MST236A054U

Features

 Low operating voltage: 5V

 Ultra low capacitance: 0.7pF
 Solid-state silicon-avalanche and active circuit
triggering technology
 Back-drive protection for power-down mode
 Lead-free version available

IEC COMPATIBILITY (EN61000-4)

 IEC 61000-4-2 (ESD) ±27kV (air), ±16kV (contact)

 IEC 61000-4-4 (EFT) Level-3,55A (5/50ns)
 IEC 61000-4-5 (Lightning) 6A (8/20μs)

Mechanical Characteristics Applications

 SOT-23-6L package  Video/Graphics Card

 Molding compound flammability rating: UL 94V-0  Digital Visual Interface (DVI)
 Marking: Marking Code  USB2.0 Power and Data lines protection
 Packaging: Tape and Reel  Notebook and PC Computers
 RoHS/WEEE Compliant  Monitors and Flat Panel Displays

Circuit Diagram Schematic & PIN Configuration

5 1 6

2 5
1 3 4 6
3 4
2
-
SOT-23-6L (Top View)

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 MST236A054U
Absolute Maximum Rating
Rating Symbol Value Units

Peak Pulse Power ( tp =8/20μs ) PPP 120 Watts

Peak Pulse Current ( tp =8/20μs ) Ipp 6 A

Operating Temperature TJ -55 to + 85 °C

Storage Temperature TSTG -55 to +150 °C

Electrical Parameters (T=25℃)

Symbol Parameter I
IF
IPP Maximum Reverse Peak Pulse Current

VC Clamping Voltage @ IPP

VRWM Working Peak Reverse Voltage

VC VBR VRWM
IR Maximum Reverse Leakage Current @ VRWM IR VF V
IT
VBR Breakdown Voltage @ IT

IT Test Current

IF Forward Current
IPP

VF Forward Voltage @ IF

Electrical Characteristics

MST236A054U
Parameter Symbol Conditions Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM Pin5 to pin2 T=25°C 5.0 V

IT=1mA
Reverse Breakdown Voltage VBR 6.0 V
Pin 5 to pin2

VRWM=5V, T=25°C
Reverse Leakage Current IR 5 µA
Pin 5 to pin2

Forward Voltage VF IT=10mA 0.8 1 V

IPP=6A, tp=8/20μs
Clamping Voltage VC 17.5 20 V
I/O pin to GND
VR = 0V, f = 1MHz
0.8 pF
I/O pin to GND
Junction Capacitance Cj VR = 0V, f = 1MHz
0.5 pF
Between I/O pins

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 MST236A054U
Typical Characteristics

Figure 1: Peak Pulse Power vs. Pulse Time Figure 2: Power Derating Curve
Ppp – Peak Pulse Power - Ppp(KW)

10 110
100

Percent of Rated Power for

90
80
1
70
60

Ipp
50
0.1 40
30
20
10
0.01
0.1 1 10 100 1,000 0
0 25 50 75 100 125 150
td – Pulse Duration - µs Ambient Temperature - TA (℃)

Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse

Current
110
Waveform 28
100
Paramters 26
90 tr=8µs
Clamping Voltage -VC(V)

24
80 td=20µs 22
20
Ipp

70 18
e-t 16
60
Percent

14
50 12
40 10
td=Ipp/2
8
30
6
20 4
2
10
0
0 1 2 3 4 5 6 7 8 9 10 11
0 0 5 10 15 20 25 30
12
Time (µs) Peak Pulse Current -Ipp(A)

Figure 5: Capacitance vs. Reverse Voltage Figure 6: Forward Voltage vs. Forward Current

5
8
f=1 MHz
Capacitance–Cj (pF)

7
Forward Voltage–VF(V)

4
6
I/O Pin to Gnd
3 5

2 3
Between I/O Lines Test
2
Waveform
1 Paramters
1 tr=8µs
td=20µs
0
0
0 1 2 3 4 5 0 2 4 6 8 10 12
Reverse Voltage–VR (V) Forward Current–IF(A)

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 MST236A054U
Outline Drawing – SOT-23-6L

PACKAGE OUTLINE

DIMENSIONS
E1

INCHES MILLIMETER
SEE DETAIL A SYMBOL
MIN MAX MIN MAX
A 0.041 0.049 1.050 1.250
e A1 0.000 0.004 0.000 0.100
e1 A2 0.041 0.045 1.050 1.150
D 0.111 0.119 2.820 3.020
D 0.2 E 0.059 0.067 1.500 1.700
E1 0.104 0.116 2.650 2.950
A2

θ
A e 0.037(BSC) 0.950(BSC)
c
L e1 0.071 0.079 1.800 2.000
A1
L 0.012 0.024 0.300 0.600
θ 0ｏ 8ｏ 0ｏ 8ｏ

X Notes
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT
DIMENSIONS
YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S
DIM INCHES MILLIMETERS MANUFACTURING GUIDELINES ARE MET.

Z 0.141 3.60

C G Z G 0.055 1.40

P 0.037 0.95

X 0.024 0.60
Y
Y 0.043 1.10

C (0.098) (2.50)
P

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