Ansys General Hardware Recommendations

February 2023

Overview
CPU
Memory
Storage
Interconnect
Graphic Card
GPU for Computing
Example SPECS
Hardware & HPC Partners
Overview
• Focuses on getting started with hardware selections for Ansys applications.
• X86-64 processor from Intel and AMD based hardware only
• Ansys is hardware vendor neutral and partners with all major hardware vendors

Hardware Type Max. # CPU cores Max. RAM Max. # GPUs

Mobile workstation Up to 10+ Up to 128 GB 1
Desktop or rackmount workstation Up to 10s + Up to 1 TB + Up to 4+
Remote viz. server and HPC cluster
Up to 100+ (per node) Up to 10s TB + Up to 8+ (per node)
HPC Cloud

2 ©2023 Ansys, Inc. / Confidential

CPU
Hardware Type Recommended CPU series Memory Channels

Mobile WS (WorkStation) Intel Core i9/i7 -12000/13000 series 2

1-socket desktop WS
2-socket desktop/rackmount WS
Remote viz. server
HPC cluster
HPC cloud instance
Intel Xeon W-3300 series 8 or 4
Intel Xeon W-2400/3400 series
AMD Ryzen Threadripper PRO 5000-WX series
Intel Xeon 9400/8400/6400 series
Intel Xeon 8300/6300 series 2X 8 or 2X 12
AMD EPYC 9004, 7003x or 7003 series

• Turn OFF Hyper-Threading (Intel) or SMT (AMD)

• Max. 4 (or 5.x for DDR5-4800 for CFD) physical cores per memory channel for high memory bandwidth per core
• Overclocking is not recommended, unless professionally overclocked and guaranteed by hardware vendor
• 4-socket (or more) system is less recommended unless fully benchmarked
• CPU models support ECC memory are recommended for production. Could be non-ECC on mobile WS.
• For 12th and 13th Gen Intel Core processors with performance hybrid architecture combines two core microarchitectures, Performance-cores
(P-cores) and Efficient-cores (E-cores), set process pinning or affinity to run on P-cores only for best performance.
• For AMD EYPC and Threadripper Pro processors, setting NPS (NUMA domains Per Socket) to 4 in BIOS is recommended
• For Intel Xeon 9400/8400/6400 processors, setting SNC (Sub-NUMA Clustering) to 4 in BIOS is recommended

3 ©2023 Ansys, Inc. / Confidential

 Memory
• General recommendations of memory (RAM) size per physical CPU core
▪ CFD solvers (Fluent, CFX, etc.), Explicit FEA Solvers (LS-DYNA, AUTODYN) and HFSS/Maxwell: 4-8 GB +
▪ Mechanical APDL solver: 8-16 GB +
• All memory channels should be populated with equal amounts of memory running at maximum speed for
maximum memory bandwidth
▪ Intel Core i7/i9 12000/13000 series (2 memory channels):
32GB (2X16GB), 64GB (2X32GB), 128GB (4X32GB, 2DPC) DDR4-3200/DDR5-4800/DDR5-5600/LPDDR5-6400
▪ Intel Xeon W-2400 series (4 memory channels):
64GB (4X16GB), 128GB (4X32GB), 256GB (4X64GB) DDR5-4800 ECC
▪ Intel Xeon W-3300 series or AMD Ryzen Threadripper PRO 5000-WX/EPYC 7003(x) series (8 memory channels):
128GB (8X16GB), 256GB (8X32GB), 512GB (16X32GB, 2DPC) DDR4-3200 ECC
▪ Intel Xeon W-3400 series (8 memory channels)
128GB (8X16GB), 256GB (8X32GB), 512GB (16X32GB, 2DPC) DDR5-4800 ECC
▪ 2-socket Intel Xeon 8300/6300 series, or AMD EPYC 7003x/7003/7002 series (8 memory channels per socket):
256GB (16X16GB), 512GB (16X32GB), 1TB (16X64GB) DDR4-3200 ECC
▪ 2-socket AMD EPYC 9004 series (12 memory channels per socket):
384GB (24X16GB), 768GB (24X32GB), 1.5TB (24X64GB) DDR5-4800 ECC
▪ 2-socket Intel Xeon 9400/8400/6400 series (8 memory channels per socket):
256GB (16X16GB), 512GB (16X32GB), 1TB (16X64GB) DDR5-4800 ECC
128GB (2X64GB) HBM2e memory (Intel Xeon 9400 series only, cache mode)
• Notes
Memory may operate at lower clock speed in some conditions (2DPC, or CPU model limitation) should be avoided, check HW doc or consult with
HW support to confirm

4 ©2023 Ansys, Inc. / Confidential

Storage
• Workstation, Datacenter or Enterprise level SSDs (Solid State Drive) are recommended
• For OS and Ansys application installation:
‐ Reading or mix-use SSD (500 GB +), non-RAID or RAID 1
• Mechanical APDL solver working directory:
‐ Local, mix-use or writing intensive, 1 TB + NVMe SSD, with >1 GB/s writing rate, non-RAID or RAID 0
‐ RAID 0, 10, 5 or 6 using 4+ SATA/SAS SSDs (less recommended)
• CFD, Explicit FEA and other solvers working directory:
‐ Mix-use SSD (1 TB+), high-performance parallel file system (Lustre or similar) or NFS/UNC (for small cluster)
• HDD (Hard Disk Drive) is not recommended, unless for large repository

