See discussions, stats, and author profiles for this publication at: https://www.researchgate.

net/publication/338832300

Experimental and Numerical Studies of Heat transfer through Heat Sinks in

Electronic devices

Conference Paper · December 2019

CITATIONS READS

0 405

5 authors, including:

Mohd Adil Asif Khan Khan

Indian Institute of Technology Madras Uzhhorod National University
5 PUBLICATIONS   3 CITATIONS    2 PUBLICATIONS   1 CITATION   

SEE PROFILE SEE PROFILE

Mohammad Altamush Siddiqui

Aligarh Muslim University
98 PUBLICATIONS   699 CITATIONS   

SEE PROFILE

Some of the authors of this publication are also working on these related projects:

Experimental and Numerical study of pool boiling View project

performance enhancement of absorption systems View project

All content following this page was uploaded by Mohd Adil on 11 February 2020.

The user has requested enhancement of the downloaded file.

 43RD NATIONAL SYSTEMS CONFERENCE ON INNOVATIVE AND
EMERGING TRENDS IN ENGINEERING SYSTEMS( NSC-2019)
Department of Mechanical and Industrial Engineering, IIT Roorkee

Experimental and Numerical Studies of Heat transfer through Heat Sinks

in Electronic devices
Md Adil, Asif khan, Abhishek gupta, Sohail Ahmad, M. Altamush Siddiqui

Department of Mechanical Engineering, ZHCET

Aligarh Muslim University 202002
*corresponding author email: mdadil@zhcet.ac.in
Abstract
Experimental and numerical studies on heat transfer from heat sink of a CPU have been conducted. The heat sink
is made of Aluminium (k= 202.5 W/mK) having a base dimension of 34.17x60.5 mm with 12 fins over it. Among
them, two fins are 2.36 mm and 10 fins are 1.25 mm thick. Temperatures of the fin base and tips were recorded
with the help of a data logger for various velocities including the free convection. Heat flux of magnitudes 4.8 W,
7.3 W, 9.9 W were supplied to the heat sink by means of a nichrome wire heater. The numerical simulation was
carried using a computational fluid dynamics (CFD) model developed using commercial software package
ANSYS Workbench. The dimensions for analysis were taken same as it is for the actual heat sink. Different values
of the heat transfer coefficient of the surrounding media varied from h=5 W/m2K to 20 W/m2K were taken. The
contour plots are presented for different heat fluxes and heat transfer coefficients. The optimum value for the heat
transfer coefficient is found to be around 16 W/m2K for the efficient working of electronic device. The
experimental results in terms of temperature are compared with numerical solutions that are found in good
agreement.

Keywords: Heat sink, Ansys, Computational Fluid dynamics

1. Introduction
Extended surfaces are employed for cooling electronic systems by proper regulation of its temperature up to
allowable limit. Research and development on heat sink has a long history, and is still continuing with efforts to
improve its design and performance by bringing innovations in modeling and analytical techniques. The
development of various heat sink with various fin geometries have revolutionized the heat sink industry. The
very first experiment conducted by Starner and McManus [1] presents free convection data for four rectangular
fin-arrays in three positions including the vertical position from the fin base. An experimental investigation was
conducted by Welling and Wooldridge [2] where free convection heat transfer take place from rectangular fins
attached to a vertical plate. They found that there is an optimum fin height for maximum heat transfer with
particular fin spacing. Harahap and McManus [3] have reported the pattern of flow associated with free convection
heat transfer from horizontal fin arrays. Computational Fluid Dynamics (CFD) codes are widely used as a tool for
thermal analysis. However, CFD-based thermal analysis is not necessarily easy to perform where the object of
analysis is geometrically complex. With the advent of CFD in recent years, computation of flow and heat transfer
have become quite possible. Arularasan and Velraj [4] optimized the geometric parameters for the rectangular
heat sink by conducting CFD modeling and simulation in Ansys-Fluent and found certain specific values of the
same. Lee [5] concluded that the cooling performance of a heat sink depends on different types of parameters
including thermal conduction resistance, dimensions, location and concentration of heat sources as well as the
airflow bypass conditions. Air cooling investigation on heat sink with square module array in electronic devices
reported by Mohammad [6]. H. Yuncu and G. Anbar [7] reported experimental results on free convection heat
transfer on rectangular fin arrays taking base plate horizontal and by varying parameters like fin height, fin
spacing, and power supply 8 W to 50 W. Paisarn et al. [8] based on real PC conditions, performed numerical
simulation on mini rectangular fin with the de-ionised water as cooling medium.
In present work, experimental and numerical heat transfer studies with air have been carried out on a heat sink of
a CPU. The experiment was conducted for different heat flux by means of a nichrome wire heater. And for the
same configuration, numerical simulation was carried out by a computational fluid dynamics (CFD) model
developed using the commercial software package ANSYS Workbench. Different values of the heat transfer
coefficient of the surrounding media, varied from h=5 W/m2K to 20 W/m2K, were studied in order to find its
optimal value. The contour plots are presented for different heat fluxes and heat transfer coefficients and compared
with the experimental observations. Experimental and numerical values are also validated.

