Microfluidics and its Applications

Micro Fluidics and its Applications

BITS F417 / ME F423

Dr. Satish Kumar Dubey

Mechanical Engineering Department
BITS Pilani
Hyderabad Campus
 BITS Pilani
Hyderabad Campus

Introduction to Microfluidics
 BITS Pilani
Hyderabad Campus

Handout
Introduction

• Course No. : BITS F417 / ME F423

• Course Title : Microfluidics and its
Applications
• Instructor : Dr. Satish Kumar Dubey
and Dr. Sanket Goel

4 BITS Pilani, Hyderabad Campus

Introduction

Scope and Objective of the Course:

Introduction to microfluidics, scaling in microfluidics,

theoretical microfluidics, Philosophy of Computational
Fluid Dynamics, Concepts of discretization, fabrication
techniques for microfluidic devices, micro valves, micro
pumps, micro flow sensors, microfluidics for life
sciences: micromixers, microneedles, micro filters, micro
separators, micro reactors, modeling and simulation on
CAD tool.

5 BITS Pilani, Hyderabad Campus

Introduction

Text Book:
Fundamentals and applications of microfluidics by Nam-
Trung Nguyen and Steven T. Wereley, Artech House,
2002.
Reference Books:
Introduction to Microfluidics, by Patrick Tabeling, Oxford
University Press, 2005.
Theoretical Microfluidcs, by Henrik Bruus, Oxford Master
Series in Condensed Matter Physics, 2008.
Microfluidics Fundamentals, Devices and Applications,
Edited by Yujun Song, Daojian Cheng, and Liang Zhao,
Wiley 2018.

6 BITS Pilani, Hyderabad Campus

Course Plan:
# Learning Objectives Topic Lectures Chap. Sec.
1 Introduction to Microfluidics Physics at the microscale, role of 2 T Ch 1
various intermolecular forces.
2 Dimensional analysis and scaling To understand fluid flow in 4 T Ch 2
laws to understand fluid flow Microfluidic domain. Navier-Stokes
equation and application to obtain
certain exact solutions.
3 Diffusion, mixing and separation Analysis of dispersion phenomena, 3 R1 Ch 4
of fluids in Microsystems Passive and active mixing, Chaotic R2 Ch 5
mixing, Hydrodynamics of
microfluidic systems, bubbles,
droplets
4 Electrohydrodynamics of Electro-osmosis, Electrophoresis, 3 R1 Ch 5
microsystems Dielectrophoresis, Magnetophoresis R2 Ch 8-11

5 Introduction to flow simulation Meshing, discretization and 3 R3 Ch 4

simulation using relevant software
6 Introduction to microfabrication Photolithography- etching – 3 T Ch 3
techniques embossing, Soft-lithographic R1 Ch 7
patterning, mask design, surface
modification.
7 Various detection mechanisms in Electrical, Amperometric, 4 Notes
Microfluidics Electrochemical, High-Speed,
Colorometric, Fluorescence,
Chemiluminiscence,
Bioluminiscence

7 BITS Pilani, Hyderabad Campus

 Course Plan

8 Characterization of Optical & Electronic 3 Notes

Microfluidic Devices Microscope, Profilometers,
Scanning Probe Microscopy,
Raman Spectroscopy, UV VIS
Spectroscopy, Confocal
Microscopy
9 Microfluidic Experimental flow Micro PIV, Fluorescent 2 T Ch 5
characterization and External microscopy Velocity and
Flow Control Laminar flow measurement and
its control
10 Microfluidics for Internal Flow Micro valves, Micro pumps, 2 T Ch 6, 7, & 8
Control Micromixers, Micro flow
Sensors
11 Ancillary areas of Microfluidics Digital Microfluidics, Thermo 3 R2, Ch 12, 15,
fluidics, Optofluidics, Nano 16, 17
fluidics, Acoustofluidics R3, Ch 5
12 Application of Microfluidics I Biomedical applications 4 Notes
Biomedical
13 Application of Microfluidics II Biochemical applications 4 Notes

8 BITS Pilani, Hyderabad Campus

Evaluation Scheme

Weightage

Component Duration % Marks Date &Time Remarks

Midterm 1Hr30m 20 60 Closed
Book
Comprehensiv 3 Hr. 30 90 Closed
e Exam Book
Quizzes 10 30 During Lecture Closed
Book
Lab 20 60 Open
Book
Project 20 60 To be announced Open
Book
Total 100 300

