FEBRUARY 8, 2006

E U R O P E
NEXT- e d i t o r i a l
How can GENERATION
Circuit Emulation MEDIA NOW news
Services over Welcome to the
Packet (CESoP) premier digital
issue of p o w e r d e s i g n
technology meet the Electronic
economic and power product •
Design Europe round-up
competitive issues
that are pushing
carriers toward SYSTEM-ON- t e c h n o l o g y
network GLASS LCD HVIC technology •
convergence? PROTOTYPE
UNVEILED h o t t o p i c s
SoG’s driver
circuit the key cover story •
component for
operating an LCD w h a t ’ s n e w ?
integrated
directly onto
glass d e s i g n i d e a s
design a differential •
voltage-controlled
current source
KEEPING IT
LEAN AND a p p l i c a t i o n s
MEAN
A look at some open-standard •
of the latest middleware
developments
in the
international
power
electronics
sector
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e d i t o r i a l editorial

Electronic Design Europe digital edition: news

Next-generation media now
power design
Welcome to Electronic Design Europe’s Digital Edition. I hope that as a busy profes-
sional engineer, you will find this twice-monthly edition a fast, convenient, and practi- technology
cal way of receiving the technical news that can help electronics engineers and their
management make the right design decisions. hot topics

Here at Penton Media, we’ve ensured that the digital edition of Electronic Design
what’s new?
Europe is convenient for you to use. We’ve integrated comprehensive navigation facili-
ties into the publication, which guarantees readers a quick and easy trip through our
magazine. The magazine presents itself on your screen via an auto-format facility, design ideas
which means readers don’t have to magnify or scroll to start enjoying its content.
We’ve also included web links that will take readers into the Electronic Design web applications
site, which offers a wealth of technical information and intelligence.

Sponsors support the magazine without overwhelming the reader, yet add value to
the magazine by providing links to electronics-related news, technical papers, and
other technical data on their own web sites.

As always, our mission is to ensure that you, the reader, is getting the information
you need. To help us meet that goal, we welcome and encourage feedback. Tell us
what you think about Electronic Design Europe’s Digital Edition. Let me know what
areas you’d like to see expanded, or those areas you feel may get too much play, by
e-mailing me at the address below. Help us to help you with your design challenges.

Thank you
print

Paul Whytock e-mail to

a friend
Editor-in-Chief
Email: pwhytock@penton.com NEXT: System-On-Glass
Prototype Unveiled home

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n e w s editorial

news

System-On-Glass LCD power design

Prototype Unveiled
A system-on-glass (SoG) low-tem- technology
perature polysilicon (LTPS) TFT
LCD prototype, developed by hot topics
Toshiba Matsushita Display
(TMD) Technology, contains the
what’s new?
driving circuit needed to operate
the LCD that’s integrated directly
onto the glass. design ideas
The new prototype integrates
the analogue circuit for 260K applications
colour production with 6-bit-per-
colour grey scale (including DAC
and amplifier circuitry). Also
included are the driving circuit
required for addressing the rows
and columns of the display, and
the power circuit for the driving
circuit. Finally, there’s a control-
ling circuit that regulates the ana-
logue, driving, and power cir-
cuits as well as all of the other
circuit functions required to oper-
ate the LCD. As a result, by elimi-
nating the external LSI circuits, print
TMD can now build a smaller,
more compact, and lighter LTPS e-mail to
a friend
The TFT LCD prototype features the driving
circuit needed to operate the LCD that’s home
integrated directly onto the glass.
page 3 of 20
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n e w s
TFT LCD that minimises the outer
pc-board size and provides for
quick and simple assembly.
Mobile-phone applications need
LCDs to be much thinner and
lighter in structure, which has
accelerated the trend toward the
adoption of thinner glass. The
new LTPS TFT LCD display holds
an edge over existing chip-on-
glass (CoG) bonding and assem-
bly processes in terms of expect-
ed production quality levels.
Freescale offers FlexRay options
Freescale Semiconductor stakes
its claim as the first company to
offer both integrated and stand-
alone FlexRay controllers. The
MC9S12XFR and MFR4300 are
based on the latest FlexRay ver-
sion 2.1 protocol. The
MC9S12XFR is Freescale’s first
microcontroller to integrate a
FlexRay module with the 16bit
S12X core.
The FlexRay protocol provides
higher data rates and fault toler-
ance required for advanced con-
trol systems that combine multiple
sensors, actuators, and electronic
control units. Core member com-
panies of the FlexRay Consortium
include BMW, Bosch,
DaimlerChrysler, Freescale,
General Motors, Philips, and
Volkswagen. Other leading
Japan-based manufacturers, such
as Honda, Nissan, and Toyota,
joined the consortium as premium
associate members, adding
momentum to the growing
acceptance of FlexRay.
ST to head European research to
cut CMOS power consumption
Designers acknowledge that
leakage currents are a primary
problem for future generations of
electronic circuits and systems.
Enter CLEAN (Controlling
Leakage power in NanoCMOS
SoCs), a new European
Integrated Project to be led by ST
Microelectronics. The three-year
research project, co-funded by
the European Commission, aims
to extend battery life and reduce
electronics power consumption
by finding solutions to control
leakage currents in CMOS
designs below 65nm.
To be successful, and thus be
able to fabricate chips with sub-
65nm technologies, leakage-
reducing countermeasures must
0 8 . 0 2 . 0 6
editorial
news
power design
technology
hot topics
what’s new?
design ideas
applications
Robert Zafalon, R&D Program Manager
of Advanced System Technology, ST
Microelectronics
be rooted in the design domain.
That’s because continuous
process improvements most likely
won’t be able to cope with the
increased leakage currents in
next-generation semiconductor
devices.
The new generation of leakage
power models, design method-
ologies and techniques, and pro- print
totype EDA tools developed with-
in the project promises to man- e-mail to
age and minimise leakage power a friend
even for very complex systems.
Within the CLEAN project, ST home
will manage and coordinate all
page 4 of 20
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n e w s
activities of the 14 European
partners. Together, they feature a
mix of skills (semiconductor ven-
dors, EDA vendors, and academ-
ic and research institutes) and the
appropriate mobilisation of
resources to ultimately achieve
the project’s objectives.
“The CLEAN project will help
overcome the technological short-
Shown with Vishay’s award and trophy from SPDEI are (left to right) Martine Resche,
account manager, distribution; Philippe Masson, distribution manager, France; Stefan Fischer,
director, distribution, Europe; and François Glowacki, account manager, distribution.
comings on the 65nm and below
technology nodes, in particular
leakage currents, process vari-
ability, and unreliability,” says
the project’s leader Roberto
Zafalon, R&D Program Manager
of Advanced System Technology,
STMicroelectronics. “The project’s
outcome will allow the decrease
of power consumption in next-
0 8 . 0 2 . 0 6
editorial
news
generation devices and, at the
same time, increase design pro- power design
ductivity, thus improving the man-
ageability of the additional com- technology
plexity of these devices.”
The CLEAN project’s results are hot topics
expected to span different
aspects of low-leakage design,
what’s new?
from modeling to optimisation,
and from design solutions to
design methods and tools. design ideas
SPDEI awards Vishay for quality applications
Vishay Intertechnology received
an award from the French associ-
ation SPDEI, which includes over
40 distributors of electronic com-
ponents. Members of le Syndicat
Professionnel de la Distribution
en Electronique Industrielle
(SPDEI) include Arrow, Avnet,
Future, and TTI.
The award cites Vishay for “the
quality of their services and their
relationship with their distribution
network.” This holds particular
significance because SPDEI print
works with 166 different compo-
nent manufacturers. e-mail to
a friend
NEXT: Keeping
And Mean
It Lean
home
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p o w e r d e s i g n • power product round-up DATASHEETS DESIGN NOTES editorial

