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Special Report – White Goods Part II Special

Special
ReportReport
– White
– White Part IIPart II
GoodsGoods

IGBT Gate Drivers in


High-Frequency Induction
Cookers
Efficiency of induction cookers is 84 percent
Today, with the constant demand for energy saving devices, high-frequency induction cookers, already
a trend in Europe, are gaining popularity in the rest of the world. These kitchen devices offer high
efficiency that reduces energy usage, reduces cooking time and, simultaneously, improves user safety,
particularly around children, since all heat is localized to the pan itself.
Figure 4: UCC28070 two-phase interleaved PFC.

magnetic interference (EMI) filter along is no reverse recovery condition in tran- motor control algorithms such as field- By Gary Aw, Product Manager, Gate Drive Optocouplers, Avago Singapore
with physically smaller PFC output ca- sition mode operation. oriented control. It improves efficiency

A
pacitors. These smaller elements of the while using smaller power electronics. ccording to the U.S. Depart- transfer is inherently less efficient than bridge series resonant converter, Fig. 1,
dual-phase interleaved topology make To incorporate inrush in the Besides being adaptable to various PFC ment of Energy, the typical direct inductive heating. and the quasi-resonant converter, Fig. 2.
it an ideal solution for embedded motor UCC28070 or its design, simply add topologies including interleaving, C2000 efficiency of induction cookers In both topologies, there exist the reso-
drive circuit. An interleaved PFC can the inrush components from Figure 3 to DSCs can simultaneously implement all is 84% compared to the 40 percent of How does an induction cooker work? nant elements Lr and Cr. For circuit sim-
meet very high power density require- either of the phase inductors. the necessary three-phase motor control gas cookers. In this article, two typi- Figures 1 and 2 show two circuit to- plification, the load pot, R, is assumed to
ments including low height. functions, handle in-system communi- cal induction cooker designs, the half- pologies for induction cookers: the half- be a purely resistive element. In both
Texas Instruments PFC controller cations, provide for a user interface, and bridge series-resonant and the quasi-
Other benefits of interleaving include roadmaps include devices such as the also provide the inrush current limiting resonant topology, are discussed. The
easier thermal management since UCC28070 or UCC28060 interleaved control described, all in a single C2000 merits and disadvantages of these two
power dissipation is distributed over PFC controllers that have an additional digital signal processor (DSP). high-frequency inverter topologies along
two phases. Reduced overall system functional block. This additional block with three gate driver circuits, discrete
cost from a smaller EMI filter, smaller monitors both the input and output sides www.ti.com transistors, optocouplers integrated cir-
PFC output capacitor sizes, and less of the PFC controller. If it determines cuit and transformers for high frequency
magnetic material as the total inductor that an inrush condition exists, such as operation are also discussed.
volume of the two phases are signifi- a momentary loss in line voltage, it will
cantly smaller than a single stage de- override the gate drive output, stopping What is induction cooking?
sign (Figure 4). Also, the MOSFET and the MOSFET from switching and shut- In an induction cooktop, a magnetic
diode current ratings can be reduced ting down the power in the SCRs gate field transfers electric energy directly
by at least 50 percent. Smaller MOS- drive circuit. This will naturally engage to the object to be heated. By induc-
FETs are inherently faster, which further the inrush element back into the high ing an electric current into the ferrous
reduces MOSFET switching losses. Fi- current path. cooking utensil, heat is generated in the Figure 1: Half-bridge series-resonant topology for induction cookers.
nally, the economy of scales increases object, and the cooking surface only
the buying power on matching devices A final note gets hot from the heat reflected from the
in each phase by doubling the volume When it comes to system integra- object being heated: no heat is directly
of each. tion for white goods applications, produced by the induction element.
many designers favor alternative paths. Because of this direct transfer of energy,
The UCC28070 works in continuous Some prefer to go the route of devices there are fewer losses, which translates
conduction mode (CCM). Also available that can execute multiple application to a higher level of efficiency.
is the UCC28060 which is a transition functions to reduce system complexi-
mode (TM). The UCC28060 has similar ties and enable faster time-to-market. This compares with conventional
benefits afforded with ripple current For example, the C2000 digital signal cooking in which a heat source, for
cancellation, but also offers some lower controllers (DSC) from TI can replace example an electrical resistance ele-
cost alternatives. Most notably is the the microcontroller traditionally used for ment or a flame, transfers heat energy
use of low cost boost diodes since there motion control while adding advanced to the cooking pot. The two-step energy Figure 2: Quasi-resonant topology for induction cookers.