5 ©2023 Ansys, Inc. / Confidential

Interconnect
• Network adapter, switch, cable and driver (software) in HPC cluster for distributed
solving on multiple compute nodes
• Recommended high performance Interconnects:
▪ NVIDIA (former Mellanox) Infiniband HDR or newer
▪ Cornelis Networks (former Intel) Omni-Path Express
▪ RDMA based Ethernet (i-WARP, RoCE, etc.) 10GE or higher (less recommended)
▪ AWS EFA (Elastic Fabrics Adapter)
• Non-RDMA 1Gb/s Ethernet is not recommended, unless connecting 2 low core count (16
or less) machines for CFD solvers or solving tasks on machines are independent.
• Check parallel latency and bandwidth from Fluent or Mechanical APDL output.
• High performance (low latency & high bandwidth) interconnect such as Infiniband
‐ Is required when a distributed solver (D-MAPDL, Fluent, CFX, LS-DYNA MPP, HFSS DDM, etc.) launches
multiple dependent tasks on multiple compute nodes. Fast data exchanging among compute nodes are
required during solving.
‐ Is not required when a distributed solver launches multiple independent tasks on multiple compute nodes.
Such as frequency sweep, optimization, etc.

6 ©2023 Ansys, Inc. / Confidential

Graphic Card
• For 3D graphic processing/rendering with OpenGL/DirectX/Shader Model on mobile/desktop/rackmount
workstation, remote visualization or VDI server
• Recommend professional or datacenter series graphic card from NVIDIA and AMD:
▪ NVIDIA RTX/T, Quadro GV/GP/RTX/T and Tesla series
▪ AMD Radeon Pro, Ryzen Pro series
• Gaming cards are not recommended
• AMD Radeon Pro graphic cards are not supported by Fluent on the Linux platform.
• 8GB or higher dedicated GPU memory for NVIDIA Quadro P or newer series, for Ansys Discovery Explore
stage (former Discovery Live)
• Avoid using single graphic card both for concurrent graphic processing and GPU computing (may slowdown
both and causes GPU memory conflicts):
Configure a middle level graphic card (e.g., RTX A2000/A4000) dedicated for 3D graphic, plus 1 or 2 high end GPUs (RTX
A6000 Ada, RTX A6000, Quadro GV100 or A100 if supported) dedicated for GPU computing on desktop workstation. Check
PCIe slots and space, power supply and cooling with HW vender
• Check tested graphic cards from https://www.ansys.com/support/platform-support

7 ©2023 Ansys, Inc. / Confidential

GPU for Computing – Offload Mode
• For Mechanical APDL GPU acceleration:
▪ Iterative Solver (PCG/JCG): all NVIDIA latest high-end GPUs, including RTX/Quadro series graphic cards and Tesla cards
▪ Sparse solver or eigensolvers based on the sparse direct solver (for example, Block Lanczos or subspace): high double precision
performance (FP64) GPUs from NVIDIA and AMD:
• NVIDIA H100, A100, A30, NVIDIA Tesla V100, P100 (GPU server only)
• NVIDIA Quadro GV100, GP100 (workstation or server)
• AMD Instint MI00, MI210, MI250 and MI250x (new in 2022 R2 on Linux GPU server only)
• For Fluent GPGPU acceleration for Algebraic Multigrid (AMG) Solver
▪ Higher end large dedicated memory NVIDIA GPUs, high FP64 performance is preferred for double precision solving
▪ Approx. estimated of 3 GB to 4 GB GPU memory per million of cells
• For IcePak (runs Fluent solver)
▪ NVIDIA GPU(s) can be used to accelerate certain solver operations like multi-grid solver for the coupled pressure-velocity formulation
• For Polyflow
▪ Polyflow supports offloading key solver computations onto a graphical processing unit (GPU) on a graphics card to accelerate those computations.
Only high-end graphics cards, the ones with the most amounts of cores and memory, will accelerate the solver computations with the best efficiency.
• For HFSS Frequency-domain and Time-domain solvers and Maxwell solvers
▪ NVIDIA Data Center GPUs of the Ampere series and Tesla GPUs of the Volta, Pascal, and Kepler generations.
▪ NVIDIA Workstation RTX and Quadro GPUs for all generations are not supported except for Quadro GV100.

