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Ipc A 630 (L)
Ipc A 630 (L)
IPC-A-630
2013 - September
Acceptability Standard for
Manufacture, Inspection and
Testing of Electronic Enclosures
A standard developed by IPC
®
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The Principles of In May 1995 the IPC’s Technical Activities Executive Committee (TAEC) adopted Principles of
Standardization Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should: Standards Should Not:
• Show relationship to Design for Manufacturability • Inhibit innovation
(DFM) and Design for the Environment (DFE) • Increase time-to-market
• Minimize time to market • Keep people out
• Contain simple (simplified) language • Increase cycle time
• Just include spec information • Tell you how to make something
• Focus on end product performance • Contain anything that cannot
• Include a feedback system on use and be defended with data
problems for future improvement
Notice IPC Standards and Publications are designed to serve the public interest through eliminating mis-
understandings between manufacturers and purchasers, facilitating interchangeability and improve-
ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the
proper product for his particular need. Existence of such Standards and Publications shall not in
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IPC Position It is the position of IPC’s Technical Activities Executive Committee that the use and implementation
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Specification When an IPC publication is updated and a new revision is published, it is the opinion of the TAEC
Revision Change that the use of the new revision as part of an existing relationship is not automatic unless required
by the contract. The TAEC recommends the use of the latest revision. Adopted October 6, 1998
Why is there Your purchase of this document contributes to the ongoing development of new and updated industry
a charge for standards and publications. Standards allow manufacturers, customers, and suppliers to understand
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©Copyright 2013. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any
copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and
constitutes infringement under the Copyright Law of the United States.
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IPC-A-630
®
Contact:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
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Acknowledgment
Any document involving a complex technology draws material from a vast number of sources across many continents.
Shown below are the principal members of the IPC-A-630 development team including the Requirements for Structural
Enclosure Task Group (7-31j) of the Product Assurance Committee (7-30). It is not possible to include all of those who
assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.
Donald McFarland, 3i Bruce Badger, GE Medical Systems Michael Voigt, Moog Inc.
Teresa Rowe, AAI Corporation LLC Callie Olague, Northrop Grumman
Douglas Schueller, AbelConn, LLC Judy Kile, GE Medical Systems LLC Eric Scott, NSWC Crane
Constantino Gonzalez, ACME Jonathan Ryan, GE Medical Systems Kevin Schuld, Peregrine
Training & Consulting LLC Semiconductor
Debbie Wade, Advanced Rework Richard Rumas, Honeywell Canada Glenn Ingram, Plexus Corporation
Technology-A.R.T Michael Zampini, Honeywell Canada Alex Ayala, Qual-Pro Corporation
Sean Keating, Amphenol Limited Jasbir Bath, IPC Lisa Maciolek, Raytheon Company
(UK) Kris Roberson, IPC Fonda Wu, Raytheon Company
Scott Venhaus, Arrow Electronics Inc. Cherry Li, IPC China (Shenzhen Hal Abel, Raytheon Missile Systems
Robert Potysman, AssembleTronics Office)
Darcie Klein, Raytheon Missile
LLC Dan Prezioso, Juniper Networks Systems
Agnes Ozarowski, BAE Systems Frederick Beltran, L-3 Curtis Rebeck, Raytheon Missile
Joseph Kane, BAE Systems Platform Communications Systems
Solutions Byron Case, L-3 Communications Joseph Schmidt, Raytheon Missile
Gerald Leslie Bogert, Bechtel Plant Robert Fornefeld, L-3 Systems
Machinery, Inc. Communications Caroline Ehlinger, Rockwell Collins
Zenaida Valianu, Celestica Shelley Holt, L-3 Communications Eddie Hofer, Rockwell Collins
John Allen, Celestica, Inc. Todd Jarman, L-3 Communications Douglas Pauls, Rockwell Collins
Jeremy Hahn, Chirch Global Theodore Laser, L-3 Communications Greg Hurst, RSI, Inc.
Manufacturing LLC
Darren Cox, Lockheed Martin Gaston Hidalgo, Samsung
Israel Martinez, Continental Missiles & Fire Control Telecommunications America
Automotive Nogales S.A. de C.V.
Robert Stringer, Lockheed Martin Gregg Owens, Space Exploration
Mary Muller, Crane Aerospace & Missiles & Fire Control Technologies
Electronics
Pamela Petcosky, Lockheed Martin Granville Thompson, Unknown
Joshua Civiello, Defense Supply Mission Systems & Training Address
Center Columbus
Alisha Amar, Lockheed Martin Space Lawrence (Skip) Foust, Veteran
David Corbett, Defense Supply Systems Company Affairs Hospital
Center Columbus
William Draper, Moog Inc. Gene Weiner, Weiner International
Peter Thomas, Emhart Teknologies
Bill Kasprzak, Moog Inc. Associates
Omar Karin Hernandez, Flextronics
Daniel Romig, Moog Inc. Gerard Donovan
Manufacturing Mex, SA de CV
Robert Ruszanowski, Moog Inc.
Gary Ferrari, FTG Circuits
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Table of Contents
1 GENERAL ................................................................. 1 1.15.2 Lighting ............................................................... 5
1.1 Scope ................................................................... 1 1.15.3 Magnification Aids ............................................. 5
1.2 Purpose ................................................................ 1 1.16 Rework/Repair .................................................... 6
1.3 Classification ....................................................... 1 1.16.1 Rework ................................................................ 6
1.4 Measurement Units and Applications ................ 1 1.16.2 Repair .................................................................. 6
1.5 Definition of Requirements ................................ 1 1.17 Process Control Requirements ........................... 6
1.6 Uncommon or Specialized Designs ................... 2 1.17.1 Statistical Process Control (SPC) ...................... 6
1.7 Terms and Definitions ........................................ 2
2 APPLICABLE DOCUMENTS .................................... 7
1.7.1 Backplanes .......................................................... 2 2.1 Department of Defense ...................................... 7
1.7.2 Brazing ................................................................ 2 2.2 IPC ...................................................................... 7
1.7.3 Electrical Bonding .............................................. 2 2.3 American Society of Mechanical
1.7.4 Fiber Optic Cables .............................................. 2 Engineers ............................................................ 7
1.7.5 Inspection ............................................................ 2 2.4 EIA ...................................................................... 7
1.7.6 Installation Torque .............................................. 2 2.5 Electrostatic Discharge Association ................... 7
1.7.7 Manufacturer (Assembler) .................................. 2 2.6 International Organization for
1.7.8 Objective Evidence ............................................. 3 Standardization ................................................... 7
1.7.9 Prevailing Torque ............................................... 3 2.7 Automotive Industry Action Group ................... 7
1.7.10 Process Control ................................................... 3 2.8 American Welding Society ................................. 7
1.7.11 Repair .................................................................. 3 2.9 NCSL International ............................................. 8
1.7.12 Rework ................................................................ 3 2.10 ASTM ................................................................. 8
1.7.13 Specified Torque ................................................. 3 3 GENERAL AND FACILITY REQUIREMENTS ......... 8
1.7.14 Supplier ............................................................... 3 3.1 Electrostatic Discharge (ESD)
1.7.15 User ..................................................................... 3 Control Program ................................................. 8
1.7.16 Validation ............................................................ 3 3.1.1 ESD Packaging ................................................... 8
1.7.17 Verification .......................................................... 3 3.2 Foreign Object Debris (FOD) ............................ 8