56 Power Systems Design Europe December 2007 www.powersystemsdesign.com 57


Special Report – White Goods Part II Special Report – White Goods Part II

Discrete gate drivers are construct-


ed using bipolar transistors, and NPN
and PNP emitter followers can achieve
reasonable drive capability. However,
using several discrete components to
build the driver, while simultaneously
incorporating necessary operational
and protective functions such as
under voltage lockout (UVLO), is not
as space efficient as using integrated
circuits. Moreover most discrete tran-
sistor driver designs do not provide
sufficient safety isolation or noise im-
munity.

Two methods of providing electrical


Figure 6: Gate drive optocoupler.
isolation are pulse transformers and
gate driver optocouplers. The pulse
Figure 3: Equivalent half-bridge series resonant circuit. Figure 4: Equivalent quasi-resonant circuit. transformer is a traditional and simple
solution, which, however, suffers from
topologies, an AC input supply of 220V switching occurs when the transistor cause of the high side gate driver circuit the potential for core saturation in a
50 Hz is converted into an unregulated turns-on at zero voltage. Zero-current required for the upper IGBT, S1 in Fig. 1) reasonably-sized transformer, resulting
DC voltage by a full-bridge rectifier. This switching refers to the elimination of in reduced efficiency. A pulse trans-
DC voltage is then converted into a high turn-off switching loss at zero current The advantage of a quasi-resonant former can only transmit AC signals,
frequency AC voltage by the inverter flow. The voltage or current provided to converter is that it needs only one IGBT and most designs have a limited duty
IGBT (insulated gate bipolar transis- the switching circuit can be made zero power switch, which reduces the size cycle ranging up to 50 percent due to
tor) switches—S1 and S2 in the case by using the resonance created by an of the PCB and heat sink. The disad- the transformer volt-second relation-
of the half-bridge circuit—which can be L-C circuit. This topology is named a vantages are that the quasi-resonant ship. An additional capacitor and zener
controlled using a microcontroller. Due “resonant converter.” switching develops a resonant voltage diode on the transformer secondary can
to the high frequency switching AC, the which can be higher than the DC input be added to permit a higher duty cycle.
element coil will produce a high frequen- The advantages of a half-bridge series voltage, increasing stresses on the IGBT However, this increases the circuit board
cy electromagnetic field which will pen- resonant circuit are stable switching and power switches. This requires higher- size and parasitic inductances, which,
etrate the ferrous material of the cooking lower cost due to simplified design. The cost components with higher blocking in turn, increases power losses in the
pot. From Faraday’s Law and skin effect, voltage within the circuit is limited to the voltage capabilities. Figure 7: Gate drive transformer.
driver circuit.
this generates eddy current within the level of the input voltage, which reduces associated with high-frequency gate the gate drive circuit becomes increas-
cooking pot which then generates heat the voltage stress across IGBT power Gate driver circuits for IGBT power drivers: parasitic inductances, power ingly important as the switching speeds The gate driver optocoupler IC inte-
to cook the food inside the pot. switch. This, in turn, allows the designer switches dissipation in the gate-drive circuit and are increased. grates an LED light source and optical
to lower the cost by choosing an IGBT Three types of driver circuits, using the losses in the power switching de-
By applying the transformer equiva- with a lower voltage rating. The disad- discrete transistors (Fig. 5), gate driver vices in the gate driver, all of which are Table 1: Summary of gate driver solution for induction cooker.
lent circuit, designers are able to map vantage of this approach is that the con- optocouplers (Fig. 6) or gate driver involved when selecting an appropriate
the load pot (secondary of transformer) trol of the half-bridge circuit is relatively transformers (Fig. 7) can be used to driver circuit.
to the primary side of the circuit where complicated and the required size of the drive the power switches in the induc-
the resonant inductor, Lr, and capacitor, heatsink and PCB area is greater, be- tion cooker. There are several issues Typically, the switching frequency of
Cr, are located. From this, we can obtain an induction cooker is between 25 kHz
the equivalent circuit for the half-bridge and 40 kHz. In order to rapidly turn on
and quasi resonant circuits, shown in and off the power switch, the gate cur-
Figs. 3 and 4. From these equivalent rent inductance loop between the driver
circuits, the operation of the induction and power switch should be as low as
cooker, and the values of the resonant possible. Hence it is advisable to design
inductor, capacitor and control algorithm the layout of the circuit to reduce the
can be derived. parasitic inductances. Since the driver
rapidly charges and discharges the gate
In order to reduce component size, capacitor of the IGBT, a relatively high
minimize switching losses and reduce peak gate current may be needed for
audible noise during operation, induc- proper operation. A higher peak current
tion cooker circuits typically utilize reso- is also desirable to increase the charg-
nant or soft switching techniques. Soft ing and discharging rates during turn-on
switching can be subcategorized into and turn-off, to help reduce the switch-
two methods: zero-voltage switching ing losses of the IGBT. Due to this,
and zero-current switching. Zero-voltage Figure 5: Discrete transistor gate driver (low side drive). managing the power dissipation within

