Syllabus Appendix 1

D-10 Adjustment & Alignment

FSE Training
Mechanical Adjustments

• Arm
– Assembly alignment - combine with Rack Drive Module alignment 6.36 (6-
101). While you have the jigs in place align the rack drive module as described
at the top of page 6-114
Some of the next steps have been covered, please review them and
continue on
– X home sensor alignment 6.67 (p.6-195)
– TH offset determination (p. 6-108)
– Tube ID Check (p.6-108)
– Tube height sensor and home flag (p. 6-127)

REMOVE NEEDLE BEFORE PROCEEDING

• Rack input sensor - Section 6.33

– Special jig - starts p. 6-93
• Rack output sensor check - Section 6.34
– Starts p. 6-98
• Barcode alignment - Section 6.31
– Special jig - starts p. 6-85

Power

• Power supply 1 - Section 6.24

(p. 6-64)
– Adjust
to 5.15V

Detector

• Detector - Section 7.2

– Light source intensity check (p.7-3)
– Gain adjust sample (abs.) and reference channels (p. 7-4)
– Offset adjust sample (abs.) and reference channels (p. 7-5)

Thermal Module

• Thermal module check

– Section 7.9 (p.7-39)
– Objective: check the temperature of the thermal module
– Fluke compatible
• Thermal module calibration
– Section 7.10 (p.7-40)
– Objectives: calibrate the temperature measurement on the system. It
consists of the following determinations: gain and offset of the electronic interface
(PCB), the sensor offset correction, the gradient correction; gradient between the
sensor location and the cartridge holder, & check the result of the calibration
• Interface board gain and offset measurements
– Section 7.10.2 (p.7-41)
– Objective: determination the slope and intercept of the interface board
electronics. The values are then saved into the system
• Sensor offset correction measurement
– Section 7.10.3 (p.7-43)
– Objective: determination of the sensor offset correction. The result will be
saved into the system
• Gradient offset measurement
– Section 7.10.4 (p.7-43)
– Objectives: determination of the gradient offset between the position of the
sensor and the cartridge. The value is saved to the system
• Verification
– Section 7.10.5 (p.7-44)
– Objective: To check the temperature of the cartridge

Waste System

• Internal waste bottle performance check

– Section 7.11 (p.7-46)
– Objectives: check the performance of the internal waste bottle vacuum
system & compare the performance to the standard performance

Hall Sensor
• Hall effect sensor check
– Section 7.12 (p.7-48)
– Objective: verify that the hall effect sensor is functioning properly
• Hall effect sensor adjustment
– Section 7.13 (p.7-50)
– Objective: adjustment of the hall-effect sensor

Tube Holder

• Tube identification check

– Section 7.15 (p.7-53)
– Objective: check the identification of microvial adapters using TH offset
and hall-effect sensor parameters

Pump Pressure

• High pressure sensor verification

– Section 7.5 (p.7-22)
– Objective: check the values given by the high pressure sensor. This
procedure must be performed after installation of a new high pressure sensor
• High pressure sensor calibration (field procedure)
– Section 7.6 (p.7-24)
– Objective: calibrate the high pressure sensor: determine the slope and the
intercept & check the result of the calibration

Bar-Code Reader

• Function Check
– Section 7.16 (p.7-54)
– Objective: to check the bar-code reader function
Touch Screen

• Position Calibration
– Section 7-17 (p.7-56)
– Objective: to calibrate the X and Y axes of the touch screen

Pump Flow

• Verification of the pump flow rate

– Section 7.7 (p.7-28)
– Objective: The verification is performed to check the pump flow rate at 1.5
ml/min and at a 500 psi backpressure. The measurement uses either the
volumetric method (7.7.2) or the gravimetric method (7.7.3). This procedure must
be performed if the pump flow rate is in question (RT off, no leaks, stable
pressure)
• Flow rate check: volumetric method
– Section 7.7.2 (p7-29)
• HP pump: flow rate calibration
– Section 7.8 (p.7-32)
– Objectives: measure the pump flow rate, calculate the correction, & check
the correction
– Volumetric method procedure section 7.8.2 (p.7-33)

Pump WC/FC

• WC/FC determination - Section 7.3

– Objective: verification of the waiting count (WC) and filling count (FC)
measurements found in the instrument.ini file. This procedure must be
performed after the replacement of the proportioning valve
• WC/FC determination - Section 7.3
– Materials needed:
1. Cartridge bypass coil
2. Dye with 0.5-0.6 AU absorbance
3. Degasser tubing coil

• Pump stability (p. 7-9)

• Detector Stability (p. 7-9)
• Leak check (p. 7-10)
– Valve and pump OFF
– Valve ON, pump OFF
– Valve and pump ON
• Automated sequence (p. 7-11)
• Static absorption measurement
– Objective: to determine the relative absorption of 100% dye solution
• Dilamex+ test
– Objective:
• Check the dynamic 20%, 50% and 100% values against static 100% and
calculated 20% & 50%
• Tolerance +/- 0.7% @ 50%, <5mAU @ 100%, 13-14% @ 20%
• Step gradient test
– Objective: To measure and check the response curve of the buffer mixing
with the previously measured WC and FC & to check the 50% point.
– Tolerance – varies with point. Values are below theoretical at the bottom
end and above theoretical at the top
• Continuous gradient test
– Objective: check the continuous gradient curve with the previously
measured WC and FC & check if the curve shape is good
– This one is optional (;-)