electronics

Article
New Wafer Alignment Process Using Multiple Vision
Method for Industrial Manufacturing
Jongwon KIM ID

Department of Electromechanical Convergence Engineering, Korea University of Technology and Education,

Cheonan 31253, Chungnam, Republic of Korea; kamuiai@koreatech.ac.kr; Tel.: +82-41-560-1249

Received: 22 January 2018; Accepted: 8 March 2018; Published: 11 March 2018

Abstract: In semiconductor manufacturing, wafer aligners have been widely used, such as the
conventional alignment method using a Charge Coupled Device (CCD) transmission sensor to detect
the notch or flat in a wafer. This paper presents a proposed vision aligner using a vision method that
can be installed in the wafer and plate bonding machine for mass production. The vision system,
which uses three cameras to perform wafer alignment of position and rotation, detects wafer face
side and ultraviolet (UV) tape on the target wafer and plate. It can be utilized for the alignment
process of wafers and ceramic plate bonding. Using the vision method, the aligner could reduce
the process steps and time required for wafer bonding, as well as unexpected problems caused by
the workers during manufacturing. The system was applied in the mass production field to verify
its performance.

Keywords: vision method; wafer alignment; sapphire wafer bonding; CCD sensor measurement;
LED manufacturing

1. Introduction
Recently, measurement and control technology using image information has begun to be used
to improve the reliability of image information processing in various industrial fields. It has been
greatly improved as a result of the development of various image processing techniques and systems,
such as area classification using the pixel-based method [1], pixel detection method in micro areas [2],
and object detection with image texturing in the image [3]. The cases mentioned show that different
kinds of technologies are used as solutions in the industrial field.
In the semiconductor manufacturing field, wafer bonding is an important process. It has
7 unit-process steps, as follows: particle removal, surface chemistry modification, vacuum pumping,
wafer alignment, room temperature joining, heating and/or forcing, and wafer thinning. Many kinds
of wafer alignment systems use Charge Coupled Device (CCD) sensors to detect the flat surface and/or
notch [4] in the wafer and plate, respectively, in the bonding process. The system can measure the
amount of change in the detected edge and align the wafer and plate. Conventionally, wafer alignment
is performed based on the flat surface of the wafer and the notch of the ceramic plate. A method using
an alignment mark on the wafer surface [5] and automatic position correction method based on rigid
body transformation was applied in a dicing machine [6], and has been widely applied in the correcting
position detection of wafers. In this method, position correction is performed using a CCD sensor with
a high-resolution, a low-density laser beam, as shown in Figure 1a. In this case, the high-resolution,
low-density laser is used to avoid physical damage to the target wafer surface caused by the laser
contact type measuring method. As part of wafer polishing process in semiconductor manufacturing,
the sapphire wafer requires an excellent surface flatness, so UV tape is attached to the wafer to protect
the surface.

Electronics 2018, 7, 39; doi:10.3390/electronics7030039 www.mdpi.com/journal/electronics

Electronics 2018, 7, 39 2 of 11
Electronics 2018, 7, x FOR PEER REVIEW    2 of 10 

   
(a)  (b) 

 
(c)  (d) 
Figure 1.1. 
Figure Conventional 
Conventional method 
method forfor 
the the  detection 
detection of  a  wafer 
of a wafer flat orflat  or  notch. 
notch. (a) aligner;
(a) Wafer Wafer  aligner;  (b) 
(b) normal
normal operation; (c) detection error case No. 1; (d) detection error case No. 2. 
operation; (c) detection error case No. 1; (d) detection error case No. 2.

