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DOI: 10.1039/x0xx00000x
easy, low-cost and scalable production of chemical sensor test strips. The Lab-on-PCB platform is enabled by low-boiling,
Università), Via S. Sofia 64, 95123 Catania, Italy The graphene channel in EG-GFET sensors is typically achieved
ꝉCorresponding author: f.torrisi@imperial.ac.uk
by chemical vapour deposition (CVD) of graphene on a copper
* these authors contributed equally
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foil and subsequent transfer of the graphene onto the desired compatibility with low-boiling solvents.52 We sonicate 500Online
View Article mg
substrate.38,39 However, a simpler and scalable approach is of graphite in 50 mL IPA for 9 hours stabilised
DOI: by small quantities
10.1039/D2NR05838C
available through solution-processable graphene inks which are (20 mg) of the biocompatible polyvinylpyrrolidone (PVP) to
prepared by liquid-phase exfoliation (LPE) through enable achieving the required concentration and improving the
sonication,40–42 hear mixing43 or microfluidisation44 of graphite. ink shelf life.65 The dispersion is then centrifuged at 13000 g to
The resulting inks can be then deposited by spray-coating45, ink- remove residual unexfoliated flakes, as further detailed in
jet printing46, screen-printing47 or aerosol-jet printing.48 This ‘Methods’.
forms thin films consisting of a network of single-layer graphene
(SLG) and few-layer graphene (FLG) flakes with average flake Whilst the PVP stabiliser increases the concentration and
thickness varying from 2 to 10 nm44,49,50 and carrier mobility of stability of the ink, it is known to lower the conductivity of the
up to 150 cm2V−1s−1.49 However, unlike CVD graphene, LPE nanostructured graphene thin films as it is electrically
graphene has only seen limited use in EG-GFET sensors51 insulating.66 PVP decomposes into gaseous products when
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despite its obvious advantages in terms of ink production heated to temperatures above 375 °C (Figure S1) but such high
scalability and the ease of its deposition.52 temperatures are above the decomposition temperature of the
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In this work, we present a novel route to manufacture EG-GFET The rheology of the graphene ink is investigated to assess its
test strips using PCB technology. We develop, a commercial and suitability for spray coating. The surface tension (𝛾) of the
accessible process to obtain scalable and low-cost EG-GFETs prepared graphene ink was 𝛾 ~ 18.50 ± 0.25 mN m-1 (Figure S2),
deposited by spray-coating. The function of such devices is lower than ~ 20.34 mN m-1 for pure 2-propanol at 25 °C, due to
demonstrated by detecting two analytes, pH and Na+, which are the added PVP stabiliser. Conversely, the resulting dynamic
relevant for a wide range of fields, for instance, point-of-care viscosity 𝜂 ~ 2.35 ± 0.1 mPa s is higher than ~ 2.01 mPa s for the
diagnostics56. agriculture57 and environmental monitoring58. pure 2-propanol70 due to the presence of the stabiliser and the
The sensor devices are characterised in terms of their concentration of the graphene flakes.
sensitivity, selectivity, limit-of-detection (LOD), limit of
quantification (LOQ), resolution, response time (τr) and linear The long-term stability of the graphene ink is an important
range (see Methods). parameter for reliable spraying and was investigated using OAS
as precipitation of the ink would result in a lower concentration
and absorbance, and with dynamic light scattering (DLS) to
2. Results and Discussion monitor the size and possible aggregation of the flakes. The
Synthesis & Characterisation of the Graphene Ink Stokes-Einstein relation is used to estimate the average particle
We select spray-coating as the deposition technique for our size in a dispersion, under the assumption of spherical particle
graphene ink, as this is a non-contact technique compatible shape, obtaining the intensity-weighted mean hydrodynamic
with high-throughput manufacturing.59 Spray-coating requires size (Z).71 This makes, in principle, DLS unreliable to measure the
inks with a boiling point between 50 and 100°C and a surface average particle size of non-spherical flakes, such as in our case.
