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    This document contains images of different types of electronic components and packaging. It asks the reader to identify (A) the type of lead or contact shown in each image and (B) the chip package shown in each image. The images show components with bat wing, C-bend, surface mount J lead, TO220 heatsink, and I-lead contacts. The chip packages shown include ball grid array, in-line package, quad flat pack, pin grid array, 9-lead multi-leaded power package, and in-line package. The purpose is to teach identification of electronic components and their packages.

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    This document contains images of different types of electronic components and packaging. It asks the reader to identify (A) the type of lead or contact shown in each image and (B) the chip package shown in each image. The images show components with bat wing, C-bend, surface mount J lead, TO220 heatsink, and I-lead contacts. The chip packages shown include ball grid array, in-line package, quad flat pack, pin grid array, 9-lead multi-leaded power package, and in-line package. The purpose is to teach identification of electronic components and their packages.

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    3 views2 pages

    05 Act Halop

    Uploaded by

    qq2y7jkg4h
    This document contains images of different types of electronic components and packaging. It asks the reader to identify (A) the type of lead or contact shown in each image and (B) the chip package shown in each image. The images show components with bat wing, C-bend, surface mount J lead, TO220 heatsink, and I-lead contacts. The chip packages shown include ball grid array, in-line package, quad flat pack, pin grid array, 9-lead multi-leaded power package, and in-line package. The purpose is to teach identification of electronic components and their packages.

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    © All Rights Reserved
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    of 2

    05 Introduction to Circuit Simulation (Midterm)

    05 Activity 1 – ARG
    Christian Placibe
    BSCPE 501
    A. Determine the type of lead/contact shown in each of the picture below.

    M27C64A-1OF1
    OR
    BAT WING

    C-BEND
    OR
    SURFACE MOUTN J LEAD COMPONENT

    TO220 HEATSINK

    I-LEAD
    OR
    Integrated in early RCA flat ceramic package

    ATMega328 in a TQFP
    package Or
    Exposed Pad

    This study source was downloaded by 100000874167150 from CourseHero.com on 10-25-2023 20:08:46 GMT -05:00

    https://www.coursehero.com/file/181360875/05-Introduction-to-Circuit-Simulation-05-Activity-1-ARGdocx/
    B. Identify the chip package shown in each image.

    BALL GRID ARRAY (BGA)

    IN-LINE PACKAGE (IP)

    QUAD FLAT PACK (QFP)

    PIN GRID ARRAY (PGA)

    9-LEAD MULTI-LEADED POWER


    PACKAGE
    OR
    IC TDA4601
    IN-LINE PACKAGE (IP)

    This study source was downloaded by 100000874167150 from CourseHero.com on 10-25-2023 20:08:46 GMT -05:00

    https://www.coursehero.com/file/181360875/05-Introduction-to-Circuit-Simulation-05-Activity-1-ARGdocx/

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