8 ©2023 Ansys, Inc. / Confidential

GPU for Computing – Native Mode
• Ansys Discovery Simulation Explore stage (former Discovery Live)
▪ 8GB+ GPU memory NVIDIA RTX/Quadro graphic card (Pascal series or newer preferred)
• HFSS SBR+ solver and Ansys EMIT supports
▪ NVIDIA Data Center GPUs of the Ampere series and Tesla GPUs of the Volta, Pascal, Maxwell, and Kepler generations.
▪ NVIDIA Workstation GPUs of the RTX and Quadro families are supported by the HFSS SBR+ solver.
• Ansys Speos supports native GPU computing from laptop NVIDIA GPUs (or even external GPU through Thunderbolt 3 or 4 port), to
desktop single & multiple GPUs (such as A6000) to datacenter GPU servers.
• Ansys Fluent Native GPU Solver
▪ NVIDIA RTX A6000 Ada/A6000/A5500/A5000/A4500/A4000, Quadro RTX 8000/6000/5000, Quadro GV100/GP100/P6000/P5000
(workstation or GPU server)
▪ NVDIA Tesla P100, Tesla V100, Tesla A100 and H100 (GPU server only)
▪ When modeling turbulence with a hexahedral mesh, single precision, 1 GB of GPU memory is required per million cells. Double precision
requires about 50% more, polyhedra mesh requires 20% to 40% more.
▪ Fluent Native GPU Solver performance is dominated by GPU memory bandwidth, number of GPU cores, number of GPUs and
interconnect latency/bandwidth (on multiple GPU servers)
• Ansys Rocky supports multi-GPUs from NVIDIA in single server
Note: GPU computing (either offload or native mode) for each solver may have limitations. Check official doc,
consult with Ansys support and do benchmark to verify.

9 ©2023 Ansys, Inc. / Confidential

 NVIDIA Datacenter (Tesla) GPUs, Passive Cooling
CUDA
Total # Memory Memory Max.
Micro Compute # Memory FP32 FP64 Foundry
Model Name Date Chip CUDA Size BW TDP Interface Width
Arch. Capability SMs Type TFLOPS TFLOPS Process Size
Cores (GB) (GB/s) (W)
Version

L40 Ada Lovelace 22Q3 AD102 8.9 18,176 142 GDDR6 48 864 90.5 1.4 300 PCIe Gen4 x16 Double TSMC 4nm

H100 SXM Hopper 22Q1 GH100 9.0 16,896 132 HBM3 80 3,430 67 34 700 SXM5 TSMC 4nm

H100 PCIe Hopper 22Q1 GH100 9.0 14,592 114 HBM2e 80 2,048 51 26 350 PCIe Gen5 x16 Double TSMC 4nm

A100 80GB SXM Ampere 20Q2 GA100 8.0 6,912 108 HBM2e 80 2,039 19.5 9.7 400 SXM4 TSMC 7nm

A100 80GB PCIe Ampere 20Q2 GA100 8.0 6,912 108 HBM2e 80 1,935 19.5 9.7 300 PCIe Gen4 x16 Double TSMC 7nm

A100 40GB SXM Ampere 20Q2 GA100 8.0 6,912 108 HBM2 40 1,555 19.5 9.7 400 SXM4 TSMC 7nm

A100 40GB PCIe Ampere 20Q2 GA100 8.0 6,912 108 HBM2 40 1,555 19.5 9.7 250 PCIe Gen4 x16 Double TSMC 7nm

A40 Ampere 20Q4 GA102 8.6 10,752 84 GDDR6 48 696 37.4 0.6 300 PCIe Gen4 x16 Double Samsung 8nm
A30 Ampere 21Q2 GA100 8.0 3,584 56 HBM2 24 933 10.3 5.2 165 PCIe Gen4 x16 Double TSMC 7nm

A16 Ampere 21Q2 4X GA107 8.6 4X 1,280 4X 10 GDDR6 4X 16 4X 200 4X 4.5 4X 0.14 250 PCIe Gen4 x16 Double Samsung 8nm

A10 Ampere 21Q2 GA102 8.6 9,216 72 GDDR6 24 600 31.2 0.98 150 PCIe Gen4 x16 Single Samsung 8nm

A2 Ampere 21Q4 GA107 8.6 1028 10 GDDR6 16 200 4.5 0.07 60 PCIe Gen4 x8 Single Samsung 8nm

T4 Turing 18Q3 TU104 7.5 2,560 40 GDDR6 16 300 8.1 0.25 70 PCIe Gen3 x16 Single TSMC 12nm

Quadro RTX 8000 Turing 18Q3 TU102 7.5 4608 72 GDDR6 48 624 14.9 0.47 250 PCIe Gen3 x16 Double TSMC 12nm

Quadro RTX 6000 Turning 18Q3 TU102 7.5 4608 72 GDDR6 24 624 14.9 0.45 250 PCIe Gen3 x16 Double TSMC 12nm

V100 SXM Volta 17Q2 GV100 7.0 5,120 80 HBM2 32 / 16 900 15.7 7.8 300 SXM3 TSMC 12nm

V100 PCIe Volta 17Q2 GV100 7.0 5,120 80 HBM2 32 /16 900 14 7 250 PCIe Gen3 x16 Double TSMC 12nm

V100S Volta 19Q4 GV100 7.0 5120 80 HBM2 32 1,134 16.4 8.2 250 PCIe Gen3 x16 Double TSMC 12nm

P100 SXM Pascal 16Q2 GP100 6.0 3584 56 HBM2 16 732 10.6 5.3 300 SXM2 TSMC 16nm

P100 PCIe Pascal 16Q2 GP100 6.0 3584 56 HBM2 16 / 12 732 / 549 9.3 4.7 250 PCIe Gen3 x16 Double TSMC 16nm

