Tle 2426

SLOS098D − AUGUST 1991 − REVISED MAY 1998
D 1/2 VI Virtual Ground for Analog Systems D Excellent Output Regulation

D Self-Contained 3-terminal TO-226AA − −45 µV Typ at IO = 0 to −10 mA
Package − +15 µV Typ at IO = 0 to + 10 mA
D Micropower Operation . . . 170 µA Typ, D Low-Impedance Output . . . 0.0075 Ω Typ
VI = 5 V D Noise Reduction Pin (D, JG, and P
D Wide VI Range . . . 4 V to 40 V Packages Only)
D High Output-Current Capability INPUT/OUTPUT TRANSFER CHARACTERISTICS
− Source . . . 20 mA Typ 10
− Sink . . . 20 mA Typ VI VI VO
V
description 8 V + I
O 2
In signal-conditioning applications utilizing a
single power source, a reference voltage equal to
one-half the supply voltage is required for
Voltage − V
6
termination of all analog signal grounds. Texas
Instruments presents a precision virtual ground
VO
whose output voltage is always equal to one-half 4
the input voltage, the TLE2426 “rail splitter.”
The unique combination of a high-performance,
micropower operational amplifier and a precision- 2
trimmed divider on a single silicon chip results in
a precise VO/VI ratio of 0.5 while sinking and
sourcing current. The TLE2426 provides a low- 0
0 0.25 0.5 0.75 1
impedance output with 20 mA of sink and source
t − Time − s
capability while drawing less than 280 µA
of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board
space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage
references. The performance and precision of the TLE2426 is available in an easy-to-use, space saving,
3-terminal LP package. For increased performance, the optional 8-pin packages provide a noise-reduction pin.
With the addition of an external capacitor (CNR), peak-to-peak noise is reduced while line ripple rejection is
improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% with 3.6% over the full 40-V input range.
Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data acquisition front end, analog
signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system
error.
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
SMALL CERAMIC PLASTIC
PLASTIC FORM
TA OUTLINE DIP DIP
(LP) (Y)
(D) (JG) (P)
0°C to 70°C TLE2426CD — TLE2426CLP TLE2426CP
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
! " #$%! " &$'(#! )!%* Copyright  1998, Texas Instruments Incorporated
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

−40°C to 85°C TLE2426ID — TLE2426ILP TLE2426IP TLE2426Y

−55°C to 125°C TLE2426MD TLE2426MJG TLE2426MLP TLE2426MP
The D and LP packages are available taped and reeled in the commercial temperature range only. Add R suffix
to the device type (e. g., TLC2426CDR). Chips are tested at 25°C.
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description (continued)
The C-suffix devices are characterized for operation from 0°C to 70°C. The I suffix devices are characterized
for operation from −40°C to 85°C. The M suffix devices are characterized over the full military temperature range
of −55°C to 125°C.
D, JG, OR P PACKAGE LP PACKAGE
(TOP VIEW) (TOP VIEW)
OUT 1 8 NOISE REDUCTION IN

COMMON 2 7 NC
COMMON
IN 3 6 NC
NC 4 5 NC OUT
NC − No internal connection
TLE2426Y chip information

This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2) (2)
(3) (3) (1) (1)
IN CHIP THICKNESS:
(3) 15 MILS TYPICAL
BONDING PADS:
NOISE (8) (1) 4 × 4 MILS MINIMUM
+1 OUT
REDUCTION
60 TJmax = 150°C
(2) TOLERANCES ARE ± 10%.

COMMON ALL DIMENSIONS ARE IN
MILS.
(8)
NOTE A: Both bonding pads numbered 1, both numbered 2,
88 and both numbered 3, must be bonded out to the
corresponding functions pin.

