QUESTION BANK

UNIT-I
1. Define EAGLE (2 marks)
EAGLE is a scriptable Electronic Design Automation (EDA) application with
schematic capture, Printed Circuit Board (PCB) layout, auto-router and
computer aided manufacturing (CAM) features. EAGLE stands for Easily
Applicable Graphical Layout Editor and is developed by CadSoft Computer.
The company was acquired by Autodesk Inc. in 2016.

2. What are the 4 basic views of Eagle software? (2 marks)

 Library
 Schematic
 Board
 Control panel.
3. What is the application of eagle Library? (2 marks)
Library - Allows you to manage and edit parts. Advanced usage of this will not
be covered in this tutorial.
4. Define the usage of Schematic window in eagle? (2 marks)
Schematic - This is where you draw the schematic for your project. It defines the
parts you have in your project, and which pins on the parts should be connected.
5. Define the application of Board window in Eagle? (2 marks)
Board - The board layout shows how the electrical components and traces will
be laid out on the board. This is where you lay out the pieces of your project and
physically connect the correct pins as defined in the Schematic.
6. What is the difference between Schematic view and Board view in EAGLE?
(3 marks)
 A schematic in electronics is a drawing representing a circuit. It uses
symbols to represent real-world electronic components.
 The board layout shows how the electrical components and traces will be
laid out on the board. This is where you lay out the pieces of your project
and physically connect the correct pins as defined in the Schematic.
7. What is the expansion of DRC error? (2 marks)
DRC stands for Design Rule Checking
8. What are the expansion of CAD and CAM? (2 marks)
 CAD stands for Computer Aided Design
 CAM stands for Computer Aided Manufacturing
9. List out any five tools used in Eagle? (2 marks)

10. What is the function of ADD tool in Eagle? (4 marks)

 The ADD tool -- (on the left toolbar, or under the Edit menu) - is what
you'll use to place every single component on the schematic. The ADD tool
opens up a library navigator, where you can expand specific libraries and
look at the parts it holds.

 The ADD tool also has search functionality - very helpful when you have to
navigate through dozens of libraries to find a part.
11. Write the Eagle design steps in order? (2 marks)
New project, Schematic, Board

UNIT-II
1. Define the process of copper foil manufacturing by electrolytic process?
(3marks)
This is manufactured by electroplating method. A thin film of copper
metal is deposited on to a slowly rotating corrosion resist metal cylinder
which is used as cathode and lower portion immersed in a copper rich
electrolytic plating bath. Pure copper as the anode and immersed into this
solution.
2. What is meant by Raw foil in electrolytic copper foil manufacturing?
(2marks)
The rolls of foil as removed from the plating machines are commonly called
RAW FOIL.
3. What is the purity of Raw foil in electrolytic copper foil manufacturing?
(2 marks)
The purity of raw foil is 99.3%.
4. Define the function of the cylinder in electrolytic copper foil manufacturing?
(3 marks)
A thin film of copper metal is deposited on to a slowly rotating
corrosion resist metal cylinder which is used as cathode and lower portion
immersed in a copper rich electrolytic plating bath. Pure copper as the anode
and immersed into this solution. As the cylinder slowly rotates in the bath, a
thin copper deposit gradually builds up into as integral sheet of metal foil
which can be gently peeled off from the cylinder surface at the point where
the cylinder surface comes out of the plating bath.
5. Draw the cell for the manufacturing of electrolytic copper foil? (2marks)

6. How to fabricate the PREPREG by treating process? (2 marks)

These sequence of manufacturing steps involves in the making of a
copper clad laminate is shown as a simplified diagram below. At the
impregnation stage solution of thermosetting resins are mostly used for
treating the reinforcing web of filler in an impregnating machine which also
called Treater.
7. Draw the diagram of treating process in PREPREG manufacturing?
(2marks)
8. What are the 2 applications of PREPREG? (2 marks)
Most commonly used to produce bottles, packaging containers, toys,
appliances, electronics housings, automotive interiors
9. Draw the flow chart of copper clad laminate manufacturing? (2 marks)

10. What are the main ingredients of copper clad laminate? (2 marks)

The main ingredients are:

