EMC VNXe1000 SeriesVNXe1600 Hardware Information Guide

EMC® VNXe1000 Series
VNXe1600 Hardware Information Guide

302-002-020
REV 02
Copyright © 2015 EMC Corporation. All rights reserved. Published in USA.
Published November, 2015
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2 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

CONTENTS
Chapter 1 VNXe1600 hardware information guide 5

About this guide..............................................................................................6
Related documentation................................................................................... 6
Preface............................................................................................................6
Chapter 2 VNXe1600 Overview 9

Overview....................................................................................................... 10
VNXe1600 platform.......................................................................................10
Chapter 3 VNXe1600 component descriptions 13

Disk processor enclosure.............................................................................. 14
General disk processor enclosure information..................................14
2U, 12 (3.5-inch) disk drive DPE....................................................... 15
2U, 25 (2.5-inch) disk drive DPE....................................................... 16
2U DPE rear view........................................................................................... 17
Fan modules.................................................................................... 18
SP power supply module..................................................................18
Storage processor rear view............................................................. 19
Chapter 4 I/O modules 25

SP I/O module types..................................................................................... 26
Four-port 1-Gb/s copper Ethernet personality module...................... 26
Four-port 8-Gb/s Fibre Channel personality module..........................27
Four-port 10-Gb/s Optical Ethernet personality module....................28
Small form-factor pluggable (SFP) transceiver modules................................. 29
Lucent Connector type interface.................................................................... 30
Chapter 5 Disk-array enclosures 31

Number of supported DAEs and disks............................................................32
General information on front-loading DAEs.................................................... 32
2U, 12 (3.5-inch) DAE.................................................................................... 33
Front view........................................................................................ 33
Rear view......................................................................................... 35
2U, 25 (2.5-inch) DAE (DAE5S)...................................................................... 39
2U, 25 (2.5-inch) DAE Front view...................................................... 39
2U, 25 (2.5-inch) rear view............................................................... 40
Appendix A Cabling 47
Cable label wraps..........................................................................................48
VNXe1600 DAE cabling..................................................................................48
Interleaved cabling with five DAEs in a VNXe1600 platform........................... 50
Stacked cabling with five DAEs in a VNXe1600 platform................................ 51
EMC VNXe1000 Series VNXe1600 Hardware Information Guide 3

CONTENTS

CHAPTER 1
VNXe1600 hardware information guide
This guide is a hardware information guide for the VNXe1600 platform. It provides an
overview of the architecture, features, and components of the VNXe1600 platform. The
specific aspects of the major components include the front and rear connectors and the
LED indicators.
l About this guide......................................................................................................6

l Related documentation........................................................................................... 6
l Preface....................................................................................................................6
VNXe1600 hardware information guide 5

About this guide

This guide is designed for personnel who install, configure, and maintain the VNXe1600
platform. To use this hardware publication, you should be familiar with digital storage
equipment and cabling.
Note
This document was accurate at publication time. New versions of this document might be
released. Check to ensure that you are using the latest version of this document.
Related documentation
The following EMC publications provide additional information:
l EMC® VNXe1000 Series VNXe1600 Installation Guide
l EMC® IPMI Tool Technical Note
These guides are available online at https://support.emc.com/products/
38171_VNXe1600. On the page that appears, click Documentation. On the page that
appears, under Content Type, click Manuals and Guides. On the right side of the page
that appears, a list of all the VNXe1600 product guides will appear. Select the desired
guide from this list.
Preface
As part of an effort to improve and enhance the performance and capabilities of its
product lines, EMC periodically releases revisions of its hardware and software.
Therefore, some functions described in this document may not be supported by all
versions of the software or hardware currently in use. For the most up-to-date information
on product features, refer to your product release notes.
If a product does not function properly or does not function as described in this
document, please contact your EMC representative.
Special notice conventions used in this document
EMC uses the following conventions for special notices:
DANGER
Indicates a hazardous situation which, if not avoided, will result in death or serious
injury.
WARNING
Indicates a hazardous situation which, if not avoided, could result in death or serious
injury.
CAUTION
Indicates a hazardous situation which, if not avoided, could result in minor or moderate
injury.
NOTICE
Addresses practices not related to personal injury.

Note
Presents information that is important, but not hazard-related.
Where to get help

EMC support, product, and licensing information can be obtained as follows:
Product information—For documentation, release notes, software updates, or for

information about EMC products, licensing, and service, go to EMC Online Support
(registration required) at http://Support.EMC.com.
Troubleshooting—Go to EMC Online Support at http://Support.EMC.com. After logging
in, locate the applicable Support by Product page.
Technical support—For technical support and service requests, go to EMC Customer
Service on EMC Online Support at http://Support.EMC.com. After logging in, locate
the applicable Support by Product page, and choose either Live Chat or Create a
service request. To open a service request through EMC Online Support, you must
have a valid support agreement. Contact your EMC sales representative for details
about obtaining a valid support agreement or with questions about your account.
Note
Do not request a specific support representative unless one has already been assigned to
your particular system problem.
Your comments
Your suggestions will help us continue to improve the accuracy, organization, and overall
quality of the user publications.
Please send your opinion of this document to:
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Preface 7

CHAPTER 2
VNXe1600 Overview
This section provides an overview for the VNXe1600 platform as well as an overview of
the architecture, features, and components of the VNXe1600.
l Overview............................................................................................................... 10
l VNXe1600 platform...............................................................................................10
VNXe1600 Overview 9
VNXe1600 Overview
Overview
The EMC VNXe1600 is a simple, affordable, and efficient storage array based on the
proved VNXe3200 architecture and feature set - purpose built for price sensitive small
and medium businesses (SMBs), remote office/branch office (ROBO), as well as
Enterprise Workgroup and Departmental environments.
The VNXe1600 is designed to be a customer installable, easy-to-use and deploy system
for small scale application and database, Exchange, and virtual server requirements. The
VNXe1600 supports SSD and HDD drives and includes host connectivity options such as
Fibre Channel and iSCSI (IPv4/6) with iSCSI Off Load performance - for maximum
deployment flexibility.
The VNXe1600 includes a rich set of enterprise storage software functionality and
advanced data services including thin provisioning to reduce capacity requirements,
FAST Cache to boost performance, asynchronous block replication for Disaster Recovery
(DR), snapshots for local data protection, and MCx™ multicore optimization for increased
processor efficiency. Additional services, including software pre-loading, rack and stack,
and certifications such as NEBS/DC are also available with VNXe1600.
The VNXe1600 key features:
l Provides dual-controller SAN storage in 2U form factor
l VNXe1600 Base Software including Unisphere management, FAST Cache, block
snapshots, remote protection - native asynchronous replication, and thin
provisioning
l Delivers VNXe advanced features in a low-cost, block-only storage array
l Great for small-scale applications and databases, Microsoft Exchange, virtual servers
l Built for five 9s (99.999%) availability
l Supports as many as 80 virtual machines
l iSCSI and Fibre Channel connectivity option
l Enhanced hardware and software support
VNXe1600 platform
This section shows examples of the front and rear views of a VNXe1600 platform. A
description of the hardware features is also included in this section.
Front view
The following illustrations show examples of the front view of the VNXe1600 platform
having either a 2U, 12 (3.5-inch) disk drive DPE or 2U, 25 (2.5-inch) disk drive DPE,
respectively.
Figure 1 Example of the front view of a VNXe1600 with a 2U, 12 (3.5-inch) disk drive DPE
Removing these drives will Removing these drives will Removing these drives will Removing these drives will
make the array unusable make the array unusable make the array unusable make the array unusable
SPD SPD SPD SPD
SAS 2TB 7.2K SAS 2TB 7.2K SAS 2TB 7.2K SAS 2TB 7.2K
SAS 2TB 7.2K SAS 2TB 7.2K

Installation

VNXe1600 Overview
Figure 2 Example of the front view of a VNXe1600 with a 2U, 25 (2.5-inch) disk drive DPE
Caution: Array Software on drives 0-3. Removing or relocating them
Will Make the Array Unusable
Rear view
Looking from left to right, the following illustration shows an example of the rear view of a
VNXe1600 having a DPE with two storage processors (SP B and A), respectively.
Figure 3 Example of the rear view of a VNXe1600
DC DC
AC AC
2/4Gb 8Gb 2/4Gb 8Gb

