed.
Clear Start Click to clear any saved Start Position to the default.
Position
Licensing... Click to open the licensing screen. This provides information about
your current license as well the functions necessary to update the
license (see page 259).
More Click to open a further screen that provides a range of user-
Options configurable options in a property-sheet style interface (see page
38).
Reference Click to either Load or Clear the reference image.
Image >

Print
Option Description
Print Screen Click to save a complete screenshot that includes the current X-ray
Snapshot image as a PDF file. A standard Save As dialog box opens.
Save Screen Click to save a complete screenshot that includes the current X-ray
(JPG) image as a JPG file. A standard Save As dialog box opens.
Debugging
Option Description
Enable Tube Click to turn on tube specific logging for any fault finding assistance.
Debug
This is only available in Engineer level access and above.
Logging
Tube Activity Click to allow a rolling graphical representation of tube currents and
Graph powers to aid with fault diagnosis.
This is only available in Engineer level access and above.
Images
Option Description
Update the Click to update the currently selected recipe (see page 91).
recipe ""
The actual text "..." for this option varies depending on actions prior
to the selection.
Update the Click to update the General Viewing recipe, once any tube voltage
General and power settings have been changed (see page 90).
Viewing
Recipe
Save Click to start the equalize dark image routine (see page 60). This is
Equalize a manual operation which is not normally required.
Dark Image
Once the equalization image has been acquired, a tick is shown
against the menu option.
This procedure can only be performed with Engineer level access
Save Click to start the equalize (NN)kV bright image routine (see page
Equalize 61). This is a manual operation which is not normally required.
(NN)kV
Once the equalization image has been acquired, a tick is shown
Bright Image
against the menu option. If the tick is shown in brackets, then an
equalization image from an adjacent voltage is being used.
This procedure can only be performed with Engineer level access
Load New Click to select and load a new demo image into the X-ray image
Demo display. A standard file selection dialog opens.
Image...
This is an 'Emulator' option only. It is not present in a normal
system.

Machine overview 33
Screens
Option Description
Inspect Provides access to all controls for performing an inspection of a

component. All the mini tabs, image and video controls are
available from this screen (see page 28).
The following screens are all displayed in a 'tabbed' format. Once any one screen
has been selected, a tab control is displayed at the top of the Gensys application
window. The selected screen is always shown as the active tab, however you can
select any of the other screens by simply clicking the appropriate tab.
Selecting the Inspect tab returns you to the main Inspect screen and turns off the
tab control.
X-Plane® Opens the X-Plane® functions tab screen (see page 233).
X-Plane is a licensed option. If you do not have it, contact your local
Nordson DAGE representative to discuss your requirements.
Users Provides tools for the creation, selection and deletion of system
users (see page 258).
Inspect and Users are the only tabbed screens available with
Operator level access.
Engineer Provides access to a series of controls that enable routine
maintenance to be carried out on the machine, and a complete
system health check. Refer to the Routine maintenance section of
the Installation and Maintenance Guide for more details.
This tab screen is only available with Engineer level access.
Calibration Provides the necessary controls for system calibration. Refer to the
Routine maintenance section of the Installation and Maintenance
Guide for more details.
Options Provides access to a range of configurable machine options (see
page 253).
This tab screen is only available for Supervisor and Engineer level
access.
Database Provides the details and the controls for the database (see page
Viewer 249).
Log Viewer Shows a chronologically-ordered list of system-generated
messages.
Help
Option Description
User's Guide Provides shortcut access to on-screen user documentation.

About Provides information about the Gensys software.

Language
Option Description
Deutsch Updates the software labels to German.

English(US) Updates the software labels to English (US). This is the default
setting.
Japanese Updates the software labels to Japanese.
Import Click to import a new language file into the Gensys application (see
Language page 267).
Export Click to export the local language (see page 271).
Current
Language
Visual Styles
Allows you to choose a 'theme' to apply to the appearance of the software. Click on
your choice to immediately update the screens. Nordson Blue is the default.
 Nordson Blue
 Autumn
 Light
 Dark
 High Contrast
 Night Vision
 None
3.4.4. Mini tabs

The following mini tabs are displayed in the left hand control panel:
Mini tab Description
Board Image (see page 69)
Annotation (see page 75)
Image Processing (see page 79)
Stretch Contrast
This further mini tab with the same icon as above is available by
selecting:
Menu > Setup > More Options... > General > Imaging > Classic
contrast mini tab
It provides a manual contrast slider control.

Machine overview 35
Image Enhancement (see page 83)

This mini tab can be enabled or disabled for Operator and
Supervisor user access levels.
Analysis (see page 93)
Measurement (see page 155)
Automatic Inspections Routines (see page 165)
Expert Image Wizard (see page 223)
Image Optimization (see page 227)

This mini tab can be enabled or disabled for Operator and
Supervisor user access levels.
X-Plane® Control (see page 233)
X-Plane is a licensed option. If you do not have it, contact your local
Dose Controls (see page 256)
This mini tab can be enabled or disabled.
3.4.5. Video processing and other function buttons

A number of function buttons and controls are displayed in the lower region of the
left hand control panel. They are grouped by functionality, as follows:
 Video control (see page 245)
The video controls can be replaced by a scale bar or hidden, depending on the
Options Screen selection (see page 253).
 Image save and print (see page 243)
 Image manipulation and processing (see page 63)
 Machine control (see page 35)
3.4.6. Machine controls

The following machine control functions are provided on the Inspect screen:
Button/control Description
Set Height (see page 56)

Click to set the height of the region of interest.
Average frames
Select the number of frames to average over.

Orbit controls
The system can orbit around a part at an oblique view giving you a 3-D
perspective. An orbit is set as follows:
1. Perform a Set Height for the region of interest.
2. Set the desired oblique view, either using the dartboard, or by clicking the
mouse wheel.
3. Select the Direction of orbit.
4. Select the Orbit speed.
The orbit controls are only enabled at oblique views.
Direction of orbit
Click to change the orbit direction between clockwise and counter-
clockwise.
Orbit speed
This selects the orbit speed, 1 (slowest) to 9 (fastest).
Orbit
Click to start the system orbiting around the current location
The system continues to orbit, until this button is clicked again. During
orbiting, most of the system controls are disabled and are re-enabled
when motion ceases.
Dartboard (see page 54)
This shows the position of the detector (red spot) in relation to

the sample.
Each ring represents ten degrees of movement from the current
position (unless the Fine control is activated). The four outside
squares represent the cardinal points.
The right hand display screen can show a larger dartboard
which also includes detector rotation and angle displays. This is
available by selecting:
Menu > Setup > More Options... > General > User Interface >
Show 2nd inclination control
A further 'overlay' dartboard display can be shown on top of the
X-ray image by pressing and holding the Ctrl + Alt keys. This is
Menu > Setup > More Options... > General > User Interface >
Show inclination control overlay
X-ray tube settings
X-ray tube voltage
Select an appropriate voltage.

Machine overview 37
X-ray power slider

If the image is generally too
bright or too dark, slide this
When changed, there is a delay of a few seconds control to the left or right to
before the image stabilizes. decrease or increase the
image brightness.
3.4.7. Low Resolution Monitor Option

The Gensys user-interface is optimised to display at a resolution of:
 1920 x 1200 pixels for the Quadra 5
 3840 x 2160 pixels for the Quadra 7
However, you may need to run the software on a monitor that cannot display the
required resolution. This situation affects the way the system operates as some
controls in the lower area of the control panel may be hidden. When this is the case,
the cursor icon changes to an open hand when positioned in a clear area of the
control panel.
When the hand is displayed you can grab the control panel by holding the left
mouse button down (closing the hand), and dragging the panel either up or down to
reveal any hidden controls.
3.4.8. Second Monitor Option

Where a secondary monitor is fitted, it can be used to display either:
 A larger navigation map (see page 70).
or
 Live results as an Automatic Inspection Routine is being executed (see page
165).
This functionality is selected from the More Options screen (see page 38).

3.4.9. More options screen

By default, the More Options screen is only available for Supervisor level access
users and above. However, an Engineer level user can make this screen accessible
to other users by changing the permissions on the Options screen (see page 258).
To display the More Options screen:
Select Menu > Setup > More Options...
The More Options screen is split into two panes which allow you to navigate and
configure a range of options.
Item Description
1 Tree view pane. This shows all the available options. Use the expand and
collapse controls as required.
2 Properties selection and configuration pane. This dynamically updates with
the relevant configurable settings as an option is selected in the Tree View.
3 This sets the location of user configurable data and log files.
4 Standard Windows screen controls.
Due to ongoing product development, the settings available in this screen are
subject to change.
Option Description
General This option allows changes such as:

 System and user interface appearance.
 Control of system logging.
 Unused analysis tabs made visible/hidden.
 Analysis and threshold detection options made visible/hidden.
Overlays Allows font style and line colors to be adjusted for overlays used
with auto measurement functions.
Callouts Allows font style and marker colors to be altered when used with
callouts. Refer to Using Annotations for more details (see page 75).
Print Allows font styles to be adjusted for printed images. Refer to
Printing the Image for more details (see page 243).

Machine overview 39
Option Description
Annotate Allows changes to the appearance of the annotations text boxes

and font to be made. Refer to Using Annotations for more details
(see page 75).
Measure Allows changes to the on-screen appearance of measurements and
relevant readouts. Refer to Using the Measurement tools for more
details (see page 155).
Image Save Sets the default saved image style in auto inspections. Refer to
Saving the Image for more details (see page 243).
CAD Allows default values to be set for the CAD Editor (see page 141).
Analysis Allows the text labeling for BGA and QFN pins to be adjusted and
the void measurement to be displayed as a relative area or an
equivalent diameter.
Reports Allows a logo to be imported into saved images.


41
4. Getting started
A typical start sequence is as follows:
1. Visually inspect the machine to ensure that all access panels are closed.
2. Set up the operator workstation. (see page 41)
3. Switch on the power and wait for the machine to finish its start-up processes
(see page 42).
4. Warm-up the X-ray tube (see page 44).
5. Load the sample (see page 44).
6. Maximize the magnification (see page 47).
This section provides step-by-step guides for the above procedures. It also contains
information on:
 Sample holders (see page 46).
 Switching the machine off normally (see page 48).
 Switching the machine off in an emergency (see page 49).
4.1. Setting up the workstation

The machine has been designed with regard to good ergonomic principles. Nordson
DAGE recommend:
 The following guidelines are considered when setting up a comfortable seated
working position for an operator:
 SEMI S8 10.2.3 and 10.2.4 specify a minimum horizontal leg clearance of
508mm at knee level and of 660mm at foot level, measured from the front
edge of the keyboard shelf.
 the PC mouse and keyboard should be within easy reach. The keyboard
may be positioned with the mouse either to the left or to the right for use by
left- or right-handed operators.
 when seated at the workstation and using the PC controls, the operator's:
shoulders should be straight or slightly forward with forearms horizontal or
slightly raised
head should be upright or leaning slightly forward
back should be fully supported, straight and upright
feet should be supported by a flat floor or placed on a suitable adjustable
footrest
 If the workstation is to be configured as a standing station, the keyboard shelf
and the monitor should be set to a comfortable height within the following limits
in order to maintain compliance with SEMI S8 8.1.1 and 9.1.3:
 Center of monitor - 1320mm (min), 1470mm (max)
 Keyboard shelf - 940mm (min), 1270mm (max)
 Always check the local health and safety regulations regarding monitor,
keyboard and mouse usage.

4.2. Switching the machine on

You switch the machine on as follows:
1. Carry out a visual check to ensure that there is no damage or evidence of
modification to the outside of the cabinet before applying power to the machine.
Any damage or modification increases the risk of radiation leakage.
2. Check that the doors are fully closed. The main and sample access doors are
fitted with interlocks to prevent machine operation when open.
3. Remove any padlock(s), if fitted, from the main isolator switch (2).
4. Turn the main isolator switch (2) to the on position indicated by I. If the isolator is
in the tripped position, T, turn it first to the off position, O, and then to the on
position I.
5. Check that the red emergency stop button on the workstation tray has not been
operated. If it has, reset it by turning in a clockwise direction.
6. Insert the key in the key-switch (1) and turn the key clockwise to X-Ray Enable.
7. Press the green Power On button (3).
This starts the X-ray tube and powers up the machine electronics, including the
control computer and monitor(s).
The control computer first goes through a normal Windows start-up. It is
possible that other software has been loaded onto the machine after installation
which may affect the power-up sequence. However, the Dage X-ray application
will normally start automatically, in which case the Gensys start screen is
displayed.
8. If the startup screen does not automatically appear, do one of the following:
 Double-click the Dage X-ray icon on the desktop.
 Select Windows Start > All apps > Dage X-ray Systems > Dage X-ray
After a few seconds the Machine Initialization screen is displayed. Various on-
screen messages show the progress of the automatic initialization routine.
9. If the system detects it has no hardware options fitted/enabled, do one of the
following when the message Press OK to Initialize Axes is displayed:
 Click OK - this allows the system to complete its initialization.
The machine resets the sample manipulator and detector mechanisms. This
takes around 90 seconds and when complete, the main application screen is
displayed and the system is ready for use.

Getting started 43
 Click Cancel - this allows you to continue to the main application but does not
allow any manipulator movement or X-ray activation.
 Click Open Door - this allows you to open the sample door to gain access to
the sample tray.
10. If the system detects it has a hardware option fitted/enabled (such as a CT
Frame or Thermal Stage) the message Choose Hardware is displayed. You can
choose to click Cancel - this allows you to continue to the main application but
does not allow any manipulator movement or X-ray activation, or click Open
Door - this allows you to open the sample door to gain access to the sample tray
and continue the machine initialization process. If you select Open Door, do the
following:
 Physically open the sample door.
The Sample Tray Hardware Configuration screen is displayed showing the
different options available depending on the hardware fitted/enabled.
 Carry out a visual inspection of the machine to confirm the status of the
hardware options.
 Close the sample door - this is important, as the OK and Open Door buttons
will remain 'greyed out' and unavailable while the door is open.
 Change the maximum Part height, if required.
 Select the correct hardware option and enter any required parameter.
 Click OK, and OK to confirm when the Confirm Hardware Selection message
box is displayed.
 Click OK when the message Press OK to Initialize Axes is displayed.
The machine automatically locks the sample door and resets the sample
manipulator and detector mechanisms. This takes around 90 seconds and
when complete, the main application screen is displayed and the system is
ready for use.

4.3. Warming-up the X-ray tube

The machine has a built-in warm-up system that gradually increases the voltage on
the X-ray tube, monitoring for arcing caused by any contamination and re-setting the
voltage when needed. It can be a quick procedure if the tube is clean, but take
longer if arcing occurs.
It is not uncommon for internal arcing to occur in all tube types if the system has
been switched off for a period of time. Open tube systems can also exhibit arcing
after any maintenance or filament change as the internal tube surfaces may have
been contaminated with dust particles, or moisture from the air.
Nordson DAGE recommends that warm-up is used at the start of every working day.
At the end of this procedure the tube is ready for use.
In general, especially when the machine is new, there may be occasions when the
X-rays will switch off without any apparent cause. This is almost certainly due to an
arc within the tube, although the system may actually report a bad vacuum as the
contamination is removed.
A tube warm-up request is presented to the user once every 24 hours, with the
option to perform the warm-up or to ignore the warm-up if it is not a suitable time.
This can be deferred for up to seven days where the warm-up procedure will need to
be run in order to be able to activate X-rays.
Alternatively the warm-up procedure can be activated manually.
Start the tube warm-up procedure by selecting Menu > Tube > Warmup
This gradually increases the voltage on the tube to its maximum rating.
Note: Depending on the length of time since last use, and whether servicing has
been performed on the tube, it may take up to 15 minutes to warm-up the tube.
4.4. Loading/unloading a sample

The maximum height of the part must not exceed
that stated in the warning box. Severe damage can
result if this limit is exceeded.
Your Engineer can set the machine to
accommodate parts up to 200mm in height, as
measured from the base of the tray (see page 47).
Always consult your engineer before loading any
oversized parts.
You load or unload a sample as follows:
1. Click the door release button to switch off the X-rays and release the sample
door.
2. Wait for the sample holder to move to the load position and the Door Unlocked
message is displayed.
Note: If the sample door is not opened within 20 seconds, it is automatically re-
locked.
3. Physically open the sample door.

Getting started 45
4. If the system detects it has no hardware options fitted/enabled, a warning box

indicating the current maximum part (sample) clearance height is displayed on-
screen. Do the following:
 Change the maximum part height, if required.
 Place the sample/part (1) on the sample holder, 20mm from the front left-
hand corner.
A plastic 'L' is supplied (2) with the system to facilitate this. This allows
oblique views (see page 54) to be used without the tray support impeding
the image.
 Close the sample door.

The clearance height warning box closes, the door is automatically locked,
and the manipulator moves to the set inspection position.
5. If the system detects it has a hardware option fitted/enabled (such as a CT
Frame or Thermal Stage) the Sample Tray Hardware Configuration screen is
displayed showing the different options available depending on the hardware
fitted/enabled. Do the following:
 Change the maximum Part height, if required.
 Select the correct hardware option and enter any required parameter.
 Place the sample (part) on the sample holder, 20mm from the front left-hand
corner.
A plastic 'L' is supplied with the system to facilitate this. This allows oblique
views (see page 54) to be used without the tray support impeding the image.
 Close the sample door - this is important, as the OK and Open Door buttons
will remain 'greyed out' and unavailable while the door is open.
 Click OK, and OK to confirm when the Confirm Hardware Selection message
box is displayed.
The Confirm Hardware Selection message box closes, the door is
automatically locked, and the manipulator moves to the set inspection
position.

4.5. Sample holders

The sample holder can be one of three types:
 A flat aluminum plate insulated on the underside.
 A carbon fiber plate which is very transparent to X-rays.
For the above types the sample can simply be placed onto the flat surface.
 A custom manufactured tooling jig.
This type has mounting points or edges for the precise location of samples.
Note: Do not use the supplied steel calibration plate as this will block most of the X-
rays.
All sample holders fit into the sample manipulator through the machine front door,
and are located in the manipulator by two pins.
Additional (blank) sample holders must be purchased for your system from Nordson
DAGE. Please contact Nordson DAGE Customer Service and inform them of your
system model number and serial number to ensure the correct sample holder is
supplied.
Sample holders with custom fitments for increased accuracy are available from
Nordson DAGE.
Do not modify your sample tray without prior
permission from Nordson DAGE UK or the warranty
will be invalid.
Removing or refitting a sample holder

1. Click the door release button to switch off the X-rays and release the sample
door.
2. Wait for the machine to move the sample manipulator to the correct position for
access to the sample holder.
Note: If the sample door is not opened within 20 seconds, it is automatically re-
locked.
3. Open the door. Further machine movement is disabled while the door is open.
4. If fitted, remove any sample/part or alignment guide on the tray (1).
5. Lift the sample holder (2) off the two locating pins (3).

Getting started 47
6. Refit by the reverse procedure.
Over-height samples
Over-height samples can be fitted to the machine,
but extreme caution is required.
The absolute maximum height setting is 200mm.
Change the clearance height as follows:
1. Measure the maximum height of the part in millimeters.
2. Select Menu > Access > Supervisor
3. Select Menu > Screens > Options, and set the Clearance height (mm) to the
desired value.
Note: At increased sample clearance heights, lower magnification views and
some larger oblique angle views may be restricted to ensure the sample cannot
clash with any part of the system mechanism. In addition, when scanning to
make a navigation map more images are taken, extending the time taken.
4. Load and inspect the sample as normal.
Customizing for low density samples

When imaging low density samples, the X-ray absorption of the sample plate can be
many times greater than that of the region of interest. Usually, in these cases, using
Stretch Contrast (see page 67) can be very effective in revealing detail. However, in
extreme cases, an alternative sample holder design may help produce a better
image.
Special carbon fiber sample holders that have a much lower X-ray absorption
coefficient are available separately from Nordson DAGE.
Note: Nordson DAGE offer a sample tray customization service – see your local
Nordson DAGE representative.
4.6. Maximizing magnification

Position the region of interest as close to the X-ray tube target as possible in order
to achieve maximum magnification.
Example 1a Example 1b
The sample (1) is simply placed on The sample is inverted to position the
sample holder (2), but region of interest closer to the tube to
magnification of the region of improve magnification.
interest (3) is limited.

Example 1c
The sample is modified to bring the

region of interest closer still to the
tube.
Samples must not protrude below the lower surface
of the sample tray, as this may cause damage to the
tube and invalidate warranty.
4.7. Switching the machine off normally

Abrupt power removal from the machine is not harmful to the system. The Windows
operating system detects this condition and runs diagnostic tests when re-started.
However, this can take some time, and data can sometimes be lost.
In order to avoid this possibility use the following procedure to turn the machine off:
1. Click the X-ray off button (1) to switch the X-rays off.
When X-rays switch off, the status bar changes to gray (2) and shows both the
voltage and power indicators (3) as zero.
2. Close Gensys by clicking the close button in the top right of the control panel at
the left of the X-ray image display.
A message window is displayed asking for confirmation of the shut down
request.
3. Select Yes. This moves the system manipulator to the park position and closes
the Gensys application.
4. Select Windows Start > Power > Shut down
5. Wait until the monitor is blank.
6. Turn the key switch to the Power Off position and remove the key.
7. Turn the main isolator switch to the off position indicated by O.
| ON
O
OFF
8. Fit a padlock to the main isolator before leaving the machine.

Getting started 49
4.8. Switching the machine off in an emergency

Press the top of the Emergency Power Off button (1) to switch off the machine in an
emergency.
This shuts the machine down instantly and removes power from all components.
The generation of X-rays is prevented as soon as the power is interrupted.
Recovering from an emergency power off

Following the actuation of the Emergency Power Off button, the cause of the
hazard, or perceived hazard should be investigated prior to attempting to restart the
machine. Any subsequently required maintenance, service or repair work must be
carried out before returning the machine to normal use.
Before the machine can be restarted, the Emergency Power Off button must be
reset by turning it clockwise (2). The machine is started in the usual way with the
addition that the Windows operating systems will run some self-diagnostic tests to
check for any errors.


51
5. Inspecting a sample
All the X-ray inspection process can be performed using the monitor and mouse.
Typically, the keyboard is only used occasionally.
A typical inspection session work sequence is as follows:
1. Carry out the typical 'getting started' (see page 41) routines to switch the
machine on, warm it up, load a a part, and so on.
2. Select your user name (see page 51) (if this system feature is configured).
3. Switch the X-rays on (see page 52).
4. Get an image (see page 52).
5. Make a navigation map (see page 70).
6. Adjust the viewed image (see page 53).
7. Make the inspection.
8. Store or print the images as required (see page 243).
9. Remove/change the sample and repeat the image adjustment (if required),
move to a new region of interest and store images as required.
10. Switch the X-rays off between inspection sessions (see page 57).
11. Turn the key switch to the Power Enable position if the machine is not going to
be used within 24 hours. The key can be removed to prevent unauthorized
usage.
This section provides step-by-step guides to sample inspection.
5.1. Selecting user

Note: Your system may not have been configured to record individual users (see
page 258). See your Engineer for details.
1. Right click in the X-ray image display area and select Screens > Users
2. Select your name from the list.
The current user’s full name is displayed in the title bar of the main application.
3. If your name does not exist in the list, type your details in the two boxes and
click Save User.
Depending on your user access level the application screen may show up a
number of options, each of which gives access to a different range of controls.
Operators usually only see the Inspect and Users options from the Screens
option. Further information is available on setting your user access level (see
page 257).

5.2. Switching the X-rays on

You can switch the X-rays on by one of the following methods:
 If the recipe options are being displayed, click General Viewing (see page 89).
 Click the X-ray on button (1).
X-rays are switched on only if the sample door is closed and locked and the
tube vacuum level is adequate.
The status bar (2) changes to red to show X-rays are being generated, and the
voltage and power indicators (3) increase to show the actual tube voltage and
power levels. The X-RAY ON indicators on the machine cabinet illuminate.
5.3. Getting an image

If no image appears, do the following:
Note: It may take several seconds for an image to appear in the X-ray image display
area.
1. Move the mouse pointer over the image, press and release the left button.
This takes a new image of the part.
2. Check that the power slider is at least one-third from the left end.
3. Select Menu > Tube > Center (X-rays need to be active for this option to be
available).
This makes an automatic adjustment to the tube calibration. After 10 seconds or
so the power output should be restored.
4. If the image is generally too bright or too dark, slide the power control to the left
or right to decrease or increase the image brightness.
When changed, there is a delay of a few seconds before the image stabilizes.
Later sections explain how contrast and brightness can be boosted in the image
processor, but it is always better to get the best basic image.
If there is still no image:
 The part may be thicker and requires higher voltage X-rays. Consult your
engineer as there may be a better setting available.
 Increase the power further.
If there is any reason why the X-ray tube cannot be switched on, a message is
shown in the message window.

Inspecting a sample 53
5.4. Adjusting what you see

You can adjust the image you see in the X-ray image display, as follows:
 Move the image (see page 53)
 Change the magnification (see page 54)
 View at an angle (see page 54)
5.4.1. Moving the image around

It is possible to move the part around using the mouse on the image display.
There are two modes of operation. To enable either, move the mouse pointer over
the image and click the right mouse button. Then do one of the following:
 Select Mouse drag mode.
In this mode two movements are possible, point the mouse at a region of
interest on the image and:
 double click the left mouse button. The feature you have selected moves to
the center of the screen.
 hold the left mouse button. The feature you have selected can be dragged
by the mouse pointer until the button is released.
 Select Mouse joystick mode.
The left button double click operates as described in mouse drag above.
However, the mouse now also operates as a joystick, controlling the speed and
direction of the part movement. The movement is controlled as follows:
 Press and hold the left mouse button and move the mouse forward a little.
Note that the mouse pointer has jumped to the center of the image display
screen.
 Still holding the button down, move the mouse around the screen. The part
moves on-screen in the direction the mouse is moving towards and at a
progressively increasing speed that depends on how far away the mouse is
from the center of the image.
 Release the mouse button to stop the movement.
This mode is useful for scanning along rows of components, although the image
remains in Live mode until the movement is stopped.
Hardware joystick option

An option is available for the addition of a single hardware joystick or a pair of
hardware joysticks. These work in the way described for the mouse joystick.
Joystick functionality is set through the More Options screen (see page 38).
 One joystick controls the manipulator table X and Y axes.
 The second joystick (if present) controls the magnification/zoom (Z-axis).
Contact your Nordson DAGE representative for further details on this option.

5.4.2. Changing the magnification

Once the region of interest has been selected, you can zoom in, or out as required.
Simply roll the mouse wheel between the buttons.
 Roll forward to increase the magnification
 Roll back to reduce the magnification
The system either zooms about the object under the mouse pointer, or the center of
the screen. This choice is selected from the More Options screen (see page 38).
5.4.3. Viewing at an angle

One of the most useful features of the Quadra machines is the ability to view at an
angle of up to 70° anywhere within the defined inspection area without
compromising the available magnification.
High magnification Large field of view
Item Description
1 Flat Panel Detector

2 Sample
3 X-ray tube
The region of interest stays in the picture provided the height has been set (see
page 56).
There are three ways of selecting the viewing angle:
 Using the dartboard (see page 54).
 Using the image (see page 55).
 Using the controls in the measurement tab (see page 155).
Using the dartboard

1. Choose a part to view at low magnification.

2. Click the left mouse button anywhere on the dartboard.
The angle of view changes automatically as selected, and the red spot moves to
show the current view position.
3. Click on the outside-edge squares to view from the cardinal points, or the
centre-point for an overhead view.
If the keyboard shift key is held down while the mouse is over the dartboard, the
sensitivity of movement is increased by a factor of ten.
Each ring represents ten degrees of movement from the current position (unless
the Fine control is activated).
Using the image

Note: The wheel on the mouse is also a button.
1. Place the mouse pointer on the picture – e.g. on the left.
2. Double-click the mouse wheel button and the angle changes to view from the
left.
The position of the mouse pointer works like the dartboard with the center of the
screen being the normal, directly above, position. The red spot on the dartboard
represents the position selected. This method can be somewhat quicker for
experienced operators. To aid this method, an 'overlay' dartboard display can be
superimposed on the X-ray image by pressing and holding the Ctrl + Alt keys. This is
Menu > Setup > More Options... > General > User Interface > Show inclination control
overlay

5.4.4. Iso-centric oblique angle viewing

The geometric magnification of a feature depends on how close it is to the X-ray
tube. For example, features on the top side of a PCB (side facing the detector)
appear at a lower magnification in the X-ray image than those on the bottom side.
As many features of differing heights may be visible at any time, the system needs
to know the height of the region of interest, for the following reasons:
 Accurate measurements, such as for linear distances and BGA ball size.
 Calibration of the scale rule.
This needs to be selected from Menu > Screens > Options > Show controls >
Scale indicator before it is displayed. The scale indicator will be shown in place
of the video controls.
 Ensuring that all features at a particular height in a sample, for example side 1
components on a PCB, remain in the field of view as an oblique angle view is
taken or changed (providing iso-centric motion).
As a corollary of setting the height correctly, objects that do not remain in the
field of view as the oblique angle is changed, explicitly indicates that they are at
a different height within the sample when compared to the reference, for
example on side 2 of the PCB. This allows you to quickly differentiate between
the different layers within the sample.
5.4.5. Setting the height

Setting the height is achieved using one of two methods. The first moves the sample
tray, the second moves the detector. Either method works well and depends on your
preference.
1. Avoiding maximum magnification, ensure the item of interest is clearly visible
and broadly in the center of the field of view.
2. Chose one of the following:
 Click the Set Height button to move the sample tray.
 Hold the shift key and click the Set Height button to move the detector.
3. Find a feature at the height required that is clearly visible from all angles,
preferably a vertical or corner feature.
4. Left click as precisely as possible on this point.
The system moves either the sample tray or detector a preset distance. When
the detector moves, this may cause the selected feature to move on-screen.
5. Left click on the new location of the selected feature.
The system moves either the sample tray again by a preset distance, or the
detector again to a greater angle.
6. Once again, select the new location of the selected feature.
7. If moving the sample tray, the above procedure steps may need to be repeated
several times. The number of repeat 'clicks' required depends upon the field of
view - and for each click the sample tray moves until the selected object
reaches the edge of the visible screen.

On the final click, the machine calculates the height of the feature and the
selected object is moved back to the center of the screen.
8. If moving the detector, up to seven repeat 'clicks' are allowed.
On the final click, the machine calculates the height of the feature and the
detector returns to the vertical position.
However, if the previous set height is substantially different from the new
requirement, this may cause the selected feature to move off-screen before
completing the seven set height iterations. In this case:
 Left click as close as possible to the edge of the X-ray image in the direction
that the feature disappeared until all of the set height iterations have
completed.
 Repeat the whole set height operation. The displacement reduces as the set
height gets closer to the correct value.
The height is now set, and is valid for any features at the same height.
Note: It is possible to review and change the set height on the Measurements mini
tab (see page 155).
5.5. Switching the X-rays off

You switch the X-rays off as follows:
 Click the X-ray off button (1).
The status bar (2) changes to grey to show X-rays have stopped being
generated, and the voltage and power indicators (3) decrease to zero. The X-
RAY ON indicators on the machine cabinet are turned off.


59
6. Adjusting for the best image

Several factors contribute to the 'ideal' image. The most important of these are:
 Tube voltage and power.
 Image enhancements such as:
 Averaging.
 Contrast.
The setting of the tube voltage and power requires some knowledge of X-ray
imaging and the operation of the machine. However, for the novice or inexperienced
user preconfigured image settings (recipes) (see page 89) are available either from
a list or using one of the buttons.
This section covers the various processes you may require to achieve the best
image in the X-ray image display.
 Manually adjusting the image settings (see page 59).
 Equalizing the gray scale (see page 60).
 Adding image enhancements (see page 62).
6.1. Manual image settings

Many of the X-ray tube settings are achieved automatically, or using a Wizard as
described in other sections. However, for advanced users it is possible to adjust
some of these settings manually.
Important factors that affect image quality are as follows:
 Tube voltage and power settings – optimizing contrast (see page 67).
 Part positioning and sample holder (see page 46) - minimizing absorption and
maximizing magnification (see page 47).
 Tube focus – for high-magnification applications (see the Installation and
Maintenance Guide).
 Contrast stretching – improving contrast on the areas of interest (see page 67).
 Image averaging – reducing the noise level in the image (see page 66).
 Image enhancements – emphasizing particular detail in the image (see page
83).
 Equalization – further noise reduction of difficult images (see page 60).
Some of these adjustments are interrelated and only time and experience lead to a
complete understanding. However, the guidelines given below may help speed this
process.
There is a natural order to the adjustments required, and this procedure suits most
cases.
1. Set the following:
 Averaging to 32
 Stretch Contrast off
 Image Enhancement off
 Color off

 3D off
2. Position the region of interest and adjust the tube voltage and power for best
contrast on the inspection point.
3. Turn on Stretch Contrast. The contrast is enhanced automatically, but manual
adjustment is also beneficial.
4. Increase the Averaging if the image appears grainy.
5. Turn on Image Enhancement. The choice of filter is usually dependent on the
magnification.
Other more general purpose filters are available. The terms fast, medium and
slow refer to how sharp the edges of the features on the part are. A slow filter
enhances slightly fuzzy detail (slow changes) whilst attenuating sharp detail.
This is useful at high magnification where sharp detail in the image is usually
just noise. New image filters can be created (see page 85).
6. Adjust the amount of Image Enhancement applied and, if necessary, further
increase the Averaging and adjust the Contrast.
If high magnification images seem blurred, the tube may need optimizing at the
current settings (see page 230) or the system may already be at maximum
resolution.
Low contrast, high magnification images are the most difficult to resolve.
Consider using a carbon-fiber sample holder - contact your local Nordson DAGE
representative for further information.
6.2. Gray scale equalization

When averaging a large number of pictures the image may still not be completely
uniform even with no part in the machine. This non-uniformity may be due to
variation in camera pixel sensitivity (fixed pattern noise). It may also be caused by
variance in the manufacturing process of a Flat Panel Detector (FPD) and the
variation of X-rays hitting the detector.
These variations are small, but become significant when random noise is removed
by averaging over 128 pictures or greater. For either case, if these variations are
consistent, they can be substantially reduced in a process called equalization.
The nature of the shading error in the detector depends on the X-ray energy and
therefore the system applies equalization calculated for each 10kV step. In order to
calculate the corrections required, various images are needed:
 A dark reference image (X-rays off).
 A series of bright, but not saturated, reference images at each 10kV step. Each
image is taken at a different power level as the detector reacts differently with X-
ray intensity.
The machine calculates an offset and scaling for each pixel in the detector to correct
for differences in sensitivity across the voltage range.
Automatically setting the equalization images

This is part of the automatic optimization procedure.

Adjusting for the best image 61
Setting the dark equalization image manually

Note: This procedure can only be performed with Engineer level access.
1. Turn off the X-rays.
2. As these images must be as free as possible from random noise, set the Image
Averaging to 256.
3. Select Menu > Images > Save Equalize Dark Image option.
It is not necessary to wait for the averaging to complete before selecting Save
Equalize Dark Image.
A Waiting for image averaging to finish message is shown.
4. Once the equalization image has been acquired, a Dark Correction Image Saved
message is shown, and a tick is shown against the menu option.
Setting the bright equalization image manually

There is a slight difference in the correction depending on whether the sample
holder is present or not. In general, the best images are made without the aluminum
sample holder being in the X-ray path i.e. either a hole for custom tooling has been
made, or a carbon fiber holder is being used.
The automatic tube optimization procedure takes the equalization image through a
hole in the focus aid assembly. However it is possible to characterize and remove
the effects of the tooling plate using this manual procedure.
1. Turn on the X-ray for each tube voltage of interest.
2. Make sure the detector is viewing directly above the tube and at low
magnification.
3. Ensure that there is no part, however faint, between the tube and the detector.
4. Set Averaging to Live.
5. Set the power level so that the gray level is approximately 80% gray scale in the
center of the image as indicated by the Pixel tool under the Measurements mini
tab. All areas of the picture must be darker than white.
6. Set the Image Averaging to 256.

