MURD620CTG,

NRVUD620CTG,
MURD620CTT4G,
NRVUD620CTT4G,
SUR620CTT4G,

SWITCHMODE http://onsemi.com

Power Rectifier ULTRAFAST RECTIFIER

6.0 AMPERES
DPAK Surface Mount Package
200 VOLTS
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.

Features
 Ultrafast 35 Nanosecond Recovery Time DPAK
 Low Forward Voltage Drop CASE 369C

 Low Leakage
1
 ESD Rating:
4
 Human Body Model = 3B (> 8 kV) 3
 Machine Model = C (> 400 V)
 AEC−Q101 Qualified and PPAP Capable MARKING DIAGRAM
 NRVUD and SUR Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements
AYWW
 Pb−Free Packages*
U
620TG
Mechanical Characteristics:
 Case: Epoxy, Molded
 Weight: 0.4 Gram (Approximately) A = Assembly Location
Y = Year
 Finish: All External Surfaces Corrosion Resistant and Terminal WW = Work Week
Leads are Readily Solderable U620T = Device Code
G = Pb−Free Package
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
ORDERING INFORMATION

Device Package Shipping†

MURD620CTG DPAK 75 Units/Rail
(Pb−Free)
NRVUD620CTG DPAK 75 Units/Rail
(Pb−Free)
MURD620CTT4G DPAK 2,500 /
(Pb−Free) Tape & Reel
NRVUD620CTT4G DPAK 2,500 /
(Pb−Free) Tape & Reel
SUR620CTT4G DPAK 2,500 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
*For additional information on our Pb−Free strategy and soldering details, please refer to our Tape and Reel Packaging Specifications
download the ON Semiconductor Soldering and Mounting Techniques Brochure, BRD8011/D.
Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:

January, 2012 − Rev. 10 MURD620CT/D
 MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,

MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 200 V
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR
Average Rectified Forward Current IF(AV) A
(Rated VR, TC = 140C)
Per Diode 3.0
Per Device 6.0
Peak Repetitive Forward Current IF A
(Rated VR, Square Wave, 20 kHz, TC = 145C)
Per Diode 6.0
Non−Repetitive Peak Surge Current IFSM A
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz) 50

Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

THERMAL CHARACTERISTICS (Per Diode)

Characteristics Symbol Value Unit
Thermal Resistance, Junction−to−Case RqJC 9 C/W
Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 80 C/W
1. Rating applies when surface mounted on the minimum pad sizes recommended.

ELECTRICAL CHARACTERISTICS (Per Diode)

Characteristics Symbol Value Unit
Maximum Instantaneous Forward Voltage Drop (Note 2) vF V
(iF = 3 Amps, TC = 25C) 1
(iF = 3 Amps, TC = 125C) 0.96
(iF = 6 Amps, TC = 25C) 1.2
(iF = 6 Amps, TC = 125C) 1.13
Maximum Instantaneous Reverse Current (Note 2) iR mA
(TJ = 25C, Rated dc Voltage) 5
(TJ = 125C, Rated dc Voltage) 250
Maximum Reverse Recovery Time trr ns
(IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25C) 35
(IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25C) 25
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.

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 MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,

100 100

70 TJ = 175C

IR, REVERSE CURRENT (mA)

10
50
1 150C
100C
30
0.1
20
i , INSTANTANEOUS FORWARD CURRENT (AMPS)

0.01
25C

10 0.001

7.0 0.0001
0 20 40 60 80 100 120 140 160 180 200
5.0 VR, REVERSE VOLTAGE (V)
Figure 2. Typical Leakage Current* (Per Leg)
3.0 * The curves shown are typical for the highest voltage device in the
175C TJ = 25C voltage grouping. Typical reverse current for lower voltage selections
2.0 can be estimated from these curves if VR is sufficiently below rated
VR.
150C 100C 14
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
F

1.0 13 5.0 SINE

12 10 WAVE
0.7 11
10 IPK/IAV = 20 dc
0.5
9.0
8.0
7.0 SQUARE
0.3
6.0 WAVE
0.2 5.0
4.0
3.0 TJ = 175C
2.0
0.1
1.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0
vF, INSTANTANEOUS VOLTAGE (V) 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10

Figure 1. Typical Forward Voltage (Per Leg) IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 3. Average Power Dissipation (Per Leg)
8.0 4.0
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)

IF(AV) , AVERAGE FORWARD CURRENT (AMPS)

RATED VOLTAGE APPLIED RATED VOLTAGE APPLIED

7.0 RqJC = 9C/W 3.5
RqJA = 80C/W
6.0 3.0
TJ = 175C
SURFACE MOUNTED ON
5.0 2.5 MIN. PAD SIZE RECOMMENDED
dc
4.0 2.0
SINE WAVE dc
3.0 OR 1.5 TJ = 175C
SQUARE WAVE
2.0 1.0 SINE WAVE
OR
1.0 0.5 SQUARE WAVE

0 0
100 110 120 130 140 150 160 170 180 0 20 40 60 80 100 120 140 160 180 200
TC, CASE TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)
Figure 4. Current Derating, Case (Per Leg) Figure 5. Current Derating, Ambient (Per Leg)

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MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,

100
TJ = 25C

C, CAPACITANCE (pF)
10

1
0 10 20 30 40 50 60 70 80 90 100

VR, REVERSE VOLTAGE (V)

Figure 6. Typical Capacitance (Per Leg)

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 MURD620CTG, NRVUD620CTG, MURD620CTT4G, NRVUD620CTT4G, SUR620CTT4G,

PACKAGE DIMENSIONS

DPAK (SINGLE GAUGE)

CASE 369C−01
ISSUE D
NOTES:
C 1. DIMENSIONING AND TOLERANCING PER ASME
A Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
E A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
4 5. DIMENSIONS D AND E ARE DETERMINED AT THE
L3 Z OUTERMOST EXTREMES OF THE PLASTIC BODY.
D 6. DATUMS A AND B ARE DETERMINED AT DATUM
DETAIL A H PLANE H.
1 2 3
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
L4 A 0.086 0.094 2.18 2.38
b2 A1 0.000 0.005 0.00 0.13
b c b 0.025 0.035 0.63 0.89
b2 0.030 0.045 0.76 1.14
e 0.005 (0.13) M C H b3 0.180 0.215 4.57 5.46
c 0.018 0.024 0.46 0.61
GAUGE SEATING c2 0.018 0.024 0.46 0.61
L2 PLANE C PLANE D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
H 0.370 0.410 9.40 10.41
L
A1 L 0.055 0.070 1.40 1.78
L1 L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
DETAIL A L3 0.035 0.050 0.89 1.27
ROTATED 905 CW L4 −−− 0.040 −−− 1.01
Z 0.155 −−− 3.93 −−−

SOLDERING FOOTPRINT*
6.20 3.00
0.244 0.118
2.58
0.102

5.80 1.60 6.17

0.228 0.063 0.243

SCALE 3:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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