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1820 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 52, NO.

8, AUGUST 2004

Mixed-Potential Volume Integral-Equation


Approach for Circular Spiral Inductors
Behzad Rejaei

Abstract—The electromagnetic behavior of circular spiral in- integral-equation (MPIE) method, generalized to three-dimen-
ductors on layered substrates is analyzed by using the concentric sional (3-D) conductors in [18]. Reference [19] used the MOM
ring approximation. The problem is formulated in terms of mixed-
and the finite-difference time-domain technique to analyze the
potential volume integral equations. The latter are semianalytically
solved within the quasi-one-dimensional approximation. The result nonuniform current distribution in inductor windings. The work
is a fast computationally efficient model, which takes into account of [20] was based on a volume integral-equation approach,
substrate RF loss, as well as nonuniform current density distribu- but used the Greenhouse algorithm [2] to evaluate the partial
tion across inductor windings. The results are in good agreement inductances. In [21], this method was generalized to include
with experimental data from various inductors on both low- and
high-resistivity silicon substrates. substrate eddy currents, which are significant in highly doped
low-resistivity substrates.
Index Terms—Eddy currents, mixed-potential integral-equation
(MPIE) method, monolithic inductors, spiral inductors, substrate
In spite of their power and generality, these numerical tech-
RF loss. niques usually do not offer the high computational speeds
required for inductor optimization in mixed-level circuit/com-
ponent design. This is because they require the division of the
I. INTRODUCTION conductor volume (or surface) into a relatively large number
of segments, and numerical evaluation of the corresponding
T HE DEMAND for full integration of RF transceiver sys-
tems has been the driving force behind the recent surge
of interest in on-chip inductors and—to a lesser extent—trans-
Green’s matrix elements on arbitrary substrates. Significant
reduction of computation time could be achieved if the field
formers. Emphasis lies on integration in silicon (Si) technology, equations were to be analytically solved in one direction (e.g.,
which offers the most in terms of reliability, low cost, and a high along the windings), effectively reducing the dimensionality
level of integration. The major drawback of Si-based devices is, of the problem. Such a model was previously presented by
however, their proneness to significant RF losses caused by the Rejaei et al. [22] by using the concentric-ring approximation
current flow in the conductive substrate. of circular spiral inductors [3]. Here, a planar circular spiral
Although the inductance of lumped elements can be predicted inductor is replaced by a series connection of concentric rings,
with reasonable accuracy [1]–[6], the analysis of substrate RF and the resulting rotational symmetry is exploited to semiana-
losses is not straightforward. The common strategy is, therefore, lytically solve the field equations within the MPIE formalism.
based on empirical or semiempirical lumped-element represen- It should be mentioned that expressions for the inductance
tations [7]–[11], where substrate effects are modeled by using and quality factor of a single ring above a layered (magnetic)
lumped capacitors and resistors, determined through compar- substrate were already derived in [23], but did not account
ison with experimental data. Despite its inherent simplicity, this for losses due to capacitive coil-substrate coupling.
method lacks the predictive power required for component de- In this paper, we present the full mathematical framework
sign and optimization. of the method of [22] and extend the latter to 3-D conduc-
An alternative approach is to use comprehensive com- tors, including the effect of the nonuniform current distribution
putational techniques [12]–[19] or semianalytical methods (skin effect, current crowding) in the coil windings. Employing
[20], [21]. In [12], inductor substrate losses were treated the MPIE technique, a solution is obtained by using a discrete
using a full-wave electromagnetic (EM) numerical package. Fourier transform along the rings, followed by application of
The spectral-domain method of moments (MOM) was ex- Galerkin’s method to compute the field distribution across each
ploited in [13] to analyze spiral inductors on multilayered ring. The result is a fast predictive model for circular spiral in-
Si substrates. Reference [17] presented an analysis of planar ductors on layered substrates. The model is derived in Section II
[two-dimensional (2-D)] devices based on the mixed-potential and compared to measurement data in Section III.

