Alexandria Engineering Journal (2022) 61, 7045–7054

H O S T E D BY
Alexandria University

Alexandria Engineering Journal

www.elsevier.com/locate/aej
www.sciencedirect.com

Experimental investigation on the thermal

performance of a heat sink filled with PCM
Mohammed Y. Tharwan *, Haitham M. Hadidi

Mechanical Engineering Department, College of Engineering, Jazan University, KSA, 114 Almarefah Rd. 45142, Saudi Arabia

Received 17 June 2021; revised 15 October 2021; accepted 18 December 2021

Available online 27 December 2021

KEYWORDS Abstract Electronic devices and technologies have been revolutionized to meet future needs and
Heat sink; users demands in terms of size, cost, and performance. Therefore, miniaturized devices have been
Phase Change materials of great interest and under investigation for the last decade. This demand requires attaining no less
(PCM); performance than achieved with large scale devices and designs. Hence, it becomes crucial to
Heat transfer; improve performance through changing physical design and/or utilized materials such as using
Fins composites or phase change material (PCM). In this study, two designs for heat sinks in the form
of plates were created. The first was solid, whereas the second was hollow and contained PCM.
Both of them were subjected to the same experiment conditions. The goal of the research is to figure
out the overall temperature accomplished of both samples and to determine the impact of adding
PCM to heat sinks thermal performance. The general design methodology for the heat sink is as
follow: a steady heat source is applied to the plate fin heat sink’s base. The plate heat sink’s thermal
efficiency was compared with and without the use of PCM. The results revealed that including PCM
into the heat sink plate improves cooling and maintains the target temperature. Furthermore, the
heat sink with a PCM outperformed by 30% compared to heat sink without PCM.
Ó 2021 THE AUTHORS. Published by Elsevier BV on behalf of Faculty of Engineering, Alexandria
University. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/
licenses/by-nc-nd/4.0/).