7. Select Menu > Images > Save Equalize (NN)kV Bright Image option.
It is not necessary to wait for the averaging to complete before selecting Save
Equalize (NN)kV Bright Image.
A Waiting for image averaging to finish message is shown.
8. Once the equalization image has been acquired, a Bright Correction Image
Saved message is shown, and a tick is shown against the menu option.
If the tick is shown in brackets, then an equalization image from an adjacent
voltage is being used.

Note: A manually generated Bright Image Equalization is only be applied when

Classic Equalization is selected.
Applying image equalization

Equalization is automatically applied with an averaged image, provided there are
suitable equalization images saved.
Note: Equalization can change the gray levels slightly. Therefore, with extreme levels
of contrast stretch, a change in brightness is seen from live to averaged values.
Bright/Dark Image Equalization and Noise Pattern Correlation

The Equalization can be applied in two different ways, or turned off completely.
When an equalization image is applied the system uses the chosen method and
adjusts the saved equalization image to minimize the effects of any background
noise in the viewed image.
Select Menu > Screens > Options > Equalization section.
The different selections can be chosen from the drop down list:
Method Description
Non-Linear This is an enhanced version of Equalization.

Equalization
It is the preferred option for general image viewing.
Classic Equalization A fixed Bright/Dark equalization.
No Equalization No equalization is used.
When Equalization images are valid for the method of Equalization required, the
control label reads Equalization (Active). For normal operation it is recommended
the Equalization is set to Non-Linear Equalization.
6.3. Adding additional image enhancements

The following topics outline further enhancement techniques and processes that can
be applied to the image.
 Noise reduction (see page 66).
 Image averaging (see page 66).
 Automatic image processing (see page 67).
 Adjusting the contrast (see page 67).
 Live image smoothing (see page 68).
In addition, there are a range of individual functions that can be accessed using the
buttons available on the Inspect screen, as shown in the table below:

6.3.1. Image controls
Stretch Contrast
Click to activate contrast stretching.
Enhance Image
Click to apply the currently selected filter.
 While the selected filter is being applied, the status light is
yellow.
 Once the selected filter has been fully applied, the status light
is green.
Click button a second time to turn off the enhancement.
Invert Image
Click to invert the displayed image, so that blacks are shown as
whites and whites are shown as blacks. This function is typically
used in combination with Stretch Contrast and/or Image
Enhancement Filters.
Normal Image Inverted Image
Click button a second time to turn off this effect.

Color the image

It is sometimes helpful to use color to search for defects as the
human eye is not that sensitive to resolving changes in gray level.
It is much better seeing changes in color. For example, using
color can highlight the presence of voiding.
Click to convert the black and white image to a false color image.
This function is typically used in combination with Stretch Contrast
and/or Image Enhancement filters to change the gray level and
hence the color representation.
Normal Image Colored Image

Create a 3-D image
Click to convert an image into a 3-D contour drawing with color.
The height and added color of the part depends on the amount of
X-rays absorbed.

While the 3D image button is active, all other filter options are
disabled.

Quad Screen
Click to divide the seen image viewer into four equal quadrants in
order to capture and view four different images at the same time.
Each quadrant outlined in a different color. The quadrant outlined
in red is the current active image and the location is shown on the
Scanmap (if one has been created).
Please note that these four images are not live images.
To switch to another quadrant simply use the left mouse button

and double click the quadrant to be made active. The outline of
the selected quadrant turns red and is the active image. The
image seen in this quadrant can be moved and manipulated in the
same way as a single image independently of any image
displayed in the other three quadrants.
As an image is shown in each quadrant and subsequently moved
to a new location on the Scanmap, a corresponding rectangle is
shown in the same color as the quadrant on the Scanmap to give
the location for operators.
The system does not automatically move the sample to the
existing displayed position.
The images shown in each
quadrant are saved images and if
a quadrant containing an existing
image is reselected this is updated
with the current location and the
image displayed is changed to the
current device under inspection.
You can add Callouts and
Annotations to the display in quad
screen mode. However, any
callouts or annotations must be
added to the active quadrant
before selecting a new quadrant.
Click button a second time to return to the single image display.

The current active window becomes the main displayed image.

6.3.2. Noise reduction

Noise in the image is an inherent part of X-ray imaging due to the nature of X-rays
and the imaging devices used. The best method of overcoming noise is to average
the results of several images where, in general, the noise level is reduced. Noise in
a image is often made worse by image enhancement because defects, like noise,
are often very slight changes in intensity, and the system cannot distinguish
between them in the image.
Image noise can be reduced further by increasing the image averaging (see page
66). However the time taken to acquire the image takes longer.
Note: The system only applies 'static enhancements' when the averaging is
complete. This is not true for 'dynamic stretching' and Live Image Enhancements.
6.3.3. Image averaging

A live image is usually noisy, but this can be substantially reduced by averaging
over a number of image frames. The number of images averaged can be adjusted to
suit the type of inspection being performed.
Higher numbers give smoother images, but require more time. Typically, 32 images
are averaged. However, when working on very low contrast images, maybe at high
magnification, averages can be made of up to 4096 images. These can be set by
using the Avg drop down list.
In difficult cases, it is usual to set up the view with a low number whilst fine-tuning
the contrast and image enhancement settings, then increase to a higher number.
An indicator, to the right of the tube power display, shows you how the averaging is
progressing.
This indicator is shown as a yellow bar (1) as the averaging progresses which turns
completely green when averaging is complete (2).
With averaged images, a compensation system called equalization is applied. This
compensates for slight differences in sensitivity in the camera between individual
picture elements or pixels. This causes a slight change in the overall intensity of the
image as it is applied, and may require a slight adjustment of the contrast settings.

6.3.4. Automatic image processing

The automatic image processing sequence is as follows:
 The machine recognizes that the part is not being moved.
 The image averaging starts.
 Once the image averaging is complete, the image processing starts and the
indicator changes to yellow.
 The final processed image is displayed and the indicator changes to green.
The designated levels of automatic image processing, once set, continue to be

applied to the on-screen image once movement and averaging have been
completed. This allows you to look quickly at similar locations on different
samples in the same way without needing to alter/modify the image processing.
6.3.5. Adjusting the contrast

Most images look better when the brightness and contrast are adjusted. Contrast
stretching is one of the most useful tools for revealing defects.
1. Select an image, referring to Getting an image (see page 52).
2. Select the Image Processing mini tab (see page 79).
3. Click the Stretch Contrast button. Once activated, the button status light turns
green.
Initially an automatic adjustment is made which makes the darkest part of the
picture black, and the lightest white. These settings are preserved even if you
move the part.
Before After
Manual adjustments can be made to the stretch and gamma using several methods:
 Adjusting the Brightness and Contrast sliders.
 Clicking and grabbing the green line of the Histogram (see page 81).
 Selecting a Live Contrast Stretching option.
You can also adjust the White, Black or Gamma (50% gray level) sliders on the
Classic Stretch Contrast mini tab if it is displayed. This mini tab can be turned on or
off by selecting:
Menu > Setup > More Options > General > Imaging > Classic contrast mini tab.

6.3.6. Live Image Smoothing

Live image smoothing allows a live image to appear as if it is averaged without the
need to wait for the image to complete a frame average before any processing can
be applied. In some cases, especially where the inspected samples are being
moved on the screen quickly, it is suggested the amount of image smoothing used is
reduced.
Live image smoothing can be enabled and adjusted, as follows:
1. Select Menu > Screens > Options > Live Smoothing section.
2. Select either On or Off, as required.
3. Adjust the slider to set the amount of smoothing applied.
You can also turn live image smoothing on or off using the control the right hand
control panel if it has been activated.

69
7. Using the Board Image tools

A feature of the system is the ability to create a sample navigation and fault location
X-ray map (known as a Navigation Map)
This provides you with a method of rapid movement to different Regions Of Interest
(ROI) on the sample through a simple mouse click. In addition, the area being
inspected is highlighted by a red rectangle superimposed on the navigation map. As
the magnification changes, the rectangle adjusts in size so it is consistent with the
area being viewed relative to the fault and, as such, can be saved along with the X-
ray image to allow prompt identification for sample repair and re-work following
inspection.
Maps can be saved and recalled as part of Automated Inspection Routines (see
page 165).
The mapping function works by taking several small X-ray images of the sample or
samples, joining them together in a mosaic.
This section provides details on:
 Making a navigation map (see page 70).
 Marking defects on the navigation map (see page 71).
 Using the navigation map (see page 72).
Select the Board Image mini tab.
The following controls are provided:
Scan Board
Click to search the sample holder for the product, starting at
the left-front corner.
If the current image is similar in contrast to the background
then this section is not considered part of the navigation map.
By using this rule and following a predetermined search pattern
the machine finds the sample or samples.
If there are two or more samples on the sample holder that are
separated by more than 60mm, the machine may not include
the additional objects in the navigation map beyond that found
in the lower left corner of the sample holder. In this case, either
move the samples closer together or use Scan Full.
Scan Full
Click to scan the full working area of the machine. It usually
takes a longer time, but always shows everything on the
sample holder.
Clear Scan
Click to clear the current scan.

Live mapping If this is selected, the system is put into live averaging mode
and the tube and oblique controls are disabled. The map is
then updated every time the system comes to rest at a new
location.
High res. map When this is selected (followed by choosing the scale factor in
the adjacent control), the board map is created, and can be
stored, at a higher resolution compared to the standard
method.
This option also uses the set Frame Averaging value, so a high
frame average can cause scan map creation to take a very
long time.
Scale factor This drop down list gives a choice of 4, 2, or 1.
Scale factor 4 is the lowest image quality setting available and
creates the smallest total image size compared to scale factor
1.
Scale factor 1 should only be used to create maps of small
objects as it will take a long time to create the map using this
setting.
7.1. Making a navigation map

There are two methods available for making the navigation map.
 Scan Board - This searches the sample holder for the product, starting at the
left-front corner.
 Scan full - This scans the full working area of the machine. It usually takes a
longer time, but always shows everything on the sample holder.
The system uses the difference in contrast, between the sample image and the
background, to differentiate what is and is not included as part of the Scan Board
navigation map. The currently selected tube voltage and power settings are used.
However, it may be necessary to alter the tube voltage and power values to make
the sample more clearly visible and produce the best navigation map.
1. Load the sample into the machine preferably 20mm from the left-front corner of
the sample holder. A plastic 'L' position guide is supplied to assist with this.
2. Click the Inspect tab.
3. Switch on the X-rays by selecting the General Viewing button unless otherwise
instructed by your engineer. There is a short delay of around 5 seconds until the
X-rays start.
4. Select the Board Image mini tab. The system is now ready to make a map of the
part.

Using the Board Image tools 71
Points to consider when creating a navigation map:

 For low contrast samples (for example, a pcb with several copper tracks and
multiple layers but few components attached), you can adjust the fixed Stretch
Contrast settings prior to making the navigation map.
 As the magnification of the part changes with height, tall parts may not be
represented with total accuracy, and some of the scans may overlap slightly.
This effect does not detract from the main use of the map, i.e. gross navigation.
 It is not possible to create a navigation map if the X-rays are turned off, or any
dynamic Stretch Contrast option is selected. Scanmap functionality is also
disabled if the system is set to Live mode.
7.2. Marking defects on the navigation map

You can mark the position of defect points on the navigation map. The map can then
be printed out or saved for use at a rework station.
There are a number of functions associated with marking the navigation map, they
are accessed using the following buttons on the board image tab.
Please note that some buttons are only available for selection once a marker has
been placed.
Add Marker
Click to add a red marker with a unique ID number at the center of
the rectangle that illustrates the current field of view.
There is no limit on the number of markers that can be added to a

single map.
Clear Marker
Click to clear most recently added marker from the navigation
map.
Press and hold the shift key and click this button to clear all
markers.
Save Map With Markers
Click to save the current navigation map with markers.
A standard Windows Save As screen is displayed.
Print Map With Markers
Click to print the current navigation map with markers.
You can enter a title before printing, if required.
Export Map
Click to export the defect locations in .CSV format. The saved file

gives the marker number and its X,Y co-ordinates relative to 0,0
on the sample tray, which is the front left corner of the sample tray
or bottom left corner as seen on the screen.
Load Map
Click to load a previously saved navigation map.
A standard Windows Open screen is displayed.
Save Map
Click to save the current navigation map.
Additional settings for the size of the navigation map and on-the-fly navigation map
generation can be made (see page 70).
7.3. Using the map

The navigation map is used as follows:
1. Double-click the left mouse button on a region of interest on the map.
The machine manipulator moves to the region of interest, a red rectangle on the
map shows where you are looking, and the region of interest is shown in the
main display.
A particular area or detail can be viewed as follows:

1. Move the mouse pointer to one corner of the region of interest.

Using the Board Image tools 73
2. Press and hold the left mouse button and move the mouse to drag a new
rectangle (1).
3. Release the left button and then press the right mouse button to move to that
point.
The area you have selected is shown in the main display, and the picture clarity
improves over a few seconds as the image processor cleans up the picture.
If the second monitor is fitted and set to display as Reference in the More Options
(see page 38) screen then it is possible to use the larger navigation map as
described above.


75
8. Using Annotations
When a fault has been discovered on a part, it can be useful to mark it with a note,
and then print or save the image. Up to nine faults can be separately marked using
specific annotations.
It is also possible to highlight areas of interest using the Annotation tools (see page
76).
Select the Annotation mini tab.
Three callout boxes are shown down the left hand side of the screen. However, up
to nine can be accessed using the scroll bar to the left. In each box there are:
 Four specific-direction pin buttons:
 A callout button:
8.1. Using annotations to mark faults

You mark a fault as follows:
1. In a callout box, click the pin button that provides the required direction.
2. Drag and drop the callout button onto the region of interest on the image.
The fault now has a pointer on it, as shown:
The pointer number corresponds to the callout box number.

3. Add a suitable comment for the fault in the callout box.
You delete a callout by simply clicking the required callout button again.
The color, text size and font used in the callout comment box can be configured to
your preference using the More Options screen (see page 38).
Select Menu > Settings > More Options... > Callouts.

8.2. Using the annotation tools

The Annotation Tools menu is displayed automatically as a floating 'pop-up' tool bar
in the X-ray image display area when the Annotations mini tab is selected.
It can also be selected by choosing Annotation Tools from the right mouse button
menu. By default, the tools menu appears in a compact form, but it can be
expanded by double clicking the menu bar.
There are three drawing options for a text box, and a pointer option. The text box
can be either a rectangle, round cornered rectangle, or an ellipse. For each shape,
holding:
 the Shift key while drawing, produces a square, a round cornered square, or a
circle.
 the Ctrl key while drawing, centers a rectangle or an ellipse around the start
point.
 both the Shift + Ctrl keys while drawing, centers a square or a circle around the
start point.
To draw a shape, do the following:
1. Select the required tool and using the left mouse button click and drag an
outline to the size required.
2. Release the left mouse button to set the shape.
Once a text box shape has been set, it appears as defined by the options
selected in the More Options screen (see page 38). However, its appearance
can also be altered using the expanded Annotation Tools menu.
Four tabs are provided, simply use the tools displayed on each tab to make the
required changes.
 Stroke
 Fill
 Text
 Pin
To Add Text in the box, do the following:
1. Double click within the text box.
2. Type the required text.
To Resize a text box after the text has been entered, do the following:
1. Ensure the Annotation Tools menu is visible.
2. Select the box to be resized.
3. Use the grab handles around the edge of the text box and drag them to resize.
The text is automatically wrapped to fit the box.

Using Annotations 77
To Delete a text box, do the following:

1. Select the box to be deleted
2. While the box is highlighted, press the keyboard Delete key.
To Delete All the annotations on an image, do the following:
1. Press Shift + Delete on the keyboard.
2. Click Yes on the confirmation box.
To Add pointers from key areas on the image to the relevant text box, do the
following:
1. Select the pointer option from the Annotation tool menu.
2. Use the left mouse button to click from the region of interest to the relevant text
box.
3. Release the left mouse button to set the pointer and attach it to the text box with
the head anchored to the region of interest.


79
9. Using the Image Processing tools

This section provides information on the tools available on the Image Processing
mini tab, they allow you to:
 Apply a 'Live' filter.
 Adjust the image contrast and brightness.
 Adjust the image Histogram.
Select the Image Processing mini tab.
Control Description
Live Image Processing

Filter 'pipelines' cannot be created for live filters, as only one filter can be selected
at a time.
You can have:
 A live image enhancement active and an averaged image enhancement
applied to the same image.
 A live stretch contrast active and an averaged stretch applied to the same
image.
However, these combinations have a cumulative effect on the displayed image,
which may not provide the best final result.
The following controls are also available on the Image Enhancement mini tab (see
page 83), and the right hand control panel (see page 30).
Live Filtering Select an 'Edge Enhancing' filter to apply to the live image.
drop down Some filters work better than others, and are dependent on the
sample being inspected.
Use live filtering Set this checkbox to enable live filtering.
Contrast
All the following controls are also available on the right hand control panel. The
first two are also available on the Image Enhancement mini tab.

Control Description
Live Contrast Select a 'Stretch Contrast' filter to apply to the live image:
Stretching drop  Linear - This applies a standard stretch contrast using the
down minimum and maximum gray levels in the image.
 Dark - This applies a stretch contrast using the minimum and
maximum gray levels in the image but emphasizes the dark
areas. This can lose some of the detail in the lighter areas of
the image.
 Maximum - This automatically tries to brighten the darker
regions while maintaining the detail of the lighter areas of
the image.
All three filters are dynamic and modify the on-screen image
contrast automatically as changes in the main X-ray image
occur, either through user modification of the tube settings, or
as the sample is moved.
Use live contrast Set this checkbox to enable live contrast stretching.
stretching
Stretch Contrast
Click to activate contrast stretching. This function allows
you to make manual adjustments to the white and black
levels and gamma (50% gray level).
Once the levels have been set, they do not change until
either the Reset button is pressed, or Stretch Contrast is
turned off and reapplied.
Click this button again to revert back to the unprocessed
image.
Histogram
This provides a graphical representation of the gray scale
levels for the displayed image with a green line
superimposed diagonally across it.
You create handles on the green line to allow you to drag
the line to your desired position. See Adjusting the
histogram (see page 81).
This feature is repeated on the right hand control panel.
The Stretch Contrast button does not need to be active
before making any adjustments using the histogram, as
moving the green line automatically activates stretch
contrast.

Using the Image Processing tools 81
Control Description
These sliders allow you to adjust the Brightness and

Contrast of the viewed image. The changes effect both
live and averaged images.
The Stretch Contrast button does not need to be active
before making any adjustments using the sliders, as
moving a slider automatically activates stretch contrast.
Reset
Click to set both sliders to the mid position and restore
the position of the histogram green line.
9.1. Adjusting the histogram

The Histogram is a graphical representation of the gray scale levels for the
displayed image with a green line superimposed diagonally across it.
This feature is repeated on the right hand control panel. There is also an option to
have the histogram displayed as a large floating window. This is selected from the
right mouse button context window. Once activated, this window can be dragged to
any location on the monitor or monitors, and resized as required. All histogram
displays work identically.
Histogram 1 Histogram 2 Histogram 3

Using the left mouse button, you can create 'handles' along the green line (see
Histogram 2).
These handles can be selected by holding the left mouse button down and dragging
the handle to the desired position. The displayed image is updated as the handle is
moved. Releasing the mouse button sets the handle (see Histogram 3).
Handles can be deleted by using the right mouse button on the handle to be
removed. You can create as many handles as you require to obtain the desired
result. Pressing the Reset button beneath the histogram display or deactivating the
Stretch Contrast button resets the green line to the default position and removes all
handles.
You can select sections of the transfer curve between handles and adjust these
without losing the shape of the transfer curve. To do this, set the transfer curve as
required by generating handles (as described above).
Histogram 4 Histogram 5 Histogram 6
To select a section of the transfer curve for adjustment, do the following:

1. Hold the shift key and select the section required by clicking the left mouse
button (see Histogram 4).
2. Continue using shift and the left mouse button until all the sections required for
adjustment have been selected (see Histogram 5).
 The transfer curve can then be adjusted as a single entity for a modified
histogram by simply using the left mouse button to select the transfer curve and
dragging it to the new position as required (see Histogram 6).
 To clear the selection, press the right mouse button.
 Alternatively, the entire transfer curve can be reset by pressing the Reset button
between the sliders below the histogram window.
Note: Transfer curve adjustments can be made on any of the histogram displays.

83
10. Using the Image Enhancement tools

The Image Enhancement tools allow you to apply filters to enhance the image. The
filter types are:
 Live
This allows for real time enhancement of the image without the need to use
frame averaging to reduce the inherent background noise. This also allows for
quicker inspection times.
 Averaged
This allows you to use one or more filters in combination to apply to the image.
Select the Image Enhancement mini tab.
Control Description
Advanced
Click to display the advanced filter creation functions (see page
85).
Live Image Filtering
Filter 'pipelines' cannot be created for live filters, as only one filter can be selected
at a time.
You can have:
 A live image enhancement active and an averaged image enhancement
applied to the same image.
 A live stretch contrast active and an averaged stretch applied to the same
image.
However, these combinations have a cumulative effect on the displayed image,
which may not provide the best final result.
The following four controls are also available on the Image Processing mini tab,
and the right hand control panel.
Filters drop Select an 'Edge Enhancing' filter to apply to the live image.
down Some filters work better than others, and are dependent on the
sample being inspected.
Use live filtering Set this checkbox to enable live filtering.

Control Description
Stretch Contrast Select a 'Stretch Contrast' filter to apply to the live image:
drop down  Linear - This applies a standard stretch contrast using the
minimum and maximum gray levels in the image.
 Dark - This applies a stretch contrast using the minimum and
maximum gray levels in the image but emphasizes the dark
areas. This can lose some of the detail in the lighter areas of
the image.
 Maximum - This automatically tries to brighten the darker
regions while maintaining the detail of the lighter areas of
the image.
All three filters are dynamic and modify the on-screen image
contrast automatically as changes in the main X-ray image
occur, either through user modification of the tube settings, or
as the sample is moved.
Use live contrast Set this checkbox to enable live contrast stretching.
stretching
Averaged Image Filtering
Filters drop Select an 'Averaged Image' filter to apply to the image.
down
Only filters and filter pipelines selected by your engineer are
present in this list.
Filter Strength Use this slider to adjust the strength (effect) of the applied filter.
 Fully left, or zero (0) turns the effect off.
 Fully right, or maximum (100), sets the effect to maximum.
Not all filters have this slider, and some may have more than
one.
Averaged image filters are selected and used, as follows:
1. Select the desired filter from the Average Image Filtering drop down.
2. Use the Filter Strength slider (where present) to adjust the effect.
3. Select a suitable image and click the Enhance Image button.
 While the selected filter is being applied, the status light is yellow.
 Once the selected filter has been fully applied, the status light is green.
4. Click the Enhance Image button again to turn off the enhancement.

Using the Image Enhancement tools 85
10.1. Adding image filtering and enhancements
Single filters
A single, or individual, filter is a single filter kernel which is applied to an image to
produce a different image of the same size.
Input image Filter Output image
Filter pipelines
A filter 'pipeline' is a linear chain of individual filters in a fixed order, i.e. the result-
image of the first filter execution is piped into the second filter of the pipeline,
producing the second result image, which is then filtered by the third filter, and so
on.
Input F1 F2 Fn Output
image image
Note: Since the results of any filter pipeline is again just an image of the same size
as the input image, filter pipelines are also referred to as 'filters' throughout the X-ray
application. This naming convention makes it easier for users who then simply have
to deal with filters.
10.2. Creating a filter pipeline

Note: Filter pipelines can only be created in Engineer level access.
A filter can consist of one filtering action or can be put together with others to form a
single filter in order to apply several different effects in one action. Filters assembled
in this way are termed filter 'pipelines'.
Further technical information on filters is available. Please refer to Understanding
Filters (see page 261).
The following buttons and controls for creating filters are provided:
Advanced
Click to display the advanced filter creation functions, as detailed
below:
Filters This window displays a list of existing filter pipelines. Expand and
collapse controls are provided. Use these to show/hide the list of
filters in the pipeline.

Filters are applied to the image in the sequence they are set.
Therefore, the final effect seen may be different if filter A is
followed by filter B, compared to filter B followed by filter A.
The sequence can be changed by using the two arrows to the
side of the filter list, simply click on the filter you wish to move in
the pipeline and then click an arrow to move it in the desired
direction.
Click on the blue tick to de-select a filter. Click on an empty box to
select.
Only ticked filters are available for use and appear in the
Averaged Image Filtering drop down list.
Operators This window displays a list of all the operators that can be applied
to a filter pipeline. Expand and collapse controls are provided, use
these to show/hide the list of filters associated with the operator
headings.
 Contrast - These filters affect the differences between light

and dark areas of the image.
 Edge - Use these filters to improve the edge definition in
various ways.
 Noise - Use these filters to reduce signal noise within the
camera generated image.
 Sharpen - These filters sharpen the entire image rather than
just the edges.
 Other - These filters provide various effects, such as
embossing, which are used to improve the readability of the
image.
Please note that the emboss filters operate in a different manner
to create a relief map of the intensity changes. They are useful
when looking for subtle changes in intensity in BGA balls or
voiding. Their use is generally one of operator preference.

Using the Image Enhancement tools 87
An emboss enhancement changes with

intensity level. Therefore, always reset
any applied Stretch Contrast when
using an emboss filter.
Create a new pipeline

Click to create a new filter pipeline.
Add filter to pipeline
Click to add the currently selected filter to the pipeline.
Remove filter from pipeline
Select the filter, then click this button to remove a filter from the
pipeline.
Delete selected pipeline
Select the pipeline, then click this button to delete it from the filter-
pipeline bank. This only applies to pipelines created since the
software was installed.
Return to the initial screen
Click to return to the filter selection screen.
You create a new filter pipeline, as follows:

1. Click the Advanced button.
2. Click the Create a new pipeline button.
A blank edit box is displayed at the end of the Filters list.
3. Type a suitable name for the new pipeline directly into the edit box.
4. Select a filter from the list in the Operators window that you wish to be part of the
new pipeline.
5. Click the Add filter to pipeline button.
6. Continue to add filters to the pipeline, as required. There is a limit of 100 filters
per pipeline. However, in general, no more than two filters in a pipeline are
required.


89
11. Using Image Recipes

Any configuration of machine image settings can be named and recalled at any
time, by any user. Each saved configuration is called a recipe. There is no limit to
the number of recipes that can be saved.
A floating toolbar that comprises up to four dedicated buttons, a general viewing
button and a selection list is provided in the X-ray image display allowing you to
select a particular recipe.
The Recipes toolbar is displayed by:
Right clicking in the image display area > selecting Recipe Options
A status light against each control indicates which button is currently active.
The dedicated buttons can each be assigned a particular recipe to provide users
with a method of rapidly recalling popular image settings. Any of these buttons can
be hidden if they are not required, and they can be re-assigned a recipe from the
selection list, at any time. Changes to any button configuration settings are made by
your engineer.
The General Viewing button recalls a recipe that gives a good image on a wide
variety of different products. You can use this as a starting point for inspections. You
cannot hide this particular button, or assign a recipe to it from the selection list.
However, you can update the image configuration it recalls with the currently set
image parameters.
Recalling a recipe
To recall a recipe, do one of the following:
 Click the list button (far right-hand side) and make a selection.
 Click one of the dedicated buttons.
 Click the General Viewing button.
The machine loads the new settings and closes the recipes toolbar. This operation
may take a few seconds.
A number of preconfigured recipes are supplied on installation. These are recalled
via the selection box on the Recipes toolbar. However, they may not be suitable for
inspecting your particular products. If this is the case, the list contents can be
changed as required, and more suitable settings established.
The following topics provide information on the various functions available for
managing the image recipes and controls. However, image recipe settings can only
be changed with Engineer level access.
 Saving a recipe (see page 90).
 Deleting a recipe (see page 90).
 Updating the General Viewing recipe (see page 90).
 Hiding a dedicated recipe button (see page 90).
 Assigning a recipe to a button (see page 90).
 Updating a recipe (see page 91).

Saving a recipe
The current system settings are saved as follows:
1. Type a new name into the recipe selection box
2. Press Enter on the keyboard.
Deleting a recipe
1. Select the recipe to be deleted from the selection list.
2. Press the Delete key on the keyboard.
The system asks you to confirm the deletion.
3. Select Yes.
Updating the general viewing recipe

The General Viewing button recalls a recipe that sets the system so that a wide
variety of samples can be seen. It is generally used to allow you to see something
quickly, e.g. before making a navigation map, or using the Image Wizard.
However, if the settings in this general recipe are unsuitable for your application,
they can be altered, as follows:
1. Change the tube voltage and power settings to more suitable values, but leave
the image averaging to 32 with all other image processing tools off.
2. Select Menu > Images > Update the General Viewing Recipe to save the changes.
Hiding a dedicated recipe button

A dedicated recipe button can be hidden by disabling it, as follows:
1. Select Menu > Screens > Options > Show Controls section.
2. Clear the checkbox against the button of choice and the configuration is
automatically set on the system. This operation may take a few seconds.
Assigning a recipe to a button

A recipe is assigned to a dedicated recipe button, as follows:
1. Select the required recipe from the selection list.
2. Hover the mouse cursor over the recipe button to be assigned, and click the
right mouse button.
A menu appears that allows you to:
 Assign the currently selected recipe to this button.
 Clear the current assignment.
 Cancel.
3. Select Assign, and the selected recipe name appears on the button.

Using Image Recipes 91
Updating a recipe
You can update the selected recipe with revised settings, as follows:
Select Menu > Images > Update the recipe"...".
The actual text "..." for this option varies depending on actions prior to the selection.


93
12. Using the Analysis tools

This section provides detailed information and step by step procedures for using the
comprehensive range of analysis tools shown in the table below:
Select the Analysis mini tab.
The following tabs are displayed:
Tab Description
Outline Measurements (see page 94)

This tool measures the diameter, the area, and roundness of each BGA
ball.
Drawing Tools (see page 120)
These tools allow you to manually define areas of interest by drawing
on the image. The shapes you draw can then be used for measurement
purposes.
Void Measurements (see page 122)
This tool is designed to work for BGAs as well as for other
measurements, such as die attach voiding. It works by looking for all
pixels within the defined area that are lighter than a set grayscale value.
The void percentage is an area measurement calculated as the total
number of these lighter pixels as a percentage to all of the pixels in the
defined area.
User Drawn Void Measurements (see page 138)
These tools allow you to manually define areas of interest by drawing
on the image. The shapes you draw can then be used for measurement
purposes.
Auto Wire Sweep (see page 109)
This tab is available by selecting:
Menu > Setup > More Options... > General > User interface > Analysis
Tabs Visibility > Auto Wire Sweep
Quad Flat Pack No-Leads (see page 112)

Tabs Visibility > Quad Flat Pack No-leads
Solder Pads Analysis (see page 116)

Tabs Visibility > Solder Pads Analysis

Tab Description
Template Based Analysis (see page 139)

This allows you to execute a series of instructions to analyze the device
under inspection using a shape defined, or imported by the CAD Editor.
Tabs Visibility > Template Based Analysis
CAD Template Editor (see page 141)

This is a simple yet flexible tool for modifying data imported from files,
or creating templates from scratch by drawing shapes over the top of
the corresponding X-ray image.
This is a licensed option. If you do not have it, contact your local
12.1. Outline Measurements

Select the Outline Measurements tab.
Threshold Set this slider to manually set the X-ray intensity level as appropriate
to define the outline of the balls.
The number shown at the top of the slider is the current threshold
value.
As this slider is moved, the results are seen in real time on-screen as
a change in the definition of the perimeter around each ball by a
colored outline.
This slider is only active if Manual is selected from the drop down.
Clear
Click to clear the current outline information from the X-ray image.
Find Outline
Click to find the ball outline based on the current configuration
settings.
Measurement type
Auto
Click to establish some system 'best guess' base settings prior to
any manual fine adjustment.
When this button is clicked, the Threshold slider moves to the best
guess position as a starting point.

Using the Analysis tools 95
Drop down Select an appropriate option. Each entry uses a slightly different
threshold detection method or set of values for the objects displayed
on the screen:
 Default
 Manual
 MaxEntropy
 Minimum
 Otsu
The above list is shown complete. If options are not displayed, they
may have been disabled in the More Options screen (see page 38).
Include sizes Set this slider to remove from the analysis any objects in the image
found below the set size given at the right-hand end of the slider.
View Indicators
Circles Set this checkbox to convert the area defined by the ball perimeter
into a circle of equivalent area located about the found center of the
ball.
This can be useful in determining visually how out-of-round the balls

are.
Centers Set this checkbox to show the center of each ball based on the
location of the intersection of the long and short axis of each ball.
Limits
If the Low limit and any corresponding High limit are set to 0.0, the measurements
are made on-screen without highlighting any passes or fails.

Diameters Set this checkbox to enable ball diameter measurement.

 If pass/fail limits are needed, set these as a Low and High limit.
 The diameter measurement is shown in green if within the set
limit, or red if outside the limits set.
Roundness Set this checkbox to enable ball roundness measurement.

 As it is normal to look for a poor roundness figure, only a lower
limit is available.
 The roundness measurement is shown in green if within the set
limit, or red if outside the limits set.

Area Set this checkbox to enable ball area measurement.

 If pass/fail limits are needed, set these as a Low and High limit.
 The area measurement is shown in green if within the set limit, or
red if outside the limits set.
12.1.1. Measuring ball grid arrays (BGA) manually

The Ball Grid Array (BGA) tool measures the diameter (the longest axis if not
perfectly circular), the area, and roundness of each BGA ball. It can also be used to
measure total percentage voiding and single largest void inside each BGA ball.
The system should be set to view from straight above the part. To do this, click on
the center of the dartboard.
Typically, you follow the procedures below to manually analyze BGAs:
 Getting ready (see page 97).
 Identify the ball outline and measure its size and shape. (see page 99)
 Identify the voiding inside the ball and measure the largest and total void areas.
(see page 122)
The identification of these shapes is made by analyzing the intensity of X-rays in the
image, and deciding, for example, the difference in intensity between a ball and a
void. Once this decision is made, the analysis can take place. The system generally
makes these decisions, but manual adjustment is available for difficult cases.
12.1.2. Getting ready

The following procedures should be followed prior to starting any BGA outline
measurements:
 Locating the part (see page 98).
 Adjusting the image settings (X-ray tube voltage and power) (see page 98).
 Setting the image magnification (see page 98).
 Setting the height (see page 99).
The following topics provide step by step details for all the above procedures.