M60 Maxwell 15Q3 2X GM204 5.2 4096 2X 16 GDDR5 2X 8 2X 160 2X 4.8 2X 0.15 300 PCIe Gen3 x16 Double TSMC 28nm
K80 Kepler 14Q4 2X GK210 3.7 4992 2X 13 GDDR5 2X 12 2X 240 5.6 1.87 300 PCIe Gen3 x16 Double TSMC 28nm

10 ©2023 Ansys, Inc. / Confidential

 NVIDIA GPUs for Desktop Workstation, Active Cooling
CUDA Total
Memory Memory Max.
Micro Compute # # Memory FP32 FP64 Foundry
Model Name Date Chips Size BW TDP Interface Width
Arch. Capability CUDA SMs Type TFLOPS TFLOPS Process Size
(GB) (GB/s) (W)
Version Cores
RTX 6000 Ada Ada Lovelace 23Q1 AD102 8.9 18176 142 GDDR6 48 960 91.1 1.49 300 PCIe Gen4 x16 DW TSMC 4nm
RTX A6000 Ampere 20Q3 GA102 8.6 10752 84 GDDR6 48 768 38.7 1.21 300 PCIe Gen4 x16 DW Samsung 8nm
RTX A5500 Ampere 22Q1 GA102 8.6 10240 80 GDDR6 24 768 34.1 1.09 230 PCIe Gen4 x16 DW Samsung 8nm
RTX A5000 Ampere 21Q2 GA102 8.6 8192 64 GDDR6 24 768 27.8 0.87 230 PCIe Gen4 x16 DW Samsung 8nm
RTX A4500 Ampere 21Q4 GA102 8.6 7168 56 GDDR6 20 640 23.7 0.74 200 PCIe Gen4 x16 DW Samsung 8nm
RTX A4000 Ampere 21Q2 GA104 8.6 6144 48 GDDR6 16 448 19.2 0.60 140 PCIe Gen4 x16 DW Samsung 8nm
RTX A2000 Ampere 21Q4 GA106 8.6 3328 26 GDDR6 12 / 6 288 8.0 0.12 70 PCIe Gen4 x16 DW Samsung 8nm
Quadro RTX 8000 Turing 18Q3 TU102 7.5 4608 72 GDDR6 48 672 16.3 0.51 260 PCIe Gen3 x16 DW TSMC 12nm
Quadro RTX 6000 Turing 18Q3 TU102 7.5 4608 72 GDDR6 24 672 16.3 0.51 260 PCIe Gen3 x16 DW TSMC 12nm
Quadro RTX 5000 Turing 18Q3 TU104 7.5 3072 48 GDDR6 16 448 11.1 0.35 230 PCIe Gen3 x16 DW TSMC 12nm
Quadro RTX 4000 Turing 18Q4 TU104 7.5 2304 36 GDDR6 8 416 7.1 0.22 160 PCIe Gen3 x16 SW TSMC 12nm
T1000 Turing 21Q2 TU117 7.5 896 14 GDDR6 8/4 160 2.5 0.08 50 PCIe Gen3 x16 SW TSMC 12nm
Quadro GV100 Volta 18Q2 GV100 7.0 5120 80 HBM2 32 868 16.7 8.33 250 PCIe Gen3 x16 DW TSMC 12nm
Quadro GP100 Pascal 16Q4 GP100 6.0 3584 56 HBM2 16 732 10.3 5.12 235 PCIe Gen3 x16 DW TSMC 16nm
Quadro P6000 Pascal 16Q4 GP102 6.1 3840 30 GDDR5X 24 433 12.6 0.39 250 PCIe Gen3 x16 DW TSMC 16nm
Quadro P5000 Pascal 16Q4 GP104 6.1 2560 20 GDDR5X 16 288 8.9 0.28 180 PCIe Gen3 x16 DW TSMC 16nm
Quadro M6000 Maxwell 15Q1 GM200 5.2 3072 24 GDDR5 24 / 12 317 6.8 0.21 250 PCIe Gen3 x16 DW TSMC 28nm
Quadro K6000 Kepler 13Q2 GK110B 3.5 2880 15 GDDR5 12 288 5.2 1.73 225 PCIe Gen3 x16 DW TSMC 28nm