1. Introduction ponents, which can only be accomplished through system

downsizing. As a result, scientists have been trying to make
1.1. Background information the cooling system more efficient and efficient. Electronic heat
management is now a critical factor in their design and devel-
Electronics have become an indispensable component of opment. Previous research has shown temperature as one of
today’s lifestyles. The tremendous rise of consumer electronics the primary causes of field failures in electronic equipment.
and industries need good heat management of electronic com- To maintain reliable functioning, it is critical to maintain the
working temperature of electronic components within a regu-
lated range. However, numerous classic cooling solutions
* Corresponding author.
(for example, natural convection and forced convection) are
E-mail addresses: mtharwan@jazanu.edu.sa (M.Y. Tharwan), hhadi- no longer useful in addressing the evaporation needs of today’s
di@jazanu.edu.sa (H.M. Hadidi).
high-performance electronic constituents in order to achieve
Peer review under responsibility of Faculty of Engineering, Alexandria
this.
University.
https://doi.org/10.1016/j.aej.2021.12.045
1110-0168 Ó 2021 THE AUTHORS. Published by Elsevier BV on behalf of Faculty of Engineering, Alexandria University.
This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
7046
Electronic products account for more than 55% of total
sales (Alawadhi and Amon [1]). Communication systems,
according to the electronics manufacturing industry, must
have a 99.999 percent dependability (known as the 99.999 per-
cent reliability standard). As per a survey conducted by the
United States Air Force, 5–9 percent of dependability issues
are caused by temperature. Traditional cooling technologies
are insufficient to meet the cooling requirements of today’s
technology due to the high expectations indicated above. A
temperature decrease of 1 °C can lower component failure rate
by as much as 4%, whereas a temperature increase of roughly
10–20 °C can raise component failure rate by 100% (Hos-
seineizadeh et al. [2]).
Cooling systems have recently been separate into two
groups: active cooling and passive cooling. A heat sink is typ-
ically utilized in active cooling to absorb direct touch heat
from the chip. A metal device with multiple heat sinks is the
most typical heat sink design. Heat energy is efficiently trans-
ported to the surrounding environment via fins, fans, and heat
sinks. Adding a fan to the system enhances the overall heat
transfer coefficient, which increases the radiator’s thermal per-
formance under forced convection. By circulating between the
fins cooler air, the fan improves the transmission of heat
energy from the radiator to the air. The fan system’s biggest
drawbacks, however, are noise, longevity, and vibration.
Because more heat is generated in such equipment when the
fan is not working properly, the system cannot function for
a long time. Miniaturization of electronic equipment without
compromising product performance is another ongoing devel-
opment in the electronics industry. As a result, electronic
equipment temperature management has become critical.
Hence, the application of active cooling technology is
restricted. To achieve consistent performance and long-life
electronic equipment, this necessitates the appropriate use of
passive technology in electronic cooling. Passive cooling and
utilization the heat sink facilitate heat transfer from occupied
space or domain to final dissipation site, however, the heat
transfer rate and temperature distribution within the part are
affected by many factors on of which is Coriolis force as indi-
cated by A.S.Oke et al.[3].
The use of PCM in passive cooling has grown in popularity
in recent years. PCM has a high fusion potential per unit vol-
ume and negligible volume change during phase transition.
This indicates that a high amount of energy can be stored in
a little amount of PCM during the phase transition. The com-
bined effects of melting heat transfer and linear stratification
heat energy, on the motion of an electrically conducting fluid
over a horizontal thermally stratified melting surface with a
non-uniform thickness was investigated by I. L. Animasaun
[4]. The study showed that when thin layer formed on an upper
horizontal thermally stratified melting surface of a paraboloid
of revolution experiences thermophoresis and heat sink, buoy-
ancy parameter is suitable to increase the velocities in x- and y-
directions near the free stream. On the other side, several arti-
cles [5–9] discussed the use of PCM in thermal energy storage.
Different types of PCMs, their thermophysical properties,
PCM packaging, expression of phase transition problems,
system-related challenges, and applications in various fields
were mentioned in these remarks. Some writers have
researched numerous PCMs and created standards to manage
the selection of PCMs, as stated by Agyenim et al. [9]. Despite
the fact that most PCMs exceed these specifications for cooling
M.Y. Tharwan, H.M. Hadidi
electronic devices, almost all PCMs have an excessively poor
thermal conductivity, which delays the melting and solidifica-
tion processes. either inside or outside Thermal conductivity
enhancers are the name for these compounds. According to
Fan and Khodadadi [10], TCE has recently been applied to
increase the performance of PCM for thermal energy storage.
However, no research has been published on the usage of TCE
and PCM in combination to improve the performance of heat
sinks used to cool electronic equipment. As far as we know,
researchers have used three approaches to improve the passive
cooling of electrical items utilizing PCM thus far. These
approaches include (a) metal fins, (b) nanoparticles, and (c) a
metal foam matrix. In these areas of electronic cooling, there
are certain documents to consult. However, no feedback on
the performance has been received thus far.
PCM was used to evaluate the thermal efficiency of a vari-
ety of fin heat sink topologies. Fin heat sinks with and without
PCM were employed in the designs. Their findings revealed
that for unsteady investigations to a record nature transient
of problem, the maximum temperature, liquids percent, and
heat transfer coefficient at diverse sites were obtained for
diverse velocity. In addition, the time it took to get the temper-
ature of the PCMs down to various liquid percent levels was
estimated for various forced convection scenarios [11]. The
thermal and electrical efficiency of fin heat sink is subjected
to the materials utilized in the design specially in electrical
equipment in which conductive fluids can support magnetic
fields. Therefor the dynamics of magnetic fields in electrically
conducting fluids can play a huge role in determining the effi-
ciency of the conductive fluid in the performance of magnetic
and thermal fields as demonstrated by Ezzat et al. [12–14].
1.2. Literature review
Azeem Anzar [11] conducted a statistical study that included
thermal analysis of various hot-rolled cheese structures using
PCM. Installed fire extinguishers installed inside and outside
the PCM, the fin is filled with PCM component parts on the
side of the end tip, and enclosed areas with forced convection
of regular systems are among the tested studies. For doing
unsteady analysis, the transient nature of problems was
recorded. The operational time of the design and the features
of the PCM are evaluated. By examining these various config-
urations, a clear and accurate picture of the mechanics of heat
transmission in a PCM-based heat sink emerges.
Based on the use of n-eicosane as a phase change material
(PCM) with pin–fin heat sinks, Adeel Arshad [15] has made
this effort to investigate the development of portable electronic
heat efficiency. To assess the performance of pin–fin heat
source for cooling electronics, four variants of pin–fin heat