II. CONCENTRIC-RING MODEL


Manuscript received November 20, 2003; revised February 19, 2004.
The author is with the Faculty of Electrical Engineering, Mathematics, and The concentric-ring model of circular spiral inductors [3] re-
Computer Science, Laboratory of Electronic Components, Technology, and sults from replacing an -turn spiral by a series connection of
Materials, Delft Institute of Microelectronics and Submicron Technology, circular rings (Fig. 1). It is assumed that the width and
Delft University of Technology, 2628 CT Delft, The Netherlands (e-mail:
b.rejaei@ewi.tudelft.nl). spacing of the rings are identical to those of the spiral in-
Digital Object Identifier 10.1109/TMTT.2004.831567 ductor. The overall dimension of the concentric-ring model is
0018-9480/04$20.00 © 2004 IEEE

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REJAEI: MIXED-POTENTIAL VOLUME INTEGRAL-EQUATION APPROACH FOR CIRCULAR SPIRAL INDUCTORS 1821

Fig. 3. Cross section of the system of rings. The volume and vertical cross
i V S s
section of the th ring are denoted by and , respectively. is the unit normal
Fig. 1. Concentric-ring model of a circular spiral inductor. The width andw to the conductor surface.
s
spacing of the rings equal those of the inductor. The radius R is determined
by requiring the outermost ring to have the same length as the first winding of
the spiral inductor. where is the conductor resistivity, is the electric field, and
and are the vector scalar potentials, respectively. The latter
can be expressed as

(2)

(3)

Fig. 2. N
System of concentric rings as a 2 -port system. where is the total volume of the conductor, de-
notes the charge density, , , and
determined by equating the total lengths of the inductors (at the . The form of the 3 3 matrix and the
midline).1 scalar Green’s functions depend on the gauge chosen [16].
To fully exploit the rotational symmetry of the model, we next We choose for the representation in [14] where
assume that the rings are disconnected. The set of concentric
rings can then be viewed as a -port system with inputs (4)
and outputs (Fig. 2). Once the admittance matrix (or, equiva-
lently, the impedance matrix) of the -port system is calcu- Note that, in (2) and (3), the dependence on the Green’s func-
lated, the admittance matrix of the spiral inductor is retrieved tions on frequency is not shown explicitly.
by connecting the rings again. Note that, since the calculation Using (1)–(3) and the continuity equation ,
of the admittance matrix of the system of rings is independent one arrives at the closed set of integro-differential equations
of the way the terminals are interconnected, this method can
be easily generalized to investigate various structures such as (5)
transformers and stacked inductors built on several metal layers
over layered substrates. In the remainder of this section, we will
present the derivation of the model in detail in several steps. (6)

A. MPIEs
In order to allow a complete solution, (5) and (6) should be
The starting point of our analysis is the MPIE approach supplemented by boundary conditions for and/or the normal
[14]–[18]. Consider a multiply connected conductor consisting component of the current density on the surface of
of concentric rings with the volumes , , the conductor ( is the unit vector normal to the surface). On the
placed on a substrate consisting of infinitely extended planar interfaces between external contacts and the conductor, either
layers parallel to the – -plane (Fig. 3). or should be specified, whereas should vanish everywhere
Neglecting the Lorentz force, the current density at each else on the surface of the conductor.
point inside the conductor is given by the Ohm’s law In this paper, we shall restrict ourselves to substrates con-
sisting of isotropic layers, i.e., where each layer is described by
(1) isotropic constitutive parameters. The resulting rotational sym-
metry of the system is then reflected in the relations

1Simulations carried out by using HP ADS/Momentum (not shown here)


(7a)
demonstrate that the concentric ring approximation is fairly accurate even if
the shape of the inductor windings significantly deviates from that of an ideal (7b)
ring, e.g., whens>w . The resulting error in inductance and quality factor was
found to be less than 4% for typical on-chip inductors built on lossy substrates.
Furthermore, many practical structures are not spirals, but symmetric inductors The spectral-domain representation of the Green’s functions
where the actual windings are indeed rings. and is given in the Appendix.

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1822 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 52, NO. 8, AUGUST 2004

Equations (12a)–(12d) can be used to transform (9) and


(10) into a set of decoupled integral equations by applying the
Fourier transformations

(13a)

Fig. 4. Concentric-ring system in cylindrical coordinates. u is the azimuthal


!
(13b)
unit vector. The input and output of the rings are denotes by the limits  0
and  ! 2 .