 Filler
 Resin
 Copper foil

11. List out any 2 filler material of the copper clad laminate? (2 marks)
These are continuous webs of materials such as paper, glass cloth etc.
12. List out any 5 resin type of the copper clad laminate? (3 marks)
These are different types,
1. Amino resin
2. Epoxy resin
3. Polyester resin
4. Phenolic resin
5.Silicon resin
13. List out any 3 electrical properties of the copper clad laminate? (2marks)
 Dielectric Strength
 Dielectric Constant
 Dissipation Factor
14. Define the Dielectric strength of the copper clad laminate? (3 marks)
It is the ability of an insulating material to resist passage of electric
current of a destructive discharge produced by an electric stress, and it
depends on a large number of factors such as chemical composition, molecule
structure, degree of moisture, voltage applied, thickness of material, ageing
etc.
15. Define the Dielectric constant of the copper clad laminate? (3 marks)

Dielectric constant is the ratio of capacitance of a capacitor with a given

dielectric to the capacitance of the same capacitor with air as dielectric
medium. The dielectric constant measured the ability of an insulating material
to store electrostatic energy. It varies with temperature, humidity and
frequency.

16. Define the water absorption of the copper clad laminate? (3 marks)

The amount of water absorbed by a sample of specified size immersed in

distilled water for a specified period ( Generally 24 hours) at a specified
temperature (e.g., 20 to 25°c), is reported as water absorption in milligrams.
The gain in weight can also be expressed as the percentage of increase over
the initial weight.

17. Define the flame resistance of the copper clad laminate? (2 marks)

Phenolic resins used in laminates are purposely formulated to reduce the

density of molecular cross-linking to give it enough flexibility and softness
required for good punchability. This unfortunately, increases the inherent
flammability of the base laminate.
18. Write the grade name for paper phenolic laminate? (2 marks)
 XXXXPC
 FR-2
 XXXP
19. What is the grade number for glass epoxy and paper epoxy laminates?
(2 marks)
 FR-3
 FR-4
20. List out any 3 laminates with its grade number? (2 marks)
 FR-3 - Paper Epoxy (Fire Resistance)
 FR-4 - Glass Epoxy (Fire Resistance)
 FR-5 - Glass Epoxy (Fire & Temp. Resistance)
21. Name any 4 copper clad laminates? (2 marks)
 Paper Phenolic
 Epoxy Laminates
 Polyester Laminates
 PTFE Laminates
22. What are the 2 commonly used copper clad laminates? (2 marks)
 FR-3 -Paper Epoxy (Fire Resistance)
 FR-4-Glass Epoxy (Fire Resistance)

UNIT-III
1. Who has invented the PCB? (2 marks)
PCB is invented by Mr.Paul Eisler in 1937.
2. What is the standard thickness of the PCB? (2 marks)
The standard thickness of PCB is 1.6mm
3. Name any 3 top level metals of PCB? (2 marks)
Copper is the most prevalent conductor, although, Nickel, silver, tin, tin leads
and gold may also used as etch resists or top level metal.
4. What are the 3 types of PCB? (2 marks)
 Single sided PCB
 Double sided PCB
 Multi layer PCB
5. Write about single sided PCB’s? (2 marks)
The single sided PCB’s are mostly used in entertainment electronics where
manufacturing costs have to be kept at a minimum. However in industrial
electronics also cost factor cannot be neglected and single sided boards should
be used wherever a particular circuit can be accommodated on such boards.

6. Write about Double sided PCB’s? (4 marks)

Double sided boards can be made with or without plated through holes. The
production of boards with plated through holes is fairly expensive. Therefore
plated through holes board are only chosen where the circuit complexity and
doesn’t leave any other choice even or such boards the total number of plated
through holes in particular of via holes (holes utilized only for through contact
and not for component mounting) should be kept to the minimum for the
resource of economy and reliability.