In  order  to  make  micro‐circuit  patterns  on  the  wafer,  the  wafer  should  be  aligned  with  the 
In order to make micro-circuit patterns on the wafer, the wafer should be aligned with the plate.
plate. For the alignment, the wafer or the ceramic plate should be rotated 360° to detect the edge and 
For the alignment, the wafer or the ceramic plate should be rotated 360◦ to detect the edge and calculate
calculate the position value  of the flat or notch according  to  the  gap  size  obtained  from  the  CCD 
the position value of the flat or notch according to the gap size obtained from the CCD sensor. The
sensor. The CCD sensor is fixed to the outer position of the wafer, as shown in Figure 1b. At this 
CCD sensor is fixed to the outer position of the wafer, as shown in Figure 1b. At this point, if any
point, if any opaque foreign materials are attached on the measuring position in flat or notch (front 
opaque foreign materials are attached on the measuring position in flat or notch (front and/or back
and/or back side),  such as a particle, the CCD sensor may not detect the position value  clearly.  So, 
side), such as a particle, the CCD sensor may not detect the position value clearly. So, the particle
the particle removal process step is located as the first step in the wafer bonding process. Due to the 
removal process step is located as the first step in the wafer bonding process. Due to the interference
interference of UV tape, the conventional method cannot be applied to the sapphire wafer process. 
of UV tape, the conventional method cannot be applied to the sapphire wafer process. The operator
The  operator  can  make  the  mistake  of putting  the  wafer  upside  down.  For  this  reason,  the  vision 
can make the mistake of putting the wafer upside down. For this reason, the vision aligner in which
aligner  in  which  the  newly  proposed  vision  method  is  applied  has  the  function  of  preventing 
the newly proposed vision method is applied has the function of preventing equipment malfunction
equipment malfunction due to operator error in the mass production field. 
due to operator error in the mass production field.
2. Vision System and Method 
2. Vision System and Method
2.1. Wafer Alignment Method 
2.1. Wafer Alignment Method
The alignment
The alignment  of of 
thethe  mechanical 
mechanical movement 
movement process 
process consists 
consists of twoof  two The
steps. steps. 
firstThe 
stepfirst  step  is 
is position
position matching with a plate and wafer, and the second step is detection of flat and notch of wafer 
matching with a plate and wafer, and the second step is detection of flat and notch of wafer and plate.
In theplate. 
and  In  the 
alignment alignment 
steps, steps,  the 
the mechanical mechanical 
drivers drivers  are 
are controlled controlled 
by the by  the compensation
offset-distance offset‐distance 
compensation methodology as shown in Figure 2 [7]. 
methodology as shown in Figure 2 [7].
Electronics 2018, 7, 39 3 of 11
Electronics 2018, 7, x FOR PEER REVIEW    3 of 10 

 
Figure 2. Wafer alignment with offset compensation methodology. 
Figure 2. Wafer alignment with offset compensation methodology.
‐ e: The distance between center of wafer (O’) and the center of chuck in aligner (O) 
− ‐ L: The distance between center of wafer and X’ 
e: The distance between center of wafer (O’) and the center of chuck in aligner (O)
‐ ϕ: The angle between center of wafer and the center of chuck in aligner 
− L: The distance between center of wafer and X’
‐ θ: The rotation angle of alignment 
− φ: The angle between center of wafer and the center of chuck in aligner
‐ R: The radius of the wafer 
− θ: The rotation angle of alignment
‐ W: The distance between O and X’ 
− R: The radius of the wafer
For the pre‐alignment, the center position of the aligner (O) should be overlapped with the real 
− W: The distance between O and X’
center position of the wafer (O’), but between the two positions have an error distance (e). In order 
to  find  the  distance  (e)  and  angle  (ϕ)  with  R,  the  controller  of  the  aligner  needs  the  correction 
For the pre-alignment, the center position of the aligner (O) should be overlapped with the real center
position value, which should be calculated by the relation formula from the form of trigonometric 
position of the wafer (O’), but between the two positions have an error distance (e). In order to find
function [8], 
the distance (e) and angle (φ) with R, the controller of the aligner needs the correction position value,
sin
which should be calculated by the relation formula ∅ the form
from cos of trigonometric
∅ ,  (1)
function [8],
q cos , (2)
2
W= R2 − (e sin(θ − ∅))
0. + e cos(θ − ∅), (3) (1)
In  that  case,  the  value  of X’  (Xi,  Yi)  in  polar  coordinates should be  converted  to  the  value of 
Xi = Li cos θi , (2)
rectangular coordinates by the Equations (2) and (3). 
Yi = 0. (3)
, ,   (4)
In that case, the value of X’ (Xi, Yi) in polar coordinates should be converted to the value of
rectangular coordinates by the Equations (2) and (3).
2 N q 2 2 0  (5)
S( a, b, R) = ∑ 2
( Xi − a) + (Yi − b) 2
(4)
i =o
2n i 2 0 (6)
∂S 
= 2 ∑ [( Xi − a) + Yi − a) − r (−2)( Xi − a) = 0
2 2 2
(5)
∂a i =1
Moreover,  in  order  to  overlap  the  position  O  with  O’,  the  W  should  be  calculated  by  the 
equation using three parameters a, b and R. Using Equation (3), the position value of O’ (a, b) can be 
∂S n  i
= 2 ∑such 
calculated  by  a  calculator,  − aa )2processor 
[( Xi as  )2 − rthe 
+ Yi − bwith  2
(− 2)(Yi −
known  b) = 0 R,  and  then  the  (6)
parameter 
∂b i =1
mechanical movement controller will align with the wafer origin, approaching in phases as shown 
Moreover, in order to overlap the position O with O’, the W should be calculated by the equation
using three parameters a, b and R. Using Equation (3), the position value of O’ (a, b) can be calculated
by a calculator, such as a processor with the known parameter R, and then the mechanical movement
controller will align with the wafer origin, approaching in phases as shown in Figure 3. After the
Electronics 2018, 7, 39 4 of 11