Locating the part

1. Move the part into the viewing area.
2. Use one of the recipes (see page 89) (such as General Viewing) if you are
unsure which settings to use.
3. Try and locate a few balls that have voiding, or some region of interest.
Image settings
It is important that the imaging device is not saturated with too much X-ray intensity
as this can cause the size of the BGA ball to appear smaller. High X-ray intensity,
and therefore saturation, can be caused by tube voltage too high, tube power too
high, or a combination of the two.
1. Set the tube voltage and power using one of the following methods:
 Selecting an existing recipe (see page 89)
 Making a manual adjustment (see page 59)
2. Ensure that with Contrast Stretching off, the area around the balls is not
saturated (not completely white).
It is quite acceptable from then on to use contrast stretching and any other
enhancement to improve the visibility of voids as the measurements are always
taken from the unprocessed image.
Setting the image magnification

1. Set the view to overhead, and zoom to the required magnification.
The magnification of the ball depends the distance between the part and the X-
ray tube. Therefore, similar-sized solder balls placed closer to the X-ray tube will
appear larger in the image compared with those placed further away, such as
on the second side of a board.
2. Limit the number of visible balls to around a maximum of 50, or less, for best
results.
If the balls are small on the screen then they will have fewer pixels describing
them, resulting in lower measurement accuracy.

Setting the height

Setting the height for the BGA to be measured is very important. If the height is not
set then the on-screen measurements in terms of microns per pixel may be incorrect
as the height of the BGA within the sample has not been determined, or confirmed.
1. Click the Set Height button.
2. Choose a ball that is clearly visible and use the center of the BGA ball as a
reference point.
3. Zoom in if necessary to improve accuracy.
4. Continue to select the same point on the same BGA ball as the system
requests.
12.1.3. Measuring ball outlines

Before any measurement can be made, the outline of each ball shown on-screen
must be defined according to a grayscale threshold level. Once achieved, the
system can measure:
 Ball diameter
 Ball roundness
 Ball area
 Some, or all, of the above measurements at the same time.
Measurement is started as follows:

1. Select the Analysis mini tab.
2. Select the Outline Measurements tab.
Only wholly complete balls within the full image are measured. If a ball is truncated
by the edge of the image, the system automatically excludes it from any
measurement.
However, depending on the viewer layout currently selected (left hand and/or right
hand panels visible), a truncated ball shown on-screen may still be measured if it is
complete in the full (savable) image.

12.1.4. Finding the ball outline

The system can analyze the image and determine a valid X-ray intensity that
represents the outline of the ball. This is achieved using an automatic threshold
detection technique. Typically, there are several options available from the drop
down list. Each one can be selected to achieve slightly different threshold detection
for the objects displayed on the screen. As an option is selected, the system
dynamically changes the displayed outline, so the the best choice can be made for
the image displayed.
The ball outline is typically found as follows:
1. Select an appropriate option from the drop down list.
2. If Manual is selected, do the following:
 Click the Auto button to move the Threshold slider to the best guess position
as a starting point.
 Manually adjust the Threshold slider, if necessary.
3. Set the Include sizes slider to a value less than the smallest ball size expected
to ensure that smaller features are not included in the analysis. A red ring is
shown in the center of the image to aid with the setting of this limit.
4. Alternatively, smaller and larger features than those of the solder balls to be
measured can be excluded as being outside of a user defined range, as follows:
 Set the lower limit as described in the step above.
 Set an upper limit by pressing and holding the Shift key and dragging the
Include sizes slider to set the desired upper limit. A pair of concentric red
rings are shown in the center of the image to aid with the setting of these
limits.
5. Set the following measurement Limits, as required:
 Diameters
 Roundness
 Area
All of the measurements above can be performed simultaneously, but the
display may be a little confusing.
6. Click the Find Outline button.
Each of the balls should now have a colored outline defining it correctly. Any
balls that are missing a colored outline mean they do not meet the user-set
criteria. This could be because the ball size or grayscale intensity are outside
the defined settings.
7. If required, do the following:

 Set the Circles view indicator.

 Set the Centers view indicator.
The displayed font size, and what is shown on the screen, can be adjusted using the
options in More Options (see page 38).
Any saved images are as shown on the screen.
12.2. Using the automation wizard

You can set up automated measurement routines, based on a reference sample.
These can then be used stand-alone, or within an Automated Inspection Routine
(see page 165).
This section provides detailed step by step procedures for:
 Starting, saving and running a routine (see page 102).
 Creating new routines (see page 103).
 Executing a routine (see page 118).
 Deleting a routine (see page 120).
The routines are created using the Automation Wizard which is accessed by:
Selecting the Analysis mini tab.
The automation wizard panel provides a range of function buttons that are displayed
as required by the wizard operation. Therefore, not all the buttons shown below are
visible at any one time. If a button is 'greyed-out' it is not currently available.
Note: The function buttons are unnamed. However, hover the cursor over a button to
display a tool tip that describes the button's function.
Function button Description
Start Routine
Click to start new routine using the automation wizard.
Load Routine
Click to load an existing routine from the database.
Once an automation routine has been defined and saved it can
be recalled at anytime to be executed, providing an easy way to
make measurements using the same settings every time.
A Load screen is displayed, allowing you to select a saved
routine. The name of the routine is shown on-screen when
successfully loaded.
Run Routine
Click to execute the currently loaded routine.
Stop Routine
Click to stop the currently loaded routine.

Save Routine
Click to save the current routine, or modified limits.
If you need to change the measurement limits for a saved
routine:
 Load the required routine.
 Change the limits, as necessary.
 Click this button to save the new limit values.
12.2.1. Starting, saving and running an automated routine

All automated routines follow the same general procedures, as follows:
Starting a new automated routine

Click the Start new routine button to begin the routine creation process.
Saving an automated routine

At the end of the routine creation process, the wizard may automatically display a
Save Settings dialog box. However, some types of routine require you to click the
Save routine button.
You use the Save Settings dialog box as follows:

1. If you wish to save as a new routine, type a unique name in the Name field.
2. If you wish to overwrite an existing routine, either select the routine in the list
window or type its name in the Name field.
3. Click OK.
4. If you are overwriting an existing routine, click Yes in the warning message.
Running the automated routine wizard

Once a routine has been started, instructions are displayed in the Automation panel.
Also, three further controls are displayed:
Control Description
Back
If an incorrect choice is made, click to move back one step.
Stop
Click to stop and exit the wizard at any point.
Fwd
Click to move forward to the next step.

12.2.2. Creating automatic measurement routines

Important: Before creating an automated routine, ensure the height has been set
correctly for the sample being tested. If this is not set correctly, the analysis results
will be inaccurate.
When creating an automated routine, you need to spend some time ensuring a good
X-ray image is obtained, with a good contrast between the gray scales.
This is achieved by adjusting the tube voltage and power levels. Generally the detail
of the image is improved by increasing the tube voltage to allow for increased X-ray
penetration of the sample and the brightness is increased by adjusting the power
setting. However, a good balance of the two is required for the best image. Once a
good image has been achieved with the voltage and power settings, an image
averaging of 128 is recommended to give a good equalized image.
During the following topics, it is assumed that an X-ray image is displayed.
You can create automated measurement routines for:
 Ball Grid Array (BGA) (see page 103)
 Void (see page 108)
 Wire sweep (see page 109)
The system can be configured to automatically measure all wires within a given
pattern. However, automated measurements are for use only with wire bonding
which has a ball bond at one end, and a wedge bond at the other.
 Quad Flat Pack No-Leads (QFN) (see page 112)
The system can be configured to automatically analyze the pads and center
contact areas of Quad Flat Pack No-Leads (QFN) devices.
 Solder pads analysis (see page 116)
The following sections provide stepped instructions for using the wizard to create the
above routines.
12.2.2.1. Creating a BGA routine

Step 1 - Starting the BGA Wizard

1. Click the Start new routine button.
Step 2 -Choosing the automation type - BGA routine

1. Select the BGA option required from the Routine Type drop down list.
The drop down list gives a choice of inspection types:
 BGA single shot - Traditional single step BGA inspection, this is useful for
regular small BGA devices.

If this option is selected, the analysis routine only acquires a single top down
image of the whole BGA array for analysis. This provides a much quicker
result but is not as accurate because it is a much larger Field of View and
some of the detail may be lost. It is ok for small arrays containing only a few
BGA balls, but it is not recommended for larger arrays.
 BGA single shot (Ball Filter) - A circular filter is applied around each BGA ball
to reduce the effect from occlusions.
 BGA Multi Shot - Traditional multi step BGA inspection. Typically used for
large regular BGA devices or where more accurate analysis is required.
 BGA Multi Shot (Ball Filter) - A circular filter is applied around each BGA ball.
 One Shot BGA from template - The inspection is a single step but the BGA
layout is created from a CAD template. Typically used for irregular BGA
layouts.
 BGA Multi Shot from template - Multi step inspection for large BGA devices
created from a CAD template.
The list above is shown complete. If options are not displayed, they may
have been disabled in the More Options (see page 38) screen.
2. Click Fwd.
Step 3 - Selecting threshold and ball size

1. Move the image so that the entire BGA is visible on the screen.
2. Select and apply any image enhancement that may be required to improve the
image displayed on screen.
3. Select the best threshold method from the drop down list, to give the best and
most accurate outline result on the displayed image.
4. Set the Include sizes slider so the majority of the balls are outlined.
5. Click the Find Outline button to show the selected outlines on the image.
6. Click Fwd.
Step 4 - Removing unwanted objects

1. Remove unwanted objects that have been outlined, such as those shown in the
red rectangles in the image below.
This can be done by clicking on or near each object or by using the Drawing tab
controls.
Unwanted objects can also be removed using the Include sizes slider to reduce
the number of objects selected.

2. Ensure that the only objects that are outlined are BGA balls before you click
the Fwd button, as any invalid objects affect the calculations performed by the
system.
3. Click Fwd.
Step 5 - Setting the correct pitch

When this step is displayed the system automatically calculates the dimensions of
the BGA and draws a graphical representation of the BGA on to the image. The
system shows the calculated Horizontal and Vertical Pitch values and selects the
closest known values from the lists.
1. If you want to force the system to use the measured value rather than the
nearest known regular value, select the Measured options from the two pitch
lists.
2. If you want to choose alternative pitches, simply select the required values from
the pitch lists.
If the nearest known value is selected, the system automatically adjusts the
measured Set Height to correct for any slight measurement differences, after
the Fwd button has been pressed.
An example of the resultant view is given below.

If the value should be one of the known values, but has been measured to be
significantly different, this is probably the result of an incorrectly set height for
this BGA.
If this is the case, cancel the creation process and set the height (see page 56)
for the BGA then restart the wizard.
3. Click Fwd.
Step 6 - Selecting what to include

1. Check the displayed image for required, and not required balls.
2. Click within a ball's outline to toggle it as included or excluded. An excluded ball
is not required for measurement.
The two states are:
 A solid red ball - indicating the ball is included in the auto inspection.
 A white outline only - indicating the ball is included, or no ball is present.
Always pay special attention to balls that may be obstructed by other
components, as these could be seen as bridges and produce invalid results.
 Two of the four balls (1) in the image are deliberately missing. The system
decided correctly.
 The balls in the bottom-right and top-right of the image (2) are obscured by
components. The system is not sure what to do, so has excluded them. If
this is a real situation, then the balls should be left excluded. However, they
can be included if required.
 The ball in the bottom-left of the image (3) has been excluded by the system
for no obvious reason. You can manually include this ball.
3. Click Fwd.
BGA balls can be painted in by holding down the Ctrl key and covering the
outlines with the mouse. This is useful if there are a large number of BGA balls
missed due to occlusions that should be included.
Step 7 - Identifying ball A1 and B1

This step identifies each ball with a unique label for the device so that resulting data
can be tracked against CAD position, for example.
1. Click on the ball that is to be designated as A1 for this device.

Ball A1 must be a corner ball but can be any one of the four corner balls.
2. Click on one of the edge balls adjacent to that selected as A1.
This becomes B1.
Depending on which adjacent ball is chosen to suit this requirement, the ball
labeling will have the numbers running horizontally and the letters vertically, or
the numbers running vertically and the letters horizontally, as shown below:
3. Click Fwd.
Step 8 - Choosing the measurement settings

If the BGA measurements were to be made with all of the balls in the device visible
on-screen at the same time, then because each ball would only comprise of a few
pixels, the precision of the measurement would be seriously affected. Therefore, the
system deliberately splits up the BGA into smaller sections during the measurement,
using higher magnification or smaller Field of View (FOV), so allowing more pixels
per ball on-screen and thereby better measurement precision.
At this point in the wizard, the system automatically zooms-in, to a preset level, on to
the first ball found in the device array. However, if the One Shot BGA option has
been chosen, this option to alter the FOV is skipped.
You can now alter the FOV from the preset level to show more, or less, balls on
screen. However, a trade-off must be made between having fewer balls on-screen
and therefore having improved precision compared to the speed of stepping through
all of the smaller sections into which the BGA will be sub-divided. Fewer balls on-
screen means many more sections to look through and therefore a longer time to
measure all of the balls.
Note: The Frame Average rate is applied to each of the smaller section
measurements. A recommended setting for the frame average is 16 - 128 fps.
1. Set the Frame Average to the required frames per second (fps).
2. Select the Threshold level to use for the BGA measurement limits as
appropriate, or leave as Auto detect.
3. Select the measurements required by setting the relevant checkboxes:
 Diameters
 Roundness
 Area
4. If limits are required for the measurements to provide pass/fail information, enter
the appropriate values into the low/high boxes.

5. Set the low/high values to zero in order to just obtain the measurements for the
balls without any pass/fail indication.
6. Select Find Outlines button to identify the BGA balls within the set parameters.
7. Click Fwd.
Step 9 - Setting void parameters

1. Choose the required void parameter settings, selecting the appropriate void
detection method, threshold and measurement limits to give the best results for
2. Click Fwd.
Step 10 - Saving the BGA routine

When the Fwd button is clicked, the Save Settings dialog box is displayed (see page
102).
12.2.2.2. Creating a void measurement routine

Step 1 - Starting the void wizard

Step 2 - Choosing the automation type - void measurement

1. Select the Area void option from the Routine Type drop down list.
2. Click Fwd.
Step 3 -Defining the area outline

1. Center the area that is to have the void measured on the screen and set the
field of view at which the analysis should be made.
2. Identify the outline of the area to be analyzed for voids by doing one of the
following:
 Use the Find Outlines method:
Set the threshold level.
Click the Find Outline button to show the selected outlines on the image.

 Manually drawing the region of interest (see page 120).
Example of void area.

3. Click Fwd.
Step 4 - Setting the void parameters and limits

1. Choose the required void parameter settings, selecting the appropriate void
detection method, threshold and measurement limits to give the best results for
2. Set suitable Limit values for the overall void and/or largest individual void
settings, if the routine is to produce pass/fail data.
Note: If the Limits are set to 0.0 then the measurements are made and stored
but without highlighting any pass or fails.
3. Click Fwd.
Step 5 - Saving the void routine

When the Fwd button is clicked, the Save Settings dialog box is displayed (see page
102).
12.2.2.3. Creating an auto wire sweep routine

Select the Auto Wire Sweep tab.
This tab may not be visible. Refer to More Options (see page 38) for more details
regarding visibility of the Analysis tabs.
Tool button Description
Remove
Click to remove all the features.

Delete Last Wire

Click to delete the last defined wire.
Wire Thickness
Wire Thickness
Click to draw a box over the chosen wire to automatically calculate
the wire thickness.
Edit Box Enter the wire thickness directly into this box.
(µm)
Accept
Click to accept the defined wire thickness.
Fault Percentage
Spec (%) Enter the fault limit as a maximum percentage of the wire bent.
Accept
Click to accept the defined fault tolerance.
Step 1 - Starting the Wire Sweep Wizard

2. Define the device template.
A blue border box is shown on the image.
3. Do the following:
 Move the region of interest inside this box.
 Click and drag a box around the region of interest which must remain within
the blue border.
Step 2 - Define the first fiducial mark

1. Draw a rectangle around a distinct and unique feature within the blue border
box, to define the first fiducial mark.
If an inappropriate point is used, a warning is given.
More information on how the system creates and uses fiducials is available (see
page 183).
Step 3 - Define the second fiducial mark

1. Define the second fiducial mark in the same manner as the first.
Step 4 - Adjust the image

1. Adjust the image (zoom) so that the wires can be seen clearly.
2. Click the Wire Thickness button.

3. Define the wire thickness by drawing a box over the chosen wire, or enter a
value for the wire in microns (µm).
4. Click the Accept button to apply the displayed defined wire thickness values.
5. If the thickness value is incorrect:
 Enter a new value, or;
 Redraw the definition box.
Step 5 - Set fault limits

1. Enter the Fault Limit as a maximum percentage of the wire bent.
2. Click the Accept button to apply the defined fault limit.
Step 6 - Define wire end points

1. Define wire end points by clicking on the ball end and then on the wedge end of
the chosen wire.
Note: It is very important to click on the ball end first, then on the wedge end of
wires to be measured.
2. Repeat the previous step for the remaining wires as required, or click and hold
the left mouse button to drag the image to a new wire position and continue.
3. If you make a mistake, then the last defined wire can be removed by clicking the
Delete Last Wire button.
Step 7 - Save the routine

1. Click the Save routine button, the Save Settings dialog box is displayed (see
page 102).

12.2.2.4. Creating a Quad Flat Pack No-Leads routine - Quadra

Select the Quad Flat Pack No-Leads tab.
Clear
Click to remove all the features.
Define Pads
Connector Pads
Click to define the connector pads. This button is usually
automatically activated.
Central Pad
Click to define the central pad. This button is usually automatically
activated.
Solder When active, use this slider to set the solder threshold percent.
Threshold
Percent
Masking
Rectangle
Choose one corner of the region of interest and click and hold the left
mouse button. Move the mouse to the opposite corner to draw a
rectangle.
Hold the Shift key on the keyboard whilst drawing to make a perfect
square, or hold the Ctrl key to draw symmetrically around the first point.
Holding both the Shift key and the Ctrl key draws a perfect square
symmetrically around the first point.
Ellipse
Use this in the same way as the Rectangle tool, to draw ellipses.
Hold the Shift key on the keyboard whilst drawing to make a perfect circle
or hold the Ctrl key to draw symmetrically around the first point. Holding
both the Shift key and the Ctrl key draws a perfect circle symmetrically
around the first point.
Add
Click to add the drawn area to the mask.
Void Limits (Pads)
Overall % Set this slider to an appropriate value.
Largest % Set this slider to an appropriate value.

Void Set this slider to an appropriate Void Threshold value.

Threshold
Edge Exclude Set this slider to an appropriate Edge Exclude Percent value.
Percent
Void Limits (Centre)
Overall % Set this slider to an appropriate value.
Largest % Set this slider to an appropriate value.
Step 1 - Starting the QFN Wizard

2. Left click and drag to draw an enclosing box around the entire QFN device
being inspected.
The wizard automatically proceeds to the next step.
Step 2 - Defining a connector pad

1. Left click and drag to draw an enclosing box around a single connector pad on
the QFN device being inspected.
The system automatically draws an outline around the solder paste.

It is recommended that the pad is outlined with enough clear space around so
that the grayscale of the connector pad and solder paste can be clearly
identified.
The wizard automatically proceeds to the next step.
Step 3 - Setting the solder threshold

Once a single pad has been outlined, the Solder Threshold Percentage slider is
automatically activated. This value is used for all of the QFN pads.
1. Set the slider to an appropriate value.
The solder paste outline is dynamically updated as you adjust the slider.
2. Click Fwd.
Step 4 - Automatic pad definition

At this point the system attempts to find the remaining pads on all four sides of the
QFN device. However, this operation can sometimes fail because a pad outside of
the defined inspection area has been identified. In this case, you must go back a
step and enlarge the inspection area.
Sometimes an occlusion may prevent correct automatic definition, or the first pad
did not have enough detail for the system to identify all the pads. In this case, you
can decide whether to go back and redraw the original pad or leave it and inspect
any missing pads manually.
The Connector Pads button is automatically activated.

1. You have a choice to de-select any identified pads, or to redefine all the pads:
 Click a pad to toggle it on or off.
 Click Fwd to continue to the next step.
 Click Back to restart defining pads.
Step 5 - Defining the central pad

1. Click the Central Pads button. This is automatically activated.
2. Left click and drag to draw an enclosing box around the central pad.

You can now use either of the masking tools to define any areas that are to be
ignored during the analysis. For example any vias that are directly underneath
the central pad.
3. Click the appropriate button to activate a Rectangle or Elliptical masking tool.
4. Left click and drag to draw an enclosing box (yellow) around the area to be
ignored, as shown:
5. Click the Add button to add the drawn area to the mask. The defined area will be
ignored. The outline around the masked area turns white, as shown:
6. Repeat the above process as many times as necessary to define all the areas to
be ignored.
7. If you have defined the central pad incorrectly, click the Central Pad button to
redefine the central pad.
8. Click Fwd.
Step 6 - Identifying the pad numbering scheme

1. Click on the pad where the number labels should start with A1. Be aware, a
QFN device does not necessarily have Pad 1 starting at a corner.
2. Click on an adjacent pad to define the labeling direction (clockwise or anti-
clockwise).
The numbers are allocated automatically once the start and direction have been
defined. The central pad is always identified as center.
The label font size can be adjusted from the More Options screen (see page
38).
3. Click Fwd.
Step 7 - Setting void and edge thresholds

1. Set the following slider controls to appropriate values. These are used to help
identify voids within the solder:
 Void Threshold
 Edge Exclude Percent
These parameters affect all pads, including the central pad.
2. Click Fwd.

Step 8 - Setting the void limits

1. Enter appropriate values for both the pads and central pad:
 Overall (percentage)
 Largest (percentage)
2. Once all the values are entered, click the Save Routine button.
The Save Settings dialog box is displayed (see page 102).
12.2.2.5. Creating a solder pads analysis routine

Select the Solder Pads Analysis tab.
Accept Pad
Click to accept the pad if the displayed result is acceptable.
Min. Solder % Enter the minimum amount of solder allowed for the defined
pad.
Min. Solder Area Enter the minimum amount of solder allowed for the defined
pad as an area (mm²).
Max. Individual Enter the maximum individual voids allowed in the solder
Voids % area, NOT the defined pad.
Max. Total Voids The maximum total voids allowed in the solder area, NOT the
% defined pad.
Manual Threshold
Enable manual Set this checkbox to enable the manual threshold controls.
thresholding See below:
The following sliders affect all of the defined pads within the current routine. The
defined pad area is outlined in dark blue and the solder area is outlined in cyan.
Voids are outlined in either red or green depending on the limits set. Simply set each
one to an appropriate value:
 Pad Threshold %
 Solder Threshold %
 Void Threshold %
 Edge Exclusion %
The Void Threshold and Edge Exclusion sliders can be used together to identify the
voids while ignoring the lighter gray areas around the edge of the pad.

Step 1 - Starting the Solder Pad wizard

2. Left click and drag to draw a red enclosing box around the entire device being
inspected.
3. Click Fwd. The enclosing box turns green.
Step 2 - Defining the connector pads

1. Left click and drag to draw a red enclosing box around a device connector pad.
The box remains red and the outline of the pad is defined along with the
calculated solder area using automatic threshold settings.
2. If the result is unacceptable, simply redraw the box.
3. Click the Accept Pad button if the displayed result is acceptable. The enclosing
box turns green defining the pad.
4. Continue to define pads individually, accepting each one in turn until all pads
are defined.
5. If you want to adjust the default values used to define the Pad, Solder, Void and
Edge Exclusion thresholds, set the Enable Manual Thresholding checkbox and
adjust the sliders as appropriate.
6. Click Fwd.

Step 3 - Setting limits

1. Enter appropriate values for:
 Min. Solder (%)
 Min. Solder Area (mm²)
 Max. Individual Void (%)
 Max. Total Voids (%)
2. Once all the values are entered, click the Save Routine button.
The Save Settings dialog box is displayed (see page 102).
12.2.3. Executing a routine

Once an automated routine has been created and/or loaded, it can be executed by
clicking the Run Routine button:
If the button is 'greyed-out', it is not available because a valid routine is not currently
loaded.
Once the button is clicked, the system automatically performs the requested
measurements at the current location.
When executing a BGA measurement the system performs a number of steps to
ensure the accuracy of the measurements. A number of these steps involve
automatic movement of the image before positioning the BGA on the screen.
There are also some outlines drawn on the screen during the measurement. The
movement and the outlines are standard operating characteristics of the system.
Care must therefore be taken to ensure that the current view is similar to the view
used to setup the routine. The system automatically adjusts for any difference in
magnification, but cannot adjust, except in a very minor way, for any positional
offsets.
Once the system has finished performing the requested measurements the system
displays the results and, provided the execution was successful, also automatically
generates an HTML report containing the results. The results are displayed in the
results window of the Automated Inspection Routine tab (see page 214).
Successful execution
If the execution of an automated measurement routine is successful, the system
displays a message giving the location of the HTML report containing the results.
However, successful execution does not mean that the results have passed as this
depends on the measurements, and the pass/fail limits that were set when the
routine was defined.

The report file can be displayed using the PC default Internet browser. However,
ActiveX content may have to be enabled in the browser for the results to be
displayed correctly.
Failed execution
If a routine fails to execute for any reason, the Result Summary is displayed and
reports the failure.
The following table summarises failure types and provides information about what
actions to take in the event of a failure. However, if a routine fails repeatedly, a new
routine should be created.
Routine Type Comments
Void It is unlikely that a void routine will fail to execute, as it is always

possible for a void measurement to be performed. The only cause of
failure is if the void mask image that is stored in a file on the hard disk
has been deleted, or is corrupt.
If an object is misaligned, the routine produces measurements that
are invalid but this situation only generates a failure if the
measurements fall outside the limits set for the routine.
BGA If the execution of a BGA routine fails, check or consider the
following:
Set Height has been performed for the BGA.
The BGA is positioned correctly and:
 The whole BGA should be visible on the screen.
 There should be a significant gap between the right side of the
BGA and the right side of the image.
 If the BGA fills the majority of the screen, even at the lowest
magnification, then the BGA should be positioned as far to the left
as possible while leaving all of the balls in the far left column in
view.
 The current brightness and contrast settings are the same as
those used when the BGA routine was taught. This is particularly
necessary if manual thresholds have been used.
Consider adjusting the tube kV and power and re-creating the BGA
routine so as to make the balls appear with more contrast on-screen.
Wire Sweep Generally a wire sweep fails because the system cannot identify all or
some of the wires of the device.
QFN QFN failures normally only occur if the device being inspected is
outside of the mask stored for inspection. When this happens,
reposition the sample being inspected to the center of the screen.
Pad Analysis Pad Analysis failures normally only occur if the device being
inspected is outside of the mask stored for inspection. When this
happens reposition the sample being inspected to the center of the
screen.

12.2.4. Deleting a routine

To delete any automation routines that are no longer required, follow the procedure
below. However, care must be taken when deleting auto routines as these can be
used in Automated Inspection Routines (see page 165) and their deletion may
cause an AIR to stop functioning correctly.
1. Select the Analysis mini tab.
2. Click the Load Existing Routine button and select the required routine.
If the routine is not visible ensure the relevant selection checkboxes are set.
3. Click Delete.
It is also possible to delete routines using the Database Viewer (see page 249).
12.3. Drawing Tools

Select the Drawing Tools tab.
Clear
Click to clear all of the shapes drawn.
Shape
Selection
Click any drawn object to select it for sizing or re-positioning.
Rectangle
Choose one corner of the region of interest and click and hold the
left mouse button. Move the mouse to the opposite corner to draw a
rectangle.
square, or hold the Ctrl key to draw symmetrically around the first
point. Holding both the Shift key and the Ctrl key draws a perfect
square symmetrically around the first point.
Three-point circle
Click on three points around the region of interest, a circle will
appear, passing through the three points.
Circle
Use this in the same way as the Rectangle tool, to draw ellipses.
circle or hold the Ctrl key to draw symmetrically around the first
point. Holding both the Shift key and the Ctrl key draws a perfect
circle symmetrically around the first point.

Polygon
A single left mouse click creates a mark. Define the region of
interest by using as many marks as required. Right clicking after the
final mark then draws straight lines between the marks in the order
they were created.
Freehand
Hold the mouse key down and draw freehand around any region of
interest, then release the mouse button. The start and end points of
the freehand line are automatically joined by a straight line to
complete the enclosed region.
Odd shaped regions can be defined as described above. However,
it is also possible to create some geometric shapes by merging
standard shapes together, see below.
Action
Add
Click to add the current shape.
Delete
Click to delete an overlapping section.
Draw a shape, then click Add. Draw an overlapping shape, then
click Delete. The area overlapped by the second shape is deleted.
A shape may be modified many times in this manner.
Merge
Click to merge the currently selected shapes.
click Merge. Many shapes can be merged together in this manner.
Keep
Click to keep only the current overlapped area.
click Keep. Only the area overlapped by the second shape is kept.
A shape may be modified many times in this manner.
12.3.1. Drawing tools - basic operation

The following procedure outlines the basic operation of the drawing tools:
1. Obtain an X-ray image.
2. Select the Analysis mini tab > Drawing Tools tab.
3. Select the required Shape draw tool, then move the cursor across to the image.
4. Choose an appropriate Action.

5. Draw as many shapes as required, adding each in turn by clicking the Add
button.
Even if the shapes overlap, the percentage voiding is calculated for each one.
This means (for example) that the whole area of a die can be measured and
then perhaps a central region.
6. Click the Clear button to clear all of the shapes drawn.
12.4. Void Measurements

Some of the additional features and options available in this section are less
relevant to ball void measurements and of more value for area void measurements,
but may still be useful in difficult situation.
'Voiding', i.e. flux or air pockets, are usually very distinctive because of their lower
density compared to the solder material. Some BGA examples are shown below:
Other circular features can also exist inside the balls depending on the process.
However, these are often extremely faint and can be taken as voiding.
Select the Void Measurements tab.
A range of controls are provided (see page 123).

You can measure the percentage voiding in any defined area, or areas. For general
void measurement:
1. Click on the center of the dartboard to set to view from straight above the part.

2. Select either:
 The correct recipe for this measurement (see page 89), or:
 A voltage and power combination, along with any image enhancement and
frame average to obtain the clearest possible image of the voids.
3. Draw around the object of interest to define it using the Drawing Tools (see
page 120).
4. Choose the appropriate technique for detecting the voids:
 Threshold detection (see page 129) - this incorporates simple gray scale
threshold measurements to identify the void.
 Blob Detector (see page 132) - this uses a more accurate means of
detection designed for devices with a low gray level variance.
5. Export the analysis data, if required (see page 136).
12.4.1. Void measurement controls

The Void Method controls on the Void Measurement mini tab are shown in the table
below.
Further controls controls on the Void Measurement mini tab are covered in these
topics:
 Void Indicators (see page 127)
 Void Limits (see page 128)
 Void Data (see page 128)
Certain controls are only displayed when a particular void detection method is
selected.
Threshold Set this slider to manually set the X-ray intensity level as
appropriate to define the voids.
The number shown at the top of the slider is the current threshold
value.
As this slider is moved, the results are seen in real time on-screen
as a change in the definition of the voids by a colored outline.
This slider is only active if Manual is selected from the drop down.
Clear
Click to clear the current void information from the X-ray image.
Voids
Click to find the voids based on the current configuration settings.
Void Method
Auto
Click to establish some system 'best guess' base settings prior to any
manual fine adjustment.

Threshold Select this method to use simple gray scale threshold measurements to
identify the void. Choose a void detection method from the drop down
(see below).
Drop down Select an appropriate void detection method. Selecting an option
dynamically updates the detected voids, so the best choice can be
made for the image displayed. Some options may work better than
others and will be affected by the varying gray level densities of the
image.
 Auto
 Adaptive
 AutoAdaptive
 Minimum
 Otsu
 MaxEntropy
 Manual
The list above is complete. If options are not displayed, they may have
been disabled in the More Options screen (see page 38).
Blob Select this method to use a more accurate means of detection
Detector specifically designed for devices with a low gray level variance.
Thick Set this checkbox to enable the identification of individual voids in thick
Solder solder paste components, e.g. BGA ball analysis and pads analysis.
Thin Solder Set this checkbox to enable void measurements in solder paste under
components and heat sinks.
Min Void This determines how small a region of bright connected pixels (void)
can be relative to the size of the region which is analyzed.
Max Void This determines how big a region of bright connected pixels (void) can
be relative to the size of the region which is analyzed.
Contrast This determines how the Blob Detector uses intensity contrast
Multiplier information to classify a point on the picture as part of a void or not.
Size Each point or pixel on the picture is analyzed to determine if it is part of
a void or not. As part of this analysis, the general intensity of the area
around the point is considered and compared with the central point.
This control specifies the size, in pixels, of each side of a square area
around the central point. In general, this must be bigger than the largest
void expected or else the central part of the void may be ignored. If it is
too large, say as large as the part, then the changes in background
intensity that are intended to be rejected may be included as part of the
void.

In the image below:

 The red point in the image below represents the point of analysis.
 The green rectangle represents the size of the square being
considered.
 The gray area represents the void.
If the size of the square being considered is too small, then the center
of large voids (1) is not counted as they look the same as the
surroundings.
Multiplier Each point on the picture is analyzed to determine if it is part of a void

or not. As part of this analysis, the general intensity of the area around
the point is considered and compared with the central point.
This control determines how strong the difference in intensity must be
in order to be taken as void. The value set is used, along with a
statistical calculation of the distribution of intensities in the area, to
determine if the point under consideration is part of the void.
 With the multiplier set higher, some fainter parts of the void (2) are
missed.
 With the multiplier set too low, noise and very faint features (3) are
included.

Original Multiplier set too high
Original Multiplier set too low
Threshold The multiplier adjustment is very sensitive in detecting fluctuations in

intensity. However, in some parts of the sample there may be situations
where there are no voids within the area of consideration. In this case,
it is likely that the system will start to detect small fluctuations in
intensity that are not part of any voids.
This control allows elimination of these unwanted hits and is usually set
to a starting value of 4 whilst the other controls are adjusted.
If it is not possible to eliminate unwanted voids by the use of the other
two controls, then start to increase this value, or increase the image
averaging.
Original Threshold set too low

Void Indicators
The results of adjusting the following sliders/controls are shown in their effects on
the voiding calculation in real time.
Edge exclude This is used to remove a specific area around the perimeter of the
shape from the analysis and is expressed as a percentage of the
selected size. Typically, 10 to 15% is a good setting to use for BGA
balls.
Largest Voids As heat dissipation is often an important property of die attach, this
control allows the user to select only the largest of the voids for
analysis. For example, a setting of 5 means that only the largest 5
voids are indicated on-screen.
Note: The total void calculation shown on-screen will now ONLY be
for the total for the number of largest voids selected. Remember to
return this slider to the far right, All, position, after the analysis to
ensure that future measurements calculate the true total voiding.
Min Void Voids below a certain size may be better removed from the analysis.
As these voids individually are a very small percentage of the area,
this control is limited to 2.5% of the area.
Max This is used to remove faint features from the analysis. It operates
Eccentricity under the assumption that true voids in thick solder are pseudo-
elliptic in shape.
The slider can assume values from 0 (i.e. any bright region which is
not a circle is a faint feature) to 1 (i.e. any bright region which is not a
straight line is a void).
Min Convexity Set this checkbox to remove faint features from the analysis. It
operates under the assumption that true voids in thick solder are
convex regions.
The control can assume values from 0% (i.e. any bright region is a
true void) to 100% (i.e. only a bright region whose contour is a
convex polygon is a true void).

Void Limits
If the Void Limits are set to 0.0, the measurements are made on-screen without
highlighting any passes or fails. Measurements greater than these limits are
indicated in red, otherwise the measurements are green. The Ind value is shown in
brackets.
Area% Set this checkbox to enable the Void Limits function.