(13c)
B. Quasi-One-Dimensional (1-D) Approximation
Employing cylindrical coordinates , we next adopt the
quasi-1-D approximation by neglecting the components of (13d)
and variations of in the radial - and vertical -directions
inside the rings
After multiplying (9) and (10) by , calculating the integral
over from 0 to , and using (13a) and (13b), one arrives at
for (8)

where is the azimuthal unit vector (Fig. 4). Here, in fact, we


have assumed that current follows the direction of the rings in-
side the conductor. Using (5)–(8), one then arrives at the integral (14)
equations

(15)
(9)
Here, the integrations are carried out over the cross sections
of the rings in the – -plane (perpendicular to the azimuthal unit
(10) vector ), , and

(16a)
where and
(16b)
(11)
(16c)
In (9) and (10), and are periodic func-
tions of with the period . This is because
in cylindrical coordinates. One can, (16d)
therefore, expand and in the Fourier series

(12a) (16e)

(12b) where , and , denote the potential


and current density on the input and output
cross sections of the th ring, respectively (Fig. 4). Note that
(12c) and are constant on , but depend on the ring index .

C. Solution of the Integral Equations


(12d) For each harmonic mode , (14) is a Fredholm integral
equation of the second kind for the functions , whereas
(15) is a Fredholm integral equation of the first kind for the
Note that and because and actu- functions . Both equations can be numerically solved
ally are even functions of due to reflection symmetry in the by Galerkin’s method, where one approximates and
– -plane. by an expansion in terms of a finite number

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REJAEI: MIXED-POTENTIAL VOLUME INTEGRAL-EQUATION APPROACH FOR CIRCULAR SPIRAL INDUCTORS 1823

of basis functions , respectively, on as


follows:

(17a)
Fig. 5. Vertical cross section of each ring (in the r –z -plane) is divided into
rectangular segments.

(17b)
D. Admittance Matrix of the System of Rings
Multiplication of both sides of (14) and (15) by the basis func- In order to calculate the admittance matrix of the concen-
tions , respectively, , and integration over the ring cross tric-ring system, one has to find the relationship between the
sections results in matrix equations for the constants and ring potentials and the ring currents
with the solution
(22)

(18)
at the inputs and outputs . Substitution of
the Fourier series expansion (13c) in the above equation results
(19) in

(23a)
where

(23b)
(20a)

where are the Fourier components of . By integrating (17a)


and (17b) over , and using (16a)–(16e), (18), (19), (20d), and
(22)–(23b), one obtains the matrix equations
(20b)
(24)

(20c)
(25)

in which
(20d)

(26a)
with denoting the Kronecker delta.
In order to reduce the computation time for the integrations
in (20b) and (20c), we divide the cross section of the rings in (26b)
rectangular segments and use the basis functions
are matrices, and
if
otherwise (27)
if
(21) designate the total current at the input, respectively, and output
otherwise
of the th ring. (The minus sign has been included according to
where and denotes the surface of the th the conventional definition of port currents in network theory.)
rectangular segment on the cross section of the th ring (Fig. 5). From (24) and (25), one can determine the Fourier coefficients
In the Appendix, we show that each element of the matrices and in terms of and . After sub-
and can then be calculated by performing a single stituting the solution obtained (not shown here) in the Fourier
integration in the spectral domain. series (13d) and (23b), evaluating and in the limits

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1824 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 52, NO. 8, AUGUST 2004

and , and applying several matrix manipulations,


we arrive at the admittance matrix as follows:

(28a)

(28b)

(28c)
(28d)

where and . Note that the summation in (28b)


only involves nonnegative ’s. This is because, as mentioned
previously, and which, in turn, im-
plies that and . Equations (28a)–(28d)
Z Y
Fig. 6. Decomposition of the matrices  and  in terms of mutual
together with the definitions (26a) and (26b) express the admit- resistance R , inductance L
 , conductance G
 , and capacitance C
tance matrix of the concentric-ring system in terms of the matrix matrices for each mode m.
elements of the Green’s functions and .
It is important to note that and have, in fact, been
computed from the vector-potential Green’s function and the
scalar potential Green’s function , respectively. It is, therefore,
natural to link and to the inductance, respectively, ca-
pacitance matrix of the system in the th mode by introducing
the decompositions