tension as low as possible.45,60 For the graphene ink we select 2- However, it is possible to infer changes in the distribution of the
propanol (IPA), which has a boiling point 82 °C 61 and a surface dispersed flakes in our graphene ink caused by sedimentation
tension of only 20.34 mN m-1, satisfying both criteria. From the or aggregation using DLS by monitoring changes in the relative
wide range of possible graphene ink preparation methods50,62– Z (ZR). For instance, an increase in the mean ZR would indicate
64, we select sonication-assisted LPE due to its simplicity and aggregate formation. Figure 1b (top panel) plots the change in
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1.2 6
a b 4 Δ ZR
c 100 View Article Online
90 DOI: 10.1039/D2NR05838C
Δ ZR (%)
1.0 2 80
0 70
Absorbance
0.8 -2
60
Count
-4
50
0.6 0 Δ AR 40
Δ AR (%)
-5 30
0.4 20
-10
10
0.2 -15
250 500 750 1000 0 50 100 150 200 100 200 300 400 500
Wavelength (nm) Time (Days) Lateral Flake Size (nm)
d 110
100
e f D G Before Annealing
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90 After Annealing
80
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Intensity (A.U.)
D' 2D
70
60
50
40
30
20
10
0 2 4 6 8 10 12 14 16 1500 2000 2500 3000
Flake Thickness (nm) Raman Shift (cm-1)
Figure 1: a) OAS of the LPE graphene ink diluted by a factor of 61. b) DLS and OAS stability analysis. DLS indicates stability against aggregation, with < 3% decrease in relative size
over 190 days whilst UV-Vis indicates gradual sedimentation initiating after 72 days of storage, peaking at -14.8% at day 190. c) AFM statistics showing a log normal distribution of
<S> peaking at 190 nm. d) AFM statistics showing a log normal distribution of <t> peaking at 2.65 nm, which equates to a mean of 5-layer thick graphene when adjusted for a 1 nm
water layer. e) TEM image of a typical LPE graphene flake before photonic annealing. f) Raman spectra before and after photonic annealing.
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are achieved using 2.54 mm-spaced gold-plated contacts, The EG-GFET channel is formed by automatic spray-coating (see
designed to fit into standard card edge connectors. Methods) to ensure repeatable and scalable deposition of
graphene ink onto the PCB test strip (Figure 2 step 3). The
Under ideal circumstances, the electrode surface must be inert contact angle between the ink and the PCB surface was only 7.8
under standard sensing conditions, to reduce the occurrence of ± 0.6° (Figure 3e) and shows excellent wetting which
undesirable chemical interference.75 The surface of the PCB test contributes to film uniformity as the individual drops coalesce
strip electrodes is plated with a 4 µm layer of nickel and a 75 nm into a thin film before evaporating45. Furthermore, increasing
layer of gold in a commercial electroless process (ENIG) to the atomisation gas pressure, which is applied on the liquid
ensure inertness of the electrodes, similar to the process in being ejected from the nozzle, decreases the average droplet
ref.76 However, clear Faradaic peaks from oxidation (at positive size of graphene ink, which contributes to the formation of films
potentials vs. Ag/AgCl reference) and reduction (-0.4 V vs. with uniform thickness by depositing a larger number of smaller
Ag/AgCl) of nickel or copper were observed (Figure 3c, red droplets45,60. Therefore, the maximum pressure (275 kPa)
curve) upon running cycling voltammetry in 10 mmol L-1 permitted by the setup was used. The distance between the
phosphate buffer with the gate electrode as the working airbrush and the substrate (40 mm) was chosen such that the
electrode and a carbon rod as the counter electrode. This spray cone covered the entire area of the channel in a single
experiment simulates the potentials the electrodes would be pass. The spray rate was adjusted such that the film dried
exposed to during EG-GFET measurements and, ideally, no between the passes and the total volume of the ink was kept
peaks indicating the corrosion of the electrodes would be constant at 0.4 mL to obtain approximately 100 channel
observed. The red curve in Figure 3c shows that at even low resistivity after photonic annealing. The repeatability of the
voltage of 0.3 V vs. Ag/AgCl, the electrodes would start to spray coating is shown in Figure S5 in Supporting information,
dissolve, interfering with EG-GFET sensing. XPS depth profiling demonstrating an 8% standard deviation with respect to the
of the electrodes to approximately 120 nm depth revealed the mean electrical resistance of the sensor batch.