2. Experiments
2.1 Experimental setup

The experimental arrangements are shown in Figs. 1 and 2. It has an Aluminium heat sink with base dimension
of 34.17x60.5 mm and 12 fins in which 2 fins are 2.36mm thick and 10 fins are 1.25mm thick. Such heat sinks
are generally employed on a processor in a CPU. A heating element made from nichrome wire embedded on an
iron plate is used for providing heat flux at the base of the heat sink. A data logger is used for recording
temperatures. The asbestos sheet is used for restricting heat loss at the base of the heat sink. Eighteen T type
(Copper and constantan) thermocouples are used for recording the temperatures. A voltmeter and an ammeter are
used for measuring heat supply. A dimmerstat is used for controlling the power provided in the experiment.

Fig. 1 Schematic diagram of experimental fin arrangement

Voltmeter

Ammeter Heat sink

under study

Voltage
Data logger
controller

Fig. 2 View of Experimental setup

2.2 Data collection

The experiments are conducted for the heat flux of magnitudes 4.8 W, 7.3 W, 9.9 W. Heat was supplied to the
heat sink by means of a nichrome wire heater. Here copper-constantan thermocouples are used in the experiment,
which is also called T type thermocouples. Figure 3 shows various thermocouples attached to different fins namely
A1, A2, and A3. At the central part, two thermocouples are attached to fin, namely B1 and B2. Three
thermocouples are attached to the rightend fin in named C1, C2, and C3. And one thermocouple is attached to the
base of the fin named as BB. The temperature was recorded with the help of Data logger (Next Sense
Technologies, 16 channels) for the base and tips of various fins at different air velocities including free convection.
Heat supplied was estimated by means of voltage and current to the heater.

Fig. 3 Top view of the heat sink with attached thermocouples Fig. 4 Heat sink model developed

3. Numerical scheme
3.1 Modeling and Design of heat sink
Generally heat sinks are made of Copper and Aluminium, because they have a desirable value of
thermal conductivity. But mostly Aluminium is chosen for the heat sinks as it is easily available and cheaper than
copper. Therefore material for a heat sink in the commercial package ANSYS FLUENT and experiment
Aluminium having thermal conductivity as 202.5 W/mK [9] is chosen. The detailed specification of the heat sink
model developed in ANSYS is shown in Figure 4.

3.2 Meshing and Simulation.

The numerical simulation was carried out by a CFD model developed using the commercial software package
ANSYS Fluent. The dimensions for analysis are taken same as it is for the actual heat sink. The structured mesh
was generated using the Hexa-dominatrix method. The number of nodes and elements is 804730 and 177270
respectively. The heat transfer coefficient (HTC) of the surrounding medium varied from h=5 W/m2K to 20
W/m2K.

3.3 Governing equations

The general form of fluid flow and heat transfer equations of compressible Newtonian fluid with time
independency used in solver execution is given below where ρ is the density, u,v and w are velocity components,
vector, p is the pressure, V is the velocity vector, k is the thermal conductivity and ho is the total entalpy.

 Conservation of mass
𝜕(𝜌𝑢) 𝜕(𝜌𝑣) 𝜕(𝜌𝑤)
+ + =0 (i)
𝜕𝑥 𝜕𝑥 𝜕𝑥
 Momentum equation
X momentum:
𝜕(𝜌𝑢2 ) 𝜕(𝜌𝑢𝑣) 𝜕(𝜌𝑢𝑤) 𝜕(𝑃𝑚 ) 𝜕2 𝑢 𝜕2 𝑢 𝜕2 𝑢
+ + = − + 𝜌𝑣 ( + + ) (ii)
𝜕𝑥 𝜕𝑥 𝜕𝑥 𝜕𝑥 𝜕𝑥 2 𝜕𝑦 2 𝜕𝑧 2

Y momentum:
𝜕(𝜌𝑣𝑢) 𝜕(𝜌𝑣 2 ) 𝜕(𝜌𝑣𝑤) 𝜕(𝑃𝑚) 𝜕2 𝑣 𝜕2 𝑣 𝜕2 𝑣
+ + = − + 𝜌𝑣 ( + + ) + g(ρ-ρa) (iii)
𝜕𝑥 𝜕𝑥 𝜕𝑥 𝜕𝑦 𝜕𝑥 2 𝜕𝑦 2 𝜕𝑧 2

