An X-band System-in-Package Active Antenna Module
Nidhi Khandelwal and Robert W. Jackson
Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, 01003,
USA
Abstract —System-in-Package (SiP) is based on the concept
of combining all the electronic requirements of a system into a
single package. Along with providing cost and size benefits, SiP
with an integrated antenna can help mitigate the feed network
losses and phase errors in an antenna array based application.
This paper presents the development of a low cost, compact RF
front end SiP solution for X-band. A printed antenna is
integrated with a multilayer BGA package using low cost
laminate substrates. This active antenna module can be further
integrated into arrays and used for wireless as well as sensing
applications.
Index Terms —active antenna, BGA (Ball Grid Array),
multilayer packaging, system-in-package(SiP) , transceiver.
I. INTRODUCTION
The system-in-package concept seeks to integrate
multiple ICs (each optimally suited for its function by
design as well as wafer process) along with other system
components like passives, interconnects and antenna into a
single functional package. SiP thus exploits the best features
of existing chip technologies and at the same time achieves
a low cost and highly integrated system [1]. System-on-
Chip (SOC) is another technique that aims at achieving the
total system integration in a single unit by integrating all the
system functionalities in one single wafer process [2]. If
SOC can overcome its technical challenges [2]-[4], it
promises to offer the most compact and light weight
solution. The system-on-package (SOP) approach
developed by Georgia Institute of Technology [4] achieves
the system integration in a similar way as SiP. SOP embeds
RF functions like baluns and filters along with passives and
interconnects inside the package, thus further improving the
area utilization and package performance. Wireless SOP
solutions with integrated antenna have been reported for
Bluetooth and WLAN applications [5]-[7]. These modules
use the more expensive LTCC or fairly new LCP substrates,
thus increasing the cost and complexity of the packaging
process.
This paper presents an X-band SiP solution where the
radiating element has been successfully integrated with the
transmit/receive ICs in a 3-layer, low cost package. The
module utilizes currently available low cost substrates and
discrete passives that can be reused and does not require any
extensive design libraries. Active antenna elements such as
this, are attractive due to the fact that transmit power
generation is distributed and received high frequency
signals can be downconverted at the element without
passing through lossy feeds. External package interconnects
are less demanding since only IF signals need to be handled.
The SiP active antenna module described herein can be
manufactured using commercial techniques such as pick and
place. The configuration is thus very compact and low cost
like other SiP solutions and would be suitable for populating
a large antenna array system. It is particularly useful for
very low cost, low power applications.
The paper is organized as follows: Section II describes
the proposed 3-layer package architecture and its unique
features. Section III gives a brief overview of the
transceiver chain and its specifications. The measurement
results for the passive radiating element are explained in
Section IV. Section V shows the measurement results for
the active element. Conclusions are listed in Section VI.
II. OVERVIEW OF 3-LAYER PACKAGE
Fig. 1 shows the cross section for the 3-layer packaging
scheme. The radiating element (transmission line fed
rectangular patch) has been constructed on a 20 mil RT-
Duroid5880 substrate (εr=2.2, tanδ=0.001). The lower
permittivity, low loss substrate was chosen to ensure a good
antenna efficiency and predictable frequency response. The
MMICs and passive devices are mounted on the underside
of the antenna ground plane. The feed line for the patch and
the transmission lines required to interconnect the MMICs
were modeled in Sonnet em [8] and etched on a 5mil, low
cost GETEK substrate (εr =3.9, tanδ =0.01). The solder balls
required for BGA assembly are mounted on a 31 mil
GETEK substrate. Thru vias are used for the connections
between the layers. This package is then mounted on a 62
mil FR-4 substrate (motherboard). The motherboard is
utilized for power distribution and providing dc bias to the
package.
Also, integration of the antenna with the package
constraints the package size to be at least equal to the
antenna size, thus increasing the probability of resonance
modes inside the package. Several thru via/ball connections
located around the perimeter of the package connect the
antenna ground to the motherboard ground and move these
resonances up in frequency. In addition, grounding vias and
a solder ball are placed in the center of the package to
further suppress the package resonances and improve the
isolation within the package. Note that the central vias do go
through to the antenna to avoid the need of costlier blind
vias. Since these vias are aligned along the center of the prototype are relatively high cost GaAs ICs. Future modules
antenna’s resonant length, they have no effect on the will require SiCMOS or SiGe ICs to be truly low cost.
antenna performance.
MMIC Data Sheet Specs Measured Gain
Active Element (BGA)
Power Amplifier 16.5 dB (6-18GHz) 15.9dB @10.2 GHz
Patch antenna LNA 13 dB (8-12 GHz) 12.8dB@10.2 GHz
RT- 7.5 dB (IF=501MHz, 8.3dB(IF=300MHz
Duroid Central Short Mixer
LNA PA RF=10GHz) RF= 10.2GHz)
Switch -1.7dB (DC-20GHz) -2.5dB @10.2GHz
GETEK Microwave ICs