2 CNA 3 CNA 6Gb SAS 2 CNA 3 CNA 6Gb SAS
00
1GbE 1GbE
e0 e1 e2 e3 e0 e1 e2 e3
00
0 1 0 1
00
00
00
00
0
0
0
0
0
0
X4 HDMI X4 HDMI
Hardware features
Contained in a 2U platform architecture, the VNXe1600 DPE weighs approximately 54 lb
(24.5 kg) for a 12-drive DPE to 45 lb (20.4 kg) for a 25-drive DPE. The 12-drive DPE
measures 3.5 inches high x 17.5 inches wide x 19.7 inches deep (8.89 cm x 44.45 cm x
50.16 cm) and the 25-drive DPE measures 3.5 inches high x 17.5 inches wide x 17 inches
deep (8.89 cm x 44.45 cm x 43.18 cm). Between the front and rear of the enclosure, a
midplane distributes power and signals to all the enclosure components. In the
VNXe1600 platform, the 2U DPE SPs, the cooling modules/fans, and the power supply
modules plug directly into the midplane connections.
Note
The previously mentioned dimensions are approximate and do not include a rack or
cabinet enclosure.
Configured for AC-input power, the VNXe1600 platform includes the following hardware
features:
l One 2U DPE:
On the front of the DPE disk drives are supported in two types of carriers, 2U, 12 (3.5-
inch) disk drive carrier or a 2U, 25 (2.5-inch) disk drive carrier.
Note
Drives used in the 2U, 12 disk drive carrier cannot be used in the 2U, 25 disk drive
carrier. They are incompatible.
l On the rear of the 2U DPE, dual SPs (A and B) are supported; each SP consists of:
n A CPU module with an Intel Xeon Dual Core 2.6-GHz processor with one Double
Data Rate Three (DDR3) synchronous dynamic RAM (SDRAM) socket supporting
one 8 GB (1 x 8 GB) of memory per SP, for a total of 16 GB per DPE
n Optional supported personality or I/O module:
– Four-port 1Gb/s copper Ethernet I/O personality module supporting 1 Gb/s
(labeled 1 GbE e0, e1, e2, and e3)
– Four-port 8-Gb/s Fibre Channel (FC) I/O personality module supporting 2/4/8
Gb/s (labeled 2/4Gb 8Gb e0, e1, e2, and e3)
VNXe1600 platform 11
VNXe1600 Overview
– Four-port 10-Gb/s Optical Ethernet I/O personality module supporting10 Gb/s

(labeled 10 GbE e0, e1, e2, and e3),
Note
Only one supported personality module can be installed at a time. Additionally,

both SPs must have the same personality module installed.
n Two integrated Converged Network Adapter (CNA) ports (labeled 2 CNA and 3
CNA) configured for either 10GbE Optical iSCSI or 8- or 16-Gb/s Fibre Channel (FC)
capability; the 10GbE Optical iSCSI supports the 10G optical SFP and the 10G
Active/Passive TwinAX cables while the 8- or 16-Gb/s FC supports either the 8- or
16-Gb/s SFPs
n Two integrated four lane 6-Gb/s mini-SAS HD ports (labeled 6Gb SAS 0 and 1 x4);
supported speeds are 1.5, 3, and 6 Gb/s; uses a mini-SAS HD cable
n One 10/100/1000 LAN management (RJ-45) port (labeled with a management
icon)
n One 10/100/1000 LAN service (RJ-45) port (used to access the SP console with
the IPMItool)
Note
Used for diagnostic and services only, this service port uses SOL (serial on LAN).
The customer may be directed to use this port under the guidance of support
personnel.
n One Mini-USB port (Mini-B receptacle)
n One HDMI port (not used)
n One debug (NMI) port
n SP LEDs
n One power supply module
n Three cooling modules/fans
l VNXe1600 supports up to 200 disks within a single system, though the actual
number of DAEs available in a valid configuration depends on the types of DPE (12- or
25-slot), DAEs (12- or 25-slot), and drive capacity. A VNXe1600 with a 2U, 12 (3.5-
inch) slot DPE supports up to fifteen 2U 12 (3.5-inch) slot DAEs or up to seven 2U 25
(2.5-inch) slot DAEs. A VNXe1600 with a 2U, 25 (2.5-inch) slot DPE supports up to
fourteen 2U 12 (3.5-inch) slot DAEs or up to seven 2U 25 (2.5-inch) slot DAEs. You
can mix DAE types within a configuration.
l Any required cables including LAN cables
l Mounting rails with hardware
l Front bezel with VNXe1600 badge

CHAPTER 3
VNXe1600 component descriptions
This section describes the VNXe1600 platform components. Included with the
component description are illustrations and tables of the LEDs, ports or connectors, and
any controls.
Note
In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
l Disk processor enclosure...................................................................................... 14

l 2U DPE rear view................................................................................................... 17
VNXe1600 component descriptions 13

Disk processor enclosure

Two types of disk drive DPEs are supported:
l either 3.5-inch disk drives (hot-swappable)
l either 2.5-inch disk drives (hot-swappable)
Note
Disk drives used in the 2U, 12 disk drive DPE cannot be interchanged with the disk drives
from a 2U, 25 disk drive DPE.
NOTICE
When calculating the number of drives supported, the DPE is included in the total drive
slot quantity.
VNXe1600 supports up to 200 disks within a single system, though the actual number of
DAEs available in a valid configuration depends on the types of DPE (12- or 25-slot), DAEs
(12- or 25-slot), and drive capacity. A VNXe1600 with a 2U, 12 (3.5-inch) slot DPE
supports up to fifteen 2U 12 (3.5-inch) slot DAEs or up to seven 2U 25 (2.5-inch) slot
DAEs. A VNXe1600 with a 2U, 25 (2.5-inch) slot DPE supports up to fourteen 2U 12 (3.5-
inch) slot DAEs or up to seven 2U 25 (2.5-inch) slot DAEs. You can mix DAE types within a
configuration.
General disk processor enclosure information

The DPE (disk processor enclosure) comprises the following components:
l Drive carrier
l Disk drives
l Midplane
l Storage processor (SP) CPU
l SP dual fan pack cooling module
l SP power supply module
l EMI shielding
Drive carrier
The disk drive carriers are metal and plastic assemblies that provide smooth, reliable
contact with the enclosure slot guides and midplane connectors. Each carrier has a
handle with a latch and spring clips. The latch holds the disk drive in place to ensure
proper connection with the midplane. Disk drive activity/fault LEDs are integrated into the
carrier.
Disk drives
Each disk drive consists of one disk drive in a carrier. You can visually distinguish
between disk drive types by their different latch and handle mechanisms and by type,
capacity, and speed labels on each disk drive. You can add or remove a disk drive while
the DPE is powered up, but you should exercise special care when removing modules
while they are in use. Disk drives are extremely sensitive electronic components.
Midplane
A midplane separates the front-facing disk drives from the rear-facing SPs. It distributes
power and signals to all components in the enclosure. SPs and disk drives plug directly
into the midplane.

Storage processor (SP) CPU

The SP CPU is the intelligent component of the DPE. Acting as the control center, each SP
CPU includes status LEDs.
SP cooling module
Each SP has redundant cooling module fans to provide proper airflow and cooling to the
DPE. Each fan includes an amber fault LED. Latches on the fan pack lock it into place to
ensure proper connection.
SP power supply module
Each SP contains a power supply module that connect the system to an exterior power
source. Each power supply includes three LEDs (AC, DC, and fault). A latch on the module
locks it into place to ensure proper connection.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DPE disk drives. When installed in cabinets that include a front door, the DPE
includes a simple EMI shield. Other installations require a front bezel that has a locking
latch and integrated EMI shield. You must remove the bezel/shield to remove and install
the disk drives.
2U, 12 (3.5-inch) disk drive DPE

The following illustration shows the location of the disk drives and the status LEDs in a
2U, 12 (3.5-inch) disk drive DPE.
Figure 4 Example of the 2U, 12 (3.5-inch) disk drive DPE (front view)
1 2 3
Removing these drives will Removing these drives will Removing these drives will Removing these drives will
make the array unusable make the array unusable make the array unusable make the array unusable
SPD SPD SPD SPD

Installation
Table 1 2U, 12 (3.5-inch) disk drive DPE descriptions
Location Description Location Description

1 3.5-inch SAS disk drive 3 DPE power on LED (blue)
2 DPE fault LED (amber) 4 Disk drive ready/activity LED (blue)
The following table describes the 2U, 12 (3.5-inch) disk drive DPE and the disk drive
status LEDs.
2U, 12 (3.5-inch) disk drive DPE 15

Table 2 2U, 12 (3.5-inch) DPE and disk drive LEDs
LED Color State Description

DPE fault (location 2) Amber On DPE fault, including SP
faults.
— Off Normal
DPE power (location 3) Blue On Powering and powered up
— Off Powered down
Disk drive ready/activity (location 4) Blue On Powering and powered up
Note
Blinking, Disk drive is on with I/O
mostly on activity
The disk drive LED (a left or right triangle
symbol) points to the disk drive that it Blinking at Disk drive is spinning up or
refers to. constant rate down normally
Blinking, Disk drive is powered up

mostly off but not spinning
Note
This is a normal part of the

spin-up sequence, occurring
during the spin-up delay of
a slot.
— Off Disk drive is powered down
2U, 25 (2.5-inch) disk drive DPE