news

International Rectifier‘s IRS2153D is an

NEW 1200V and
600V Drivers
electronic ballast IC for fluorescent lamps. In International Rectifier’s power design
addition to being lead-free, the 600V self- latest HVICs consist of 1200V and 600V
oscillating half-bridge IC includes an internal gate driver and current sense interface ICs technology
offering protection functions in half the
bootstrap diode to simplify circuits.
footprint compared to discrete opto-coupler
or transformer-based solutions. hot topics
optimise external component www.irf.com/eu
selection for uniform lamp bright-
what’s new?
ness during manufacturing. A
preheat feature, which sets the SEMINAR CD PRODUCT CONFIGURATOR
correct preheat frequency for the design ideas
correct duration (thus helping to
maximise lamp life), can be easi- LOWER applications
ly realised externally. your power development cost
The IC includes 2V undervolt- by specifying Vicor modular DC-DC
age lockout hysteresis for more converters. The widest range of
robust ballast circuits and pre- standard input voltages, output

KEEPING IT T
aking a look at the lighting vents unwanted shutdown when voltages, and power levels in
side of the power market, there are momentary transients. the industry.
International Rectifier intro- In addition, an undervoltage www.vicoreurope.com

LEAN
AND
duced its IRS2153D, an electron-
ic ballast IC for fluorescent
lamps. In addition to being lead-
free, the 600V self-oscillating
half-bridge IC includes an inter-
lockout circuit ensures that the
high-side floating voltage correct-
ly switches the high-side gate
driver output.

nal bootstrap diode to simplify PoE Device Merges Analogue,

MEAN
Paul Whytock looks at some of the
latest developments in the
circuits. It’s also designed to
increase efficiency and perform-
ance over older, less-efficient self-
oscillating bipolar transistor-
based solutions.
The IRS2153D’s oscillator fre-
Digital, And Power
Switching gears in the ever-
evolving power arena, a joint
development between
PowerDsine and Freescale has
borne fruit with the PD64004A
print

