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Lead Free Solder Vs Lead Solder: Which is Better?

For so many years, the leaded solder is now the material of choice for PCB

manufacturing. However, in recent years, consumers worry about the

environmental and health implications of these leaded products, which

has increased. These factors led to the European Union’s RoHS directive,

which restricted the use of hazardous materials in electronic and electrical

equipment, to take effect starting July 2006.

Some nations, unlike the U.S.A, do not have legislation that makes the use

of lead within consumer products unlawful. But, some companies are

requesting that the electronic device they order be made with lead solder.

But again, what type of solder is recommended for usage in the electrical

industry? What distinguishes lead free solder from solder that contains

lead?

This piece will find answers to all questions relating to this, coupled with

providing additional insights regarding lead free solder and leaded solder.

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Table of Contents

What is Lead Free Solder vs Leaded Solder?

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lead free SMT solder

Solder is typically used by electronic makers to attach components to

Circuit boards. All solders, whether lead free solder or with lead, have the

same purpose. However, different solder techniques are used with

different devices as well as use situations.

Lead Soldering

Lead and tin are the two main ingredients in leaded solder. Leaded

solder’s sufficient flowing capability is a benefit. Since its melting point is

lower than that of lead free solder, it doesn’t heat up components as

much.

Moreover, lead free solder takes on a duller appearance whenever it cools,

making it harder for users to spot problems like oxidation. Lead solder

also is less expensive and simpler to use compared to lead free solder.

Lead Free Solder

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The elimination of lead from electronics manufacturing as well as waste

recycling procedures is the primary driver behind

manufacturers’ switch to the usage of lead free solder. Alternative

materials for soldering centered on the tin metal have rapidly developed

over the past 20 years in the field of electronic manufacturing. The

components used in this alternate method have characteristics that are

different from those of the tin and lead eutectic composition.

Soldiers require performance akin to that of superalloys used in jet

engines because they are functional around 80% of the melting

temperature. But as things get smaller, the demands for solder junctions

keep going up because to the rising stress and density characteristics.

Hence, the PCB design that takes into account its melting point that is high

and anisotropic features is required for lead free solders.

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The Differences Between the Features of Lead and Lead Free

Solder

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When lead is used in large quantities for a long period of time in consumer

goods, negative consequences on the environment, as well as on human

health, results. Nowadays, businesses use lead free solder to assist the

social responsibility initiatives of environmental protection.

The Melting Point of Lead Free Solder Is Greater than the Lead

Solder

Lead-filled solder melts at a temperature of 1830°C, whereas lead free

solder melts at 2170°C. The consequences of lead free solder’s greater

melting point are as follows:

Compared to lead soldering, which uses a lower temperature, lead free

soldering quickly oxidizes its solder. Certain components, such as those

with plastic packaging as well as electronic capacitors, are adversely

impacted by the higher soldering temperature that lead free solder has.

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Components with a low dielectric are more prone to failure because of the

high component stress caused by lead-free solder’s high temperature.

Components made with lead free solder feature a number of soldering

surfaces. Tin is frequently used by businesses on these surfaces due to its

affordability. However this tin produces a thin layer of oxidation present

on the exterior that can result in electroplating.

Whether eutectic

Because lead and tin combined to make an eutectic mixture,

manufacturers valued this combination. What we mean is that this

temperature of the tin and lead alloy is lower than the heats of the two

metals separately. Although a eutectic metal pair has not been found, a

successful lead free soldering method has been developed by electronic

manufacturing industry.

Health Issues

Businesses concerned with environmental preservation cite lead’s harmful

nature as this primary justification for switching to lead free soldering. The

human body can indeed collect lead even after brief, repeated exposures.

Lead can also easily enter the body via your mouth, nose, or skin.

Lead-free fuel and paint are now both commonplace. Yet, one of the last

remaining products which still uses it is solder.

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Workers are especially susceptible to the risks of lead because they can

swiftly breathe it in or receive it by contacting contaminated surfaces

inside a sector with high lead output. Keep in mind that lead poses a

greater risk to youngsters. Thus, everywhere you use lead solder, consider

these health issues seriously.

