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copper traces from corrosion and ensure reliable solder joints, the
Preservatives).
Key Properties
Good wirebondability
1. Reliable Solderability
immersion gold.
layer.
Gold allows reliable lead-free soldering, unlike tin finishes which are
3. Corrosion Resistance
gold.
4. Halogen-free Formulations
The nickel and palladium base preserves the low contact resistance
of gold finishes.
7. Self-Limiting Thickness
salts.
ENE
Pros:
Cons:
Palladium is expensive
1. Lead-free Soldering
2. Automotive Electronics
outgassing.
4. Medical Electronics
Biocompatible finish.
7. Wire Bonding
Electrolytic Nickel Gold Strips nickel and activates for ENEPIG process
Immersion Gold Strips gold, activates nickel, then follows ENEPIG steps
Solder Mask Defined Selectively strip solder mask before plating ENEPIG
No. The top surface is pure gold, with palladium and nickel below it.
micron.
Yes, the gold outer layer of ENEPIG is highly solderable with both
soldering processes, unlike PCB finishes like OSP which have poor heat
resistance.
Related Posts:
https://www.raypcb.com/why-choose-enepig-pcb/