presence of copper throughout (Figure 3d, top) in addition to
gold, likely coming from an uneven coverage of the gold layer. We investigated the effect of photonic annealing on the
A layer containing nickel and phosphorus was observed electrical resistance of the EG-GFET channel by exposing the
approximately 80 nm below the surface which is expected. The PCB test strip to three different IPL energies (Figure 3f). Xenon
ENIG gold plating process is primarily intended to improve the IPL exposure at 2.5 J cm-2, 3.75 J cm-2 and 5.0 J cm-2 resulted in a
solderability of the PCBs rather than provide electrochemically similar decrease of the resistance from 309.8 (not annealed,
inert electrodes, as reported previously.77 Therefore, a 0.5 µm- red curve) to 112.4, 107.9 and 114.7 for light pulse energies
thick layer of platinum was electroplated onto all the of 2.5 J cm-2, 3.75 J cm-2 and 5.0 J cm-2, respectively. Therefore,
electrodes, to render them inert (Figure 2, step 2). XPS profiling the lowest IPL energy (2.5 J cm-2) was used for all subsequent
the electroplated electrodes shows the presence of only pure experiments, ensuring improved channel resistance with
platinum in the top 120 nm (Figure 3d, bottom) and the cyclic minimal risk of damage to the PCB.
voltammetry sweeps (Figure 3c blue curve) show substantially
reduced Faradaic currents, typically associated with water
electrolysis on platinum electrodes.78
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I (mA)
2
1
0
-1
-2
-1.0 -0.5 0.0 0.5 1.0
E vs Ag/AgCl (V)
d 100 e f
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Au 4f 4 No Annealing
75
Atomic %
P 2p
50 2
ID (mA)
25 Cu 2p Xe, 5.0 J cm-2
0 0
Electroplate Pt -2
Atomic %
100
Pt 4f -4
0
0 250 500 750 1000 1250 1500 -0.4 -0.2 0.0 0.2 0.4
Etch Time (s) VDS (V)
Figure 3: a) Photograph of the GFET on PCB. b) SEM micrograph of the interdigitated electrodes. c) Cyclic voltammetry between -1 and 1V using the original ENIG plated electrodes
and Pt-plated electrodes, showing the nickel redox peaks and substantially greater stability of the Pt electrodes. d) Depth profile of ENIG (top) and Pt (bottom) plating of the PCB.
The approximate depth after 1500 seconds is 120 nm (0.08 nm s-1). e) Contact angle of a drop of the graphene ink on PCB substrate, showing a contact angle of θ = 7.8 ± 0.6o. f) ID -
VDS curves for the graphene channel showing a change in resistance after IPL annealing. The electrodes were dry (not in a solution) during the measurement. The resistances were
309.8 (not annealed) and 112.4, 107.9 and 114.7 for light pulse energies of 2.5 J cm-2, 3.75 J cm-2 and 5 J cm-2, respectively.