9 BITS Pilani, Hyderabad Campus

Lab Experiments
1. Introduction to the software COMSOL and its application in
Microfluidics
2. Simulation of Microfluidic Sensors using COMSOL
3. Microfluidic simulations using COMSOL: Laminar Flow; Convection
diffusion; Conjugate heat transfer
4. Development of Micro-device using FDM based 3D printer.
5. Study the customized filament making for FDM 3D printer
6. Development of Micro-device with the photolithography process
using dry film photoresist
7. Development of Micro-device using poly-di-methyl-siloxane
(PDMS) based Soft-lithography
8. Development of paper Micro-device using solid wax printer
9. Study of Scanning Electron Microscopy
10. Understanding of Clean room and Electron Beam Deposition
Website (www.mmne.in) [MEMS, Microfluidics and Nanoelectronics Lab]
https://universe.bits-pilani.ac.in/hyderabad/cleanroom/cleanroom
https://www.bits-
pilani.ac.in/hyderabad/CentralAnalyticalLaboratory
10 BITS Pilani, Hyderabad Campus
General Information

6. Chamber Consultation Hour: T 10 Hr E-205

7. Make-up Policy: There will no make-ups unless for
genuine reasons. Prior Permission of the Instructor-in-
Charge is required to take a make-up for any
component.

8. Notices: CMS

11 BITS Pilani, Hyderabad Campus

 Facilities @ BITS (1/2)
Micro/Nanofabrication Micro/Nanofabrication
• Thermal Evaporation • Soft-lithography
• Photolithography o Hot Air Oven
o Lamination mask o Desiccator
maker o Plasma Cleaner with
o Laminator Vacuum Pump
o Spin Coater, Hot Plate • Paper-based device
o UV exposure unit o Solid Ink Wax printer
• 3D printing o Cutting plotter
o Stereolithography
o Fused Deposition
Modelling – FDM
• PCB Printer
• CO2 Laser
12 BITS Pilani, Hyderabad Campus
 Facilities @ BITS (2/2)
Testing
• Fumehood
• Pipettes Set
• Digital Viscometer
• Miniature Peristaltic pump
• Micro-pumps
• Conductivity and pH meter
• Photomultiplier tube
• Digital agitator cum stirrer
• USB Data acquisition
system
Characterization
• Fluorescence, Digital
Microscope
• High Speed Camera
• Electrochemical
Workstation
• Four-probe station
• Common Facilities (XRD,
DSC, TGA, SEM, XPS,
FTIR, Spectrometer etc)
Simulation
• COMSOL
• Matlab
• AutoCAD
13 BITS Pilani, Hyderabad Campus
 Fabrication Facility

• Facility Location : E 209

• Size: 581 Sq. F (80 % class
1000 and 20% class 100)
• Temperature range : 18-22 oC
• Humidity : 48% to 52%

•Wet station
•Physical vapor
deposition tool
•Oxidation and annealing
furnaces
•U.V. exposure System
•Electrical
characterization tool
A class 100 cleanroom maintains less than one hundred particles larger
than 0.5 microns in each cubic foot of air space.
A class 1000 cleanroom has less than 1000 such particles per cubic foot.
14 BITS Pilani, Hyderabad Campus
Air shower

Air showers are specialized enclosed antechambers which are incorporated

as entryways of cleanrooms and other controlled environments to reduce
particle contamination. Air showers utilize high-pressure, HEPA- (High-
efficiency particulate air) filtered air to remove dust, fibrous lint and other
contaminants from personnel or object surfaces.
BITS Pilani, Deemed to be University under Section 3 of UGC Act, 1956
 Wet station

Applications
• RCA Process
• Piranha Process
• Development process
• Wet etch
• Glass/PET substrate
cleaning
• Incoming wafer surface have organic
and inorganic residues on it, before
going into device fabrication on those
wafers one should do RCA process to
remove contaminants
•Rinse/ used DI water will be drained
• All the other chemicals collected in used bottles and will have to do third party disposal .

Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio
Corporation of America
Piranha solution, also known as piranha etch, is a mixture of sulfuric acid (H2SO4)
and hydrogen peroxide (H2O2), used to clean organic residues off substrates.
16 BITS Pilani, Hyderabad Campus
2-Inch furnaces capabilities
Tools/specs Dry oxidation N2 annealing General
purpose CDA

Deposition SiO2 NA
materials
Type of Si, Si, Other Si & Other
Substrates substrates on substrates on
case by case case by case
approval approval

Deposition Up to 1000 Up to 1000 450 deg. C

Temp. deg. C deg. C

Gases Allowed O2, N2 N2 N2 95%+H2

5%, Ar.
Substrate size 2” 2” 2”

17 BITS Pilani, Hyderabad Campus

2-Inch furnaces capabilities

2 inch furnaces
18 BITS Pilani, Hyderabad Campus
Metallization by electron beam
evaporator
Tool/ E beam evaporator
specs
Materials to All metals except high
melting point materials like
deposit W, Pt and other ceramics

Sample size small sample –up to 4

inch

Base vacuum 5 X 10^_6 m bar

Substrate RT
Temp.
Substrate Si , quartz ,ITO AND
allowed FTO glass
•In-situ thickness measurement by quartz
crystal
•Maximum thickness up to 200 nm
recommended
19 BITS Pilani, Hyderabad Campus
U V exposure equipment

• U V light by LED lamps or other halogen lamps

uniformly over 100 mm X 200 mm area.
• Can be used for curing materials
• Used for level one Lithography

20 BITS Pilani, Hyderabad Campus

U V exposure equipment

Technical Specifications:
Range of UV : 350 nm to 450 nm
Wave Length
Wattage of Lamp : Not more than 2 kW
Exposure Area : Min : 100 mm x 100 mm
Max : 200 mm x 200 mm
UV Exposure Unit will have a programmable time counter
and Mask and substrate will be held by Vacuum.
Note:
• If all features are above 50 microns we use Transparency masks can be
printed out side using laser printer
• Resolution need to be identified
• Only level one lithography is possible

21 BITS Pilani, Hyderabad Campus

Spin coater equipment
Spin Coating equipment used to coat the thin film material on top
of flat substrates often polymers, uniformly on flat substrates by
employing the concept of centrifugal force. The substrate needs
to be rotated at high speed to achieve the desired thickness of
the coating material

• Few nm to 250 micro

thickness possible

22 BITS Pilani, Hyderabad Campus

Probe station: electrical
characterization
Probe station is used to measure electrical properties of
semiconductor device . place the probe tips onto the correct
locations on the device by moving manipulators. Sweep the
voltage and acquire response by SMU (source measure unit)

23 BITS Pilani, Hyderabad Campus

 Mask aligner
Mask aligner is indispensable for patterning of deposited material
or etching unwanted material to fabricate actual devices or
prototypes.

New Equipment: Mask aligner execute

multi level lithography process.
 It allows to fabricate different size of
micro-channels and pattern surface
of the devices.
 Feature size can be minimized to 5
micron. (Solar cell, Memory devices,
MEMS, Micro fluidic flat form
applications, 2D materials, etc.)

Mask Aligner
24 BITS Pilani, Hyderabad Campus
 BITS Pilani
Hyderabad Campus

Microfluidics
Size characteristics of microfluidic devices

Nguyen, N. T., Wereley, S. T., & Shaegh, S. A. M. (2019). Fundamentals

and applications of microfluidics. Artech house.

26 BITS Pilani, Hyderabad Campus

MEMS, Micro System & Microfluidics

 Technology that can be defined as miniaturized mechanical and

electro-mechanical elements
 The physical dimensions of MEMS devices can vary from well
below one micron to several millimeters.
 MEMS devices can vary from relatively simple structures having
no moving elements, to extremely complex electromechanical
systems with multiple moving elements under the control of
integrated microelectronics.
Microfluidics
Microfluidics is the engineering or use of devices that apply fluid
flow to channels smaller than 1 millimetre in at least one
dimension. (not rigid to values…..
 Microfluidic devices can reduce reagent consumption, allow well
controlled mixing and particle manipulation, integrate and
automate multiple assays (known as lab-on-a-chip), and facilitate
imaging and tracking.