All Enter the allowable percentage for all voids.
Ind Enter the allowable maximum percentage for an individual void.
Ind Ø Set this checkbox to allow for an indicated diameter of voids to be
measured.
Two fields are provided for the measurement limits to be set as
either µm or %. Enter appropriate values as required.
This option is enabled in the More Options screen (see page 38).
Void Data
Save
Click to save the results displayed on the screen to a .csv or Excel
(.xlsx) file.
Test Sample Enter appropriate text. This is added to the 'Test Sample' column in
ID edit box the .csv file.
Number the Set this checkbox to add an ID number to the features displayed on
features the screen.
Show Set this checkbox to allow the voids to be shown as a true circle with
minimum the smallest enclosing diameter rather than the true void outline.
enclosing
circle

12.4.2. Threshold detection

There are three threshold detection methods available:
 Standard automatic (see page 129)
 Manual (see page 130)
 Adaptive (see page 131)
Three alternative automatic threshold options can be enabled in the More Options
screen (see page 38). By default, they are disabled.
 Minimum
 Otsu
 MaxEntropy
Standard automatic method

This auto detection method is typically used where there are many separate
selection shapes on the screen, all requiring a different intensity setting.
In the example below, two regions on the screen have been selected. However,
using the Auto button and the manual Threshold slider, it is impossible to find an X-
ray intensity that is suited to both regions, because the void intensity for each is
significantly different.
When Auto is selected, the two regions are analyzed separately and an intensity
appropriate for each is chosen.
1. If analysing BGA voids, complete finding the ball outline (see page 100).
2. Select the Analysis mini tab > Void Measurements tab.
3. Select Void Method > Threshold.
4. Select Void Method > Auto (in drop down list).
5. Set the Void Indicators > Edge exclude slider to 15%.
The edge of the ball is usually significantly lighter in grayscale (density) than the
center, due to the solder ball being thinner at the edges compared to the center,
when imaged from the top down. Therefore, if a certain amount of the edge of
the ball is not excluded from the analysis then this lower density edge region,
because it has a similar grayscale value to true voids in the central portion of the
ball, will be included incorrectly in the total void percentage value for that ball.

Setting the Edge exclude slider to 15% (typically, otherwise use in the range 10 -
20%) excludes this low density region from being included in the voiding
calculation. The results of adjusting the slider are shown in their effects on the
voiding calculation in real time.
Note: Although the void measurement area is being reduced with this slider, the
final void percentage is calculated as a function of the whole ball area.
Furthermore, if a true void is located within this exclusion region then it is not
calculated into the total and therefore an error bar in the void measurement data
must be understood.
6. Set the Void Indicators > Largest Voids slider to maximum.
7. Set the Void Indicators > Min Void slider to minimum.
8. Set the Void Limits > Area% checkbox.
9. Set the respective Void Limits > All and > Ind values.
It is normal for BGAs to measure the overall voiding percentage. Although it is
possible to fail based on the largest individual (Ind) void found.
Note: If the Limits are set to 0.0, the measurements are made on-screen without
highlighting any passes or fails.
10. Click the Voids button.
A typical result is shown below:
The largest individual void for each BGA ball is shown in brackets. If the value is
greater than the set limit, it is shown in red.
Note: Measurement limits should be set to tighter values than may be required
for production standards to take into account edge exclusion and void size
variation caused by magnification differences depending on the position of the
void within the ball.
11. If the void percentage value is not displayed:
Set the Analysis mini tab > User Drawn Void Measurements tab > Show void
statistics checkbox.
Manual method
If the voids are not outlined correctly, then a manual adjustment of the void outlines
can be done, as follows:


3. Select Void Method > Manual (in drop down list).
4. Click the Auto button to move the Threshold slider to the best guess position as
a starting point.
6. Make any adjustments to the void intensity by moving the Threshold slider.
7. Adjust the Void Indicators (see page 127).
8. Set and adjust the Void Limits (see page 128).
Adaptive method
The adaptive method provides a better method for calculating void percentage
compared to the single threshold method when the background absorption in the
image is varying. For example, consider a die that is not co-planer to its substrate
and which causes a variation in the thickness of the die attach under the die. This
causes a density variation in the background level over the die. Measuring void
percentage under these conditions using a single grayscale threshold to define the
voids would be inadequate in this case as the single threshold used to define what is
a void will not adjust to take into account the varying density of the background over
the die.
With the adaptive method, the grayscale level chosen to define the voids changes
across the analysis area. This is because the system looks at the average grayscale
in the immediate vicinity of each pixel. This method is more often used when
analyzing large voiding areas, such as under die-attach, where the density
background across the measurement is more variable, for example due to
noticeable variation in material thickness. This method may be used for BGA
analysis.
3. Select Void Method > Adaptive (in drop down list).
A set of manual sliders is shown that allows you to set their respective levels as
appropriate to define the outline of the voids:
 Size
 Multiplier
 Threshold
Selecting AutoAdaptive from the drop down list, disables the manual
adjustments for the Adaptive void detection method.
4. Click the Auto button to move the sliders to system 'best guess' positions as a
starting point.
6. Make any adjustments to the voids by moving the manual sliders.
7. Adjust the Void Indicators (see page 127).
8. Set and adjust the Void Limits (see page 128).

12.4.3. Blob Detector

The blob detector provides a better method for computing void percentage
compared to threshold-based (see page 129) methods, when high density materials
(low contrast images) must be analyzed, and both foreground and background
absorptions are varying. These conditions make the identification of voids very
challenging unless the void detector could process intensity information as well as
local contrast information. Blob detection offers this capability.
The following topics provide step by step procedures for measuring voids using Blob
Detection.
Measuring voids by means of blob detection

Voids measurement by means of blob detection is performed as follows:
1. Select a voltage and power combination, along with any image enhancement
and frame average to obtain the clearest possible image of the voids.
2. Define the area(s) of interest using the drawing tools.
4. Select Void Method > Blob Detector.
5. Select an option:
 Thin Solder (see page 133) - choose for void measurements in solder paste
under components and heat sinks.
 Thick Solder (see page 135) - choose for BGA balls analysis and pads
analysis.
6. Set the Void Limits > Area% checkbox, if required.
7. Set the respective Void limits > All and > Ind values, if required.
Typical results of void percentage computation in thick and thin solder paste
components are shown below:
Thick solder paste analysis (BGA ball analysis) Thin solder paste analysis

Note: The above measurements were made on-screen without highlighting any
passes or fails by setting Void Limits to 0.0
Thin Solder option
The technique provides an efficient solution for void percentage calculation in high
density materials (low contrast image analysis). Each point or pixel on the picture is
analyzed to determine if it is part of a void or not. As part of this analysis, information
about the local intensity contrast of each voiding region is extracted and used to
provide a very accurate identification of individual voids.
There are a number of controls associated with this method. The following explains
and illustrates the effects of these controls.
Max Void slider
Typically, you would set the Max Void slider to 5%, if the largest void is expected to
be less than or equal to 5% of the area which is under analysis. With this slider set
to the default value 5%, an accurate detection of each void region on the image will
be achieved. However, a bigger value should be used if the blob detector returns a
void outline which is smaller than the true void contour, i.e. some parts of a void
region have not been included, see below:
 (a) some parts of a void region are not detected because the size of the largest
void expected was under-estimated, (Max Void = 5%)
 (b) increment of the max void value allows a more accurate void identification,
(Max Void > 5%).
The above shows that accurate void detection can be achieved by setting the Max
Void slider to a value that is greater than 5%. However, with Max Void value set too
high, some faint features (Figure 4.b) may be included. These features are false
voids and could generate a less accurate void measurement. Therefore, it is
advisable to set the Max Void slider to a value as close as possible to the minimum
value (3%) in order to achieve a more accurate void measurement, see below:

 (a) Void measurement returned by the blob detector when setting the value of
Max Void in the range [3% - 12%]
 (b) Void identification achieved with Max Void set to a value greater than 12%.
Faint features are included in the void measurement.
Contrast Multiplier adjustment slider
In general, with the Contrast Multiplier slider set to less than or equal to 25, the blob
detector provides a good void identification. However, higher values should be used
to include more low contrast voids in the void percentage computation. As for Max
Void, setting Contrast Multiplier too high allows detection of faint features. Typical
results of void percentage computation obtained with Contrast Multiplier set to
values 10, 25, and 75, are shown below.
Edge exclude slider

This is used to remove a specific area around the perimeter of the shape from the
analysis and is expressed as a percentage of the selected size. The results of
adjusting the slider are shown in their effects on the voiding calculation in real time.

Thick Solder option

The technique provides an efficient solution for the identification of individual voids
in thick solder paste components, for example, BGA ball analysis. Each point or
pixel on the picture is analyzed to determine if it is part of a void or not. As part of
this analysis, information about the intensity contrast and the pseudo-elliptic shape
of each voiding region is used to provide a very accurate void percentage
calculation.
There are a number of controls associated with this method. The following explains
and illustrates the effects of these controls.
Min Void slider
This control determines how small a region of bright connected pixels (void) can be
relative to the size of the region which is analyzed. It is very useful when dealing
with void percentage computation in BGA analysis and allows you to remove voids
below a certain size from the analysis. As these voids individually are a very small
percentage of the area, the control is limited to 2.5% of the area.
It is advisable to set this slider to 0, if the area under analysis is not a solder ball.
Max Void slider
In general, with the Max Void slider set greater than or equal to 10%, the blob
detector returns an accurate detection of each void region on the image. However,
higher values should be used if the largest void is expected to be greater than 10%
of the area which is analyzed.
Contrast Multiplier slider
In general, with the Contrast Multiplier slider set to 75, the blob detector returns a
very accurate void measurement. Lower values should be used if the faint features
are included in the measurement by the detector. However, setting Contrast
Multiplier too low might result in missing the detection of true void regions. Typical
results of void percentage computation obtained with Contrast Multiplier set to
values 75, 20, and 5, are shown below.

Edge exclude slider

This control is used to remove a specific area around the perimeter of the shape
from the analysis and is expressed as a percentage of the selected size. Typically,
10 to 15% is a good setting to use for BGA balls.
Max Eccentricity slider
This control is used to remove faint features from the analysis. It operates under the
assumption that true voids in thick solder are pseudo-elliptic in shape. The slider can
assume values from 0 (i.e. any bright region which is not a circle is a faint feature) to
1 (i.e. any bright region which is not a straight line is a void).
Min Convexity checkbox
This control is used to remove faint features from the analysis. It operates under the
assumption that true voids in thick solder are convex regions. The control can
assume values from 0% (i.e. any bright region is a true void) to 100% (i.e. only a
bright region whose contour is a convex polygon is a true void).
12.4.4. Exporting Data

You can export the analysis results of BGA ball and area voids so they can be used
for SPC purposes. This is particularly useful where an irregular pitch is used for the
BGA balls, or manually drawn analysis areas are used.
Data is exported as follows:

2. Set the Void Data > Number the features checkbox, if required.
If set, the information displayed on screen for each feature during a manual void
analysis is preceded by an ID number (colored blue).
3. Add a Test Sample ID String in the edit box adjacent to the Save button, if
required.
This entry is added to the Test Sample column of the saved data file.
4. Click the Void Data > Save button.
5. Select the destination for the file.
6. Select the required output file type, either:
 CSV files (.csv)
 XLSX files (.xlsx)
7. Click Save.
File save considerations

 If you enter the name of a file that already exists, there is no warning that an
existing file name has been selected. Instead, the data for the new analysis is
appended to the end of the existing file. In this way, the results for several
analysis can be collected into one data file.
 If the Number the features option is not selected and the Save button is pressed,
there is a warning that the saved file will have no numbering information.
 If the Void button has not been pressed, there is no void percentage information
available. In this case, the Save button is disabled.
Further technical information is available, refer to Report export formats (see page
264).

12.5. User Drawn Void Measurements

Select the User Drawn Void measurements tab.
Define Voids Geometry

Selection
Click any drawn object to select it for sizing or re-positioning.
Three-point circle
Click on three points around the region of interest, a circle appears,
passing through the three points.
Circle
Choose one corner of the region of interest and click and hold the
left mouse button. Move the mouse to the opposite corner to draw an
ellipse.
circle or hold the Ctrl key to draw symmetrically around the first
point.
Holding both the Shift + Ctrl keys draws a perfect circle symmetrically
around the first point.
Polygon
A single left mouse click creates a mark. Define the region of interest
by using as many marks as required. Right clicking after the final
mark then draws straight lines between the marks in the order they
were created.
Freehand
Hold the mouse key down and draw freehand around any region of
interest, then release the mouse button. The start and end points of
the freehand line are automatically joined by a straight line to
complete the enclosed region.
Define Action
Add Void Click to add the currently defined void.
Delete Void Click to delete the currently defined void
Three displays show void statistics, these are read-only.
Two checkbox options are available, set as required:
 Treat overlapping areas separately
 Show void statistics

12.5.1. Adding and removing void areas manually

1. Define the shape of the joint area using the standard automatic detection
method (see page 129).
2. Set the following options, as required:
 Treat overlapping areas separately
 Show void statistics
3. Select one of the drawing tools as appropriate.
4. Define the void you want to analyze by drawing an outline shape around it.
5. Click the Add Void button.
6. Identify and define any further voids, as required.
7. Use the Delete Void button to remove it from the image, if you mark a void
incorrectly.
12.6. Template Based Analysis

The Template Based Analysis provides functionality which allows you to define the
shape of a device using the CAD editor, or to import an existing CAD file, then
execute a series of instructions to analyze the device under inspection.
Select the Template Based Analysis tab.
12.6.1. Creating a Template Based Analysis

2. Enter a Name for the new routine.
3. Click the Import button and select the required CAD template from the library, an
example is shown here:
4. Use the Browse button to select the required text description file (see page 140).

An example description for the device under test (shown above) might be:
FIND ROI(A+B+C+1+2+3)
VOID ROI(1) Pad1 10 65
Once the text description file is loaded, the contents are displayed in a window.
5. Click the Save routine button.
Text Description File

The text description file consists of text commands for what to identify and inspect.
A typical file would consist of five space delimited instructions. These are:
Instruction Description
Action The instructions for the routine to carry out, which consist of key
words such as:
 FIND - Template matching only, no measurement is carried out.
This line is always needed and must be the first line for any text
file.
 VOID - Measures the void percentages within the defined object.
 RING - Measures the void percentages and identifies any breaks
in the solder for a hollow object, for example, the outer can solder
joint for a MEMS device.
Template The title of the object. This must include the enclosing object title.
Label The inspected object label to use in the results.
Void Limit The value used here would depend on the customer specification and
is the total percentage of voiding allowed for each defined object.
Solder This is the minimum amount of solder paste coverage allowed for the
Paste Limit defined object. If set to 0, this is ignored.
Using the previous example, the text file breakdown would appear as:
 FIND ROI(A+B+C+1+2+3) - Find the template labeled ROI with objects titled
A,B,C,1,2 and 3.
 VOID ROI(1) Pad1 10 65 - Measure the voids within object 1, call it Pad1 in the
results and use a maximum total void limit of 10% for the void analysis and a
minimum of 65% solder paste cover.
12.6.2. Selecting and Running the Template Based Analysis

A Template Based Analysis can be run as a single automated inspection, or as part
of an Automatic Inspection Routine (AIR) (see page 165).
To run the Template Based Analysis as a single automated inspection, do the
following:
1. Ensure the device under test is displayed on the Inspect screen and suitable
voltage and power settings are used to give a good contrasting image.
2. Select the Template Based Analysis mini tab.
3. Click the Open Routine button and select the required routine.

4. Click OK.
5. Click the Run button.
Once the inspection completes, a pop-up window is displayed with the option to
view the HTML report via a hyperlink.
12.7. CAD Template Editor

The CAD editor is a simple yet flexible tool for modifying Component Alignment
Design data imported from files (Typically, AutoCAD DXF), or creating templates
from scratch by drawing shapes over the top of the corresponding X-ray image. The
accuracy of the CAD data is maintained to a minimum of three decimal places and
all drawing tools operate at this precision.
The CAD editor embraces the notion of ‘layers’ of related shapes for ease of
selection and visualization. The interpretation of the shapes on each layer or how
the shapes are distributed across layers is mostly up to the individual user.
However, different analysis may require some layers to be marked in certain ways to
indicate a level of preprocessing by the user to speed the analysis.
The CAD editor employs a standard coordinate system with X increasing from left to
right and Y increasing from bottom to top. All units are in metric millimeters inside
the editor environment although the CAD data import dialog does have options for
importing and converting other units.
When you have finished importing, or creating a CAD template in the CAD editor, it
must be exported to the template library to make it available to the analysis engine.
Select the CAD Template Editor tab.
12.7.1. CAD editor controls
Top-level functions
The CAD Editor environment is controlled by the following top-level function buttons:
Button Description
Clear
Click this to remove all the current design data and create an empty
layer ready for editing.
Import
Click this to import design data from an existing file.
Export
Click this to write the current design data to a file in a Dage
proprietary format.
Merge
Click this to append further data (from a file) to what is currently
loaded.

Editor Modes
The editor operates at any given time, in one of four edit modes which define how it
interacts with the rest of the X-ray application. The following radio buttons are
available:
Mode Description
Hide All the CAD layers are invisible and do not respond to any input.
Float All the CAD layers are visible and clicking and dragging moves the X-ray
image behind the layers. This is useful for aligning the image with the CAD
data.
Lock The CAD layers are visible and move with the X-ray image as you click and
drag.
Edit The CAD layers and/or X-ray image cannot be clicked and dragged and all
the edit tools are available.
Layer Tools
The layer structure is visualized by the layer list:
Each layer has the following state attributes:
Column Description
The color in the box is randomly generated when a layer is created.

However, click once in in the box to access a color change dialog.
Click this icon to show or hide the layer.
This icon shows the layer is visible, but cannot be edited.
Layer Attributes used for analysis interpretation.

type
It is useful to allow you some level of preprocessing of the CAD data in
order to minimize the decision phases of a particular analysis and
speed up the analysis time. Different analysis may use all, some or
none of these layer attributes. It completely depends on the analysis
type.
This column indicates one of four attribute states:
Neutral or decorative
You may add any shapes or text that helps with device identification or
alignment/placement. These layers do NOT take part in any analysis
and only have a minimal draw overhead.
Targets/Objects
All shapes on this layer form the input to the image analysis engine, the
interpretation of which depends entirely on the analysis type.

Column Description
Fiducials
These shapes define references that are used by the analysis engine to
generate placement and/or alignment/rotational data.
Region Of Interest
These shapes define areas that contain target shapes that are of
particular interest during analysis (or conversely, are of NO particular,
or dubious interest).
The buttons to the right of the layer list are used for manipulating the CAD layer
structure, as follows:
Button Description
Rename
Click to set or change the name of the current layer.
Add
Click to create a new layer with a randomly assigned color.
Delete
Click to remove the current layer.
Save As
Click to save the current layer to file (Dage’s proprietary XML
format).
Move DN
Click to move the current layer down one.
Move UP
Click to move the current layer up one.
Layers are very useful for managing large amounts of related visual data. However,
as the CAD data gets, potentially, very substantial, the CAD editor has extra tools to
help manage these layers visually.
These tools are found immediately below the layer list.
Button Description
Show All
Click to display all shapes on all visible layers.
Show Selected
Click to display only the selected shapes.
Show Invert
Click to toggle the current show state of all shapes.

There are four checkbox controls immediately below the Show buttons. These
enable some useful productivity features designed to de-clutter the display when
doing fine edits:
Function Description
Enable layer Set this checkbox so when a shape is selected, its layer is
auto-select automatically selected as well.
Auto-hide Set this checkbox to hide all but the current layer you are working
unselected on.
layers
Enable polygon Solid polygons can obscure detail below them. Set this checkbox
fill to allow you to disable polygon filling so obscured detail can be
viewed.
Show Labels Text labels have a fixed font size and can quickly hide small
details if there are enough of them. Set this checkbox to allow you
to hide labels when editing.
CAD Edit Tools

These tools are split into two groups:
 Creation (see page 144) - These tools draw or erase a shape.
 Replication (see page 145) - These tools replicate existing shapes.
All CAD Edit tools are available on a movable window that is automatically displayed
when a layer is added to a template.
More advanced tools are available when operating in Engineer level access. These
are displayed by setting the Show advanced edit options checkbox. Refer to
Advanced Tools for further details (see page 147).
Creation Tools
The following CAD Edit tools are available:
Tool Description
Select
Selects the shape closest to the mouse click, while obeying the layer
selection rules.
 For rectangles and ellipses, selection occurs at the shape center or
on the shape edge.
 For polylines and polygons, selection occurs along the edge of the
shape or at any vertex.
Once this tool is engaged, left-clicks can be used to select single shapes
or left-click + Shift to perform multiple shape selection (multi-selected
shapes are shown in white with a yellow rectangle bounding the
selection). Multi-selection is accomplished by right-dragging a bounding
box around the shapes to be selected.
Once a shape is selected it turns white with small, red drag

Tool Description
handles/vertex markers which be dragged to re-position/re-size the

shape.
Shapes are de-selected by right-clicking when using any creation tool
including the select tool. When using the select tool, left-clicking over
empty space de-selects the shapes. At any time, selected shapes can
be deleted by pressing the DEL key.
Ellipse
This draw an ellipse (or circle).
Rectangle
This draws a rectangle (or square).
Polyline/Polygon
This draws a polyline (an unclosed polygon) or a polygon shape.
 Polyline drawing is terminated by right clicking when defining the last
vertex.
 A polygon is closed by left clicking on the start vertex (a yellow
square appears around the first vertex when you are close enough to
it to close the polygon).
3-Point Circle
This defines a circle from three mouse clicks around the circle
circumference.
Eraser
This works by ‘painting’ out the shapes that you want to erase. It is very
useful for deleting fine detail, or when working close in.
Zoom and Centre
Click to zoom and centre on selected shapes. If no shapes are selected
then all shapes are implied.
For both the Rectangle and Ellipse tools, holding:
 the Shift key while drawing, produces a square or a circle.
 the Ctrl key while drawing, centers a rectangle or an ellipse from the center
out (rather than a corner).
All shapes except Polygon can have a line width assigned via the shape attributes
editor, and only a polygon shape can be filled.
Replication Tools
The following CAD Edit tools are available:
Tool Description
Linear Copy
The shape is copied along a line starting at the first left mouse button
hold (which selects the shape as well) and ends on a point defined by the

Tool Description
left mouse button release. The number of copies defaults to five which
can be modified by the cursor keys before the second point is defined.
Pressing the right arrow cursor key increases the number of repeats
while the left arrow decreases the number.
Array Copy
Similar to the linear tool except three click-release events define two
orthogonal axes of a rectangle or a regular trapezoid to create an array of
shape duplications. The first linear copy is made as before; left mouse
button and hold on the object to be copied, drag the cursor to the
required end point, use the left and right arrow cursor keys to define the
number of object repetitions, and set the point by releasing the left mouse
button. Dragging the mouse cursor to a third location, usually at right
angles to the first set, duplicates the entire row.
The use of the up and down arrow cursor keys defines the number of
repetitions. Set the final point by a single left mouse click. The entire
array is then outlined in a yellow box to indicate a complete set of
objects.
Irregular Array Copy

Similar to the array copy except that four left mouse button click events
are used to define an irregular or distorted array of duplications. The
cursor keys control the number of duplication along each axis in the
same way as the array copy tool. The first left mouse button hold selects
the object to be copied, dragging the cursor to the first point and
releasing the mouse button to set the first line.
Moving the cursor again starts to duplicate the line of objects. A second
left mouse button hold and drag allows the lines to be skewed as
required. Releasing the left mouse button sets the final point.

Tool Description
In all cases, the editor reverts to the previous creation tool after one use of a
replication tool to stop unexpected array duplications happening.
Advanced Tools
When operating in Engineer level access there are more advanced tools available
for use when creating or editing CAD files. These are accessed by setting the show
advanced edit options check box.
Most of these controls are self-explanatory:
Tab Description
Data This allows accurate positional and size adjustments for each object:
Align This allows objects to be aligned in a specific way or rotated by 90°

steps:

Tab Description
Grids This allows an alignment grid to be displayed. You can also adjust the
grid various grid attributes:
If Grid snap is active, it can prevent small features from being drawn
easily.
Shape Attributes Editor

Double-clicking a selected shape on one of its selection points opens a shape
attributes editor dialog.
This allows you to specify the color, line width (if applicable) and assign a label to
individual shapes. You can also assign any color and line width changes to all
similar shapes on the same layer.
 To change the shape Color, double-click the color box to open a color change
dialog.
 Edit the Line Width value directly in the edit box.
 To apply these changes to all similar shapes on this layer, set the Apply to ALL
shapes on this layer checkbox.
 To create a label, type the text for the label into the Prefix edit box and select an
Auto ID Mode from the drop down:
 Manually assign ID
 Increment ID on copy

 Auto-assign next ID
 Auto BGA/Array assign ID
 Edit the ID number directly in the edit box to change the starting value.
 To place the label relative to the shape center, click in the corresponding Align
grid cell. The selected cell turns red to indicate the current placement.
The following image shows a single ellipse with a line thickness of 0.3mm, a label
prefix of 'U' and Increment ID on copy selected as the Auto ID Mode. The shape
was replicated using the regular array tool to define a trapezoid array of ellipses.
Note how the label ID value was automatically incremented each time the shape
was copied. The shapes are also multi-selected, as shown by the bounding yellow
rectangle.
Template Library Access

Multiple templates for different CAD-driven analysis are stored in the Template
Library which is the only place that the analysis engine has access to CAD
templates.
The library access functions are as follows:
Save to library
Click to save the current CAD template to the library.
Once a CAD template is created, either by direct file
import or by using the CAD editor’s creation tools, it must
be saved to the template library.
However, if you wish to save a 'work in-progress', use the
Save to file function to write a temporary copy of your work
to a file in a proprietary XML format where it can be re-
loaded at anytime.
Load from library
Click to load a selected template to the editor.
Once a template is saved to the template library, it can be

re-loaded into the editor. However, it is a single, closed

shape that cannot be further edited except for placement.
The Template Library Viewer dialog is displayed. This
allows you to navigate to the required template location. It
also provides a layer list and a preview window for file
confirmation (see below).
Flip data on load Set this checkbox when a board loads into the X-ray
machine upside-down. It flips the CAD data vertically (Y
axis) when a template is imported from the template
library.
The Load from Library button displays the Template Library Viewer dialog. This
dialog is also displayed during the setup of an analysis to allow you to select the
CAD template to use for analysis. The controls and functions it provides are as
follows:
Control/Function Description
Library This displays a hierarchical tree diagram of the library. Expand

navigation tree and collapse controls are provided. Use this display to navigate
to, and select the required CAD template file.
Layer list This displays a non-editable layer list for the selected template
file.
Preview window This provides a simplified preview image of the selected
template file.
Show labels on Set this to show any labels included in the selected template in
preview the preview window.
Information This shows any authoring information included in the selected
template file (if set).
OK Click to load the selected template into the editor, and close the
dialog.
Cancel Click to abort template load operation and close the dialog.
Delete Click to delete the currently selected template.
Load from file Click to load a Dage proprietary XML format file.
Save to file Click to save a template to a Dage proprietary XML format file.
Save all to file Click to save all templates to a Dage proprietary XML format
file.
12.7.2. Creating a CAD template

The system needs to be in either Supervisor or Engineer level access mode to
access the CAD tools required to create a new CAD template file.
1. With the device under test displayed on the Inspect screen, set the X-ray Tube
voltage and power to give a good contrasting image.
2. Select the CAD Template Editor mini tab.

3. Select Add to add a new layer and automatically open the CAD Edit Tools
window.
4. Use the CAD Edit Tools to create the required design on the screen. For
example: select the rectangle tool and while holding the left mouse button down,
drag from one corner to the opposite corner to define a rectangle.
5. Double-click the selected shape on one of its selection points to open the Shape
Attributes Editor.
6. Specify the shape color and line width (if applicable). You can assign these
color and line width choices to all similar shapes on the same layer.
7. Assign a label to the shape and position it, as required.
8. Continue using the CAD Edit tools to create the required template shape for
inspection, assigning each individual shape with a unique label.
9. Set the layer as a Target/Object and lock it.

10. Add a new layer and set it as a Region of Interest.

11. Set this region as a rectangle which encompasses the entire device under test.
12. Click the Save to library button to save the completed CAD template.
13. Enter a suitable Template name and set any other options, as required.
14. Click OK.
12.7.3. Importing an existing CAD template

1. Open the CAD Template Editor mini tab.
2. Click the Import button.
3. Select the CAD file to import.
The system supports the following CAD file formats:
 Gerber (*.grb, *.art)
 Dage XML (*.xml)
 Autodesk DXF (*.dxf)
 Generic CSV (*.csv)
 Comma separated TEXT (*.txt)
4. Click OK.
5. Rename the layers, if required.
6. Click the Save to Library button to save the imported CAD Template to the
library.


155
13. Using the Measurement tools

Select the Measurement mini tab.
The Measurement screen has a number of controls to help in precise positioning of

the part. The functions of these controls are shown in the table below.
Certain controls are only displayed when a particular measurement method is
selected, or depend on what features have been enabled in the More Options
screen (see page 38).
Measurement Types Select the required measurement type from the list:
drop down  Distance (see page 158)
 Distance (mm) and angle (see page 159)
 Distance only (mm) (see page 160)
 Wire sweep (see page 160)
 Perpendicular distance (see page 161)
 2x Perpendicular distances (see page 161)
 Pixel graph (see page 162)
An alternative method of accessing the above measurement
tools is available, as follows:
 Right mouse click anywhere in the image viewer. This
brings up the menu options.
 Select Measure. This displays the measurement tools list.
 Select the required tool.
Click to start the measurement. The green indicator lights
when function is active.
Click to cancel the last measurement made.
Click to zero the current X/Y position and length values.
X and Y Distance These display the current X and Y distance values.

Length This displays the current length.
Click to set the Field Of View.
Current Location
The current location display can show either Absolute positions or Relative positions
based on the location of the mouse cursor. This is set using the Show absolute X-Y
position option from the More Options screen (see page 38).
X and Y Positions This is the absolute X and Y co-ordinate positions for the
center of the Inspect Screen displayed in millimeters.
The datum, or 0,0 point, for this positioning is the front left
hand corner of the sample tray. This equates to the bottom

left corner of the Navigation Map as seen on the screen.

You can type specific X and Y co-ordinate locations into the
respective numeric field and then drive the sample tray to
that position by clicking the Goto Position button.
Click to drive the sample tray to a specific position.
Relative current location
If the Show absolute X-Y position option is not set from the More Options screen, the
following three sets of live readouts are displayed, in millimeters, based on the
position of the mouse cursor over the image. The displays are inactive until the
mouse cursor is over the image.
The height of the part (see page 56) must be set in order to calibrate the
measurements.
Offset from image This is the position of the cursor from the bottom-left corner
of the image.
Offset from scan This is the position of the cursor from the bottom-left corner
of the manipulator.

Using the Measurement tools 157
Offset from graticule This is the position of the cursor from the cross-hair (it must
be turned on, see below).
Click to toggle the display of a grid on the image.

The grid consists of different colors and resizes as the image
is zoomed in and out. Red lines are a matrix of 2mm, yellow
lines are 1mm and green lines are 0.1mm grids. The smaller
grid disappears once a certain zoom level has been
exceeded.
Click to toggle the display of a set of cross hairs on the
image.
Use this feature for higher measurement accuracy.
Tilt Angles
The dartboard can still be used to adjust the angle of view as normal.
The numbers displayed reflect the current position. They can be changed by entering
a new number, or nudged by using the up/down buttons.
This sets the angle of the detector, in degrees, from the
vertical.
This defines the position the detector takes around the

inspection point, in degrees. As you face the front of the
system, 0° is East, 90° is North, 180° is West, 270° is South.

The settings defined numerically are reflected exactly in the

dartboard.
This sets the height of the feature being inspected. Further
explanation can be found in Setting the height (see page 56).
Jog Control
These controls allow the part to be moved in precise
increments.
There are three groups of four arrows, click on any of the four
arrows to move the part in the required direction by the
specified jog distance. You set the jog distance for each
group by entering a value directly in the numerical box
beneath the controls.
You can select µm (micro-meters or micron) or mm as the
units, simply click the respective button.
Distance
This tool enables point-to-point measurements to be made on the part under
inspection. The two points can be located anywhere within the machine’s working
area.
1. Select Measurement mini tab > Measurement Types.
2. Select Distance from the drop down list.
The Measure button is activated automatically (The green indicator lights).
3. Move to the first point to be measured. Use of the Cross Hair feature is
recommended for accuracy.
Note: For precise alignment, zoom-in on the part.
4. Click the Zero button to zero the position indicator when the first point is aligned.
5. Move to the second point, aligning it in the same way as the first.
The machine displays the:
 Vertical (Y)
 Horizontal (X)
 Point to point (true) distance between the two points

Note: This measurement is independent of the height of the sample as it counts

the number of steps the motors have moved as the sample is moved in the X
and Y directions. However, it requires that the Z-height does not change
between the start and end points of the measurements.
The X and Y distance is displayed as an overlay on the image along with the actual
length between the first and second points. The overlay text color and position on
the screen can be set from the More Options screen (see page 38).
Distance and angle

This tool makes point-to-point measurements on-screen, and can be used without
mechanically moving the part. However, both ends of the measurement must be on
the screen at the same time.
Note: The height must be set (see page 56) for correct calibration.
2. Select Distance (mm) and angle from the drop down list.
3. Click the mouse pointer on the first end point of the distance to be measured.
Then click on the second end point.
4. If you make a mistake, click the Cancel button. This removes the last
measurement made.
The distance and angle measurements are displayed as shown below:
Step 3 can be repeated as many times as necessary to make multiple

measurements on the same image. Saving the image stores the measured data
as part of the image (see page 243).
Note: The angle shown is the angle made between the two measurement points
relative to the frame of the image. The distance displayed is the direct straight
line distance between the two measurement points.
5. Click the Measure button again to clear the measurement(s).
The color of the text and measurement lines can be set from the More Options

Distance Only
This tool makes point-to-point measurements on-screen, and can be used without
mechanically moving the part. However, both ends of the measurement must be on
the screen at the same time.
Note: The height must be set (see page 56) for correct calibration.
This method of measurement works in the same way as the Distance and Angle
measuring tool but only displays the direct straight line distance between the two
measurement points.
The color of the text and measurement lines can be set from the More Options
Wire sweep
This tool measures the percentage bend in bond wires.
1. Check the dartboard is shown with the red spot in the center.
3. Select Wire sweep from the drop down list.
4. Align the part so that all of the wires to be measured can be seen.
5. Point to the start point of a wire and click the left button.
6. Point to the end point of the same wire and click the left button.
A straight line is drawn from the start to end point.
7. Select the point of greatest bend and click the left button.
A straight line is drawn parallel to the reference line and another perpendicular
to the maximum bend point.
The ratio of these measurements is displayed as a percentage near the wire, as
shown below:
measurement made.
Repeat this procedure as many times as necessary to make multiple

Perpendicular distance
This tool measures the perpendicular distance between a reference line and a set
point.
Note: For accurate measurements the feature height must be set and the sample
must be viewed from directly above.
3. Select Perpendicular distance from the drop down list.
4. Adjust the image so the whole part to be measured can be seen.
5. Point to the start point of the reference line and click the left button.
6. Point to the end point of the reference line and click the left button.
7. Point to the required perpendicular point and click the left button.
to the reference line.
The distance measurement between the two lines is displayed, as shown below:
measurement made.
2x Perpendicular distances
This tool measures the perpendicular ratio between a reference line and two set
points.
Note: For accurate measurements the feature height must be set and the sample
must be viewed from directly above.


