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Section 2.4
IMPORTANT!
Heat generated by the device is channeled outwards to the enclosure. As such, it is recommended that
2.5 cm (1 in) of space be maintained on all open sides of the device to allow for some convectional
airflow.
Forced airflow is not required. However, any increase in airflow will result in a reduction of ambient
temperature and improve the long-term reliability of all equipment mounted in the rack space.
NOTE
For detailed dimensions of the device with either rack, DIN rail or panel hardware installed, refer to
Chapter 5, Dimension Drawings .
CONTENTS
• Section 2.4.1, “Mounting the Device to a Rack”
• Section 2.4.2, “Mounting the Device on a DIN Rail”
• Section 2.4.3, “Mounting the Device to a Panel”
Section 2.4.1
CAUTION!
Vibration hazard – risk of damage to the device. Always use four rack mount adapters (two at the front
of the device and two at the rear) when installing the device in high-vibration or seismically active
locations.
CAUTION!
Electrical/mechanical hazard – risk of damage to the device. Before installing the device in a rack,
make sure of the following:
• When installing the device in a closed or multi-device rack, be aware that the operating ambient
temperature of the rack may be higher than the ambient temperature of the room. Make sure the
rack is installed in a suitable environment that can withstand the maximum ambient temperature
generated by the rack.
• Do not exceed the maximum number of devices or weight restrictions specified by the rack
manufacturer.
• Do not overload the supply circuit. Refer to the over-current protection and power supply ratings
specified by the rack manufacturer.