1.7.18 Welding ............................................................... 3 3.3 Soldering ............................................................. 8
1.7.19 Wire Diameter (D) .............................................. 3 3.4 Facilities .............................................................. 8
1.8 Health and Safety ............................................... 3 3.4.1 Field Assembly Operations ................................ 8
1.9 Order of Precedence ........................................... 3 3.5 Tools and Equipment .......................................... 8
1.10 Acceptance Requirements .................................. 3 3.5.1 Control ................................................................ 8
1.11 Requirements Flowdown .................................... 3 3.5.2 Calibration .......................................................... 9
1.12 Personnel Proficiency ......................................... 4 3.6 Preservation and Packaging ............................... 9
1.13 Inspection Conditions ......................................... 4
4 MATERIALS AND PROCESSES .............................. 9
1.13.1 Target .................................................................. 4
4.1 Cleaning Prior to Application ............................ 9
1.13.2 Acceptable .......................................................... 4
4.2 Foamed Polymers ............................................... 9
1.13.3 Process Indicator ................................................ 4
4.3 Encapsulants and Sealants ................................ 10
1.13.4 Defect .................................................................. 4
4.3.1 Processing Requirements .................................. 10
1.13.5 Disposition .......................................................... 4
4.4 Adhesive Bonding ............................................ 10
1.13.6 Product Classification Implied Relationships .... 4
4.5 Welding and Brazing Specifications ................ 10
1.13.7 Conditions Not Specified ................................... 4
4.5.1 Welding and Brazing Procedure
1.14 Electrical Clearance ............................................ 4 Qualification ...................................................... 10
1.15 Inspection ............................................................ 5 4.5.2 Qualification of Personnel Performing
1.15.1 Sampling ............................................................. 5 Welding or Brazing Operations ....................... 10
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4.6 Cables and Harnesses ....................................... 10 Figure 6-1 Hardware Installation ...................................... 13
4.6.1 Fiber Optic Cables ............................................ 10 Figure 6-2 Hardware Installation Order ........................... 13
4.6.2 Connector Assembly ......................................... 10 Figure 6-3 Torquing Sequence – Four Hole Pattern ....... 14
4.6.3 Crimping ........................................................... 10 Figure 6-4 Torquing Sequence – Linear Pattern ............. 14
Figure 6-5 Torquing Sequence – Circular Pattern ........... 14
4.6.4 Splices ............................................................... 10
Figure 6-6 Torque Stripe .................................................. 15
4.6.5 Soldering ........................................................... 10
Figure 6-7 Rivet Parts ...................................................... 15
4.6.6 Installation ........................................................ 10
Figure 6-8 Dimensions of Driven/Shop-Formed Head –
5 ACCEPTABILITY OF SURFACE FINISHES .......... 12 Universal ......................................................... 16
6 ELECTRONIC ENCLOSURE ASSEMBLY ............. 13 Figure 6-14 Cracks in Driven/Shop-Formed Heads .......... 17
Figure 6-15 Cracks in Driven/Shop-Formed Heads –
6.1 Hardware Installation ....................................... 13
Defect 2, 3 ...................................................... 18
6.1.1 Torque ............................................................... 13 Figure 6-16 Cracks in Driven/Shop-Formed Heads –
6.1.2 Hardware Installation Sequence/Torque Defect 2, 3 ...................................................... 18
Pattern ............................................................... 13 Figure 6-17 Marred Manufactured Head ........................... 18
6.1.3 Tooling and Equipment .................................... 14 Figure 6-18 Flattened Manufactured Head ........................ 18
6.1.4 Materials Applied to the Fastener System ....... 14 Figure 6-19 Open Heads (Gapping) .................................. 18
6.2 Electrical Bonding ............................................ 15 Figure 6-20 Head Heights – Flush Rivets ......................... 19
6.3 Rivets ................................................................ 15 Figure 6-21 Rivet Flash ...................................................... 19
6.3.1 Material Preparation ......................................... 15 Figure 6-22 Blind, Hollow Type Rivet ................................. 19
6.3.2 Conventional Rivets ......................................... 16 Figure 6-23 Sheet Deformed by Pressure ......................... 19
Figure 6-24 Sheet Deformed by Pressure ......................... 20
6.3.3 Blind Rivets ...................................................... 16
Figure 6-25 Sheet Deformed by Pressure ......................... 20
6.3.4 Specialized Rivets ............................................ 16
Figure 6-26 Sheet Deformed By Pressure ........................ 20
6.3.5 Acceptance Requirements ................................ 16
Figure 6-27 Sheet Expanded Internally ............................. 20
7 MARKING/LABELING ............................................ 21 Figure 6-28 Sheet Injured by Rivet Gun or Trim
7.1 Marking Acceptability Requirements .............. 21 Flush Shaver .................................................. 20
Figure 6-29 Countersinks – Defect 2, 3 ............................. 20
7.1.1 General .............................................................. 21
Figure 6-30 Sheet Misalignment ........................................ 20
7.1.2 Surface Preparation .......................................... 21
7.1.3 Location ............................................................ 21
7.1.4 Curing and Adhesion ........................................ 21 Tables
7.1.5 Content, Legibility and Permanency ............... 21 Table 1-1 Electrical Clearance .......................................... 5
7.2 Internal Assemblies and Subassemblies .......... 22 Table 1-2 Magnification Aids – Wire Applications ............ 5
Table 1-3 Magnification Aids – Other Applications ........... 6
8 TESTING/VERIFICATION ....................................... 22
Table 4-1 Welding and Brazing Reference
Documents ...................................................... 10
Figures
Table 4-2 Minimum Bend Radius Requirements ............ 11
Figure 1-1 An Optical Fiber Cable ..................................... 2
Table 6-1 Identification Markings on Conventional/
Figure 4-1 Wire Wrapped in the Opposite Direction Solid Rivets ..................................................... 15
to the Feed in Direction .................................. 11
Table 6-2 Dimensions of Driven/Shop Formed Head
Figure 4-2 Wire Kinked (B) ............................................... 11 (mm [Inches]) .................................................. 16
Figure 4-3 Filler Rod ........................................................ 11 Table 6-3 A-Max Dimension by Rivet Size ..................... 19
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1 GENERAL
1.1 Scope This standard provides the requirements for the manufacture, inspection and test for electronic enclosures.
1.2 Purpose This standard has been written to direct the manufacturers and end users of electronic enclosures of electri-
cal and electronic equipment to understand the best practices to meet requirements, ensuring the reliability and function of
the end item assembly for its intended design life.
An electronic enclosure, for the purpose of this document, is defined as a chassis, box, top level assembly, high level assem-
bly (HLA), functional unit, drawer, cabinet, or other designation, forming a top level system assembly. An enclosure typi-
cally consists of a combination of printed board assemblies (PBAs), cable and wire harness assemblies, and other electron-
ics and/or mechanical components, and is typically tested as a functional unit. The enclosure includes the necessary
mechanical and structural elements to protect and integrate the assembly into a finished system. Enclosures are often modu-
lar components or sub-systems of larger systems, designed for quick replacement in the end-use environment.