(29)

in which , , , and are real frequency-dependent


matrices (see Fig. 6). Here, can be interpreted as
the inductance matrix of mutually coupled inductors. Simi-
larly, represents mutually coupled capacitors. The ma-
trix takes account of the dc loss in the conductor, as well
as additional RF loss due to nonuniform distribution of current
density on the cross section of the windings (skin effect, cur- Fig. 7. Admittance matrix of the inductor is obtained by connecting the rings
in series. The underpass is modeled as a stripline, capacitively interacting with
rent crowding). However, it also includes losses due to substrate 0
the inductor windings through the N 1 metal–oxide–metal capacitors formed
eddy currents induced by the RF magnetic field. The matrix between the inductor and underpass metals.
, on the other hand, contains substrate RF losses caused by
the flow of substrate currents induced by the potential differ-
ence between different points on the conductor and between the TABLE I
conductor and reference ground. The latter has implicitly been LAYER PARAMETERS FOR MEDIUM-RESISTIVITY (MR)
AND LOW-RESISTIVITY (LR) Si SUBSTRATES
defined as a point at the infinity, where the Green’s functions
vanish.
In practice, only a small number of modes (small ’s) will
suffice to provide an adequate solution of the problem. Higher
modes (larger ’s) become important at very high frequencies
where the effective wavelength becomes smaller than the length
of rings. The number of modes included in the calculation de-
pends on the required accuracy and should be determined from
numerical experimentation.
2 2 admittance matrix of the spiral inductor. In practical
E. Retrieving the Admittance Matrix of the Inductor applications, however, an underpass is used to connect the inner
After the admittance matrix of the concentric-ring system terminal of the coil to other devices. It is not possible to directly
is computed, the rings can be connected in series to obtain the include the underpass in the concentric-ring model due to the

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REJAEI: MIXED-POTENTIAL VOLUME INTEGRAL-EQUATION APPROACH FOR CIRCULAR SPIRAL INDUCTORS 1825

Fig. 8. Measured (markers) and simulated (solid lines) inductance and quality factor of circular spiral inductors. (a) Inductor A (N = 4, R = 120 m, w =
13:7 m, s = 10:27 m). (b) Inductor B (N = 4, R = 140 m, w = 11:38 m, s = 3 m). (c) Inductor C (N = 6, R = 160 m, w = 11:25 m,
s = 3 m). Substrate resistivity was 5
cm. Metal thickness was 1 m.
1

breaking of the circular symmetry. Nevertheless, in the special as a stripline interacting with the inductor through lumped
case of Fig. 7, one can approximately model the underpass metal–oxide–metal capacitors formed between the underpass

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1826 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 52, NO. 8, AUGUST 2004

Fig. 9. Measured (markers) and simulated (solid lines) inductance and quality factor of circular spiral inductors. (a) Inductor A (N = 4, R = 120 m, w =
13:7 m, s = 10:27 m). (b) Inductor B (N = 4, R = 140 m, w = 11:38 m, s = 3 m). (c) Inductor C (N = 6, R = 160 m, w = 11:25 m,
s = 3 m). Substrate resistivity was 0.01
cm. Metal thickness was 4 m.
1

and windings. Despite the neglect of the mutual inductance III. EXPERIMENTAL RESULTS
between the underpass and spiral coil, this approximation turns
out to be accurate enough for typical integrated inductors, as We have fabricated various spiral inductors on medium-resis-
shown by the experimental data in Section III. tivity (5 cm) and low-resistivity (0.01 cm) Si substrates.

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REJAEI: MIXED-POTENTIAL VOLUME INTEGRAL-EQUATION APPROACH FOR CIRCULAR SPIRAL INDUCTORS 1827

TABLE II
GEOMETRICAL PARAMETERS (N , R, w , s), INDUCTANCE AT MAXIMUM QUALITY FACTOR (L ), MAXIMUM QUALITY FACTOR (Q ), AND
SELF-RESONANCE FREQUENCY (f ) OF THREE INDUCTORS ON MEDIUM- AND LOW-RESISTIVITY SUBSTRATES