The following illustration shows the location of the disk drives and the status LEDs in a
2U, 25 (2.5-inch) disk drive DPE.
Figure 5 Example of the 2U, 25 (2.5-inch) disk drive DPE (front view)
1 2 3
Caution: Array Software on drives 0-3. Removing or relocating them
Will Make the Array Unusable
5 4

Table 3 2U, 25 (2.5-inch) disk drive DPE details

1 2.5-inch SAS disk drive 4 Disk drive fault LED (amber)
2 DPE fault LED (amber) 5 Disk drive ready/activity LED (blue)
3 DPE power status LED (blue)
The following table describes the 2U, 25 (2.5-inch) disk drive DPE and the disk drive
status LEDs.
Table 4 2U, 25 (2.5-inch) DPE and disk drive LEDs

DPE fault (location 2) — Off No fault has occurred, normal operation
Amber On Fault has occurred
DPE power (location 3) Blue On Powering and powered up
Disk drive fault (location 4) Amber On Fault has occurred
— Off No fault has occurred
Disk drive on/activity (location 5) Blue On Powering and powered up
Blinking Disk drive activity
2U DPE rear view

On the rear of the 2U DPE, viewing from left to right, each SP (B and A), consists of:
l Three cooling modules/fans
l SP power supply module
l SP B and A
The following illustration shows the location of the DPE components in one SP.
Figure 6 Example of DPE components in SP (rear view)
1 2
DC DC
AC AC
2/4Gb 8Gb 2/4Gb 8Gb

2 CNA 3 CNA 6Gb SAS 2 CNA 3 CNA 6Gb SAS
00
1GbE 1GbE
e0 e1 e2 e3 e0 e1 e2 e3
00
0 1 0 1
00
00
00
00
0
0
0
0
0
0
X4 HDMI X4 HDMI
4 3
2U DPE rear view 17

Table 5 DPE rear view descriptions

1 Cooling modules/fans (3) 3 Optional I/O module slot
2 Power supply module 4 Storage processor
Fan modules
The following illustration shows a fan module. A set of orange release tabs on each fan
module (location 1) locks it into place to ensure the proper connection.
Figure 7 Fan module
1 2
The following table describes the fan module fault LED.
Table 6 Fan module descriptions

Fault (location 2) Amber On Fault, not operating properly
— Off No fault, operating normally
SP power supply module

Figure 8 on page 18 shows the SP power supply module. Each power supply includes
three LEDs (AC, DC, and fault). A latch on the module locks it into place to ensure proper
connection.
Figure 8 SP latch, power supply (power in) recessed connector (plug), and status LEDs
AC
1
DC
2

NOTICE
The power supply used in your storage system must meet the storage system power
requirements and must be the same type of power supply to be used in both SPs (SP A
and B). You cannot mix power supply types.
Table 7 on page 19 describes the power supply (fault and power on) LEDs.
Table 7 SP power supply (fault and power on) LEDs

AC power (input) (location 1) Green On AC Power on
— Off AC Power off, verify source power
DC power (output) (location 2) Green On DC Power on
— Off DC Power off, verify source power
Fault (location 3) Amber On Power supply or backup fault, check cable

connection
Blinking BIOS, POST and OS booting up or system

overheating
— Off No fault or power off
CAUTION
Do not remove the SP power supply module while the SP is plugged in. The removal of a
power supply module for more than a few minutes can cause the SP to shut down due to
lack of cooling.
Storage processor rear view

On the rear of the storage processor, viewing from left to right, are:
l Two integrated Converged Network Adapter (CNA) port
l Two 6-Gb/s mini-SAS HD ports
l Optional personality or I/O module:
n Four-port 1Gb/s copper Ethernet I/O personality module supporting 1 Gb/s
(labeled 1 GbE e0, e1, e2, and e3)
n Four-port 8-Gb/s Fibre Channel (FC) I/O personality module supporting 2/4/8
Gb/s (labeled 2/4Gb 8Gb e0, e1, e2, and e3)
n Four-port 10-Gb/s Optical Ethernet I/O personality module supporting10 Gb/s
l Two RJ-45 LAN connectors (labeled with a network management symbol and a wrench
symbol
l SP status LEDs
l Mini-USB port
l HDMI port, not used
l Reset switch (NMI)
The following illustration shows the location of the SP components:
Storage processor rear view 19

Figure 9 Example storage processor (rear view)
1 2 3
2/4Gb 8Gb
6Gb SAS 1GbE
e0 e1 e2 e3
00
2 CNA 3 CNA
0 1
00
00
0
0
0
X4 HDMI
14 13 12 10 8 6 5 4
11 9 7
Table 8 Storage processor descriptions

1 SP release lever (left side) 8 Mini-USB connectora (Mini-B
receptacle);
2 Optional personality module slot 9 SP status/fault LED (amber/blue)
3 SP release lever (right side) 10 CRU fault LED (amber)
4 Service LAN (RJ-45) port2 (labeled 11 SP unsafe to remove LED (black

with a wrench symbol); uses SOL with white hand);
(serial over LAN)
5 Management LAN (RJ-45) port 12 SP power LED (green)

(labeled with a network
management symbol and 1GbE);
6 HDMI connector (labeled HDMI) 13 Two 6-Gb/s mini-SAS HD ports

(labeled 6Gb SAS 0x4 and 1x4)
7 NMIb (password reset) push 14 Two Converged Network Adapter

button (CNA) ports (labeled 2 CNA and 3
CNA)
a. A Mini-USB adaptor/converter (Mini-B plug to Standard A receptacle) is provided if you are

using a full-sized USB Flash drive.
b. NMI = non-maskable interrupt, push button used for password reset and forcing a system
dump. Hold for 2 seconds to reset the password. Hold for 10 seconds or more forces a reboot.
The following table describes the SP status LEDs.
Table 9 SP LEDs

Status/Fault Amber Blinks once every BIOS running
(location 9) four seconds
Blinks once every POST running

second

Table 9 SP LEDs (continued)

Blinks four times a Operating system boot started
second
On Fault detected
— Off Normal, no fault detected
Blue Blinks once every Operating system booted

four seconds
Blinks once every Operating system driver starting

second
Blinks four times a 1. Operating system driver started

second
2. Fault, a system error has occurred,
causing some storage resources to
become unavailable. The SP is not
operating and the status LED is
blinking.
On l System not initialized. A

management IP address (static or
dynamic) is assigned.
Note
Once license is accepted, the SP

Fault LED turns off.
l Degrade Mode
— Off Ready for I/O
Blue and Alternating at one Service mode

amber second intervals
Blue and Blinking once System not initialized. No management

amber every three IP address (static or dynamic) is
seconds assigned. Once management IP address
is assigned, the LED should restore to
original state and color.
CRU fault (location Amber On Fault, lights amber when an internal CRU
10) is faulted. For example, bad DIMM.
Unsafe to remove White On Do not remove SP, data could be lost

(location 11) during time periods like flashing BIOS/
POST firmware, updating resume PROMs.
— Off Safe to remove SP without the risk of

data loss.
Power (location 12) Green On Power on
Blink once a The SP is initializing a serial over LAN

second (SOL) session (standby)

Table 9 SP LEDs (continued)

— Off Power off, verify connection
Converged Network Adapter (CNA) ports

Each SP contains two integrated CNA ports (labeled 2 CNA and 3 CNA). These ports are
PCI Express 3.0 x4 adapters that provide interfaces that can be configured as either 10-
Gb/s Ethernet Optical iSCSI or 8-/16-Gb/s Fibre Channel.
Once you set the network protocol on the CNA ports you cannot switch to a different
network protocol.
Figure 10 Embedded CNA ports
DC
AC
2/4Gb 8Gb
2 CNA 3 CNA 6Gb SAS
00
1GbE
e0 e1 e2 e3
0 1
00
00
0
0
X4 HDMI
The 10GbE uses either 10Gb Optical SFP+ modules or 10G Active/Passive TwinAX cables
to provide 10GbE iSCSI connectivity. EMC, Brocade, and Cisco TwinAX Active cables are
supported.
The 8- or 16-Gb/s Fibre Channel (FC) uses 8- or 16-Gb/S SFP+ modules, respectively, to
provide FC connectivity.
CNA port activity LED
The CNA activity port LED—a bi-color blue/green LED below each connector— indicates
the link/activity of the port. The port activity LED color depends on the protocol
configured on the CNA.
l Fibre Channel CNA ports use a blue LED
l Ethernet CNA ports use a green LED
The following table describes the link/activity and connection speed associated with the
CNA port LEDs.
Table 10 CNA LED descriptions

Link/Activity Green On Ethernet link active
Blinking (1Hz) Ethernet port fault
Blue On Fibre Channel link active
Blinking (1Hz) Fibre Channel port fault
— Off Link inactive (Ethernet or FC)

Table 10 CNA LED descriptions (continued)
Storage processor internal components

Included within the SP, are the following replaceable components:
l SDRAM or memory modules
l Battery backup unit (BBU)
l mSATA SSD
l Personality or I/O module (optional)
SDRAM or memory module
The SDRAM or memory module slots reside on the rear section of the SP printed circuit
board (motherboard) within the SP.
Battery backup unit (BBU)
The SP includes a 3-cell Lithium-ion (Li-ion) internal battery or BBU that powers the
associated SP module and fans during a power event.
Like the SDRAM slots, the BBU also resides on the rear section of the SP.
mSATA SSD
Each SP has an mSATA SSD interface located under a plastic cover of the bottom of the
SP assembly. The mSATA Flash device resides on the bottom of the SP.
Personality or I/O module (optional)
The personality or I/O module resides on the front of the SP. For more information, see
I/O modules on page 25.