1.3 Classification This standard recognizes that electrical and electronic assemblies are subject to classifications by
intended end-item use. Three general end-product Classes have been established to reflect differences in producibility, com-
plexity, functional performance requirements and verification (inspection/test) frequency. It should be recognized that there
may be overlaps of equipment between Classes. The user (customer) is responsible for defining the product Class. If the
user and manufacturer do not establish and document the acceptance Class, the manufacturer may do so. Accept and/or reject
decisions shall [D1D2D3] be based on applicable documentation such as contracts, drawings, specifications, standards and
reference documents.
The Class of product specified for the enclosure assembly shall [D1D2D3] apply to all subassemblies unless as agreed
between user and supplier (AABUS).
1.4 Measurement Units and Applications All dimensions and tolerances, as well as other forms of measurement (tem-
perature, weight, etc.) in this standard are expressed in SI (System International) units with Imperial English equivalent
dimensions provided in brackets. Dimensions and tolerances use millimeters as the main form of dimensional expression;
Micrometers are used when the precision required make millimeters too cumbersome. Celsius is used to express tempera-
ture. Weight is expressed in grams. Unless specifically required herein, actual measurement of specific part mounting and
determination of percentages are not required except for referee purposes. For the purposes of determining conformance to
this specification, all specified limits in this standard are absolute limits as defined in ASTM E29.
1.5 Definition of Requirements The word shall is used in the text of this document wherever there is a requirement for
materials, process control, or acceptance of an electronic enclosure assembly.
Where the word shall leads to a hardware defect for at least one Class, the requirements for each Class are in brackets next
to the shall requirement.
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1.6 Uncommon or Specialized Designs IPC-A-630, as an industry consensus document, cannot address all of the pos-
sible product design combinations. However, the standard does provide criteria for commonly used technologies. Where
uncommon or specialized technologies are used, it may be necessary to develop unique acceptance criteria. The develop-
ment should include user involvement. The acceptance criteria shall [N1N2D3] have user agreement. Requirements for spe-
cialized processes and/or technologies not specified herein shall [N1D2D3] be performed in accordance with documented
procedures which are available for review.
1.7 Terms and Definitions Other than those terms listed below, the definitions of terms used in this standard are in accor-
dance with IPC-T-50.
1.7.1 Backplanes A backplane is typically a printed board assembly (PBA) that serves as a backbone to connect a series
of application specific PBAs (usually called daughter cards) that share common I/O and power distribution.
1.7.2 Brazing Brazing is a method of joining two pieces of metal together with a third, molten filler metal. The filler metal
may be in the form of a filler rod (similar to welding rod in concept) or the braze metal may be clad onto sheet metal stock.
1.7.5 Inspection An evaluation of quality characteristics relating to a standard, specification, or design drawing.
1.7.7 Manufacturer (Assembler) The individual, organization, or company responsible for the assembly process and veri-
fication operations necessary to ensure full compliance of assemblies to this standard.
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1.7.8 Objective Evidence Documentation in the form of hard copy, computer data, video, or other media.
1.7.9 Prevailing Torque The sum of the torque required to overcome the kinetic friction of the mating threads plus the
locking feature, when 100% of the locking feature is engaged and the fastener is unseated.
1.7.10 Process Control A system or method to continually steer an operation in reducing variation in the processes or
products to meet or exceed the goal in quality and performance.
1.7.11 Repair The act of restoring the functional capability of a defective article in a manner that precludes compliance
of the article with applicable drawings or specifications.
1.7.12 Rework The act of reprocessing noncomplying articles through the use of original or alternate equivalent process-
ing, in a manner that assures compliance of the article with applicable drawings or specifications.
1.7.14 Supplier The individual, organization or company which provides to the manufacturer (assembler) components
(cables, wire harnesses, electronic, electromechanical, mechanical, printed boards, etc.) and/or materials (solder, flux, clean-
ing agents, etc.).
1.7.15 User The individual, organization, company, contractually designated authority or agency responsible for the pro-
curement of electrical/electronic hardware, cables and wire harnesses, etc., and having the authority to define the Class of
product and any variation or restrictions to the requirements of this standard (i.e., the originator/custodian of the contract
detailing these requirements). In cases where the procuring agency or authority (i.e., the ‘‘customer’’) has no contractual
approval or authority over the design, the user is the design authority.
1.7.16 Validation The process of establishing that the product or process meets its intended requirements or customer
needs.
1.7.17 Verification The process of confirming that the product complies with established requirements and that the docu-
mented process is followed.
1.7.18 Welding Welding is a materials joining process which produces coalescence of materials by heating them for
defined times and temperatures with or without the application of pressure or filler material.
1.7.19 Wire Diameter (D) In this document, the outside diameter of the wire, including insulation if present.
1.8 Health and Safety Materials, material handling/storage, test methods, process, equipment referenced in this standard
may be hazardous. To provide for personnel safety, follow all applicable local, Federal (National) occupational, safety and
health regulations.
1.9 Order of Precedence In the event of a conflict the following order of precedence applies. Exceptions to the require-
ments of this standard shall [D1D2D3] be AABUS.
a. Contract
b. Engineering Drawing
c. This Specification
d. Any additional reference specifications
1.10 Acceptance Requirements All products shall [D1D2D3] meet the requirements of the assembly drawing(s)/
documentation and the requirements for the applicable product Class in the document herein. Manufacturers shall [D1D2D3]
perform 100% inspection unless sampling inspection is defined as part of a user approved documented process control plan.
1.11 Requirements Flowdown When this standard is contractually required, the applicable requirements of this standard
(including product Class - see 1.3) shall [D1D2D3] be imposed on all applicable subcontracts, assembly drawing(s), docu-
mentation and purchase orders. Unless otherwise specified, the requirements of this standard are not imposed on the pro-
curement of commercial-off-the-shelf (COTS) assemblies or subassemblies.
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When a part is adequately defined by a specification, then the requirements of this standard should be imposed on the manu-
facture of that part only when necessary to meet end item requirements. When it is unclear where flowdown should stop, it
is the responsibility of the manufacturer to establish that determination with the user. When an assembly is procured that
assembly should meet the requirements of this standard. If the assembly is manufactured by the same manufacturer, the
requirements are as stated in the contract for the entire assembly.
1.12 Personnel Proficiency Except for welding or brazing (see 4.5.2), all instructors, operators, test and inspection per-
sonnel shall [D1D2D3] be proficient in the tasks to be performed. Objective evidence of that proficiency shall [N1D2D3]
be maintained and be available for review. Objective evidence should include records of training to the applicable job func-
tions being performed, work experience, testing to the requirements of this standard and results of periodic reviews of pro-
ficiency. Supervised on-the-job training is acceptable until proficiency is demonstrated.
1.13 Inspection Conditions For each section of this document, target, acceptable and defect conditions are listed for each
product Class. Where applicable, process indicator conditions are also listed. The inspector shall not [D1D2D3] select the
product Class for the assembly under inspection. Documentation that specifies the applicable Class for the assembly under
inspection shall [D1D2D3] be provided to the inspector. The descriptions of these conditions follow.