Each substrate consists of a 525- m-thick Si layer, insulated


by a 4- m-thick layer of SiO . The spiral coils were built by
using the top metal layer (1- and 4- m-thick aluminum on 5-
and 0.01- cm substrates, respectively). The underpass con-
tact was built by using an additional 0.6- m-thick metal layer,
spaced 0.8 m below the top metal layer.
The -parameter measurements were performed using an
HP8510B/8514A network analyzer in combination with a Cas-
cade Microtech Summit 9000 probe station with 200- m-pitch
signal–ground probes. The calculated -parameters, after
deembedding the measurement pads, are then used to calculate
the inductance and quality factor of each coil in the
configuration where port 2 (connected to the inner terminal) is
grounded as follows:2

(30)
Fig. 10. Measured (markers) and simulated (solid lines) quality factor of
inductor A (N = 4, R = 120 m, w = 13:7 m, s = 10:27 m) built on
Table I lists the substrate parameters used in the simulations. the 5-
1 cm Si substrate using a 1-, 2-, and 4-m-thick Al layer.
The simulations were performed retaining the harmonic
mode only since numerical experimentation revealed negligible the nominal value used (5 cm). In conventional processes
improvement upon inclusion of higher modes. In order to take variations up to 5% are normal on different wafers or different
account of the nonuniform distribution of current and charge locations on the same wafer. Besides affecting , this would
density, the cross section of each winding was divided into a shift , in particular, on medium-resistivity substrates [24].
number of rectangular segments (see Section II-C and the Ap- Nevertheless, the overall agreement between simulated and
pendix). The simulations were carried out on an HP Unix work- experimental ’s and ’s on both substrates is good, bearing
station. For a four-turn inductor, the computation time for each in mind that no fitting parameters were used.
frequency point was less than 0.22 s at five segments/winding A common shortcoming of many commercial, 2-D and
and less than 1.5 s at 25 segments/winding. The results shown two-and-one-half-dimensional (2.5-D) EM solvers is their
below were obtained using 25 segments/winding. inability to handle the finite thickness of the conductors: the
Figs. 8 and 9 show the measured and simulated and metal layers are assumed to be infinitely thin, while the nonuni-
for three different inductors (A,B, and C), on the medium- form current distribution in the vertical direction is accounted
and low-resistivity substrates. The geometrical parameters for by using an effective complex frequency-dependent sheet
of the three coils, as well as their measured and simulated resistivity. The concentric-ring model, however, is not restricted
inductance at maximum quality factor , maximum to this planar approximation. In order to test the accuracy of
quality factor , and self-resonance frequency are the model in handling thick conductors, we built additional
listed in Table II. The discrepancy between the measured and spiral inductors on the 5- cm substrate with the thickness of
simulated inductance curves for coils B and C in Fig. 8 can be the top metal layer ranging from 2 to 4 m. The quality factor
attributed to the underestimation of their by the model on of the 2-nH inductor built using a 1-, 2-, and 4- m-thick layer
the 5- cm substrate (Table II). However, one should note that is shown in Fig. 10. Again, a good match is found between
the actual resistivity of the Si substrate may have differed from the simulated and measured data, although the model predicts
2Unlike classical microwave substrates, Si technology does not allow a slightly higher at frequencies above 6 GHz as the metal
the use of a through-wafer vias providing access to a backside metal layer thickness is increased.
(RF ground). In the experiments discussed here, large rectangular patches
(800 m 2 300 m) distanced 300 m away from the edge of the coils and
built in the first metal layer were used as a ground pad for the probes. The IV. CONCLUSIONS
large area of each patch provides a low-impedance path through the conductive
substrate to the metallic chuck on which the wafers are placed during the We have presented a semianalytical model for circular spiral
measurement. The chuck replaces the backside metal as the RF ground. inductors on layered substrates. The model employs the concen-

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1828 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 52, NO. 8, AUGUST 2004

where and are substrate reflection coefficients deter-


mined by the recursive relations

(33a)

(33b)

(33c)

(33d)

(33e)