27 BITS Pilani, Hyderabad Campus

Why Miniaturization
 Required when
Modern Community demands for: application demands
 Intelligent very small volume :
 Multifunction ink jet printing, drug
 Robust
delivery, POC device.
 Low Cost Products
 Low power  Mimicking of bio
 Faster Device systems.
 Point of care/ source device  Improved
 Exploitation of scaling effects reproducibility
 Exploitation of new effects
 Cost and performance
 Minimum material and sample
advantage
Miniaturization is the feasible solution  Minimal invasive
to such demands  Self assembly and self
repair

28 BITS Pilani, Hyderabad Campus

Microfluidics: Interdisciplinary y Subject
 Micro fabrication
 Chemistry
 Biology
 Mechanics
 Control system
 Micro scale Physics and
Thermo-Fluid transport
 Numerical modelling and
simulation
 Material Science
 System integration and
packaging
 Validation experiments
 Reliability Engineering
 ……..
Applications
 Mixing and reactive system
 Fundamental
understanding of bio –
physical process .
 Manipulation and analysis
of bio molecules.
 Bio medical diagnostics
 Sensing/ sensors
 Energy harvesting .
 Drug delivery
 Electronic cooling
 Drug screening
29 BITS Pilani, Hyderabad Campus
 Microfluidics: Cradle to Grave

Design & Fabrication Detection Testing and

Simulation • Photolithography •
Characterization
Optical
(Si / Glass) • Generate
• Aim (colorimetric /
samples of
o Understand • Direct laser image)
various
Dependent writing • Luminescence parameters
Parameters (maskless) (chemi / bio) ratios for Testing
o Simulation to • Soft-lithography • Electrical • Analysis of flow
analyze (PDMS) (impedance / characteristics
practicality • Laser engraving amperometric) • Investigate
o Design finalization (PMMA) • Electrochemical possibility for
for fabrication and • Paper based • Electrochemilumi other
testing applications
• 3D printing nisence
• Tools: COMSOL, (various polymers)
Matlab, CATIA

Microfluidics: Process Value Chain

30
 BITS Pilani
Hyderabad Campus

Introduction to Microfluidic Modelling

Experimental Vs Modelling and Simulation
• Mathematical model in place of physical
model
• Classical mathematics does not
provides solutions of most of practical
problems mathematical models.
• Solutions available (If) are contains
infinite series, special functions ,
transcendental equations so their
numerical evaluations are very
complicated.
• Numerical methods developments and
availability of computers makes it
feasible to obtain approx.
(reasonable accurate) solution of
mathematical model of practical
interest.
Full scale equipment testing
Most reliable information
Expensive Impossible (In some
cases)
Small Scale models testing
Less expensive
Does not simulate all the feature
Results extrapolated
Less reliable results
Numerical method solvers:
 Finite Difference
 Finite Element
 Finite Volume Method.
32 BITS Pilani, Hyderabad Campus
Numerical method
Problem solution involves
• Applied Mathematics for problem formulation and
numerical analysis and programming

• Engineering / Sciences for problem formulation

visualization of results / data

• Computer Science numerical analysis programming and

visualization of results / data

Numerical method solvers:

• Finite Difference; Finite Element; Finite Volume
Method.
33 BITS Pilani, Hyderabad Campus
Continuum hypothesis for micro-fluidics
 Dependent on length scales
 Nano-meter scales: NO
 Micro-meter scales: Yes, but NO for Gas
 Influence on numerical method
 Nano-meter scales: non- continuum
 Micro- and meso-copic methods
 Micro-meter scales: continuum
 Macroscopic methods
 Micro-meter scales for gas: non- continuum
 Micro- and meso-copic methods
 Nano- to micro-meter scales
 Multi-scale modeling

34
 Modelling Approaches
Modelling approaches for microfluidic simulation
 Continuum Fluid Mechanics
 Molecular Approaches
 MD
 DSMC Technique  Small Characteristic length.

Kn 
L  Multi physics Simulation
VL
Re 

k Ma
Kn 
2 Re
VL
Pe 
 35
 Modelling Approaches
Modelling approaches for microfluidic simulation
 Continuum assumption fails for some range of parameters:
 Knudsen number for gas when Knudsen is larger than 0.1
 For liquids when fluid is sheared at faster than twice the characteristic molecular
interaction frequency
Molecular Approaches
Molecular Dynamics:
 Straight forward application of Newton’s second laws for each molecule.
 Collection of molecules distrusted in the space .
 Each molecules assigned random velocity, such that it follows Boltzmann
distributions
 Molecular velocities are integrated forward in time to arrive new molecular position.
 As per user desire velocity can be sampled, averaged to compute flow quantities.
Direct Simulation Monte Carlo (DSMC) Technique:
 DSMC is based on Kinetic theory of gas
 DSMC tracks the motion of hundreds of particles out of thousands or millions of
particles.
 It uncouples molecular motions from intermolecular collisions.
 Molecular motions are treated deterministically, while intermolecular collisions are
treated statistically

36