sinks, including a no-fin heat sink, are evaluated at four differ-
ent volumetric fractions of n-eicosane. Because the PCM has a
low thermal conductivity, thermal conductivity enhancers
(TCEs) are used to help it dissipate heat. Pin-fins with a con-
stant volume fraction (9 percent of the total volume of the heat
sink) are employed. Aluminum is used to make TCEs. The
influence of fin thickness, amount of n-eicosane, and input
heat flux for three distinct critical set point temperatures is
explored using pin–fin heat sinks with fin thicknesses of
1 mm, 2 mm, and 3 mm (SPTs). The researchers discovered
that using n-eicosane in a pin–fin heat sink can help with tem-
Experimental investigation on the thermal performance
perature management. The 2 mm thick pin–fin heat sink exhib-
ited the best thermal performance for reliable electronic pack-
age performance, according to enhancement ratios. Mushtag
investigated [16] different types of PCMs in a 3-D micro-
channel heat sink with rectangular channel, as shown in
Fig. 1. After using air as a heat sink, four materials that change
phase (paraffin wax, neicosane, p116, and RT41) were used as
cooling mediums in various types and combinations at various
room temperatures. A steady heat flux is applied to the bottom
of the heat source, while the top surfaces are subjected to a
mixed (convection and radiation) boundary constraint. The
findings revealed that utilizing phase change materials in
micro-channel heat sinks of various designs improved the
micro heat sinks’ cooling performance.
Idris Al Siyabi [17] studied the PCM combination’s effects,
PCM placement in multiple-PCM heat sinks, PCM thickness,
melting temperature, and heat source intensity on the thermal
behavior of heat sinks using three distinct heat sinks. The tem-
perature distribution throughout the heat sink and the PCM
melting profile are determined. The results show that: (i) the
PCM combination RT50-RT55 extends the thermal regulation
period and reduces the heat sink temperature at the end of the
operation, (ii) the PCM combination RT50-RT55 extends the
thermal regulation period and reduces the heat sink tempera-
ture at the end of the operation, (iii) As PCM thickness grows
from 30 mm to 60 mm, the thermal-regulation-period increases
by 50 min, (iv) As PCM melting temperature rises, the thermal-
regulation-period and heat sink temperature rise, and (v) As
the power rating rises from 1 to 2, the thermal-regulation-
period reduces.
Jiefeng Liu [18] investigated the performance of a mesh-
finned phase change heat sink (PCM). Using a multi-physical
coupling model of the PCM heat sink, the effects of various
power losses, air velocities, fin heights, and PCM thickness
on the thermal performance of the PCM mesh-finned heat sink
are explored. In addition, depending on the findings of the
thermal network characteristics calculation, the heat sink
design is changed to improve thermal performance. Power
losses, air velocity, fin height, and PCM thickness all have a
significant impact on the PCM heat sink’s protective perfor-
mance, according to the research. After optimization, the
Fig. 1 Diagram of the investigated heat sink with PCMs [16]
7047
PCM heat sink has an 80-second protection period and a
100-second recovery time.
Xiaohu Yang [19] carried out research. This study proposes
a low-melting-point metal phase transition material/air natural
cooling combination heat sink for thermal control of electron-
ics with thermal shock. A theoretical analytic model for the
heat sink’s transient heat transfer performance is developed,
as well as a general design method for the heat sink. Under
the thermal shock situation, the phase change heat absorption
of low-melting-point-metal PCM gallium effectively reduces
the temperature increase of the heat source and prevents the
device from overheating, as shown in numerical modelling of
specific situations in Fig. 2. The numerical findings suggest
that the theoretical analytical model created in this study
may provide a valid prediction of the thermal efficiency of
the PCM heat sinks, which can be used for rapid performance
prediction and evaluation in practical thermal design.
Under the thermal shock situation, change in the phase of a
metal with a low melting point heat absorption PCM gallium
effectively suppresses the heat source’s temperature rise and
prevents the device from overheating, as shown in numerical
modelling of specific situations in Fig. 3. The numerical find-
ings suggest that the theoretical analytical model created in
this study may provide a valid prediction of the PCM heat
sink’s thermal performance, which can be used for rapid per-
formance prediction and evaluation in practical thermal
design. To test the effect of Nano PCM as a reference heat
sink, a plate fin heat sink was chosen. The plate heat sink’s
thermal performance with and without PCM is compared.
According to the findings, adding PCM (SiO2-based nano
PCM with paraffin wax) to the heat sink plate improves cool-
ing capacity while maintaining a safe temperature. In terms of
thermal performance, the heat sink made of PCM augmented
with nano particles outperformed the basic PCM heat sink.
Three distinct types of Pin fins were tested by K. Vishnu
Prakash [21]. Based on different operational timings, heat
sinks with and without PCM are tested, With the help of a
Data Acquisition Card, the temperature is measured (DAQ).
The results showed that including the PCM into the heat
source would assist in maintaining the temperature stable for
extended periods of time while also lowering the heat sink’s
7048
Fig. 2 Numerical simulation model [19].
Fig. 3 Heat sink arrangement schematic design [20].
heating rates and peak temperatures. Increasing the number of
fins on electronic equipment can also help to improve their
thermal performance.
Senthilkumar [22] investigated the effects of (phase change
material) PCM material, modification in PCM volume (50 ml
to 100 ml), pin fin (circular and square), and various cavity
heat sinks on thermal performance. Heat sink thermal perfor-
mance was tested using paraffin and a 70 W source of heat.
The introduction of PCM improves the heat dissipation rate
and lowers the operating temperature of electronics equip-
ment, according to the findings. When compared to other cav-
ity heat sinks, the thermal efficiency of the 9 cavity heat source
is improved, and it is comparable to a pin fin structure heat
sink. It’s worth noting that increasing the volume of PCM
boosts the latent heat capacity.
2. Design experiments and methodology
2.1. Fins design
Aluminum Fins were used and tested in this investigation.
Rectangular cross section plates of 100 mm  100 mm size
M.Y. Tharwan, H.M. Hadidi
were used as the base of the fins. Two designs of fins (solid
and hollow) with 70 mm height, 100 mm width, and 10 mm
thickness with six fins, and 12 mm in-between distance as indi-
cated in Fig. 4.
2.2. Experimental setup
To investigate the thermal performance of the fins, Free and
Forced Convection Apparatus TD1005 (TecQuipment) was
used. This device is made up of multiple components includ-
ing: (a) duct, a duct cross section (128 mm  75 mm) with a
length of 850 mm by which air can pass across the fins surface
by free convection or forced convection using a replacement
variable speed electric fan at the top of the duct as shown in
Fig. 5, (b) electrical heater installed to the backside of the duct
with maximum power approximately 100 W and display reso-
lution 0.1 W, which provide the heat needed to heat the fins
with dimensions (120 mm , 120 mm , 50 mm) as shown in
Fig. 5. The duct is equipped with fan installed at the top. This
fan is to draw the air out of the duct at certain speed. The setup
also include an anemometer which measures air velocity in the
duct. Three thermocouples are used, the first thermocouple is
Experimental investigation on the thermal performance 7049