11 ©2023 Ansys, Inc. / Confidential

 NVIDIA GPUs (8GB+) for Mobile Workstation

CUDA Total
Memory Memory FP64 Max.
Micro Compute # # Memory FP32 Foundry
Model Name Date Chips Size BW TFLOP TDP Interface
Arch. Capability CUDA SMs Type TFLOPS Process Size
(GB) (GB/s) S (W)
Version Cores
RTX A5500 Ampere 22Q1 GA103S 8.6 7424 58 GDDR6 16 448 24.7 0.73 165 PCIe Gen4 x16 Samsung 8nm
RTX A5000 Ampere 21Q2 GA104 8.6 6144 48 GDDR6 16 448 21.7 0.54 165 PCIe Gen4 x16 Samsung 8nm
RTX A4500 Ampere 22Q1 GA104 8.6 5888 46 GDDR6 16 448 18.5 0.45 140 PCIe Gen4 x16 Samsung 8nm
RTX A4000 Ampere 21Q2 GA104 8.6 5120 40 GDDR6 8 384 17.8 0.54 140 PCIe Gen4 x16 Samsung 8nm
RTX A3000 12GB Ampere 22Q1 GA104 8.6 4096 32 GDDR6 12 336 14.1 0.20 130 PCIe Gen4 x16 Samsung 8nm
RTX A2000 8GB Ampere 22Q1 GA107 8.6 2560 20 GDDR6 8 224 9.3 0.74 95 PCIe Gen4 x16 Samsung 8nm
Quadro RTX 6000 Turing 20Qx TU102 7.5 4608 72 GDDR6 24 672 14.9 0.42 250 PCIe Gen3 x16 TSMC 12nm
Quadro RTX 5000 Turing 19Q2 TU104 7.5 3072 48 GDDR6 16 448 9.4 0.34 110 PCIe Gen3 x16 TSMC 12nm
Quadro RTX 4000 Turing 19Q2 TU104 7.5 2560 40 GDDR6 8 448 8.0 0.25 110 PCIe Gen3 x16 TSMC 12nm

12 ©2023 Ansys, Inc. / Confidential

Example Hardware SPECS (Mobile Workstation)
Component Essential
CPU Intel Core i5/i7 1200/1300 U/P series
Memory 2X16GB DDR4-3200 non-ECC
2X16GB DDR5-4800 non-ECC
2X16GB LPDDR5-6400 non-ECC
Storage 1TB mix-use PCIe NVMe SSD
Graphic NVIDIA T550 (4GB)
NVIDIA RTX A500 (4GB)
Brands and Dell Precision 3470 (14”)
models Dell Precision 3570 (15”)
HP ZBook Firefly 14-inch G9
HP ZBook Firefly 16-inch G9
Lenovo ThinkPad P14s Gen 3 (Intel)
Lenovo ThinkPad P16s Gen 1 (Intel)
13
Medium Ultimate
Intel Core i5/7/9 12000/13000 H/HK series Intel Core i5/i7/i9 12000/13000 HX series
2X32GB DDR5-4800 non-ECC 128GB DDR5-4800/3600 non-ECC CAMM module
2X32GB LPDDR5-5200 non-ECC 4X32GB DDR5-4800 ECC SODIMM
(higher speed in 13th Gen Intel Core Mobile) (higher speed in 13th Gen Intel Core Mobile)
1TB or 2TB mix-use PCIe NVMe SSD 2TB+ mix-use PCIe NVMe SSD
NVIDIA T600 (4GB) NVIDIA RTX A3000 (12GB)
NVIDIA T1200 (4GB) NVIDIA RTX A4500 (16GB)
NVIDIA RTX A1000(4GB) NVIDIA RTX A5500 (16GB)
NVIDIA RTX A2000 (8GB)
Dell Precision 5470 (14”) Boxx GoBoXX SLM17
Dell Precision 3571 (15”) Dell Precision 7670
Dell Precision 5770 (17”) Dell Precision 7770
HP ZBook Studio 16-inch G9 HP ZBook Fury 16 G9
HP ZBook Power 15.6-inch G9 Lenovo ThinkPad P16 Gen 1
Lenovo ThinkPad P1 Gen 5
Lenovo ThinkPad P15v Gen 3 (Intel)
©2023 Ansys, Inc. / Confidential
 Example Hardware SPECS (1-socket Desktop Workstation)
Compone Essential
nt (2 Memory Channels)
CPU AMD Ryzen 5/7/9 5000X or 7000X
Intel Core i7/i9 12000K/13000K
Memory 4X32GB DDR4-3200 non-ECC
4X32GB DDR5-4800 non-ECC
4X32GB DDR5-4800 ECC
Storage 1TB+ PCIe NVMe SSD
Graphic NVIDIA RTX A series
(GPU) Max. single RTX 6000 Ada
Brands BOXX APEXX A3/E3/S3/S4
and Dell Precision 3660
models EXXACT VWS-147165456
HP Z2 Tower G9 Workstation
Lenovo ThinkStation P360 Tower
Supermicro SYS-531A-IL
14
Medium
(4 memory channels)
Intel Xeon W3/5/7-2400
(20 or less cores)
4X32GB DDR5-4800 ECC
4X64GB DDR5-4800 ECC
TBs PCIe NVMe SSD
NVIDIA RTX A series
Max. 2X-3X RTX 6000 Ada
BOXX APEXX W3
HP Z4 G5
©2023 Ansys, Inc. / Confidential
Ultimate Ultimate-New
(8 Memory Channels) (8 Memory Channels)
AMD Threadripper Pro 5000 WX or Intel Xeon W5/7/9-3400 series
Intel Xeon W-3300 or 3rd Gen. Scalable (36 or less cores)
(32 or less cores)
8X32GB DDR4-3200 ECC 8X32 DDR5-4800 ECC
8X64GB DDR4-3200 ECC 8X64 DDR5-4800 ECC
TBs PCIe NVMe SSD TBs PCIe NVMe SSD
NVIDIA RTX A series NVIDIA RTX A series
Max. 2X-4X RTX 6000 Ada Max. 3X-4X RTX 6000 Ada
BOXX APEXX T3/T4 (AMD) BOXX APEXX W4
BOXX APEXX W4L (INTEL) HP Z6 G5
Dell Precision 7865 (AMD) HP Z8 Fury G5
Lenovo ThinkStation P620 (AMD)
Supermicro SYS-540A-TR (INTEL)
 Example Hardware SPECS (2-socket Desktop Workstation)
Component Dual 3rd Gen. Intel Xeon Scalable
(2X8 memory channels DDR4-3200)
CPU 2X Intel Xeon Platinum 8358 (2X32C, 2.6Ghz)
2X Intel Xeon Gold 6338 (2X32C, 2.0Ghz)
2X Intel Xeon Gold 6354 (2X18C, 3.0Ghz)
Memory 512GB (16X32GB) DDR4-3200 ECC
1024GB (16X64GB) DDR4-3200 ECC
Storage TBs PCIe NVMe SSD
Graphic NVIDIA RTX A series
Max. 2X to 4X RTX 6000 Ada
Brands and EXXACT TWS-115999024 (Max. 4X A100)
models Supermicro SYS-730A-I/740A-T
(Max. 2X RTX 6000 Ada)
Dual 3rd Gen. AMD EPYC
(2X8 memory channels DDR4-3200)
2X AMD EPYC 7573X (2X32C, 2.8Ghz, 768MB L3 Cache)
2X AMD EPYC 75F3 (2X32C, 2.95Ghz, 256MB L3 Cache)
2X AMD EPYC 7543 (2X32C, 2.8Ghz, 256MB L3 Cache)
512GB (16X32GB) DDR4-3200 ECC
1024GB (16X64GB) DDR4-3200 ECC
TBs PCIe NVMe SSD
NVIDIA RTX A series
Max. 3X RTX 6000 Ada
BOXX APEXX M4i
EXXACT Valence VWS-131642625
KOI Computers XTREMESTATION
Dual 4th Gen Intel Xeon Scalable
(2X8 memory channels DDR5-4800)
2X Intel Xeon Platinum 8462Y (2X32C, 2.8Ghz)
2X Intel Xeon Gold 6448Y (2X32C, 2.1Ghz)
2X Intel Xeon Gold 6442Y (2X24C, 2.6Ghz)
2X Intel Xeon Gold 6444Y (2X16C, 3.6Ghz)
512GB (16X32GB) DDR5-4800 ECC
1024GB (16X64GB) DDR5-4800 ECC
TBs PCIe NVMe SSD
NVIDIA RTX A series
Max. 2X to 4X RTX 6000 Ada
EXXACT TWS-154715021
HP Z8 G5
Supermicro SYS-741GE-TNRT