(33f)

where is the number of substrate layers (the infinite layer


Fig. 11. Multilayered substrate used for the evaluation of the spectral-domain beneath the substrate is denoted by ), and , , and
Green’s functions.
are the dielectric constant, permeability,
and conductivity of each layer, respectively (Fig. 11). The layer
tric-ring approximation where the circular inductor is replaced thicknesses are denoted by .
by the series connection of concentric rings. Using the rotational From (11), (12c), (12d), (31a), (31b), and Neumann’s addi-
symmetry of the system of rings, as well as the quasi-1-D tion theorem for Bessel functions [25]
approximation, a semianalytical solution is derived for the
MPIEs based on the Fourier series expansion of the potentials (34)
and currents in the rings. The results are in good agreement
with experimental data for inductors of various sizes and metal
thicknesses built on a lossy Si substrate. with , it follows that

APPENDIX
In order to calculate the functions and and their ma- (35a)
trix elements, we start with the spectral representation of the
Green’s functions and

(31a)

(35b)
(31b)
The matrices and are evaluated by substituting
where denotes the th-order Bessel function of the first kind the above relationship into (20b) and (20c) and carrying out the
and and are spectral-domain Green’s functions. integrations using the basis functions (21). Due to the exponen-
Although the expressions for the spectral-domain Green’s tial dependence of the spectral-domain Greens functions on
functions in stratified media can be found in various papers, we and , the integrations over those variables can be performed
present them below for the sake of completeness. We restrict analytically, whereas those involving are calculated by means
ourselves to the typical configuration of Fig. 11 where and of the relationships
are both located above the substrate. (Although relevant, the
more general, but complicated case where and lie in arbi-
trary substrate layers will not be discussed here.) The functions
and are then given by

(32a)

(32b) (36)

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REJAEI: MIXED-POTENTIAL VOLUME INTEGRAL-EQUATION APPROACH FOR CIRCULAR SPIRAL INDUCTORS 1829

