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Flexible
Standard flex:
Coverlay
Adhesive
Kapton
Capabilities:
The parameters are the same as those previously applied in the flex part of the flex‐rigid.
Systronic manufactures different models of flexible:
• Single sided
• Double sided
• Double sided plated through holes
• Multilayer
• With stiffener
Flexible multilayer with prepreg:
Prepreg
Flexible with stiffener cold bonded:
Material of stiffener: Stiffener Acrylic
• FR4 or Polyimide
• Coverlay
• Aluminum
Objective:
Offer general guidelines for designing circuits used in dynamic flex applications.
Background:
Flexural life if a function of many parameters: circuit thickness, number of layers, material at
neutral axis, material modulus and tensile strengths, copper trace dimensions, flex speed, radius of
bending, and temperature, to name a few.
Therefore a functional test of the finished circuit is recommended. If that is not feasible, then very
conservative designs are encouraged.
Many single‐sided flex circuits have cycles that are in the millions of flexural cycles, depending on
radius/thickness ratio, flex speed, degrees movement, location of neutral axis, and other factors.
Double‐sided circuits have much lower cycle lives, typically in the thousands to tens of thousands,
depending on the construction and bend radius/thickness ration.
Multi‐layer circuits have very low flex life, typically in the tens to hundreds of flexural cycles.
Recommendations: (Dupont)
1. Use single clads instead of double or multi‐layer flex cables.
2. Make circuit symmetric (Kapton, adhesive thickness equals both sides).
3. Place copper at or as close to neutral axis as possible.
4. Use the thinnest Kapton available that still offers electrical and handling performance.
5. Use minimum coverlay adhesive thickness to encapsulate traces.
6. Use widest copper traces possible.
7. Use half‐oz. copper for ground planes.
8. Use half‐oz. copper instead of one‐oz. copper foil for the circuit lines.
9. Use AP to minimize adhesive thickness, if available for design.
10. Avoid plated‐through holes in flex areas.
11. Make the conductor widths uniform in the flex area.
12. Distribute conductors evenly across the width of the bend region.
13. Orient conductor’s perpendicular to the bend axis.
14. Place conductors away from the circuit edge.
15. Avoid conductor direction changes in bend region.
16. If DS circuits are required, stagger circuit traces on opposing sides.