7. Mention any five Design rules of single sided PCB layout? (3 marks)
 All components must be represented pictorially
 There can be no cross over.
 Keep point to point conductor runs or straight as short as possible. WheN
unable to use straight lines for conductor runs use 45o bends.
 Polarity marks on the layout should be drawn for power terminal, diodes,
polarized capacitor
8. Write the reference designators for Transistor, IC, Relay & Test point?
(2 marks)
Q TRANSISTOR

K RELAY

TP TEST POINT

U INTEGRATED CIRCUIT
9. Define the process of wave soldering? (2 marks)
 Component leads are soldered to a printed circuit board by travelling at a
predetermined rate of speed through a wave of molten solder.
 Wave soldering is the most widely used method for soldering the leaded
components to printed circuit boards.
10.What are the 3 process involved in SMD soldering? (2 marks)
SMD soldering also called as reflow soldering
1. Screen printing(printing of solder paste)
2. (Pick and place of the SMD components)
3. Reflow soldering (applying the hot air)
11.Write about Pick & Place process in SMD soldering? (3 marks)
After screen printing the boards then proceed to the pick & place machines
were they are placed on a conveyor belt. Most SMDs are usually delivered to
the production line in either paper or plastic tubes. Some large integrated
circuits are delivered in static free trays. Numerical controls pick and place
machines remove the part from the tapes, tubes or trays and place them on the
PCB.
12.What is the application of SMD soldering? (2marks)
Today, surface mount technology is widely used for electronics
manufacturing. SMT components can be made very small, and many types-
particularly capacitors and resistors- are used in billions.
13.Write about flexible PCB’s and its applications? (3 marks)
There circuits are made by laminating copper foil on to a flexible substrate
such as “Kevlar” or “Kepton”. They can range from a single conductor layer
upto several layers. They are most often used to replace a wiring harness with
a flat circuit to save weight or space. Often, the flexible circuit will contain
active and passive components. Common applications are cameras, printers,
disk drivers, avionics and video tape recorders.
14.Write the expansion of SMT? (2 marks)
SMT-Surface Mount Technology
15.Write the expansion of SMD? . (2
marks)
SMD-Surface Mount Devices 
16.Write any 3 advantages of SMD components? (2 marks)

1. It’s faster for automatic machines to place

2.Has a smaller physical size for the same electrical function.
3. Less parasitic (unwanted) effects.
4. Parts are cheaper.

17.Write any 2 package number of SMD resistor? (2 marks)

SMD Resistor package number 1206, 0805, 0603
18.Write any one package number of SMD transistor? (2 marks)

SOT23- This SMT package has three terminals for a diode or a transistor. It
can have more pins when it is used for small integrated circuits such as
operational amplifiers. It is 3 x 1.75 x 1.3mm3 in size.

19.Write any 2 package number of SMD IC? (2 marks)

 SOIC (small out-line integrated circuits): this package has a dual-in -
line configuration and gull-wing leads with a pin spacing of 1.27mm.
 TSOP (thin small outline package): this package is thinner than the
SOIC and has a smaller pin spacing of 0.5mm.
20.Write the expansion of BGA component? (2 marks)
BGA stands for Ball Grid Array
21.Write the expansion of LGA component? (2 marks)
LGA stands for Land Grid Array

UNIT-IV
1. Which layer is used for marking border mark in PCB design? (2marks)
Mechanical layer is used as marking border mark in PCB design
2. Name any 4 PCB design layers for double sided PCB layout? (2 marks)
 Signal Layer
 Power plane Layer
  Mechanical Layer
3. Name any 3 PCB design layers for Single sided PCB layout? (2 marks)
 Top
layer
 Top
solder mask
 Top silk
screen
4. Name any 5 PCB design layers for Multilayer PCB layout? (2 marks)
 Top layer
 Middle layer 1
 Middle layer 2
 Bottom layer
 Top solder mask
 Top legend
5. What is the difference between solder mask layer and paste mask layer?
(2 marks)

Solder mask layer Paste mask layer

It is one part on the circuit board It is just for the stencil
Solder mask is applied when Paste mask is used when
making PCB board assembling
6. Define the Silkscreen layer in PCB design? (3 marks)
 The silkscreen layer is also known as Overlay.
 Top Overlay refers to the silkscreen on top of the board, and Bottom
Overlay refers to silkscreen on bottom
 This is the layer onto which the component designators are printed (R1,
R2, …) so as to identify individual components during component
placement of the board
7. Draw the foot print of leaded resistor and SMD resistor?