Cost

Compared to lead free solders, lead-filled solder is less expensive. This is

due to the fact that lead costs just one-tenth as much as tin, making lead

based solder very accessible. Lead free solders can also be made more

expensive by some manufacturers who swap out the tin for silver.

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Lead Free Solder has Poorer Wettability Compared to Leaded

Solder

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When the solder joint’s wettability is low, it struggles to meet the needs of

tensile strength, shear capacity, and self-regulation ability. As a result, low

wettability leads to a high solder joint rejection rate, especially when

changes aren’t made to address this weakness.

Physical Characteristics: Lead Free Solder vs Lead Solder

Joint reliability is negatively impacted by lead free solder. Lead free solder

is superior to leaded solder in terms of mechanical effect. Moreover,

lead-free solder develops surface oxides, the flux impurities, as well as

alloy deposits which can result in subpar performance in terms of contact

resistance. As a result, the switch in electronic production from the lead to

the lead-free does not completely replace the mechanical and electrical

components.

Adopting Lead Free Solder

It is crucial to understand that the main distinction between lead free and

lead-lead solder is its high tin content. This will help you decide which

solder type to use. As a result, you should consider the following factors

before making your decision.

Metal dendrite growth

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It is significant to notice that the growth processes of tin whisker and

metal dendrite differ. Ionic electro-transfer during electrochemistry

results in the formation of metal dendrites. Tin whisker, on the contrary,

creates shortcuts which further cause circuit failure.

Growing of Tin Whisker

Tin whisker, acting in cylindrical filament or columnar nature, emerges

from susceptible areas of the tin oxide covering. There may be shortcuts

created by the whisker in-between neighboring pins. Furthermore, it could

impact the high-frequency components negatively.

One primary cause of tin whiskers is pressure stress that is present in tin

soldering coatings. For example, when there is an excess of metallic alloy

Cu6Sn5, it can lead to a number of defects, including build up of pressure

stress upon that tin coat, CTE mismatching, as well as pin distortion, which

further results in the development of the tin whisker.

Tin whisker, that is more obvious in purest tin, is another effect of high tin

alloy concentrations. Fortunately, a number of metal alloys, including Bi

and PB, can stop tin whisker formation.

CAF Creation

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Another failure brought on by electrochemical processes is a CAF –

conducting anodic filament. CAF development is triggered by

anode conductive filaments that contains some copper and grows from

positive electrodes to negatively charged electrodes. This circuit board is

where the procedure takes place.

When the negative and positive electrodes are connected via a short

circuit, CAF typically increases. This results in a terrible catastrophe for the

production of extremely compressed PCBs. Lead free solder’s high melting

point hastens CAF generation.

Tin Pest

Tin pests are a result of impulsive polymorphism stage modification.

Normally, uncontaminated tin would turn from white color to grey at

temperatures below 130C. Tin pests should ideally pose a risk to reliability.

Yet, because the pollution and iron combine, you won’t usually notice it.

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Lead-free Solder vs Lead Solder: Which is More Suitable for

Use?

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Aerospace Corporation conducted a study regarding the use of lead

in consumer electronics, which is at odds with the environmental and

health facts about leaded electronics. According to this study, there is

insufficient evidence to back up the claim that lead used in electronic

devices seriously harms both humans and the environment. The quantity

of lead which manufacturers really use in electrical rework is so negligible

as to not endanger animals.

If lead solder is offered in your local markets, use it. It is simpler to use, its

melting point is lower, and results in fewer joint quality issues.

Conclusion

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Leaded solder has a lot to offer the electronic manufacturing industry, but

change is sweeping in. If they haven’t already, all industries that utilize a

lot of solder will most likely switch to the lead free soldering shortly. Aside

from that, as many governments implement eco-friendly policies, there

could not be enough solder available in the marketplace for hobbyists.

With every change, lead free solder encounters resistance from some

people. Yet, in terms of protecting human safety and health, a switch to a

much safer approach is unquestionably important.

Related Posts:

1. Lead Free Solder Vs Lead Soldering: How to Choose in Electronics

Use

2. What’s the Difference Between HASL and HASL Lead-free in PCB?

3. What is the Significance of Solder Mask Defined Pads in Solder Pad

PCBs?

4. What is Halogen Free PCB ?

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