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How Thick is 3 oz Copper in PCB?


3 Oz Copper PCB , 105Micron ( 4.1339 Mil ) , When a design use 3 oz

copper , We can call it heavy copper PCB . If base copper is 3oz , then

completed copper will be 4 oz, for multi-layer , Inner 3 oz , the final will be

3oz, When do 3 oz PCB manufacturing, We need take care the solder

mask , because the thick solder mask will flow .

Table of Contents

Introduction

Printed circuit boards (PCBs) form the backbone of electronics, providing

mechanical support and electrical connectivity for components. PCB

copper thickness is a key design parameter that affects current capacity,

electrical/thermal performance and manufacturability.

While 1 oz copper has been the traditional standard thickness, 3 oz copper

boards are being increasingly adopted for high power and performance

designs needing thicker conductors. In this article, we will look at what 3

oz copper PCB thickness means, how it compares to other copper weights,

its applications and advantages, and the design considerations when

working with 3 oz copper boards.

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What Does 3 oz Copper Mean?

PCB copper thickness is specified by weight in terms of ounces per square

foot (oz/ft2). This refers to the amount of copper foil weight present in one

square foot of board area, excluding the fiberglass dielectric substrate

weight.

Some common PCB copper weights are:

 1/2 oz – 0.5 oz/ft2 (17 μm)

 1 oz – 1 oz/ft2 (35 μm)

 2 oz – 2 oz/ft2 (70 μm)

 3 oz – 3 oz/ft2 (105 μm)

 4 oz – 4 oz/ft2 (140 μm)

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So a 3 oz copper PCB has around 3 ounces of copper foil per square foot

on each metal layer. In terms of thickness, 3 oz copper equals

approximately:

 105 μm (micrometers)

 4.2 mil (thousandths of an inch)

 0.105 mm (millimeters)

This is over 3x thicker than standard 1 oz foil.

Why Use Thicker 3 oz Copper?

The trend towards 3 oz copper PCBs is being driven by several factors:

 Higher current capacity – The thicker copper can handle over 3

times the current compared to 1 oz material without overheating.

This enables higher power PCBs.

 Lower losses – Increased copper mass reduces resistive losses and

voltage drops across traces. This improves electrical efficiency.

 Thermal performance – The excellent thermal conductivity of

copper spreads heat over larger board area, keeping components

cooler.

 Finer lines and spaces – 3 oz copper allows very fine trace

geometries and clearances for dense SMT boards.

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 High frequency/high speed – Thicker traces reduce impedance

mismatch and electromagnetic radiation for faster circuits.

 Reliability – Heavier copper is more resistant to thermal stress,

electromigration and corrosion over product lifetime.

 High current components – New power devices often need PCBs

exceeding 2 oz copper thickness.

For such reasons, 3 oz copper provides clear advantages over thinner foils

in appropriate applications.

Applications Suited for 3 oz Copper PCBs

Some examples of products and systems that can benefit from upgrading

to 3 oz copper thickness include:

 High power motor drives – Thick 3 oz layers handle large motor

phase currents without overheating.

 Electric vehicle electronics – Low loss and current capacity aid

powertrain and battery management systems.

 Power converters – Enhanced thermal dissipation rating and

ampacity rating in AC-DC and DC-DC converters.

 Power amplifiers – RF power amps for communications systems

need low loss boards to minimize distortion.

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 Server/telecom hardware – High speed backplanes and data

storage devices require thicker conductors.

 Medical equipment – Critical devices like MRI scanners and surgical

systems demand maximum reliability under all conditions.

 Defense electronics – Mission-critical systems in extreme

environments are designed with 3+ oz copper for ruggedness.

 Solar inverters – High currents handled with low losses and lower

layer counts.

 LED lighting – Operating at elevated temperatures, thick copper

PCBs keep LEDs cool and efficient.

For such demanding applications, 3 oz copper provides greater

robustness, performance margin and long-term reliability versus standard

1-2 oz foils.

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Key Benefits of 3 oz Copper PCBs

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The advantages of increasing copper thickness from 1 oz to 3 oz include:

1. Lower Electrical Resistance

Copper’s resistivity is 1.72 x 10<sup>-6</sup> ohm-cm. Increasing

cross-section area by using thicker copper lowers resistance

proportionally. The 3 oz foil offers about 3 times lower trace

resistance than 1 oz material:

Trace Width 1 oz Resistance 3 oz Resistance Resist


10 mil 19.8 mΩ/inch 6.6 mΩ/inch ~67% lower
5 mil 39.6 mΩ/inch 13.2 mΩ/inch ~67% lower
3 mil 66 mΩ/inch 22 mΩ/inch ~67% lower
2 mil 99 mΩ/inch 33 mΩ/inch ~67% lower
1 mil 198 mΩ/inch 66 mΩ/inch ~67% lower

(Assuming standard 1.4 mil trace thickness. Table values approximate.)

Lower resistance minimizes undesirable power losses on the PCB due to

I<sup>2</sup>R heating and IR voltage drops. This maximizes electrical

efficiency.

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2. Increased Current Carrying Capacity

For a given temperature rise, trace current handling capacity increases in

proportion to the square root of the copper cross-sectional area.

Going from 1 oz to 3 oz thick copper almost triples the allowable current

density. For example, a common 10 mil wide trace can handle:

 1 oz: ~1.2 A

 3 oz: ~3 A

This expanded ampacity matches the higher current loads of modern

power electronics. A board’s power handling capability is increased

without needing more layers.