Electronics 2018, 7, x FOR PEER REVIEW    4 of 10 

pre-alignment, the wafer should be rotated by the rotation chuck with the mechanical limitations
in  Figure  3.  After  the  pre‐alignment,  the  wafer  should  be  rotated  by  the  rotation  chuck  with  the 
Electronics 2018, 7, x FOR PEER REVIEW 
of flat and notch using a detection   4 of 10 
mechanical limitations  of  flat  and method with
notch  using  the CCDmethod 
a  detection  sensorwith 
[9]. the 
After
CCD the wafer
sensor  alignment,
[9]. After 
the mechanical aligner has to rotate for completion of alignment by re-check.
the wafer alignment, the mechanical aligner has to rotate for completion of alignment by re‐check. 
in  Figure  3.  After  the  pre‐alignment,  the  wafer  should  be  rotated  by  the  rotation  chuck  with  the 
mechanical limitations  of  flat  and  notch  using  a  detection  method  with  the  CCD  sensor  [9]. After 
the wafer alignment, the mechanical aligner has to rotate for completion of alignment by re‐check. 

(a)  (b)
Figure 3. Wafer alignment process: (a) origin matching; (b) wafer rotation. 
Figure 3. Wafer alignment process: (a) origin matching; (b) wafer rotation.
(a)  (b)
2.2. Implementation of the Vision Aligner Using the Method 
Figure 3. Wafer alignment process: (a) origin matching; (b) wafer rotation. 
2.2. Implementation of the Vision Aligner Using the Method
In this research, the vision aligner consists of a vision system and aligner, as shown in Figure 4. 
2.2. Implementation of the Vision Aligner Using the Method 
The vision system has three vision‐cameras, and the vision area covers the target wafer size, and the 
In this research, the vision aligner consists of a vision system and aligner, as shown in Figure 4.
pixel position values are a known parameter. The vision camera consists of a pixel array (one pixel 
The vision system has three vision-cameras, and the vision area covers the target wafer size, and the
In this research, the vision aligner consists of a vision system and aligner, as shown in Figure 4. 
has  a  unit values
size  of are
real alength), 
knownso  the  counting  number 
visionof  pixels  can  be  converted 
pixelThe vision system has three vision‐cameras, and the vision area covers the target wafer size, and the 
position parameter. The camera consists to  a 
of a pixel real length 
array (one pixel
with 
unit size of real length), so the counting number of pixels can be converted to a realsystem 
unit  value  based  directly  on  the  real  position from  the  captured image.  The vision 
has apixel position values are a known parameter. The vision camera consists of a pixel array (one pixel  lengthis with
aimed at position correction in the sapphire wafer and ceramic plate bonding process with attached 
has  a  unit  size  of  real on
length),  so  the  counting  number  of  pixels image.
can  be The
converted 
unit value based directly the real position from the captured visionto  a  real length 
system is aimed at
UV tape. 
with  unit  In addition, wafer flip detection has been added to prevent misapplication of wafers by 
value  based  directly  on  the  real  position from  the  captured image.  The vision  system  is tape.
position correction in the sapphire
workers in the manufacturing process.  wafer and ceramic plate bonding process with attached UV
aimed at position correction in the sapphire wafer and ceramic plate bonding process with attached 
In addition, wafer flip detection has been added to prevent misapplication of wafers by workers in the
UV tape.  In addition, wafer flip detection has been added to prevent misapplication of wafers by 
manufacturing process.
workers in the manufacturing process. 

 
Figure 4. Vision aligner for wafer positioning and angle correction. 
 
