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This documentation specifies the solder joint goals used by the PCB Library Expert, the
leading library automation solution. Adhere's to IPC-J-STD-001 standard for solder join
at Ribbon L
L Lead
ar End Cap
(Concave, Convex)
dy Outward L
rid Array
Nominal Ball Ball Size Reduced Ball Land Variation Finished Land Density
Courtyard
Diameter Reduction Diameter (Range) Diameter Level
Nominal Ball Ball Size Increased Ball Land Variation Finished Land Density
Courtyard
Diameter Increase Diameter (Range) Diameter Level