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Roll No.
(Regulation 2017)
Time: 3 Hours Answer ALL Questions Max. Marks 100
PART-A10 x2 20 Marks)
Q.No Questions Marks
What is the purpose for which SiO2.layer is used during IC fabrication process? How is it easily 2
fomed on thecomponentsside of thesilicon wafer repeatedly?
2 What is a 'schottky diode'? How form ing of schottky diodes inadvertently' is avoided during IC
fabrication process?"
3 What is a 'Widlar curent source'? Give an application for the same.
Sketch the circuit diagram of an OPAMP based 1 st order low pass filter circuit? How will you modify
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RR 150 kQ
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