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all electronic devices and equipment. An ideal PCB should be perfectly flat
This article provides a detailed overview of PCB bow and twist – how it
board assembly.
Bow refers to deviation of the PCB surface from perfect flatness resulting
board.
Twist indicates the amount of distortion in the planar form of the PCB
causing the corners to rise above or sink below the center plane. The four
The aim should be to control these within acceptable limits rather than try
Some key factors that create stresses leading to bowing and twisting of
PCBs are:
substrates and prepregs are bonded together under heat and pressure.
plating tanks etc. Non-uniform stresses on the panels can result in shape
distortions.
Any mismatch between position of internal layers and outer layers during
Plating Stresses
plating which can reach over 0.5 pounds per square inch. This tends to
individual PCBs from panels introduce twist and bow if not controlled.
fabrication makes bow and twist very difficult to avoid completely in PCBs.
manufacturing yield.
Affects Coplanarity
packs, ball grid arrays and other devices needing flat contact pads. Solder
Hampers Reliability
Stresses induced in solder joints and plated through holes due to board
Higher levels of bow and twist will fall outside permitted tolerance limits
Twisted boards cannot make flush contact with test fixture pins. Gaps
create false failures and unreliable test results. Fixture damage can also
occur.
Bowing and twisting results in PCBs failing during assembly process tests.
Increases Costs
Overall PCB cost increases due to lower fabrication yields, more rework,
permissible bow and twist. testing methods to measure bow and twist are
also defined.
Bow Measurement
across two edges of the diagonal of the PCB panel. Using a dial indicator,
Twist Measurement
pins stretched by rubber bands touch the PCB corners. The height
difference between the other two corners indicates the degree of twist.
Note:
During the design phase itself, analysis methods help predict the bow and
CLPT Analysis
FEA Tools
Finite element analysis tools like Ansys, Comsol etc. can construct 3D PCB
Analytical Calculations
Process Modeling
Mass curing models mimic the actual curing conditions like temperature
Historical Data
Thinner Dielectrics
Using prepregs and bonding sheets under 100 μm thick lowers thermal
Prepregs with CTE values between the extremes of copper and FR-4 (17 –
Embedding glass fabrics with very low CTE (2-5 ppm/°C) in prepregs
excessive distortion.
Routers with rigid linear motors, granite beds and linear encoders
Panel Symmetrization
Selectively removing copper from one side and adding dielectric layers
Panel Splicing
Cutting a large panel into smaller pieces can lower internal stresses and
Flattening Pressing
Applying high uniform pressure between flat plates compresses top and
While fabricating optimally flat PCB panels is ideal, somebow and twist is
unavoidable. Steps can be taken during PCB population and final product
Board Stiffening
Heating fully loaded boards to over 100°C then cooling slowly in controlled
Panelized Assembly
FAQs
How are very thin and flexible PCBs tested for bow and twist?
Related Posts:
3. What is DFM?
https://www.raypcb.com/bow-and-twist-in-pcb/