e-mail to
a friend

home
international power electronics sector quency precision of 3%, helps to 4-Channel Power over Ethernet
page 6 of 20
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p o w e r d e s i g n • power product round-up
Manager IC. The four-port
PD64004A joins the 12-port
PD64012 and other current
PD64004 solutions. One particu-
larly smart aspect of this new
chip, which uses Freescale’s
SMARTMOS8 technology, is that
it integrates power, analogue,
and advanced digital logic func-
tions into one device. It’s opti-
mised for use in low-port count
Ethernet switches, SOHO routers,
and midspans, allowing for next-
generation network devices to
share power and data over the
same cable.
The chip is designed to min-
imise the number of external com-
ponents required and to reduce
overall system costs. Capable of
operating under a switch ambient
temperature range of –40
to
+85
C, the PD64004A simplifies
the router and switch vendor’s
thermal design tasks.
This feature will particularly
benefit those industrial systems
targeted for industrial use.
Moving to 1- sense resistors,
the PD64004A reduces total ther-
mal dissipation and eases system
design. The chip now supports
fully automated operation and
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DATASHEETS DESIGN NOTES editorial
news
power management, eliminating to eight LEDs in series. High out-
NEW 1200V and
600V Drivers
the need for microcontrollers. put power allows for up to International Rectifier’s power design
Special pins dedicated for total 800mW LED loading. latest HVICs consist of 1200V and 600V
setup allow the device to be truly gate driver and current sense interface ICs technology
offering protection functions in half the
stand-alone. Up to eight MOSFET driver ICs have flexible gate footprint compared to discrete opto-coupler
PD64004A managers can coop- drive levels or transformer-based solutions. hot topics
erate automatically to provide up Vishay Intertechnology devel- www.irf.com/eu
to 32 ports of PoE at the lowest oped new high-speed, half-bridge
what’s new?
implementation costs. SEMINAR CD MOSFET driver ICs that
The device fully complies with provide flexible gate-drive SEMINAR CD PRODUCT CONFIGURATOR
the IEEE 802.3af-2003 standard, levels. The company claims they design ideas
and works with pre-standard pro- will optimise efficiency, reduce
prietary solutions. component count, and minimise
expense in high-frequency, high-
LOWER applications
your power development cost
current, dc-dc synchronous rectifi- by specifying Vicor modular DC-DC
er buck power supplies. converters. The widest range of
The MOSFET drivers (the standard input voltages, output
SiP41109 and SiP41110) oper- voltages, and power levels in
ate with external n-channel the industry.
MOSFETs. They’re designed to www.vicoreurope.com
provide gate-drive voltages of 8
White LED Drivers Eye New Colour or 12V, operate at switching fre-
LCD Panels For Portables quencies up to 1 MHz, and func-
Toshiba Electronics Europe tion in 5 to 48V systems (e.g.,
expanded its constant-current power converters, industrial
white LED-driver product line with equipment). The high-side driver
a compact dc-dc converter IC for of each device features an inter- print
powering multi-segment white nal bootstrap diode to reduce
LEDs. These drivers are used to external component count.■ e-mail to
backlight new, larger colour LCD a friend
panels in small portable devices,
including cell phones and PDAs.
A single device drives from two
NEXT: Performance Without
Penalties home
page 7 of 20
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t e c h n o l o g y • HVIC technology
PERFORMANCE
WITHOUT
PENALTIES
We look at how
International Rectifier’s
latest high-voltage IC
(HVIC) technologies can
help designers save
space, cut component
count, improve system
reliability, and deliver
enhanced protection
functionality
D
esigners of today’s industrial
and appliance applications
are continually faced with
the challenge of reducing applica-
tion size and component count. At
the same time, they’ve got to
improve system performance and
reliability. The latest high-voltage
0 8 . 0 2 . 0 6
MICRON SENSOR PRODUCT BROCHURE editorial
news
NEW AT DIGI-KEY,
IC (HVIC) technologies can help
by streamlining the design of the Micron’s CMOS power design
inverter-based, variable-speed image sensor portfolio offers designers
of every image-capture application the
motor drive solutions that increas- flexibility, speed, resolution, feature set, technology
ingly find their way into these and innovative thinking to develop
applications. Furthermore, the high-quality products. hot topics
same integrated technologies can www.digikey.com
also deliver benefits to applica-
what’s new?
tions such as general-purpose
inverter circuits, switch-mode
power supplies (SMPSs), and unin- design ideas
terruptible power supplies (UPSs).
Variable-speed motor drives applications
deliver a number of benefits in
domestic appliances and industri-
al or commercial equipment
(e.g., air conditioners): higher
energy efficiency, improved relia-
bility, lower vibration, and
reduced electrical and acoustic
noise. Implementing these vari-
able-speed drives efficiently and
cost-effectively is made possible
mainly due to advances in
power-semiconductor technology,
via devices such as IGBTs and
power MOSFETs. A key aspect of print
these designs is that the IGBT-
and MOSFET-based power e-mail to
stages are protected from failures a friend
(short circuits, overcurrent condi-
tions, and ground faults). home
Sensing of inverter-stage and
page 8 of 20
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t e c h n o l o g y • HVIC technology
motor-phase currents is another
critical requirement in these
designs, since it’s the basis for
both current-mode control and
overcurrent protection. Current-
mode control requires high preci-
sion and linearity, while overcur-
rent protection requires fast
response. Practically, the current
signals can be sampled in series
with the positive or negative DC
bus, individual IGBT phase leg,
or motor-phase lead (Fig. 1).
Current signals sampled in either
DC bus are the vector sum of all
IGBT-phase-leg currents. Also, the
signal content is the pulse-width-
modulated envelope, at fixed car-
rier frequency, of the fundamental
variable-frequency motor current.
Therefore, rather complicated
“sample-and-hold” plus DSP cir-
cuits must be used to extract use-
ful current information with good
linearity and accuracy.
Sampling current in the individ-
ual IGBT-phase-leg current pres-
ents an easier processing proposi-
tion, but can’t eliminate the need
to deal with carrier frequency
sampling. By far, the simplest cur-
rent signal available is from the
motor-phase lead. The signal con-
Figure 1. Depicted is a cross section of the
HVIC device.
tent is only the fundamental vari-
able-frequency motor current. The
one significant complication here
is that the small differential signal
in the millivolt range is floating on
top of a 600V to 1200V com-
mon-mode voltage. In addition,
the common-mode voltage swings
from –dc to +dc at a dV/dt rate
of up to 10V/ns due to the
action of the IGBT inverter phase.
0 8 . 0 2 . 0 6
MICRON SENSOR PRODUCT BROCHURE editorial
news
NEW AT DIGI-KEY,
Micron’s CMOS power design
image sensor portfolio offers designers
of every image-capture application the technology
flexibility, speed, resolution, feature set,
and innovative thinking to develop
Motor high-quality products. hot topics
www.digikey.com
what’s new?
design ideas
applications
High-voltage IC technology
With the latest developments in
HVIC technology, designers now
can employ elegant, space-sav-
ing, and low-component-count
solutions that address the issues
of protection and current sensing
in modern drive designs. IR’s pro- print
prietary HVIC technology, for
example, allows a low-side e-mail to
grounded CMOS circuit to be a friend
fabricated alongside a high-side
floating CMOS, separated by an home
N- or P-channel LDMOS region
page 9 of 20
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t e c h n o l o g y • HVIC technology MICRON SENSOR PRODUCT BROCHURE