1.13.1 Target A condition that is close to perfect (in the past has sometimes been labeled as ‘‘preferred’’). It is a desir-
able condition, not always achievable, and may not be necessary to ensure reliability of the assembly in its service environ-
ment.
1.13.2 Acceptable This characteristic indicates a condition that, while not necessarily perfect, will maintain the integrity
and reliability of the assembly in its service environment.
1.13.3 Process Indicator A process indicator is a condition (not a defect) that identifies a characteristic that does not
affect the ‘‘form, fit, function or reliability’’ of a product.
a. Such condition is a result of material, design and/or operator/machine related causes that create a condition that neither
fully meets the acceptance criteria nor is a defect.
b. Process indicators should be monitored as part of the process control system. If the number of process indicators indi-
cates an abnormal variation in the process, identifies an undesirable trend, or displays other conditions that indicate the
process is (or is approaching) out of control, the process shall [N1N2D3] be analyzed. This may result in action to reduce
the variation and improve yields.
c. Disposition of individual process indicators is not required and affected product should be used as is.
d. Not all process indicators are specified by this standard.
e. It is the responsibility of the manufacturer to identify process indicators that are unique to the assembly process.
1.13.4 Defect A defect is a condition that fails to meet the acceptance criteria of this document and negatively affects the
form, fit or function of the assembly in its end use environment. The manufacturer shall [N1D2D3] document and disposi-
tion each defect.
It is the responsibility of the manufacturer to identify defects that are unique to the assembly process. It is the responsibil-
ity of the user to define unique defect categories applicable to the product.
1.13.5 Disposition Disposition is the determination of how defects should be treated. Dispositions include, but are not
limited to, rework, use as-is, scrap, or repair. User concurrence shall [N1D2D3] be required for ‘‘use as-is’’ and shall
[N1N2D3] be required for ‘‘repair’’ dispositions.
1.13.6 Product Classification Implied Relationships A defect for a Class 1 product means that the characteristic is also
a defect for Class 2 and 3. A defect for a Class 2 product means that the characteristic is also a defect for a Class 3 prod-
uct, but may not be a defect for a Class 1 product where less demanding criteria may apply.
1.13.7 Conditions Not Specified Conditions that are not specified as a defect or as a process indicator are considered
acceptable unless it can be established that the condition affects form, fit, function, or reliability AABUS.
1.14 Electrical Clearance Electrical clearance spacing between conductors should be maximized whenever possible. The
minimum spacing between conductors and between conductive materials (such as conductive markings or mounting hard-
ware) and conductors should be defined on the applicable drawings or documentation. When mixed voltages appear on the
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same assembly, the specific areas and appropriate clearances should be identified on the drawings. Failure to adhere to this
criteria can cause equipment operating problems, and in the case of high voltages or high power applications, potential
severe damage/fire.
Although minimum electrical clearance distances are normally Table 1-1 Electrical Clearance
fixed by the design/drawing (e.g., minimum spacing between Voltage Set* Clearance
two terminal studs), it is possible to violate the minimum Up to 64 A 1.6 mm [0.062 in]
spacing by the installation method. For example, improper B 3.2 mm [0.125 in]
orientation of an uninsulated terminal lug or an excessively C 3.2 mm [0.125 in]
long wire wrap/solder connection pigtail with orientation that Over 64-600 A 1.6 mm [0.062 in]
B 3.2 mm [0.125 in]
places the connections closer to non-electrically common con-
C 6.4 mm [0.25 in]
ductors could violate the minimum spacing. Violation of mini-
Over 600-1000 A 3.2 mm [0.125 in]
mum electrical clearance shall [D1D2D3] be a defect. Electri- B 6.4 mm [0.25 in]
cal clearance distance is defined as the shortest point-to- point C 12.7 mm [0.5 in]
distance between non-common, uninsulated, energized parts Over 1000-3000 C 50 mm [2 in]
or between an energized part and ground. The minimum elec- Over 3000-5000 C 75 mm [3 in]
trical clearance distance depends on the circuit voltage rating *Set A = Normal operating volt-ampere rating up to 50.
and the normal volt-ampere rating. In cases where no mini- *Set B = Normal operating volt-ampere rating of 50 to 2000.
*Set C= Normal operating volt-ampere rating over 2000.
mum electrical clearance value is otherwise defined, the crite-
ria in Table 1-1 may be used as a guideline.
1.15 Inspection All electronic enclosures shall [N1D2D3] be inspected per this document. All associated sub-assemblies
shall [N1D2D3] be inspected per the individual build requirements for each assembly.
1.15.1 Sampling Manufacturers shall [N1N2D3] define a sampling inspection program as part of a documented process
control plan (see 1.17). If there is no documented process control plan the manufacturer shall [N1D2D3] perform 100%
inspection.
1.15.2 Lighting Illumination at the surface of workstations should be at least 1000 lm/m2 (approximately 93 foot candles).
Supplemental lighting may be necessary to assist in visual inspection. Light sources should be selected to prevent shadows
on the item being inspected except those caused by the item being inspected.
NOTE: In selecting a light source, the color temperature of Table 1-2 Magnification Aids – Wire Applications1
the light is an important consideration. Light ranges from Magnification Power
3000-5000° K enable users to distinguish various metal and Wire Size AWG Inspection Maximum
plating features and contaminants with increased clarity. Diameter mm [inch] Range Referee
larger than 14 AWG
Inspection of some materials may require UV lighting, i.e., >1.63 mm [0.064 in]
N/A 1.75X
conformal coating coverage, and should have an intensity of
14 to 22 AWG
nominally 1000 mW/cm2 when measured at 38.1 cm [15 in] 1.63 - 0.64 mm 1.5X - 3X 4X
from the filter face. [0.064 to 0.025 in]
<22 to 28 AWG
1.15.3 Magnification Aids Unless otherwise specified <0.64 mm - 0.032 mm 3 - 7.5X 10X
herein, visual inspection shall [N1D2D3] be performed with- [<0.025 - 0.013 in]
out magnification. A maximum of 4x shall [N1D2D3] be used Smaller than 28 AWG
10X 20X
for referee purposes only. <0.32 mm [<0.013 in]
Note 1: Referee magnification power is to be used only to verify a product
When required, magnification power for inspection shall rejected at the inspection magnification. For assemblies with mixed wire size,
[A1P2D3] be at least the minimum/maximum inspection the greater magnification may be (but is not required to be) used for the entire
assembly.
power specified in Tables 1-2 and 1-3. Other magnification
powers within the inspection range may be used. The magnification power requirement is based on the gauge of the wire
or the item being inspected. For assemblies with multiple criteria, the greater magnification may be used for the entire
assembly. If the presence of a defect cannot be determined at the inspection power, the item is acceptable. The referee mag-
nification power is intended for use only after a defect has been determined but is not completely identifiable at the inspec-
tion power.
The tolerance for magnification aids is 15% of the selected magnification power. Magnification aids should be maintained
and calibrated as appropriate (see IPC-OI-645). Supplemental lighting may be necessary to assist in visual assessment.