15 ©2023 Ansys, Inc. / Confidential

 Example Hardware SPECS (HPC Cluster)
Component Intel Xeon 6300/8300 Based AMD EPYC 7003 Based
Head Node CPU: Single/Dual 8+ Cores Xeon Scalable 5300/6300 CPU: Single/Dual 8+ Cores AMD EPYC 7003 (7313/72F3)
Memory: 8x/16x 16GB DDR4-3200 ECC Memory: 8x/16x 16GB DDR4-3200 ECC
OS & APP: 2x SSDs RAID 1 OS & APP: 2x SSDs RAID 1
Shared Storage: 5+ 2TB SSDs RAID 5 or 6 Shared Storage: 5+ 2TB SSDs RAID 5 or 6
Interconnect: HDR Infiniband Interconnect: HDR Infiniband

Compute CPU: Dual Intel Xeon Platinum 8358 (2X32C, 2.6Ghz) or
Dual Intel Xeon Gold 6338 (2X32C, 2Ghz) or
Nodes Dual Intel Xeon Gold 6354 (2X18C, 3.0Ghz)
Memory: 16x 32GB DDR4-3200 ECC (CFD or Explicit FEA) or
16x 64GB DDR4-3200 ECC (MAPDL)
OS: 2x SSDs RAID 1
Local SSD (MAPDL): mix-use or write intensive NVMe SSD ~2TB
Interconnect: HDR Infiniband
CPU: Dual AMD EPYC 7573X (2X32C, 2.8Ghz, 768MB L3 Cache) or
Dual AMD EPYC 75F3 (2X32C, 2.95Ghz, 256MB L3 Cache) or
Dual AMD EPYC 7543 (2X32C, 2.8Ghz,256MB L3 Cache)
Memory: 16x 32GB DDR4-3200 ECC (CFD or Explicit FEA) or
16x 64GB DDR4-3200 ECC (MAPDL)
OS: 2x SSDs RAID 1
Local SSD (MAPDL): mix-use or write intensive NVMe SSD ~2TB
Interconnect: HDR Infiniband

