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The electrical conductivity of plasma sprayed yttria-stahilized zirconia decreases with increasing
particle size injected into the plasma. The particle size-dependency 01' conductivity is related to the inadequate
flow of particles on impact with the substrate, porosity and the growth 01' columnar grains across splat
boundaries. The results suggest that the interfacial impedance is dominated by the splat boundary
configuration and columnar grain boundaries huye a secondary effect.
EXPERIMENTAL PROCEDURE
Figure 1. Scanning electron micrograph of YSZ feed powder prior to plasma spraying.
18
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Parlic1e size (M).
RESULTS AND DISCUSSION sprayed with different feed particle sizes. The
intragrain conductivity O'¡ and grain boundary O'g
The conductivity data are expressed as conductivity by may be calculated from:
Nyquist diagrams in which the imaginary
impedance is plotted the real impedance (Figure O'i = K/R¡ (1)
3). The locus of the points generally describes
two semicircles: it has been established [1-3] that O'g = K/Rg (2)
the semicircIe at the higher frequency on the left of
the diagram relates to intragrain resistance and the where K is the cell constant given by:
one at the lower frequency to grain boundary
resistance. The diagrams in Figure 3 reveal K = US (3)
significant differences between samples plasma
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Figure 3. Nyquist diagrams for YSZ deposits sprayed with different feed particle sizes. (A) 20-38 um,
(B) 38-52 um, (C) 52-75 um, (D) 75-90 um, (E) 90-110 um, ~M) 20-110 um.
where L and S are the sample thickness and cross- Examination of the deposits with light
sectional area respectively. R¡ and Rg are the microscopy and scanning electron microscopy
.intercept lengths 01' the respective semicircle on the showed that there was a general increase in the
real impedance axis. The results are given in volume fraction of pores in the YSZ deposits with
Table 1 along with the corresponding density increasing particle size (Figure 5). In arder to gain
measurements, and are plotted on Figure 4. The an insight into the mechanism of the formation of
data show that the density is initially constant and the deposits and its effect on density, wipe tests
then decreases (Figure 4a). However, the were undertaken in which glassslides were
conductivity immediately falls rapidly with plasma sprayed using an extremely rapid gun
increasing partic1e size, particularly the grain traverse speed. This results in the deposition of
boundary conductivity. Density or porosity isolated on the slide and enables the extent of flow
c1earIy has a blocking effect cm the transport 01' of individual particles on impact with the substrate
ions there may be other contributing factors. to be observed. Figure 6(a) shows that the
Table 1. Density, intragrain and grain boundary conductivities 01' plasma sprayed samples.
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Figure 5. SEM of YSZ deposits plasma spayed with different particle sizes (a) 20-38 urn, (b) 20-38 urn,
(e) 52-75 um, (d) 90-110 um.
a particle in the plasma provides homogenization A (20-38 um) and B (38-52 um) are virtually the
and absence of monolithic phaseon solidification, same while the conductivity of the latter 1S
whereas some monoclinic will clearly remain after markedly lower (Table 1, Figure 4). Examination
incomplete inelting. The presence of a significant of the micrographs in Figure 5 shows that there is
fraction of monoclinic phase in the deposit sprayed much more columnar grain growth across the splat
with the large (90-110 um) feed particles (Figure boundaries in sample A than the other samples.
7b) therefore indicates incomplete melting, while The columnar grains form during solidification of
virtually complete melting has occurred using the the molten splat and their growth across the
boundary between splats, are indicative of sound
small (20-38 urn) particle size (Figure 7c). The inter-splat bonding. The deposits formed from
influence of feed particle size on deposit density larger particles often exhibit gaps between the
(Figure 4a) can thus be understood in terms oí splats and inferior inter-splat bonding. These
thermal diffusion distances in the plasma and results suggest that the major contribution to the
particle flow on impact. grain boundary impedance is the bIocking effect of
The deterioration in conductivity with the splat boundaries rather than the columnar grain
increasing particle size can be attributed in part to boundaries. Measures to improve the bonding
the associated decreasing density, since pores will between splats and the goodness of fit of spIat
present a substantial blocking effect on the boundaries are likely to improve the conductivity
transport of ions through the grains and at grain od the deposits.
boundaries. Nevertheless, the density of samples
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ACKNOWLEDGEMENTS. REFERENCES
The authors wish to thank the Science and L A. O. Isenberg, Proc. Syrnp, "Electrode
Engineering Research Council and Cookson Materials and Processes for Energy Conversion
Group pIe for pennission to publish this paper. and Storage" , Electrochemical Society, 1977,
77-6, p 572.
2. G. Chiodelli, A. Magistris, M. Scagliotti and
Parrnigiani, 1. Mater. Sci., 23 (1988) 1159.