Fig. 4 Rectangular cross section fins: (a) solid fin design and (b) hollow fin design.

Fig. 5 Experimental Setup.

to measure the temperature (T1) of the room (air), which is
installed inside the duct, the second thermocouple is to mea-
sures temperature (T2) of the fin base and it is installed on
the heater, and the third one is to measure the temperature
(T3) of the fins, which is installed on the fins. The thermocou-
ples connect to sockets on the front of the control panel (See
Fig. 5).
2.3. Work pieces Preparation
Cylindrical Aluminum bulk were cut into smaller pieces
(cylindrical shapes) with 200 mm diameter as shown in Fig.
(6a). Smaller cylinders were cut into cubic shapes with dimen-
sion of 100  100  70 mm, and then the samples were shaped
into solid fins Fig. (6b) and hollow fins Fig. (6b) using the
milling and drilling machines.
2.4. Experiment procedure
The fins were installed on the base of the heater. Whereas,
three thermocouples were T1: room temperature, T2: fins
base/heater temperature, and T3: PCM temperature were
attached to their designated locations on the fins. Then, fins
were installed inside the duct and the heater was installed out-
side the duct. An air velocity sensor was placed inside the duct
to measure the air velocity. The power was turned at 80 W, fan
7050
Fig. 6 Work piece Preparation.
speed v = 1.8 m/s, for 600 s. After the power reached 80 W the
power was turned off = 0 W for 600 s, then data was repeat-
edly collected for both cases.
3. Analysis and discussions
3.1. Case 1: Heat sink integrated with PCM
Fig. 7 shows the evolution of the air velocity which is fixed at
nearly 2 m/s for all experiments tests in order to compare
results with different factor such as power charge and different
heat sink cases.
Fig. 8 shows the time evolution of the power. The heater’s
electrical power gives a direct and perfect measurement of the
heat energy it emits or conducts in each experiment. The elec-
trical power of the heater is determined by the voltage and cur-
rent applied to it. The power regulator is fixed on 80 Watt but
in the below graph shows power alternate between 0 and 80 to
maintain the same level of heat energy.
Fig. 9 shows the relationship between temperature and time
with PCM. After turning on the power, the temperature is
gradually increased until it reaches the maximum temperature
at 79 Co then stabilized.
Considering the heat convention as rectangular function as
shown in Fig. 10. Power regulator was adjusted to 40 Watt to
M.Y. Tharwan, H.M. Hadidi
test the response of the fins willed with changed phase materi-
als. It varieties in between 0 and 40 W/(m2.K). Fig. 11 depicts
the heating and cooling of the PCM cycle. After the heat con-
vention the coefficient has abruptly decreased, temperature
decreases slowly at constant rate with PCM as shown in
Fig. 11 which is excellent behavior in order to save electronic
from thermal shocks. The presence of phase change material
enables for the absorption of surplus heat and the stabilization
of temperature at lower rates during melting time. The heat
convection coefficient percentage is reduced almost about
22.5%. As the heat convection coefficient rises, the tempera-
ture in the fins without phase change material drops rapidly,
whereas the temperature in fins filled with phase change mate-
rials drops slowly due to the solidification of the PCM. The
PCM saves energy throughout the melting process, which
can be used to heat up the accommodation during the dis-
charging period.
Fig. 11 shows the temperature response curves of a heat
sink in three phases: a regular heat load, a pulsed heat load,
and a de-pulsed heat load. The heat source temperature grows
exponentially and achieves a stable value 1800 during the nor-
mal heat load phase (time period 0–1800, heat source power
40). The heat source’s power abruptly rises to 40 at time
1800, and the heat source’s temperature rises rapidly in a
new exponential form, reaching its greatest temperature at
the conclusion of the heat pulse. The heat source power then
Experimental investigation on the thermal performance 7051

