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17 Jan 2024, Fri

CL 242 Fundamentals of Heat and Mass Transfer

Basics & Heat Conduction in 1D


Tutorial 1
A block of ice cream, taken from
the freezer, is placed on the
T1.1 Heating of an kitchen counter for 80 seconds.
How much heat was transferred

Ice cream Block from the surroundings to the


block during this time?
Engineering problems
● Statement in common language
● Identify physics
● Restate problem technically (define your
own question)
● Reveal knowns and unknowns

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Recall Plan for Heat Transfer and Polya

A. Understand (restate)
B. Plan
1. Control Volume
2. Time basis
3. HT modes
4. Conservation equations
5. Simplifications
6. List properties
C. Carry out
1. Solve symbolically
2. Substitute numerics
D. Look back
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Understand

Highlight Keywords, interpret A block of ice cream, taken from the freezer, is
● Ice cream block => Solid placed on the kitchen counter for 80 seconds. How
● Freezer => sub-zero much heat was transferred from the surroundings
● Kitchen => Room to the block during this time?
● Counter => Table top
● Heat to block => Warm room

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Understand

Highlight Keywords, interpret A block of ice cream, taken from the freezer, is
● Ice cream block => Solid placed on the kitchen counter for 80 seconds. How
● Freezer => sub-zero much heat was transferred from the surroundings
● Kitchen => Room to the block during this time?
● Counter => Table top
● Heat to block => Warm room
Draw Schematic

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1. Control Volume
Ice block
● Can’t be certain of the correct CV
Air
● Take a guess and go ahead
● If unsolvable, try a different one Room
Walls

Thumb Rules

● Does problem statement define a body?


● Is there a main “Subject” of interest?
● Start with 2D-sectional view
Table

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2. Time basis

A block of ice cream, taken from the freezer, is


● Total heat [=] Joules
placed on the kitchen counter for 80 seconds.
● time interval 80 s How much heat was transferred from the
surroundings to the block during this time?

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3. HT Modes
Cold Ice
Heat transfer across control surface block

● Solid-Solid : Conduction Warm


● Solid-Air : Convection Air

● Solid-Walls: Radiation Room Walls

Warm
Table

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3. HT Modes
Cold Ice
Heat transfer across control surface block

● Solid-Solid : Conduction Warm


● Solid-Air : Convection Air

● Solid-Walls: Radiation Room Walls

Warm
Type of Convection? Table

A. Forced
B. Free
C. Condensation
D. Evaporation
E. Can’t say

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Convection in Detail
Cold Ice
1. If fan is present: Forced block

2. Absence of fan: Free, which sides? Warm


Air
A. Top
B. Side
C. Bottom Warm
Table
D. Top + Side
L

Convection

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4. Conservation Equations

Forced Natural Cond. Rad.

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5. Simplifying Assumptions

1. No flow (through CV)

2. No work done

3. No heat generation inside the volume


(chemical, electrical, nuclear)

4. Heat input to the system raises the stored


thermal+mechanical energy

5. Desired to find qs

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Flux expressions

● Introduce Temperature notation

● Conduction : Table to body

● Convection : Air to body

● Radiation: Wall to body

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6. Knowns and Unknowns

● Block temp = Freezer temp The dimensions of the box are 17 x 5 x 6 for the
length, width, and height, respectively (all in cm).
● Still air => Free convection
The temperature of the freezer compartment was
● Given: set at -10oC. The ambient air is still at 31oC and
kitchen walls are at 36oC. The block's packaging is
made of cardboard of thickness 1 mm and an
emissivity of 0.94. The convective heat transfer
coefficient is 6 W/m2.K.

● Conductivity of cardboard not given

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Properties Table: Appendix A

● Look for cardboard or closest


● Check for units in the header
● Check for temperature variations

Conductivity of cardboard [W/m.K], which one?