CHAPTER 4
I/O modules
Several types of I/O modules are supported. In this section, each I/O module description
includes the type of port (copper or optical) as well as a description of the LEDs.
l SP I/O module types............................................................................................. 26

l Small form-factor pluggable (SFP) transceiver modules......................................... 29
l Lucent Connector type interface............................................................................ 30
I/O modules 25
I/O modules
SP I/O module types

Many I/O module types are supported by the storage processor.
NOTICE
When adding new I/O modules, always install I/O modules in pairs—one module in SP A
and one module in SP B. Both SPs must have the same type of I/O modules in the same
slots.
Refer to VNXe1600 Overview on page 9 for a details on the supported types and the
system limits of storage processor I/O modules.
l Four-port 1Gb/s copper Ethernet I/O personality module supporting 1 Gb/s (labeled 1
GbE e0, e1, e2, and e3)
l Four-port 8-Gb/s Fibre Channel (FC) I/O personality module supporting 2/4/8 Gb/s
(labeled 2/4Gb 8Gb e0, e1, e2, and e3)
l Four-port 10-Gb/s Optical Ethernet I/O personality module supporting10 Gb/s
Four-port 1-Gb/s copper Ethernet personality module

Figure 11 on page 26 shows an example of the four-port 1-Gb/s copper Ethernet (RJ-45)
personality module. The 1 GbE ports are labeled e0, e1, e2, and e3.
These ports support speeds of 10-, 100-, and 1000-Mb/s Ethernet transmission rates
over copper wiring and are used for front-end connectivity.
WARNING
The four-port 1-Gb/s copper Ethernet (RJ-45) ports on the four-port 1-Gb/s copper
Ethernet I/O personality module are LAN ports not WAN ports. LAN ports contain safety
extra-low voltage (SELV) circuits, and WAN ports contain telephone-network voltage
(TNV) circuits. Some LAN and WAN ports both use RJ-45 connectors. Use caution when
connecting cables. To avoid electric shock, do not connect TNV circuits to SELV circuits.
Figure 11 1-Gb/s copper Ethernet personality module (RJ-45) port LEDs
e0 e1 e2 e3
3 2
Table 11 1-Gb/s copper Ethernet module descriptions

Fault (location 1) Amber On Fault, replace I/O module

I/O modules
Table 11 1-Gb/s copper Ethernet module descriptions (continued)

Activity, right (on each port) (location 2) Amber Blinking Transmit/receive activity
— Off No activity
Link, left (on each port) (location 3) Green On Network/link connection (any speed)
— Off No network/link connection
Note
The ports here are LAN ports. A symbol depicting a telephone handset with a line through
it indicates that you should not connect WAN type RJ-45 telephone connectors to these
ports.
To access the Ethernet ports, connect a Category 5, 5E, or 6 unshielded twisted-pair (UTP)
cable to the RJ-45 connectors on the back of the SP 1-Gb/s copper Ethernet personality
module.
Table 12 Ethernet cabling guidelines
Type Description
10Base-T or 100Base-TX EIA Categories 5 UTP (2 pairs) up to 328 ft (100 m)
1000Base-T EIA Category 6 (recommended)
Four-port 8-Gb/s Fibre Channel personality module

Figure 12 on page 28 shows an example of the 8-Gb/s Fibre Channel personality
module. The FC ports are labeled e0, e1, e2, and e3.
These ports are marked with a blue link LED and does not indicate port speed. The ports
can function at 2-, 4-, or 8-Gb/s depending on the host speed to which the port is
connected.
The four-port 8-Gb/s FC I/O personality module uses small form-factor pluggable+ (SFP+)
transceiver modules to connect to LC-type optical fibre cables. These SFP+ transceiver
modules are input/output (I/O) devices that plug into the FC port of the FC I/O personality
module. These SFP+ modules are hot-swappable. This means that you can install and
remove an SFP+ module while the SP is operating.
Note
A link LED may flash green for a second upon cable insertion due to the link discovery
process.
Four-port 8-Gb/s Fibre Channel personality module 27

I/O modules
Figure 12 Four-port 8-Gb/s Fibre Channel personality module LEDs
1 2
00
e0 e1 e2 e3
The following table describes the SP four-port 8-Gb/s Fibre Channel personality module
fault and port LEDs.
Table 13 Four-port 8-Gb/s Fibre Channel descriptions

Link (on each port) (location 2) Blue On 2-, 4-, or 8-Gb/s link speed
Blinking Small form-factor pluggable (SFP+) transceiver

module faulted, unsupported, or optical cable
fault.
— Off No network connection
Four-port 10-Gb/s Optical Ethernet personality module

Figure 13 on page 28 shows an example of the four-port 10-Gb/s Ethernet personality
module. The 10GbE ports are labeled e0, e1, e2, and e3.
The four 10-Gb/E ports supports Twin-ax cables, both active and passive, or small form-
factor pluggable (SFP) + transceiver modules to connect to LC-type optical fiber cables.
The SFP+ transceiver modules are input/output (I/O) devices that plug into the Ethernet
port of the personality module. These SFP+ modules are hot-swappable. This means that
you can install and remove an SFP+ module while the SP is operating.
Figure 13 Four-port 10-Gb/s Ethernet personality module LEDs
1 2
00
e0 e1 e2 e3
The following table describes the SP four-port 10-Gb/s Ethernet personality module fault
and port LEDs.

I/O modules
Table 14 Four-port 10-Gb/s Ethernet descriptions

Link (on each port) (location 2) Green On 10-Gb link speed
Green Blinking Small form-factor pluggable (SFP+) transceiver

module faulted, unsupported, or optical cable
fault.
— Off No network connection
Small form-factor pluggable (SFP) transceiver modules

Certain I/O modules use a small form-factor pluggable plus (SFP+) transceiver module for
cable connections. The SFP+ transceiver modules connect to Lucent Connector (LC) type
interface (see Lucent Connector type interface on page 30 for more information) optical
fibre cables. These SFP+ transceiver modules are input/output (I/O) devices. These SFP+
modules are hot swappable. This means that you can install and remove an SFP+ module
while the component is operating.
Figure 14 on page 29 shows an example of an SFP+ module.
Figure 14 Example of an SFP+ module
4
3
2
1 CNS-001090
Table 15 SFP+ module descriptions

1 Dust plug (protective cap) 3 Send or transmit (TX) optical bore
2 Bale clasp latch 4 Receive (RX) optical bore
Small form-factor pluggable (SFP) transceiver modules 29

I/O modules
Lucent Connector type interface

The Lucent Connector (LC) type interface was developed by Lucent Technologies (hence,
Lucent Connector). It uses a push-pull mechanism. LC connectors are normally held
together in a multimode duplex configuration with a plastic clip. These cables are usually
colored orange for OM2 multimode optical fiber type cables and aqua for OM3 multimode
optical fiber type cables. These cables have the duplex connectors encased in a gray
plastic covering. To determine the send or transmit (TX) and receive (RX) ferrules
(connector ends), these cables will show a letter and numeral (for example A1 and A2 for
the TX and RX, respectively) or a white and yellow rubber gasket (jacket) for the send or
transmit (TX) and receive (RX) ends Figure 15 on page 30.
Figure 15 Example of LC-type connectors
2
A
1
A
4 CNS-001102
Table 16 LC-type connector details

1 Cable 3 Rubber gasket (jacket), receive
(RX)
2 Rubber gasket (jacket), send or 4 Ferrule (connector end to SFP+

transmit (TX) module)

CHAPTER 5
Disk-array enclosures
This section describes and illustrates the front- and rear-panel controls, ports, and LED
indicators on the supported disk-array enclosures (DAEs).
l Number of supported DAEs and disks....................................................................32

l General information on front-loading DAEs............................................................ 32
l 2U, 12 (3.5-inch) DAE............................................................................................ 33
l 2U, 25 (2.5-inch) DAE (DAE5S).............................................................................. 39
Disk-array enclosures 31
Number of supported DAEs and disks