58 Power Systems Design Europe December 2007 www.powersystemsdesign.com 59


Special Report – White Goods Part II NEW PRODUCTS
WHITE GOODS

receiver for safety isolation, with transis-


tors to provide sufficient drive current,
For the single-switch resonant con-
verter, the designer has the option of the
power ground. However, in cases where
safety isolation and reduction of driver ACAL Offers Space-Saving Film Capacitors from EPCOS
and protection functions such as UVLO discrete gate driver, gate transformer losses becomes an issue, the gate drive
appliances. The Y2 capacitors offer The series is designed for operation
or desaturation detection. or gate driver optocoupler topologies. optocoupler or transformer are excellent
a rated AC voltage of 300 VAC and a in equipment that is continuously
As discussed previously, the quasi- alternatives.
temperature stability of 110 °C. Their connected to single-phase power grids.
Gate driver ICs are easy to design converter resonant voltage can be
design ensures extremely reliable These capacitors also satisfy the IEC,
with, and will save PCB board space. higher than the DC link voltage and this For the half-bridge converter, a float-
performance in a compact format. Their UL and CSA standards.
Due to the integrated design, the drive voltage stresses the power semiconduc- ing or high-side power switch needs to
dimensions range from 4 x 9 x 13mm3 Samples are available from ACAL
circuitry can be located very close to tor switch. In most commercial low cost be driven. A high-side discrete solu-
to 20 x 39.5 x 41.5mm3. They also Technology now and customer
the power switch, which not only saves single switch induction cooker designs, tion would increase the component
satisfy the most important international applications can be fully assessed
PCB space but also improves the overall the discrete gate driver circuit is used count, and not provide any isolation. As
standards such as IEC, UL and CSA. and verified by testing prototype
noise immunity of the system. However, as there is no upper power switch, and shown, the pulse transformer galvanic
The new B32021* to B32026* series will designs in ACAL’s EMC chamber
as with any ICs, power dissipation is a both the controller and power semi- isolation solution becomes increasingly
replace the previous B81122* series. which can measure conductive and
major concern. conductor are able to share the same complicated for duty cycle switching
ACAL Technology has announced New X1 capacitors of the B32911* radiated emissions and test products to
above 50 percent. Also, the
new compact Y2 EMI suppression to B32916* series were simultaneously EN55022, EN61000 and EN61000-3-2.
solution size is larger because
capacitors from EPCOS. Connected to developed for a rated AC voltage of 330 ACAL has a team of experts on hand
of the additional discrete
protective ground between the neutral VAC. These reliable components were to ensure any design is effectively and
components on top of the
conductor and phase to suppress high- designed for across-the-line applications rapidly completed in partnership with
transformer size. The gate
frequency interference and transients, in order to suppress symmetrical their customers.
driver optocoupler IC provides
they protect the equipment and allow it electrical interference and are intended www.acaltechnology.co.uk
a good level of protection,
to operate reliably. Typical applications specifically for equipment requiring a
isolation, and common-mode www.epcos.com
include power supplies and household high level of interference protection.
noise rejection. This resolves
many of the problems that are