editorial

news
NEW AT DIGI-KEY,
LDMOS level shift tion—functionality that was
HV once available only in high-end Micron’s CMOS power design
n+ p– p– n+ p– n+ p– systems. In addition to these image sensor portfolio offers designers
advanced functions, the ICs fea- of every image-capture application the technology
P++ n-epi P++ flexibility, speed, resolution, feature set,
p-sub ture high noise immunity with and innovative thinking to develop
up to 30% fewer components in high-quality products. hot topics
HV-floating CMOS half the footprint compared to www.digikey.com
HV HV
discrete optocoupler- or trans-
what’s new?
p– n+ p+ p+ n+ n+ n+ p– former-based solutions. As a
n-epi p-well result, designers can reduce
P++ P++
PCB area by as much as 50%. design ideas
p-sub

Grounded CMOS 1200V HVICs a good fit for applications

LV
n+ p+
n-epi
P++
Figure 2. HVIC advances create a variety of space-saving current-sensing methods for mod-
ern drive designs.
(Fig. 2). The LDMOS performs
level shifting to transfer control
signals across the high-voltage
barrier between the low-side and
high-side circuits. What ultimately
results is a technology that
enables the design of single-
monolithic-chip solutions for driv-
ing and protecting MOSFETs and
IGBTs. At the same time, HVIC
technology makes it possible to
sense a small differential voltage
LV
p+ n+ n+ n+
p-well
P++
p-sub
floating on top of a large com-
mon-mode voltage, even when
this includes fast transients.
By using its HVIC technology,
International Rectifier developed
a new suite of rugged, high-
speed, high-voltage IGBT con-
trol ICs and sensor ICs that
enable small circuits with full
protection. These ICs offer a set
of protection functions that
includes ground fault protec-
industrial applications
The IR22381 is an analogue,
three-phase IGBT gate driver.
With a deadtime of 0.5
s, the
device operates ten times faster
than comparable optocoupler-
based drivers. In addition, the
IR22381 minimises temperature
drift and changes in perform-
ance over time.
An integrated de-saturation
feature provides for all modes
of overcurrent protection, includ-
ing ground fault, shoot-through, print
and short-to-supply-rails protec-
tion. Soft shutdown is initiated e-mail to
in the event of an overcurrent a friend
condition followed by the turn-
off of all six outputs. A shut- home
down input is included to
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t e c h n o l o g y • HVIC technology
enable custom shutdown func-
tions. The IR22381 includes pro-
grammable deadtime, and the
output drivers have separate
turn-on/turn-off pins with a
two-stage turn-on output to
achieve the desired IGBT dV/dt
switching level. Voltage feed-
back provides accurate measure-
ments, and a bootstrap power
supply eliminates an auxiliary
power supply.
The IR2277 and IR22771 are
high-speed, single-phase current
sense interface ICs with syn-
chronous sampling for motor
drive applications. The current
is sensed through an external
shunt resistor that converts the
analogue voltage into a time
interval through a precise dual
ramp system. The time interval
is level-shifted and provides
digital PWM output that’s suit-
able for digital-signal-process-
ing and analogue-to-digital
interfaces without additional
logic circuits. Maximum
throughput is 40ksamples/s
(suitable for up to 20kHz asym-
metrical PWM modulation) and
maximum delay is less than
7.5
s at 20kHz.
A noise-immune, bidirectional,
level-shifting circuit is used to
avoid false common-mode, dV/dt
noise up to 50V/ns. The IR2277
provides both analogue and
PWM output, while the IR22771
supplies PWM output.
The IR2214 and IR22141 are
designed to drive single half-
bridge circuits in power switch-
ing applications as well as three-
phase 380VAC circuits at up to
50A at 80C. Unlike solutions
that use optocouplers, the
IR2214 and IR22141 gate driv-
ers deliver stability during their
lifetime and include parameter
matching, which includes propa-
gation delay for high- and low-
side channels as well as dead-
time insertion. Their low quies-
cent current on the high side
enables economical and space-
saving bootstrap supply topology.
Fault feedback on IGBT de-satura-
tion automatically shuts down the
IGBT when used in multiphase
configurations.
Desaturation detection for both
sides as well as an internal bias-
ing resistor are included in the
IR2214, while the IR22141 fea-
tures an additional active de-satu-
0 8 . 0 2 . 0 6
MICRON SENSOR PRODUCT BROCHURE
editorial
news
NEW AT DIGI-KEY,
ration diode bias. The IR2214
and IR22141 can be connected Micron’s CMOS power design
together via a dedicated pin to image sensor portfolio offers designers
of every image-capture application the
protect the drive system from flexibility, speed, resolution, feature set,
technology
phase-to-phase short circuits. and innovative thinking to develop
Input and output pins are 3.3V high-quality products. hot topics
CMOS-compatible to simplify www.digikey.com
microprocessor interfacing.
what’s new?
Separate power and signal
ground pins enable emitter shunt
configurations to simplify low-side design ideas
IGBT current sensing. They’re
packaged in an SSOP-24. applications
600V HVICs targeted for appliance
applications
To best fit appliance motor
drives and a wide range of gen-
eral-purpose inverter circuits, the
1200V HVICs come in 600V ver-
sions. The IR21381 is an ana-
logue three-phase driver, similar
to the IR22381. The IR2177 and
IR21771 are 600V versions of
the IR2277 and IR22771.
Rounding out the set, the IR2114
and IR21141 represent 600V print
versions of the IR2214 and
IR22141. ■ e-mail to
a friend
NEXT: Meeting Network Needs
Both Old And New home
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h o t t o p i c • cover feature editorial