VNXe1600 supports up to 200 disks within a single system, though the actual number of
DAEs available in a valid configuration depends on the types of DPE (12- or 25-slot), DAEs
(12- or 25-slot), and drive capacity. A VNXe1600 with a 2U, 12 (3.5-inch) slot DPE
supports up to fifteen 2U 12 (3.5-inch) slot DAEs or up to seven 2U 25 (2.5-inch) slot
DAEs. A VNXe1600 with a 2U, 25 (2.5-inch) slot DPE supports up to fourteen 2U 12 (3.5-
inch) slot DAEs or up to seven 2U 25 (2.5-inch) slot DAEs. You can mix DAE types within a
configuration.
Note
DAE configuration rules are:

l Maximum number of enclosures per bus is 10, when supported.
l Consider the maximum number of drives supported by the system when adding
additional DAEs, when supported. If the resulting total drive slot quantity exceeds the
supported limit, you will not be able to add another DAE.
Note
Lifting the disk-array enclosure (DAE) and installing it into or removing it from a rack is a
two to three-person job. If needed, use an appropriate lifting device (mechanical lift).
General information on front-loading DAEs

Each DAE with front facing drives typically consists of the following components:
l Drive carrier
l Disk drive
l Midplane
l Link control cards (LCCs)
l Power supply/cooling modules
l EMI shielding
Drive carrier
The disk drive carriers are metal and plastic assemblies that provide smooth, reliable
contact with the enclosure slot guides and midplane connectors. Each carrier has a
handle with a latch and spring clips. The latch holds the disk drive in place to ensure
proper connection with the midplane. Disk drive activity/fault LEDs are integrated into the
carrier.
Disk drives
Each disk drive consists of one disk drive in a carrier. You can visually distinguish
between disk drive types by their different latch and handle mechanisms and by type,
capacity, and speed labels on each disk drive. You can add or remove a disk drive while
the DAE is powered up, but you should exercise special care when removing disk drives
while they are in use. Disk drives are extremely sensitive electronic components.
Midplane
A midplane separates the front-facing disk drives from the rear-facing LCCs and power
supply/cooling modules. It distributes power and signals to all components in the

enclosure. LCCs, power supply/cooling modules, and disk drives plug directly into the
midplane.
Link control cards (LCCs)
An LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and expansion to
downstream devices. An enclosure address (EA) indicator is located on each LCC. Each
LCC also includes a bus (loop) identification indicator.
Power supply/cooling modules
The power supply/cooling module integrates independent power supply and blower
cooling assemblies into a single module.
Each power supply is an auto-ranging power-factor-corrected, multi-output, off-line
converter with its own line cord. The drives and LCC have individual soft-start switches
that protect the disk drives and LCC if you install them while the disk enclosure is
powered up. A disk or blower with power-related faults will not affect the operation of any
other device.
Each power/cooling module has three status LEDs.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DAE disk drives. When installed in cabinets that include a front door, the DAE
includes a simple EMI shield. Other installations require a front bezel that has a locking
latch and integrated EMI shield. You must remove the bezel/shield to remove and install
the disk drive modules.
2U, 12 (3.5-inch) DAE

The 2U, 12 (3.5-inch) disk drive DAE is 2U (3.5 inches) high and includes slots for 12 disk
drives. It uses a 6-Gb/s SAS interface for communication between the storage processors
(SPs) and the DAE.
Front view
On the front, viewing from left to right, the 2U, 12 (3.5-inch) disk drive DAE includes the
following components:
l 3.5-inch disk drives (hot-swappable)
l Status LEDs
The following illustration shows the location of these components.
2U, 12 (3.5-inch) DAE 33

Figure 16 Example of a 2U, 12 (3.5-inch) DAE (front view)
1 2 3
SPD

Installation
Table 17 2U 12 disk drive DAE descriptions

1 3.5-inch SAS drives 3 DAE power on LED (blue)
2 DAE fault LED (amber) 4 Disk drive ready/activity LED (blue)
The following table describes the DAE and the 3.5-inch disk drive status LEDs.
Table 18 Example of a 2U, 12 (3.5-inch) DAE and the disk drive LEDs

DAE fault (location 2) Amber On DPE fault, including SP
faults.
— Off Normal, no fault has

occurred.
DAE power (location 3) Blue On Powering and powered up
Disk drive ready/activity (location 4) Blue On Powering and powered up
Note
Blinking, Disk drive is on with I/O
mostly on activity
The disk drive LED (a left or right triangle
symbol) points to the disk drive that it Blinking at Disk drive is spinning up or
refers to. constant rate down normally
Blinking, Disk drive is powered up but

mostly on not spinning
Note
This is a normal part of the

spin-up sequence, occurring
during the spin-up delay of a
slot.
— Off Disk drive is powered down

Rear view
On the rear, viewing from top to bottom, a 2U, 12 (3.5-inch) DAE includes the following
hardware components:
l Two link control cards (LCCs) A and B
l Two power supply/cooling modules (A and B)
Figure 17 Example DAE with two LCCs and two power supply/cooling modules (rear view)
1 1
2 1
6Gb SAS 6Gb SAS

8 6Gb SAS 6Gb SAS
4
X4 X4 # X4 X4 #
10 9 7 6 5 3
Table 19 DAE rear view descriptions

1 LCC B AC power supply/cooling 6 LCC A SAS connector (output);
model labeled with a double black
diamond symbol
2 LCC A AC power supply/cooling 7 LCC A left latch handle

model
3 LCC A right latch handle 8 LCC B
4 LCC A 9 LCC B power LED
5 LCC A SAS connector (input); 10 LCC B fault LED

labeled with a double black circle
(or dot) symbol.
LCC 6-Gb/s SAS port LEDs and port direction (input or output)
The following illustration shows the LCC 6-Gb/s SAS port LED—a bi-color (blue/green) LED
below the connector, either left or right—that indicates the link of the SAS port. The
following illustration also shows a double black circle (or dot) symbol for input (location
3) or a double black diamond symbol for output (location 2).
Figure 18 DAE LCC 6-Gb/s SAS port LED
2 3
6Gb SAS 6Gb SAS
1 x4 x4
4
Rear view 35
Table 20 DAE LCC 6-Gb/s SAS port LED

Link (locations 1 and 4) Blue On All lanes are running at 6 GB/s
Green On One or more lanes running at 1.5 or 3

Gb/s
Alternating blue/ Blinking Port is being marked by the host

green
— Off Not connected
6-Gb/s SAS LCC

The LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and output to downstream
devices.
The LCCs in a DAE connects to the storage processors and other DAEs. The cables connect
the LCCs in a system in a daisy-chain (loop) topology.
Internally, each DAE LCC uses protocols to emulate a loop; it connects to the drives in its
enclosure in a point-to-point fashion through a switch. The LCC independently receives
and electrically terminates incoming signals. For traffic from the system’s storage
processors, the LCC switch passes the signal from the input port to the drive being
accessed; the switch then forwards the drive output signal to the port.
Note
If the target drive is not in the LCC’s enclosure, the switch passes the input signal directly
to the output port.
Each LCC independently monitors the environmental status of the entire enclosure, using
a microcomputer-controlled monitor program. The monitor communicates the status to
the storage processor, which polls disk enclosure status. LCC firmware also controls the
SAS PHYs and the disk-module status LEDs.
An enclosure ID1 indicator is located on each LCC. Each LCC also includes a bus (back-
end port) identification indicator. The SP initializes the bus ID when the operating system
is loaded.
DAE LCC input/output ports and connectors

The 2U, 12 (3.5-inch) DAE LCC supports two 6-Gb/s SAS x 4 ports on the rear of the
device.
6-Gb/s mini-SAS x4 ports
The DAE6-Gb/s mini-SAS x4 ports on the rear of each LCC (A and B). This port provides an
interface for SAS and NL-SAS drives on the DAE. This port is a 26-circuit mini-SAS small
form-factor 8088 (SFF-8088) specification (socket or receptacle) using an SFF-8088
specification mini-SAS 26-circuit cable (plug) with a pull tab.
Note
Each mini-SAS cable is keyed with an in and out connection to prevent incorrect cabling.
1. The enclosure ID is sometimes referred to as the enclosure address (EA).