8. What is meant by GERBER file? (2 marks)

  Gerber, otherwise known as RS-274-D, is the industry standard photo
plotting language
 It is used by photo plotter equipment which use light to “draw” a line

9. What is the file needed for photo plotting? (2 marks)

All CAD software packages provide the data that drives the photo plotter. The
commands required are in a format called “GERBER FORMAT”
10. List out any 3 PCB design software? (2 marks)
Orcad, cadens, cadster, protel, Express PCB,
11.What is meant by Net list? (3 marks)
It is possible to get the connectivity information in the form of a text data in
addition to the schematic drawing. This is called the “NETLIST”. This gives
the total connectivity of the circuit. In the Netlist data input, in addition to the
connectivity information, we will have to give the details of the component
foot print.
12.Define about solder masking? (2 marks)

Solder mask is usually the green coating on a PCB board which is designed to
insulate and protect the underlying copper traces from environmental factors,
and is also used to prevent bridging (shorting) traces during wave soldering.

13.Define about Legend printing? (2 marks)

A PCB legend printing is a layer of text placed on a PCB board to label
components and provide other useful information

UNIT-V
1. What are the details are required to generate the PCB design? (2marks)
 Circuit
diagram (schematic diagram)
 Size &
Type (S/S,D/S or MLB)
 Compon
ent specification (mechanical size, values codes. Etc)
  Equipme
nt specification (ventilation, view place for fixing PCB).
2. How to decide the track width for low frequency circuits? (2 marks)
For low freq based on the current carrying capacity
3. If the VCC track width is 1mm, find out the Ground and Signal track
width? (for low frequency) (2 marks)
For low frequency the Ground is 2mm and the Signal track is 0.5mm

4. What is the current carrying capacity of 1mm Track width and 35 µm

copper thick? (2 marks)
Current carrying capacity of 1mm track width and 35µm thick Cu foil is
3Amps.
5. Explain about Via hole? (2 marks)
The interconnection between component side & solder side is called as Via hole.
6. What is meant by Annular ring of the PCB pad? (2 marks)
Annular ring is the area around the diameter of hole. It gives electrical
connection and mechanical support to the component
7. Write the expansion of EMI? (2 marks)
EMI stands for Electromagnetic Interference
8. Explain about Cross talk, due to EMI? (2 marks)
High frequency electrical signals generate electric fields that radiate energy.
When energy is coupled to a nearby circuit. It is called CROSS TALK.
9. What are the advantages of using an IC base in PCB assembly? (2 marks)
 IC is a heat sensitive component so it cannot be directly soldered.
 It is difficult to desolder the IC’s since it has many pins.
10. What is the angle of corner of the conductor routings? (2 marks)
The angle of corner of the conductor routings is 45degree
11. How to decide the space between two parallel conductor routings?
(3marks)
 It is based on the cross talk
 It is based on the breakdown voltage
  The min. spacing between two parallel conductors is 0.5mm
 The min spacing between two solder pad is 0.4mm.
12. Write about continuity testing of bare PCB board? (3 marks)
 Verifying there are no open points within the circuit.
 Verifying that the required resistance between two separate electrical
connections is met.
 Digital multimeter can be used to check the continuity.
 One connection at a time can be checked.
13. Write about trouble shooting procedure of bare PCB’s? (2 marks)
The troubleshooting procedure of bare PCB’s are,
1. Continuity testing
2. Bare board testing
3. Fly probe test

UNIT-VI
1. What are the 2 types of image transfer techniques in PCB fabrication?
(2marks)

The 2 types of image transfer techniques in PCB fabrication are,

 Photo printing process

 Screen printing process
2. How to clean the contaminated copper surface of the laminate? (2 marks)
 Degreasi
ng in Trichloroethylene vapour
 Abrasive
cleaner scrub (pumice)
 Thoroug
h cleaner rinse (No residue)
 Blow
dry with clean air
  Oven
dry 50-60oc, 10-15mins
3. Name the 3 types of copper contaminations? (2marks)
 Organic
soil
 Metallic
soil
 Particula
te matter
4. What is the application of dry film photo resist in PCB manufacturing?
(2 marks)
Transferring image from film master to copper clad laminates
5. What type of light source is used in dry film exposing process? (2 marks)
UV is the type of light source used in dry film exposing process.
6. What are the 2 protective layers of dry film photo resist? (2 marks)
 Polyster
 Poly
ethylene or Poly olifin
7. Name any 2 methods of making single sided PCB’s? (2 marks)
 Print etch method
 Plat and etch method