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ID (mA)
ID (mA)
1.8 2.0
1.6 1.8
1.6
1.4
1.4
1.2 1.2
1.0 1.0
-400 -200 0 200 400 600 -0.4 -0.2 0.0 0.2 0.4 0.6
VGS (mV) VGS (V)
300 10.00
d e 4.424 f
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4.422
ID Linear Fit
I (mA)
4.418 pH 7.46
9.25
150
pH 7.42
4.416 4.420
9.00
100 pH 7.5
ID (mA)
pH 7.35 4.418
4.414 4.415 pH 7.2
8.75
4.413
50 4.412 pH 7.20 120 124 128 132
Time (s)
0.0
2 4 6 8 10 12 0 100 200 300 400 500 600 3 4 5 6 7 8 9 10 11 12
Time (s) pH
pH
Figure 4: a) Schematic of the four-terminal EG-GFET. b) Forward and backward ID vs VGS sweeps of the EG-GFET in 10 mmol L-1 PB solution at VDS = +200 mV. c) Forward sweeps of
the ID vs VGS of the EG-GFET at decreasing pH values from pH 11 to pH 3. d) The Dirac point values extracted for the plots in c) showing a linearity of 25.8 ± 0.5 mV/pH. e) pH
switching showing an ultimate resolution of 0.04 pH units, with response times of < 10 s. f) ID sensitivity of 143 µA/pH through a linear range of pH 11 to pH 3 which is > 2800 times
greater than the IG response.
observed for graphene pH sensor prepared by alternative diminishing quantities, yielding R ~ 0.04 pH units for the EG-
graphene fabrication techniques such as CVD-grown graphene GFET. Both τr and R are in line with previously reported pH-
on SiO2 (21 – 22 mV/pH)88, suspended graphene (17 mV/pH)89, sensitive EG-GFET devices,96 demonstrating the suitability of
epitaxial graphene on silicon carbide (19 mV/pH)90 and our platform for commercial, scalable, and low-cost
mechanically exfoliated graphene on SiO2 (20 mV/pH),91 and manufacturing techniques with superior performance
within the same order of magnitude for reduced graphene characteristics to those based on CVD88 and mechanical
oxide (rGO) based devices (29 - 40 mV/pH).92,93 exfoliation91.
We also use the VGS sweeps to identify the ideal VGS value for The sensitivity of the device may alternatively be described as a
constant VGS sensing. A VGS value of + 50 mV was chosen for pH function of change in ID, at constant VGS and VDS. Figure 4f shows
sensing as it is in the linear regime of the ID response and is also a plot of ID values (black data points) as a function of pH at VDS
the VGS at which the minimum magnitude of IG occurs (Figure = + 200 mV and VGS = + 50 mV. A linear fit (red dashed line) of
S6). The EG-GFET resolution to pH sensing is ultimately limited the ID points, shows a sensitivity of 143 ± 7 µA/pH through a
by the noise of the measurement setup.94 Hence minimising IG dynamic range of pH 11.0 to 3.0. The sensitivity of ID to pH, is
is integral to minimising noise and drift, improving device over three orders of magnitude higher than the sensitivity of IG
lifespan, and ensuring robustness. 84,95 (blue data points), which is 0.05 ± 0.02 µA/pH over the same
range, thus excluding the possibility of electrolysis playing a
Figure 4e shows the response of ID (at VGS = + 50 mV and VDS = + significant role in the sensor response to pH.79 Moreover, we
200 mV) as a function of time to diminishing alternate additions demonstrated multiple EG-GFETs detecting for pH (N = 10) from
of acid and base, which change the pH of the measured 5 separate fabrication batches. The EG-GFETs were allowed to
solution. The baseline peak-to-peak ID noise is IDnoise, P-P ~ 1 µA settle for 180 s to attain a stable ID (Figure S7). The EG-GFETs
whilst root mean square (RMS) ID noise is IDnoise, RMS ~0.2 µA. show a mean pH sensitivity of sensitivity 3.05 ± 0.15 % per pH
Adjusting the pH from 7.50 to 7.20 caused ID to drop from 4.420 unit (Figure S8), between pH 3 and 11, with high precision and
mA to 4.414 mA. The inset in Figure 4e shows a zoomed in low variance (adjusted R2 = 98.04 %).
region of the same plot for a pH change of 0.30 (blue shading)
that we used to estimate the response time as τr ~ 4 s. The utility of EG-GFETs resides on their versatility towards
Subsequent adjustment of the pH from 7.20 back to 7.50 caused targeted detection of further species beyond H3O+/OH- (pH).
