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ORDERING INFORMATION
Benefits
• Reduced PCB Space Device Package Shipping†
• Standardized Driver for Wide Range of Relays NUD3124LT1G SOT−23 3000 / Tape &
(Pb−Free) Reel
• Simplifies Circuit Design and PCB Layout
SZNUD3124LT1G SOT−23 3000 / Tape &
• Compliance with Automotive Specifications (Pb−Free) Reel
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2
NUD3124, SZNUD3124
THERMAL CHARACTERISTICS
Symbol Rating Value Unit
TA Operating Ambient Temperature −40 to 125 °C
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range −65 to 150 °C
PD Total Power Dissipation (Note 5) SOT−23 225 mW
Derating above 25°C 1.8 mW/°C
PD Total Power Dissipation (Note 5) SC−74 380 mW
Derating above 25°C 3.0 mW/°C
RqJA Thermal Resistance Junction–to–Ambient (Note 5) SOT−23 556 °C/W
SC−74 329
5. Mounted onto minimum pad board.
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3
NUD3124, SZNUD3124
tPHL − 324 −
High to Low Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V)
tPLH − 1280 −
Low to High Propagation Delay; Figure 1, (VDS = 12 V, VGS = 5.0 V)
Transition Times: ns
Fall Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) tf − 2086 −
Rise Time; Figure 1, (VDS = 12 V, VGS = 3.0 V) tr − 708 −
tf − 556 −
Fall Time; Figure 1, (VDS = 12 V, VGS = 5.0 V)
tr − 725 −
Rise Time; Figure 1, (VDS = 12 V, VGS = 5.0 V)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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4
NUD3124, SZNUD3124
VIH
Vin 50%
0V
tPHL tPLH
VOH
90%
Vout 50%
10%
VOL
tf tr
25
Ppk, PEAK SURGE POWER (W)
20
15
10
0
1 10 100
PW, PULSE WIDTH (ms)
Figure 2. Maximum Non−repetitive Surge
Power versus Pulse Width
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NUD3124, SZNUD3124
140 14
12
10
VDS = 28 V
100
8
80 6
4
60
2
40 0
80 110 140 170 200 230 260 290 320 350 −50 −25 0 25 50 75 100 125
RELAY’S COIL (W) TJ, JUNCTION TEMPERATURE (°C)
Figure 4. Load Dump Capability versus Figure 5. Drain−to−Source Leakage versus
Relay’s Coil dc Resistance Junction Temperature
80 34.8
BVDSS BREAKDOWN VOLTAGE (V)
70 34.6
IGSS GATE LEAKAGE (mA)
34.4
60
VGS = 5 V 34.2 ID = 10 mA
50
34.0
40
33.8
VGS = 3 V
30 33.6
20 33.4
−50 −25 0 25 50 75 100 125 −50 −25 0 25 50 75 100 125
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Gate−to−Source Leakage versus Figure 7. Breakdown Voltage versus Junction
Junction Temperature Temperature
1 1
VGS = 5 V
VDS = 0.8 V
0.1
0.01
ID DRAIN CURRENT (A)
1E−04
0.001
85 °C
1E−06 1E−04
1E−05 25 °C
VGS = 1 V
1E−08
1E−06 −40 °C
1E−10 1E−07
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)
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NUD3124, SZNUD3124
1800 0.20
RDS(ON), DRAIN−TO−SOURCE RESISTANCE (mW)
800 0.06
ID = 0.15 A 0.04
600 VGS = 5.0 V 0.02
400 0.00
−50 −25 0 25 50 75 100 125 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
TJ, JUNCTION TEMPERATURE (°C) VGS, GATE−TO−SOURCE VOLTAGE (V)
Figure 10. On Resistance Variation versus Figure 11. On Resistance Variation versus
Junction Temperature Gate−to−Source Voltage
36.0
VZ ZENER CLAMP VOLTAGE (V)
35.5
35.0
34.5 −40 °C
25 °C
34.0
85 °C
33.5
125 °C
33.0
32.5
32.0
0.1 1.0 10 100 1000
IZ, ZENER CURRENT (mA)
Figure 12. Zener Clamp Voltage versus Zener
Current
1.0
D = 0.5
RESISTANCE (NORMALIZED)
0.2
r(t), TRANSIENT THERMAL
0.1
0.1
0.05
Pd(pk)
0.02
0.01
0.01 PW t1
t2 PERIOD
SINGLE PULSE DUTY CYCLE = t1/t2
0.001
0.01 0.1 1.0 10 100 1000 10,000 100,000 1,000,000
t1, PULSE WIDTH (ms)
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NUD3124, SZNUD3124
APPLICATIONS INFORMATION
12 V Battery
− +
NO
NC
Relay, Vibrator,
or
Inductive Load
Drain (3)
Gate (1) 10 k
Micro
Processor
Signal
100 K
for
Relay
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AS
DATE 30 JAN 2018
SCALE 4:1
D NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
3 THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
E HE T PROTRUSIONS, OR GATE BURRS.
1 2
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
L A 0.89 1.00 1.11 0.035 0.039 0.044
3X b A1 0.01 0.06 0.10 0.000 0.002 0.004
L1 b 0.37 0.44 0.50 0.015 0.017 0.020
e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008
TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.080
L 0.30 0.43 0.55 0.012 0.017 0.022
L1 0.35 0.54 0.69 0.014 0.021 0.027
A HE 2.10 2.40 2.64 0.083 0.094 0.104
T 0° −−− 10 ° 0° −−− 10°
A1 SIDE VIEW SEE VIEW C c
GENERIC
END VIEW
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT XXXMG
G
1
3X
2.90 0.90 XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
STYLE 9: STYLE 10: STYLE 11: STYLE 12: STYLE 13: STYLE 14:
PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE PIN 1. CATHODE PIN 1. SOURCE PIN 1. CATHODE
2. ANODE 2. SOURCE 2. CATHODE 2. CATHODE 2. DRAIN 2. GATE
3. CATHODE 3. GATE 3. CATHODE−ANODE 3. ANODE 3. GATE 3. ANODE
STYLE 15: STYLE 16: STYLE 17: STYLE 18: STYLE 19: STYLE 20:
PIN 1. GATE PIN 1. ANODE PIN 1. NO CONNECTION PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. CATHODE
2. CATHODE 2. CATHODE 2. ANODE 2. CATHODE 2. ANODE 2. ANODE
3. ANODE 3. CATHODE 3. CATHODE 3. ANODE 3. CATHODE−ANODE 3. GATE
STYLE 21: STYLE 22: STYLE 23: STYLE 24: STYLE 25: STYLE 26:
PIN 1. GATE PIN 1. RETURN PIN 1. ANODE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE
2. SOURCE 2. OUTPUT 2. ANODE 2. DRAIN 2. CATHODE 2. ANODE
3. DRAIN 3. INPUT 3. CATHODE 3. SOURCE 3. GATE 3. NO CONNECTION
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42226B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
SC−74
6 CASE 318F
ISSUE P
1
DATE 07 OCT 2021
SCALE 2:1
GENERIC
MARKING DIAGRAM*
XXX MG
G
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42973B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
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