A. 0.046
B. 0.000017
C. 0.078
D. 0.039
E. 0.18

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7. Solve Symbolically and 8. Substitute

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Look back

Dominant mode of HT [poll]? Validation of numbers

A. Conduction 1. Hand calculations

B. Convection 2. Remember order of magnitude of heat

C. Radiation rate: 10 to 100 J/s

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Variations to the problem

● Forced convection

● Condensation of moisture

● Melting of ice cream

● Table temperature decrease

● Box is half-empty (with air)

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T1.2 A furnace wall is made of a
composite of a refractory material
Furnace Cooling with a thermal conductivity and of
steel. The inside is in contact with
a gas phase and the outside with
a liquid used for cooling
purposes.

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Understand the Problem Statement
Skim the text, skip the numbers:

A furnace wall is made of a composite of 20 mm of a refractory material with a thermal conductivity k = 21 W/mK on
r

the inside and 30 mm of steel k = 20.8 W/mK on the outside. The inside is in contact with a gas phase (at
s

1750 C) and the outside with a liquid (at 100 C) used for cooling purposes, with convective heat
o o

transfer coefficients 50 and 1450 W/m K respectively. The contact resistance between the two materials is 0.04
2

m K/W. Sketch the possible temperature profile and find the following.
2

1. Heat flux through the wall


2. The temperature inside the refractory ● Underline keywords
3. The temperature inside steel ● Draw a schematic, label parts
● Identify HT Processes
● Choose an axis for Temperature
variation in 1D
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3D Schematic and Sectional View
Gas, Refractory
1750oC Bimaterial contact

Steel

Liquid, 100oC

Conv. Cond. Cond. Conv.


Contact ● Sketch temperature
T profile

x
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Choose the Temperature Profile Combination
1 2 3 4

Boundary 1 Bulk Boundary 2 Choose combinations to describe your profile,


Example:
A
1. B1, D3, C4

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Choose the Temperature Profile Combination
1 2 3 4

Boundary 1 Bulk Boundary 2 Choose combinations to describe your profile:

A
1. B1, F3, B4
2. B1, D3, C4
3. A1, F3, A4
B 4. A1, D3, A4
5. B1, D3, A4
C

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Temperature Profile
T Refractory Steel

x
Conv. Cond. Contact Cond. Conv.

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Resistance Equivalent
T Refractory Steel

x
Conv. Cond. Contact Cond. Conv.

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Total Resistance and Individual Drops

Same q flows through all materials

Gas convection

Refractory
What is the unit
Contact of Rc?

What is given?

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T1.3
A modern CPU can generate up to
CPU Fins 30,000 W/m2 of heat. For
optimum clock speed, an array of
fins is used to maintain its
temperature at 70oC.

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Understand the Problem Statement

A modern CPU is fusion welded with an array of


fins on the top surface of as shown in the
picture.
The bottom is pressed against the motherboard.
There is convective HT below the motherboard
and convective HT on the fins above the chip.
The fins are a 5 x 5 array of rectangular
extensions of aluminum.

● Underline keywords
● Draw a schematic and label parts
● Identify HT Processes

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Process Identification Diagram

Fusion welding
(No contact resistance)
N # Fins
Heat source

CPU Bi-material contact


Motherboard

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Vertical Temperature Profile

Temperature profile along z:


T
A. F1, B2, C4
B. F1, F3, C4
C. F1, E3, C4
N # Fins D. D1, F3, A4
E. E1, F3, B4
CPU
Motherboard

● Draw the resistance network

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Resistance Network

Fusion welding
(No contact resistance)
N # Fins
Heat source

CPU Bi-material contact


Motherboard

Find:

Then find:
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Fin Heat Transfer

Bergman et al. (Incropera) 32


Areas for HT
Top View
Fin cross section area

Base area without fins

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Performance of a Fin

Fin effectiveness Actual HT with Fin

HT without Fin

Area at the base

Bergman et al. (Incropera) 34

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