YSi V ProgrammingManual

High-speed High-precision Hybrid AOI
YSi
Programming Manual
V3.0
EPP716B210
Safety instructions
Safety instructions
w
Be sure to read these safety instructions before using YAMAHA surface mounters or related products.
Contents
CE marking i
1. Safety ii
1.1 To ensure safety ii
1.1.1 Defining safety ii
1.1.2 Causes of injuries and accidents ii
1.2 Using safety gear ii
1.3 Restrictions on machine use iii
1.3.1 Defining the operator and service personnel iii
1.3.2 Restricting machine operation with passwords iii
1.3.3 Lock out the main switch and the air supply/exhaust switch iii
1.4 Cautions during machine operation iv
1.5 Cautions during power outages iv
1.6 Cautions regarding ferromagnetic fields iv
1.7 Handling the internal tape cutter iv
1.8 Keeping hands away from moving parts v
1.9 Handling solvents (including solder, adhesive and flux) vii
1.10 Handling the X-ray unit viii
1.11 Handling the laser viii
1.12 Handling grease and oil ix
1.13 Handling batteries ix
1.14 Handling heavy objects ix
1.15 Parts and materials to be used x
2. Safety message xi
2.1 Safety message and categories in this manual xi
2.2 Typical warning text found in manual xii
2.2.1 Safety instruction xii
2.2.2 Operation and handling precautions xiii
2.2.3 Facilities and environmental condition xiv
3. Warning labels xv
3.1 Warning label format and mark description xv
3.1.1 Warning label format xv
3.1.2 Meaning of marks xv
SF-SMT-EP166-460
3.2 Warning labels xvi
3.2.1 Handling safety covers xvi
3.2.2 Pinching or crushing injury xvii
3.2.3 Effects on human body xviii
3.2.4 Handling each section xxi
3.3 Caution labels xxiii
3.3.1 Machine damage xxiii
3.4 Label positions xxviii
CE marking
This equipment conforms to the EU Machinery Directive 2006/42/EC (description A1 below) and EMC
Directive 2014/30/EU (description A2 below).
However, this equipment does not bear CE marking if a custom order item was installed.
Safety instructions
A1.
Cautions regarding the official language of EU countries and the language used in operation
manuals, CE declarations, operation screen characters, and warning labels when this equipment is
installed in an EU countr y.
• All materials except warning labels are written in English only.
n NOTE
Warning labels only have pictograms or else include warning messages in English, Chinese, Korean and Japanese
language.
A2.
EMC description
• Electromagnetic immunity (Immunity)
Complies with test standards as specified by EN 61000-6-2.
• Electromagnetic emissions (Emission)
Complies with test standards for ISM category: Group 1, Class A, as specified by EN 55011.
n NOTE
Class A equipment is intended for use in industrial environments. If used in other environments, ensuring
electromagnetic compatibility (EMC) might be difficult. Refer to EN 55011 standards for detailed information.
i
1. Safety
To ensure that the machine you purchased is used safely and correctly, always comply with the instructions
and rules in this manual regarding safety. However this manual cannot cover all items regarding safety in
detail. So it is extremely important that the operator or person handling the machine make correct decisions
Safety instructions
regarding safety.
1.1 To ensure safety

To maintain the safety of the operator or person working with this machine, it is essential that it (including
external parts feeders) be installed correctly in compliance with the safety standards and conditions of that
country.
Complying with the safety regulations and laws of that country is the responsibility of the customer who
purchased this machine. The supervisor of this machine must take responsibility to ensure all measures have
been taken for machine safety.
1.1.1 Defining safety

1. Safety has priority over all other operations.
2. Safety is more important than any other task.
3. Safety is the foundation for work efficiency.
4. Safety begins with maintaining (keeping it neat and orderly) the work environment.
1.1.2 Causes of injuries and accidents