UNIT-VII
1. What is the application of plating in PCB manufacturing? (2 marks)
The application of plating in PCB manufacturing is because, Copper is a
corrosive metal so it may corrode so it should be coated with Tin, Gold or
Aluminium
2. Write the expansion of PTH? (2 marks)
PTH stands for Plated Through Hole
3. List out the 3 types of plating techniques? (2 marks)
  Immersi
on Plating
 Electrole
ss Plating
 Electro
plating
4. What is the application of Electro less plating in PCB manufacturing?
(2 marks)
Electroless plating is used I through hole process in single sided an double
sided
5. Explain about Electro plating? (2 marks)
It’s the process of depositing an adherent metallic coating upon a negatively
charged electrode the medium is water in which metal salts have been
dissolved as a current source of metallic ions. It’s the purpose of
electroplating to obtain a metallic coating that has different properties or
dimensions than those of the basic metal.
6. What is the difference between Electro plating and Electro less plating?
(2 marks)

Electro plating Electro less plating

It’s the process of depositing an
adherent metallic coating upon a
negatively charged electrode the
medium is water in which metal
salts have been dissolved as a
current source of metallic ions.
This mechanism is similar to
electroplating but the source of electrons
is a chemical reduction agent. In
electroplating electrons are obtained
from a DC power source to reduce metal
ions to the metallic state in Electroless
plating no current is used in the
deposition

7. What are the 5 metals, which can be electro plated on PCB’s? (2 marks)
The five metals which can be electro plated in PCB’s are Tin, Tin lead ,
Nickel, Silver,Gold.
8. What are the 2 advantages of Gold plating in PCB manufacturing?(2 marks)
 Low contact resistance
  High wear resistance it’s customary to plate 5µm gold over copper or
2.3µm, gold over a nickel under coat of 4µm.
9. Which metal to be electro plated on the edge connector tabs of the PCB?
(2 marks)
Gold metal is to be electroplated on the edge connector tabs of the PCB
10. What is the minimum thickness of the PTH plating in the PCB? (2 marks)
The minimum thickness of the PTH plating in PCB is 25µA
11. What are the process steps involved in print & etch method of PCB
fabrication? (4 marks)
 Material cutting
 Image transfer
 Etching
 Dry film stripping
 Drilling
 Solder masking
 Solder coating
 Legend printing

UNIT-VIII
1. Explain about Etching process? (2 marks)
The technical, economical and environmental needs for the practical
application of process control have brought about major improvement in
etching techniques. Batch type operation with their variable etching rates and
long down times have been replaced with continuous, constant etch rate
process.
2. Name the 4 type of etching process? (2 marks)
 Immersion Etching
 Bubble Etching
 Splash Etching
 Spray Etching
3. List out any 4 types of PCB etching chemicals? (2 marks)
 Alkaline
Ammonia Etching
 Cupric
Chloride Etching
 Ammoni
um Persulphate Etching
 Ferric
Chloride Etching
 Chromic
Acid Etching
4. What is meant by Immersion etching? (2 marks)
In this techniques deep tank is used to immersion the pieces. The PCB
is immersed in the solution until etching is complete, and it requires long
process time, and intolerable factor in large quantity production. Heating the
etch solution and agitation of some form speed up the action.
5. Write about Bubble etching technique? (2 marks)
Bubble etching is a modified form of immersion etching. Air is bubbled
through the solution and past the work being etched. Air passing through the
solution has two functions.

6. Brief about Spray etching process? (3 marks)

 Spray etching is the most common method since it is fast well suited to
high production and capable of very fine line definition.
 Spray etching techniques include the single and double sided etching
with either horizontal or vertical positioning of the work. In spray
 etching, the etchants is pumped under pressure from the pump via pipe
networks to the nozzles and from there gets splashed on to the boards.