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1.16 Rework/Repair In the event a rework or repair action takes place, any tests/inspections that were previously per-
formed shall [D1D2D3] be repeated in their entirety for the portion of the product that was affected by the rework or repair.
1.16.1 Rework Rework shall [N1N2D3] be documented. Rework shall [D1D2D3] meet all applicable requirements of this
standard. Rework does not include a second application of a soldering iron during a hand soldering operation on a single
connection.
1.16.2 Repair Repairs shall [N1D2D3] be conducted in accordance with a documented procedure. The repair method
shall [N1N2D3] be AABUS (see also 1.13.5).
1.17 Process Control Requirements The primary goal of process control is to continually reduce variation in the pro-
cesses, products, or services to provide products or processes meeting or exceeding customer requirements. Process control
tools such as IPC-9191, EIA-557-1, AIAG/ASQC PPAP or other user-approved systems may be used as guidelines for
implementing process control.
Manufacturers shall [N1N2D3] develop and implement a documented process control system.
A documented process control system, if established, shall [N1D2D3] define process control and corrective action limits.
This may or may not be a statistical process control (SPC) system. The use of SPC is optional and should be based on fac-
tors such as design stability, lot size, production quantities and the needs of the manufacturer (see 1.17.1 for SPC, AIAG/
ASQC PPAP or other accepted industry standard).
Process control methodologies shall [N1N2D3] be used in the planning, implementation and evaluation of the manufactur-
ing processes used to produce electronic enclosures. The process control philosophy, implementation strategies, tools and
techniques may be applied in different sequences depending on the specific company, operation, or variable under consid-
eration to relate process control and capability to end product requirements.
1.17.1 Statistical Process Control (SPC) When an SPC system is used, it shall [D1D2D3] include the following elements
as a minimum:
a. Training is provided to personnel with assigned responsibilities in the development, implementation and utilization of
process control and statistical methods that are commensurate with their responsibilities.
b. Quantitative methodologies and evidence is maintained to demonstrate that the process is capable and in control.
Improvement strategies define initial process control limits and methodologies leading to a reduction in the occurrence
of process indicators in order to achieve continuous process improvement.
c. Criteria for switching to sample based inspection is defined. When processes exceed control limits, or demonstrate an
adverse trend or run, the criteria for reversion to higher levels of inspection (up to 100%) is also defined.
d. When defect(s) are identified in the lot sample, and the number exceeds the limit allowed by the sampling plan, the entire
lot is 100% inspected for the occurrence(s) to the defect(s).
e. A system is in place to initiate corrective action for the occurrence of process indicators, out-of-control process(es) and/or
discrepant assemblies.
f. A documented audit plan is defined to monitor process characteristics and/or output at a prescribed frequency.
g. Objective evidence of process control may be in the form of control charts or other tools and techniques of SPC derived
from application of process parameter and/or product parameter data.
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2 APPLICABLE DOCUMENTS
2.2 IPC2
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-610 Requirements for Acceptability of Electronic Assemblies
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-OI-645 Standard for Visual Optical Inspection Aids
IPC-TM-650 Test Methods Manual3
2.4.1 Adhesion, Tape Testing
2.4 EIA5
EIA-557-1 General Standard of Statistical Process Control Systems
1. http://www.landandmaritime.dla.mil/
2. www.ipc.org
3. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)
4. www.ASME.org
5. www.eciaonline.org
6. www.ESDA.org
7. www.iso.org
8. www.aiag.org
9. www.aws.org
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2.10 ASTM11
ASTM E29 Standard Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
3.1 Electrostatic Discharge (ESD) Control Program When identified on the engineering drawing as being ESD sensitive
(ESDS), the electronic enclosure shall [D1D2D3] be protected in accordance with ANSI/ESD S20.20, MIL-STD-1686 or
equivalent standard. When ESD personal grounding equipment cannot be used for reasons of operator safety (i.e., around
electrically energized items) ionization may be required to neutralize electrostatic charges.
Industry best practice is to treat any unknown electronic components or assemblies as ESDS to prevent potential damage.
3.1.1 ESD Packaging When identified on the engineering drawing as being ESDS, electronic enclosures shall [N1D2D3]
be packaged in electrostatic protective material to shield against ESD. Conductive cap plugs or ESD protective material shall
[N1D2D3] be used on all exposed connectors.
3.2 Foreign Object Debris (FOD) The manufacturer shall [N1P2D3] establish and employ a documented FOD control
program. Assemblies shall [N1D2D3] be free of FOD.
Handling of cleaned assemblies shall [N1N2D3] preclude recontamination.
3.3 Soldering Unless otherwise specified, soldering shall [N1D2D3] be in accordance with IPC/WHMA-A-620.
3.4 Facilities Work areas shall [D1D2D3] be maintained at levels that prevent contamination or deterioration of tools,
materials and work surfaces. Eating, drinking and/or use of tobacco products shall [D1D2D3] be prohibited in the work area.
When processing ESDS assemblies, the manufacturer shall [N1D2D3] verify that ESD control is adequate when humidity
decreases to a level of 30% or lower.
For operator comfort and solderability maintenance, the temperature should be maintained between 18°C [64.4°F] and 30°C
[86°F] and the relative humidity should not exceed 70%. For process control, more restrictive temperature and humidity
limits may be required.
3.4.1 Field Assembly Operations In field assembly operations where the controlled environmental conditions required by
this standard cannot be effectively achieved, precautions shall [N1D2D3] be taken to minimize the effects of the uncon-
trolled environment on the operation being performed on the hardware.
10. www.ncsl.org
11. www.astm.org
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Soldering irons, equipment and systems shall [D1D2D3] be chosen and employed to provide temperature control and iso-
lation from electrical overstress or ESD when ESDS parts or assemblies are involved.
3.5.2 Calibration Torque tools, measuring equipment and mechanical and electrical test equipment (including contact
retention testers) shall [N1D2D3] be calibrated. Crimping tools shall [N1D2D3] be calibrated or verified using a docu-
mented process.
The manufacturer shall [N1D2D3] have a documented calibration system in accordance with ANSI/NCSL Z540 or other
National or International standard. The minimum standard shall [N1D2D3] assure:
a. Measurement standards used for calibrating tools are traceable to National Institute of Standards and Technology (NIST)
or other National or International standard. Calibration of tools is performed in an environment compatible with the envi-
ronmental requirements of the tools.
b. Calibration intervals are based on the type of tool and records of the tool’s calibration. Intervals may be lengthened or
shortened on the basis of stability demonstrated over previous calibration periods.
c. Procedures are generated and utilized for the calibration of all tooling stated herein. Procedures include, as a minimum,
standards to be used, parameters to be measured, accuracy, tolerances, environmental factors and steps in the calibration
process.
d. Records are maintained that document calibration.
e. Tools are labeled to indicate, as a minimum:
1. Date of calibration.
2. Calibration due date.
3. Any limitation of use. If not practical to place the label directly on the tool, then the label is affixed to the tool con-
tainer or other location as documented in the procedures.
4. Tool identification.
3.6 Preservation and Packaging Electronic enclosures shall [D1D2D3] be packaged in a manner that will afford protec-
tion against contamination, corrosion, deterioration and physical damage.