Most accidents are not something that occurs but something that are caused. So it is important to make an
effort NOT to cause accidents.
n Hazardous actions
• Ignoring causes of accidents
• Working or operating equipment in cramped locations
• Working in locations or positions where safety cannot be ensured
• Unsafe machine operation and using equipment whose safety cannot be ensured
• Working or operating equipment at speeds where safety cannot be ensured
• Working or operating machines with safety equipment removed
• Performing work or tasks on top of a machine currently in operation
• Playing around or goofing off during work
• Performing maintenance or inspections without wearing safety gear
1.2 Using safety gear

Always wear safety gear when operating or servicing equipment.
Helmet : Use during maintenance work
Safety glasses or goggles : Use around light harmful to eyes and when applying lubricant and when handling organic
solvents.
Respiratory gear : Use when handling organic solvents
Safety gloves : Use when applying lubricant and when handling organic solvents.
ii
1.3 Restrictions on machine use
1.3.1 Defining the operator and ser vice personnel
c CAUTION
Only the operator and service personnel having sufficient knowledge of this machine should handle this machine.
Safety instructions
Operator:
The operator is someone who has been trained by us in machine operation, has a thorough knowledge of the machine
operation manual and demonstrates adequate knowledge of machine operation and safety.
Main tasks of the operator include pre-operation checks, operation (component mounting) and making setups
(changeovers). The machine is only used in normal operating mode.
Ser vice personnel:
The service personnel are those trained by us in machine maintenance as well as safety instruction and demonstrate a
thorough knowledge of safe handling of the machine according to the type and location of machine operation. They must
also understand hazardous sections of the machine and residual risks.
Main tasks of the service personnel include machine maintenance, repair, adjustment and management of the system.
The service personnel may make changes to the machine settings and operation in factory adjustment mode.
1.3.2 Restricting machine operation with passwords

Machine operating levels usable by the operator and service personnel (mentioned above) must be restricted
by password. This prevents the operator and service personnel from using the machine at a higher level than
allowed.
1.3.3 Lock out the main switch and the air supply/exhaust switch
When the maintenance work is performed with the power supply and the air supply off, make sure to lock the
main switch and the air supply/exhaust switch with a padlock as shown below before the work. This is to
prevent a bystander from accidentally turning on the power and the air supply during the maintenance work.
Also, make sure to lock the main switch and the air supply/exhaust switch with a padlock when the machine is
left unused for a long period of time. Manage the key of the padlock according to the customer's rules.
Lock out the main switch and the air supply/exhaust switch
Main switch
: Position where the padlock can be set
“ ”Circle Mark
(OFF position)
ø4 to ø6
OFF
Padlock
Padlock
Air supply / exhaust switch

Example: YS100 Example: YCP10
OFF
OFF
OFF position OFF position
Padlock
91208-L0-00
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1.4 Cautions during machine operation
• Always make pre-operation checks before turning on the main power switch.
• Do not use an air blow tool when cleaning the machine. (Airborne dust will badly affect machine operation.)
• Stop all machine operation before cleaning around the machine.
Safety instructions
• Do not turn off the compressed air during operation.

• Always make periodic inspections to prevent unexpected machine breakdowns.
• Allow only properly trained, experienced workers to perform repair and adjustment.
1.5 Cautions during power outages

If a power outage (blackout) occurs during automatic machine operation, always turn the main power switch
off to prevent faulty operation and equipment damage after power has been restored. Remove items such as
boards that remain inside the machine.
1.6 Cautions regarding ferromagnetic fields

Some machines contain parts generating strong magnetic fields which may cause death, bodily injury, or
device malfunction. Always comply with the following instructions.
• Persons wearing electronic medical devices such as cardiac pacemakers and/or hearing aids must not put
any of their body parts into the machine.
• Persons wearing ID cards, purses, and/or wristwatches must keep away from the linear motor.
• Do not attempt to disassemble the linear motor (including surrounding covers).
• Do not bring tools close to the linear motor.
• Do not bring tools close to the magnetic scale.
• Do not put magnetic materials or objects close to the linear motor.
• Do not touch a portion close to the linear motor during operation or immediately after the operation has been
finished since such part is hot.
c CAUTION
When disposing of a part generating strong magnetic fields such as a linear motor, dispose of it in compliance with
the laws and regulations of the country where the machine is used. If you have any questions about disposal of the
parts, please contact YAMAHA or your distributor.
1.7 Handling the internal tape cutter