3. Select 2x Perpendicular distances from the drop down list.
The Measure button is activated automatically (the green indicator lights).
4. Adjust the image so the whole part to be measured can be seen.
5. Point to the start point of the reference line and click the left button.
6. Point to the end point of the reference line and click the left button.
7. Point to the first required perpendicular point and click the left button.
8. Point to the second required perpendicular point and click the left button.
The ratio of the two distances from the reference line is displayed, as shown
below:
The ratio is always the shortest distance as a percentage of the longest.
measurement made.
Pixel graph
The Pixel graph tool enables you to obtain a grayscale plot across a section of the
image.
2. Select Pixel Graph from the drop down list.


3. Point to the start point of the plot and click the left button.
4. Point to the end point of the plot and click the left button.
A grayscale plot of the image between the two points is displayed.
5. Click the Menu button on the plot to:
 Print the plot.
 Stretch the brightness of the plot.
 Set the plot scale (X Axis) in pixels rather than mm.
 Save the graph.
 Exit and close the plot screen.


165
14. Using the Automatic Inspection Routine tools

The system can record a sequence of unique inspection steps that can then be
replayed at any time. This is particularly useful when it is necessary to make
frequent inspections of large quantities of the same product. For example, when
needed as part of production quality control.
It may be helpful to consider the whole automated inspection routine as a roll of film
where every frame is equivalent to a unique position, view and possibly an
automated measurement, within the product under test.
Several identical products can be sequentially inspected in one inspection routine,
providing they all fit within the system inspection area. Furthermore, where each
product contains one, or more, identical sub-units, then these can be inspected in a
single routine. For example, the inspection of a PCB panel containing a number of
identical board images, or inspecting a strip, or strips, with several semiconductor
devices in each one.
The Automatic Inspection Routine Wizard enables the easy configuration of such
routines. The wizard very simply creates a layout template that defines how many
boards (which might also be called products/units/panels/strips/and so on.) are on
the sample tray for each inspection run. It also defines how many patterns (which
might also be called sub-units/images/devices/and so on.) each board contains.
Once the layout template has been defined, you have to create an inspection
sequence for the first pattern of the first board and that same inspection sequence is
then applied to all the individual items in the layout. This can be achieved without
the need for complex programming and debugging and any subsequent modification
made to the original inspection sequence is automatically applied to all identical
objects.
The Automatic Inspection Routine (AIR) is created using a 'golden sample' as a
reference for all inspection criteria.
Note: Throughout this description the term 'board' always refers to the largest
repeated sample object for inspection and the term 'pattern' refers to repeated
objects occurring within a board.

In the example above, there are six identical boards on the sample holder placed in
two rows of three boards. Each board (1) contains two identical patterns (2). During
the layout creation for this arrangement, it is only necessary to define, by mouse
drag, the area of the first board and the first pattern. The position of additional
boards and patterns are then simply defined by double-clicking, with the left mouse
button, on the bottom left-hand corner of the additional objects as they are shown on
a navigation map, or defined using the matrix dimensions.
Note: Boards having two patterns that are identical, but rotated by 180° to each other
must be treated as a single item. Furthermore, the inspection points on each pattern
have to be uniquely identified in the AIR as the inspection point for pattern A cannot
be used with a rotation function applied for pattern B.
The following topics provide detailed information and step by step instructions for:
 Defining the inspection steps (see page 180).
 Inspecting die, BGA and general voids automatically (see page 181).
 Creating or editing an Automated Inspection Routine (see page 188).
 Using automated inspections (see page 204).
 Importing and using CAD data (see page 211).
 Storing data (see page 214).
 Viewing an inspection report off-line (see page 214).
 View results (see page 216).
14.1. Automatic Inspection Routine Controls

All Automatic Inspection Routine (AIR) controls are accessed by:
Selecting the Automatic Inspections Routines mini tab.
This mini tab comprises seven top-level functions and five further tabs (see page
167) that provide more detailed functionality.
Note: The function buttons are unnamed. However, hover the mouse over a button to
display a tool tip that describes the button's function.
The top-level functions are:
Button Description
Save or copy the current routine

This allows you to:
 Save the current routine.
 Save the current routine under a different name.
 Create a copy of the current routine to use as a base for a new
pattern.
A Save as dialog box is displayed.

Using the Automatic Inspection Routine tools 167
Button Description
Open a program
This allows you to select the specific routine to be loaded.
A Choose Program dialog box is displayed.
The name of the currently loaded routine is displayed next to the title.
Choose program(s) to delete
This allows you to delete one or more existing routines (programs).
A Delete dialog box is displayed.
Note: This option also deletes all associated reference images.
Automated Inspection Routine wizard
This starts the wizard for creating Automatic Inspection Routines.
Refer to Creating a new routine (see page 189) for more details on
the wizard.
Cross-hairs
This toggles the display of the cross-hairs on the image display.
These are particularly useful when manually aligning parts during
inspection routines.
Navigation map
This toggles between the navigation map and the live image for the
selected routine.
Import CAD file
This allows you to import an existing CAD file to aid with creating an
AIR. The CAD data must be in XML format.
Refer to Importing and using CAD data (see page 211) for more
details.
Further AIR editor tabs

The five further tabs provide a range of functions, as shown in the table below. The
controls and functions available on each tab are described in individual topics.
Tab Description
Run Automatic Inspections Routines (see page 168)

This displays the controls required to run inspection sequences.
View Results (see page 169)
This displays the controls for selecting and viewing previous results
for the currently loaded routine.
Edit (see page 170)
This allows you to edit the inspection steps within the currently
loaded routine.
Options (see page 175)

Tab Description
This allows you to configure the way the routines are run and what
data is captured and presented in the report.
Pattern cursors (see page 176)
This is for through-hole percentage fill analysis only.
Run Automatic Inspections Routines tab

Select the Run Automatic Inspections Routines tab.
The following functions and options are provided:
Option Description
Step This displays the currently loaded automated inspection routine

window details.
Start/Next position
Click to start the routine, or advance to the next position in the
pattern.
Pause
Click to pause the automatic advance.
Stop
Click to stop automatic position advance.
Re-datum
Click to set the pattern datum to the current position.
Play/Run
Click to play (run) the routine.
Pass
Click to pass the current step.
Fail
Click to fail the current step.
Enable Set this checkbox to enable the system to automatic advance
automatic through the inspection steps using a predefined delay time
advance between individual steps.
Reference This displays the default reference image.
image window

View Results tab

Select the View Results tab.
Serial No. Select the serial number of a previously run routine, if it is to be

reviewed. Otherwise the serial number, if any, of the most recent
run of the inspection routine is automatically displayed.
Tree diagram The results are displayed in a hierarchical tree diagram. Expand
and collapse controls are provided.
 A red cross indicates that a board/pattern or subsidiary step
has failed.
 A green tick indicates that a board/pattern or subsidiary step
has passed.
Right-click on an inspection step to edit the pass/fail judgment. You
can:
 Change Result - if an error was made during the run
 Add (or edit) the failure Result Code
 Add (or edit) the Result Comment.
However, editing step results is limited to Engineer level access
only.
Double clicking any step in the tree returns the system to that
particular location in the inspection sequence, but does not adjust
the power and voltage levels accordingly. This is useful if
additional inspection or analysis is required to verify if a fault is
acceptable or needs rework.
If the inspection sequence included an automated inspection
measurement, such as BGA measurement, then more details are
given for each measurement, by clicking on the relevant + symbol.
User The user who created the report.
Date The report date.
View report
Click to view the full HTML report.
Export report
Click to export the report.
Overview map
Click to show or hide the overview map.

Edit tab
Select the Edit tab.
You move through the routine steps using the following controls:
Control Description
Step This is automatically created when a new inspection step is added.

Number
Step Type This is automatically created and gives a brief detail of the step type,
such as: Area Void, Orbit, BGA and so on.
Record a new step
Click to save a new step with the current view settings (see page
197).
Move to previous step
Click to load the previous step of the routine.
Move to next step
Click to load the next step of the routine.
Delete the current step
Click to delete the currently loaded step from the routine.
Re-datum
Click to start the currently selected routine's alignment procedure to
ensure correct alignment when editing.
 If fiducial alignment is used, the system automatically aligns the
sample. However, if the fiducial location is not found on-screen,
you are notified and the live X-ray image must be moved until the
fiducial area is back in the field of view. This button should then
be pressed again and the alignment will be correct.
 If manual alignment is used, you should manually align the live
X-ray image (as necessary), so the reference location is centered
around the cross-hairs on-screen. This button should then be
pressed again to confirm correct alignment.
Once the alignment of the sample(s) has been confirmed, changing the position,
magnification, oblique angle view, X-ray tube conditions, contrast stretch and image
enhancement from what was initially defined for any inspection step can be easily
achieved, as follows:
1. Select the step that requires modifying.
2. Use the system controls to move and change the live X-ray image to show the
view that is now needed at this step, on-screen.
3. Once satisfied with the new, revised view, click the Update button to confirm the
changes within the routine.

A range of additional editing functions for the inspection steps are available on four
further tabs. The controls and functions available on each tab are described in
individual topics.
Tab Description
General details (see page 171)

Provides tools for editing basic inspection step settings.
Reference image (see page 172)
Provides tools to change the reference image associated with an
inspection step.
Custom details (see page 173)
Provides tools to change the current pass/fail inspection step into
a specialist (custom) action.
Program layout (see page 174)
Provides tools for selecting a specific layout 'action' and change
the serial number option for an inspection step.
Edit General Details

Function/Option Description
Step Name Click to edit the step name. This allows you to apply an
application specific name to a particular inspection step, in place
of a sequential number. For example, indicating that you are
inspecting BGA03 instead of at step003 within the routine. This
information is shown in the report.
Grade required Set this to force the operator to enter a Pass or Fail grade at this
step in the inspection routine.
If you leave this unchecked, operators can grade at their
discretion during the automated inspection routine.
Wait for Set this to ensure any frame averaging has completed before
Average starting the analysis or moving to the next step.
Manual Choose the relevant advance option for this step if it is to be
Advance/Auto different from the default set in the inspection wizard.
Advance
Auto advance Enter the required time delay before moving to the next
after inspection step, in seconds, when the auto-advance option is
chosen.
Comments Enter instructions, or comments, to be shown to the operator at
this step during the inspection routine.
Update
Click to save any changes made to any of the above values.
This can be clicked after each individual modification or after all

changes have been made. No changes are made to the routine

until this button is clicked. A dialog box is displayed asking if the
changes are to be made to all steps, or just the current step.
Save map
Click to save the current map as the map for this inspection
routine.
Save location
Click to update the location data for the current step.
No location changes are made to the routine until this button is
pressed. If the location is changed, it may be necessary to also
change the reference image associated with the step.
Location fiducial
Click to display the fiducial window (see page 184) and to define
an additional fiducial point within the inspection routine.
For example, it may be necessary to ensure correct sample
positioning ahead of an automated area-void measurement.
Once the fiducial is saved, this step is converted to a location
fiducial step.
Rotation fiducial
Click to display the fiducial window (see page 184) and define an
additional rotational fiducial point within the inspection routine.
Once the fiducial is saved, this step is converted to a rotation
fiducial step.
Edit the Reference Image

The system can provide a reference image on-screen at each inspection step, to
help guide you during analysis. If a reference image has been set to be saved
during the creation of an inspection routine (see page 185), then the image on-
screen at the time Record is clicked is used as the default reference image for that
step.
However, it may be necessary to change the reference image associated with an
inspection step. There are three options:
Option Description
Select a new image

Click to select an image from an existing file. A file selection box
appears.
Save
Click to save the current live image as the reference image.
Delete
Click to delete the current reference image.

Edit Custom Details

Option Description
Automation Routine
Click to open a selection window. Choose an automatic
measurement routine to be executed at the location of this
inspection step.
Store details Set these to automatically save the fail or pass details for this
for fails/passes inspection step.
Select both options to save all details, leave both options
unchecked if no details are to be saved.
In some cases, identical devices may be used but in a different
orientation. When this is the case, the same automatic
measurement routine can be selected but a rotational angle for
the inspection needs to be included.
Enter the angle of rotation (anti-clockwise only) for this inspection
step and click this button.
This option is only available for Template Based Analysis. No
other measurement type supports device rotation.
Pattern Cursors
Cursor Select a previously defined overlay cursor for aiding via fill
analysis to be added to this inspection step.
Refer to Pattern cursors tab for more information (see page 176).
Orbit
Orbit speed The system can provide a live X-ray view as the detector
continuously orbits around the inspection step location at the set
oblique angle view. The system continues to orbit until you press
Stop, manually advance to the next step, or automatically
advance to the next step when the auto-advance delay time
expires.
The higher the number selected, the faster the orbit speed.
This option is only available at an oblique angle, and a setting of 0
de-selects the option.
Clockwise Select the orbit direction, as appropriate.
Anti-clockwise

Edit the Routine Layout

Note: This option is only available in Engineer level access.
When this tab is selected, the overlay navigation map window shows the outlines of
each board and pattern and also the location of all inspection steps.
The arrows above indicate where steps are located on the example navigation map.
The steps are colored:
 Blue on the source board/pattern
 Green on subsequent repeats
The following options allow the engineer to change the serial number options for the
boards and patterns in a stored inspection routine from that previously saved during
the automation wizard.
Option Description
Select Choose one of the following actions, as required:

Action  Reposition Boards
 Change alignment method
 Reposition Patterns
 Set analysis for all
Select the required action, then click this button.
The system reloads the inspection wizard at this step for the action
selected, simply follow the instructions and continue the wizard to the
end.
However, if Set analysis for all was selected, a selection window
opens allowing you to chose a single automation routine to be run for
every inspection step in the automatic inspection routine.
Use a Set as appropriate to force a request for a unique serial number for
serial the program/board/pattern every time this step is run.
number...

Options tab
Select the Options tab.
Display Options
Enable ref. Set to generate a reference image for each step created.
images
Force a serial Set to allow routines to be run only if a serial number for the part
number is entered.
Show device Set to allow the name of the device being inspected to be
name included in the results report.
Show pin Set to allow the package style to be included in the results report.
package For example: TO252 or TO220.
Edit Result Click to edit the failure Result Codes. See Editing Failure Codes
Codes (see page 203).
Options for passed or failed steps
Show grade Set to show the Enter Grade screen when a step is passed or
screen failed.
Save image Set to save an image when a step is passed or failed when you
press a grading key.
Force a result Set to force a manual result or grade when a step is failed and
code option to save an image. Only allows configured failure codes.
Validate result This confirms the result code entered is actually a valid code in
code the Result Code list.
Automatic Options
Automatic Sets the automatic saving of images and the generation of
image saving results.
options and  Always - always saves and generates images and reports.
Automatic
report options  Only if a serial number is entered - only saves and generates
images and reports if a serial number is entered.
 Never
Generate serial Set to generate an automatic serial number if none entered.

numbers
Stop X-rays Set to turn off the X-rays once an AIR has completed.

Default Report Options

Include Images Sets what images are saved with the report.
 None
 Fails only - only images of failed steps are stored.
 Passes only - only images for passed steps are stored.
 All - all images are stored.
Include map Set to include the navigation map with the report.
Location to Allows you to select the location to store reports. By default:
store results
C:\Users\Public\Public
Documents\Dage\XRay\Patterns\Reports\[Pattern
Name]\Results\[Individual destination folder]
Click the Browse button to navigate to the required directory.
Pattern cursors tab

Through-hole fill analysis enables you to non-destructively examine and calculate
the percentage of solder material contained within a particular joint of a through-hole
component. In this way, non-destructive confirmation is available of acceptable
through-hole production quality, for example to meet IPC 610-E guidelines.
The following functionality allows you to design cursors that can be used as an
overlay on the image. A cursor enables you to judge the solder fill of via holes more
accurately. Saving the image stores the through-hole fill percentage data as part of
the image.
Select the Pattern Cursors tab.
Cursor Type An entry is automatically created when a pattern cursor is

created.
Cursor Name Enter a name for the cursor.
Via Hole Height The system sets a default value based on the current
magnification.
This value can be manually changed to match the size of the
hole.
Via Hole The system sets a default value based on the current
Diameter magnification.
This value can be manually changed to match the size of the
hole.

Drawing Type Choose, as appropriate:

 Orthographic - displays the pattern cursor with parallel lines.
 Perspective - displays the pattern cursor in a 3D view, which
can be useful when viewing a long via, for example.
Invert Set this checkbox to invert the display order of the marker values
and their respective labels.
Show visual Set this checkbox to show cursor shading to assist visual depth
shading cueing.
Marker Details This window displays the current marker details in a tree view.
Use the expand and collapse controls as required.
Add marker
Click to add an additional marker to the cursor.
Delete cursor
Select the cursor you wish to delete from the list of markers and
click this button to delete it.
Save cursor
Click to save the cursor.
You create a cursor as follows:
1. Enter a name for the cursor and press Enter on the keyboard.
2. If necessary, change the default values for the Via Hole Height and Via Hole
Diameter to match the actual size of the hole.
3. Set the height (see page 56) to a point approximately in the middle of the
through-hole to ensure the cursor dimensions match the selected values. You
may find it easier to use the alternative method for set-height in order to find the
center of the through-hole as this will tilt the detector.
Note: This is very important for the dimensions to be accurate.
4. View the hole at an oblique angle to verify the dimensions.
5. Use the Dartboard to change the angle of view.

An image similar to that shown below should be displayed.
While the pattern cursor tab remains visible, the pattern cursors remain on-
screen. Changing the oblique angle and/or altering the magnification used
makes the system automatically adjust the pattern cursors so they are aligned
and proportionate to the new view settings. However, some manual adjustment
of the through-hole may be necessary to perfectly re-align the pattern cursors.
6. Choose a Drawing type.
7. Each cursor is created with 0% and 100% markers by default, and these are
shown in the Marker Details window.
You can view or hide the details of a marker by clicking the relevant +/- box, or
by double-clicking the % marker.
8. To add further markers:
 Click the Add button one or more times. The markers are added to the
image, with default values: color = green, % value = 50%.
Any number of markers at different fill percentages can be added.
9. To set an inspection marker color:
 Double-click the Click to change color box.
 Choose the required color and click OK. The marker updates automatically.

10. To set an inspection marker position:

 Highlight the value to be changed with a single left mouse click.
 Select it with a second single left mouse click.
 Enter the new value.
 Move the mouse pointer onto the image, the marker is immediately redrawn
at the appropriate location.
11. To display or hide the percentage label for a marker:
 Double click the relevant Show number on screen? item to toggle between
Yes and No.
12. Click the Save button to save the cursor.

14.2. Defining the inspection steps

Once the layout has been defined, you can define the Inspection Steps that you wish
to use for analysis. In the example given, this means:
 Move to the first desired inspection location on the left hand pattern of the lower
left board.
 Define the type of view (or automated measurement) required at this point.
 Record the inspection step into the automated sequence.
 Move to the next inspection position.
 Repeat the above as many times as necessary to capture all the required
inspection steps for the product.
Every inspection sequence created for this pattern is repeated automatically for
every other pattern, in all the other boards.
Each inspection step can be any of the following functions:
 Manual pass/fail analysis against a reference image shown on-screen, this
allows you to grade failures (see page 202), if required.
 Automatic image capture (see page 201).
 Ball Grid Array (BGA) measurement (see page 103).
 Void measurement (see page 108).
 Wire sweep measurement (see page 109).
 Quad Flat Pack No-Leads (QFN) measurement (see page 112).
 Solder pads analysis (see page 116).
 Orbit rotation (see page 200).
 Through-hole calculation (see page 176).
 Additional fiducial alignment (see page 183).
An automated inspection routine can be constructed using any (or all) of these
functions, either singly or repeatedly, in any order and in any combination.
Practical inspection step consideration

At each inspection step, the position on the sample, the magnification, the oblique
angle, the tube power, the tube kV, the frame average, the contrast stretch applied
and any image enhancement can all be set differently to suit the inspection
requirements for that inspection location.
However, it may be beneficial to avoid changing the tube voltage or power too
frequently unless it is absolutely necessary. This is because it takes the tube a finite
time to adjust its settings and this slows the speed of the inspection sequence.
Using the contrast stretch function may be adequate to highlight the desired features
instead of changing the tube settings. In addition, taking many frame averages for
each image increases inspection time. Setting a value of 32 frames, or less, is often
usually sufficient for analysis, unless the contrast is particularly low. However, if it is
necessary to change the tube conditions within an inspection sequence then
consider grouping all of these inspection points together in a continuous sequence.

Reporting
At the completion of an automated inspection routine, the system provides an HTML
report of the results (see page 211). This report includes a navigation map of the
product(s) with the location of any failures clearly highlighted, the full results of any
automated measurements and details of the inspection time, date, product name,
serial number and operator name.
14.3. Inspecting die, BGA and general voids automatically

This section provides information on:
 Part location and alignment (see page 181).
 Operator reference image and prompts (see page 185).
 Operator grading and viewing options (see page 187).
14.3.1. Part location and alignment

The parts to be inspected should be located with a customized sample holder.
There are two methods of alignment that can be used within inspection routines:
 Manual alignment (see page 183)
 Automatic fiducial alignment (see page 183)
The inspection wizard used to generate automatic inspection routines requires that a
part has at least one alignment point.
Product alignment points

However carefully the part is located, it is sometimes necessary to make some
adjustment of the inspection positions to compensate for some differences in the
position of the product.
For example, a printed circuit board may be located in the machine by use of tooling
pins, or by simple reference edges. However, there is usually a tolerance between
these and the copper layers which typically reference the items of inspection. If this
tolerance is acceptable at the highest magnification being used, then no alignment
points are required.

Item Description Item Description
1 Printed Circuit Board (PCB) 4 Tooling pin

2 Copper feature 5 Sample holder
3 Tooling pin hole
Dimension Tolerance
Tooling hole to copper ± 0.15mm

tolerance
Clearance of tooling pin ± 0.05mm
Total location accuracy ± 0.20mm
Highest magnification view 5mm (approx. 5um resolution)
Therefore tooling error 0.20/5.0*100%
represents
= 4% movement of object - OK
If the highest magnification was instead 0.5mm, then the tooling error could move
the part 40% of the field of view. This would probably be unacceptable, and
alignment points would be required.
Note: There can be more than one alignment step in the sequence. In fact, any
inspection point can be used to reference the product datum point by correcting the
error and clicking the Re-datum button.

Manual product alignment

A part must have at least one dedicated alignment point. This is because the system
needs to confirm the location of each new item for inspection in relation to the
reference sample on which the routine was created. This can be achieved through a
manual 1-point alignment, or an automatic 2-point, contrast-based, fiducial
alignment.
Manual alignment works by providing you with an on-screen reference image
overlaid with a location cross. You compare this image to that of the current product
seen in the main X-ray image. During the creation of the automated inspection
routine, the manual alignment position should be carefully chosen, using position,
magnification, kV, power, etc., to provide an easily identifiable feature, located in an
easily reproducible position (for example - the cross is located through the middle of
the hole).
If there is a positional difference between the reference image and the current
product under test, you can move the X-ray image on-screen, using the mouse, until
its appearance coincides with that of the reference image. The system remembers
the X and Y movements the sample manipulator has made to achieve this. You then
click the Re-datum button.
The offset made in the X and Y directions is then automatically applied to every
point in the automated inspection routine for that inspection run only. In this way,
any modest misalignment of repeat sample tests can be easily accommodated.
Note: Using a customized sample holder typically provides a robust practical solution
that ensures good repeat sample positioning.
Automatic fiducial alignment

The system can automatically adjust for misalignment of parts using fiducial
alignment (see page 184). There are two types of fiducial alignment:
 Location
Location contrast-based (not optically-based) fiducial steps corrects for an XY
displacement of the part.
 Rotation
A rotation fiducial corrects for a rotation of the part. A rotation fiducial requires
that a location fiducial has already been created for the rotation to be correctly
calculated.

Both types of fiducial alignment consist of a position and a reference area. The
reference area is a unique area (in terms of contrast variation) within the current X-
ray view. When a fiducial step is used during an inspection routine, the system
locates the reference area using pattern recognition techniques and determines its
current location.
 For a location fiducial the system calculates the difference between the current
location and the original location and generates an offset that is then applied to
all subsequent steps of the routine.
 Rotation fiducial steps perform a similar calculation but also use the previous
location fiducial to calculate a difference in rotation.
Note: Rotation fiducial steps only correct positional errors caused by rotation of the
part, the live image will still appear at an angle.
Teaching a fiducial
A fiducial is created using the fiducial window. This window is displayed
automatically on-screen during the inspection wizard process if fiducial alignment is
chosen. It can be manually displayed by choosing to add a fiducial step in the
routine editor.
Create a fiducial, as follows:
1. Draw an outline around an area on the X-ray image by holding down the left
mouse button and moving the mouse.
The ideal is to define a unique area of contrast variation (not optical variation)
within the image that the system can use to define its position in the future.
Once the desired area has been defined, the system automatically calculates
and displays on the X-ray image (and in the fiducial window) if the contrast
variation contained within the defined area matches with any other similarly
sized areas in the image.
2. Click the Set Template button.
If the object is unique, i.e. the next best match has a correlation probability of
less than 80%, this saves the current selection for use.
3. If creating a unique fiducial area is not possible in the current X-ray image, click
the Move button to enable moving the image using the mouse.
4. Move the image, and/or change the magnification, so there is a greater contrast
variation in view.
5. Click the Draw button to re-enable drawing mode and repeat steps 1-3 until,
ideally, a unique fiducial area is achieved, or subsequent matches are less than
80%.

14.3.2. Operator reference image and prompts

When recording an inspection sequence, the current X-ray image is automatically
saved as a reference image. This image is then displayed as a guide when the
sequence is subsequently run. The displayed reference image can be magnified and
moved using the mouse to drag the image and the mouse wheel, or scroll bar, to
change the magnification.
However, in some applications the default reference image may be inappropriate, or
misleading. In which case, the reference image can be cleared, or an alternative
reference image assigned (see page 199).
In addition, you can add a text prompt with instructions of what is required at this
particular inspection step.

187
14.3.3. Operator grading and viewing options

When recording an inspection step, it may be necessary to force the operator to
grade that inspection location with a pass or fail judgment.
Enable grading as follows:
1. Select Inspect > Automatic Inspection Routines mini tab > Edit tab > Edit General
Details tab
2. Set the Grade Required checkbox.
This forces the operator to pass or fail the inspection point by using the green
tick or red cross buttons displayed when the routine is run.
3. If the inspection point is a fail, after clicking the cross button, the operator can
optionally:
 Assign a grade code (usually a number between 0 - 9) that has been locally
designated to indicate different types of failure mode.
 Enter comments to provide additional information within the final report.
 As an alternative to pressing the tick or cross buttons during the inspection,
the operator may instead press Enter on the keyboard to designate a pass,
or a numeric key between 0 - 9 to indicate a particular grade code failure.
This speeds up inspection throughput but at the expense of the ability to
assign additional comment.
 Save the image.
All this data appears in the inspection report, which can be generated at the end
of the inspection sequence.
The grade codes are also saved in a database for later analysis and are
referenced by product (inspection routine), name, and serial number.

14.4. Creating or editing an Automated Inspection Routine

Before creating or editing an Automated Inspection Routine (AIR), the following
points need consideration:
 The sample holder may need to be customized to provide a repeatable location
for the product (see page 46).
 Ideally, a recipe should be chosen that allows as many, preferably all, of the
inspection points to be covered. Refer to Manual image settings (see page 59)
or Image recipes (see page 89).
 The product to be inspected should be fixed into the machine, the recipe
selected and X-rays turned on.
This section provides information on the following:
 Creating a new routine using the Automatic Inspection Wizard (see page 189).
 Defining inspection steps within an automated routine (see page 197).
 Editing inspection steps within an automated routine (see page 199).
 Grading options - logging passes and failures during automated inspections
(see page 202).
All automatic inspection routine controls are accessed by:
Selecting the Automatic Inspections Routines mini tab.

14.4.1. Creating a new routine using the Automatic Inspection Routine (AIR) wizard
In order to help in understanding what the wizard is intended for, consider the
example below. There are six identical boards on the sample holder, placed in two
rows of three boards (1). Each board contains two identical patterns (2) and all items
must be inspected in one automated routine.
The following controls are used when creating an automatic inspection routine with
the wizard:
Tab Description
Start Wizard
Click to start the AIR wizard.
The system displays the first step of the wizard along with prompting
text. The step numbers displayed during the wizard increase in value
but may not always be sequential. This is normal operation and
reflects the choices made during the wizard.
Click to move the wizard to the next step.
Click at any time to halt the wizard.
To start creating a new routine, click the Start Wizard button.

Step 1 - Choose map type

The wizard uses a large version of the navigation map to configure the layout of the
test samples on the sample holder. It also provides other functions:
 It indicates the location of any failures found during an automated inspection.
 It provides the navigation map in large view on-screen when an operator is
about to load the samples, so as to encourage correct sample orientation and
placement.
 It overwrites any existing navigation map when the routine is loaded, which
means that the navigation map does not have to be re-created from the start
every time that routine is to be used.
Therefore, a navigation map must be created for each routine.
1. Select the desired map option:
 Single board
 Full scan
 Current - this is only an option if a valid Scan Map (see page 70) has already
been completed. If a current map does not exist then you have to use either
the single board map or full scan option.
2. Enter the Name for this program (routine), for example the product name.
3. Click Advance.
 The system performs the requested board scan, if selected, and the
navigation map is created over the main X-ray image section of the image
display before proceeding to the next step.
 If the current map option is chosen, the system does not perform a board
scan and proceeds to the next step.
Pressing the Navigation Map button toggles the main X-ray image view
between the live X-ray image and the navigation map. Consider selecting the
best X-ray tube settings to provide the most suitable navigation map before
commencing the wizard. The resolution of the navigation map is not the
same as the live X-ray image.
 If the program name entered is already in use, a message is displayed,
select Yes or No, as appropriate.
Step 2 - Select auto-advance option

Routines can be configured to automatically advance between inspection steps after
a user defined delay, even if they are a manual step that would normally wait for you
to confirm a pass or fail. This can be particularly useful for routines that are to be
used to generate reports for off-line evaluation.
In addition, this approach could be considered for a tray of devices, for example.
The routine steps on and reports a pass automatically at every inspection step
unless you press a grade code (failure) key when you see a failure. This logs the
failure and continues with automatic passes until the next failure is observed.
1. Choose either the Manual or Auto advance after option.
This is a default setting that is applied to every inspection step in the
subsequent routine. However, when creating the individual inspection steps, any
of them can be changed to the other option locally.

2. If Auto advance after is chosen, enter the required delay interval.

3. Click Advance.
Step 3 - Define number of boards and patterns

1. Enter a value in the Num. Boards box to define the boards to be inspected in the
routine.
For the example previously given, this is 6.
2. Enter a value in the Num. Patterns box to define the number of patterns to be
inspected within each board.
For the example previously given, this is 2.
3. Select the Serial number for each program option to associate the results and
reports of the inspection routine with a unique serial number each time the
program is run. It is possible to create a single program which contains multiple
boards each containing multiple patterns.
4. Select the Serial number for each board option to associate the results and
reports of the inspection routine with a serial number on each board. This may
be in addition to, or instead of, the serial number of the relevant program. A
unique serial number for each board is requested every time the routine is run.
5. Select the Serial number for each pattern option to associate the results and
reports of the inspection routine with a serial number on each pattern. This may
be in addition to, or instead of, the serial number of the relevant pattern and/or
board. A unique serial number for each pattern is requested every time the
routine is run.
6. Click Advance.
If a serial number is already stored in the results database, the system asks if it is
OK to overwrite the existing results at the time of program execution.
Step 4 - Define board outline

1. Click and drag on the large navigation map, to draw an outline around the first
board - typically located in the bottom left-hand corner of the image.
2. Edit the Board Name, as required (for example: Board_1).
3. Click Advance.

The defined board now has a blue outline to indicate it is the source board.
Step 5 - Define board layout method

This step defines the positions of the other boards on the sample holder.
1. Choose the required board layout method:
 Manually position boards (see page 192)
 Insert matrix of Boards (see page 193)
2. Click Advance.
Step 6 - Manual board layout

Manually position the remaining boards as follows:
1. Click on a board in the displayed list to position it.
2. Edit the board name if this is to be different from the default (for example:
Board_2).
3. Double left-click on the large navigation map at the position of the bottom left-
hand corner of the board being defined. An outline of the same size as the
source board is drawn and outlined in green around this second board. The
associated icon in the list changes from a red cross to a green tick.
Note: The boards do not have to be assigned in a specific order with this
approach. The second board does not necessarily have to be next to the first,
for example, but can be elsewhere on the sample holder.
4. If the position of this, or any other subsequent board, is not where it is required,
re-select the board in question from the list and repeat step 3.
5. Click Advance. The button becomes available once all the boards have been
positioned.

Step 6 - Matrix board layout

With this method, the system automatically numbers and defines the placement of
the boards. It goes across the columns before going up the rows on the sample
holder.
1. Enter the number of board matrix rows (2 in the example).
2. Enter the number of board matrix columns (3 in the example).
3. Enter the X pitch. This is the horizontal distance (1) in millimeters between the
origin of the source board and the origin of the board immediately to its right on
the sample holder.

4. Enter the Y pitch. This is the vertical distance (2) in millimeters between the
origin of the source board and the origin of the next board immediately above it
on the sample holder.
5. Click Advance.
Step 7 - Choose the alignment method

1. Select the alignment method to be used for each board:
 Manual alignment (see page 194)
 Fiducial alignment method (see page 195) - You cannot set a fiducial
alignment in live mode.
2. Click Advance.
Step 8 - Manual alignment

If manual alignment is selected, the system moves to show the bottom left-hand
corner of the first, or source, board in the main X-ray image. The cross-hairs are
automatically turned on to aid alignment.
1. Drag the X-ray image so the cross-hairs are positioned over a reference feature
that allows for easy realignment on subsequent boards.
2. Once a satisfactory alignment position has been selected, click Advance.
 If there is only a single pattern in the board, the system:
 Finishes the wizard.
 Saves this view as an alignment step for the source board.
This same alignment step is then automatically added as the alignment step
for each subsequent board. It is assumed in this case that the pattern has
the same outline as the board.

 If there is more than one pattern in the board, the wizard advances to the next
step.
Step 8 - Fiducial alignment

If fiducial alignment is selected, the system moves to show the bottom left-hand
corner of the first source board in the main X-ray image and display the fiducial
screen (see page 183). You need to define and save, firstly the location fiducial and
then the rotational fiducial.
Although the X-ray image can be moved where there is insufficient contrast detail to
allow a unique fiducial to be acquired, wherever possible, try and keep the location
fiducial as close as possible to the board origin.
Once the location fiducial has been saved, the system automatically moves to the
top right hand corner of the source board where the rotation fiducial should be
created and saved (see page 184). For the best results, try and keep the rotation
fiducial location as close to the top right hand corner as possible.
Once both fiducial points have been satisfactory defined:
 If there is only a single pattern for each board, the system:
 Finishes the wizard.
 Saves these views as alignment steps for the source board.
These same alignment steps are then automatically added as alignment
steps for each subsequent board. It is assumed in this case that the pattern
has the same outline as the board.
 If there is more than one pattern in the board, the wizard advances to the next
step.
Step 9 - Define pattern outline

1. Define the outline of the bottom left-hand pattern on the board by clicking and
dragging on the navigation map around the outline of the first pattern.
The pattern is outlined in red.