4.1 Cleaning Prior to Application All surfaces to be coated, bonded or encapsulated shall [N1D2D3] be clean and free
from grease, dirt, flux and other contaminants.
When cleaning is required, surfaces to be coated, bonded, or encapsulated shall [N1D2D3] be cleaned in accordance with
a documented procedure. The maximum time between cleaning/surface preparation and material application shall [N1D2D3]
be part of the documented procedure. If the maximum time between cleaning/surface preparation and material application
is exceeded, the surfaces shall [N1D2D3] be reprocessed.
4.2 Foamed Polymers Foamed polymers shall [N1D2D3] be applied in a manner as to preclude damaging fragile com-
ponents or exerting undue stress on adjacent surfaces.
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4.3 Encapsulants and Sealants The encapsulation and sealing processes shall [N1D2D3] be accomplished in accordance
with documented procedures.
4.3.1 Processing Requirements Processing requirements for encapsulation and sealing shall [N1D2D3] include the
following:
a. Surface preparation, cleaning and/or no-clean requirements.
b. Resin or polymer preparation.
c. Processing temperatures (including exothermic heat of reaction).
d. Rework methods.
The welding and brazing processes are further outlined in Aluminum Brazing (including Dip Brazing) AWS C3.7
IPC-HDBK-630. Resistance Brazing AWS C3.9
4.5.1 Welding and Brazing Procedure Qualification Welding and brazing shall [N1D2D3] be performed to documented
procedures. Procedure approval may be required by the user. Welding and brazing shall [N1D2D3] be qualified for use by
an appropriate qualification method in accordance with the required classification (e.g., mechanical testing of the joints,
Non-destructive Testing (NDT), visual inspection, etc.).
4.5.2 Qualification of Personnel Performing Welding or Brazing Operations Personnel performing and/or inspecting
welding or brazing shall [N1D2D3] be qualified to a recognized military or industry standard or a documented internal
qualification procedure, in accordance with the required classification. See Table 4-1 for recognized industry standards.
4.6.1 Fiber Optic Cables The engineering drawing shall [N1D2D3] specify the fiber optic cable materials, fabrication
methods and required testing processes.
4.6.2 Connector Assembly Unless otherwise specified on the engineering drawing, the assembly of connectors shall
[N1D2D3] be in accordance with IPC/WHMA-A-620.
4.6.3 Crimping Unless otherwise specified on the engineering drawing, crimping shall [N1D2D3] meet the requirements
of IPC/WHMA-A-620.
4.6.4 Splices Unless otherwise specified on the engineering drawing, splice connections shall [N1D2D3] meet the
requirements of IPC/WHMA-A-620.
4.6.6 Installation
4.6.6.1 Routing and Stress Relief Wires and cables shall [D1D2D3] be positioned or protected to avoid contact with
rough or irregular surfaces and sharp edges and to avoid damage to conductors or adjacent parts.
Wire shall not [N1D2D3] be routed through ‘‘keep out’’ zones, e.g., hot surfaces or mechanical interference areas.
Unless otherwise specified, the minimum bend radius of the installed wire or cable shall [D1D2D3] be in accordance with
Table 4-2.
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4.6.6.2 Wire Dress and Service Loops If required, a service loop shall [D1D2D3] be provided to allow at least one field
repair.
Wire routing shall [D1D2D3] meet requirements for drip loops, no mechanical interference,
etc.
Defect – Class 1, 2, 3
IPC-630-4-1
• Bends are kinked (see Figure 4-2).
Figure 4-1 Wire Wrapped in
4.6.6.3 Clamping and Support The harness shall [D1D2D3] be supported with mounting the Opposite Direction to the
hardware to preclude stress. Feed in Direction
Acceptable – Class 1, 2, 3
• Wires/harness assembly held securely in the clamp.
• Wires/harness assembly and not pinched in clamp. B
• Insulation is compressed by less than 20% by the clamp.
• Filler rods, if used, extend more than 1 mm [0.04 in] but less than 19 mm [0.75 in] on IPC-630-4-2
each side of the clamp (see Figure 4-3). Figure 4-2 Wire Kinked (B)
• Filler rods, if used, are on the gap side of the clamp.
Defect – Class 1, 2, 3
• Wires/harness assembly not held securely in the clamp.
• Wires/harness assembly pinched in clamp.
• Insulation is compressed by more than 20% by the clamp.
• Filler rods, if used, extend less than 1 mm [0.04 in] or more than 19 mm [0.75 in] on each
side of the clamp.
Figure 4-3 Filler Rod
• Filler rods, if used, are not on the gap side of the clamp.
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4.6.6.4 Intersecting Wire Bundles/Cables Unless otherwise specified, when intersecting wire bundles or cables are
secured to each other, the tie wrap and lacing shall [N1D2D3] meet the requirements of IPC/WHMA-A-620.
5.1 Application Required finish, including any primer, shall [D1D2D3] be applied to all areas identified in the engineer-
ing design. Finishes shall not [D1D2D3] be present where prohibited by the engineering design (e.g., wear or mounting sur-
faces).
5.2 Curing and Adhesion Paint and any primer shall [D1D2D3] be fully cured and tack-free. Finish shall [D1D2D3] be
adherent, without chipping, flaking, peeling, cracking, bubbling, or lifting. Finish shall [D1D2D3] comply with specified
adhesion requirements, such as tape testing (see IPC-TM-650, Test Method 2.4.1).
5.3 Appearance The final finish shall [D1D2D3] dry to a smooth, uniform surface, free from runs, sags, bubbling, streaks,
or dusting. Scratches, scuffs, or other surface damage shall not [D1D2D3] compromise protection of the underlying surface,
adhesion of the finish, or serviceability of the item, or expose base metal (see 5.3.2 for Cosmetic Flaws). Defects may be
reworked through methods AABUS which could include abrasion, sanding, followed by touchup with a brush or overspray.
5.3.1 Color and Gloss Surfaces shall [A1D2D3] comply with color and gloss requirements specified. Such evaluation is
typically by visual comparison with a specified ‘‘paint chip’’ standard, but a spectrophotometer, gloss meter, color meter, or
other measurement device may be specified.
NOTE: Color chips or samples should be stored in a cool, dark place, away from UV light and chemicals. The colored face
of the chip or sample should not be touched with bare hands.
5.3.2 Cosmetic Flaws Minor flaws that do not affect form fit or function shall [D1D2D3] be acceptable unless AABUS.
These include surface irregularities such as scratches, roughness, sandy finish, mottling or other variability, scuffs, stains, oil
spots, brush marks, sanding lines, rivet rings, spot weld craters, orange peel, polishing marks, waviness, edge build-up,
overspray, dirt specks, voids, pinholes, etc.
NOTE: Conversion coatings on aluminum, and other plated finishes are normally variable in color and uniformity, and these
are defects only when specified in engineering drawing or AABUS.
5.3.3 Inspection Acceptance shall [D1D2D3] be determined by visual inspection at a distance of approximately 45.72 cm
[18 in] with the unaided eye (see Table 1-3). Appearance items which require concentrated study to detect are not consid-
ered defects.
5.4 Performance Requirements The final finish shall [D1D2D3] meet any specified performance requirements (e.g., salt
fog).