associated with transformer
or discrete transistor drivers. Three-Phase 600V ICs Offer Integrated Bootstrap
Summary
Functionality, Negative vs Immunity, and Advanced Input
In this article, the half-
bridge series resonant and
Filtering
quasi resonant induction the devices to withstand the very large require high levels of robustness and
cooker topologies along with negative Vs transients that are seen reliability. Also, an advanced input filter
three gate driver methods during high-current switching and has been integrated to reject noise and
were discussed. In order to short-circuit conditions. Additionally, an reduce distortion, improving system
reduce the design size and advanced input filter improves system performance in many motor control
audible switching noise while performance while the integrated applications.
improving power efficiency, bootstrap functionality reduces the To address the needs of applications
these resonant converters are circuit footprint. suffering space constraints and
chosen. The discrete transis- Integrating power MOSFET/IGBT gate to simplify design, the IRS2336xD
tor gate driver circuit is cost drivers with three high-side and three ICs feature integrated bootstrap
effective but increases design low-side referenced output channels, functionality. This functionality can
complexity while provid- International Rectifier has introduced the IRS2336xD ICs provide 180mA/ reduce the bootstrap power supply from
ing no safety isolation. The the IRS2336xD protected 600V three- 330mA drive current at up to 20V MOS six components to three, while providing
required size of the gate drive phase gate driver ICs with integrated gate drive capability operating up to VBS over-voltage protection for the
transformer consumes board bootstrap functionality for appliance 600V. system through the use of additional
space, and requires addi- motor control, servo drives, micro- Part of International Rectifier’s G5 HVIC integrated intelligent protection circuitry.
tional work, cost and board inverter drives, and a wide range of platform, these devices incorporate The new devices utilize IR’s advanced
space to achieve switching general purpose applications. advanced functionality including high-voltage IC process which
duty cycles above 50 per- IR’s latest high-voltage gate drivers negative Vs immunity circuitry to protect incorporates next-generation high-
cent. Finally, the use of gate are ideal for three-phase applications the system from catastrophic events voltage level-shifting and termination
drive optocoupler ICs saves that require industrial level ruggedness. that can be seen during high-current technology to deliver superior electrical
board space through high These new ICs feature IR’s proprietary switching and short-circuit conditions, over-stress protection and higher field
level feature integration while negative Vs immunity circuitry, allowing critical for industrial systems that reliability. In addition to the over-current
providing high voltage safety and over-temperature detection input,
isolation and noise immunity Specifications: these ICs feature under-voltage lock-
all in one package. Part Number Input Logic UVLO VIT,TH tON, tOFF VOUT out protection, integrated deadtime
HIN/N, protection, shoot-through protection, a
www.avago.com IRS2336D 8.9 V/ 8.2 V 0.46 V 530 ns, 530 ns 10 V – 20 V shutdown input, fault-reporting, and are
LIN/N
compatible with 3.3V input logic.
IRS23364D HIN, LIN 10.4 V/ 9.4 V 0.46 V 530 ns, 530 ns 10 V – 20 V
www.irf.com

60 Power Systems Design Europe December 2007 www.powersystemsdesign.com 61

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