A video describing how to properly connect mini-SAS HD cables and mini-SAS cables to a
SP and a DAE, respectively, in a VNX product is available online at: https://
edutube.emc.com/, in the Search box, type in Mini-SAS HD Cable Connectivity. The
video will start immediately.
Note
The first half of the video shows an example of how to connect a mini-SAS HD cable to a
mini-SAS HD port while the second half shows how to connect a mini-SAS cable to a DAE
LCC port.
Table 21 on page 37 lists the DAE LCC 6-Gb/s mini-SAS port pin signals used on the
connector.
Table 21 6-Gb/s mini-SAS port connector pinout
Pin Signal Pin Signal

A1 GND B1 GND
A2 Rx 0+ B2 Tx 0+
A3 Rx 0- B3 Tx 0-
A4 GND B4 GND
A5 Rx 1+ B5 Tx 1+
A6 Rx 1- B6 Tx 1-
A7 GND B7 GND
A8 Rx 2+ B8 Tx 2+
A9 Rx 2- B9 Tx 2-
A10 GND B10 GND
A11 Rx 3+ B11 Tx 3+
A12 Rx 3- B12 Tx 3-
A13 GND B13 GND
LCC enclosure ID (enclosure address) and bus ID

On the rear of the LCC (A and B), an LCC enclosure ID indicator is provided (location 1).
This ID indicator is a seven-segment LED for displaying decimal numbers. The LCC
enclosure ID appears on both LCCs (A and B) which is the same ID number. The enclosure
ID is set at installation.
Each LCC includes a bus (loop) identification indicator (location 2). This indicator is a
seven-segment LED for displaying decimal numbers. The bus ID after the operating
system is loaded.
Rear view 37
Figure 19 Example of LCC loop bus ID and enclosure ID
6Gb SAS 6Gb SAS
x4 x4 #
2 1
DAE AC power supply/cooling module

The following illustration shows an example of the 2U, 12 (3.5 inch) disk drive DAE AC
power supply/cooling module with a power in (recessed) connector (plug) and status
LEDs.
Figure 20 Example of a DAE AC power supply/cooling module power in (recessed) connector (plug)
and status LEDs
2
1 3
The following table describes the DAE power supply/cooling module LEDs.
Table 22 DAE AC power supply/cooling module LEDs

Power (location 1) Green On Power on
— Off Power off
Fault (location 2) Amber On Power supply fault, check cable connection
Blinking BIOS, POST and OS booting up or system overheating
Fan Fault (location 3) Amber Fault Fault, not operating normally
— No fault No fault, fan operating normally
The power supply/cooling modules are located above the LCCs. The units integrate
independent power supply and blower cooling assemblies into a single module.
Each power supply is an auto-ranging, power-factor-corrected, multi-output, offline
converter with its own line cord. Each supply supports a fully configured DAE and shares
load currents with the other supply. The drives and LCCs have individual soft-start
switches that protect the disk drives and LCCs if they are installed while the disk
enclosure is powered up.
Note
Each line cord should be plugged into a different AC power distribution system (PDU) for
high availability.

2U, 25 (2.5-inch) DAE (DAE5S)

The 2U, 25 (2.5-inch) disk drive DAE is 2U (3.5 inches) high and includes slots for 25 disk
drives. It uses a 6-Gb/s SAS interface for communication between the storage processors
(SPs) and the DAE.
2U, 25 (2.5-inch) DAE Front view

On the front, the 2U, 25 (2.5-inch) disk drive DAE includes the following components:
l 2.5-inch 6-Gb/s SAS disk drives (hot-swappable)
l Status LEDs
Figure 21 on page 39 shows the location of these components.
Figure 21 Example of a 2U, 25 (2.5-inch) disk drive DAE (front view)
1 2 3
5 4
Table 23 2U, 25 (2.5-inch) disk drive DAE descriptions

1 2.5-inch 6-Gb/s SAS drives 4 Disk drive fault LED (amber)
2 DAE fault LED (amber) 5 Disk drive status/activity (blue)
3 DAE power status LED (blue)
Table 24 on page 39 describes the 2U, 25 (2.5-inch) DAE and disk drive status LEDs.
Table 24 2U, 25 (2.5-inch) DAE and disk drive status LEDs

DAE fault (location 2) Blue On No fault has occurred
Amber On Fault has occurred
DAE power (location 3) Blue On Powering and powered up
Disk drive fault (location 4) Amber On Fault has occurred
— Off No fault has occurred
2U, 25 (2.5-inch) DAE (DAE5S) 39

Table 24 2U, 25 (2.5-inch) DAE and disk drive status LEDs (continued)

Disk drive on/activity (location 5) Blue On Powering and powered up
Blinking Disk drive activity
2U, 25 (2.5-inch) rear view

On the rear of a 2U, 25 (2.5-inch) DAE are the following components:
l Two 6-Gb/s SAS LCCs ( link control cards); A (location 3) and B (location 2)
l Two power supply/cooling modules; A (location 4) and B (location 1)
Figure 22 on page 40shows the location of these components.
Figure 22 Example of 2U, 25 (2.5-inch) disk drive DAE (rear view)
1 2
#
X4
X4
SAS
6 Gb
A
6 Gb
SAS
X4
X4
3 4
2U, 25 (2.5-inch) DAE LEDs and connectors

Figure 23 on page 41 shows the location of the 2U, 25 (2.5-inch) DAE LEDs, connectors,
and the latch handles:
l AC power supply (A and B) recessed power in (plug)
l AC power supply (A and B) LEDs (power and fault)
l AC power supply (A and B) latch handle
l LCC (A and B) mini-SAS connectors (input and output)
l LCC (A and B) mini-SAS link LEDs
l LCC (A and B) bus ID
l LCC (A and B) LEDs (power and fault)
l DAE enclosure ID
l LCC (A and B) management (RJ-12) connector
l LCC (A and B) latch handle

Figure 23 Example of 2U, 25 (2.5-inch) disk drive DAE (rear view)
1 2 3 4 5 6 7 8 9 10 11
#
X4
X4
SAS
6 Gb
B
6 Gb
SAS
X4
X4
#
12
Table 25 2U, 25 (2.5-inch) DAE descriptions

1 LCC B power supply LED (on, 7 LCC B bus ID
green)
2 LCC B power supply fault LED (on, 8 LCC B power and fault LEDs
amber)
3 LCC B AC power supply power in 9 DAE enclosure ID or address

(recessed plug)
4 LCC B SAS connector link LED (on, 10 LCC B management (RJ-12)

blue) connector to SPS
5 LCC B SAS connector (input); 11 LCC A power supply latch handle

labeled with a double circle (dot)
symbol
6 LCC B SAS connector (output); 12 LCC A right latch handle

labeled with a double diamond
symbol
6-Gb/s SAS LCC

The LCC supports, controls, and monitors the DAE, and is the primary interconnect
management element. Each LCC includes connectors for input and output to downstream
devices.
The LCCs in a DAE connects to the storage processors and other DAEs. The cables connect
the LCCs in a system in a daisy-chain (loop) topology.
Internally, each DAE LCC uses protocols to emulate a loop; it connects to the drives in its
enclosure in a point-to-point fashion through a switch. The LCC independently receives
and electrically terminates incoming signals. For traffic from the system’s storage
processors, the LCC switch passes the signal from the input port to the drive being
accessed; the switch then forwards the drive output signal to the port.
Note
If the target drive is not in the LCC’s enclosure, the switch passes the input signal directly
to the output port.
2U, 25 (2.5-inch) rear view 41

Each LCC independently monitors the environmental status of the entire enclosure, using
a microcomputer-controlled monitor program. The monitor communicates the status to
the storage processor, which polls disk enclosure status. LCC firmware also controls the
SAS PHYs and the disk-module status LEDs.
An enclosure ID2 indicator is located on each LCC. Each LCC also includes a bus (back-
end port) identification indicator. The SP initializes the bus ID when the operating system
is loaded.
2U, 25 (2.5-inch) DAE LCC input/output ports and connectors

The 2U, 25 (2.5-inch) DAE LCC supports the following I/O ports on the rear:
Figure 24 LCC ports
A1 A13
B1 B13
6 Gb
SAS
X4
X4
#
l Two 6-Gb/s by four-lane PCI Gen 2 SAS ports

Figure 24 on page 42 shows an example of 6-Gb/s mini-SAS port connector (socket)
and cable connector (plug) with pull tab.
l One management (RJ-12) connector
Figure 24 on page 42 shows the management port (labeled with two symbols; one
depicting a telephone handset with a line through it and the other depicting a
battery).
6-Gb/s mini-SAS x4 ports
The DAE6-Gb/s mini-SAS x4 ports on the rear of each LCC (A and B). This port provides an
interface for SAS and NL-SAS drives on the DAE. This port is a 26-circuit mini-SAS small
form-factor 8088 (SFF-8088) specification (socket or receptacle) using an SFF-8088
specification mini-SAS 26-circuit cable (plug) with a pull tab.
Note
Each mini-SAS cable is keyed with an in and out connection to prevent incorrect cabling.
A video describing how to properly connect mini-SAS HD cables and mini-SAS cables to a
SP and a DAE, respectively, in a VNX product is available online at: https://
edutube.emc.com/, in the Search box, type in Mini-SAS HD Cable Connectivity. The
video will start immediately.
2. The enclosure ID is sometimes referred to as the enclosure address (EA).

