Course Course Name L-T-P - Credits Year of Introduction

code.
MP463 Micromachining Methods 3-0-0-3 2016
Prerequisite: MP 212 Machine Tools
Course Objectives
 To give an overview of various techniques used for machining in the micro scale.
 To understand the theory of micromachining.
 To introduce various applications of MEMS.
Syllabus
Introduction to Micro System design, Micromechanics, Micro fabrication techniques, Principles
of micromachining, Mechanical micromachining processes, Advanced micromachining processes,
Micro electro mechanical system fabrication.

Expected outcome .
The students will be able
i. To gain knowledge on the structure of materials in the micro scale.
ii. To understand various micro machining processes and to differentiate its uses.
iii. To select and apply the suitable micro machining process as per needs of design
References:
1. Jain V.K., Advanced Machining Processes, Allied Publishers, New Delhi, 2007
2. Jain V.K., Introduction to Micromachining, Narosa Publishers, New Delhi, 2009
3. Madore J., Fundamental of Micro Fabrication, CRC Press, 2002.
4. Mark J. Jackson, Micro fabrication and Nanomanufacturing, CRC Press, 2006.
5. Mohamed Gad-el-Hak, The MEMS Handbook, CRC Press, 2006
6. Peter Van Zant, Microchip fabrication, McGraw Hill, 2004.
7. Sámi Franssila, Introduction to Micro Fabrication, John Wiley and Sons, UK, 2004.
Course Plan
End
Sem.
Module Contents Hours
Exam
Marks
Introduction to Micro System design, Material properties, Structural
behavior, sensing methods, micro scale transport –feedback systems.
I 6 15%
Micromechanics: Microstructure of materials, its connection to
molecular structure and its consequences on macroscopic properties
Micro-fabrication: Bulk processes – surface processes – sacrificial
II processes and Bonding processes– Wafer IC manufacturing – PSM – 6 15%
IC industry-New Materials-Bonding and layer transfer devices.
FIRST INTERNAL EXAMINATION
Mechanical micromachining: Theory of micromachining-Chip
III formation-size effect in micromachining-- microturning, 7 15%
micromilling, microdrilling –microgrinding
Advanced micromachining processes: Abrasive jet micromachining,
Abrasive water jet micromachining, Ultrasonic micromachining, Laser
IV 7 15%
beam micro machining- Electrical Discharge micromachining, Wire
Electrical Discharge micromachining,
SECOND INTERNAL EXAMINATION
Electro chemical micromachining, Electro chemical microgrinding,
V 8 20%
Electron beam micromachining, Focused ion beam machining,
 Chemical micromachining
Abrasive flow nanofinishing, Magnetic abrasive nanofinishing
Micro electro mechanical system fabrication: Introduction –
Advances in Microelectronics – characteristics and Principles of
VI MEMS – Design and application of MEMS - Materials for MEMS – 8 20%
MEMS fabrication- LIGA– Microsystems packaging- Future of
MEMS.
END SEMESTER EXAM

Question Paper Pattern

Maximum marks: 100 Time: 3 hrs

The question paper should consist of three parts

Part A
There should be 2 questions each from module I and II
Each question carries 10 marks
Students will have to answer any three questions out of 4 (3X10 marks =30 marks)

Part B
There should be 2 questions each from module III and IV
Each question carries 10 marks
Students will have to answer any three questions out of 4 (3X10 marks =30 marks)

Part C
There should be 3 questions each from module V and VI
Each question carries 10 marks
Students will have to answer any four questions out of 6 (4X10 marks =40 marks)

Note: In all parts, each question can have a maximum of four sub questions