2006 CATALOG TOP 10 WHITE PAPERS
news

MEETING Engineers
and scientists
now can access new graphical tools for
simplifying work that incorporates
time-series analysis, time-frequency
power design

NETWORK
technology
analysis and wavelets with the National
Instruments Advanced Signal Processing
Toolkit. hot topics
www.ni.com

NEEDS what’s new?

BOTH OLD design ideas

AND NEW applications

How can Circuit Emulation Services

over Packet (CESoP) technology meet
the economic and competitive issues
that are pushing carriers toward
network convergence?

I
n the heady days of the telecom
boom, hype led many to
believe a full-scale network rev-
olution was underway. Circuit-
switched infrastructure was going
the way of the dinosaur, the fork-
lifts were ready and running on
the frontlines, and IP networks
were on the rise.
While the evolutionary pace has
slowed from what was predicted
after the telecom crash, carriers
still face the same challenges when
planning to migrate from a circuit-
based to packet-switched-network
(PSN) infrastructure. Primarily, they
need an efficient and cost-effective
solution for transporting revenue-
generating legacy services over
the PSN.
One emerging solution that
meets the economic and competi-
tive issues, thus pushing carriers
toward network convergence, is
Circuit Emulation Services over
Packet (CESoP) technology.
print
The carrier crunch
For decades, the time-division- e-mail to
multiplexing (TDM)-based circuit- a friend
switched network has been the
heart of the Public Switched home
Telephone Network (PSTN).
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h o t t o p i c s • cover feature editorial

