Silicon Carbide Schottky

Diode
650 V, 6 A

FFSB0665B-F085
Silicon Carbide (SiC) Schottky Diodes use a completely new
technology that provides superior switching performance and higher
reliability compared to Silicon. No reverse recovery current, www.onsemi.com
temperature independent switching characteristics, and excellent
thermal performance sets Silicon Carbide as the next generation of
power semiconductor. System benefits include highest efficiency, VRRM IF
faster operating frequency, increased power density, reduced EMI, and
650 V 6.0 A
reduced system size and cost.
Features
• Max Junction Temperature 175°C
• Avalanche Rated 24.5 mJ
• High Surge Current Capacity
1., 3. Cathode 2. Anode
• Positive Temperature Coefficient
Schottky Diode
• Ease of Paralleling
• No Reverse Recovery / No Forward Recovery
• AEC−Q101 Qualified and PPAP Capable 3
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant 1
2
Applications
D2PAK−2
• Automotive HEV−EV Onboard Chargers TO−263
• Automotive HEV−EV DC−DC Converters CASE 418BK

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Parameter Symbol Value Unit MARKING DIAGRAM
Peak Repetitive Reverse Voltage VRRM 650 V
Single Pulse Avalanche Energy (TJ = 25°C, EAS 24.5 mJ
IL(pk) = 9.9 A, L = 0.5 mH, V = 50 V) &Z&3&K
FFSB
Continuous Rectified Forward @ TC < 150 IF 6.0 A 0665B
Current
@ TC < 135 8.0
Non−Repetitive Peak Forward TC = 25°C IFM 523 A
Surge Current tP = 10 ms
TC = 150°C 467 &Z = Assembly Plant Code
tP = 10 ms &3 = Numeric Date Code
&K = Lot Code
Non−Repetitive Forward Surge TC = 25°C IFSM 45 A FFSB0665B = Specific Device Code
Current (Half−Sine Pulse) tP = 8.3 ms
Power Dissipation TC = 25°C Ptot 61 W
TC = 150°C 10 ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
Operating Junction and Storage Temperature TJ, Tstg −55 to °C this data sheet.
Range +175
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.

© Semiconductor Components Industries, LLC, 2019 1 Publication Order Number:

August, 2020 − Rev. 1 FFSB0665B−F085/D
 FFSB0665B−F085

THERMAL CHARACTERISTICS
Parameter Symbol Value Unit
Thermal Resistance, Junction−to−Case, Max. RqJC 2.46 °C/W

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Parameter Symbol Test Conditions Min Typ Max Unit
ON CHARACTERISTICS
Forward Voltage VF IF = 6.0 A, TJ = 25°C 1.38 1.7 V
IF = 6.0 A, TJ = 125°C 1.53 2.0
IF = 6.0 A, TJ = 175°C 1.67 2.4
Reverse Current IR VR = 650 V, TJ = 25°C 0.5 40 mA
VR = 650 V, TJ = 125°C 1.0 80
VR = 650 V, TJ = 175°C 2.0 160
CHARGES, CAPACITANCES & GATE RESISTANCE
Total Capacitive Charge QC VC = 400 V 16 nC
Ctot VR = 1 V, f = 100 kHz 259 pF
VR = 200 V, f = 100 kHz 29
VR = 400 V, f = 100 kHz 22
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.

PACKAGE MARKING AND ORDERING INFORMATION

Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity
FFSB0665B−F085 FFSB0665B D2PAK Tape & Reel† 330 mm 24 mm 800 Units
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

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2
 FFSB0665B−F085

TYPICAL CHARACTERISTICS

−6
12 10
TJ = −55o C
IF , FORWARD CURRENT (A)

TJ = 25 o C

I R , REVERSE CURRENT (A)

9
TJ = 75 o C −7
TJ = 175 o C 10
TJ = 125o C
6 TJ = 175 o C

−8 TJ = 125o C
10
TJ = 75 o C
3
TJ = 25 o C
TJ = −55o C
−9
0 10
0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 100 200 300 400 500 600 650
V F , FORWARD VOLTAGE (V) V R , REVERSE VOLTAGE (V)
Figure 1. Forward Characteristics Figure 2. Reverse Characteristics

80 80
I F , PEAK FORWARD CURRENT (A)

D = 0.1 P TOT , POWER DISSIPATION (W)

60 60

D = 0.2
40 40
D = 0.3

D = 0.5
20 20
D = 0.7 D = 1

0 0
25 50 75 100 125 150 175 25 50 75 100 125 150 175
T C , CASE TEMPERATURE ( o C) TC , CASE TEMPERATURE ( o C)

Figure 3. Current Derating Figure 4. Power Derating

25 1000
Q C , CAPACITIVE CHARGE (nC)

20
CAPACITANCE (pF)

15
100
10

0 10
0 100 200 300 400 500 600 650 0.1 1 10 100 650
V R , REVERSE VOLTAGE (V) V R , REVERSE VOLTAGE (V)

Figure 5. Capacitive Charge vs. Reverse Figure 6. Capacitance vs. Reverse Voltage
Voltage

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 FFSB0665B−F085

TYPICAL CHARACTERISTICS

E C , CAPACITIVE ENERGY ( mJ)

4

0
0 100 200 300 400 500 600 650
V R , REVERSE VOLTAGE (V)

Figure 7. Capacitance Stored Energy

r(t), NORMALIZED EFFECTIVE TRANSIENT

2
DUTY CYCLE−DESCENDING ORDER
1
THERMAL RESISTANCE

D=0.5

0.1
D=0.2
D=0.1
D=0.05
0.01 D=0.02
D=0.01

SINGLE PULSE
0.001
10
−6
10
−5
10
−4
10
−3
10
−2
10
−1
1
t, RECTANGULAR PULSE DURATION (sec)

Figure 8. Junction−to−Case Transient Thermal Response

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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

D2PAK2 (TO−263−2L)
CASE 418BK
ISSUE O
DATE 02 AUG 2018

GENERIC
MARKING DIAGRAM*

XXXXXXXXG
AYWW

XXX = Specific Device Code

A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON93788G Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: D2PAK2 (TO−263−2L) PAGE 1 OF 1

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