Z momentum:
𝜕(𝜌𝑤𝑢) 𝜕(𝜌𝑤𝑣) 𝜕(𝜌𝑤2 ) 𝜕(𝑃𝑚 ) 𝜕2 𝑤 𝜕2 𝑤 𝜕2 𝑤
+ + = − + 𝜌𝑣 ( + + ) (iv)
𝜕𝑥 𝜕𝑥 𝜕𝑥 𝜕𝑧 𝜕𝑥 2 𝜕𝑦 2 𝜕𝑧 2

 Conversation of energy :

(v)
4. Results and Discussions.
4.1 Experimental
For specified power supply to the heater, the velocity of air across the heat sink were varied. This created different
heat transfer coefficient over the heat sink. Steady state temperatures at different locations over the heat sink as
specified in Fig. 3 were recorded using a data logger. Tempearures recorded are shown in Table 1. The tip
temperatures of all the fins which are in observations are found to have minimum temperatures and they increases
with the the increase in the heat flux and temperature decreases with the increase in the fan speed and found
minimum tempearature at the maximum HTC.
Table 1. Observation table for experimental data

Measured Temperatures (celcius)

Power HTC
A1 A2 A3 Ab B1 B2 Bb C2 C1 C3 Cb BB T1 T2
supply(W) (W/m2K)
4.8 6.9 55 55 54 56 55 54 55 54 55 54 56 57 45 36
4.8 9.2 44 44 43 45 44 43 45 44 44 44 45 47 37 32
4.8 13.01 40 39 39 41 40 40 41 40 40 40 41 45 35 31
4.8 18.54 37 36 36 38 37 36 37 37 36 37 38 40 33 31
7.32 7.4 60 60 59 61 61 59 61 60 61 60 62 69 48 35
7.32 9.76 52 52 51 54 52 52 53 52 52 52 54 58 41 34
7.32 12.6 46 46 45 48 47 46 48 47 46 47 48 52 39 34
7.32 18.84 45 43 43 46 44 43 45 43 43 44 45 49 36 32
9.9 8.4 81 80 78 82 81 79 81 78 81 79 82 85 54 35
9.9 9.2 63 63 62 65 63 62 64 62 63 63 65 69 53 36
9.9 13.6 49 50 50 52 51 50 52 51 50 50 53 58 40 34
9.9 18.84 45 45 45 48 46 45 47 45 45 45 47 53 37 33

4.2 Numerical results

Temperature contour plots obtained numerically are presented in Fig. 5 (a-h) in which heating load is varied from
4.8 W to 9.9 W at the base of the heat sink. The heat transfer coefficient is changed across the heat sink by varying
air velocity. The temperature along the fin length varies from base to the tip. The lowest temperature is obtained
at the tip of each fin. The highest temperature is seen at the base of the fin, which is a very good agreement with
the literature. For obtaining the best performance of electronic devices we need to dissipate more heat away from
the devices [10]. At heat load of 4.8 W and heat transfer coefficient of 18.4 W/m2K, the maximum temperature is
just 40.6˚C which is quite low as compared to those at higher heat fluxes. From the Figures5(a-h) , the maximum
temperatures at different loads and heat transfer coefficient are selected and plotted in Fig. 6 which shows that
maximum temperature decreases gradually with increase in the HTC. It can also be seen in Fig. 6 that the rate of
decrement of maximum temperature is lowered at larger values of HTC. This indicates faster cooling rate at high
values of HTC of the coolant(air). However, at around HTC ≥ 16 W/m2K, the change in maximum temperature
on the sink becomes almost constant. Therefore there is no need to further increase the HTC because this will
result in consumption of more electricity and hence become costly.

Fig. 5(a) Temperature contour for heat flux 4.8 W and Fig. 5(b) Temperature contour for heat flux 4.8 W and
HTC 9.2 W/m2k HTC 18.54 W/m2k

Faster rate of cooling is observed near ends of the heat sink where fresh air enter as compared to the middle part
of the heat sink where air movement lowers down. Also Fig. 5 (a to h) shows that the temperature across the fin
is increasing with the increase in the heat flux. Thin fins (i.e.1.25mm), show lower temperatures as compared to
the thick fins (i.e.2.36 mm).