2006 CATALOG TOP 10 WHITE PAPERS
news
TDM: time division multiplexing Engineers
Some think TDM’s days are num- CESoP: Circuit Emulation Services over Packet
Wireless LAN
and scientists
access point power design
bered, while others believe this WiMAX (802.16) now can access new graphical tools for
WiMAX simplifying work that incorporates
venerable technology will coexist Wireless LAN MAC
CESoP
alongside IP for years to come.
access point time-series analysis, time-frequency technology
70 Mbits/s TDM analysis and wavelets with the National
Much of the world’s voice traf- up to 48 km equipment
CESoP
MAC Instruments Advanced Signal Processing
fic is still carried over the cir- Toolkit. hot topics
cuit-switched network, account- TDM CESoP www.ni.com
equipment
ing for a significant portion of
what’s new?
carrier revenues. However, data Wi-Fi (802.11)
Wireless LAN
access point
traffic now outpaces voice traf- Wireless LAN
access point Wi-Fi
fic on the network. MAC CESoP T1/E1 design ideas
54 Mbit/s
Wi-Fi
Carriers are caught in an eco- T1/E1 CESoP MAC
up to 100 m
nomic and competitive crunch. TDM
equipment applications
Recognising the tremendous TDM CESoP
equipment
growth in data traffic, carriers
have started to build out IP net-
works on top of their circuit infra- works with VoIP to transfer rev- nectionless networks was met by
structure. Fiscally, this is only a enue-generating services to a both IC manufacturers and
short-term solution. The bottom line less-costly network, and announc- equipment vendors. Their solu-
makes it impossible to maintain ing more IP or Ethernet services tion combines old and new
two disparate networks for voice based on true Ethernet networks, approaches to transport TDM
and data traffic, each with sepa- not on circuit-switched networks. traffic over new IP, Ethernet, or
rate support staff, unique hard- This trend will continue as carri- multiprotocol-label-switching
ware, and different management ers endeavour to reduce costs. (MPLS) networks.
systems. Cable providers and But the major issue remains— The agreed approach is pat-
wireless operators are also carriers need to transport legacy terned after Circuit Emulation
aggressively moving off the side- traffic originating from the home, Service over ATM. Some took print
lines, and are now circling the enterprise, and campuses over ATM cells and packetised the
carriers’ once-secure voice dollars. the new network. payloads into IP packets. Others e-mail to
Carriers are fighting back, and put the TDM channels into the IP a friend
clearly the path forward is con- Introducing CESoP payload directly, thus eliminat-
vergence toward one single PSN. The challenge of transporting ing the segmentation and home
They’re installing new data net- circuit-switched trunks over con- reassembly step of ATM. CESoP
page 13 of 20
EUROPE
h o t t o p i c s • cover feature
has parallels to ATM AAL1
transmission. Both are constant
bit rate, both transmit uncom-
pressed voice, and both support
structured and unstructured cir-
cuit transport.
Synchronisation is a critical
issue when converging circuit-
switched services on a packet-
based infrastructure. In the cir-
cuit-switched network, timing
and synchronisation is inherent
in the technology’s design.
However, when this service is
carried over a PSN, the timing
element is lost and must be
transported by other means.
With CESoP technology, all
associated timing and signalling
information is “tunnelled” along-
side TDM voice, video, and
data traffic across the packet
network.
Standardisation work is well
underway on CESoP technology.
The ITU’s recommendation ITU
Y.1413 deals with TDM over
MPLS networks. The MPLS and
Frame Relay Alliance and the
MEF Forum recently released
their implementation agreements
for Circuit Emulation Services
over MPLS and Metro Ethernet
network. The IETF is also actively
working on TDM-over-Packet
standardisation.
Potential opportunities
Now let’s turn to the opportuni-
ties for this technology. There are
many potential applications in dif-
ferent networks, since the technolo-
gy can run over IP, MPLS, or
Ethernet networks.
One main benefit of the technolo-
gy is its ability to transport many
TDM trunks from one location to
another over a packet network.
The technology is initially being
adopted in the access part of the
network, primarily to transfer multi-
ple trunks across a medium such
as a gigabit fibre or a fixed-radio
access network.
The simplest application for
CESoP technology is to provide
packet interconnection for existing
TDM equipment, enabling legacy
traffic to move across an
IP/MPLS/Ethernet network. By
doing this, TDM vendors can
extend the lifespan of their equip-
ment, and generate years of
income from older products.
Evolving installed equipment to
support new services, rather than
0 8 . 0 2 . 0 6
editorial
2006 CATALOG TOP 10 WHITE PAPERS
news
Engineers
a forklift upgrade, is something and scientists
carriers are asking for now. power design
now can access new graphical tools for
simplifying work that incorporates
Network applications for CESoP time-series analysis, time-frequency technology
analysis and wavelets with the National
CESoP technology is being Instruments Advanced Signal Processing
used to carry Sonet/SDH traffic Toolkit. hot topics
across an IP or Ethernet network, www.ni.com
such as a metro Ethernet network
what’s new?
or a Resilient Packet Ring. The
Sonet/SDH sub-rates are packe-
tised and carried across the design ideas
packet network. Thus, a VT1.5
can be carried across the packet applications
network and be reintegrated into
a Sonet/SDH ring.
We can see that there are
many applications for this tech-
nology in existing and new net-
works. Despite the best wishes of
some, legacy TDM traffic won’t
disappear overnight, meaning
carriers must find innovative and
cost-effective ways to carry this
traffic over the PSN.
CESoP is one viable approach.
It simpler than VoIP, and can be
complementary where VoIP tech- print
nology is too complex or expen-
sive to use. ■ e-mail to
a friend
NEXT: What’s New? home
page 14 of 20
EUROPE
w h a t ’ s n e w ?
Precision power analysers
Tokyo, Japan. To further support
customer requirements for more
advanced and complex power-
analysis capabilities, Yokogawa
introduced an advanced calcula-
tion function as an option for its
WT3000 precision power
analyser. The new /G6 Option
adds the capability for
IEC61000-3-2-compliant harmon-
ic measurements, wide band-
width harmonic measurements,
FFT calculations, and waveform
mathematical functions, plus the
ability to store transient wave-
form data.
Power sensor modules
Munich, Germany. Rohde &
Schwarz launched Power Sensor
Modules R&S NRP-Z27/-Z37 for
its Measuring Receiver R&S
FSMR. The modules, which
include a power sensor with inte-
grated power splitter, allow
designers to determine the signal
power and perform all further
measurements of the measuring
receiver using a single signal con-
nector. The R&S NRP-Z27 and
R&S NRP-Z37 cover a frequency
range up to 18 and 26.5GHz,
respectively. Overall, they pro-
vide, in connection with the R&S
FSMR, a compact solution for cali-
brating signal sources.
When calibrating signal gener-
ators, high accuracy is crucial.
Equipped with the R&S NRP-
Z27/-Z37 module, the R&S
FSMR becomes a high-precision
0 8 . 0 2 . 0 6
PROMOTION DEV TOOLS editorial
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hot topics
Receiver R&S FSMR. One part of www.zilog.com
the signal power is coupled out
what’s new?
to the sensor test cell via the
power splitters integrated in the
power sensors. The other part is design ideas
transferred to the R&S FSMR via
a high-quality microwave cable. applications
Thus, you avoid having to switch
between the power-sensor mod-
ule and the measuring receive.
The latter is necessary when
using two separate instruments.
Machine vision software design kit
is IEEE1394-friendly
Berlin, Germany. Sony Europe’s
Image Sensing Solutions (ISS)
division has developed an
IEEE1394.b machine-vision soft-
ware design kit (SDK). The SDK
makes it simple for customers to print
debug and integrate their appli-
cations with any IEEE1394-type e-mail to
board, IEEE1394.b driver, and a friend
Sony IEEE1394.b camera.
The toolkit speeds development home
time for camera control applica-
page 15 of 20
EUROPE
w h a t ’ s n e w ?
tions with IIDC1394.b Sony digi-
tal cameras using the Microsoft
DirectShow Application Program
interface (API), or the IIDCAPI
camera control API.
Integrators need a good knowl-
edge of C/C++ programming
with DirectShow to gain the
immediate benefits. Users can
capture image data in various
sizes, formats and frames rates.
The kit comes fully documented
with a complete programming
guide, reference guide, and
Direct Show tutorial to reduce
learning time.
File system targets standard
NOR devices
Newbury, England. Abacus Polar
unveiled a range of products for
embedded devices, including file
system software. The new solu-
tions follow the signing of a dis-
tribution agreement with HCC-
Embedded, and complement
existing embedded solutions from
Abacus.
The solutions range from micro-
controllers and digital-signal-pro-
cessing devices, through memo-
ries and development tools, to
complete systems based on
Microsoft Windows CE and XP
Embedded.
The HCC portfolio comprises
several families of file systems
targeted at standard NOR
devices, serial flash, and RAM
drives, through microcontrollers
with embedded flash, to PC-com-
patible cards in compact flash,
multimedia-card (MMC), and
Secure Digital formats. In addi-
tion, there’s software that enables
microcontrollers to be mounted
as pen drives on a standard per-
sonal computer.
EFFS-TINY is a fail-safe file sys-
tem designed for flash devices
with small erasable sectors that
demand a small ROM footprint
and tiny usage of RAM. It’s ideal
for most standard serial flash
parts and RAM drives. The sys-
tem is particularly suited to micro-
controllers (such as the MSP430)
that feature flash which is both
erasable in small sectors and is
application-programmable.
Using EFFS-TINY generates new
possibilities, such as storing con-
figuration data as standard .ini
or .txt files, or simply being able
to drop new .wav files to the
microcontroller.
0 8 . 0 2 . 0 6
PROMOTION DEV TOOLS editorial
news
Cost/time-saving modules set
their sights on wireless systems Whether you need a power design
motor control or general-purpose
Sheffield, U.K. Fabless semicon-
solution, ZiLOG offers the most
ductor company Jennic crafted a comprehensive, award-winning
technology
range of IEEE802.15.4/ZigBee development tools in the market
modules that it says will speed today - each with a FREE C-Compiler. hot topics
development of wireless-sensor- www.zilog.com
based products.
what’s new?
The JN5121MOxxx modules
minimise bill-of-material costs for
wireless systems. They give devel- design ideas
opers access to the full digital and
analogue IO capability of the applications
JN5121 chip, including ADCs,
DACs, comparators, timers, UART,
serial interfaces, and GPIO.
Coming in a surface-mount 18
by 30mm form factor, the modules
include versions with integrated
ceramic antennas or with an SMA
connector for ranges of up to
about 200m. There’s also an 18
by 40mm version with an integrat-
ed power amplifier and low-noise
amplifier for extended-range (over
1km) applications. Each module is
supplied with IEEE802.15.4 MAC print
layer software, or with a ZigBee
network stack. ■ e-mail to
a friend
Design A Differential
NEXT: Voltage-Controlled
Current Source home
page 16 of 20
EUROPE
d e s i g n i d e a s • Design a differential voltage-controlled current source
D
emand for voltage-controlled
current sources (VCCSs) and
multipliers in a wide spec-
trum of electronics and communi-
cation devices always seems to
exist. The multipliers employed in
circuits like the Gilbert Cell, how-
ever, produce outputs proportional
to the product of two voltages.
Research, as well as commercial
applications, perpetually confronts
the problem of implementing a sin-
gle-ended multiplier with an output
that’s produced from the differ-
ences of two pairs of voltages.
The circuit that’s described below
i1
V1
CCII(+)
X
Z mobility, and Cox is the gate
Y
VG1 M1
VG2
M2
1. This simplified circuit shows a linear volt-
age-controlled resistor. Depending on VG1 and
VG2, the resistor’s value can be either posi-
tive or negative.
offers a simple and inexpensive
solution.
To realize a differential VCCS
(DVCCS), one must consider its
design elements, which can be
traced from the linear voltage-
controlled resistor (VCR). The sim-
plified circuit in Figure 1 shows a
linear VCR, whose value can be
either positive or negative
depending on VG1 and VG2
applied to the gates of the
MOSFETs. Assuming identical
MOSFETs, the equivalent resist-
ance (REQ) at the input (V1) is
REQ = V1/i1 = [K(VG1
VG2)]–1 (1)
where K = sCOX(W/L). W/L is
the aspect ratio, ms is the electron
oxide capacitance. These results
were obtained using the ID
VDS
relationship in the triode region.
Equation 1 shows the equivalent
resistance as the difference of two
voltages. This can be exploited to
implement a DVCCS. By
ungrounding the two MOSFETs
and interchanging M2 and
CCII(+), and by making small
modifications/additions, we
obtain a new circuit—a DVCCS,
0 8 . 0 2 . 0 6
editorial
news
or a two-quadrant multiplier.
Figure 2 shows the circuit real- power design
ized as suggested above in
design basics. The circuit consists technology
of two MOSFETs and two current
conveyors: CCII(+) and CCI(2). hot topics
The currents iD1 and iD2 in the tri-
ode operating region of the
what’s new?
MOSFET are:
iD1 = K [(V4
V2
VTH)
design ideas
((V1
V2)/2)](V1
V2) (2)
applications
iD2 = K [(V3
V2
VTH)