ID to return to 4.420 mA. The resolution R was determined by We tested the suitability of our platform to detect for Na+ by
measuring ID over subsequent additions of acid and base in depositing a sodium-selective membrane as a proof-of-concept
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ID (mA)
ID (mA)
ID (mA)
100 µmol L-1
1.5 1.5 250 µmol L-1 1.5
1.44
1.43 500 µmol L-1
1.4 1.4 1 mmol L-1 1.4
ID (mA)
1.42 Δ 2 mmol L-1
1.41
2 mmol L-1
Na+
1.40
1.3 1.3 1.39 1.3
765 780 795
Time (s)
-200 0 200 400 600 0 200 400 600 800 100 101 102 103 104 105
VGS (mV) Time (s) Concentration Na+ (µmol L-1)
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Figure 5: a) Sweep of a
Na+-selective EG-GFET in 10 mmol K-PB. b) Incremental addition of
L-1 Na+ results in proportional decreased in the ID. c) The GFET response has to Na+ is
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131.4. ± 5 µA/log10 change in Na+ in the range of 5 µmol L-1 to 10 mmol L-1.
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interest had an absorbance value in the range of 0.1 – 1.0 where solution in water (Acros Organics, extra pure) atView80 Article
°C for 10
Online
absorbance is approximately equal to the attenuance of the minutes.104 AFM analysis was carried out DOI:using Gwyddion (v
10.1039/D2NR05838C
dispersion.103 In the ink stability assays, OAS was used to 2.58). The mean flake size < 𝑆 > , is calculated < 𝑆 > = (∑
supplement the DLS data, by analysing the rate of ink flake 𝑥𝑦)/𝑛, where x and y are the length and width of the flakes74
sedimentation in the ink as a function of the change in and n the number of flakes, while mean flake thickness < 𝑡 >
absorbance (ΔA). The relative absorbance (AR) is defined as the is calculated by averaging the flake thickness at the thickest
absorbance values normalised to the absorbance at day 1, with point for each flake. The aspect ratio (Ar) was defined as
ΔAR subsequently defined as ΔAR = AR-1 – AR-X, where AR-1 and AR- <𝑆>/<𝑡> .
X being the AR at day 1 and the subsequent measurement day x
respectively. Surface tension and contact angle measurements. Surface
tension measurements were measured using the pendant drop
Raman spectra were measured on a Renishaw inVia micro- method using a FTA1000B imaging instrument (First Ten
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Raman spectrometer (WiRe 4.1) using a x20 objective with a Angstroms) using the Drop Shape Analysis (v2.0) software.
green 532 nm laser and 1800 lines/mm grating. An incident Drops were formed using a 20-gauge stainless steel dispenser
Open Access Article. Published on 24 January 2023. Downloaded on 1/25/2023 12:59:34 PM.
power of ≤ 1 mW was used to avoid thermal damage. Samples needle. Using the same instrument and dispenser needle, drops
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inertness. Plating was done at constant current of 1 mA for 30 Electrical measurements. Electrical measurements of Online
View Article the
minutes. The plating quality was inspected visually using optical graphene transistor devices were collected DOI:on a Keithley 4200
10.1039/D2NR05838C
microscopy and using XPS. (Keithley Interactive Test Environment [KITE] v9.1), using a
delay factor of 1.3, filter factor of 3 and A/D aperture times of 5
Spray coating. The graphene channel was deposited by spray PLC. Measurements were taken at the lowest available source
coating of the LPEG ink onto the interdigitated source-drain and current range. Measurements were taken at VDS = +200 mV
electrodes. The LPEG ink was spray-coated using a custom-built unless stated otherwise.