7. Write about splash etching process? (2 marks)

Splash etching offers distinct advantages over bubble etching with regard to
evenness of etch and minimization of undercut. But few pieces only etch at a
time; even when double paddles are used.
8. What is the metal used in Alkali etching machine spare parts? (2 marks)
Titanium is the metal used in Alkali etching machine spare parts
9. What is the suitable etching technique used in large volume PCB
manufacturing? (2 marks)
Spray etching is the suitable etching technique used in large volume PCB
manufacturing.
10. What is the suitable etching technique used in laboratory purpose PCB?
(2marks)
Immersion etching is the suitable etching technique used in laboratory
purpose PCB.
UNIT-IX
1. Name any 3 mechanical machining operations in PCB manufacturing?
(2 marks)
 Punchin
g holes
 Blanking
 Sawing
2. What is the machining used in piercing the holes in FR2 laminate?
(3marks)

It is possible to pierce holes to the paper phenolic FR2 and paper Epoxy FR3
material. By using the punch and Die, Holes can be pierced. Always pierce
with the copper side up. They are for use where inspection standards permit
rough-Quality holes.
3. What is the machining used in cutting odd shape PCB’s? (2 marks)

Odd shapes that cannot be feasibly produced by shearing or sawing are either
Blanked or Routed.

4. Name the cutting wheel in the circular saw machine? (2 marks)

Sawing the copper clad laminates is best accomplished with a circular saw,
which gives a smoother cut and because of the abrasive nature of laminated
materials, diamond-steel-bonded saws can be used.
5. What type of drill bit used in PCB drilling process? (2 marks)
PCB is typically drilled with tiny drill bits made of solid tungsten carbide.
6. Write the expansion of CNC drilling? (2 marks)
CNC Drilling stands for Computer Numerical Drilling
7. What is the data is required for CNC drilling? (2 marks)

Three files are produced when generating an NC drill file

 The DRL File (The binary excellon format file, read by the NC machine)

 The TXT file (An ASCII version of excellon file, which can be checked)

 The DRR FILE (An ASCII text report including the tool table, count etc…)

8. Name any 3 lasers, which is used in PCB machining operations? (2 marks)

 UV/YAG laser
 NDYAG laser (Neodymium drifted Yittrium, Aluminum, Garnet)
 Co2- carbon dioxide laser, which has a gaseous lasing medium.

UNIT-X
1. Brief about Multilayer boards? (2 marks)
 The ability to pack more connections into a smaller space. Multilayer
boards consists of a certain number of thin PCB’s stacked together and
adhesively joined with insulting Prepregs to form one rigid board. Electrical
connection between the different conductive layers is done with plated through
holes [PTH].
2. What is the minimum layer of Multilayer PCB? (2 marks)
The number of layers is referred to as the number of separate conductor
patterns. It is usually even and includes the two outer layers. Most main boards
have between 4 and 8 layers.

3. What is the adhesive material used in joining of layers in multilayer

boards? (2 marks)
A Prepreg is one of the adhesive material used in multilayer boards and it
holds the cores together. The layers get pressed together at a temperature to
create the required board thickness.
4. What is application of PREPREG material in multilayer PCB
manufacturing? (2 marks)
Prepreg is used for joining the inner layer and outer layers to make the
multilayer board.
5. What are the advantages of Multilayer PCB’s? (3 marks)
 Low-loss and low-dielectric constant materials as speeds become faster.
 Dimensional stability as features become smaller and board bigger.
 Improved thermal properties.
 Surface mounted components become more common.
 Suitable for High speed circuits
6. What are the 3 types of Vias used in Multilayer PCB’s? (2 marks)
 Conventi
onal plated through hole.
 Buried
via
  Blind
via

7. Define about Blind Via? (2 marks)

The blind via is a plated through hole connecting the surface layer to one or
more layers of a multilayer board which does not go through the entire board
thickness.
8. Brief about Buried Via? (2 marks)
A buried via can be describe as a plated through hole connecting two or more
layers of multilayer board, buried inside the board structure but not coming to
the external surface of the board.
9. What is meant by core layers in Multilayer PCB? (2 marks)
Surface destined to become outer layers are left fully copper-plated. These
etched laminates are called core layers.

10. Write about black oxide coating of Multilayer PCB’s? (2 marks)

SMOBC boards and multilayer inner boards are manufactured with oxide
coating. The oxide coated copper layer forms a good bond with the epoxy
layer and solder resist layer. So that boards are oxide coated at high
temperature in the oxide coating solution after the following process.