Note: Sometimes patterns can be laid out as mirror images on the board. In this
case, the mirror images must be treated as if they are two different patterns
within the system.
2. Click Advance.
3. If the advance button is unavailable, re-define the pattern outline and ensure
that the defined area lies within the navigation map.
The defined area is outlined in blue.
Step 10 -Select pattern layout method

This step provides fine adjustment to the position of the first pattern relative to the
navigation map. A suitable reference object at, or close to, the bottom left corner of
the defined pattern area should be used so that correct manual placement of
subsequent patterns may be quickly and easily defined.
1. Enter/edit the name for the first pattern, as required.
2. Select the pattern layout option:
 Manually position patterns (see page 196)
 Insert matrix of patterns layout (see page 197)
3. Move the main X-ray image view, by mouse click and drag, until the position of
the bottom left-hand corner of the defined first pattern area is in the middle of
the screen (located at the center of the cross-hairs).
4. Click Advance.
Step 11 - Manual pattern layout

This step involves locating the bottom left hand corners of all of the repeated
patterns. This method is very similar to locating repeated boards (see page 183).
1. Click on a pattern in the displayed list to locate it.
2. Double-click the bottom left-hand corner of that pattern on the navigation map.
This changes the main display from the navigation map to the live X-ray image.
3. Move the main X-ray image view, by mouse click and drag, until the equivalent
reference object as that selected for the first pattern is in the middle of the
screen (located at the center of the cross-hairs).
4. Click Record.
The associated icon in the list changes from a red cross to a green tick.
5. Repeat steps 1 – 4 for all additional repeat pattern locations.
Note: The patterns do not have to be located in a specific order with this
approach. Sequentially numbered patterns do not need to be defined as being
physically next to each other. For example, they can be positioned anywhere
within the board to suit specific requirements.
6. When all the patterns have been located correctly, click Advance.

Step 11 - Matrix pattern layout

With this method the system automatically numbers and defines the placement of
the patterns. It goes across the columns before going up the rows on the sample
holder.
1. Enter the number of pattern rows in the board (1 in the example).
2. Enter the number of pattern columns in the board (2 in the example).
3. Enter the X pitch. This is the horizontal distance (1), in millimeters, between the
origin, or reference object location, of the first pattern and the origin of the next
pattern to its right on the sample holder.
4. Enter the Y pitch. This is the vertical distance (2), in millimeters, between the
origin, or reference object location, of the first pattern, and the origin of the next
pattern immediately above it on the sample holder.
In the example image shown, this value is 0 as there is only one row of patterns.
5. Click Advance.
14.4.2. Defining inspection steps within an automated routine

Once the automated inspection wizard completes, the system knows the location
and layout of all of the boards and all patterns on the sample holder. It is now
necessary to define exactly what is to be inspected in each pattern.
The system does this by recording all the required inspection steps on the first
pattern of the first board and then automatically assigning them (with the correct
positional offset) to all other patterns on all other boards.
1. At the completion of the automated inspection routine wizard a message
appears. Click OK.
2. Move the live X-ray image until it is located at the first inspection point on the
first pattern of the first board.

3. Adjust any (or all) of the magnification, tube kV, tube power, oblique angle view,
frame average, contrast stretch and image enhancement parameters until the
image you require to be repeated for all of the samples at that position is shown
on-screen.
4. Click Record.
This sets up the current X-ray image view as that to be used at this position on
all subsequent runs of this inspection sequence.
The default inspection step, created when Record is clicked, is that of a manual
pass/fail step (see page 187). Depending on how the automation wizard was set
up, this might require, or force you to determine if the current subject under test
passes or fails when compared to the reference product.
Editing inspection steps within an automated routine details how to edit, or
modify, the current inspection step (see page 199). This enables:
 The inspection location, the type of X-ray view, and the conditions used to
create the image to be changed from what is currently set
 The pass/fail step to be changed into an automated BGA, area-void or
through-hole fill measurement, or an additional fiducial, or a continuous-
rotation view at an oblique angle
5. Move to the next inspection position and repeat steps 3 and 4 above.
6. Continue as necessary until all inspection steps have been created.
The full automated inspection routine, looking at all patterns on all boards is now
ready to use. Refer to Using automatic inspections for more details (see page
204).

14.4.3. Editing inspection steps within an automated routine

Any of the editing procedures detailed in the following topics may be undertaken
after the initial recording of an inspection step, or during the creation of an
automated inspection routine. They can also be applied, at a later date, to any
inspection step within a previously stored routine.
In order to edit an existing automated inspection routine it must first be selected and
opened. Any modifications made are based upon the sample(s) currently in the
system, and these should be, ideally, the same reference samples that were used to
set up the inspection routine in the first place. Whatever is used, it is necessary to
ensure that the current samples are aligned relative to the original set up.
Otherwise, any positional changes defined on these new samples may not be in the
correct position. The system can confirm the current alignment using the Re-Datum
button, which uses the fiducials defined in the original routine and any misalignment
can be accounted for. Although the system prompts you to check the alignment
ahead of editing existing routines, this MUST be done before any modifications are
made.
The following editing procedures can be carried out:
 Adding a manual inspection step (see page 199)
 Adding a fiducial alignment step to a pattern (see page 199)
 Adding an automatic inspection routine step (see page 200)
 Adding a cursor inspection step (see page 200)
 Adding an orbiting inspection step (see page 200)
 Changing an existing inspection step (see page 200)
 Deleting an inspection step (see page 200)
 Inserting an inspection step (see page 201)
 Automatic advance (see page 201)
Adding a manual inspection step

1. Move the image and adjust the system settings to ensure that the feature to be
inspected is located correctly and is clearly visible.
2. Click Record to add the current settings as an inspection step for this pattern.
A dialog box is displayed asking whether to insert the step after, or before the
current step. Choose Yes or No as appropriate. This dialog is only displayed
after the first step. Subsequent steps are automatically placed behind.
The dialog is displayed as it may be desirable to add an additional fiducial
ahead of the first inspection point. This may be useful in the case of an
automated inspection of area voiding so it can be ensured that the test piece is
aligned relative to the area void set position, and the area calculation is made at
the same position.
Once added, the general details of the step can be edited on the General (see page
171) tab.
Adding a fiducial alignment step to a pattern

1. Select the Edit General Details tab.
2. Press the Location Fiducial button to enter the fiducial editor mode.

If the Automatic Advance option is not selected when the fiducial step is
created, the routine waits for manual confirmation.
Adding an automatic inspection routine step

1. Add a manual inspection step (see page 199).
2. Select the Edit Custom Details tab.
3. Click Browse to select a routine.
4. Select the Store Details options for the results of this routine.
5. If Template Based Analysis is selected, enter an inspection Angle of Rotation
value, if required.
Adding a cursor inspection step

1. Add a manual inspection step (see page 199).
3. Choose the appropriate Pattern Cursor from the drop down list.
Adding an orbiting inspection step

1. Add a manual inspection step (see page 199) for the purposes of orbiting.
The view saved must be an oblique view.
3. Select the Orbit Speed from the drop down list.
4. Select the Orbit Direction.
Changing an existing inspection step

Before editing any existing steps it is recommended the board alignment is checked
by clicking the Re-datum button.
1. Select Automatic Inspections Routines mini tab > Edit inspection steps tab.
2. Select the inspection step by:
 Using the Forward and Back buttons.
 Choosing the Step Number required from the drop-down list.
4. Make any changes that are required.
5. Click Update.
6. If the location of the step has been changed, click Update location.
Deleting an inspection step

2. Select the inspection step by:
3. Click Delete.

Inserting an inspection step

2. Select the inspection step immediately before the new step is to be inserted by:
3. Move and modify the live X-ray image until the required position and the desired
image are shown on-screen. Then click Record.
If you are recording or creating the second step of a routine, a dialog box is
displayed asking whether to insert the step after, or before the current step.
Choose Yes or No as appropriate.
4. Choose No to make this new step, the first step of the routine. This might really
only be required if an additional fiducial location step is needed ahead of an
automated measurement, for example.
5. Edit any other details, then click Update.
Automatic advance
You can set the system to advance through the inspection routine automatically,
with a time delay in seconds, between each inspection step. You can stop the
system at any time to dwell on an inspection step by pressing the Stop button.
2. Set the Grade Required checkbox to force the operator to enter a Pass or Fail
grade at this step in the inspection routine, if required.
3. Set the Auto advance after checkbox and set the desired delay, in seconds.
4. Click Update.
A dialog box is displayed asking whether you want to set all other steps to have
this time delay. Choose Yes or No, depending on the type of inspection being
run.
If Yes, then this also applies to any of the alignment steps that have been set up
for the automated inspection routine. Therefore, it is usually necessary to set the
alignment steps back to Manual advance.
You can disable automatic advance on all the steps by clearing the Enable
automatic advance box.

14.4.4. Grading options - logging passes and failures during automated inspection
It is possible to use the machine for visual inspection only. However, it is extremely
useful to also save data on the status of each inspection step. For example, passes
can be logged to prove quality compliance and failures can be logged for quality
improvement and process control purposes.
Therefore, it is very important to ensure the results are easily transferable and the
locations of any failed inspection steps in particular can be relayed to a re-work
station where defects can be assessed and re-worked, or repaired.
The system creates reports of the automated inspection results. They typically
contain:
 Details of the sample under test, i.e. product, serial number, date of test,
operator.
 A listing of all the inspection steps undertaken during the automated routine.
 Thumbnail images of each step.
 The reference navigation map, set up during the creation of the of the
automated inspection routine.
 The location of any failed inspection steps highlighted on the navigation map.
 The location of failed pattern(s) within board(s).
The reports are saved as HTML and, therefore, can be easily transferred, and
viewed, on any PC using an Internet browser. The HTML format allows you to click
on any of the thumbnail images in the report which then provide the full X-ray image,
at that step, for additional analysis.
By configuring the default way that automated inspection routines are run (see page
175), you can save the full X-ray image for a pass and/or a fail, or not save any X-
ray image at all. This gives flexibility in terms of reducing the amount data in the
reports, if required.
Setting Grading required

Typically, during an automated inspection routine, the operator exercises discretion
as to what report data is saved. However, it is possible to force the operator to
record a pass/fail judgment for every manual visual inspection step made, this is set
as follows:
2. Set the Grade Required checkbox to force the operator to enter a Pass or Fail
grade at this step in the inspection routine.
3. Click Update.
The first time you change or update the grade required option in any step of an
automated routine, a dialog box is displayed asking whether you want to set all
steps to require grading. Choose Yes or No, as appropriate. However, each step
can be subsequently configured individually to suit specific requirements.
Note: Automated inspection steps in the routine, such as the BGA measurements,
are graded, or otherwise, through their wizard definitions, so the setting of the Grade
Required option of these steps is irrelevant.

Grading function
The operator can be forced to choose, or optionally to choose, whether to pass or
fail a manual inspection step. The choice is made using the pass or fail buttons:
Pass
Fail
If Fail is clicked, the Grade Details screen is displayed for you to enter (optionally)
further failure details (assuming the Grade Screen option has been set (see page
175)). If the system, through either a timed inspection step, or an operator action,
tries to advance to the next inspection point when Grade Required is selected, then
this screen is automatically displayed.
1. Enter a numerical Result Code (a number between 0 and 9), to indicate a
generic failure, for example, and provide more information for later analysis. The
Result Code failure descriptions (Test Type) are completely operator
configurable (see below).
2. Add Comments as further explanation of this particular inspection result.
Note: Any failure codes and comments that are added are shown in the final
report.
3. Set the Save Result Image checkbox to save the current image, seen on the live
X-ray view, into the final report.
4. Click the Save button.
Editing Failure Codes

Note: The failure codes can be edited in Engineer level access only.
The results codes can be edited to relate to any existing failure mechanism
descriptions, as follows:
1. Select Automatic Inspections Routines mini tab > Options tab.
2. Click Edit Result Codes to open a window listing all the preset fault codes
3. Double clicking any description in the Test Type column to directly edit it. The
associated Result Code can also be changed in the same way.
4. Click OK.

14.5. Using automatic inspections

An automated inspection routine can be used once it has been created (see page
189). It can then be repeated (run) as many times as required. Different routines can
be quickly loaded to enable inspection to satisfy changing work demand.
To run an automated inspection routine, you would typically follow some, or all the
steps below:
 If a second monitor is fitted, select either the Navigation Map, or AIR results
display (see page 205).
 Select and load the routine (see page 206).
 Exclude any board, pattern or inspection steps that are not required (see page
206).
 Start the routine and enter any serial numbers, if requested (see page 207).
 Run the routine.
 Cancel automatically advancing through the routine steps (see page 210).
 Move through the routine steps, advancing manually (see page 208).
 Correct any sample misalignment (see page 208).
 Record and grade the inspection step results, as required (see page 210).
 At the completion of the inspection run, view the inspection report summary (see
page 211).
To start using an automated inspection routine:

Select Automatic Inspections Routines mini tab > Run Automatic Inspections
Routines tab.

Second monitor results screen

The second monitor can be used to display either a larger Navigation Map (see
page 70), or the results of an Automated Inspection Routine (AIR) as it is being
executed. This is set from the More Options (see page 38) screen.
When the second monitor is set as the Navigation Map, you can move the sample
tray around by either using a double left mouse click to move a region of interest to
the center of the screen, or to define a region of interest to be displayed.
If the second monitor is set to display the results, it is not possible to move around
the map in the same way. The results screen, when selected, shows the Navigation
Map of the loaded AIR. This is indicated by the word Results displayed in the top left
corner of the map.
As an AIR is being executed, the results map displayed on the second monitor is
updated with a series of green ticks for inspection steps which have passed the
required inspection criteria, or red crosses to indicate steps which have failed.
You can click on the ticks or crosses to display a small window, that gives more
detail of the step along with a thumbnail image.

Note: Not all automated measurement steps are supported.
Selecting and loading an inspection routine

1. Select Automatic Inspections Routines mini tab.
2. Click the Open a program button in the top level automated inspection routine
controls (see page 166).
3. Select the routine to be used, click OK.
The system only executes the currently loaded routine. The name of the routine
is displayed next to the title of the main inspection tab.
Note: In order to reduce cycle times, it is recommended that all objects are on
the sample holder, within the X-ray system and the X-rays are turned on before
continuing.
Excluding a board, pattern or inspection step

It may be necessary to use a routine that has multiple patterns on multiple boards
but not all of the possible samples may be present on the sample holder. Therefore,
it is possible to exclude board(s), pattern(s) or individual inspection steps from a
specific inspection run.
The large navigation map is displayed as an aid for aligning samples and also for
identifying which objects, if any, should be excluded. This exclusion lasts only for the
duration of the current test and does not affect the saved routine.
To exclude or include an object, do the following:
1. Right click the object (board, pattern or inspection step) to be excluded.
2. Click on Include to toggle the control and remove the tick.
A red slash is displayed over the excluded object.
3. If an object is excluded by accident, then repeating the above action includes it

again.
The x,y location of the selected object is also displayed when the right click
menu is active.

4. If you need to change the values, click on the x,y location to open an edit box:
 Enter new values into the edit boxes, as required.
 Click OK, to close the edit box and save the updated values in the database.
Starting the inspection

Once you have selected and loaded a routine, and excluded any objects, as
necessary.
1. Click the Start/Next position button to initiate an inspection.
A window is displayed allowing you to enter serial numbers. However, this
window is only displayed if the routine has been configured to require a serial
number for an object (board or pattern). Each object requiring a serial number
has a text field for number entry.
Serial numbers can be numeric and alpha-numeric in value.
2. Enter the serial number for a specific object, by clicking on the text field
associated with that position and typing in the required value.
3. If an incorrect value is entered, simply right-click on the text again and enter the
correct value.
Note: If a bar code reader is attached to the system, then serial numbers can be
entered by this method for each sample location.
If you enter a serial number that already exists in the system database, the
system notifies you with a warning message.
 You can overwrite the previously stored data with the new results that are to
be taken. For example, it may only be required to keep successful product
quality information following re-work.
 Alternatively, you must modify, or change the current serial number. For
example, add additional coding to the serial number so that the original data
and the data after re-work are maintained separately.
Click Yes or No, as appropriate.
Note: The system defines a serial number as being unique in value. Therefore,
for example, if you attempt to use the serial number 'test board 1' for two
completely different inspection routines this is not allowed and the warning
message appears.
If the automation routine has not been setup to use serial numbers for patterns
or boards, then one serial number for the entire run can be entered directly on
the run screen without going to the serial number entry screen.
4. Click the Play/Run button, the system loads the first alignment step of the first
board included in the routine.

Moving through the inspection routine sequence

A routine is made up of a number of different layers:
 The top-level layer is a board or part.
Each board (part) is made up of at least one alignment step plus at least one
instance of a pattern. A board can contain a number of instances of the same
pattern.
 A Pattern is made up of a number of inspection points.
Each inspection point is called a step, there can be any number of each of the
different types of inspection step. The inspection steps are shown sequentially
in the order they are executed.
Once an inspection routine is loaded, moving through the step sequence is simply a
matter of:
 Clicking on the required step. Or:
 Click the Start/Next position button.
You need to consider that at each inspection step the tube voltage, power and
contrast settings may have been set to different values. Therefore, as you move
through the inspection steps, you may need to allow a little time for the tube to
stabilize before the next X-ray image is fully available.
Correcting for sample misalignment

Each board has either one manual alignment step or two automatic fiducial
alignment steps defined. The method for correcting any sample offset differs
depending upon which alignment method has been used.
Manual alignment (AIR)

If manual alignment has been used, align the image according to the reference
image and then click the Datum button. The comments and reference image saved
during the routine's creation help to remind you of the correct alignment.
Make the alignment as follows:
1. Use the mouse control to align the main X-ray image so that it is identical to that
shown in the reference image.
2. Click the Re-Datum button.
The amount the system manipulator has been moved to re-align the current X-
ray image to be equivalent to that of the reference image is known by the
system. These movements are then used as an off-set for all subsequent
inspection steps for this particular inspection run only.
3. Move to the next step by pressing the Start/Next position button.

Fiducial alignment
If fiducial alignment has been used, the system automatically searches the current
image for the first (location) fiducial area. If it is found then the system highlights the
area and displays the percentage match.
Once matched, the system moves to the second (rotational) fiducial location and
searches for that fiducial area. If it is found, then the system, again, highlights the
area and displays the percentage match. In this way, the system automatically
calculates the positional and rotational off-set of the current sample compared to the
reference sample. It then applies these off-sets to every inspection step for the
current inspection run only.
Missing fiducial
If either fiducial is not found on-screen then a manual message dialog is displayed.
This can happen if the current sample is so far away from the original reference
position that the defined fiducial area is no longer within the field of view.
In order to correct for a missing fiducial, do the following.
1. Click OK to clear the message.
2. Use the mouse controls to move the live X-ray image until the fiducial alignment
area is seen in the center of the screen.
3. Click the Re-Datum button.
This system then repeats its search for the fiducial area within the current
image.
 If successful, the procedure continues as above.
 If un-successful, move the image some more and click the Re-Datum button
again.
Incorrect object matched

If there is one, or more, locations that might have similar fiducial areas within the
sample, it is possible that the system will choose the wrong fiducial area. If this
happens, proceed as follows:
1. Click the Stop button to halt the inspection run.
2. Move the image so that only the desired fiducial area is visible on the screen.
3. Click the Re-datum button.

If it is not possible to only display the desired object, then a new fiducial should
be taught for the routine that is unique for a given field of view.
Canceling automatically advancing between inspection steps

Your engineer may have programmed the routine to automatically advance from
step-to-step after a predetermined number of seconds. In this case it is possible to
cancel or override this operation in the following ways:
 Click the Play button to skip the delay and immediately advance to the next
point.
 Click the Stop button to hold indefinitely at the current step.
 Clear the Enable automatic advance checkbox option to stop all automatic
advancing.
Note: This only applies to step and repeat inspection steps. If the step is an
automated measurement such as a BGA or Void then the system will proceed to
the next step regardless.
 Grade the current step using the Pass/Fail buttons, or using the keypad.
Recording and grading the results

The routine may have been set so that at each manual inspection point you must
press one of the following:
 The Pass button, or the Enter key on the keyboard.
 The Fail button, or a keyboard number between 0 and 9. The number pressed is
logged as the failure code. The recording window does not appear if a keyboard
value is pressed, and therefore comments cannot be added.
Alternatively, if automatic advance between steps is enabled then you can only
choose to record failures as they appear on-screen by pressing the Fail button.
Depending on how the inspection run is configured (see page 187) different options
may appear as a pass or fail is recorded. For example, a recording window may
appear. If an inspection point fails, you can do one or more of the following:
 Enter a failure code. This allows failures of the same type to be noted within the
report for subsequent process evaluation.
 Enter a comment.
 Save the image.
 Click the Save button to record the data in the database.
The comments and images saved here can be used at a re-work station to provide
further information about the analysis. In addition, the failure code can be used to
analyze the historical performance of the production line.

Viewing the on-line summary report

The inspection report summary can be viewed directly after completion of an
inspection run, or at any time (off-line).
Select Automatic Inspections Routines mini tab > View Results tab.
When the View Results tab is selected, the navigation map is shown in place of the
live X-ray image. The navigation map contains markers indicating the location(s) of
failed steps, as shown below:
14.6. Importing and using CAD data

You can import a CAD file to assist with the set-up of an Automated Inspection
Routine (AIR). However, this CAD file must be in XML format and contain all the
positional data required for the AIR.
A wizard is provided to guide you through the CAD Import process. The following
controls are made available as the wizard operates:
Button Description
Next
Click to move to the next step.
Stop
Click to stop the wizard.

Button Description
Back
Click to move back a step.
Move/Draw
This button toggles between two discrete modes:
 Sample move mode
 Fiducial image selection mode (see below)
In the sample move mode, you can move the sample to align the
fiducial in the centre of the cross hairs.
Fiducial image selection mode
In this mode you click on the image and draw an enclosing box until
the fiducial is completely inside the box.
Check for unique fiducial
Click to check whether the rectangular match area currently defined
in the middle of the screen is sufficiently unique and large enough to
be used for fiducial matching.
If a valid fiducial is not found, an error message is displayed, click OK
to clear.
Finish
Click to complete the wizard.
Important: Before importing a CAD file, ensure a navigation map (see page 70) has
been created for the samples to be inspected.
1. Select the Automatic Inspections Routine mini tab.
2. Click the Import CAD file button to start the CAD Import Wizard.
This allows the system to extract positional and analysis parameters from the
selected XML file. Where fiducial alignment is used, the wizard manages the
capture of appropriate images.
Wizard Step 1
1. Click the Import button.
2. Navigate to and select the required xml file. Click OK.
3. Choose a map type:
 Single board
 Full scan
 Current
4. Click Next to start any new scan that may have been requested, and advance
the wizard to Step 2.

Wizard Step 2
No user interaction is required as the system completes the requested scan.
If Current Map was selected in Step 1, the wizard moves directly to Step 3.
Wizard Step 3 & 4 - Accepting the fiducials

1. Move the tray to the first fiducial.
2. Align the first fiducial mark in the centre of the screen using the cross hairs.
3. Toggle the Move/Draw button to swap between moving the tray, and drawing the
enclosing box.
4. Click on the image and draw an enclosing box until the fiducial is completely
inside the box.
5. Click the Check for unique fiducial button.

This checks whether the image is sufficiently unique and large enough to be
used for fiducial matching. If it is, the selection area is shown outlined green
rather than blue, and the Fiducial Unique indicator turns green:
6. Once the first fiducial mark has been setup, click the Next button to move to
setup the second fiducial in exactly the same way as the first.
7. Click the Next button to accept the fiducial, and move to the next step.
Wizard Step 5
This step is associated with importing an XML file for a manually aligned routine.
However. it does not currently have any functionality requiring user interaction, so
the wizard moves straight to step 6.
Wizard Step 6 - Finish

1. Click the Finish button to complete wizard operation.
2. A message dialog is displayed. Click OK to clear.

14.7. Data storage

The location for saving images and HTML reports is selectable from the Automatic
Inspection Routines Options tab (see page 175).
By default, the directory structure is:
C:\Users\Public\Public Documents\Dage\XRay\Patterns\Reports\[Pattern
Name]\Results\[Individual Destination Folder]
The [Individual Destination Folder] is created each each time the automated
inspection routine is run, using the date and time, or a serial number as the folder
name.
 If a serial number is not entered, for any reason, prior to using an automated
inspection routine, then those results are not stored in the system database in
the same directory.
 However, a report and the resulting images are still stored separately for this by
viewing (see page 214) or exporting (see page 216) the results at the end of the
run. The results are also stored in the automation directory using a date/time
code.
Click the Browse button to open a window allowing you to select the storage
location.
All automated measurement data such as from BGA and area-void analysis,
together with any manual grading and comments are also saved separately in an
ODBC compliant database. This can be accessed through SQL Server 2008 R2 or
2014. However, Nordson DAGE recommend you DO NOT use any third-party
software to connect to this database.
14.8. Viewing an automated inspection routine report off-line

The reports are saved as HTML and can be transferred, and viewed on any PC
using an Internet browser. The HTML format allows you to click on elements within
the report to see additional content, such as full X-ray images and results of
measurements.
The HTML format has been optimized for viewing with MS Internet Explorer.
The HTML reports use active content so ensure the browser Internet Options >
Advanced > Settings > Security are set to Allow active content to run from files on
my computer.
1. Select Automatic Inspections Routines mini tab > View Results tab.
2. Select the routine that is to have its report regenerated from the Serial No. drop
down list.
3. Click the Report button.
4. Configure the Report Details options:
 Select the required images. Limiting the number of pictures included in the
report saves disk space.
 Add additional title and comment text to be included in the displayed result. It
is recommended to include (as a minimum), the images of the failures and
the navigation map.

5. Click OK.
The report is generated and displayed. It is also saved to the hard drive and can
be accessed directly by browsing the directory structure (see page 214).
If the system is part of a network, the report is available to any other computer on
the network. This is particularly useful, for example, for passing data and images to
re-work stations.
If serial numbers are used for boards and/or patterns, then the results are stored in
successive sub-directories in the database with a separate HTML report for each
serial number. All subsidiary reports associated with a specific inspection routine
can be accessed via a link within the parent report. A sample report is shown below:
Item Description
1 Failure positions marked in:

 Orange - when failed manually.
 Red - when failed automatically.
2 Navigation map
3 Click on thumbnail image for full X-ray image of that step.
Only the center portion of the image is displayed in the
thumbnail.
If an automated measurement is part of the routine (for example BGA
measurement), then at that step in the report there is a further link to access more
detailed information.

Exporting the report

As the report is in HTML, it can contain links to additional images and information.
This additional data has to be located at specific places in the directory structure in
order for its correct display. While the data is within the system this is not a problem.
However, if the report is sent to another location (for example, by file copy or email),
the necessary links may not be correctly organized.
In order to overcome this, all exported reports are stored in user-defined, self-
contained directories. The top-level directory includes all images and HTML files
necessary to view the complete report. The whole directory can be copied or
emailed ensuring the report can be regenerated on other PCs.
When an inspection routine, which included a serial number, has completed, a
message window is displayed (if the system has been configured to display this
information).
 The full path of the report can be copied and pasted into Internet Explorer to
locate the file.
 The report can be viewed by clicking the link on the message window.
 Click OK to close this window.
To export a report, do the following:
1. Select Automatic Inspections Routines mini tab > View Results tab.
2. Select the routine that is to have its report exported from the Serial No. drop
down list.
3. Click the Export Report button. A standard Save As window is displayed.
4. Choose the name of the directory and the location in which to store the copy of
the report.
5. Click Save to confirm and store the data.
6. A message window is displayed confirming the report has been exported
correctly. Click OK to close this window.
264).
14.9. Results
The results are displayed in two HTML report formats:
 On-line (see page 217)
 Off-line (see page 217)
The system also generates a CSV format file. The filename format is
YYYYMODDHHMISS where:
YYYY = the year
MO = the month
DD = the day
HH = the hour
MI = the minute
SS = the second

264).
On-line reports
Select Automatic Inspections Routines mini tab > View Results tab.
The following controls and functions are available:
Control/Function Description
Serial No. Select the serial number of a previously run routine, if it is to

be reviewed. Otherwise the serial number, if any, of the most
recent run of the inspection routine is automatically displayed.
Tree diagram The results are displayed in a hierarchical tree diagram.
Expand and collapse controls are provided.
 A red cross indicates that a part or subsidiary part has
failed.
 A green tick indicates that a part or subsidiary part has
passed.
More details are given for each measurement the system has
made, by clicking on the relevant + symbol.
Off-line reports
The following are examples of off-line reports for various routine types.
BGA
Click on a ball to view detailed results for that ball.
This ball has passed all This ball has failed one or
the defined tests. more defined parameters.
This ball is bridged to This ball is missing, but
an adjacent ball. should be present.

The legend indicates if a ball has passed all of the defined tests. If a ball has failed
one, or more, of the defined tests, is a bridge, or is missing it is marked as a fail. A
missing ball is defined as a ball that should be present based upon the reference
sample but is not. It should not be confused with locations where balls are not
present in the reference device, for example in the center of the shown example.
Void

Wire Sweep

QFN

Pad Analysis


223
15. Using the Expert Image Wizard

The image wizard is used to establish a set of machine settings, termed a recipe, to
give a good picture of the part under inspection.
Select the Expert Image Wizard mini tab.
Before starting the image wizard, do the following:

1. Load a part (see page 44).
2. Switch on the X-rays (see page 52).
3. Make a navigation map (see page 70).
4. Decide on the specific region of interest, and position it in the center of the X-ray
image display area.
You start the image wizard as follows:
1. Select the Image Wizard mini tab.
2. Click the Start button.
The machine performs an automatic process (see page 224) to determine the
best tube settings based on the part being viewed including the level of
magnification. If this is changed significantly, then the image enhancement
selected may be inappropriate.
After determining most of the correct settings, four images are shown with
different contrast and brightness settings. The top left image is set so that the
darkest part of the image is black on the screen, and the lightest part of the
image white. In the other three images, the brightness and contrast are adjusted
to deliberately enhance low, medium or higher intensity objects.
3. Point to the image that best shows the detail required in the image and click the
left mouse button. The images are re-drawn with a finer level of adjustment. The
top left image is now the original selected in the previous step.
4. Choose the image that best suits the feature being inspected by clicking the left
mouse button over the image.

All of the machine settings are now set as the machine recipe, and the view can
be moved as normal to another part of the device.
5. Move the mouse over the image and press and release the left mouse button to
apply the new settings to the current image.
6. To stop the wizard routines and revert the system to the previous settings, click
the Stop button when active.
If required, the machine settings can be changed. Alternatively, this recipe may be
given a name and saved for future use. The image wizard results are also
automatically saved as a recipe named Last Image Wizard Result.
15.1. How the wizard works

The image wizard process follows an automatic sequence of steps that determine
the following parameters:
Step Parameter Description
1 Tube voltage The process uses one of four preset voltages, 60, 80,
100 and 120kV.
Starting at the lowest voltage the system looks for X-ray
penetration through the darkest (thickest) part of the
sample. If there is insufficient penetration, the voltage is
increased.
2 Tube power The power is increased as far as possible whilst
ensuring that no part of the image is saturated.
3 Contrast stretch The contrast is initially stretched so that the darkest part
of the image is black on the screen, and the lightest
white.
4 Image From the amount of contrast stretching applied, the
averaging noise in the image can be calculated. The number of
frames to average is calculated to reduce this noise to a
reasonable level.
5 Operator choice The remaining part of the process is left for you to
choose depending on the feature being viewed and
personal preference.

Using the Expert Image Wizard 225
The image processing capability of the system means that particular intensity levels
in the image can be considerably enhanced without significantly increasing the noise
levels.
Note: The images displayed are full-resolution. However, due to limited screen
space, only the center of the image is shown.
This whole process can take 30 seconds or more, but will probably only be used to
establish a process as all of these settings can be saved to a named machine recipe
and recalled at any time.
The image averaging may have been determined to be, for example, 512. However,
to save time the image is not refreshed on the screen during operation of the wizard
and therefore may look noisy.
You can refresh the image by moving the mouse over the image and then pressing
and releasing the left button.


227
16. Using the Image Optimization tools

Adjustments associated with the X-ray tube and the imaging system change slowly
over time, leading to a gradual change in performance of the system. To maintain
the machine in peak performance, it is necessary to reset these adjustments
periodically using an 'Optimization' process. Refer to the Quadra Installation and
Maintenance Guide for more detail on system maintenance.
The Optimization process establishes the correct settings for optimal performance of
the tube at different operating voltages. It allows the use of both built-in and custom
routines, for optimizing either across the complete tube voltage range, or at specific
voltages.
One or more of the following user-selectable operations can be performed during
tube optimization:
Operation Description
Centering This ensures the electron beam is traveling down the center of
the X-ray tube. It is crucial to good operating efficiency, as poor
alignment leads to a loss of X-ray output power and darkening
of the image.
Focus This is essential for obtaining sharp, well-defined images. For
the fine detail necessary to determine focus accurately, the
optimization process uses a focus aid fitted to the rear
underside of the manipulator table.
Equalization This ensures that the image brightness is even across the
whole field of view.
Efficiency This runs a special routine to ensure the tube is running as
efficiently as possible.
Please note: This is not normally required for NT4 tubes.
Profile This runs a routine to 'profile' the tube, It obtains the drawn
current at different power levels.
Please note: This is not normally required for NT4 tubes.
Optimize When checked, this acquires the required equalization images
exposure times for the different exposure times.
To enable/disable any of the above:
1. Select Menu > Screens > Options > Image Optimisation
This tab is only available to Engineers unless access has been given to
Operators and/or Supervisors via the Options (see page 258) screen.
2. Set or de-select the relevant checkboxes, as required.
Note: Some of these operations are evaluated for success during the automatic
procedure, and further steps may be taken if the first result is not satisfactory.
Select the Image Optimization mini tab.

Control Description
Optimization There are four built-in optimization types (see page 230)
Type drop available in the drop down list:
down  COMPLETE
 WIZARD
 CURRENT
 CENTER ONLY
If any custom optimizations (see page 230) have been defined,

their names are also included in this list.
A locked padlock symbol alongside an optimization type
indicates that the scheme is locked, and its configuration
cannot be changed.
The settings that are established by optimization tend to
change slightly as the machine warms up. Therefore, it is
recommended that at least one hour is allowed before
COMPLETE or WIZARD optimizations are used.
Optimize Now
Click to start (execute) the optimization process (see
page 230).
Stop Optimizing
Click to stop the optimization process.
Optimization As the optimization progresses, the indicators against each
display window voltage change, as follows:
 Yellow - the optimization is in progress.
 Red - the optimization has failed.
 Green - the optimization has completed successfully.
Only the voltage sequence applicable to the chosen
optimization is shown.
Skip warm-up Set this checkbox to skip the warm-up period at the start of the
optimization process.