Figure 4. Vision aligner for wafer positioning and angle correction. 
Figure 4. Vision aligner for wafer positioning and angle correction.
Electronics 2018, 7, x FOR PEER REVIEW    5 of 10 
Electronics 2018, 7, 39 5 of 11
The  vision aligner  is  designed  to  replace  the  wafer  aligner using  the  conventional  method  in 
the manufacturing of micro light emitting diodes (LEDs). Sapphire wafers are suitable materials for 
The vision aligner is designed to replace the wafer aligner using the conventional method in the
LED fabrication, and are used at sizes of 2, 4 and 6 inches, and there are many substrate arrays for 
manufacturing
producing  LEDs  of micro light emitting
on  wafers.  In  order diodes (LEDs).
to  make  one Sapphire wafers
LED  chip,  one are suitable is 
substrate  materials for LED
necessary.  The 
fabrication, and are used at sizes of 2, 4 and 6 inches, and there are many substrate arrays
maximum  size  of  the  substrate  is  0.8  mm,  and  the  allowable  array  angle  error  range  is  0.1°,  for producing
LEDs on wafers. In order to make one LED chip, one substrate is necessary. The maximum size of the
including mechanical movement error and error in the vision system. Thus, there is a limitation in 
substrate is 0.8 mm, accuracy 
that  the  operation  and the allowable
range  is array angle error
less than ±0.8  range is 0.1◦ , including mechanical movement
mm and ±0.1° for the centering and rotational 
error and error in the vision system. Thus, there is a limitation in that the operation accuracy range is
errors, respectively. 
less than ±0.8 mm and ±0.1◦ for the centering and rotational errors, respectively.
The vision system has three cameras, which are mounted on a movement rail. Camera No. 1 
(Cam  The visionMono, 
1)  (10M  systemRS‐A5001‐10GM, 
has three cameras, which Kwangmyung 
Vicosys,  are mounted on a movement
city,  Republic  of  rail. Camera
Korea)  No. 1
performs 
(Cam 1) (10M Mono, RS-A5001-10GM, Vicosys, Kwangmyung city, Republic
rotation and translation correction of the wafer, camera No. 2 (Cam 2) (5M Color, RS‐A5001‐5CM,  of Korea) performs
rotation and translation correction of the wafer, camera No. 2 (Cam 2) (5M Color, RS-A5001-5CM,
Vicosys, Kwangmyung city, Republic of Korea) detects whether the wafer turns upside down or not, 
Vicosys, Kwangmyung
and  camera  No.  3  (Cam  city,
3) Republic
(5M  Mono,  of Korea) detects whether
RS‐A5001‐5GM,  the Kwangmyung 
Vicosys,  wafer turns upside city, down or not,
Republic  of 
and camera No. 3 (Cam 3) (5M Mono, RS-A5001-5GM, Vicosys, Kwangmyung city,
Korea) detects if the UV tape is normally attached to the wafer surface or not. The resolution of each  Republic of Korea)
detects if the UV tape is normally attached to the wafer surface or not. The resolution of each camera
camera was 94 μm/pixel. Cam 1 and 2 are used for white‐ring‐type back‐light, which has a lighting 
was 94 µm/pixel.
dimmer,  and  the  Cam
white 1 coaxial 
and 2 are used
light  is for
for white-ring-type
the  Cam  3,  with back-light, which has
a  90°  reflection  a lighting
mirror.  dimmer,
Applying  the 
and the white coaxial light is for the Cam 3, with a 90 ◦ reflection mirror. Applying the vision method
vision  method  to  the  sapphire  wafer  bonding  process,  the  working  distance  is  690  mm  between 
to the sapphire wafer bonding process, the working distance is 690 mm between Cam 1 and the wafer,
Cam 1 and the wafer, as shown in Figure 4. It is possible to use a maximum wafer size of 10 inches, 
as shown
and  in Figure
this  can  4. It is based 
be  decided  possibleon tothe 
userequired 
a maximum image wafer size of
quality,  10 inches,
wafer  and this
size,  and  can be of 
the  depth  decided
focus 
based on the required
(DOF) of the applied camera. image quality, wafer size, and the depth of focus (DOF) of the applied camera.

 
Figure 5. Vision aligner for the detection of wafer flipped. 
Figure 5. Vision aligner for the detection of wafer flipped.
In
In order
order toto detect the
detect  wafer
the  inversion,
wafer  Cam
inversion,  2 checks
Cam  the mask
2  checks  pattern
the  mask  on theon 
pattern  wafer surface,surface, 
the  wafer  which
is carved on both sides of wafer. The mask pattern is a special characteristic. When white light
which  is  carved  on  both  sides  of  wafer.  The  mask  pattern  is  a  special  characteristic.  When  white  is
applied to the mask pattern as shown in Figure 5, a white color mask pattern appears on the
light is applied to the mask pattern as shown in Figure 5, a white color mask pattern appears on the  back side
of the wafer, and a yellow color mask patterns appears on the front side. The color value comparison
back side of the wafer, and a yellow color mask patterns appears on the front side. The color value 
is the most effective way to recognize whether the wafer is turned over in vision processing or not.
comparison is the most effective way to recognize whether the wafer is turned over in vision processing 
In order to detect UV tape on the wafer surface, a 90◦ reflection mirror is installed in front of the camera
or not. In order to detect UV tape on the wafer surface, a 90° reflection mirror is installed in front of the 
to acquire an image of the wafer’s flank, as shown in Figure 6.
camera to acquire an image of the wafer’s flank, as shown in Figure 6. 
Electronics 2018, 7, 39 6 of 11
Electronics 2018, 7, x FOR PEER REVIEW    6 of 10 