Note
The first half of the video shows an example of how to connect a mini-SAS HD cable to a
mini-SAS HD port while the second half shows how to connect a mini-SAS cable to a DAE
LCC port.
Table 26 on page 43 lists the DAE LCC 6-Gb/s mini-SAS port pin signals used on the
connector.
Table 26 6-Gb/s mini-SAS port connector pinout
Pin Signal Pin Signal

A1 GND B1 GND
A2 Rx 0+ B2 Tx 0+
A3 Rx 0- B3 Tx 0-
A4 GND B4 GND
A5 Rx 1+ B5 Tx 1+
A6 Rx 1- B6 Tx 1-
A7 GND B7 GND
A8 Rx 2+ B8 Tx 2+
A9 Rx 2- B9 Tx 2-
A10 GND B10 GND
A11 Rx 3+ B11 Tx 3+
A12 Rx 3- B12 Tx 3-
A13 GND B13 GND
6-Gb/s mini-SAS port LEDs and port direction (input or output)

Figure 25 on page 43 shows the 6-Gb/s mini-SAS port LED—a bi-color (blue/green) LED
next to the connector, either left or right—that indicates the link/activity of the mini-SAS
port.
Figure 25 6-Gb/s mini-SAS port LED
1
6 Gb
SAS
X4
X4
2 3
Table 27 on page 44 describes the 2U DAE LCC 6-Gb/s port LEDs.

Table 27 6-Gb/s mini-SAS port LEDs

Link/activity (location 3) Blue On All lanes are running at 6 GB/s
Green On One or more lanes is not running at full

speed or disconnected
Alternating Blue/ Blinking Port is being marked by the host

Green
— Off Not connected
Management (RJ-12) port

The management port (labeled with two symbols; one depicting a telephone handset
with a line through it and the other depicting a battery). The telephone handset with a
line through it symbol means that you cannot connect telephone type circuits to this
connector (see the following WARNING).
WARNING
The RJ-12 port is a LAN port not a WAN port. LAN ports contain safety extra-low voltage
(SELV) circuits, and WAN ports contain telephone-network voltage (TNV) circuits. An
RJ-45 (or TNV-type) looks the same as the RJ-12 except for two very important
differences. An RJ-45 is an 8-wire modular jack. The RJ-12 is a six-wire modular jack. The
RJ-45 plugs and jacks are wider than their RJ-12 counterparts - 7/16" vs 3/8". An RJ-45
plug won't fit into an R-J12 jack. But an RJ-12 plug will fit into an RJ-45 jack. Use caution
when connecting cables. To avoid electric shock, do not attempt to connect TNV circuits
to SELV circuits.
2U, 25 (2.5-inch) LCC enclosure ID (enclosure address) and bus ID

On the rear of the LCC (A and B), an LCC enclosure ID indicator is provided (location 1).
This ID indicator is a seven-segment LED display for displaying decimal numbers. The LCC
enclosure ID appears on both LCCs (A and B) which is the same ID number. The enclosure
ID is set at installation. (Figure 26 on page 44)
Each LCC includes a bus (loop) identification indicator (location 3). This indicator
includes two seven-segment LED displays for displaying decimal numbers. The SP
initializes the bus ID when the operating system is loaded (Figure 26 on page 44).
Figure 26 Example of an LCC B enclosure ID, bus ID, and power on and power fault LEDs
1 3
6 Gb
SAS
X4
X4
Table 28 on page 45 describes the LCC status LEDs.

Table 28 LCC power on and power fault LEDs

Power on (location 4) Green On Power on
— Off Power off
Power fault (location 2) Amber On Fault detected
2U, 25 (2.5-inch) DAE AC power supply/cooling module

Figure 27 on page 45 shows an example of the 2U, 25 2.5 inch DAE AC power supply/
cooling module with a power in (recessed) connector (plug) (location 2), latch handle
(location 1), and status LEDs.
Figure 27 Example of a 2U 25 2.5 inch DAE AC power supply/cooling module power in (recessed)
connector (plug) and status LEDs
3 4
Table 29 on page 45 describes the 2U 25 2.5 inch DAE power supply/cooling module
LEDs.
Table 29 2U 25 2.5" DAE AC power supply/cooling module LEDs

Power fault (location Amber On Fault
3)
Blinking During power shutdown and
during overvoltage (OVP) and
undervoltage protection
(UVP) fault
Power on (location 4) Green On Power on
— Off Power off
The power supply/cooling modules are located to the left and right of the LCCs. The units
integrate independent power supply and dual-blower cooling assemblies into a single
module.

Each power supply is an auto-ranging, power-factor-corrected, multi-output, offline

converter with its own line cord. Each supply supports a fully-configured DAE and shares
load currents with the other supply. The drives and LCCs have individual soft-start
switches that protect the disk drives and LCCs if they are installed while the disk
enclosure is powered up. The enclosure cooling system includes two dual-blower
modules.

APPENDIX A
Cabling
This section describes examples of the types of cabling you will need to connect the DAEs
to your system. The descriptions are presented in illustrations and text. Each illustration
shows an example of the cable connection points (ports) located on the specific
hardware components for the
Note
The following sections only discuss the DAE cabling with the customer installable front-
loading DAEs.
For all other cabling of your system, its installation guide provides information about the
system power cabling, DAE power cabling, PDU power cabling, LAN cabling, and so on.
l Cable label wraps..................................................................................................48

l VNXe1600 DAE cabling..........................................................................................48
l Interleaved cabling with five DAEs in a VNXe1600 platform................................... 50
l Stacked cabling with five DAEs in a VNXe1600 platform........................................ 51
Cabling 47
Cabling
Cable label wraps

Each system comes with a cable label wrap guide or set of cable label wraps to affix to
the cables. These labels should be affixed to the appropriate cables as you connect the
cables. The installation guide for your system shows an example of the cable wrap guide
and how to affix the cable label wrap to a cable.
Note
If your system was assembled at the factory, all the cable labels have been affixed to the
cables except for any DAEs you have ordered. Additionally, if your system was not
assembled at the factory, the cable kit supplied with your product will have all the
required cables already labeled except for the DAEs.
VNXe1600 DAE cabling

Note
The DAE (s) that are to be directly connected to the DPE need to be located close enough
to the DPE so that the DPE-to-DAE interconnect cables (that are provided with every DAE)
can be routed and connected to the DPE easily.
Shown in the upcoming figures are examples of two-bus SAS cabling in this DPE-based
storage platform. The storage processors connect to the DAEs with mini-SAS HD (DPE
end) to mini-SAS (DAE end) cables. The cables connect LCCs in the DAEs of a storage
platform in a daisy-chain topology.
The DPE is automatically Enclosure 0 (EA0).
The first DAE is connected to the Storage Processor mini-SAS output port 1 and is
designated as Enclosure 0 (EA0).
The mini-SAS HD ports on the VNXe1600 platform DPE are labeled 0 and 1. Mini-SAS HD
port 0 is connected internally to the SAS expander that connects the internal DPE disks.
Since mini-SAS HD port 0 is already connected internally to the DPE disks, the first DAE
(2U, 12 disk drive DAE) is connected to mini-SAS HD port 1 to balance the load on the
SAS ports. The second DAE (2U, 25 disk drive DAE) is connected to mini-SAS HD port 0.
Notice that each DAE device supports two completely redundant buses (LCC A and LCC
B).
The rule of load or bus balancing is applied to all DAEs. That is, Bus 0 is Enclosure
Address 0 (EA0), Bus 1 is EA0, and so on. In the case of the VNXe1600 platform, Bus 0
EA0 is the DPE (SP A and B). So, to balance the load, Bus 1 EA0 becomes the first DAE
(LCC A and B) in the cabinet with the next DAE (LCC A and LCC B) as Bus 0 EA1, and so on.
If you have several DAEs in your VNXe1600 platform, you can daisy-chain them within
that bus. However, it is recommended that you balance each bus. In other words, always
optimize your environment by using every available bus, and spreading the number of
enclosures as evenly as possible across the buses.

