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Low Drop Power Schottky Rectifier: Main Products Characteristics
Low Drop Power Schottky Rectifier: Main Products Characteristics
IF(AV) 3A
VRRM 40 V
Tj 150°C
VF (max) 0.475 V
Value
Symbol Parameter Unit
1N5820 1N5821 1N5822
VRRM Repetitive peak reverse voltage 20 30 40 V
IF(RMS) RMS forward current 10 A
IF(AV) Average forward current TL = 100°C δ = 0.5 3 A
TL = 110°C δ = 0.5 3 3 A
IFSM Surge non repetitive forward tp = 10 ms 80 A
current Sinusoidal
PARM Repetitive peak avalanche tp = 1µs Tj = 25°C 1700 W
power
Tstg Storage temperature range - 65 to + 150 °C
Tj Maximum operating junction temperature * 150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
dPtot 1
* : < thermal runaway condition for a diode on its own heatsink
dTj Rth( j − a )
THERMAL RESISTANCES
Fig. 1: Average forward power dissipation versus Fig. 2: Average forward power dissipation versus
average forward current (1N5820/1N5821). average forward current (1N5822).
PF(av)(W) PF(av)(W)
1.8 2.0
δ = 0.1 δ = 0.2 δ = 0.5 δ = 0.1 δ = 0.2 δ = 0.5
1.6 1.8
δ = 0.05
1.6 δ = 0.05
1.4 δ=1
1.4
1.2
1.2 δ=1
1.0
1.0
0.8
0.8
0.6 0.6
T T
0.4 0.4
0.2 0.2
IF(av) (A) δ=tp/T tp
IF(av) (A) δ=tp/T tp
0.0 0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Fig. 3: Normalized avalanche power derating Fig. 4: Normalized avalanche power derating
versus pulse duration. versus junction temperature.
PARM(tp) PARM(tp)
PARM(1µs) PARM(25°C)
1 1.2
0.1 0.8
0.6
0.01 0.4
0.2
tp(µs) Tj(°C)
0.001 0
0.01 0.1 1 10 100 1000 0 25 50 75 100 125 150
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1N582x
Fig. 5-1: Average forward current versus ambient Fig. 5-2: Average forward current versus ambient
temperature (δ=0.5) (1N5820/1N5821). temperature (δ=0.5) (1N5822).
IF(av)(A) IF(av)(A)
3.5 3.5
Rth(j-a)=Rth(j-l)=25°C/W
Rth(j-a)=Rth(j-l)=25°C/W
3.0 3.0
2.5 2.5
2.0 2.0
Rth(j-a)=80°C/W Rth(j-a)=80°C/W
1.5 1.5
1.0 T 1.0 T
0.5 0.5
δ=tp/T tp Tamb(°C) δ=tp/T tp Tamb(°C)
0.0 0.0
0 25 50 75 100 125 150 0 25 50 75 100 125 150
Fig. 6-1: Non repetitive surge peak forward Fig. 6-2: Non repetitive surge peak forward
current versus overload duration (maximum current versus overload duration (maximum
values) (1N5820/1N5821). values) (1N5822).
IM(A) IM(A)
16 12
14 11
10
12 9
8 Ta=25°C
10 Ta=25°C
7
8 Ta=75°C
Ta=75°C 6
6 5
4 Ta=100°C
4 Ta=100°C
IM
3
IM
2 2
t t
δ=0.5 t(s) 1 δ=0.5 t(s)
0 0
1E-3 1E-2 1E-1 1E+0 1E-3 1E-2 1E-1 1E+0
Fig. 7: Relative variation of thermal impedance Fig. 8: Junction capacitance versus reverse
junction to ambient versus pulse duration (epoxy voltage applied (typical values).
printed circuit board, e(Cu)=35mm, recommended
pad layout).
Zth(j-a)/Rth(j-a) C(pF)
1.0 600
F=1MHz
Tj=25°C
1N5820
0.8
1N5821
1N5822
0.6
δ = 0.5 100
0.4
δ = 0.2 T
0.2 δ = 0.1
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1N582x
Fig. 9-1: Reverse leakage current versus reverse Fig. 9-2: Reverse leakage current versus reverse
voltage applied (typical values) (1N5820/1N5821). voltage applied (typical values) (1N5822).
IR(mA) IR(mA)
1E+2 5E+1
1N5821
Tj=125°C
1N5820 1E+1 Tj=125°C
1E+1
1E+0
1E+0 Tj=100°C Tj=100°C
1E-1 1E-1
Tj=25°C
1E-2 1E-2 Tj=25°C
VR(V) VR(V)
1E-3 1E-3
0 5 10 15 20 25 30 0 5 10 15 20 25 30 35 40
Fig. 10-1: Forward voltage drop versus forward Fig. 10-2: Forward voltage drop versus forward
current (typical values) (1N5820/1N5821). current (typical values) (1N5822).
IFM(A) IFM(A)
50.00 50.00
10.00 10.00
Tj=125°C Tj=125°C
Tj=100°C
1.00 1.00 Tj=100°C
Tj=25°C Tj=25°C
0.10 0.10
VFM(V) VFM(V)
0.01 0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
IFSM(A)
100
F=50Hz Tj initial=25°C
80
60
40
20
Number of cycles
0
1 10 100 1000
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1N582x
PACKAGE MECHANICAL DATA
DO-201AD plastic
B A B ØC
note 1 E E note 1
ØD ØD
note 2
DIMENSIONS
REF. Millimeters Inches NOTES
Min. Max. Min. Max.
A 9.50 0.374 1 - The lead diameter ♠ D is not controlled over zone E
B 25.40 1.000
♠C 5.30 0.209 2 - The minimum axial length within which the device may be
♠D 1.30 0.051 placed with its leads bent at right angles is 0.59"(15 mm)
E 1.25 0.049
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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1N5822 1N5822RL