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and stripping.
3
f. Threaded fasteners shall [D1D2D3] be seated with mating surfaces, with
no gaps between hardware and the mating surfaces.
4
g. Flathead/countersunk screws shall not [D1D2D3] protrude above the
2
mounting surface.
3
h. Hardware shall [D1D2D3] be torqued as specified on the engineering
drawing and in accordance with 6.1.1.
i. Hardware sequence (e.g., torque pattern) shall [D1D2D3] be in accor- 4
dance with 6.1.2.
1
IPC-630-6-2
6.1.1 Torque The amount of torque applied establishes the preload in the
fastener and the joint clamping force. Incorrect preload may result in static Figure 6-2 Hardware Installation Order
1. Lock washer
or fatigue failure of the fastener, joint slip, or separation.
2. Flat washer
The manufacturer shall [N1D2D3] have necessary procedures to ensure 3. Nonconductive material (laminate, etc.)
4. Metal (not conductive pattern or foil)
proper torque methods and application using calibrated tools.
The torque applied at final assembly (installation torque, see 1.7.6) shall [N1D2D3] include prevailing torque (see 1.7.9),
if required, and specified torque (see 1.7.13).
If there is no specified torque, manufacturer defined standard torque values shall [N1D2D3] be used. For more information
on torque, refer to IPC-HDBK-630.
Threaded fasteners which have been over-torqued shall [N1D2D3] be removed and discarded.
There shall [N1D2D3] be a documented process for torquing of threaded fasteners, including, but not limited to, standard
torque values (when not specified in engineering drawings), requirements, procedures, quality assurance provisions and tool
control.
6.1.2 Hardware Installation Sequence/Torque Pattern The objective of following a strict hardware installation sequence
(e.g., torque pattern) is to ensure that the resulting assembly is evenly loaded. An evenly loaded assembly will be more
resistant to hardware loosening from vibration.
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RIVET MATERIAL PART NO. HEAD MARKINGS PART NO. HEAD MARKING
Alum. alloy 5056 H32 MS 20470B Raised cross MS 20426B Raised cross
CRES 347 AN 123151 thru 123300 Plain AN 123451 thru 123600 Plain
Inconel 600 AN 123301 thru 123450 Plain AN 123601 thru 123728 Plain
CRES A-286 NAS 1198 Raised offset teat NAS 1199 Raised offset teat
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6.3.2 Conventional Rivets Conventional rivets shall [N1D2D3] be installed by stationary or portable squeeze equipment
wherever possible. If rivet guns and bucking bars are used, rivets should be formed with as few blows as possible.
Unless drawings show the direction of driving, the driven head shall [N1D2D3] be formed against the thicker sheet or harder
metal.
The driven rivet shall [N1D2D3] completely fill the hole. Peening of the driven head by rolling the bucking bar is not per-
mitted since the rivet hole will not be filled.
All rivets in sand cast materials shall [D1D2D3] be squeeze driven.
6.3.3 Blind Rivets Holes shall [D1D2D3] be in alignment prior to installation. Forcing of rivets into holes is not permit-
ted.
6.3.4 Specialized Rivets Specialized rivets shall [D1D2D3] be installed in accordance with rivet manufacturer’s
instructions.
6.3.5.1.1 Dimples Riveted assemblies shall not [N1D2D3] have cracked dimples. Dimples shall not [N1D2D3] be
eccentric or oversized.
6.3.5.1.2 Diameter and Height Diameter and height of the driven head shall [N1D2D3] be within the maximum and
minimum limits given in Table 6-2 and illustrated in Figures 6-8 and 6-9. As an exception for orbital riveted parts, at mini-
mum, the periphery of the hole shall not [N1D2D3] be visible (i.e., the requirement for diameter need not be met at the
riveted surface).
Table 6-2 Dimensions of Driven/Shop Formed Head (mm [Inches])
RIVET DIAMETER DIAMETER HEIGHT
1.57 [0.062] 2.74 [0.108] – 2.39 [0.094] 1.17 [0.046] – 0.53 [0.021]
2.39 [0.094] 3.92 [0.156] – 3.18 [0.125] 1.57 [0.062] – 0.79 [0.031]
3.18 [0.125] 5.16 [0.203] – 3.92 [0.156] 1.98 [0.078] – 1.19 [0.047]
3.92 [0.156] 6.73 [0.265] – 5.16 [0.203] 2.64 [0.104] – 1.19 [0.047]
4.75 [0.187] 7.62 [0.312] – 5.94 [0.234] 3.18 [0.125] – 1.60 [0.063]
6.35 [0.250] 10.97 [0.423] – 7.62 [0.312] 4.37 [0.172] – 1.98 [0.078]
7.62 [0.312] 13.08 [0.515] – 8.66 [0.341] 5.16 [0.203] – 2.74 [0.108]
9.53 [0.375] 15.88 [0.625] – 11.91 [0.469] 6.35 [0.250] – 3.18 [0.125]
A C A C
B B
IPC-630-6-8 IPC-630-6-9
Figure 6-8 Dimensions of Driven/Shop-Formed Head – Figure 6-9 Dimensions of Driven/Shop-Formed Head –
Universal Flush
A. Height A. Height
B. Diameter B. Diameter
C. Contour may be as shown by broken line if orbital riveter is used C. Contour may be as shown by broken line if orbital riveter is used
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Target – Class 2, 3
• No malformed rivets.
Acceptable – Class 2, 3
• Driven head of rivet tangent to the shank (see Figure 6-12).
IPC-630-6-12
6.3.5.1.5 Cracks
Target – Class 2, 3
• No cracks.
• Fine cracks located on / around the periphery of the shop Figure 6-13 Driven/Shop-Formed Head Concentricity –
formed head in which the following criteria is not exceeded Defect
(see Figure 6-14):
– Maximum depth of any crack does not exceed 1⁄8 of the C
nominal shank diameter.
– Maximum width of any crack does not exceed 1⁄16 of nomi-
A
nal shank diameter.
– Cracks running in an approximately radial direction do not
B
extend within a concentric circle which is 10% greater
IPC-630-6-14
than the nominal shank and providing cracks are not such
as to be a potential cause for a piece of the rivet to chip Figure 6-14 Cracks in Driven/Shop-Formed Heads
A. Width
off.
B. Depth
C. 10% greater than rivet shank diameter
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Defect – Class 2, 3
• Fine cracks located on / around the periphery of the shop
formed head in which the following criteria is exceeded:
– Maximum depth of any crack exceeds 1⁄8 of the nominal
shank diameter.
– Maximum width of any crack exceeds 1⁄16 of nominal
shank diameter.
IPC-630-6-15
– Cracks running in an approximately radial direction that
extend within a concentric circle which is 10% greater Figure 6-15 Cracks in Driven/Shop-Formed Heads –
than the nominal shank and providing cracks are such as Defect 2, 3
to be a potential cause for a piece of the rivet to chip off.
• Wedge shape cracks in the periphery of the shop formed
head (see Figure 6-15).
• Cracks that may permit a chip to fall out.
• Cracks in any other area (see Figure 6-16).
Target – Class 2, 3
• No marring.