3. Improved Electromagnetic Shielding

With trace signals becoming faster in high speed digital designs,

containing electromagnetic interference (EMI) is critical.

A solid plane or enclosure of thick copper foil provides superior shielding

and isolation against radiated EMI compared to thinner material. 3 oz

copper is very effective at blocking interfering fields.

4. Enhanced Thermal Performance

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Copper is the PCB conductor of choice due to its excellent thermal

conductivity (385 W/m-K). This rapidly conducts heat away from hot spots

to cooler areas.

Increasing copper thickness reduces the thermal resistance between

components and board layers. This results in lower component

temperatures for the same heat dissipation levels.

5. Finer Line Resolution and Spacing

The thicker 3 oz copper allows reliably etching very fine trace widths and

clearances down to ~2 mils.

This high density interconnect capability supports complex routing in

compact PCBs and integrating tiny chip components with fine lead pitches.

6. Lower Inductance Wiring

At higher frequencies, conductors exhibit self-inductance which opposes

changes in current. Thicker traces reduce this inductance which otherwise

can distort signals.

3 oz copper wiring has about 3x lower inductance than an equivalent 1 oz

trace. This enhances high frequency AC performance.

7. Improved Signal Integrity

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Electrical transmission line effects like reflections become significant at

higher speeds and frequencies.

Thicker 3 oz traces better match characteristic impedances. Along with

lower overall resistance and inductance, this reduces signal degradation in

high speed channels.

8. Lower Layer Counts Possible

By carrying more current on outer layers, 3 oz copper may permit using

fewer inner layers for power distribution on some designs. But enough

should be retained for shielding.

9. Long-Term Reliability

Thicker copper is inherently more resistant to thermal stresses,

electromigration, corrosion, and physical damage. This enhances PCB

durability over product lifetime.

Reliability is especially critical for automotive, medical, military and

aerospace applications where failure is not an option.

Comparison of 3 oz to Standard 1 oz Copper

Here is a summary comparison between typical 1 oz and 3 oz PCB

material properties:

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Parameter 1 oz Copper 3 oz Co
Copper Thickness 1 oz/ft2 (35 μm) 3 oz/ft2 (105 μm)
Trace Resistance Higher ~65% lower
Current Capacity Lower ~2.5x higher
Inductance Higher ~2x lower
Thermal Conduction Moderate Improved
EMI Shielding Fair Excellent attenuati
Fine Line Capability 3-4 mil lines/spaces 2-3 mil lines/space
Reliability Moderate Enhanced
Cost Lower Moderately higher

So for high power, high frequency or mission-critical applications, 3 oz

copper provides substantially improved performance over standard 1 oz

foil.

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Design Guidelines for 3 oz Copper

To fully utilize the benefits of 3 oz copper in a design, engineers should

follow certain PCB layout practices:

 Employ minimum trace widths based on actual current needs rather

than oversizing out of habit.

 Use space made available for tighter component placement and

routing density. But observe spacing rules.

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 Limit the length of low-amplitude high frequency traces as much as

possible.

 Watch for acid traps and spacing violations from tighter lines and

spaces.

 Increase the number of small vias used for connections instead of

fewer larger holes.

 Ensure adequate thermal reliefs for leads, but remove for pads/vias

if suitable.

 Add more copper fills for thermal and EMI shielding purposes if

appropriate.

 In power planes, minimize cut-outs and splits which increase

inductance.

 Account for possible manufacturer inspection issues with very fine

geometries.

 Refine clearance grids, design rules and DFMs to match 3 oz

capabilities.

 Watch for and correct acid traps, necking and over-etching of fine

features.

With careful design practises tailored to the capabilities of 3 oz copper,

PCB engineers can maximize the benefits of this thick copper technology

for their specific application needs.

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Frequently Asked Questions

Q1. Can 3 oz copper be used for multilayer boards?

Yes, 3 oz copper foils are commonly used on multilayer PCBs. The

lamination process can accommodate the thickness.

Q2. Are there special drill requirements for 3 oz copper?

Laser drills are typically used for all multilayer boards regardless of copper

thickness. Mechanical drills above 0.3mm are suitable.

Q3. Does solder mask adhesion change on 3 oz copper?

There is minimal effect on solder mask adhesion between different

copper weights. The chemical bond to copper remains the same.

Q4. Does 3 oz copper withstand soldering heat?

Yes, soldering temperatures are well below the melting point of copper.

The thicker 3 oz copper is more thermally stable against soldering

exposure.

Q5. Is 3 oz copper readily available from manufacturers?

As 3 oz copper gains adoption, more PCB suppliers offer quick turnaround

capability in 3 oz material at reasonable costs.

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Conclusion

With its 3X thickness over standard 1 oz foils, 3 oz copper provides

substantially increased current capacity, finer features, lower losses,

improved thermal management, enhanced reliability and superior EMI

control. These benefits make 3 oz copper the material of choice for

leading edge high-performance and high-reliability electronics. To fully

leverage 3 oz copper’s capabilities, engineers must follow disciplined

layout and design practises tailored to the finer geometries and higher

densities achievable. When designed properly, 3 oz copper PCB

technology enables electronics to meet the demands of today as well as

the future.

Related Posts:

1. How Thick is the Copper on a 1 oz Copper PCB in mm?

2. How Thick is the 5oz PCB?

3. How Thick Should a PCB be?

4. How is Thick 0.093 Inches? An In-Depth Look

https://www.raypcb.com/3-oz-copper-pcb/

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