((V1
V2)/2)](V1
V2) (3)
Also, the currents i2 and i0
(assuming an ideal current con-
veyor; that is, IX = IZ, IX = IY, VX =
VY, for CCI(+), and IX =
IZ, IX =
IY, VX = VY, for CCI(2)) are:
i2 = iD2
iD1 (4)
iO =
i2 (5)
Performing a complete mathe- print
matical analysis using Equations
2 through 5, we get the current e-mail to
at the output terminal as: a friend
iO= K[(V1
V2)(V3
V4)] (6) home
page 17 of 20
EUROPE
d e s i g n i d e a s • Design a differential voltage-controlled current source
Any three of the four voltages
may be kept constant, and cur-
rent may be obtained in propor-
tion to the fourth one.
Consequently, a conventional
VCCS is realized. If all four volt-
ages are varying, we obtain a
differential VCCS. That is, the
output current is proportional to
the difference of two voltages
and another two voltages.
Moreover, the DVCCS also can
be visualized as a two-quadrant
multiplier where the product of
two voltages yields a proportion-
ate current. Because V3 and V4
are applied to the gate terminals
of the MOSFETs, they must
always be positive. Furthermore,
the direction of the current may
be controlled by varying different
voltages.
The circuit makes the most out
of the MOSFET’s beneficial char-
acteristics—low power consump-
tion, high input impedance, low
fabrication cost by increasing cell
density—with complete elimina-
tion of nonlinear square proper-
ties. As a result, the DVCCS right-
ly falls into the category of exter-
nally linear, internally nonlinear
(ELIN) circuits.
0 8 . 0 2 . 0 6
editorial
news
V1
iD1 iD2
firmed the expected voltage-cur-
rent linearity. power design
To the author’s best knowledge,
V4 M1 V3 M2
no commercially available IC technology
performs conversion of a differen-
iD1 CCII(+) tial voltage to a single-ended cur-
X hot topics
Y
Z rent. Implemented as an IC, this
circuit would require only seven
what’s new?
iD2
terminals: four voltage inputs,
iD1 one current output, and two
power-supply terminals. design ideas
iD1- iD2
CCI(–) The differential VCCS may find
i2 i0
X applications in AGC amplifiers, applications
Y Z amplitude modulators, double-
i2 sideband modulators and detec-
V2
tors, single-sideband modulators
2. The complete circuit for the differential and detectors, AM detectors, fre-
voltage-controlled source can also be consid- quency doublers, squaring cir-
ered to be a two-quadrant multiplier. cuits, dividers, square-root cir-
cuits, rms measuring circuits,
Figure 2 shows how all voltages microemissive displays, tempera-
see a high input impedance. Also, ture controllers, remote error sen-
with the current available at the Z sors, and so on. ■
terminal of the current conveyor,
the current output is available Jivesh Govil is a final-year electron-
from a low impedance source. ics and communication engineering
This clearly shows that the real- student at Netaji Subhas Institute of print
ized VCCS is similar in character- Technology (University of Delhi),
istics to an ideal VCCS. India; e-mail: jivesh@engineer.com e-mail to
This circuit was simulated using a friend
Electronics Workbench An Open Standards
(MultiSim). Its characteristics were
verified using PSpice, which con-
NEXT: Approach To
Simulator Design home
page 18 of 20
EUROPE
0 8 . 0 2 . 0 6