Solder Balls Table 1: Gain specifications and measurements for ICs

DC Bias/ IF LO IV. MEASUREMENT RESULTS FOR THE PASSIVE ANTENNA

FR-4 Motherboard To characterize the antenna without any ICs inside the
package, a through transmission line was used to connect
the patch feed on the GETEK substrate to the IF
Fig. 1. Cross-section view of 3-layer package
transmission line (see Fig. 4). The package was then
mounted on a motherboard to perform the measurements of
The package size is 15mm x 15mm x 1.5mm. The cost of
the patch. The antenna resonates at 10.2 GHz with a gain of
the package is estimated to be on the order of a couple of
7 6.4 dB. The gain measurements were done by comparing
dollars when manufactured in large quantities (~10 ), based
the power received by the patch to that received by a
on existing lower frequency commercial modules with
standard gain X-band horn antenna over a range of
similar construction (e.g. RFMD power amplifier module).
frequencies. Fig.3 shows the gain curve for the passive
patch after de-embedding the effects of the transmission line
III. TRANSCEIVER ARCHITECTURE AND SPECIFICATIONS on the motherboard.
Fig. 2 shows the block diagram of the transmit-receive
chain implemented in this module. Commercially available
bare dies for the ICs and discrete thin film passives (chip
jumpers and bypass capacitors) have been used for the
assembly. The ICs and passives were mounted using
conductive silver epoxy and wire bonds were used for
providing the connections between the components and
package traces. Although assembly was done by hand for
this prototype, automated wire bonding and pick and place
machines would be used for high volume manufacture.

IF
LNA
Mixer Antenna

T/R
Fig. 3. Gain vs. frequency for the passive antenna
LO
T/R Simulations (PCAAD 5.0) estimate a directivity of 7.3 dB
and 89.4% efficiency (gain of 6.8 dB) for the fabricated
PA patch dimensions. Hence, assuming a directivity of 7.3 dB,
the antenna on the package has an efficiency of 81.3%. This
Fig. 2. Transmit receive architecture loss in efficiency can be attributed to the solder ball
transitions between the motherboard and the package and
The data sheet gain specifications and the probe the wire bond connections inside the package. The patch
measurement results for the individual ICs mounted inside showed a return loss of around 25 dB before and after it was
the package are listed in Table1. The ICs used in this mounted on the motherboard.

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 V. TRANSMIT-RECEIVE MEASUREMENTS
Fig.4 shows transmit and receive ICs mounted inside the
package (under the patch). In the receive mode, the signal
from the patch travels down to the patch feed, to the
switch_1 and LNA and gets downconverted at the mixer.
The LO frequency required for the downconversion is
provided using the two internal LO feeds and switch_2. The
transmit chain comprises of a power amplifier and the two
switches.
A. Receiver Measurements
The IF frequency for the receiver was 300 MHz. The LO
frequency was chosen at 10.5 GHz. The gain results and
radiation pattern for the active antenna in receive mode are
shown in Fig.6 and Fig.7 respectively. The measured gain
for the receive mode was 23.9 dB. Based on the measured
gain of the passive patch and the measurements listed in
Table 1, the estimated gain for the receiver was 25 dB.
Also, the module has an upper sideband image rejection (at
10.8 GHz) of 12 dB, thus relaxing the requirements for
image rejection.

Solder
IF Balls LO
Mixer

LO for Rx
Switch_2
LNA
Bypass
Caps
Central
Switch_1 Short
PA
Wire
Bonds
Patch
feed

Fig. 4. Transmit-receive ICs mounted inside the BGA package Fig. 6. Gain vs. frequency for receive mode

Motherboard
H-plane

Radiating patch
15mm

E-plane
Motherboard

15mm

Fig. 5. BGA package mounted over motherboard

Fig. 5 shows the package mounted on the motherboard

using solder balls (BGA technique). Fig. 7. Radiation patterns for receive mode

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B. Transmitter Measurements
The gain plot for the transmitter chain is shown in Fig. 8.
The measured gain as well as the estimated gain (based on
the measured gain for passive patch and measured gain for
transmit chain ICs) for the transmitter chain was 17.3 dB.
The normalized E-plane and H-plane radiation patterns for
the transmit mode were in good agreement with the patterns
for the receive mode.
Fig. 8. Gain vs. frequency for transmit mode
VII. CONCLUSION
An inexpensive, highly integrated X-band active antenna
element has been demonstrated. The packaging scheme
utilizes the currently available low cost laminate substrates
and BGA technique to achieve the integration of the entire
transmit and downconverter chain with an antenna. The
measured gain of the active element is comparable to the
estimated gain in both the modes, thus showing that
packaging does not affect the IC performances drastically.
The central short used in the package helps suppress
package resonances in the desired X-band as well as
improves the isolation within the package.
ACKNOWLEDGEMENT
This work was supported by the National Science
Foundation (NSF) under NSF Award Number ECS 9979282
and the Engineering Research Centers Program under NSF
Award Number 0313747. The authors also wish to thank
Filtran Microcircuits Inc. for the manufacture of the
multilayer package.
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