RAYMING PCB & ASSEMBLY

PCB Raw Materials

PCB Laminate Material and

Its Manufacturers

PCB Laminate Technical informations

KB FR4-61606160A6160C RAW Material TECHNICAL

INFORMATION data sheet Click to down

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The premium types of raw material are well-known brands in

the printed circuit board (PCB) industry, which guarantees the steady

product quality of RayPCB. More attention has been focused

on establishing long-term relationships between raw material suppliers

and RayPCB to ensure the stability and reliability of timely material

supply.

This friendly relationship leads to mutual support and growth.

Here you may review our list of PCB laminate material suppliers. We

offer for fabrication of your printed circuit boards these materials,

such as glass fiber epoxy laminates, special high performance

laminates, and more. Your choice of laminates will depend on your

application. If you need assistance selecting the right material, please

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contact the helpful customer service representatives at RayMing

Technology.

If we are out of stock of some special PCB material, we can buy it

for you—there may just be a delay in requiring laminate. Or, you

can supply to the materials to us. We only charge for

the manufacturing cost. If you have any questions, you are

welcome to contact us!

Brands of PCB Material Manufacturers

First Grade Main FR-4 material :

KINDGBOARD (KB), NAN YA, SHENGYI, ISOLA ,ITEQ,

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Second Grade FR-4 material :

Panasonic, VENTEC GMD, HUAZHENG

Microwave material:

Rogers, Taconic, TEFLON, DUPONT, ARLON, Nelco

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Flexible material:

DUPONT, PI

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Aluminum material:

BERGQUIST, CUSTOM AL Base

The CEM-3 type material is an electronic grade alkali-free glass

non-aromatic cloth with flame-retardant brominated epoxy resin

filled in the middle insulation layer, and one sheet is filled with

flame-retardant brominated epoxy resin on both sides of the

non-woven fabric. Copper foil is on one or both sides of Resin

electronic-grade alkali-free glass fiber cloth and is then formed by

hot-pressing into copper-clad laminate.

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Copper-clad laminate is also called substrate. The reinforcing

material is soaked with resin, one or both sides are covered with

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copper foil, and a board material is formed by hot pressing, which

is called copper-clad laminate. This is the basic material of PCB,

often called substrate. When it is used in multilayer PCB board

production, it is also called “core.”

 Paper substrate

 Glass fiber cloth substrate

 Synthetic fiber cloth substrate

 Non-woven substrate

 Composite substrate

 Other

Copper-clad laminate refers to substrates such as paper

and fiberglass cloth, which are filled with resin to make bonding

sheets (adhesive paper and tape). After combining several

bonding sheets, one or both sides are equipped with copper foil.

It is cured by heat and pressure to make a plate-shaped product.

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Shielding board material refers to a copper-clad laminate with a

shielding layer or patterned circuit in the inner layer. As long as

the circuit on both sides is processed, it can become a multilayer

circuit board. This is also called a “copper clad laminate with

shielding layer.”

Multilayer materials refer to copper-clad laminates and adhesive

sheets (adhesive cloth) used to make multilayer circuit boards.

Recently, this has come to include grease-coated copper foil (RCC)

for multi-layer laminates. The so-called multi-layer board refers to

a circuit board with two layers of patterned circuits on both

surfaces and the inside.

Special substrates refer to laminates, metal core substrates, etc.

used in the additive process, which are not included in the

above-mentioned types of special plates.

Metal core substrates also include resin-coated substrates (FBC,

etc.) Others are:

 Aluminum core base substrates

 Copper core base substrate

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 Ceramic core base substrate

 Glass base substrate

Copper-clad laminate, also called PCB substrate.

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(1) A plate-shaped material formed by filling a reinforcing material

(glass fiber cloth, referred to as glass fiber cloth) with resin (pp

sheet), covering one or both sides with copper foil, and hot

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pressing, called a copper-clad layer pressure plate (Copper Clad

Laminates, [CCL]).

(2) The basic material for PCB, it is often called board.

(3) When it is used in the production of multilayer boards, it is also

called core board (or core).

Copper foil

(1) The thickness of copper foil is measured in oz (ounces), and oz

itself is the unit of mass. Usually, the thickness of copper foil is

expressed as “thickness” by mass. The thickness of copper foil is

usually defined as “oz”, 1oz copper thickness—spread one ounce

of copper evenly on one square foot area. At this time, the

thickness of the copper foil is called 1oz copper thickness, and its

thickness is exactly 1.37mil (about 1.4mil).

 The standard thickness of copper foil is 12μm (1/3oz), 18μm

(Hoz), 35μm (1oz),and 70μm (2oz).

Process principle of prepreg (prepreg or pp)

pp is a sheet material made by filling treated glass fiber cloth with

resin glue, and then heat treating (pre-baking) to make the resin

enter the B stage. The process principle of the pressure plate is to

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use the prepreg from the B-stage to the C-stage conversion

process to bond the various circuit layers into one.

Rogers 4350 raw material

Common performance indicators of substrate

(1) DK: The dielectric constant of the material. Only by reducing

DK can a high signal propagation speed be obtained.

(2) Df: The dielectric loss angle of the material; the lower this

angle, the lower the signal propagation loss is.

Note that DK is mainly related to the impedance of the

signal network and also related to the capacitance between the

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plates, and Df is mainly related to the loss of the signal network.

Factors affecting DK are:

 Resin (DK of epoxy resin is between 3～4);

 Glass fiber cloth (DK between 6～7);

 Resin content (RC value).

(3) Tg: glass transition temperature, which has the greatest impact

on vias. The glass transition temperature is the characteristic of

the polymer, which refers to the resin from hard (glassy) to soft

(rubbery). This is the temperature at which the shape changes.

At present, the Tg value of FR-4 board is generally 130-140, and in

the manufacture of printed boards, there are several process

problems that exceed this range, which will have a certain impact

on the processing effect and final state of the product. Therefore,

increasing Tg is a primary method to improve the heat resistance

of FR-4. The Tg classification is as follows.

 Ordinary Tg sheet: 130～140℃.

 Medium Tg sheet: 140～150℃.

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 High Tg board: greater than 170°C (PCB boards with more

than 8 layers must use high Tg boards).

(4) CAF: Abbreviation for conductive anodic filament, called ion migration resistance.

https://www.raypcb.com/the-introduction-of-cclcopper-clad-laminate/

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