Cabling
Note
On the DPE and DAE, each cable connectors (or ports) include a symbol to denote the
direction the cable needs to connect to. The mini-SAS HD cable connector (or port) on the
DPE has a double diamond symbol , indicating that it is the output from that device. On
the DAE, connect the cable to the mini-SAS cable connectors (or ports) that have a double
circle symbol , indicating the input to that device.
Cabling with two DAEs in a VNXe1600 platform

The following example in Figure 28 on page 49 shows how to connect two different
DAEs, a 2U, 12 disk drive DAE and a 2U, 25 disk drive DAE.
The cables shown in the following illustration are:
Note
The cable colors shown in the example are orange for Bus 0 and blue for Bus 1.
l Cable 1, orange, DPE to the 2nd DAE or 2U, 25 DAE (labels SP A SAS 0 to LCC A)
l Cable 2, orange, DPE to the 2nd DAE or 2U, 25 DAE DAE (labels SP B SAS 0 to LCC B)
l Cable 3, blue, DPE to the 1st DAE or 2U, 12 DAE (labels SP A SAS 1 to LCC A)
l Cable 4, blue, DPE to the 1st DAE or 2U, 12 DAE (labels SP B SAS 1 to LCC B)
Figure 28 Example of the VNXe1600 with two DAEs (2U, 12 disks and 2U, 25 disks) cabling
LCC B
LCC A
6Gb SAS 6Gb SAS
2 X4 1
LCC B LCC A
4 3
SP B SAS 1
SP A SAS 1
SP B SAS 0 SP A SAS 0
Note
The cable end on the mini-SAS end has single diamond symbol indicating it as the output
end. While the cable end on the mini-SAS HD end does not have a symbol.
VNXe1600 DAE cabling 49

Cabling
Interleaved cabling with five DAEs in a VNXe1600 platform

Figure 29 on page 51 shows a second example of a VNXe1600 platform with five DAEs
(all are 2U, 25 disk drive DAEs) or a VNXe1600 platform with a total of 150 disk drives
(including the DPE, a 2U, 25 disk drive device).
In the example, the rack accommodates five DAEs (three DAEs for Bus 1 and two DAEs for
Bus 0) along with the VNXe1600 system.
As described previously, the mini-SAS HD ports on the DPE are labeled 0 and 1. Mini-SAS
HD port 0 is connected internally to the SAS expander that connects to the internal DPE
disks. However, since five DAEs are available for a maximum of 125 disk drives, it is
recommended that the DAEs be load balanced. To do this, it is recommended that you
daisy-chain the DAEs for the most efficient load balancing. So, in
Figure 29 on page 51, two buses (Bus 0 and Bus 1) are available with the first DAE on
Bus 1 designated as EA0/Bus 1 (blue DAE). The second DAE continues Bus 0 and is
designated as EA1/Bus 0 (orange DAE). Then, the rest of the DAEs are intertwined in a
daisy-chain. So, the first DAE is daisy-chained to the third DAE designated as EA1/Bus 1,
the second DAE is daisy-chained to the fourth DAE designated as EA2/Bus 0, and so on.
The DAEs shown in Figure 29 on page 51 are:
Note
The DAE colors shown in the example are orange for Bus 0 and blue for Bus 1.
l EA0/Bus 1, blue DAE, DPE to 1st DAE (labels SP A SAS 1 to LCC A)
l EA0/Bus 1, blue DAE, DPE to 1st DAE (labels SP B SAS 1 to LCC B)
l EA1/Bus 0, orange DAE, DPE to 2nd DAE (labels SP A SAS 0 to LCC A)
l EA1/Bus 0, orange DAE, DPE to 2nd DAE (labels SP B SAS 0 to LCC B)
So, the cabling for Bus 1 is interleaved and daisy-chained through the remaining DAEs
starting with:
l EA1/Bus 1
While the cabling for Bus 0 is interleaved and daisy-chained through the remaining DAEs
starting with:
l EA2/Bus 0
The remaining cabling is daisy-chained for load balancing.
Note
In this example, Bus 0 is indicated with orange DAEs and Bus 1 is indicated with blue
DAEs.

Cabling
Figure 29 Example of the VNXe1600 platform with five interleaved DAEs (2U, 25 disks)
X4
SAS
6 Gb
B
EA 2/Bus 1
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
B
EA 2/Bus 0
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
B
EA 1/Bus 1
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
B
EA 1/Bus 0
A
6 Gb
SAS
X4
#
#
X4
SAS
6 Gb
EA 0/Bus 1
A
6 Gb
SAS
X4
Stacked cabling with five DAEs in a VNXe1600 platform

Figure 30 on page 52 shows a third example of a VNXe1600 platform with five DAEs (all
are 2U, 25 disk drive DAEs) or a VNXe1600 platform with a total of 150 disk drives
(including the DPE, a 2U, 25 disk drive device).
In the example, the rack accommodates five DAEs (three DAEs for Bus 1 and two DAEs for
Bus 0) along with the VNXe1600 system.
As described previously, the mini-SAS HD ports on the DPE are labeled 0 and 1. Mini-SAS
HD 0 is connected internally to the SAS expander that connects to the internal DPE disks.
However, since five DAEs are available for a maximum of 125 disk drives, it is
recommended that the DAEs be load balanced. To do this, it is recommended that you
daisy-chain the DAEs for the most efficient load balancing. So, in
Figure 30 on page 52, two buses (Bus 0 and Bus 1) are available with the third DAE on
Bus 0 designated as EA1/Bus 0 (orange DAE). The first DAE starts with Bus 1 and is
designated as EA0/Bus 1 (blue DAE). Then, the rest of the DAEs are stacked in a daisy-
chain. So, the first DAE is daisy-chained to the second DAE designated as EA1/Bus 1, the
third DAE is daisy-chained to the fourth DAE designated as EA2/Bus 0, and so on.
The cables shown in Figure 30 on page 52 are:
Note
The DAE colors shown in the example are orange for Bus 0 and blue for Bus 1.
l EA0/Bus 1, blue DAE, DPE to 1st DAE (labels SP A SAS 1 to LCC A)
l EA0/Bus 1, blue DAE, DPE to 1st DAE (labels SP B SAS 1 to LCC B)
l EA1/Bus 0, orange DAE, DPE to 4th DAE (labels SP A SAS 0 to LCC A)
l EA1/Bus 0, orange DAE, DPE to 4th DAE (labels SP B SAS 0 to LCC B)
So, the cabling for Bus 1 is stacked and daisy-chained through the remaining DAEs
starting with:
Stacked cabling with five DAEs in a VNXe1600 platform 51

Cabling
l EA1/Bus 1
While the cabling for Bus 0 is stacked and daisy-chained through the remaining DAEs:
l EA2/Bus 0
Note
In this example, Bus 0 is indicated with the orange DAEs and Bus 1 is indicated with the
blue DAEs.
Figure 30 Example of the VNXe1600 platform with five stacked DAEs (2U, 25 disks)
#
X4
SAS
6 Gb
EA 2/Bus 0
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
EA 1/Bus 0
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
EA 2/Bus 1
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
EA 1/Bus 1
A
6 Gb
SAS
X4
#
X4
SAS
6 Gb
EA 0/Bus 1
A
6 Gb
SAS
X4

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EMC® VNXe1000 Series

VNXe1600 Hardware Information Guide

Published November, 2015

2 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

Chapter 1 VNXe1600 hardware information guide 5

Chapter 2 VNXe1600 Overview 9

Chapter 3 VNXe1600 component descriptions 13

Chapter 4 I/O modules 25

Chapter 5 Disk-array enclosures 31

EMC VNXe1000 Series VNXe1600 Hardware Information Guide 3

4 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

l About this guide......................................................................................................6

VNXe1600 hardware information guide 5

About this guide

Addresses practices not related to personal injury.

6 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

Presents information that is important, but not hazard-related.

Where to get help

Product information—For documentation, release notes, software updates, or for

8 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

SPD SPD SPD SPD

SAS 2TB 7.2K SAS 2TB 7.2K

10 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

Caution: Array Software on drives 0-3. Removing or relocating them

Will Make the Array Unusable

2/4Gb 8Gb 2/4Gb 8Gb

– Four-port 10-Gb/s Optical Ethernet I/O personality module supporting10 Gb/s

Only one supported personality module can be installed at a time. Additionally,

12 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

l Disk processor enclosure...................................................................................... 14

VNXe1600 component descriptions 13

Disk processor enclosure

General disk processor enclosure information

14 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

Storage processor (SP) CPU

2U, 12 (3.5-inch) disk drive DPE

SPD SPD SPD SPD

SAS 2TB 7.2K SAS 2TB 7.2K

Table 1 2U, 12 (3.5-inch) disk drive DPE descriptions

Location Description Location Description

2 DPE fault LED (amber) 4 Disk drive ready/activity LED (blue)

2U, 12 (3.5-inch) disk drive DPE 15

Table 2 2U, 12 (3.5-inch) DPE and disk drive LEDs

LED Color State Description

DPE power (location 3) Blue On Powering and powered up

— Off Powered down

Disk drive ready/activity (location 4) Blue On Powering and powered up

Blinking, Disk drive is powered up

This is a normal part of the

— Off Disk drive is powered down

2U, 25 (2.5-inch) disk drive DPE

Caution: Array Software on drives 0-3. Removing or relocating them

Will Make the Array Unusable

16 EMC VNXe1000 Series VNXe1600 Hardware Information Guide

Table 3 2U, 25 (2.5-inch) disk drive DPE details

Location Description Location Description

2 DPE fault LED (amber) 5 Disk drive ready/activity LED (blue)

3 DPE power status LED (blue)

Table 4 2U, 25 (2.5-inch) DPE and disk drive LEDs

LED Color State Description

Amber On Fault has occurred

DPE power (location 3) Blue On Powering and powered up

— Off Powered down

Disk drive fault (location 4) Amber On Fault has occurred