Brands • Dell EMC PowerEdge R750 (head node, 2U), C6520 within C6400 • Dell EMC PowerEdge R7515 (head node, 2U), C6525 within C6400
chassis (4 servers in 2U) or R650 (1U) chassis (4 servers in 2U) or R6525 (1U)
and • HPE ProLiant DL380 Gen10 Plus (head node, 2U), XL220n within • HPE ProLiant DL345 Gen10 Plus (head node, 2U), XL225n within
models Apollo 2000 Gen10 Plus chassis (4 servers in 2U) or DL360 Apollo 2000 Gen10 Plus chassis (4 servers in 2U), or DL325 Gen
Gen10 Plus (1U) 10 plus(1U)
• Lenovo ThinkSystem SR650 V2 (head node, 2U), SD630 V2 within • Lenovo ThinkSystem SR655 (head node, 2U), SR635 (1U)
DA240 enclosure (4 servers in 2U) or SR630 V2 (1U)

Parallel For large HPC cluster with 10s or more users/compute nodes.
IBM Spectrum Scale (GPFS) parallel file system based storage solutions.
Storage Lustre parallel file system based storage solutions.

16 ©2023 Ansys, Inc. / Confidential

Example Hardware SPECS (HPC Cluster – AMD EPYC 9004)
Component AMD EPYC 9004 Based
Head Node CPU: Single/Dual 8+ Cores AMD EPYC 9004 (9354P/9124)
Memory: 12x/24x 16GB DDR5-4800 ECC
OS & APP: 2x SSDs RAID 1
Shared Storage: 5+ 2TB SSDs RAID 5/6
Interconnect: HDR Infiniband

Compute CPU: Dual AMD EPYC 9554 (2x64C, 3.10Ghz, 256MB L3 Cache, 360W) or
Dual AMD EPYC 9534 (2x64C, 2.45Ghz, 256MB L3 Cache, 280W) or
Nodes Dual AMD EPYC 9474F (2X48C, 3.60Ghz, 256MB L3 Cache, 360W) or
Dual AMD EPYC 9454 (2X48C, 2.75Ghz, 256MB L3 Cache, 290W) or
Dual AMD EPYC 9374F (2X32C, 3.85Ghz, 256MB L3 Cache, 320W) or
Dual AMD EPYC 9354 (2X32C, 3.25Ghz, 256MB L3 Cache, 280W)
Memory: 768GB (24X32GB) DDR5-4800 ECC (CFD or Explicit FEA) or
1.5TB (24X64GB) DDR5-4800 ECC (MAPDL)
OS: 2x 512GB SATA/SAS/NVMe SSD RAID 1
Local SSD (MAPDL): mix-use or write intensive NVMe SSD ~2TB
Interconnect: HDR Infiniband

Brands and • Dell EMC PowerEdge R7625 (head node, 2U), R6625 (compute nodes, 1U)
• HPE ProLiant DL345 Gen11 (head node, 2U), DL365 Gen 11(compute nodes, 1U)
models • Lenovo ThinkSystem SR665 V3 (head node, 2U), SR645 V3(compute nodes, 1U) or SD665 V3 (12 dual-socket nodes in 6U
DW612S enclosure)

Parallel For large HPC cluster with 10s or more users/compute nodes.
IBM Spectrum Scale (GPFS) parallel file system based storage solutions.
Storage Lustre parallel file system based storage solutions.

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Example Hardware SPECS (HPC Cluster – 4th Gen Intel Xeon Scalable)
Component 4th Gen Intel Xeon Scalable Based
Head Node CPU: Single/Dual 8+ Cores Intel Xeon Gold (6414U/5416S)
Memory: 8X/16X 16GB DDR5-4800 ECC
OS & APP: 2x SSDs RAID 1
Shared Storage: 5+ 2TB SSDs RAID 5/6
Interconnect: HDR Infiniband

Compute CPU: Dual Intel Xeon Max 9460 (2X40C, 2.2Ghz, 97.5MB Cache, 350W, 2X64GB HBM2e Memory) or
Dual Intel Xeon Max 9462 (2X32C, 2.7Ghz, 75.0MB Cache, 350W, 2X64GB HBM2e Memory) or
Nodes Dual Intel Xeon Gold 6458Q (2X32C, 3.1Ghz, 60MB Cache, 350W, Liquid Cooled) or
Dual Intel Xeon Platinum 8460Y+ (2x40C, 2.0Ghz, 105MB Cache, 300W) or
Dual Intel Xeon Platinum 8462Y+ (2x32C, 2.8Ghz, 60MB Cache, 300W) or
Dual Intel Xeon Gold 6448Y (2X32C, 2.1Ghz, 60MB Cache, 225W) or
Dual Intel Xeon Gold 6438Y (2X32C, 2.0Ghz, 60MB Cache, 205W) or
Dual Intel Xeon Gold 6442Y (2X24C, 2.6GHz, 60MB Cache, 225W)
Memory: 512GB (16X32GB) DDR5-4800 ECC (CFD or Explicit FEA) or
1.0TB (16X64GB) DDR5-4800 ECC (MAPDL)
OS: 2x 512GB SATA/SAS/NVMe SSD RAID 1
Local SSD (MAPDL): mix-use or write intensive NVMe SSD ~2TB
Interconnect: HDR Infiniband

Brands and • Dell EMC PowerEdge R760 (head node, 2U), R660 (compute nodes, 1U) or C6620 (4 servers in 2U)
• HPE ProLiant DL380 Gen11 (head node, 2U), DL360 Gen 11 (compute nodes, 1U)
models • Lenovo ThinkSystem SR650 V3 (head node, 2U), SR630 V3 (compute nodes, 1U) or SD650 V3 (12 dual-socket nodes in a
6U DW612S enclosure)

Parallel For large HPC cluster with 10s or more users/compute nodes.
IBM Spectrum Scale (GPFS) parallel file system based storage solutions.
Storage Lustre parallel file system based storage solutions.