automatic spray-coating setup consisting of an airbrush Peak to peak noise measurements were measured by
mounted on movable platform with 3 axis of movement (XYZ) measuring the difference between the maximum and minimum
and with electronic gas flow control. The nozzle-substrate values within a region where no response signal is expected.
distance was chosen to 40 mm to cover the whole channel in a Alternatively, the RMS noise was measured as the standard
single pass. 275 kPa N2 gas was used as the atomisation gas and deviation of the baseline noise since mean of a noise signal is
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pipetted into the spray-coater reservoir was kept constant at Sensor measurements. Reference pH measurements were
Ion selective transistor. The recipe for the sodium ion selective Detection for sodium ions was conducted by sequential
transistor was adapted from Choudhury et al.107 In brief, a additions of Na2SO4 (VWR, ≥ 98% purity) solutions in deionised
solution of 80 mg mL-1 of the ion selective membrane was water or potassium phosphate buffer solution (K-PB). K-PB was
produced by dissolving 264 mg of polyvinyl chloride (PVC) prepared by dissolving 7.541 mmol of potassium phosphate
(Sigma Aldrich, high molecular weight, Selectophore grade), 530 dibasic, K2HPO4, (Sigma Aldrich, ACS reagent, ≥ 98% purity) and
mg (1.24 mmol) of bis(2-ethylhexyl) sebacate (DOS) (Sigma 2.459 mmol of potassium phosphate monobasic, KH2PO4,
Aldrich, selectophore grade) plasticiser, 5.6 mg (5.64 µmol) of (Sigma Aldrich, ACS reagent, ≥ 99 %) in 1L of deionised water.
sodium ionophore X (IUPAC: 4-tert-Butylcalix[4]arene-
tetraacetic acid tetraethyl ester, Sigma Aldrich, selectophore For each detected analyte, the relevant device performance
grade), and 1.6 mg (3.23 µmol) of potassium tetrakis ((4- characteristics were established, in line with existing
chlorophenyl)-borate (Sigma Aldrich, selectophore grade) ion protocols.108,109 The sensitivity is defined as the change in the
exchanger in 10 mL of tetrahydrofuran (THF) (Sigma Aldrich, device response divided by the corresponding change in
selectophore grade) and shaken for 10 minutes until the stimulus, which is also expressed as the slope of the signal to
solution turned translucent. A 9:1 dilution in THF was conducted stimulus.108,109 The limit of detection (LOD) is the lowest amount
to produce a solution of 8 mg mL-1. The solution was stored at 2 of analyte that can be detected whilst the limit of quantification
– 8 °C. (LOQ) is the lowest amount of analyte that can be quantified.108
The ion selective solution was deposited on top of the transistor The limit of quantitation (or quantification) is the analytical
by drop casting 5 µL of the 8 mg mL-1 solution onto the transistor value above which greater values can be quantified.108 The
and allowed 30 seconds to dry. A further 2.5 µL of 80 mg mL-1 linear range is the range of analyte concentrations at which the
was then deposited on top. The ion selective membrane (ISM) signal response is linearly proportional to the concentration of
was allowed to dry for 12 hours in ambient conditions. Prior to analyte.108 The resolution (R) is defined as the lowest difference
first characterisation, the membraned devices were immersed in concentration that can be distinguished on constant
for 15 minutes in a solution 0.1 mol L-1 NaCl (VWR, ACS reagent) changes.109 The response time (τr) is the time for a sensor to
followed by a 10-minute rinse in deionised water. The sodium respond from a stable concentration of analyte to a step change
selective sensors were reused by dipping in deionised water for in concentration.109 Hysteresis is the maximum difference in
10 minutes. output when a value is separately approached via increasing
and decreasing analyte concentration ranges109 or the
Device Measurements
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DOI: 10.1039/D2NR05838C
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