Using the Image Optimization tools 229
Live Exposure Levels

Create Corr. Images
Click to acquire the images required to allow the
exposure time to be adjusted to one of four preset
options through the Options screen:
 Live (default)
 Short
 Medium
 Long. This is ideal for use when the Image is too
dark for useful inspection because of high density
samples.
This is only available in Engineer level access.
Equalisation Position
Go to position
Click to go to the equalisation position.
Save
Click to save the current location as the equalisation
position.
Grid position
Go to grid
Click to go to the focus grid position.
Image Defect Corr.
The detector may contain some defective pixels due to
the nature of its construction. These are minimized by
the use of an automatic defect correction algorithm.
Click to start the automatic operation to create a new
image defect correction map.
This function can only be accessed in Engineer level
access.
Go to default
Click to go to the default focus grid position.
Save
Click to save the current location as the focus grid
position.

Built-in methods
The four built-in optimizations operate as follows:
Operation Description
COMPLETE This optimizes all of the tube settings at all voltages. Depending on the
X-ray tube within the system, this process could take several hours to
complete. It is recommended that this process is run from time to time,
when the machine is likely to be unused. Nordson DAGE recommends
at least every six months.
WIZARD This is a similar process to COMPLETE, but only at the four Image
Wizard voltages; 60, 80, 100, and 120kV, which reduces the total time to
around 10 minutes. As it is quite likely that these are the most frequently
used voltages, this is often enough to restore the optimum settings in
many applications.
CURRENT This optimizes at the current voltage only and is often used where the
best possible image is needed for a very low-contrast part, highest
resolution or for a report.
CENTER ONLY This is used following a filament / crystal (dependant on the tube type)
change to compensate for the slight, inevitable change in electron
emission position.
Note: Sealed transmissive tubes have no field serviceable parts.
Custom methods
Where particular tube voltages are used frequently, appropriate custom optimization
sequences can be created, as follows:
1. Select Menu > Screens > Options > Image Optimisation
This tab is only available to Engineers unless access has been given to
Operators and/or Supervisors via the Options screen (see page 258).
2. Enter a name for the custom optimization sequence in the drop down list and
press Enter on the keyboard.
3. De-select the 'not required' tube voltages by clicking the relevant voltage
checkbox. As each voltage is deselected the tick is removed.
4. Click the Save button to save the custom sequence.
Note: Changes are only saved if the Save button is clicked.
Starting the optimization

1. Select Inspect > Image Optimization mini tab.
2. Select the Optimization Type required from the drop down list.
3. Click the Optimize Now button.
If an earlier run has not yet completed, a system prompt appears. Answer as
necessary.
The Optimization Window shows the optimization progress and the status of
each voltage setting.

Using the Image Optimization tools 231
4. The process can be stopped at any time by clicking the Stop Optimizing button.
Note: If there are failures, then starting the test again gives the option of trying
the failed voltages only.
When setting-up the machine, the order you should carry out the optimization
operations is as follows:
1. Run Image Defect Correction. Refer to the Installation and Maintenance Guide
for full details.
2. Run Create Corr. Images.
3. Run Complete Optimization.


233
17. Using X-Plane®

The X-Plane® capability of your Nordson DAGE X-ray inspection system uses a
proprietary tomosynthesis (CT) technique to generate a virtual 3D model from a
selected 2D field of view without the need to cut or destroy the sample. Once the 3D
model has been produced, it can then be sliced in any 2D X-ray plane and viewed
and/or saved for analysis using the supplied X-Plane® viewer.
Additionally, the 3D model data set can be exported into a third-party CT
visualization software package for the creation of rendered 3D views and other
additional analysis. Nordson DAGE can provide an additional visualization package,
if required.
The X-Plane capability provides you with the ability (amongst others) to:
 Investigate the position and size of voids at joint interfaces and other locations
in BGA/CSP/QFN/LGA.
 Identify Head on Pillow (HoP) and open joints.
 Separate and inspect the different layers within a Package on Package (PoP),
or MCM.
 Remove obscuring detail caused by side 2 features when needing to inspect
side 1 components.
 Investigate the quality and fill of thru-hole joints and vias.
 Identify tilted components and warpage.
 Analyze complex connectors.
 Examine the tracks in each individual board layer.
 Investigate embedded components.
 Make virtual micro-sections.
Note: The X-Plane capability is a licensed option. Contact your Nordson DAGE
Select the X-Plane Control mini tab.
This section provides detailed information on the following:

 Acquisition parameters (see page 234).
 Reconstruction controls and parameters (see page 234).
 Fiducials (see page 236).
 Remote fiducial set-up (see page 236).
 X-Plane operation (see page 237).
 The X-Plane viewer (see page 239).

Acquisition parameters
The following acquisition controls and functions are provided:
Control Description
Inclination This allows you to define the off-axis angle to be used by the detector
Angle for image acquisition. This can be set, by default, in 5 degree steps
from 30° to 60° from the drop down.
You can type any angle between 1° and 60° (as required) directly into
the text field.
Number of This allows you to select the number of projections/images to be
Projections acquired in a 360 degree rotation of the detector around the set field
of view. These images are used for CT model reconstruction.
The higher the number of projections the better the model, but at the
expense of increased acquisition time.
You can type a value directly into the text field.
Click to select the folder for saving the acquisition and reconstruction
images to.
Important: This folder must be set prior to starting an acquisition. If the
same folder is used each time, the new acquisition images overwrite
the existing ones.
Click to define and set the position and height of the remote fiducial.
Remote Set this checkbox if a remote fiducial is used during acquisition. Refer
Fiducial to Remote Fiducial set-up (see page 236) for details.
Click to start the acquisition process.
Click to stop the acquisition process.
Click to set the template and continue the process.
Instruction This displays any process instructions.

window

Using X-Plane® 235
Reconstruction controls and parameters

The following reconstruction controls and functions are provided:
Control Description
Slices Count This is displayed purely for reference and is not user-adjustable.
This value indicates the number of slices displayed in the Z-axis
in the model to cover the thickness determined by the Z Step
value.
Reconstruction This allows you to enter an offset in the number of slices to the
Plane Offset reference level defined using the Set Height feature.
As an example, with an Offset of 0, and a Slices Count of 240,
there will be 120 slices above the reference level, and 120
below.
For most acquisitions this should be left at zero and should only
be adjusted when the Region of Interest of the CT model is not
covered by the reconstruction. In this case, a new
reconstruction can be made using the same images but using
the new reconstruction parameters.
Number of This is used for reconstructing the CT model. It is set by
Iterations entering a value between 1 and 10.
A higher number of iterations produces a better model but takes
longer to reconstruct.
Scale This is displayed for reference only and is not user-selectable.
Projection
Adjust Z Step This allows you to vary the thickness over which the Slices
Count covers. It can be set from 0.1 up. Larger values allow a
larger thickness of the sample to be covered but there is greater
separation between each slice.
As this value is adjusted, the thickness of the model covered by
the slices is displayed in the text window. This value also
depends on the field of view used.
Click to generate an off-line reconstruction of the acquired
images. This allows you to make adjustments to any or all of the
reconstruction settings from the recently acquired image data
set, and then perform a reconstruction without the need to
acquire a complete new model.
If this control is 'greyed-out' then there are no suitable images in
the project folder to reconstruct.

Fiducials
A Fiducial is one or more defined features that are required to produce the
reconstructed CT model.
There are two modes of fiducial alignment available:
 In-model
This is suitable to use if the sample being viewed contains something with
cylindrical symmetry (such as BGA balls or vias) within the field of view that is
not obscured by other features during a full 360 degree rotation at the desired
inclination angle for the detector. The choice of which in-model fiducial feature
or features used is defined during normal X-Plane® operation.
Tip: Set the detector to the required angle of view using the angle control on the
measurement controls panel. Then perform a complete 360 degree rotation of
the field of view to ensure the selected fiducial is not obscured by something of
equal, or greater density.
 Remote
This mode should be used if a suitable in-model fiducial is not available. It uses
a feature outside of the sample field of view as the fiducial feature. The remote
fiducial is set-up (see page 236) in a separate operation prior to starting image
acquisition.
Remote Fiducial set-up

In order for the remote fiducial to function correctly, a fiducial feature needs to be
placed in a clear space on the sample tray. In this example illustrated below, a ball
bearing has been stuck to the sample tray. However, the remote fiducial could be
another non-obscured cylindrical symmetry object on the sample, for example, a via,
or a plated-through hole.
1. Set the Remote Fiducial checkbox.
2. Locate the remote fiducial feature to be used, and center it on the Inspect
Screen. See example:
3. Use the Set Height (see page 56) feature to set the reference level of the fiducial
feature.
4. Once complete and before moving the sample manipulator, click the Set Remote
Fiducial button.
The remote fiducial position and relative height level have now been set.

Using X-Plane® 237
The Set Height feature will subsequently need to be used again in order to set the
desired reference level of a selected feature in the field of view for image
acquisition. This does not change the calibrated position for the remote fiducial.
17.1. X-Plane® Operation

The following procedure outlines typical X-Plane operation:
1. Define the field of view to be used for analysis.
2. Use the Set Height feature to set an appropriate reference level within the
sample.
3. Ensure the Frame Average is set to a value other than Live. Between 16 and 128
is a suggested setting. A higher frame average produces a cleaner model by
improving the signal to noise ratio of the image, but at the expense of
acquisition time.
4. If a remote fiducial (see page 236) alignment is required, this needs to be set up
before starting the image acquisition, and the Remote Fiducial checkbox set.
5. Once the above steps have been completed, or an in-model fiducial is to be
used, continue this procedure.
6. Select the Project Folder for storing the images acquired.
7. Select, or enter the required Inclination Angle.
Tip: Choosing a high Inclination Angle normally produces a better model but
could result in losing information through other components obscuring the field
of view. Set the detector to the required angle of view using the angle control on
the measurement controls panel and perform a complete 360° rotation of the
field of view to ensure the selected fiducial is not obscured by any other
components during rotation.
8. Select, or enter the required Number of Projections.
9. Select the number of Iterations for the reconstruction.
10. If a remote fiducial is to be used, do the following:
 Ensure the Remote Fiducial checkbox is set.
 Click the Start acquisition button.
The routine adjusts the system manipulators to place the detector at the
desired inclination angle and move to the position previously set for the
remote fiducial feature.
 Hold down the left mouse button and draw an outline grid from the center of
the fiducial feature until it is completely enclosed. Ensure the enclosing
boundary is slightly larger than the feature being used. Only a single feature
can be used as a remote fiducial.

The fiducial outline grid may need to be adjusted to ensure an accurate

alignment if the fiducial is not centered within the red outline grid.
Place the mouse cursor to either the left or right of the red outline grid and
scroll the mouse wheel to move the red outline grid to the left or right outside
of the fiducial feature. Place the cursor above or below the red outline grid
and scroll the mouse wheel to move the outline grid up or down.
If you have an incorrect alignment or wish to reposition the fiducial, left click
within the red grid outline and redefine the new fiducial in the normal way.
 Proceed to step 12 below.
11. If an in-model fiducial is to be used, do the following:
 Ensure the Remote Fiducial checkbox is not set.
 Click the Start acquisition button.
The system moves to the selected angle.
 Hold down the left mouse button and draw an outline grid from the center of
the fiducial feature until it is completely enclosed.
The in-model fiducial approach allows multiple fiducials to be selected by
drawing around each one separately. Although one fiducial may be
sufficient, additional fiducials may help when a single fiducial might be
obscured by other components or features during the 360° image
acquisition. The system monitors all the fiducial features selected to ensure
accurate reconstruction.
Tip: Select similar cylindrically symmetric features if using more than one
fiducial.
If necessary, adjust a fiducial outline grid or redefine a fiducial as detailed

above.
The red outline grid turns blue to indicate it has been set when a second or
any subsequent fiducial outline grid is defined.
Reselecting a set fiducial outline grid by left clicking on it, deletes the fiducial.
12. Once all fiducials have been identified, click the Set and Continue button.
The system starts to acquire images using the parameters set. During image
acquisition, a small window is displayed below the Reconstruction parameters.
This window shows the fiducial feature selected as it is tracked during the 360°
image acquisition. In the case of several fiducial features being selected, the
best feature at that particular orbital angle is displayed. This allows you to
monitor the tracking of the fiducial feature, or features, and to decide if the
system has been set up correctly without the need to wait for the complete
model to be reconstructed.

Using X-Plane® 239
Once image acquisition is complete, reconstruction commences automatically

with progress displayed in the text window. Once reconstruction is complete, the
model is displayed automatically in the X-Plane® Viewer.
13. Click the Stop button at any time to halt the acquisition process.
17.2. X-Plane® Viewer

Once the images have been acquired, a CT model is automatically reconstructed
using the parameters previously set in the Reconstruction controls (see page 234)
and can be viewed in the X-Plane® Viewer.
The viewer is automatically displayed after reconstruction has completed. It can also
be accessed by selecting:
Menu > Screens > X-Plane
A comprehensive range of controls are provided (see page 240).
Item Description
1 Image position, Offset and Magnification parameter displays.

2 Image Load and Save controls.
3 Image view screen. The model can be moved around the screen by
holding the left mouse button down and dragging the image within the
view area. However, predefined short cut keys offer further functionality
(see page 242).
4 Video controls.
5 Image Enhancement Filter selection drop down.
6 Add, Remove and Clear filter controls.
7 Measurement tool tabs.
8 Image axis change controls.

9 Live Contrast Stretching selection controls.

10 Histogram
11 Image Brightness, Contrast and Reset controls.
X-Plane® screen controls

The X-Plane® viewer screen provides the following tools and controls:
Control Description
Image The currently displayed Slice Position, Angle Offset and

parameters Magnification values are displayed. These are read-only.
Axis The view displayed in the image window can be changed to one of
buttons the major axis by clicking the relevant view button.
The currently selected axis view button is highlighted with a blue
border.
Live Select one of the two stretch contrast filters that can be applied to
Contrast the image seen on the X-Plane® Viewer:
Stretching  Linear - This applies a standard stretch contrast using the
minimum and maximum gray levels in the image.
 Bright - This applies a stretch contrast using the minimum and
maximum gray levels in the image but emphasizes the bright
areas. This can lose some of the detail in the darker areas of
the image.
Both filters are dynamic and modify the on-screen image contrast
automatically as the image varies through the displayed slices.
Use live Set this checkbox to switch on the live contrast stretching feature.
contrast
stretching
Histogram Use this histogram display to improve the stretch contrast of the
displayed image.
Click near the green line using
the left mouse button to create
a linear modification spot. Click
near this spot with the right
mouse button to remove it. You
can add as many modification
spots as required.
The added points can be
grabbed using the left mouse
button and moved by dragging
the cursor around the
histogram.
Brightness Use to manually adjust the brightness of the image.

Using X-Plane® 241
Control Description
Contrast Use to manually adjust the contrast of the image.

Reset Click to restore both sliders and any histogram adjustment to the
default position.
Load
Click to navigate to, and load tomographic slices from a previous
model into the X-Plane® Viewer.
Save
Click to save the currently viewed image.
Save All
Click to save all (export) the reconstructed model tomographic
slices as an' Image Stack' that can be used by third-party CT
visualization software.
When exporting the images for external CT visualization the data
set contains the currently visible planar orientation (if it has been
modified from the original) together with the any contrast
adjustments and image enhancements that have been applied.
Video These controls operate in exactly the same way as their
controls counterparts on the main Inspect window. Refer to Using the video
tools (see page 245) for further details.
Drop down Select an Image Enhancement Filter. This is applied to an image as
soon as it is selected. These filters can be applied individually, or in
sequential combinations known as 'pipelines'.
Add
Click to add the currently selected filter to the pipeline displayed in
the field below the button.
Remove
Click to remove the last filter from the pipeline.
Clear
Click to clear all filters from the pipeline.
Measurements tabs
For the single slice displayed on the X-Plane® Viewer screen, outline and void
measurements can be made using the tools available on the following tabs:
Outline Measurements (see page 94)
Drawing Tools (see page 120)
Void Measurements (see page 122)

Control Description
User Drawn Void Measurements (see page 138)
Short Cut Keys

The model can be moved around on the screen by holding the left mouse button
down and dragging the image within the view area. However, the following keys
when used in combination with the mouse movement offer further functionality:
Key Description
CTRL Holding this key while holding the left mouse button down, allows you to
adjust the digital zoom within the tomographic model. Moving the mouse
to the left decreases the digital zoom and moving right increases it.
SHIFT Holding this key while holding the left mouse button down, allows you to
move through the slices. Moving the mouse to the left goes down
through the slices and moving right goes up.
CTRL + Holding both these keys while holding the left mouse button and then
SHIFT moving the mouse vertically or horizontally allows you to adjust the
plane of view of the slices.
For example, when in the Z-view, if an inspected device is warped
(tilted) with respect to a printed circuit board then the default slices will
be perpendicular to the board but not to the warped device. Using this
key combination allows the plane of view to be adjusted so the slices are
made perpendicular to the device rather than the board for better
analysis and/or an indication of the warpage angle of the device relative
to the board.
Once the plane of view has been changed then the full X-Plane analysis
is available in the normal way on this revised planar view. Clicking on
one of the axis view buttons (for example the Z) returns the slices to the
original slice view.

243
18. Printing and Saving the image

The following controls are provided on the Inspect screen to print and save the X-ray
image:
Button Description
Save
Click to save the X-ray image. A standard Save As dialog is
displayed:
 Select the desired destination location.
 Choose an appropriate output format from the choices available.
 Name the file and click Save.
Save
Click to save the X-ray image and callouts. A standard Save As
dialog is displayed:
 Select the desired destination location.
 Name the file and click Save.
The image is saved in .jpg format.
Print
Click to send the currently displayed X-ray image to the default
printer. A standard print dialog is displayed:
 Enter a title and the number of copies required.
 Click Print.
If the printed image is black, ensure the Compatible Printing
checkbox is set on the Options screen.
See your Engineer for printer configuration details.

Image size considerations

The XY size of the display is the size of the area between the left- and right-hand
control panels (or the screen edge, if these are side panels are disabled) where the
X-ray image is displayed. Images saved with reports are also this size.
The image being displayed is scaled and cropped to best fit the display area and to
give the best possible usage of the display. In general, the image dimensions are
scaled down so one edge fits the display exactly, whilst the other edge requires
cropping. However, if the image size is smaller than the display, then no image
conversion is performed. This can happen (for example), if the X-ray application is
displayed on a high-resolution monitor.
Because of the way images are displayed, it is not possible to create graphic
overlays larger than the image on the screen. Since the images saved with reports
often have overlays drawn over them, images saved with overlays are the size of
the displayed image. However, this is not the case for raw images saved without
overlays as these are saved at the maximum system size.
There are two options which allow this behavior to be enhanced, they can be
enabled in the More Options screen (see page 38).
 Crop image to monitor. This enables the above default sizing scheme, or when
set to FALSE, reduces the scaling of the image so that no cropping occurs. This
is so that you can see the entire image when setting up an AIR. However, this
can result in white space on one dimension in order to meet this restriction.
 Hide right panel during AIR. This simply hides the right-hand control panel (if
visible) making the display area larger and so increasing the saved image
dimensions. With this option selected, the display size increases and therefore,
so does the image size. The right panel is hidden at the start of the AIR and
restored at the end of the AIR.
Setting the Save Image defaults

The default settings for saving images is set:
Select Menu > Settings > More Options... > Image save.
For JPEG format, the quality of the image, an option to include any overlays with the
saved image and an option to include a logo with the saved image can be
configured.
Note: Settings made here are also applied to images saved as part of any Automatic
Inspection Routine or Automatic Measurement.

245
19. Using the Video tools

The video recording function allows you to record the main X-ray image on-screen
during inspection in the following ways:
 Live during sample movement.
 As the X-ray image is averaged when sample movement stops.
 Continuously, or for a user determined time, after the averaging process is
complete that allows inclusion in the video of the fully contrast-stretched and
fully-enhanced final X-ray image.
The video recorded is as displayed on the Inspect screen, including Quad screen
view, Pseudo color and any overlays used.
Note: If overlays are used during the video recording, the Video Calibration (see
page 246) needs to have been completed.
The video recording option adds the facility to record the X-ray image, both live and
during averaging, as an AVI file. This file can be viewed using the Windows Media
Player or many other video handling programs.
The AVI file format is a wrapper format. This means that the images inside the file
can be in many different formats. For example, they could be uncompressed, or
compressed using many different compression methods, such as MPEG, CinePak,
Indeo, MJPEG or Windows Media 9.
The type of compression used is determined by the codec
(Compressor/Decompressor) selected. Some codecs are supplied with Windows OS
and additional codecs can be installed from the Microsoft website or obtained from
other companies.
Note: Any third-party codecs used must be 64-bit versions and compatible with
Windows 10 64-bit.
Using compression in the finished file is a trade off between speed of acquisition
and final file size. Saving uncompressed images is much faster than compressing,
but the saved file can be very large. For example, a file of one minute of live X-ray
video with 1280 x 1024 pixels per frame in uncompressed format will be about 1 GB
in size.
Video recording is controlled by four buttons and a recording indicator on the Inspect
screen.
Button Description
Record
Click to start recording the X-ray image in a video file.
The recording indicator turns red.
Pause
Click to pause the video recording.
The recording indicator turns yellow.
Stop
Click to stop the video recording, and close the video file.
The recording indicator turns off.

Button Description
Change filename
Click to change the video file name.
Recording indicator
This is lit during recording as indicated above. However, after the
video recording has been completed, this indicator may continue to
flash yellow. This indicates the video compression is still active and
playback of the video cannot be performed until this has completed.
19.1. Setting the video capture options

The video capture controls need to be turned on from the Options screen which is
only available for Supervisor access.
Select Menu > Screens > Options > Show Controls
The video capture controls are enabled on the Inspect screen and in the Video
Capture Options section of the Options screen by selecting the feature from the drop
down list.
The Video Capture group on the Options screen controls all the video capture
options, as follows:
Option Description
Resolution This determines the frame size (in pixels) of the images that are
saved. The smaller the image, the faster the save and smaller
the file size, but there is less detail in the images.
Resolutions greater than the fitted detector size are not displayed
in the list.
The image is stretched to fit the size it is being saved at. So if a
size is chosen that does not have a 4:3 aspect ratio then the
image is distorted.
Calibrate The system should be calibrated before videos are recorded.
This is necessary to set the frame rate (number of frames per
second) of the video. If you do not calibrate then the videos are
not replayed at the correct speed. The calibration process
determines the speed to use for each of the image sizes, both
with and without compression.
When the system is being calibrated the recording indicator turns
green. The progress indicator shows how much of the calibration
has been completed and progress messages are displayed in
the message text box.
If you try to record a video without calibrating, you are asked to
calibrate before recording the video.
Change This opens a filename dialog allowing you to choose the filename
Filename to use when a video is saved.

Using the Video tools 247
Option Description
Change The default Codec is generally sufficient for all applications and
Codec should be set to Microsoft Video 1.
However, if you want to use a different Codec then a pre-
installed Codec can be selected from the drop down list. Once a
Codec has been selected, a warning message is displayed
requesting the video capture system is recalibrated.
Any third-party video Codecs installed must be native 64-bit
versions and compatible with Windows 10 64-bit OS. Your local
Nordson DAGE representative can offer more advice if required.
Settings Some Codecs allow you to configure certain settings, such as
the compression ratio, or the record and playback speed.
Click to open the selected Codec setting panel (if available).
Save live If selected, then the live image is saved during averaging. If not
images selected, then the averaged image is saved as it builds up.
Pause If selected, then recording is paused automatically a given time
recording after averaging finishes. This saves recording an unchanging
image. Recording resumes when the image changes. The
progress indicator counts down the time to when the recording is
paused.
Stop If selected, then recording stops after the specified time interval.
recording The progress indicator counts down the time to when the
after n recording pauses. Recording only continues when the sample is
seconds moved.
Note: As an example, if a video is required of a complete
inspection routine then this function enables you to take as long
as necessary to inspect the sample in real time but only n
seconds of that time is included in the video. This makes for
smaller file sizes.
Disk space If selected, then a warning is displayed if the free disk space
warning goes below the specified value.
Automatically If selected, the filename has a number appended to it. This is
increment automatically incremented each time a recording is started. If
filenames selected with the options shown above, then the next file is
saved as test_0.avi. The one after that is test_1.avi and so on.
Include If selected, this includes any overlays on the screen to be
overlays recorded with the video, e.g. any void or BGA outlines.
Timestamp A timestamp can be attached to the video.
This can be displayed as Frames, Seconds or the industry
standard SMPTE, which displays hours, minutes, seconds and
frames in a single display.


249
20. Database viewer

Note: This tab is available in Engineer level access only.
Select Menu > Screens > Database Viewer
The tab provides a range of controls that enable the following actions:
 Connection to an existing database (see page 249).
 Refreshing of displayed database details (see page 250).
 Viewing and deleting existing:
 Automatic inspection routines (patterns) (see page 250).
 Pattern results (see page 250).
 BGA measurement details (see page 251).
Note: Maintenance of results includes deletion of old or unwanted records.
Database Connection
The default connection is ODBC Data Source and all parameters are automatically
set.
1. Click Test Connection to check the set-up details are valid. A system message
giving the test result is displayed on completion.
2. Following a successful connection, click Save Connection to save this set-up.
Alternatively, the database connection can be configured to use the SQL Native
Client. This allows the X-Ray application to connect to an existing database, or a
database on a separate server.
Note: The saved automatic inspection routines and results are linked to the serial
number of the X-ray system they were created on. This means routines created on
Machine A may not be accessible to Machine B in the case of a common server for
the database.
To set the X-ray software to use the SQL Native Client, do the following:
1. Select SQL Native Client Connection Type in the Database Connection section.
2. Enter or check the parameters for connection in the following fields:
 Server - this must be <<PC Name to connect to>>\DAGESQLEXPRESS.
 Database Name - (this is already set and should not be altered).
 User Name (UID) - (this is already set and should not be altered).
 Password (PID) - (this is already set and should not be altered).
3. Click Test Connection to check the set-up details are valid.
A system message giving the test result is displayed on completion.
4. Following a successful connection, click Save Connection to save this set-up.

If a database connection fails, contact your local Nordson DAGE representative for
assistance.
Read only database access

In some cases, access to the Dage SQL database is required, in order for third party
software to access the stored information. To facilitate this, a read only account has
been created:
 Read only username: DageXrayReader
 Read only password: DageXR@3
Database Details section

Select Menu > Screens > Database Viewer > Database Details
 Click the Refresh Data button to update the displayed summary that shows how
many different patterns, routines and sets of results are stored in the database.
 Click the Backup Data button to allow the database to be exported to a location
of your choice.
 Click the Restore Data button to allow you to select the database to be restored.
Patterns
Select Menu > Screens > Database Viewer > Patterns
To view the details of an automatic routine (pattern), select it from the Routine
names drop down list. The details of the selected routine are displayed.
Using the appropriate button, you can:
 Delete the current routine.
 Delete all routines.
A warning message is displayed before deletion.
Pattern Results
Select Menu > Screens > Database Viewer > Pattern Results
To view the results of an automatic routine (pattern), select it from the View Results
drop down list. The details of the selected results are displayed.
 View results.
The results are shown in a results tree and each branch can be expanded or
collapsed using the + or - buttons.
 Delete the current results.
 Delete all results.

Database viewer 251
BGA Routines
Select Menu > Screens > Database Viewer > BGA Routines
To view the automatic measurement details of a BGA Routine, select it from the
Measurement drop down list. The details of the selected measurement are
displayed.
 Delete the current measurement.
 Delete all measurements.
Note: Care must be observed when deleting automatic measurements as these
could stop automatic inspection routines from working correctly if the deleted
routine was used by them.


253
21. System configuration

 Settings on the Options screen (see page 253).
 User access (see page 257).
 User names (see page 258).
 Licensed functionality (see page 259).
21.1. Settings on the options screen

The Options screen is generally only available to an Engineer level user unless
access has been specifically given to Operators and/or Supervisors.
Select Menu > Screens > Options
The following options and functions are configurable:
Clearance Sets the maximum height of the sample allowed on the sample
Height holder to prevent collision with the detector. This can be between
20mm (Minimum) and 200mm (Maximum).
Compatible When selected, printing could be slower but work with a wider
printing range of printers.
Live Smoothing
Smoothing This function improves the quality of the image when the
level machine is used in live mode. It is either On or Off and the
amount of smoothing used is set using the slider bar. If the slider
is set to the left it provides down to 50% smoothing and if set to
the right it provides up to 100% smoothing. However, this can
result in a blurring of the image if the on screen sample is moved
quickly.
Image optimization
Optimisation There are four built-in optimization types (see page 230)
Type drop available in the drop down list:
down  COMPLETE
 WIZARD
 CURRENT
 CENTER ONLY
If any custom optimizations (see page 230) have been defined,

their names are also included in this list.
A locked padlock symbol alongside an optimization type
indicates that the scheme is locked, and its configuration cannot
be changed.

Voltage For a custom optimization sequence, you can de-select the 'not
selection required' tube voltages by clicking the relevant voltage checkbox.
window As each voltage is deselected the tick is removed.
The deselected voltages will not be included in the sequence list
displayed in the Optimization Display Window on the Image
Optimization mini tab.
Checkboxes Set one or more of the available optimization operation
checkboxes, as required:
 Tube Focus
 Centring
 Equalisation Images
 Efficiency
 Profile
Save
Click to save a custom optimization sequence.
Show controls
Recipe buttons The four left-hand options, when selected, enable the
appearance of the image recipe buttons.
Drop down list Selecting Video capture controls from the drop down list turns on
those controls on the Inspect screen.
If Scale Indicator is selected, the video controls are replaced by
an adjustable scale setting.
Dose controls Setting this checkbox enables a further mini tab on the Inspect
screen, which allows the control of the amount of radiation
dosage received by a sample in the X-ray machine (see page
256).
Video Capture
The Setting the video capture options (see page 246) topic contains full details on
the controls in this section.
Low Dose Mode
Permit Low This allows the system to be configured to keep unnecessary
Dose Mode exposure to X-rays to a minimum.
When the system is in the Low Dose Mode, the tube power is set
to zero after the time set by Low dose predelay, the image
remains on the screen and all image processing and
measurement functions are available. When the machine is next
moved, or the X-ray settings are changed, the system resets the
power to the previously selected level and the system performs
as normal. There may be a few seconds delay before a new
image is displayed following any change to the system power,
voltage or position as takes a finite time for the X-ray tube to
regain the appropriate voltage and power levels.

System configuration 255
Low dose This defines the time (in seconds) that the system has to be
predelay static (no change in X-ray settings and/or no movement) before
entering the Low Dose Mode.
Image Correction
Distortion Due to the construction of image intensifiers, there is some
Correction natural distortion of the image around the edges of the screen.
This option allows for a correction of the distortion to show the
images as flat. The distortion correction uses maps which are
generated during the machine setup and calibration using a
special calibration jig. This is particularly important when using
the CT option.
Systems using Flat Panel Detectors (such as the Quadra) do not
have this distortion effect, but this feature is still available.
If distortion correction maps do not exist, an error message is
displayed. In the event of this occurring, contact your local
Nordson DAGE representative.
Defect In some cases, it is useful to be able to view the uncorrected
Correction image from the detector. To allow this, you can switch off the
defect correction algorithm by unchecking this box.
Set this checkbox to reapply the correction to hide any defective
pixels in the detector.
Login
Force login If selected, all users are forced to log in at the start of a session.
Switch off X- If selected, the system automatically turns off the X-rays when
rays on logout the user logs out.
Timeout This sets the time (in minutes) for a period of inactivity, after
which the system automatically logs the user out.
Equalisation (Active)
Drop down list This selects the equalisation type to be applied:
 Non-Linear
 Classic
 None
Aspire Exposure Time (Active)
Drop down Select an appropriate exposure time:
 Live (default)
 Long
 Medium
 Short
This setting changes the sensitivity of the Aspire Flat Panel
Detector in a similar way to the ISO setting for a digital camera.
Accessibility options

Operator Double click a control to set Yes or No to allow or disallow an

Operator-level user access to a particular screen or function
shown in the list.
Supervisor Double click a control to set Yes or No to allow or disallow a
Supervisor-level user access to a particular screen or function
shown in the list.
Refer to User access (see page 257) for full details.
CT System Options
This is an optional extra. Refer to the separate user guide for the 3D CT Option.
When fitted, extra features can be enabled using the following controls:
 CT Scanning Enabled
 CT Frame inserted
 Save QuickView Angle File
 Automatic Remote CBR
Dose controls
Setting the Dose controls checkbox on the Options screen, enables the following
mini tab on the Inspect screen. This mini tab provides controls that allow you to
control the amount of radiation received by a part in the X-ray machine.
Select the Dose Controls mini tab.
The system displays:

 Dose (rad) - This is an indication of the cumulative dose for the current part.
 Dose rate (rad/hr) - This is the current dose rate based on the state of the X-ray
tube
 Exp. Dist. (mm) - This is the exposure distance. It is calculated as the distance
between the top of the tube and the bottom of the sample tray.
The dose calculator is accessed as follows:
1. Click the Calc button.
The calculator provides a number of user-definable parameters. These allow
you to determine the best settings for the X-ray system to perform the required
inspections. Modify the values, as required.
2. If you have changed any of these user-definable parameter values, click the
Recalc button to update the dose rate and sample dosage values.
3. Once you are satisfied with the settings, click the Apply button to apply the dose
rate and sample dosage values to the system.
Due to physical limitations within the system, it may not always be possible to
set the exact settings requested. If this is the case, the system chooses values
as close as possible to those requested.

The System Limits section of the calculator allows you to set a maximum
dosage that is acceptable for an individual part. If the Enable Limit control option
is selected the system warns the user when the dosage for the current part
reaches 75%, 80% and 90% of the limit. When the dosage reaches 99% X-rays
are turned off and they remain off until the part is removed. The cumulative
dosage amount is reset every time that the sample door is opened.
Note: Dose information is provided as a guide only based on the tube output. The
effects of packaging and shielding by other components on the sample will affect,
and probably reduce, the true dose to the radio-sensitive parts. Therefore you must
make external dose measurements to confirm the true dose for specific applications.
21.2. User access

A powerful feature of the Gensys application is the ability to configure the user
access rights. Options that are not allowed for a particular level of user access are
simply removed from being seen on-screen (see page 258).
It is assumed in this guide that the user access level is set to Engineer.
Four levels of user access are possible:
Operator No password.
Supervisor Supervisor password required, if set.
Engineer Engineer password required, if set.
Factory Factory key required - Nordson DAGE use only.
The user access level can be changed as follows:
Select Menu > Access and choose the appropriate access-level option.
Setting a password
Passwords can be set against Supervisor and Engineer user levels, if required.
However, after software installation or re-installation all passwords are cleared by
default. A password is set as follows:
1. Select Menu > Access and choose the appropriate access-level option.
2. Select the Password menu option.
3. Enter, and then verify the new password for this level.
4. Click OK.
If at any stage a password is forgotten, the passwords can be cleared using the
Clear Passwords disk generated at system installation. However, a Clear
Passwords disk can be created from the install media. Refer to creating a password
access disk in the Installation and Maintenance guide.