• Never supply electrical power and compressed air to the machine while the covers for the tape cutter are removed.
• Tape cutter maintenance tasks must be performed by YAMAHA service personnel.
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1.8 Keeping hands away from moving parts
During use of this machine, the customer’s equipment and operating conditions might allow the operator’s
hands to come into contact with moving parts.
Use the following safety measure options to avoid possible danger where openings or gaps are found on the
machine.
Safety instructions
■ Dummy feeder
Use dummy feeders as safety measures to fill a gap between tape feeders. Install dummy feeders on the feeder plate the
same way as normal feeders in order to prevent hands from entering.
Prevention of hand entry

Dummy feeder
Clamp lever
Dummy feeder (Wide-size)
Dummy feeder (8mm-size)

91203-L0-20
c CAUTION
To install or remove a dummy feeder, be sure to first press the emergency stop button and then open the cover. The
machine has a structure that does not allow installing or removing a dummy feeder when the machine is in operation.
However, inserting a dummy feeder inside the cover during operation may cause serious accidents, so be careful not
to attempt it.
■ One-stop cover (for machines designed for use with feeder exchange carriage, excluding YSM40/YSM40R)
If not using a feeder exchange carriage in the machine that is to be used with feeder exchange carriages, install a
one-stop cover in the position where a feeder exchange carriage is to be installed.
Prevention of hand entry

One-stop cover
One-stop cover
91204-L0-10
n NOTE
One-stop covers cannot be installed or removed during operation. The machine must be in a stopped state because
the section where a feeder exchange carriage is to be installed will move up and down for the installation or removal
of the feeder exchange carriage.
v
■ Muzzle plate
Use these plates as a safety measure for the board conveyor entrance and exit openings. Each plate is movable, so adjust
the mounting position to match the boards to be produced.
Muzzle plate
Safety instructions
Upper muzzle plate
Board conveyance plane
Lower muzzle plate
91205-L0-00
Upper clearance Lower clearance Remarks
YS100, YS88 8.0 to 38.5mm 1.0 to 31.0mm
YS12, YS12P, YS12F, YS24,

5.0 to 20.0mm 4.2 to 39.2mm
YS24X,YSD
YSM40/YSM40R 0 to 44.0mm 0 to 39.0mm
Z:LEX(YSM20/YSM20W) 0 to 36.0mm 4 to 40.0mm

From board conveyor plane
YC8 13.4 to 80.4mm 4.6 to 39.2mm
YSB55w 0 to 10mm 6mm (fixed)
YSP 0 to 6.6mm 0 to 26.4mm
YSi-V 0 to 48.0mm 0 to 102mm
c CAUTION
When installing a unit such as a loader or an unloader on the upstream or the downstream side of the machine, set the
muzzle plates to the opening of the board conveyor entrance or the board conveyor exit to make the opening small.
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1.9 Handling solvents (including solder, adhesive and flux)
Cleaning organic solvents, such as isopropyl alcohol (IPA) and ethanol are used for the maintenance of this
machine (including optional units). Additionally, the solder paste printers, dispensers, and some hybrid placers
and flip chip bonders use solder, flux, or bond, etc. during normal production. Since many of these materials
include organic solvents, great care should be taken when handling them.
Safety instructions
Cautions on handling solvents
1. Hazards to human health
Organic solvents constantly vaporize and contaminate the surrounding atmosphere. Inhaling or coming in contact with
organic solvent vapor may cause serious damage to human health.
2. Flammability
Organic solvents are highly flammable substances and can easily catch fire if handled improperly.
3. Adverse effects on machines
Some kind of solvent may deteriorate parts used in the machine, electric cable sheathes, and other resin parts.
To prevent accidents caused by solvents