Electronics 2018, 7, x FOR PEER REVIEW    6 of 10 

 
Figure 6. Vision aligner for UV tape detection.   
Figure 6. Vision aligner for UV tape detection.
Figure 6. Vision aligner for UV tape detection. 
2.3. Operation of the Vision Aligner 
2.3. Operation of the Vision Aligner
2.3. Operation of the Vision Aligner 
The  vision  aligner  has  three  basic  functions:  the  correction  of  the  wafer  position  and  angle, 
detection of wafer inversion, and detection of the attached UV tape. In the manufacturing process 
The vision
The  aligner
vision  hashas 
aligner  three basic
three  basic functions: the correction 
functions:  the  correctionof of the
the  wafer
wafer  position
position  and  and angle,
angle, 
with  a  wafer,  UV  tape  is and
attached  on  the  front  side  of UV
surface, 
tape.and  then  it  is  inserted  into 
detection of wafer inversion, and detection of the attached UV tape. In the manufacturing process 
detection of wafer inversion, detection of the attached In the manufacturing the with
process
cassettes of the wafer bonding process equipment. During the process, many mistakes result from 
with  a  wafer, 
a wafer, UV tape is UV  tape  is 
attached onattached 
the fronton  the of
side front  side  of 
surface, and surface, 
then itand  then  it  is 
is inserted intoinserted  into  the 
the cassettes of the
worker error, such as from inserting the wafer into cassette without the UV tape. In this case, the 
cassettes of the wafer bonding process equipment. During the process, many mistakes result from 
wafer bonding process equipment. During the process, many mistakes result from worker error, such
whole mass production process will be stopped until the problem is solved. In order to avoid such 
worker error, such as from inserting the wafer into cassette without the UV tape. In this case, the 
as from
an  inserting
uncertain the wafer the 
problem,  intovision 
cassette without
performs  the UVcorrection 
position  tape. In this
and case,
three the whole
steps  mass production
of  inspection  as 
whole mass production process will be stopped until the problem is solved. In order to avoid such 
process will be stopped
shown in Figure 7.  until the problem is solved. In order to avoid such an uncertain problem,
an  uncertain  problem,  the  vision  performs  position  correction  and  three  steps  of  inspection  as 
the vision performs position correction and three steps of inspection as shown in Figure 7.
shown in Figure 7. 

 
 
Figure 7. Operation steps of the aligner controller and vision system. 
Figure 7. Operation steps of the aligner controller and vision system. 
At first, when the wafer transfer robot moves the wafer from the cassette to the work chuck in 
Figure 7. Operation steps of the aligner controller and vision system.
the  aligner,  Cam  1  takes  the  image  of  the  entire  area  of  the  present  wafer.  The  error  of  wafer 
At first, when the wafer transfer robot moves the wafer from the cassette to the work chuck in 
the first,
At aligner, 
when Cam 
the1 wafer
takes transfer
the  image  of  the 
robot movesentire 
thearea 
waferof  from
the  present  wafer. toThe 
the cassette theerror 
workof  wafer 
chuck in the
aligner, Cam 1 takes the image of the entire area of the present wafer. The error of wafer position and
angle are measured by the captured image from Cam 1 of the vision system, as shown in Figure 8. Then,
Electronics 2018, 7, 39
Electronics 2018, 7, x FOR PEER REVIEW    7 of 11
7 of 10 

Electronics 2018, 7, x FOR PEER REVIEW    7 of 10 
position and angle are measured by the captured image from Cam 1 of the vision system, as shown 
the measured error is transmitted to the mechanical controller. The controller performs the position
in  Figure  8.  Then,  the  measured  error  is  transmitted  to  the  mechanical  controller.  The  controller 
position and angle are measured by the captured image from Cam 1 of the vision system, as shown 
and angle correction according to the error values. Figure 8c,d shows the position correction processes
performs  the Then, 
position 
the and  angle  correction  according to 
to  the mechanical 
error  values.  Figure  8c,d 
The shows  the 
of the plate8. (notch
in  Figure  type), measured  error 
in which the is  transmitted 
operation method is the 
the same as the controller. 
wafer position controller 
correcting
position correction processes of the plate (notch type), in which the operation method is the same as 
performs  the  position  and  angle 
operation. If the deviation of the correction  according 
wafer position to  the with
is satisfied error 
thevalues.  Figure 
reference 8c,d the
value, shows  the 
system
the wafer position correcting operation. If the deviation of the wafer position is satisfied with the 
position correction processes of the plate (notch type), in which the operation method is the same as 
performs the next steps with Cam 2 and 3.
reference value, the system performs the next steps with Cam 2 and 3.   
the wafer position correcting operation. If the deviation of the wafer position is satisfied with the 
reference value, the system performs the next steps with Cam 2 and 3.   