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Continuous filter trap voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 80 mA
Duration of short-circuit current at (or below) 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG or LP package . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
TA ≤ 25
25°C
C DERATING FACTOR TA = 70
70°C
C TA = 85
85°C
C TA = 125
125°C
C
PACKAGE
POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING
D 725 mV 5.8 mW/°C 464 mW 377 mW 145 mW
JG 1050 mV 8.4 mW/°C 672 mW 546 mW 210 mW
LP 775 mV 6.2 mW/°C 496 mW 403 mW 155 mW
P 1000 mV 8.0 mW/°C 640 mW 520 mW 200 mW
recommended operating conditions

C SUFFIX I SUFFIX M SUFFIX
UNIT
MIN MAX MIN MAX MIN MAX
Input voltage, VI 4 40 4 40 4 40 V
Operating free-air temperature, TA 0 70 −40 85 −55 125 °C

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)

TLE2426C
PARAMETER TEST CONDITIONS TA† UNIT
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 5 V 25°C
25 C 2.48 2.5 2.52
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 5 V Full range 2.475 2.525
Temperature coefficient of output voltage Full range 25 ppm/°C
VI = 5 V 25°C 170 300
Supply current No load µA
A
VI = 4 to 40 V Full range 400
25°C −45 ± 160
Output voltage regulation IO = 0 to − 10 mA
Full range ± 250 µV
(sourcing current)‡
IO = 0 to − 20 mA 25°C −150 ± 450
25°C 15 ± 160
Output voltage regulation IO = 0 to 10 mA
(sinking current)‡
IO = 0 to 20 mA 25°C 65 ± 235
Output impedance 25°C 7.5 22.5 mΩ
Noise-reduction impedance 25°C 110 kΩ
Sinking current, VO = 5 V 26
Short-circuit current 25°C mA
Sourcing current, VO = 0 −47
CNR = 0 120
Output noise voltage, rms f = 10 Hz to 10 kHz 25°C µV
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
Output voltage current step response µss
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 5 V, VO to 0.1% 20
Step response CL = 100 pF 25°C µs
VI = 0 to 5 V, VO to 0.01% 160
† Full range is 0°C to 70°C.
‡ The listed values are not production tested.


TLE2426C
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 12 V 25°C
25 C 5.95 6 6.05
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 12 V Full range 5.945 6.055
VI = 12 V 25°C 195 300
A
25°C −45 ± 160
IO = 0 to − 20 mA 25°C −150 ± 450
25°C 15 ± 160
Output voltage regulation IO = 0 to 10 mA
IO = 0 to 20 mA 25°C 65 ± 235
CNR = 0 120
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 12 V, VO to 0.1% 20
VI = 0 to 12 V, VO to 0.01% 120
† Full range is 0°C to 70°C.


TLE2426I
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 5 V 25°C
25 C 2.48 2.5 2.52
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 5 V Full range 2.47 2.53
Temperature coefficient of output volt-
Full range 25 ppm/°C
age
VI = 5 V 25°C 170 300
A
25°C −45 ± 160
IO = 0 to − 20 mA 25°C −150 ± 450
IO = 0 to 10 mA 25°C 15 ± 160
Output voltage regulation ± 250
IO = 0 to 8 mA Full range µV
IO = 0 to 20 mA 25°C 65 ± 235
CNR = 0 120
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 5 V, VO to 0.1% 20
VI = 0 to 5 V, VO to 0.01% 160
† Full range is − 40°C to 85°C.


TLE2426I
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 12 V 25°C
25 C 5.95 6 6.05
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 12 V Full range 5.935 6.065
VI = 12 V 25°C 195 300
A
25°C −45 ± 160
IO = 0 to − 20 mA 25°C −150 ± 450
IO = 0 to 10 mA 25°C 15 ± 160
IO = 0 to 20 mA 25°C 65 ± 235
CNR = 0 120
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 12 V, VO to 0.1% 20
VI = 0 to 12 V, VO to 0.01% 120


TLE2426M
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 5 V 25°C
25 C 2.48 2.5 2.52
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 5 V Full range 2.465 2.535
VI = 5 V 25°C 170 300
A
25°C −45 ± 160
IO = 0 to − 20 mA 25°C −150 ± 450
IO = 0 to 10 mA 25°C 15 ± 160
IO = 0 to 20 mA 25°C 65 ± 235
CNR = 0 120
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 5 V, VO to 0.1% 20
VI = 0 to 5 V, VO to 0.01% 120


