What Is The ICT Test

RAYMING PCB & ASSEMBLY
What is the ICT test
Introduction
ICT stands for In-Circuit Test. It is an electronic testing method used to
verify the quality and integrity of circuit board assemblies. ICT testing
detects defects like shorts, opens, missing components, wrong values,
misplaced parts, and improper solder joints.
This article provides a comprehensive overview of ICT covering test
basics, fixture types, program development, test coverage analysis,
optimizing fault diagnosis, considerations for combining with functional
test, and selecting ICT solutions suited for production volumes.
Request ICT Test Service
Contact Us
What is ICT Testing?
PCB Manufacturing & Assembly Services https://www.raypcb.com/

In-circuit testing refers to testing a populated printed circuit board to
verify:
 Electrical connections between components per the
design netlist
 Presence of correct component values at specified locations

 Absence of manufacturing defects like shorts or opens
 Overall assembly quality and workmanship
ICT leverages mechanical “bed-of-nails” test fixtures that make
temporary electrical contact with test nodes across the board being
tested. The connected tester then energizes various circuit paths and
checks that corresponding nodes are properly excited.
Deviation from expected node levels pinpoints defects in assembly
such as wrong components, missing parts, poor solder joints, short
circuits or open circuits. By energizing multiple circuit nets, ICT can
rapidly validate board assembly quality prior to functional testing.
Why Perform ICT Testing?
Below are some key benefits provided by ICT testing:
 Detects manufacturing defects – Such as missing components,
wrong polarity, opens, shorts etc.
 Verifies component presence – Confirms BOM is assembled
correctly.
 Catches workmanship issues – Like poor solder joints, wrong
placement etc.

 Accelerates fault finding – Quickly diagnoses if board failures are
due to manufacturing or design issues.
 100% pre-functional testing – Increases chances of passing final
functional testing.
 Improves process control – Statistical tracking of failure rates
highlights production issues.
 Reduces rework costs – Problems identified early are cheaper to
rework than post-functional test diagnosis.
 Works for powered off state – Can test boards before powering
up which is safer.
ICT provides an efficient and cost-effective means of validating board
assembly quality prior to functional test. It weeds out manufacturing
issues ahead of time.

ICT Test Basics
Below are some key concepts related to in-circuit testing:
ICT Testing Principle

Test Fixtures
The fixture makes temporary electrical contact with test nodes on
the board being tested. Popular styles include:
 Bed of Nails – Consists of an array of spring-loaded “nails” or
“pins” that contact test points. Very common fixture type.
 Flying Probe -Uses movable probes that get positioned
dynamically over desired test nodes. Eliminates need for
custom fixture.
 Pogo Pin – Uses an array of spring-loaded pins. Combines
high probe density with probe cleaning for longevity.
Node Access
To energize and measure circuits, test probes must make contact
with nodes like:
 Testpads – Added specifically for ICT contact
 Vias – Access inner layer nodes
 Component leads – Contact leads protruding through board
 Traces – Probe can land directly on exposed track pads

Test Program
A specialized software program tailor-made for each PCB design.
It contains vectors describing stimulus and measurements for
each test node. Determines pass/fail based on measuring circuit
nodal responses.
Fault Diagnosis
Using the test program, failures get pinpointed to specific
components, nets, or nodes. For example, a short between two
pins implies a defective component. Out of tolerance
measurements imply wrong value components. Open circuits
indicate poor solder joints.
Proper fault diagnosis allows targeted and rapid rework.

ICT Test Fixture Types
There are three common fixture types used in ICT. Each has
particular pros and cons:
Bed of Nails
Consists of an array of spring-loaded “nails” or “pins” that make
electrical contact with test points on the board. Very common
fixture type.
Pros – Low cost, high density probing, fast fixture build
Cons – Pin damage over time requiring maintenance

Flying Probe
Uses movable probes mounted on XY arms. Probes get positioned
dynamically over desired test nodes selected by the program.
Pros – No need for custom fixture, flexible, easy changeovers
Cons – Slower testing than bed of nails, higher machine cost
Pogo Pin Fixtures
Use an array of spring-loaded pins that can compress and spring
back when contacting boards. Provides both high density and
reliability.
Pros – Reliable, high cycle life, fine pitch capability
Cons – Higher fixture cost than traditional nails
Fixtures must be matched to PCB design and production
volume. Low volume prototyping benefits from flying probe
flexibility while higher throughput production favors bed of nail or
pogo pin fixtures.
To perform testing, unique test programs need to be developed
matched to the circuit design of each PCB variant:

