Professional Documents
Culture Documents
Barrier Diodes
MMSD301T1G,
SMMSD301T1G,
MMSD701T1G,
SMMSD701T1G, www.onsemi.com
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
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2
MMSD301T1G, SMMSD301T1G, MMSD701T1G, SMMSD701T1G,
TYPICAL CHARACTERISTICS
MMSD301T1G, SMMSD301T1G
2.8 500
MMSD301T1 MMSD301T1
400
2.0 KRAKAUER METHOD
300
1.6
1.2 200
0.8
100
0.4
0 0
0 3.0 6.0 9.0 12 15 18 21 24 27 30 0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (VOLTS) IF, FORWARD CURRENT (mA)
10
MMSD301T1 0.1 MMSD301T1
TA = -40°C
IR, REVERSE LEAKAGE ( m A)
TA = 100°C
IF, FORWARD CURRENT (A)
1.0
TA = 85°C
0.01
TA = 75°C
0.1
TA = 25°C 0.001
0.01 TA = 25°C
0.001 0.0001
0 6.0 12 18 24 30 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VR, REVERSE VOLTAGE (VOLTS) VF, FORWARD VOLTAGE (VOLTS)
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3
MMSD301T1G, SMMSD301T1G, MMSD701T1G, SMMSD701T1G,
TYPICAL CHARACTERISTICS
MMSD701T1G, SMMSD701T1G
2.0 500
MMSD701T1 MMSD701T1
1.6 400
KRAKAUER METHOD
1.2 300
0.8 200
0.4 100
0 0
0 5.0 10 15 20 25 30 35 40 45 50 0 10 20 30 40 50 60 70 80 90 100
VR, REVERSE VOLTAGE (VOLTS) IF, FORWARD CURRENT (mA)
10 100
MMSD701T1 MMSD701T1
IF, FORWARD CURRENT (mA)
IR, REVERSE LEAKAGE ( m A)
1.0 TA = 100°C
10
TA = 75°C TA = 85°C TA = -40°C
0.1
1.0
0.01 TA = 25°C
TA = 25°C
0.001 0.1
5 15 25 35 45 55 65 0.2 0.4 0.8 1.2 1.6 2.0
VR, REVERSE VOLTAGE (VOLTS) VF, FORWARD VOLTAGE (VOLTS)
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
DATE 07 OCT 2009
SCALE 5:1
D
A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
ÂÂÂÂ
A1 Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
ÂÂÂÂ
1
MILLIMETERS INCHES
ÂÂÂÂ
DIM MIN NOM MAX MIN NOM MAX
A 0.94 1.17 1.35 0.037 0.046 0.053
A1 0.00 0.05 0.10 0.000 0.002 0.004
b 0.51 0.61 0.71 0.020 0.024 0.028
HE E c --- --- 0.15 --- --- 0.006
D 1.40 1.60 1.80 0.055 0.063 0.071
E 2.54 2.69 2.84 0.100 0.106 0.112
HE 3.56 3.68 3.86 0.140 0.145 0.152
L 0.25 --- --- 0.010 --- ---
q 0° --- 10 ° 0° --- 10 °
2
q GENERIC
b L MARKING DIAGRAM*
C
XXXMG
1
SOLDERING FOOTPRINT* G
0.91
XXX = Specific Device Code
ÉÉÉ ÉÉÉ
0.036
M = Date Code
ÉÉÉ ÉÉÉ
G = Pb−Free Package
1.22 (Note: Microdot may be in either location)
ÉÉÉ 2.36
ÉÉÉ 0.048
*This information is generic. Please refer to device data
sheet for actual part marking. Pb−Free indicator, “G” or
microdot “ G”, may or may not be present.
0.093
4.19
STYLE 1:
0.165 PIN 1. CATHODE
2. ANODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42927B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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