TLE2426M
MIN TYP MAX
VI = 4 V 1.98 2 2.02
VI = 12 V 25°C
25 C 5.95 6 6.05
Output voltage V
VI = 40 V 19.8 20 20.2
VI = 12 V Full range 5.925 6.075
VI = 12 V 25°C 195 250
A
25°C −45 ± 160
IO = 0 to − 20 mA 25°C −150 ± 450
IO = 0 to 10 mA 25°C 15 ± 160
IO = 0 to 20 mA 25°C 65 ± 235
CNR = 0 120
V
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA 25°C
CL = 100 pF 275
CL = 0 400
VO to 0.01%, IO = ± 10 mA 25°C
CL = 100 pF 390
VI = 0 to 12 V, VO to 0.1% 12
VI = 0 to 12 V, VO to 0.01% 120

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0, TA = 25°C (unless

otherwise noted)
TLE2426Y
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
Output voltage VI = 5 V 2.5 V
Supply current No load 170 µA
IO = 0 to − 10 mA −45
Output voltage regulation (sourcing current)† µV
IO = 0 to − 20 mA −150
IO = 0 to 10 mA 15
Output voltage regulation (sinking current)† µV
IO = 0 to 20 mA 65
Output impedance 7.5 mΩ
Noise-reduction impedance 110 kΩ
Short-circuit current mA
CNR = 0 120
Output noise voltage, rms f = 10 Hz to 10 kHz µV
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA
CL = 100 pF 275
Output voltage current step response µs
CL = 0 400
VO to 0.01%, IO = ± 10 mA
CL = 100 pF 390
VI = 0 to 5 V, VO to 0.1% 20
Step response CL = 100 pF µss
VI = 0 to 5 V, VO to 0.01% 160
† The listed values are not production tested.
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0, TA = 25°C (unless

otherwise noted)
TLE2426Y
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX
Output voltage VI = 12 V 6 V
Supply current No load 195 µA
IO = 0 to − 10 mA −45
Output voltage regulation (sourcing current)† µV
IO = 0 to − 20 mA −150
IO = 0 to 3 mA 15
Output voltage regulation (sinking current)† µV
IO = 0 to 20 mA 65
Output impedance 7.5 mΩ
Noise-reduction impedance 110 kΩ
Short-circuit current mA
CNR = 0 120
Output noise voltage, rms f = 10 Hz to 10 kHZ µV
CNR = 1 µF 30
CL = 0 290
VO to 0.1%, IO = ± 10 mA
CL = 100 pF 275
Output voltage current, step response µs
CL = 0 400
VO to 0.01%, IO = ± 10 mA
CL = 100 pF 390
VI = 0 to 12 V, VO to 0.1% 12
Step response CL = 100 pF µss
VI = 0 to 12 V, VO to 0.01% 120
† The listed values are not production tested.

TYPICAL CHARACTERISTICS
Table Of Graphs
FIGURE
Output voltage Distribution 1,2
Output voltage change vs Free-air temperature 3
Output voltage error vs Input voltage 4
vs Input voltage 5
Input bias current
vs Free-air temperature 6
Output voltage regulation vs Output current 7
Output impedance vs Frequency 8
vs Input voltage 9,10
Short-circuit output current
vs Free-air temperature 11,12
Ripple rejection vs Frequency 13
Spectral noise voltage density vs Frequency 14
Output voltage response to output current step vs Time 15
Output voltage power-up response vs Time 16
Output current vs Load capacitance 17