(a)  (b)
(a)  (b)

(c)  (d) 
(c)  correction  with  Cam  1,  (a)  before  the  operation 
Figure 8. Position  and  angle  (d)  (wafer/flat  type);  (b) 
Figure 8. Position and angle correction with Cam 1, (a) before the operation (wafer/flat type); (b) after
after the operation; (c) before the operation (plate/notch type); (d) after the operation. 
Figure 8. Position  and  angle  correction  with  Cam type);
1,  (a) (d)
before 
the operation; (c) before the operation (plate/notch afterthe 
the operation 
operation.(wafer/flat  type);  (b) 
after the operation; (c) before the operation (plate/notch type); (d) after the operation. 
After completing the position and angle correction, the Cam 2 captures the mask pattern of the 
After
wafer  completing
surface.  the position
To  determine  and angle
the  correct  correction,
wafer  thenumber 
side,  the  Cam 2 captures thecolor 
of  yellow  mask pixels 
patterncan 
of the
be 
After completing the position and angle correction, the Cam 2 captures the mask pattern of the 
wafer surface. To determine
extracted from the pattern.  the correct wafer side, the number of yellow color pixels can be extracted
wafer  surface.  To  determine  the  correct  wafer  side,  the  number  of  yellow  color  pixels  can  be 
from the pattern (Figure 9a,b).
extracted from the pattern. 

(a)  (b) 
Figure  9.  Detection  (a)  (b) 
of  wafer  inversion,  (a)  mask  color  pattern  of  the  front  side;  (b)  mask  color 
pattern of the back side. 
Figure  9.  Detection  of  wafer  inversion,  (a)  mask  color  pattern  of  the  front  side;  (b)  mask  color 
Figure 9. Detection of wafer inversion, (a) mask color pattern of the front side; (b) mask color pattern
pattern of the back side. 
of the back side.
Finally, Cam 3 captures the image of the wafer flank to detect the attached UV tape. UV tape 
can  be  detected  by  changing  of  image  values  to  black  and  white  (image‐binarization)  and  with 
Finally, Cam 3 captures the image of the wafer flank to detect the attached UV tape. UV tape 
thickness and threshold comparison with the captured image, as shown in Figure 10a,b. 
can  be  detected  by  changing  of  image  values  to  black  and  white  (image‐binarization)  and  with 
thickness and threshold comparison with the captured image, as shown in Figure 10a,b. 
Electronics 2018, 7, 39 8 of 11

Finally, Cam 3 captures the image of the wafer flank to detect the attached UV tape. UV tape can
be detected by changing of image values to black and white (image-binarization) and with thickness
and threshold comparison with the captured image, as shown in Figure 10a,b.
Electronics 2018, 7, x FOR PEER REVIEW    8 of 10 
Electronics 2018, 7, x FOR PEER REVIEW    8 of 10 

  
(a)  (b) 
(b) 
(a) 
Figure 10. Detection of UV tape attached: (a) with UV tape attached; (b) without UV tape. 
Figure 10. Detection of UV tape attached: (a) with UV tape attached; (b) without UV tape. 
Figure 10. Detection of UV tape attached: (a) with UV tape attached; (b) without UV tape.

The 
The  threshold 
threshold  line 
line  is 
is  set 
set  up 
up  according 
according  to 
to  the 
the  error 
error  range 
range  based 
based  on 
on  the 
the  target 
target  wafer 
wafer  size 
size  and 
and 
The threshold
thickness.  The  UV  line is
tape  set
can  up
be  according
detected  if to the
the  error
image  range
area  based
of  the  on
UV  the
tape  target wafer
crosses  the  size
line  and
and 
thickness.  The  UV  tape  can  be  detected  if  the  image  area  of  the  UV  tape  crosses  the  line  and 
thickness.
thickness.  The UV tape can be detected if the image area of the UV tape crosses the line and thickness.
thickness.    
The
The  vision aligner is installed in the fully automated wafer-bonding equipment for LED
The  vision 
vision  aligner 
aligner  is 
is  installed 
installed  in 
in  the 
the  fully 
fully  automated 
automated  wafer‐bonding 
wafer‐bonding  equipment 
equipment  for 
for  LED 
LED 
manufacturing in Korea. To make more suitable equipment for mass production,
manufacturing in Korea. To make more suitable equipment for mass production, the vision aligner  the vision aligner
manufacturing in Korea. To make more suitable equipment for mass production, the vision aligner 
should be integrated with the controller, and the mass production process should be inspected by a
should be integrated with the controller, and the mass production process should be inspected by a 
should be integrated with the controller, and the mass production process should be inspected by a 
worker. The operation states of the vision aligner are displayed using the Graphical User Interface
worker. The operation states of the vision aligner are displayed using the Graphical User Interface 
worker. The operation states of the vision aligner are displayed using the Graphical User Interface 
(GUI) software as shown in Figure 11. The GUI software has multiple vision methods for the three
(GUI) software as shown in Figure 11. The GUI software has multiple vision methods for the three 
(GUI) software as shown in Figure 11. The GUI software has multiple vision methods for the three 
cameras, and control algorithms for aligner and system monitoring in real time.
cameras, and control algorithms for aligner and system monitoring in real time. 
cameras, and control algorithms for aligner and system monitoring in real time. 