where and are Sturve functions. As a result, computation [14] J. R. Mosig and F. E. Gardiol, “A dynamic radiation model for mi-
of each matrix element only requires the evaluation of a single crostrip structures,” in Advances in Electronics and Electron Physics,
P. W. Hawkes, Ed. New York: Academic, 1982, vol. 59, pp. 139–237.
integral over the variable . [15] , “General integral equation formulation for microstrip antennas
and scatterers,” Proc. Inst. Elect. Eng., vol. 132, pp. 424–432, 1985.
ACKNOWLEDGMENT [16] K. A. Michalski and D. Zheng, “Electromagnetic scattering and radia-
tion by surfaces of arbitrary shape in layered media. II. Theory,” IEEE
The author would like to thank J. N. Burghartz, H. Schellevis, Trans. Antennas Propagat., vol. 38, pp. 335–344, Mar. 1990.
[17] M. Kahrizi, T. K. Sarkar, and Z. A. Maricevic, “Space domain approach
and A. Akhnoukh, all of the Delft Institute of Microelectronics for the analysis of printed circuits,” IEEE Trans. Microwave Theory
and Submicron Technology (DIMES), Delft, The Netherlands, Tech., vol. 42, pp. 450–457, Mar. 1994.
for their support. [18] R. Bunger and F. Arndt, “Efficient MPIE approach for the analysis of
three-dimensional microstrip structures in layered media,” IEEE Trans.
Microwave Theory Tech., vol. 45, pp. 1141–1153, Aug. 1997.
REFERENCES [19] T. Huan-Shang, L. J. Lin, R. C. Frye, K. L. Tai, M. Y. Lau, D. Kossives, F.
Hrycenko, and C. Young-Kai, “Investigation of current crowding effects
[1] A. E. Ruehli, “Inductance calculations in a complex integrated circuit
environment,” IBM J. Res. Develop., vol. 16, pp. 470–481, 1972. on spiral inductors,” in IEEE MTT-S Int. Microwave Symp. Dig., 1997,
pp. 139–142.
[2] H. M. Greenhouse, “Design of planar rectangular microelectronic induc-
tors,” IEEE Trans. Parts, Hybrids, Packag., vol. 10, pp. 101–109, 1974. [20] A. M. Niknejad and R. G. Meyer, “Analysis, design, and optimization
of spiral inductors and transformers for Si RF ICs,” IEEE J. Solid-State
[3] R. L. Remke and G. A. Burdick, “Spiral inductors for hybrid and mi-
crowave application,” in IEEE Proc. 24th Electronic Computation Conf., Circuits, vol. 33, pp. 1470–1481, Oct. 1998.
1974, pp. 152–161. [21] , “Analysis of eddy-current losses over conductive substrates with
applications to monolithic inductors and transformers,” IEEE Trans. Mi-
[4] P. A. Brennan, N. Raver, and A. E. Ruehli, “Three-dimensional induc-
tance computations with partial element equivalent circuits,” IBM J. Res. crowave Theory Tech., vol. 49, pp. 166–176, Jan. 2001.
[22] B. Rejaei, J. L. Tauritz, and P. Snoeij, “A predictive model for Si-based
Develop., vol. 23, pp. 661–667, 1979.
[5] E. Pettenpaul and H. Kapusta, “CAD models of lumped elements on circular spiral inductors,” in IEEE MTT-S Int. Microwave Symp. Dig.,
1998, pp. 148–154.
GaAs up to 18 GHz,” IEEE Trans. Microwave Theory Tech., vol. 36, pp.
294–304, Feb. 1988. [23] S. F. Mahmoud and E. Beyne, “Inductance and quality-factor evaluation
of planar lumped inductors in a multilayer configuration,” IEEE Trans.
[6] A. C. Cangellaris, J. L. Prince, and L. P. Vakanas, “Frequency-dependent
inductance and resistance calculation for three-dimensional structures in Microwave Theory Tech., vol. 45, pp. 918–923, June 1997.
high-speed interconnect systems,” IEEE Trans. Comp., Hybrids, Manu- [24] J. N. Burghartz and B. Rejaei, “On the design of RF spiral inductors on
silicon,” IEEE Trans. Electron Devices, vol. 50, pp. 718–729, Mar. 2003.
fact. Technol., vol. 13, pp. 154–159, Mar. 1990.
[7] N. M. Nguyen and R. G. Meyer, “Si IC-compatible inductors and LC [25] M. Abramowitz and I. A. Stegun, Handbook of Mathematical Functions
With Formulas, Graphs, and Mathematical Tables. New York: Wiley,
passive filters,” IEEE J. Solid-State Circuits, vol. 25, pp. 1028–1031,
Aug. 1990. 1972.
[8] R. G. Arnold and D. J. Pedder, “Microwave characterization of
microstrip lines and spiral inductors in MCM-D technology,” IEEE
Trans. Comp., Hybrids, Manufact. Technol., vol. 15, pp. 1038–1045,
Dec. 1992.
[9] R. B. Merril, T. W. Lee, H. You, R. Rasmussen, and L. A. Moberly, “Op- Behzad Rejaei received the M.Sc. degree in
Q
timization of high integrated inductors for multi-level metal CMOS,” electrical engineering from the Delft University of
in Proc. Int. Electron Devices Meeting Tech. Dig., 1995, pp. 983–986. Technology, Delft, The Netherlands, in 1990, and
[10] J. N. Burghartz, M. Soyuer, and K. A. Jenkins, “Microwave inductors the Ph.D. degree in theoretical condensed matter
and capacitors in standard multilevel interconnect silicon technology,” physics from the University of Leiden, Leiden, The
IEEE Trans. Microwave Theory Tech., vol. 44, pp. 100–104, Jan. 1996. Netherlands, in 1994.
[11] C. P. Yue, J. Lau, T. H. Lee, and S. S. Wong, “A physical model for planar From 1995 to 1997, he was a member of the
spiral inductors on silicon,” in Proc. Int. Electron Devices Meeting Tech. physics faculty with the Delft University of Tech-
Dig., 1996, pp. 155–158. nology, where he performed research on mesoscopic
[12] D. Lovelace, N. Camilleri, and G. Kannell, “Silicon MMIC inductor charge–density–wave systems. Since 1997, he has
modeling for high volume, low cost applications,” Microwave J., pp. been with the Department of Electrical Engineering,
60–71, Aug. 1994. Mathematics, and Computer Science, Delft University of Technology, where
[13] S. H. Song, H. B. Lee, H. K. Jung, S. Y. Hahn, K. S. Lee, C. Cheon, and he is currently an Associate Professor. His research interests are in the areas of
H. S. Kim, “Spectral domain analysis of the spiral inductor on multilayer EM modeling of integrated passive components and physics of ferromagnetic
substrates,” IEEE Trans. Magn., vol. 33, pp. 1488–1491, Mar. 1997. devices.

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