CAD Data
PCB CAD data provides key inputs like netlist, testpoint locations,
and board dimensions needed to develop the test program.
Fixture Modeling
For bed of nail fixtures, fixture plates are designed with probes
precisely aligned to contact test nodes on the PCB.
Node Access Analysis
Determines optimal points to access key nets – identifying
testpads, component pins, vias etc. balanced with minimizing
probe count.
Test Vectors
Test vectors define the electrical stimulus patterns that should be
applied to nets and the expected responses to verify at
corresponding test nodes for fault detection.
Diagnostic Routines
Algorithms that analyze measurement deviations and map them
to specific fault conditions like open, short, misplaced part, wrong
value etc.

Program Simulation
The test program is simulated on virtual board models prior to
testing live boards. Debugging and performance optimization
done during simulation.
Fixture Validation
The test fixtures are verified on known good boards to validate
contact reliability prior to starting production testing.
Developing optimized test programs is key to maximizing test
coverage and fault diagnosis capabilities.
Some key strategies help maximize the detection of assembly
defects using ICT:
 Include testpoints on designs upfront to access nets –
recommended at least 4-6 testpoints per side.
 Identify critical nets used by multiple components that
provide the best test coverage.
 Verify access to nets for low resistance, capacitance, and
inductance measurements.

 For program development, focus on highest risk component
types like BGAs.
 Divide tests into functional blocks matching board layout to
simplify diagnostics.
 Optimize node access to balance dense probing against
fixture cost and debugging.
 Ensure testvectors detect both catastrophic and
out-of-tolerance issues.
 Validate coverage by fault insertion on known good boards.
 Set pass/fail limits based on statistical prediction of error
rates.
Thorough test coverage analysis during development reduces
escapes into functional testing.



While functional test validates overall board operation, ICT
focuses on assembly workmanship and component correctness.

ICT Pros
 Catches manufacturing defects functional testing can miss
 Executes at powered off state – Safer
 Much faster fault isolation to specific components
 100% pre-functional testing improves yields
Functional Test Pros
 Confirms board operates correctly under power
 Detects issues missed by ICT – Bad solder joints can still
conduct
 Validates performance – Clock speeds, voltages, timing,
temperatures
 Tests functionality – exercizes circuits in operation
Introducing ICT testing prior to functional test improves quality
and debug efficiency. ICT diagnoses manufacturing issues while
functional testing confirms proper functionality. The two
methodologies complement each other.
Key ICT Equipment Considerations

Below are key considerations when selecting ICT systems:
Throughput
 Tests per hour rating
 Ability to handle small or large boards
 Multi-site testers for parallel testing
Expandability
 Spare fixture sites for future board variants
 Probe capacity for dense fixtures
 Easy programming integration for new boards
Fixturing Approach
 Bed of nails, flying probe, or hybrid fixture strategy
Software
 Flexible program development tools
 Intuitive diagnostics and repair instructions
 Statistical process control and analysis

Hardware
 Pin electronics design – Matrix, multiplexer, instruments
 Test probe technologies – Nails, pogo pins, MEMS
 DUT power management for live current tests
Integration
 Interfaces with handling systems like loaders/unloaders
 Data exchange with manufacturing execution systems
 Combination with functional testers
Evaluating technical factors ensure the system matches both
current and future testing needs.
Conclusion