Fig. 7 Air velocity evolution for the case with PCM.

Fig. 8 The power time evolution for the case with PCM.

Fig. 9 Temperature Evolution for the with PCM case.

returns to its average value, and the heat source temperature
drops exponentially until it reaches the stable value
3.2. Case 2: Heat sink without PCM
For this case, the air velocity is maintained at 2 m/s and the
power at 80 Watt as shown in Fig. 12. The goal of the exper-
iment is to see how a heat sink performs with and without a
PCM. The heat sink’s temperature responses with and without
PCM are measured and compared. Fig. 13 shows the temper-
ature distribution of the two heat sinks cases. The graph
clearly illustrates that the base the plate’s temperature fin heat
sink without PCM is greater than the base temperature of the
heat sinks filled with PCM. The heat sink without PCM
reaches a maximum temperature of 102.3 °C in 212 s, while
the heat sink with PCM reaches a maximum temperature of
7052 M.Y. Tharwan, H.M. Hadidi

Fig. 10 Supplied Power during charging and discharging processes.

Fig. 11 Temperature Evolution during charging and discharging processes.

Fig. 12 The supplied Power time evolution.

79 °C in 300 s. Because PCM melts and absorbs more heat
energy as latent heat, the base temperature of the heat sink
is reduced for PCM loaded heat sinks. Despite the fact that
the PCM has a low heat conductivity, PCM absorbs more heat
energy from the heat source base, the temperature of PCM
filled heat sinks is lower than that of plate fine heat sinks with-
out PCM. As a result, the PCM-filled heat sink clearly indi-
cates a lower temperature value. PCM stored more heat
energy, including the heat sink in the cooling. So heat sinks
based on PCM slowly release the heat energy and heat up at
a slower rate as well.
4. Conclusions
This study proposes a phase transition material coupled heat
sink that can be utilized for thermal control of electronics with
thermal shock. Experimental assessment for the heat sink’s
Experimental investigation on the thermal performance
Fig. 13 Comparison of the temperature evolution.
transient heat transfer performance is established, as well as
the basic design process for the heat sink. The findings of the
experiments reveal that, under the thermal shock situation,
due to its phase change heat absorption, PCM may efficiently
minimize the temperature rise of the heat source and prevent
the device from overheating. From the experimental results,
the following results can be drawn:
1-When PCMs are used in a heat source, the temperature of
the heat source is reduced compared to when PCMs are not
used. PCMs have a melting temperature that is adequate
for application as well as melting’s latent heat
When PCM is close to the heating source, it melts fast and
produces a lower temperature than when PCM is far away
derived from a heat source that generates a high
temperature
Because PCM heat absorption is proportional to the
applied temperature, selecting a PCM with a melting tem-
perature that matches the application temperature is
crucial.
It has been discovered that inserting PCM within the heat
sink’s fins results in a lower temperature. As a result, it’s
critical to create a heat sink with fins loaded with PCM that
melts at an appropriate temperature.
The heat sink having PCM yielded the best heat transfer
performance among other cases without PCM. Its thermal
performance was increased by a factor of 30% compared to
that of the heat sink without PCM.
Declaration of Competing Interest
The authors declare that they have no known competing
financial interests or personal relationships that could have
appeared to influence the work reported in this paper.
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