  
Figure 11. GUI software of vision aligner. 
Figure 11. GUI software of vision aligner. 
Figure 11. GUI software of vision aligner.
3. Performance Test and Consideration of This Research 
3. Performance Test and Consideration of This Research 
The 
The  proposed 
proposed  vision 
vision  aligner 
aligner  with 
with  vision 
vision  methods 
methods  was 
was  verified 
verified  through 
through  tests 
tests  with 
with  over 
over  2000 
2000 
wafers in the mass production field. In the test results, there were no bonding defects caused by the 
wafers in the mass production field. In the test results, there were no bonding defects caused by the 
position 
position  correction 
correction  errors, 
errors,  and 
and  no 
no  occurrence 
occurrence  of 
of  defects 
defects  in 
in  which 
which  wafers 
wafers  were 
were  flipped 
flipped  in 
in  cassettes 
cassettes 
with 
with  UV  tape.  The  UV  tape  attached  on  the  wafer  tip  can  be  measured  with  the  length  over 
UV  tape.  The  UV  tape  attached  on  the  wafer  tip  can  be  measured  with  the  length  over  the 
the 
reference line on the image in most cases. However, when the tips of the UV tape and wafer have 
reference line on the image in most cases. However, when the tips of the UV tape and wafer have 
the same length, which is the rarely cases, it could not be detected on the basis of a third inspection 
the same length, which is the rarely cases, it could not be detected on the basis of a third inspection 
Electronics 2018, 7, 39 9 of 11

3. Performance Test and Consideration of This Research

The proposed vision aligner with vision methods was verified through tests with over 2000 wafers
in the mass production field. In the test results, there were no bonding defects caused by the position
correction errors, and no occurrence of defects in which wafers were flipped in cassettes with UV tape.
The UV tape attached on the wafer tip can be measured with the length over the reference line on the
image in most cases. However, when the tips of the UV tape and wafer have the same length, which is
the rarely cases, it could not be detected on the basis of a third inspection with Cam 3. In this case,
the error occurs on the flat inspection step, and the aligner can sort out the defective wafers. Figure 12
shows the bonding system equipped with the vision aligner.
Electronics 2018, 7, x FOR PEER REVIEW    9 of 10 

 
Figure 12. Sapphire wafer‐bonding system with vision aligner. 
Figure 12. Sapphire wafer-bonding system with vision aligner.

The proposed vision method is a new method to replace the conventional one. It is difficult to 
compare proposed
The visiondifference 
the  technical  method isbetween 
a new method to replace but 
both  methods,  the conventional one. Ititems 
some  comparison  is difficult to
can  be 
compare the technical difference between both methods, but some comparison items can be compared,
compared, as shown in Table 1. 
as shown in Table 1.
Table 1. The inspection result with comparison of conventional and proposed methods. 
Table 1. The inspection result with comparison of conventional and proposed methods.
No.  Name of Item Conventional Method Vision Method 
No.
1.  Name of Item
Using a sapphire wafer  Conventional
Impossible  Method Vision Method
Possible 
2. 
1. Time‐consuming for wafer alignment 
Using a sapphire wafer 0.5~1 s 
Impossible 1~2 s 
Possible
2.
3.  Time-consuming for wafer alignment
Detection accuracy for flat/notch  0.5~1 s
Over the 0.1 mm  1~2 s
Over 294 μm 
3.
4.  Detection accuracy for flat/notch
Detection of wafer inversion  Over the 0.1 mm
Impossible  Over 294 µm
Possible 
4. Detection of wafer inversion Impossible Possible
5. 
5.
Detection of UV tape 
Detection of UV tape
Impossible 
Impossible
Possible 
Possible