Fig. 5(c) Temperature contour for heat flux 7.32 W and Fig. 5(d)Temperature contour for heat flux 7.32 W and
HTC 12.6 W/m2k HTC 18.54 W/m2k

Fig. 5(e) Temperature contour for heat flux 9.9 W and Fig. 5(f) Temperature contour for heat flux 9.9 W and
HTC 8.4 W/m2k HTC 9.2 W/m2k

Fig. 5(g) Temperature contour for heat flux 9.9 W and Fig. 5(h) Temperature contour for heat flux 9.9 W and
HTC 13.6 W/m2k HTC 18.54 W/m2k

100
Maximum Temperature

80

60
(C)

40 4.8 W
7.3 W
20 9.9 W

0
3 8 13 18 23
h (W/m2K)

Fig. 6 Variation of maximum temperature on heat sink with varying

heat transfer coefficient at various load

4.3 Comparison between Experimental and Numerical results

Comparison of tip temperatures for one of the fins was made. Errors with the analytical and experimental values
were calculated and found that maximum deviation is ± 8 %. This error might be due to HTC, which may not be
uniform through out the fin’s surfaces during the experimentation due to the channelized flow of air, as we have
taken constant HTC in numerical analysis. As there is space constraint for mounting thermocouples, we have used
M-Seal to fix these thermocouples and its usage changes the mode of heat transfer from convection to conduction
in the vicinity of the thermocouples. This may also lead to increase in temperature. It may also be due to limitations
of the Data Logger, Ammeter & Voltmeter readings in giving the exact value. Least count of Data Logger was
limited to one degree Celsius.
Table 2. Comparison of tip temperatures for one of the fin in experimental and numerical studies
%Error
S.No. Heat HTC Type of Experimental Numerical
b/w
source(W) (W/m2K) convection (˚C) (˚C)
E&N
1 4.8 6.9 FREE 54.75 59.92 8.63
2 4.8 9.2 FORCED 43.75 48.88 -4.43
3 4.8 13.01 FORCED 39.25 43.16 -3.51
4 4.8 18.54 FORCED 36.25 39.12 -2.69
5 7.32 7.4 FREE 59.75 63.29 2.18
6 7.32 9.76 FORCED 51.75 58.17 -5.34
7 7.32 12.6 FORCED 45.75 52.5 -4.55
8 7.32 18.54 FORCED 43.5 44.85 -3.57
9 9.9 8.4 FREE 79.75 77.47 -6.92
10 9.9 9.2 FORCED 62.5 74.63 -6.6
11 9.9 13.6 FORCED 49.75 57.49 -5.99
12 9.9 18.54 FORCED 45 50.13 -5.23

Conclusion
In the present work, numerical and experimental work for Aluminium heat sink was carried. It is obvious that for
obtaining best performance of electronic devices we need to dissipate more heat from the devices. We therefore
need high air velocity for high heating of electronic devices. At the same time, a very large HTC may be useless
and unnecessarily increase the electricity cost. Therefore there should be some optimal value for HTC, which in
the present study comes out to be around 16 W/m2k, for better performance as well as economy. The numerical
values of temperature on the fins are compared with the experimental values of the temperatures and found
agreement with the same.

References
1. Starner KE; McManus HN (1963) An Experimental Investigation of Free Convection Heat Transfer From
Rectangular Fin-arrays. J Heat Trans, Trans ASME, Series C 85: 273-278

2. Welling JR; Wooldridge CB (1965) Free Convection Heat Transfer Coef®cient From Rectangular Vertical
Fins. J Heat Trans, Trans ASME, Series C 87: 439-444

3. Harahap F; McManus HN (1967) Natural Convection Heat Transfer From Horizontal Rectangular Fin Array. J
Heat Trans, Trans ASME, Series C 89: 32-38

4. Arularasan R.* and Velraj R (2008) CFD analysis in a heat sink for cooling of electronic devices. Int. J of The
Computer, the Internet and Management Vol. 16.No.3 September-December, pp 1-11

5. M.M. Mohamed, (2006) Air cooling characteristics of a uniform square modules array for electronic device
heat sink, Applied Thermal Engineering 26 486–493.

6. H. Yuncu and G. Anbar (1998) An experimental investigation on performance of rectangular fins on a

horizontal base in free convection. heat transfer Heat and Mass Transfer 33 507-514, Springer-Verlag

7. Paisarn Naphon, Setha Klangchart, Somchai Wongwises (2009) Numerical investigation on the heat transfer
and flow in the mini-fin heat sink for CPU, International Communications in Heat and Mass Transfer 36 834–
840.

8. Lee S. (1995) Optimum design and selection of heat sinks. IEEE Semiconductor thermal measurement and
management symposium, San Jose, USA, February, pp 48-54
 9. Ch. Srinivasa Rao, V (2018) Himachandra Raju CFD Modeling and Analysis of a Heat Sink with Rectangular
Pin Fin. Int. J for Research in Applied Science & Engineering Technology (IJRASET) ISSN: 2321-9653; IC
Value: 45.98; SJ Impact Factor: 6.887 Volume 6 Issue III

10. R. Sam Sukumar, G.Sriharsha, S.Bala Arun, P.Dilip kumar, Ch.Sanyasi Naidu (2013) Modelling And Analysis
Of Heat Sink With Rectangular Fins Having Through Holes. Int. J of Engineering Research and Applications
(IJERA), Vol. 3, Issue 2, pp.1557-1561

View publication stats