In-circuit testing is a efficient way to validate component assembly
and soldering quality before functional testing. Investing in test
coverage analysis, fault diagnosis, fixturing, and equipment optimized
for the product mix enables finding issues early. This prevents time
wasted troubleshooting bad boards escaping to system test. However,
ICT requires upfront effort to develop fixtures and programs tailored to
PCB designs. Combining in-circuit testing with follow-on functional test
provides a robust validation approach covering both manufacturing
quality and operational correctness. As volumes scale, purpose-built
ICT systems with fast fault diagnosis maximize quality and rework

efficiency. With today’s complex PCBs, finding ways to thoroughly test
assemblies before powering boards up improves overall yields.
FAQ
What types of defects can be detected with ICT testing?
ICT testing can detect wrong components, missing parts, reversed
polarities, shorts, open circuits, poor solder joints, wrong
component values, misplaced components, and counterfeit parts
among other assembly defects.
What level of test coverage can be expected from ICT?
Typical ICT test coverage ranges from 60% to 90% depending on
board complexity. Critical factors are accessibility of test nodes,
fixture density, and test program development time invested.
How long does it take to develop an ICT test fixture and program for a new PCB?
For a medium complexity board, test program development can
range from 1 to 4 weeks. Developing custom bed of nails fixtures
adds 4 to 6 weeks depending on node density. Flying probe avoids
custom fixturing.
What are some key differences between ICT and functional board testing?

Key differences are that ICT focuses on manufacturing defects,
does not require powered up state, provides rapid fault isolation,
and is much faster but may miss certain faults detected during
system operation by functional testing.
When should ICT vs flying probe fixturing be used?
ICT bed of nails fixtures provide fastest throughput and are
preferred for high volume production while flying probes are
flexible and better suited for prototypes or low volumes due to no
fixed fixturing requirement.
https://www.raypcb.com/ict-test/

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RAYMING PCB & ASSEMBLY

What is the ICT test

detects defects like shorts, opens, missing components, wrong values,

misplaced parts, and improper solder joints.

This article provides a comprehensive overview of ICT covering test

basics, fixture types, program development, test coverage analysis,

optimizing fault diagnosis, considerations for combining with functional

test, and selecting ICT solutions suited for production volumes.

Request ICT Test Service

What is ICT Testing?

PCB Manufacturing & Assembly Services https://www.raypcb.com/

In-circuit testing refers to testing a populated printed circuit board to

 Electrical connections between components per the

 Presence of correct component values at specified locations

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Absence of manufacturing defects like shorts or opens

 Overall assembly quality and workmanship

ICT leverages mechanical “bed-of-nails” test fixtures that make

checks that corresponding nodes are properly excited.

Deviation from expected node levels pinpoints defects in assembly

such as wrong components, missing parts, poor solder joints, short

circuits or open circuits. By energizing multiple circuit nets, ICT can

rapidly validate board assembly quality prior to functional testing.

Why Perform ICT Testing?

Below are some key benefits provided by ICT testing:

 Detects manufacturing defects – Such as missing components,

wrong polarity, opens, shorts etc.

 Verifies component presence – Confirms BOM is assembled

 Catches workmanship issues – Like poor solder joints, wrong

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Accelerates fault finding – Quickly diagnoses if board failures are

due to manufacturing or design issues.

 100% pre-functional testing – Increases chances of passing final

 Improves process control – Statistical tracking of failure rates

highlights production issues.

 Reduces rework costs – Problems identified early are cheaper to

rework than post-functional test diagnosis.

ICT provides an efficient and cost-effective means of validating board

assembly quality prior to functional test. It weeds out manufacturing

issues ahead of time.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

ICT Test Basics

Below are some key concepts related to in-circuit testing:

ICT Testing Principle

PCB Manufacturing & Assembly Services https://www.raypcb.com/

The fixture makes temporary electrical contact with test nodes on

the board being tested. Popular styles include:

 Bed of Nails – Consists of an array of spring-loaded “nails” or

“pins” that contact test points. Very common fixture type.

 Flying Probe -Uses movable probes that get positioned

dynamically over desired test nodes. Eliminates need for

 Pogo Pin – Uses an array of spring-loaded pins. Combines

high probe density with probe cleaning for longevity.

To energize and measure circuits, test probes must make contact

with nodes like:

 Testpads – Added specifically for ICT contact

 Vias – Access inner layer nodes

 Component leads – Contact leads protruding through board

 Traces – Probe can land directly on exposed track pads

PCB Manufacturing & Assembly Services https://www.raypcb.com/

A specialized software program tailor-made for each PCB design.

It contains vectors describing stimulus and measurements for

each test node. Determines pass/fail based on measuring circuit