TYPICAL CHARACTERISTICS†
DISTRIBUTION DISTRIBUTION
OF OF
OUTPUT VOLTAGE OUTPUT VOLTAGE
3 40
98 Units Tested 98 Units Tested
From 2 Wafer Lots From 2 Wafer Lots
2.5 VI = 5 V VI = 12 V
TA = 25°C TA = 25°C
30
Percentage of Units − %
Percentage of Units − %
2
1.5 20
10
0.5
0 0
2.48 2.49 2.5 2.51 2.52 6 6.025 6.05 6.075 6.1
VO − Output Voltage − V VO − Output Voltage − V
Figure 1 Figure 2
OUTPUT VOLTAGE CHANGE OUTPUT VOLTAGE ERROR

vs vs
FREE-AIR TEMPERATURE INPUT VOLTAGE
150 4
IO = 0
VI = 40 V IO = 0
TA = 25°C
VO − Output Voltage Change − mV
3
75 Error Equals VO / VI Deviation From 50%
Output Voltage Error − %
VI = 12 V
2
0
VI = 4 V, 5 V
1
−75
O
0
∆V
−150 −1
−75 −50 −25 0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40
TA − Free-Air Temperature − °C VI − Input Voltage − V
Figure 3 Figure 4
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.

INPUT BIAS CURRENT INPUT BIAS CURRENT

vs vs
INPUT VOLTAGE FREE-AIR TEMPERATURE
300 300
IO = 0
VI = 40 V
250 250
TA = 25°C
I IB − Input Bias Current − µ A
I IB − Input Bias Current − µ A

VI = 12 V
200 200
TA = − 55°C VI = 5 V
150 150
VI = 4 V
TA = 125°C
100 100
IIB
IIB
50 50
IO = 0
0 0
0 5 10 15 20 25 30 35 40 −75 −50 −20 0 25 50 75 100 125
VI − Input Voltage − V TA − Free-Air Temperature − °C
Figure 5 Figure 6
OUTPUT VOLTAGE REGULATION OUTPUT IMPEDANCE

vs vs
OUTPUT CURRENT FREQUENCY
500 100
VI = 5 V or 12 V VI = 5 V or 12 V
Max TA = 25°C IO = 0
TA = 25°C
Output Voltage Regulation − µV
10
250
z o − Output Impedance − Ω
Max
Typ 1
0
Typ
0.1
Min
−250
0.01
Min
0.001
−500
−20 −10 0 10 20 10 100 1k 10 k 100 k 1M
IO − Output Current − mA f − Frequency − Hz
Figure 7 Figure 8

SHORT-CIRCUIT OUTPUT CURRENT SHORT-CIRCUIT OUTPUT CURRENT

vs vs
INPUT VOLTAGE INPUT VOLTAGE
0 40
VO = GND
(Output Sourcing)
I OS − Short-Circuit Output Current − mA

TA = 25°C
−20 30 TA = − 55°C
TA = 125°C
−40 20
TA = − 55°C
−60 10
VO = VI
IOS
IOS
TA = 125°C (Output Sinking)

TA = 25°C
−80 0
0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40
VI − Input Voltage − V VI − Input Voltage − V
Figure 9 Figure 10
SHORT-CIRCUIT OUTPUT CURRENT SHORT-CIRCUIT OUTPUT CURRENT

vs vs
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
0 40
VI = 40 V
VO = GND
−10 (Output Sourcing) VI = 4 V
VI = 12 V
−20 30
VI = 5 V
−30 VI = 4 V
VI = 5 V
−40 20
−50
−60 VI = 12 V 10
IOS
IOS
−70 VO = VI
VI = 40 V (Output Sinking)
−80 0
−75 −50 −25 0 25 50 75 100 125 −75 −50 −25 0 25 50 75 100 125
TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C
Figure 11 Figure 12

RIPPLE REJECTION SPECTRAL NOISE VOLTAGE DENSITY

vs vs
FREQUENCY FREQUENCY
100 400
VI = 5 V or 12 V
Vn − Spectral Noise Voltage Density − nV/ Hz

VI = 5 V or 12 V
90 TA = 25°C
∆VI(PP) = 1 V CNR = 1 µF
80 IO = 0
TA = 25°C 300
70
Ripple Rejection − dB
60
50 200
40
30
100
20 CNR = 0
CNR = 0
10 CNR = 1 µF
0 0
10 100 1k 10 k 100 k 1M 1 10 100 1k 10 k 100 k
f − Frequency − Hz f − Frequency − Hz
Figure 13 Figure 14
OUTPUT VOLTAGE RESPONSE