18 ©2023 Ansys, Inc. / Confidential

 Recommended Hardware for VDI in Ansys Gateway powered by AWS
Ansys Application Instance Notes
Discovery g5*, g4dn* For Discovery, a dedicated graphics card is required.
For SpaceClaim and DesignModeler, c6i and m5 are allowed for smaller geometries, but for larger geometries, g5 and g4dn are preferred
Electronics c5d, m5d, g3*, g4dn* AEDT VDI is supported on Windows-based virtual desktops only
c5d, m5d are recommended when solvers are used and hardware-accelerated graphics are not needed
c to m provide increased memory (RAM)
g3 and g4dn are recommended when accelerated graphics are needed
Fluids c5, c6i, m5, m6i, g3*, g4dn* c5 or c6i are recommended for most workflows
m5 and m6i provide more memory (RAM) if needed
g3 or g4dn provide hardware-accelerated graphics for improved pre/postprocessing
Granta Selector t2.medium and above
LS-DYNA c6i, c6a, m6i, m6a c6i (Intel) or c6a (AMD) are recommended for most workflows
m6i (Intel) and m6a (AMD) provide more memory
LS-PrePost g3*, g4ad* g-series instances are only necessary for large models that require accelerated graphics
Less expensive instances without a GPU are quite capable of handling smaller models in LS-PrePost
Lumerical c6i, c6a, c5, c5a, c5n, c4
RedHawk-SC Instances from the M or R families
SCADE Machine should have minimum 16GB of memory (for example, t2.xlarge)
Speos g5*, m5d, m6a, m6i, p2*, p3*, r5a, g3s is required for GPU compute
r6i, g3s*, g4dn* (2xlarge)
Workbench LS-DYNA c6i, r6i, m6i
Workbench/Mechanical c5, c6i, m5, m6i, r5, r6i, g4dn* c6i, m6i, or r6i are recommended when solvers are used and hardware-accelerated graphics are not needed
If c6i, m6i, and r6i are not available in your region, use c5, r5, or m5
c to m to r provide increased memory (RAM)
g4dn is recommended when hardware-accelerated graphics are needed

* Has GPUs (graphics processing units) for accelerated graphics performance.

Note:
• Ansys recommends that you disable multithreading/Hyper-Threading when selecting an instance type.
• Some instances are available in selected regions only.

19 ©2023 Ansys, Inc. / Confidential

 Recommended Hardware for HPC in Ansys Gateway powered by AWS
Ansys Application Instance Families or Types Notes

Electronics c5n, c6i, m6i Recommended instance types: c5n.18xlarge, c5n.9xlarge, c6i.32xlarge, m6i.32xlarge
Fluids c5n.18xlarge EFA is strongly recommended for all Fluids solvers. These instance types support EFA.
c6i.32xlarge
hpc6a.48xlarge
LS-DYNA hpc6id.32xlarge
hpc6a.48xlarge
c6i.32xlarge
These instance types support EFA (recommended)
c6a.48xlarge
hpc6id.32xlarge and hpc6a.48xlarge are recommended
m6a.48xlarge
m6a.48xlarge
m6i.32xlarge
RedHawk-SC Instances from the M or R families
Speos c5a, c5d, c5n, c6i, m6i Instance types that support EFA: c5n.18xlarge, c5n.9xlarge, c6i.32xlarge, m6i.32xlarge
Workbench/Mechanical c6i, m6i, r6i, hpc6id c to m to r provide increased memory (RAM)
Need good balance between cores and memory per core
Instance types that support EFA: c6i.32xlarge, m6i.32xlarge, r6i.32xlarge, hpc6id.32xlarge
Note:
• The same availability zone should be selected for all resources in the HPC workflow setup (virtual machine used for job submission, file storage server, cluster).
• Ansys recommends that you disable multithreading/Hyper-Threading when selecting an instance type.
• Some instances are available in selected regions only.
• For information about EFA, see Elastic Fabric Adapter (EFA) in this guide.

20 ©2023 Ansys, Inc. / Confidential

 Ansys Hardware and HPC Partners
• Advanced Micro Devices (AMD) • Intel
• BOXX • International Computer Concepts
• Bull SAS • KOI Computers
• Dell Technologies • Lenovo
• Drizti Inc. • MicroConsult GmbH
• DUG Technology • Microsoft Azure
• Exxact Corporation • MVConcept
• Fujitsu • Nor-Tech
• GNS Systems GmbH • NVIDIA Corporation
• Gompute • OpenText Corporation
• Hewlett Packard Enterprise (HPE) • Oracle
• HP Inc. • Super Micro Computer, Inc.
• HPC Systems • TotalCAE
• IBM • X-ISS

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 Check out the various computing solutions
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