Defect – Class 2, 3
• Ringed head on solid rivet (see Figure 6-17-A).
• Marred / cut head on solid rivet with depth exceeding 1⁄4 of A
head height (see Figure 6-17-B).
• Marred / cut head on flush rivet (not shown).
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6.3.5.2.4 Head Height – Flush Rivets Unless otherwise specified, heads of flush type rivets shall not [N1D2D3] project
more than 0.0508 mm [0.002 in] above the sheet surface. Installed rivets shall not [N1D2D3] be able to be rotated by fin-
ger pressure.
Target – Class 2, 3
• No sheet deformation or damage.
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• Edge gaps less than or equal to 0.38 mm [0.015 in] (see Fig-
ure 6-25).
• Bulging of the sheet perpendicular to the rivet shank less A
than or equal to 0.127 mm [0.005 in] (see Figure 6-26).
Defect – Class 2, 3
• Open seams greater than 0.76 mm [0.003 in] (see Figure IPC-630-6-24
6-25).
• Bulging of the sheet perpendicular to the rivet shank greater
than 0.127 mm [0.005 in] (see Figure 6-26). 0.015 max.
IPC-630-6-26
IPC-630-6-27
IPC-630-6-28
Figure 6-27 Sheet Expanded Internally
Figure 6-28 Sheet Injured by Rivet Gun or Trim Flush
Shaver
0.005 max.
IPC-630-6-29
IPC-630-6-30
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7 MARKING/LABELING
For the purposes of this section, marking and labeling (including labels and nameplates) are referred to as marking.
Examples of the markings addressed by this section include, but not limited to the following:
a. Manufacturer identification name/logo.
b. Part numbers/name/national stock number (NSN) and revision level.
c. Unique individual serial number.
d. Date code.
e. Safety & ESD labels.
f. Relevant regulatory agencies’ certification labels.
g. Voltages.
h. Application and/or user markings (installation or user information).
i. Quality and test acceptance label/marking.
j. Reference designators (connector identification).
Additional (non-required) information may be marked onto the product for internal purposes. This marking is not subject to
the provisions of this section, provided that:
a. The marking does not conflict with, and is separated from, required information.
b. Prior to delivery nonpermanent internal markings should be removed for Class 2 and shall [N1N2D3] be removed for
Class 3 products.
7.1 Marking Acceptability Requirements The following requirements apply to markings applied by the manufacturer
(assembler).
7.1.1 General Electronic enclosures shall [D1D2D3] be marked as required on the engineering drawing or AABUS.
Manufacturing processes (e.g., cleaning) shall [N1D2D3] be compatible with marking methods and materials.
Marking materials shall [N1D2D3] be defined by the engineering drawing.
7.1.2 Surface Preparation All surfaces to be marked shall [N1D2D3] be clean and free from grease, dirt, flux and other
contaminants. Cleaning requirements of 4.1 apply.
Before bonding adhesive-backed labels and nameplates to smooth surfaces, the substrate surface may be lightly abraded to
improve adhesion.
7.1.3 Location Markings shall [D1D2D3] be positioned in accordance with the engineering drawing. If no position is
specified, the marking shall [D1D2D3] be AABUS.
Unless otherwise specified, markings shall not [N1D2D3] traverse or cover components or electrical connections.
7.1.4 Curing and Adhesion Marking inks shall [N1D2D3] be applied and cured per documented procedures. After cur-
ing, marking inks shall [N1D2D3] be tack free.
Labels shall [D1D2D3] comply with the adhesion requirements. Labels shall not [N1D2D3] be peeled more than 10% of
the label area.
After bonding adhesive-backed labels and nameplates, there shall not [N1D2D3] be any entrapped air bubbles beneath the
label or nameplate.
7.1.5 Content, Legibility and Permanency Regardless of marking method used, markings shall [D1D2D3] contain the
required information, be legible, be permanent in the intended application and shall not [D1D2D3] damage the product nor
impair its function.
Laser marking depth should be sufficient to easily read but shall not [D1D2D3] damage the enclosure to the extent that the
marking may impair its function (e.g., structural integrity) or reliability (e.g., corrosion susceptibility).
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SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
Required markings shall not [N1D2D3] be deliberately altered, obliterated or removed unless required by the engineering
drawing/assembly documentation. Required marking shall not [D1D2D3] be missing. There shall [D1D2D3] be no missing
or illegible characters in the markings. There shall not [D1D2D3] be any double images.
Marking shall [N1D2D3] be human or machine readable (e.g., bar code). Recommended minimum character should be
2 mm [0.079 in] or 5.67 point character height. Machine readable marking shall [N1D2D3] be successfully read within three
(3) attempts using a scanner.
7.2 Internal Assemblies and Subassemblies Internal assemblies and subassemblies shall [N1D2D3] be marked as
required on the engineering drawings. If no internal assembly or subassembly marking requirements are specified, markings
shall [N1D2D3] meet the requirements of IPC-A-610 for soldered electronic and electrical assemblies and IPC/WHMA-A-
620 for cable and wire harness assemblies. Requirements for original markings on components, wires, or other procured
items are AABUS.
8 TESTING/VERIFICATION
The manufacturer shall [D1D2D3] perform all required testing. Test results shall [D1D2D3] meet user requirements. Test
records and retention shall [D1D2D3] be maintained AABUS.
NOTE: Some testing/verification may also be performed at a lower level for subassemblies (e.g., dielectric withstanding
voltage).
Nondestructive tests (procedure/parameters/stimuli/fixtures) shall [D1D2D3] be selected and applied in a manner that does
not cause damage to the unit under test.
In the event a rework or repair action takes place, any tests/inspections that were previously performed shall [D1D2D3] be
repeated in their entirety for the portion of the product that was affected by the rework or repair.
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SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
• Use the IPC member logo to highlight your company’s leadership in the
industry.
• Build your brand visibility through IPC’s Products and Services Index (PCB and
EMS companies only), and IPC’s annual trade shows and conferences, including
IPC APEX EXPO.
• Gain valuable exposure by sponsoring market research conferences and
executive management meetings.
®
Application for Site Membership
Thank you for your decision to join IPC. Membership is site specific, which means that IPC member benefits are
available to all individuals employed at the site designated on this application.
To best serve your specific needs, please indicate the most appropriate member category for your facility.
(Check one box only.)
__________________________________________________________________________________________________
___________________________________________________________________________________________________
___________________________________________________________________________________________________
o Industry Supplier
Facility supplies raw materials, equipment or services used in the manufacture or assembly of electronic products.
Which industry segment(s) do you supply? o PCB o EMS o Both o Printed electronics
o Consulting Firm
What services does the firm provide?_____________________________________________________________________
___________________________________________________________________________________________________
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
Association Connecting Electronics Industries
®
Application for Site Membership
Site Information
Company Name
Street Address
Authorized Signature
*Fax/Mail application with credit card payment to: Please attach b usiness card
3000 Lakeside Drive, Suite 309 S
of primary contact here
Bannockburn, IL 60015
Tel: +1 847-615-7100
Fax: +1 847-615-7105
www.ipc.org
Submitted by:
Name Telephone
Company E-mail
Address
City/State/Zip Date
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
ISBN #978-1-61193-113-6