Setting user access options

Operator and Supervisor access to various system functions and options are
granted by an Engineer level user on the Options screen.
Select Menu > Screens > Options
The Options screen is generally only available to an Engineer access level user
unless access has been specifically given to Operators and/or Supervisors.
However, only an Engineer can allow or disallow access to various operating
functions for the Operator and Supervisor user levels.
The following table is displayed in the top right hand corner of the screen:
To change the access rights for a particular access level, double click in the correct
column for the function/option to be changed. This toggles the Yes/No values.
In order to protect the system from accidental alterations the System Setup screen
option is set (by default) to No. However, it can be seen by an Engineer access level
user as Read Only - unless the system is set to Factory Access.
Note: Alterations made to the System Setup options by unauthorized personnel will
invalidate the machine warranty.
21.3. User names

The user name function allows the management (by name) of the system operators.
Please be aware that there is no direct link between the user names and the access
levels of the system.
The current user name is saved in the database along with test result whenever an
automated inspection sequence is used. This allows the identification of the operator
who created the test results.
To access the user name functions select Menu > Screens > Users
Managing user names

The following functions are available to manage the user names:
Function Procedure
Create new  Type a unique name (this can be a short name, or nickname)
user in the User Name box.
 Type a complete name into the Full Name box (if required).
 Click Save User.
Edit existing  Select the user to be edited from the list.
user  Change any of the details, as required.
 Click Save User.
Delete user  Select the user to be deleted from the list.
 Click Delete User.

Function Procedure
Change user  Select the required name from the list.

This user’s full name is displayed in the title bar of the main
application.
21.4. Licensed Functionality

Some functionality of the Gensys application requires licensing in order to operate.
This includes the X-Plane® option. Please contact your local Nordson DAGE
Note: License files are not transferable between different systems.
The licensed features of your system can be checked by:
Selecting Menu > Setup > Licensing...
The displayed Licensing screen gives details of any functionality already available
through the license.
 If a purchased option is not available, please contact your local Nordson DAGE
representative.
 If a new license file is required, your Nordson DAGE representative will require
certain information about the system the license file is required for. This can be
obtained as follows:
 Click Copy Machine Details.
 Paste the information into a Notepad file.
 Send this file to your local Nordson DAGE representative.
 If new options are required for a system with an existing license file, this can be
exported to a user defined folder and then sent to your Nordson DAGE
representative for the option to be added, as follows:
 Click Export License.
 Navigate to a suitable folder.
 Click Select Folder.
 Send the file to your local Nordson DAGE representative.
Once a new or updated license file has been received, do the following:
1. Save the license file to the system control computer.
2. Click Import License and navigate to where the file has been saved.
3. Click Open.
4. Restart the Gensys application. This is required for the new license to become
active.


261
22. Technical reference

This section contains technical information on the following:
 Understanding filters (see page 261)
 Report export formats (see page 264)
 Setting the operating language (see page 266)
 Radiation measurements and units (see page 271)
22.1. Understanding Filters

Note: These topics are intended to give Engineers an understanding of filter creation.
Some understanding of XML is assumed.
The file FiltersAndMethods.xml itself is written in XML V1.0 standard format and is
made up of three parts:
 A commenting section, briefly describing the filter and pipeline definition.
 A filter-kernel section, where single filter kernels are defined.
 The pipeline section, where filter pipelines are defined as filter chains.
A knowledgeable user can alter the settings in this file manually and make new filter
kernels or pipelines available in the program. All definitions must be placed inside
the tag-pair:
<FiltersAndMethods> and </FiltersAndMethods>
The filter kernel

A filter kernel is the typical mathematical notion for defining an enhancement filter
operator. Enhancement filters operate from an input image, calculating an output
image pixel-by-pixel.
Each resulting pixel PR in the output image is calculated from the corresponding
pixel on the input image AND some surrounding pixels.
In this example, only the pixels immediately surrounding the pixel of interest are
considered.
Input image Output image
There are many ways of image enhancing. However the most common, and the
type used on the Nordson DAGE machine, is to weight each pixel in the input image
such that:
PR = (P0·W0 + P1·W1 + P2·W2+ P3·W3+ P4·W4+ P5·W5+ P6·W6+
P7·W7+ P8·W8) / N

This means that N=9 weighting terms (W0 to W8) need to be defined. It is usual to
show these as a matrix, which from this point will be referred to as filter kernel.
Defining filters
Filter Kernels are part of the filter definition. All filter definitions must be placed
inside the tags <Filter> and </Filter>.
The following XML sample shows how to define a filter kernel in
FiltersAndMethods.xml:
Individual filter kernels are defined inside the tag pair <Kernel> and </Kernel>. The
kernel weights are defined row by row. Currently, only square sized filter kernels are
supported, which means that the size of the kernel row and column per kernel must
be equal, e.g. 3x3, 5x5, 7x7, etc. One row is defined as space separated list of
integer values inside the tag pair <row> and </row>.
All filters must have an individual name, defined by the Name attribute. A filter can
have a Category attribute, defining the class of the filter, e.g. Edge for edge-defining
filters, etc. If the category is omitted, the filter is inserted into the Other category by
default.
Filters can have different kernels which differ by their kernel type. The Type
attribute(s) must define consecutive integer values, beginning with 1. Each new
kernel type defines a completely new filter operator which is accessible through the
filter name. The kernel size may vary from type to type, e.g. allowing 3x3, 7x7, etc.
sized kernels defined for one filter.
Depending on the filter a Strength slider is provided to vary the effect. A value of
zero (0) turns the filter off.

Technical reference 263
Single Filters
The X-ray application automatically creates a single filter-pipeline for every defined
kernel.
These single filters cannot be changed from within the program. They can, however,
be used as filters in the normal way. Each of these user defined single filters has
strength settings which are defined in the Image Enhancement mini tab. It is also
important to note that some of the built-in filters have different kernel types.
Built-in filters
Apart from the user defined filters, the system has a number of built-in filters, which
do not show up in the filter definition section of FiltersAndMethods.xml. These built-
in filters cannot be changed or overwritten. They are, however, listed in the pipeline
definitions section in the default version of FiltersAndMethods.xml. If one of the built-
in filter pipelines is deleted, the filter can no longer be used.
The Pipeline section

Filter pipelines are historically named Methods in the FiltersAndMethods.xml file.
Therefore, if the Engineer wishes to define a new pipeline, it must be done inside a
<Method> and </Method> tag pair. The following is an example covering all aspects
of the pipelines:
All filter pipelines must be given an individual name in the Name attribute. An
additional Permit attribute shows or removes the pipeline from the basic user Image
Enhancement mini tab; its values can be true or false.
A pipeline executes each of its single filters one by one in the same order as they
are written down in FiltersAndMethods.xml from top-to-bottom. One filter within a
pipeline is always defined inside a short <Filter> and </> tag pair (see example). A
filter must have a name set by the Name attribute and this name must be either that
of a built-in filter or that of a filter defined in the filters-section of
FiltersAndMethods.xml. This filter can be differentiated further by a Kernel Type, the
Type attribute, and, where applicable, have its strength set by the Strength attribute;
0 to 100 in integer steps.
Note: Filters can only ever be used when they are defined in the pipeline section of
FiltersAndMethods.xml.

22.2. Report export formats
What is Exported?
The data file can be saved as either CSV or XLSX format.
CSV format (see page 265)

CSV format conforms to the following specification:
 Locale information is used when writing the file, so that it imports correctly into
Excel. For example, in the UK the decimal point character is ‘.’ and the
separator character is ‘,’. In Germany, the decimal point character is ‘,’ and the
separator character is ‘;’.
Strings are surrounded with double quotes, for example:
 UK 1.23,"abc","string, with separators",,,,
 Germany 1,23;"abc";"string; with separators";;;;
 Leading and trailing spaces in a field are ignored. String fields are written
without leading and trailing spaces.
 All lines are padded with separator characters so that they have the same
number of fields (ten).
 The last field in a line does not have a separator character after it. So each line
has nine separator characters.
The first line of the file contains header information, followed by the data for the first
feature on the second line of the file and so on. The data saved is:
 Test Sample ID  Diameter
 Feature ID Number  % Roundness
 X position  Area
 Y position  % Overall Void
 Pass / Fail result  % Largest Void
If the Number manual features option is not selected, then the Feature ID Number
column is empty.
If another set of void analysis data is added to the same file, then the header
information is not repeated.
XLSX format (see page 265)

XLSX format allows the saved file to be opened with Microsoft Excel or equivalent
compatible software.

Sample CSV Data File

If the string 'Sample 123' had been entered into the Test Sample ID edit box, then
the data file for the results displayed above would be:
"Test sample", "ID" , "X Position", "Y Position", "Result", "Diameter (um)", "%
Roundness", "Area", "% Overall Void", "% Largest Void"
"Sample 123",1,150,100,"fail",1200,100.0,1.132,1.7,1.7
"Sample 123",2,100,200,"fail",1200,100.0,1.132,0.0,0.0
"Sample 123",3,450,90,"fail",1200,100.0,1.132,1.6,0.8
If the Test Sample ID was changed to 'Sample 456' and some more voids were
measured (four in total), then the new data was saved to the same file, the new file
would contain:
"Test sample", "ID" , "X Position", "Y Position", "Result", "Diameter (um)", "%
Roundness", "Area", "% Overall Void", "% Largest Void"
"Sample 123",1,150,100,"fail",1200,100.0,1.132,1.7,1.7
"Sample 123",2,100,200,"fail",1200,100.0,1.132,0.0,0.0
"Sample 123",3,450,90,"fail",1200,100.0,1.132,1.6,0.8
"Sample 456",1,150,100,"fail",1200,100.0,1.132,1.7,1.7
"Sample 456",2,100,200,"fail",1200,100.0,1.132,0.0,0.0
"Sample 456",3,450,90,"fail",1200,100.0,1.132,1.6,0.8
"Sample 456",4,650,90,"pass",1100,100.0,0.998,1.6,0.8
XLSX Results
The report is output in the Excel xlsx format. This format is part of the Open Office
XML specification (see ISO/IEC 29500) and is used for representing spreadsheets.
The term Pad is used instead of ball because the X-ray system can be used to
analyze all shapes of solder pads and not just round BGA ball pads.
Field Description
Operator Name of operator logged on when the analysis was run.

Date The date the analysis report was generated
Lot no Lot no associated with sample
Total Area Field of view area in microns
Pad Count Number of solder pad areas analyzed
Total Pad Area Sum of all the Pad Areas analyzed in microns
Total Pad Area
Total Pad Area/Total Area as a percentage
Ratio
Total Void Area Sum of all the Void Areas detected in microns
Total Void Area
Total Void Area/Total Pad Area as a percentage
Ratio
Pad Number Number of the pad as labeled in the image
Pad Area Pad area in microns
Void Area The area of the voids in the pad microns
Void Ratio Percentage area of the pad that has voids

Field Description
Void Count Number of voids detected in the pad

Pass if both Pad Area and Void Ratio are within the
Grade
analysis limits
The following is an example of the form of the report:
22.3. Setting the operating language

The Nordson DAGE X-ray machine supports multiple languages.
You can change the Gensys application operating language as follows:
1. Select Menu > Language
2. Select the required language from those listed on the menu.
It may take a few seconds for the application screens to change to the new
language.

Further language translations can be created by your local Nordson DAGE

representative. Please contact them to discuss your requirements.
Note: To be displayed properly, some languages may require an appropriate
operating system font or language pack to be installed.
Importing a new language file

Once a new language file has been created, it can be imported into Gensys, as
follows:
1. Select Menu > Language > Import Language
A standard Open dialogue opens.
2. Navigate to the required language file (.dmsg) location.
3. Click Open.
4. Answer Yes or No as appropriate when prompted to switch to the new language.
Language hierarchy
There are three levels of hierarchy in the translation of languages. The contents of
the levels are text files, extracts of which are shown in the example below.
Translation example for the word 'Operator':
Step Action Text
1 Check Customer preferences MOperator=&Technician

file.
Yes=O.K.
If not found, step 2.
2 Check selected language file. HoldDelay=Temps de Maintien
Yes=Oui
No=Non
If not found, step 3. MOperator=&Operator
3 Check standard English file. HoldDelay=HoldDelay
Yes=Yes
No=No
MOperator=&Operator
Note: Any software upgrades only include updates to the English language file.
Refer to Updating a language file (see page 271) for details on how to update the
local language file.
Format of language files

The following topics describe how to create and modify language files. It is important
that the master language file (English(US).dmsg) is not altered in any way.
All the language files follow the format outlined below.
The example given is for the master English translation file.
[Messages]
Yes=Yes
No=No

Grade=Grade
GradeLastTest=Grade Last Test
SampleIncomplete=Sample is incomplete
The text [Messages] indicate to the system that this is a language file. The remaining
lines specify the text associated with a label as described below:
Label=text
The label is used by the system as an identifier; each one is unique and must not be
changed. The system searches through the file looking at each of the labels. Each
label is recognized, and the text following the equals sign (=) is read as the text
associated with the label.
There are some formatting options that may be used, as described below:
Long lines
Some text is split onto two lines by the use of a 'new line' as shown below:
QSaveSample=Current Sample is unsaved.\rDo you want to save the
sample?
The text "\r" is a formatting identifier indicating a new line is to be started.
Data within the text

Sometimes it is necessary for the system to adapt the text with some specific
information. An example is shown below:
MustEnterUserField=You must enter a value in the '%s' field
In this case the text %s indicates that this is the point to substitute the text. Other
substitutes such as %d or %t for numbers may also be used.
The position of the substitute text can be altered to suit the translation, but it must
not be removed, or the meaning of the message will be lost.
Disabling lines
It is possible to disable translation lines from being used. A good example is the
default custom definition file, where all of the labels and standard English
translations are listed for convenience, but they are all disabled as follows:
SampleIncomplete=!Sample is incomplete
The exclamation mark (!) disables the text from being used.
Comments
A line in the language file that starts with a ; or a # is a comment and is ignored
when the file is read.
For example,
;Japanese Translation
Shortcuts
Menu and dialog box items can sometimes be chosen by using an 'Alt' key shortcut.
For example, 'Alt+F' for the File menu. The letter to use for the shortcut is specified
by placing an & in front of it. For example, MAccess=&Access would specify that
pressing the 'Alt+A' keys as the Access menu shortcut.
However, these shortcuts are not normally used in the X-ray system.

Creating custom definitions of terms

There is a hierarchy of message translation (see page 267). The first point of
reference is the custom file, located in
C:\Users\Public\Documents\Dage\XRay\Options
This file is for customer use, and any of the messages or names that appear on the
Gensys screens can be changed by editing this file.
Using a text editor such as Notepad, you can open the file, which contains every
reference label and associated text, all disabled.
Important: The text editor used must be able to save files in UTF-8 format.
There are some label conventions, as follows:
TNewSample=!New Sample
MPassword=!&Password
AChangeTestSettings=!Test Group screen
The first letter helps indicate where the text is used. In these cases:
T = a tab on top of the screen
M = a menu item from the top menu bar
B = A button
Q = A Question
TT = On screen tool tips
X = Any text in a dialog box
For example: Change the word Operator to Technician in all menus.
1. Open the file C:\Users\Public\Documents\Dage\XRay\Options\Custom.dmsg using
Notepad (or equivalent text editor).
2. Use Search to locate each occurrence of the word Operator.
3. On the right side of the equals sign only, substitute the word Technician.
4. Remove the exclamation mark (!) to enable the substitution.
5. Save the file in UTF-8 format.
The following lines should have been modified:
Before
ASetupOperator=!Setup | Operator screen
MOperator=!&Operator
TOperator=!Operator
Operator=!Operator
ErrorSavingOperatorPrefs=!Error saving operator preferences
ErrorLoadingOperatorPrefs=!Error loading operator preferences
After
ASetupOperator=Setup | Technician screen
MOperator=&Technician
TOperator=Technician
Operator=Technician
ErrorSavingOperatorPrefs=Error saving technician preferences
ErrorLoadingOperatorPrefs=Error loading technician preferences

To turn on the changes, select any another language then return to your chosen
language.
Note: It can take a few seconds for the screens to be updated.
The modified custom.dmsg file can be copied to any other Dage X-ray machine, as
long as the system OS is the same.
Creating a new language

This topic is included for those customers who wish to create a translation file where
one does not exist. Dage would normally expect our agents to provide the
translation. However we recognize that this may not be possible or convenient.
Language files have the extension .dmsg.
1. Open the file custom language file, using Notepad (or any equivalent text editor,
as long as the file can be saved as UTF-8.).
Important: Do not change this file.
2. Use the File > Save As menu option to create a copy. Enter a suitable filename
(this appears in the language menu). The file extension must be .dmsg.
For example, to create a Polish translation file, the filename 'Polski.dmsg' would
be appropriate.
Add a comment (a line starting with ; or #) at the top of the file saying what
language this is in English e.g. '; Polish translation'.
3. Next translate the contents (see page 267) of each line on the right side of the
equals sign (=) in turn.
There is naturally a limited amount of space available on some parts of the
screen, so take care to be as brief as possible.
Important: Don't forget to remove the ! after the = to enable the translation.
4. Save the file in UTF-8 format to an easily accessible location (e.g.
C:\Users\Public\Documents\Dage\XRay\).
5. Use Import Language (see page 267) from the menu bar and set the local
language.
Carefully check each screen in turn for errors, or for missing or truncated text.
6. Use Export current language (see page 271) and save the file to an easily
accessible location (e.g. C:\Users\Public\Documents\Dage\XRay\).
7. Make any necessary changes to the file and use the import function to update
the local language and set the language as required.
Note: It can take a few seconds for the screens to update.
An example of how to use the custom.dmsg file to translate entries to German is
shown below:
; Custom
MAccess=!&Access
MOperator=!&Operator
MSupervisor=!&Supervisor
MEngineer=!&Engineer
TInspect=!Inspect
TEngineer=!Engineering
; German

MAccess=&Zugriff
MOperator=&Bediener
MSupervisor=&Techniker
MEngineer=&Einrichter
TInspect=Inspektion
TEngineer=Einrichtung
Note: The use of the English language description at the start of the translated file
and the removal of ! from the beginning of each translation. In some lines & has
been used to indicate short cut key access if this feature is switched on in the
Windows operating system.
Updating a language file

Following a software upgrade, and the first time the X-ray machine is started, the
following actions occur:
 The currently selected language file is scanned and compared with the new
master English language file. Any new lines found in the English are added to
the selected language file, in English, but set to disabled by use of an
exclamation mark (!).
 The custom definitions file is similarly scanned.
Note: It is only necessary to translate the extra lines added. Other language files
can be updated in this way by selecting each in turn from the language list.
 Any item that is in the local language or custom file but is not in the english file
is deleted. It is either a mistake, or an old translation of some text that no longer
exists.
 The local language file can then be exported to an easily accessible location
(e.g. C:\Users\Public\Documents\Dage\Xray\) and any new entries in English
can be translated as required.
To export the local language, do the following:
1. Ensure it is selected as the displayed language.
2. Select Menu > Language > Export Current language
A standard Save As dialog opens.
3. Select the file save location.
4. Click Save.
If the language file already exists either overwrite it, or save it with a new file
name.
5. Modify the language file as required (see page 267) and save it in UTF-8 format.
6. Use the Import Language (see page 267) function to import and set the modified
local language file.
22.4. Radiation measurements and units

 SI Units (see page 272)
 Alternative units (see page 272)

SI Units
There are two quantities of radiation dose in use:
 Absorbed Dose (D)
A measure of the energy that is deposited in a material per unit mass from any
interaction with radiation.
 Equivalent Dose (HT)
This is the absorbed dose modified by a weighting factor (Wr), to take into
account the different biological effects that arise from irradiation of tissue with
different types of radiation.
The relationship between equivalent dose and absorbed dose is given by: HT = D x
Wr.
The units of radiation measurement are defined by the International System of Units
(SI)
Quantity SI Unit
Activity Becquerel (Bq) (disintegration's per second)

Absorbed Dose Gray (Gy) (J Kg-1)
Equivalent Dose Sievert (Sv) (Gy x Wr)
Note: Wr is the weighting factor.
Type of Radiation Wr
X-rays, -rays,  particles 1

Neutrons and Protons 5 - 20
 Particles 20
Note: For X,  and  radiation the Gray and the Sievert are numerically equal. This is
because in this case Sv = Gy x Wr = Gy x 1.
Alternative units
Some countries (for example, the USA), use alternative units.
Quantity Alt. Unit SI Unit Conversion
Activity Curie (Ci) Becquerel (Bq) 1 Ci = 3.7 x 1010

Bq
Absorbed Dose RAD Gray (Gy) 1 rad = 0.01 Gy
Equivalent Dose REM Sievert (Sv) 1 rem = 0.01 Sv
Note: REM stands for Roentgen Equivalent Man.

Therefore 1μSv per hour (10-6 Sv/h-1) is equivalent to 0.1 milli-Roentgens per hour
(10-4 rem/h-1)

273
23. Principles of operation

This section gives additional background information on the operating principles
behind Nordson DAGE Quadra X-ray Microscopes. This knowledge is not essential
to the normal operation or maintenance of the machine. However, it is included as
appreciation may help in diagnosing and solving unusual problems not covered
elsewhere in this guide.
The operation of the X-ray tube (see page 273) and imaging system (see page 278)
is usually the least familiar technology to production-line engineers and technicians,
therefore, the majority of this section is devoted to a background on these topics.
23.1. X-ray generation

 The electromagnetic spectrum (see page 273).
 Simple X-ray generation (see page 274).
 Controlling current flow (see page 275).
 X-rays from the tungsten target (see page 276).
Electromagnetic spectrum
The term X-rays describes electromagnetic radiation in a certain energy band. Other
energy bands are known as radio, microwave, visible, ultraviolet and so on. The
boundaries between one band and another are rather loosely defined as shown
below:
No. Description No. Description
1 Gamma ray 6 Microwave

2 X-ray 7 Radio
3 Ultraviolet 8 Shorter wavelength - higher frequency - higher
energy
4 Visible 9 Longer wavelength - lower frequency - lower energy
5 Infrared

Energy in any electromagnetic field is made up of discrete packets called photons.

The wavelength of a photon is inversely proportional to the energy used to create it.
This means more energetic photons have a shorter wavelength.
Photons that we can see as (for example) red always have the same energy. If the
red light becomes brighter, we are simply seeing more photons every second.
Red light has an energy of about 1.5 eV (electron Volts), violet light around 3 eV.
A photon of energy more than 12 eV is termed ionizing radiation and can damage
other materials as it has sufficient energy when impacting another atom to remove
an electron. This is particularly important when considering the potential damage to
the cell structures of our own bodies. The Quadra X-ray machines generate photons
with a maximum energy of 160,000 eV. This energy is clearly a health risk, hence
the extensive use of lead shielding within the equipment.
Simple X-ray generator

A simple method of generating X-rays is shown here:
No. Description No. Description
1 Vacuum chamber 5 Hot cathode

2 Anode (Tungsten) 6 X-rays
3 Electron 7 High voltage generator (30kV to 160kV)
4 Velocity (energy)

Principles of operation 275
Two electrodes (the anode(2) and the cathode(5)) are suspended in a vacuum
chamber (1) and connected to a high voltage power supply (7).
As the cathode is heated to a sufficient temperature, electrons (3) become more
energetic, and can obtain sufficient velocity (4) to leave the surface of the material.
As atoms are usually of neutral overall charge (the electrons balancing with the
protons), the loss of a negatively charged electron leaves a net positive charge on
the cathode.
As opposite charges attract, the electrons move back to the surface of the cathode.
This process happens continuously and creates a cloud of electrons on the cathode.
The process is called 'Thermionic Emission'.
However, if a positive potential is available nearby, then the electrons may be
attracted towards it provided the voltage gradient from the electrons to the anode is
greater than that to the cathode.
In the X-ray generator above, the potential on the anode accelerates the electrons
towards the more positive potential. When the electrons hit the anode, a small
(<1%) proportion have some of their energy converted to X-rays (6). The maximum
possible energy of the X-ray photon in electron-volts is equivalent to the accelerating
potential – i.e. 1000V creates X-rays up to a maximum energy of 1000 eV.
Controlling current flow
No. Description
1 Anode (Tungsten)
2 Control electrode
3 Hot cathode
4 High voltage generator
5 Variable voltage generator

The addition of a control electrode (2) modifies the voltage gradient to the anode (1).
The negative potential on the control electrode can be set to create an additional
hurdle for the electron to pass.
Electrons with sufficient energy (velocity) will make it past the control electrode, and
then accelerate normally to the anode. However, lower energy electrons will not be
able to overcome the negative voltage gradient of the control electrode, and
therefore return back to the cathode (3).
By changing the negative potential (5) on the control electrode, the current flow to
the anode can be regulated from maximum (no control voltage) to zero (high
negative voltage). This is the principle of the thermionic triode or amplifier valve.
X-rays from the tungsten target

The Bohr model of the atomic structure is used here to describe what happens when
an electron hits an atom of tungsten in the target.
The main principles of this model are:
 Electrons orbit around the nucleus of the atom.
 The nucleus contains protons and neutrons that make up most of the atomic
mass.
 Protons have a positive charge and electrons a similar negative charge.
 There are usually equal numbers of protons and electrons so the net charge is
zero.
 Electrons can only exist in special orbits around the nucleus.
 An electron in a bigger orbit has more energy than one in a smaller orbit.
It is a common principle of physics that any object will give up its energy if possible.
Therefore, if an electron is in a high orbit and there is space in a lower one, then it
will move to the lower orbit and lose that energy as electromagnetic radiation. The
difference in energy levels determines the energy of the photon.
 - Relative energy
 - Wavelength (nm)

In the illustration above, an electron impacts a tungsten atom from the lower right. In
doing so, it gives an electron additional energy which means it must enter a higher
orbit. However, this is an unstable state and the electron must decay back to the
lower orbit and release that energy in the form of a photon.
Depending on the orbital energy levels, the photons have a number of discrete
energies and therefore wavelengths as shown on the X-ray spectrum chart. This
radiation is known as Characteristic Radiation and is unique to the target material.
In the illustration above, an electron enters a tungsten atom from the lower right, but
does not impact an electron. However, its direction is changed and an amount of
energy is lost.
This loss of energy (velocity) is converted to a photon. The more energy lost by the
electron means more energy in the photon and hence the shorter the wavelength.
As these interactions are random, a broad band of wavelengths are generated, but
limited to the maximum energy of the incident electron as shown on the X-ray
spectrum chart.
This radiation is known as Brehmsstrahlung which means 'braking radiation' and is
retained from the original German to describe the radiation which is emitted when
electrons are decelerated or 'braked'.

In practice, both methods of X-ray generation are present, and the X-ray output
spectrum is a combination of both as shown above.
23.2. Imaging with X-rays

When imaging with X-rays the following points need to be considered:
 X-rays travel in straight lines and cannot be focused by conventional means.
 Denser objects absorb more X-rays and create a shadow on the imager.
 The shadow is larger than the object by the geometric magnification.
 Moving the object closer to the X-ray source increases the magnification.
The detector (shown below) accepts incoming X-ray photons, converts them to
visible photons, amplifies them (depending on the detector type) and creates a
visible image for the operator that is representative of the varying intensity of the
incoming X-rays. For example, in an image intensifier, a CCD camera shows the
results of the output screen.
No. Description
1 X-ray source
2 Object
3 Detector
4 Camera
The Importance of Spot Size
 The size of the X-ray source determines the sharpness of the image.
 A small spot ultimately allows smaller details to be seen at extreme
magnifications.
The diagram below shows how a sharp edge is imaged by different X-ray sources.
X-ray source Object Detector Picture
Large Blurred edge
Small

X-ray source Object Detector Picture
Sharpest
Smallest
edge


281
24. Index Creating an auto wire sweep routine • 93,

103, 109, 180
A Creating automatic measurement routines
About this manual • 6 • 101, 103
Adding additional image enhancements • Creating or editing an Automated

59, 62 Inspection Routine • 166, 188
Adding and removing void areas D

manually • 139
Dage Precision Industries Limited
Adding image filtering and Software License - EULA • 5
enhancements • 85
Data storage • 166, 214, 215
Adjusting for the best image • 59
Database viewer • 33, 120, 249
Adjusting the contrast • 47, 59, 62, 67
Defining inspection steps within an
Adjusting the histogram • 30, 67, 80, 81 automated routine • 170, 188, 197
Adjusting what you see • 51, 53 Defining the inspection steps • 166, 180
Automatic image processing • 62, 67 Deleting a routine • 101, 120
Automatic Inspection Routine Controls • Document signal words • 9
166, 206
Drawing Tools • 93, 109, 120, 123, 241
B Drawing tools - basic operation • 121
Blob Detector • 123, 132
E
C Editing inspection steps within an
CAD editor controls • 141 automated routine • 185, 188, 198, 199
CAD Template Editor • 39, 94, 141 Executing a routine • 101, 118
Changing the magnification • 53, 54 Exporting Data • 123, 136
Compliance • 7 F
Contact information • 4 Finding the ball outline • 100, 129
Creating a BGA routine • 103, 180 Foreword • 3
Creating a CAD template • 150
G
Creating a filter pipeline • 60, 83, 85
Getting an image • 51, 52, 67
Creating a new routine using the
Automatic Inspection Routine (AIR) Getting ready • 97
wizard • 167, 188, 189, 204 Getting started • 41, 51
Creating a Quad Flat Pack No-Leads Grading options - logging passes and
routine - Quadra • 93, 103, 112, 180 failures during automated inspection •
Creating a solder pads analysis routine • 180, 188, 202
93, 103, 116, 180 Gray scale equalization • 59, 60
Creating a Template Based Analysis •
139 H
Creating a void measurement routine • Hazardous Energies • 13
103, 108, 180 Hazardous materials • 19
High voltage hazard • 19
How the wizard works • 223, 224 More options screen • 31, 37, 38, 53, 54,
73, 75, 76, 95, 101, 104, 109, 112, 115,
I 116, 124, 128, 129, 155, 159, 160, 205,
244
Image averaging • 59, 62, 66
Moving the image around • 29, 53
Image controls • 35, 63
Moving the machine • 14
Imaging with X-rays • 273, 278
Importing an existing CAD template • N
152
Noise reduction • 62, 66
Importing and using CAD data • 166,
167, 211 O
Inspecting a sample • 51 Operating software • 27
Inspecting die, BGA and general voids Operator grading and viewing options •
automatically • 166, 181 181, 187, 198, 210
Interior layout • 25 Operator reference image and prompts •
Iso-centric oblique angle viewing • 56 172, 181, 185
Operators safety rules • 13
L
Outline Measurements • 93, 94, 241
Labels • 10
Licensed Functionality • 31, 253, 259 P
Live Image Smoothing • 62, 68 Part location and alignment • 181
Loading/unloading a sample • 41, 44, Principles of operation • 273

223 Printing and Saving the image • 35, 38,
Local safety rules • 19 39, 51, 159, 160, 161, 162, 243
Lock Out - Tag Out procedures • 15 R

Low Resolution Monitor Option • 37 Radiation measurements and units • 261,
271
M
Re-establishing the supplies • 17
Machine controls • 35
Reference • 7
Machine layout • 21
Report export formats • 137, 216, 217,
Machine overview • 21 261, 264
Making a navigation map • 37, 51, 69, Results • 166, 216
70, 72, 190, 205, 212, 223
Right hand control panel • 30, 79
Manual image settings • 59, 98, 188
Right-click menu • 29
Marking defects on the navigation map •
69, 71 S
Maximizing magnification • 41, 47, 59 Safe disposal instructions • 20
Measuring ball grid arrays (BGA) Safety information • 9
manually • 97
Safety interlocks • 14
Measuring ball outlines • 97, 99
Sample handling • 14
Menu functions • 31
Sample holders • 41, 46, 59, 188
Mini tabs • 34
Second Monitor Option • 37
Index 283
Selecting and Running the Template Using the Analysis tools • 35, 93
Based Analysis • 140
Using the annotation tools • 30, 75, 76
Selecting user • 51
Using the Automatic Inspection Routine
Setting the height • 35, 54, 56, 106, 156, tools • 35, 37, 69, 101, 120, 140, 165
158, 159, 160, 177, 236
Using the automation wizard • 101
Setting the operating language • 261, 266
Using the Board Image tools • 34, 69
Setting the video capture options • 245,
Using the Expert Image Wizard • 35, 223
246, 254
Using the Image Enhancement tools • 35,
Setting up the workstation • 41
59, 79, 83
Settings on the options screen • 33, 35,
Using the Image Optimization tools • 35,
253
227
Software interface • 28, 33
Using the Image Processing tools • 34,
Starting, saving and running an 67, 79
automated routine • 101, 102, 108,
Using the map • 69, 72
109, 111, 116, 118
Using the Measurement tools • 30, 35,
Statutory regulations • 18
39, 54, 57, 155
Switching the machine off in an
Using the Video tools • 35, 241, 245
emergency • 41, 49
Using X-Plane® • 33, 35, 233
Switching the machine off normally • 41,
48
V
Switching the machine on • 41, 42
Video processing and other function
Switching the X-rays off • 51, 57 buttons • 35
Switching the X-rays on • 51, 52, 223 Viewing an automated inspection routine
System configuration • 253 report off-line • 118, 166, 214
Viewing at an angle • 45, 53, 54
T
Void measurement controls • 122, 123
Technical reference • 261
Void Measurements • 93, 97, 122, 241
Template Based Analysis • 94, 139
Threshold detection • 123, 129, 132 W
Warming-up the X-ray tube • 31, 41, 44
U
Understanding Filters • 85, 261 X
User access • 31, 51, 253, 256, 257 X-Plane® Operation • 233, 237
X-Plane® Viewer • 233, 239
User Drawn Void Measurements • 93,
138, 242 X-ray generation • 273
User names • 33, 51, 253, 258 X-ray safety • 17
Using Annotations • 34, 38, 39, 75
Using annotations to mark faults • 75
Using automatic inspections • 166, 198,
204
Using Image Recipes • 30, 52, 59, 89, 98,
123, 188

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Quadra X-ray Microscope

Nordson DAGE Support Options

 Third-party documents for:

6. Adjusting for the best image 59

7. Using the Board Image tools 69

9. Using the Image Processing tools 79

10. Using the Image Enhancement tools 83

11. Using Image Recipes 89

12. Using the Analysis tools 93

12.6. Template Based Analysis 139

13. Using the Measurement tools 155

14. Using the Automatic Inspection Routine tools 165

14.5. Using automatic inspections 204

15. Using the Expert Image Wizard 223

16. Using the Image Optimization tools 227

17. Using X-Plane® 233

18. Printing and Saving the image 243

19. Using the Video tools 245

20. Database viewer 249

21. System configuration 253

22. Technical reference 261

23. Principles of operation 273

24. Index 281

FCC - Radio and television interference

© 2017 Nordson Dage Ltd.

Environmental impact statement

© 2017 Nordson Dage Ltd.

DANGER indicates an imminently hazardous

© 2017 Nordson Dage Ltd.

This indicates that X-rays are emitted

This indicates that you should read and understand the

© 2017 Nordson Dage Ltd.

This indicates the presence of high voltages within the

This indicates the presence of a high voltage on an

© 2017 Nordson Dage Ltd.

This indicates the presence of compressed air.

This indicates the presence of high voltages within the

This indicates the presence of high

© 2017 Nordson Dage Ltd.

2.3. Operators safety rules

2.4. Hazardous Energies

© 2017 Nordson Dage Ltd.

2.5. Moving the machine

2.6. Sample handling

2.7. Safety interlocks

© 2017 Nordson Dage Ltd.

2.8. Lock Out - Tag Out procedures

Electrical isolation and lockout

© 2017 Nordson Dage Ltd.

Pneumatic isolation and lockout

© 2017 Nordson Dage Ltd.

2.9. Re-establishing the supplies

2.10. X-ray safety

© 2017 Nordson Dage Ltd.

2.11. Statutory regulations

© 2017 Nordson Dage Ltd.

2.12. Local safety rules

Appointed safety personnel

Routine checks of X-ray cabinet

2.13. Hazardous materials

2.14. High voltage hazard

© 2017 Nordson Dage Ltd.

2.15. Safe disposal instructions

Material or Substance Area of Use Disposal