With  regard  to  item  No.  1,  the  conventional  method  cannot  be  applied  to  the  alignment 
With regard
process  steps  to a 
with  item No. 1, wafer 
sapphire  the conventional method
that  has  a  UV  cannot
tape,  bevision 
but  the  applied to the alignment
method  process
can  be  used  for  a 
steps with a sapphire wafer that has a UV tape, but the vision method can be used for a general
general  wafer  or  a  sapphire  wafer.  In  the  conventional  method,  since  the  position  value  wafer is 
calculated while the wafer is placed, the time required for actual placement is shorter than the new 
method.  However,  at  mass‐production  sites,  the  wafer  for  final  alignment  must  be  rotated  more 
than three times, and the value of the position must be calculated for every rotation. However, since 
the new method extracts the coordinate values on the image, a separate mechanical operation time 
is  not  required.  As  a  result,  the  alignment  process  is  terminated  at  less  than  one  rotation  of  the 
Electronics 2018, 7, 39 10 of 11

or a sapphire wafer. In the conventional method, since the position value is calculated while the
wafer is placed, the time required for actual placement is shorter than the new method. However,
at mass-production sites, the wafer for final alignment must be rotated more than three times, and the
value of the position must be calculated for every rotation. However, since the new method extracts
the coordinate values on the image, a separate mechanical operation time is not required. As a
result, the alignment process is terminated at less than one rotation of the wafer, and quick response
characteristics can be obtained.
In the case of item No. 3, it is necessary to minimize the physical laser component in the
conventional method. In addition, minimized components can result in unexpected results at industrial
sites due to reduced laser density and signal power. Since the newly proposed method has a size of
94 µm/pixel for one pixel, the accuracy must be at least 94 [µm/pixel].
However, due to interference of light transmitted from outside, unless an accuracy of at least
3 pixels or more is guaranteed, it can be used safely at the industrial site.

4. Conclusions
The semiconductor manufacturing industry is one of the mass production industries. In particular,
in the semiconductor manufacturing industry, accuracy is an important factor, as many types of
manufacturing equipment have an organic relationship. Considering the characteristics of such
industries, the machine vision technology combining vision technology and machine control technology
has the advantage that it can actively respond to various working environments.
The vision aligner proposed in this research is a good example of verifying the effectiveness of
convergence technology through an operation test at an industrial site. In addition, by applying the
vision aligner to the sapphire wafer process, which cannot be done with the conventional method, it is
possible to expect development of convergence technology in the future.
In the near future, in order to develop more diverse and advanced technologies, it is necessary to
analyze the problems in the industrial field and consider applying multifaceted technologies to solve
the problem. Moreover, along with the development of the machine vision technology applied in this
research, it is necessary to promote research on various related convergence technologies with artificial
intelligence technology.

Conflicts of Interest: The author declares no conflict of interest.

References
1. Miyasaka, T.; Okuro, T.; Zhao, X.; Takeuchi, K. Classification of Land Use on Send-Dune Topography
by Object-Based Analysis, Digital Photogrammetry, and GIS Analysis in the Horqin Sendy Land, China.
Environments 2016, 3, 17. [CrossRef]
2. Wermes, N. Pixel detector for particle physics and imaging application. Nucl. Instrum. Methods Phys. Res.
2013, A, 277–288. [CrossRef]
3. Nan, B.; Mu, Z.; Cheng, J. A Local Texture-Based Superpixel Feature Coding for Saliency Detection Combined
with Global Saliency. Appl. Sci. 2015, 5, 1528–1546. [CrossRef]
4. Park, H.L.; Lyou, J. A Wafer Alignment Method and Accuracy Evaluation. J. Inst. Control Robot. Syst. 2002, 8,
812–817. [CrossRef]
5. Kim, H.T.; Song, C.S.; Yang, H.J. Algorithm for automatic alignment in 2D space by object transformation.
Microelectron. Reliab. 2006, 46, 100–108. [CrossRef]
6. Kim, H.T.; Yang, H.J.; Baek, S.Y. Iterative algorithm for automatic alignment by object transform.
Microelectron. Reliab. 2007, 47, 972–985. [CrossRef]
7. Lee, N.H.; Cho, T.H. Pre-Alignment Using the Wafer Edge’s Position Data. In Proceedings of the KIIS Spring
Conference, Seoul, Korea, 24–26 April 2009; pp. 303–305.
8. Lee, N.H.; Cho, T.H. A Wafer Pre-Alignment Using a High-Order Polynomial Transformation Based Camera
Calibration. J. Semicond. Display Technol. 2010, 9, 11–16.
Electronics 2018, 7, 39 11 of 11

9. Lee, H.S.; Jeon, J.W.; Kim, J.W.; Jung, S.J.; Byun, J.E. A 12-inch wafer pre-aligner. Microprocessors Microsyst.
2003, 27, 151–158. [CrossRef]

© 2018 by the author. Licensee MDPI, Basel, Switzerland. This article is an open access
article distributed under the terms and conditions of the Creative Commons Attribution
(CC BY) license (http://creativecommons.org/licenses/by/4.0/).