TO OUTPUT CURRENT STEP OUTPUT VOLTAGE POWER-UP RESPONSE
1.5 V 3
0.1% 0.01%
4 VI = 5 V 2.5
O − Change In Output Voltage − mV
CL = 100 pF Output Voltage Response

3 TA = 25°C
0.1% 2
O − Output Voltage − V
2
1.5
1
IO = 0
0.01% 1
0 CL = 100 pF
0.01% TA = 25°C
−1 0.5
VV)
−2 10 mA 0
IO Step 0.1%
−3
VO
5
∆V
Input Voltage Step

−4 −10 mA
0
−1.5 V
0 1000 2000 3000 4000 0 50 100 150 200
Time − µs Time − µs
Figure 15 Figure 16

STABILITY RANGE
OUTPUT CURRENT
vs
LOAD CAPACITANCE
20
VI = 5 V
15 Unstable
TA = 25°C
I O − Output Current − mA 10
−5 Stable
−10
−15
−20
10 −6 10 −5 10 −4 10 −3 10 −2 10 −1 10 0 10 1 10 2
CL− Load Capacitance − mF
Figure 17

MACROMODEL INFORMATION
* TLE2426 OPERATIONAL AMPLIFIER “MACROMODEL” SUBCIRCUIT
* CREATED USING PARTS RELEASE 4.03 0N 08/21/90 AT 13:51
* REV (N/A) SUPPLY VOLTAGE: 5 V
* CONNECTIONS: FILTER
| INPUT
* | | COMMON
* | | | OUTPUT
* | | | |
.SUBCKT TLE2426 1 3 4 5
C1 11 12 21.66E−12
C2 6 7 30.00E−12
C3 87 0 10.64E−9
CPSR 85 86 15.9E−9
DCM + 81 82 DX
DCM − 83 81 DX
DC 5 53 DX
DE 54 5 DX
DLP 90 91 DX
DLN 92 90 DX
DP 4 3 DX
ECMR 84 99 (2,99) 1
EGND 99 0 POLY(2) (3,0) (4,0) 0 .5 .5
EPSR 85 0 POLY(1) (3,4) −16.22E − 6 3.24E − 6
ENSE 89 2 POLY(1) (88,0) 120E − 6 1
FB 7 99 POLY(6) VB VC VE VLP VLN VPSR 0 74.8E6 − 10E6 10E6 10E6 − 10E6 74E6
GA 6 0 11 12 320.4E − 6
GCM 0 6 10 99 1.013E − 9
GPSR 85 86 (85,86) 100E − 6
GRC1 4 11 (4,11) 3.204E − 4
GRC2 4 12 (4,12) 3.204E − 4
GRE1 13 10 (13,10) 1.038E − 3
GRE2 14 10 (14,10) 1.038E − 3
HLIM 90 0 VLIM 1K
HCMR 80 1 POLY(2) VCM+ VCM − 0 1E2 1E2
IRP 3 4 146E − 6
IEE 3 10 DC 24.05E − 6
IIO 2 0 .2E − 9
I1 88 0 1E − 21
Q1 11 89 13 QX
Q2 12 80 14 QX
R2 6 9 100.0E3
RCM 84 81 1K
REE 10 99 8.316E6
RN1 87 0 2.55E8
RN2 87 88 11.67E3
RO1 8 5 63
RO2 7 99 62
VCM + 82 99 1.0
VCM − 83 99 − 2.3
VB 9 0 DC 0
VC 3 53 DC 1.400
VE 54 4 DC 1.400
VLIM 7 8 DC 0
VLP 91 0 DC 30
VLN 0 92 DC 30
VPSR 0 86 DC 0
RFB 5 2 1K
RIN1 3 1 220K
RIN2 1 4 220K
.MODEL DX D(IS=800.OE−18)
.MODEL QX PNP(IS=800.OE− 18 BF=480)
.ENDS

PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TLE2426CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426C Samples
TLE2426CLP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CLPE3 ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CLPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2426C Samples
TLE2426CP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426CP Samples
TLE2426ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426IDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 2426I Samples
TLE2426ILP ACTIVE TO-92 LP 3 1000 RoHS & Green SN N / A for Pkg Type 2426I Samples
TLE2426ILPR ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type 2426I Samples
TLE2426IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426IP Samples
TLE2426IPE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type TLE2426IP Samples
TLE2426MD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 2426M Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLE2426 :
• Automotive : TLE2426-Q1
• Enhanced Product : TLE2426-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Apr-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLE2426CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLE2426IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Pack Materials-Page 1

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLE2426CDR SOIC D 8 2500 350.0 350.0 43.0
TLE2426IDR SOIC D 8 2500 350.0 350.0 43.0
TUBE

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
TLE2426CD D SOIC 8 75 505.46 6.76 3810 4
TLE2426CDG4 D SOIC 8 75 505.46 6.76 3810 4
TLE2426CP P PDIP 8 50 506 13.97 11230 4.32
TLE2426ID D SOIC 8 75 505.46 6.76 3810 4
TLE2426IDG4 D SOIC 8 75 505.46 6.76 3810 4
TLE2426IP P PDIP 8 50 506 13.97 11230 4.32
TLE2426IPE4 P PDIP 8 50 506 13.97 11230 4.32
TLE2426MD D SOIC 8 75 505.46 6.76 3810 4
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION
2.67
3X
2.03 4.19
3.17
3 2 1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92
FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP
2X
METAL
(1.5) 2X (1.5)
2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING

STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX ( 1.4) 2X ( 1.4)

ALL AROUND METAL
TYP 3X ( 0.9) HOLE
METAL
2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)

FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP 0.5 MIN
16.5
15.5
11.0 9.75
8.5 8.50
19.0
17.5
2.9 6.75 3.7-4.3 TYP

TYP
2.4 5.95
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated

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  

D 1/2 VI Virtual Ground for Analog Systems D Excellent Output Regulation

0°C to 70°C TLE2426CD — TLE2426CLP TLE2426CP

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

−40°C to 85°C TLE2426ID — TLE2426ILP TLE2426IP TLE2426Y

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

OUT 1 8 NOISE REDUCTION IN

TLE2426Y chip information

BONDING PAD ASSIGNMENTS

(2) TOLERANCES ARE ± 10%.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

recommended operating conditions

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7

electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9

electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)

10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0, TA = 25°C (unless

electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0, TA = 25°C (unless

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11

12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

OUTPUT VOLTAGE CHANGE OUTPUT VOLTAGE ERROR

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13

INPUT BIAS CURRENT INPUT BIAS CURRENT

I IB − Input Bias Current − µ A

OUTPUT VOLTAGE REGULATION OUTPUT IMPEDANCE

14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SHORT-CIRCUIT OUTPUT CURRENT SHORT-CIRCUIT OUTPUT CURRENT

I OS − Short-Circuit Output Current − mA

TA = 125°C (Output Sinking)

SHORT-CIRCUIT OUTPUT CURRENT SHORT-CIRCUIT OUTPUT CURRENT

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15

RIPPLE REJECTION SPECTRAL NOISE VOLTAGE DENSITY

Vn − Spectral Noise Voltage Density − nV/ Hz

OUTPUT VOLTAGE RESPONSE

CL = 100 pF Output Voltage Response

Input Voltage Step

16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 17

18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

OTHER QUALIFIED VERSIONS OF TLE2426 :

NOTE: Qualified Version Definitions:

TAPE AND REEL INFORMATION

*All dimensions are nominal

*All dimensions are nominal

*All dimensions are nominal

LAND PATTERN EXAMPLE

SOLDER MASK SOLDER MASK

NON SOLDER MASK SOLDER MASK

SOLDER MASK DETAILS

6. Publication IPC-7351 may have alternate designs.

SOLDER PASTE EXAMPLE

LAND PATTERN EXAMPLE

0.05 MAX ( 1.4) 2X ( 1.4)

LAND PATTERN EXAMPLE