a p p l i c a t i o n s • open-standard middleware editorial

news

ance processing subsystem units

that need to communicate in real power design
time. Thus, as systems get larger
and more distributed, the perform- technology
ance issues of latency, determin-
ism, and system bottlenecks hot topics
become even more critical in main-
taining the simulation experience.
what’s new?
One primary issue is that,
although use of COTS-based open-
standard hardware such as VME design ideas
AN and Unix/PC systems is common,
until recently the only way to pro-
OPEN STANDARDS vide software connectivity between
applications was via proprietary
applications

APPROACH TO systems solutions. Another now-

emerging issue is the need to

SIMULATOR ensure that investment in applica-

tion software can be reused effec-
tively across multiple projects.
These two vital but difficult fac-

DESIGN tors are driving the need for

more formalised software struc-

T
Real Time Innovations o achieve ever-more realistic
performance, whilst still main-
examines the challenges taining real-time response, sim-
and benefits of adopting ulator systems adopt techniques
open standard middle- such as multiprocessor systems,
ware solutions in the high-performance graphics cards,
and distributed sensors and actua-
development of high-per-
tors to boost speed and flexibility.
formance, COTS-based Increasingly, such systems consist
simulator systems. of many different high-perform-
tures, as well as carving a path
toward a COTS middleware solu-
tion. These issues must be tackled
at two levels: both inside print
(between the simulator’s system
components) and outside (for dis- e-mail to
tributed simulator-to-simulator con- a friend
nectivity) such systems.
home
For the rest of this article, click here

page 19 of 20
EUROPE
0 8 . 0 2 . 0 6

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“An Open Standards Approach To Simulator Design” page 20 of 20