1. Be careful not to inhale toxic vapors of solvents for extended periods.
2. Do not use solvents near fire or flame. Keep solvents away from flame or fire.
3. Use only the specified solvent in the correct manner. Do not reuse any solvent repeatedly, and do not mix with other
solvents or chemicals.
4. Check the contents of the safety data sheet (MSDS/SDS), thoroughly notify work personnel of toxicities of included
chemical materials and measures to be taken in case of an accident, and take necessary countermeasures.
5. Use appropriate safety gear (safety goggles, protective gloves, and respiratory protective devices) corresponding to the
solvent or material types.
6. See the safety data sheet (MSDS/SDS) for how to dispose the solvents and the cloths used for wiping off the solvents.
c CAUTION
If no safety data sheets (MSDS/SDS) are supplied with solvents or materials you have purchased, be sure to acquire
the safety data sheets from the suppliers.
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1.10 Handling the X-ray unit
Some YS series inspection equipment models contain an X-ray unit. Take the following precautions when using
with an X-ray unit.
1. The X-ray output window of the X-ray source is made of ver y thin ber yllium foil.
Safety instructions
· Beryllium in the form of dust particles can cause acute toxicity or chronic toxicity, and may induce respiratory
problems if inhaled.
· To ensure safety, the X-ray unit is designed so that the X-ray window cannot be touched. However, should the X-ray
output window be broken for some reason, immediately turn off the power switch and use extreme care not to inhale
the dust particles.
· Chlorine gas can corrode the beryllium window of the X-ray tube, causing permanent damage to the X-ray tube. Do
not use the X-ray unit in environments where chlorine gases are generated. Take special care when handling samples
such as vinyl chloride materials which may generate chlorine gases.
2. Lead is used in the covers of machines equipped with an X-ray unit.
Although lead is sealed within the covers so that the lead portions cannot be directly touched, use caution since lead is
known as heavy metal having harmful effects.
3. A safety key is provided for machines equipped with an X-ray unit.
The safety key must be managed by the supervisor of the machine.
4. Safety education about X-ray
Appropriate measures are taken for YAMAHA's X-ray unit so that the amount of the X-ray leak to the outside of the
equipment is very small. Therefore, when using this equipment in Japan, it is not necessary to set controlled areas
defined in Article 3 of the Ordinance on Prevention of Ionizing Radiation Hazards.
It is not legally obligated to conduct the safety education, but it is recommended to conduct the education by the
customer.
When operating this equipment outside Japan, the safety education is conducted as required according to the relevant
country's laws, regulations, and standards.
TIP
When conducting the safety education in Japan, the contents stated in “Special Education Standard for Radiography
(Ordinance of the Ministry of Health, Labor and Welfare No. 50)” are recommended. However, the safety education
does not necessarily need to be these contents.
c CAUTION
When disposing of an X-ray unit (X-ray source), dispose of it in compliance with the laws and regulations of the
country where the machine is used. If you have any questions about disposal of the unit, please contact YAMAHA or
your distributor.
1.11 Handling the laser

In this machine (including optional units), there are portions using the laser, such as a sensor and barcode
reader.
c CAUTION
The laser to be used by this machine is class 2 (visible light and low output) at a maximum.
Knowledge and information about laser

1. Harmful to human body
Never look at the laser directly even when it is weak. In particular, if the laser is irradiated to an eye for a long time,
this may cause serious injury.
2. Reflection of laser
The laser is reflected by a glass or metal surface. Pay special attention to the reflected laser light during maintenance
work.
To prevent accidents caused by laser

1. Do not align your eye with the laser height so that you do not look at the laser directly.
2. Wear safety goggles during work, when necessary.
3. Shield the laser during work, when necessary.
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1.12 Handling grease and oil
Grease or oil is used for the operating axes of this machine. When performing the lubrication work, strictly
observe the cautions shown below.
Cautions on handling grease and oil
Safety instructions
1. If grease or oil enters your eye or sticks to your skin, this may cause inflammation. Be sure to wear safety goggles and
protective gloves during work. Additionally, if you swallow grease or oil by mistake, this may cause vomiting or
diarrhea.
2. If grease other than that specified is used, this may cause damage to the machine.
3. If grease with different characteristics is mixed with proper grease, this may cause the machine performance to lower.
4. Be sure to cap tightly after use to prevent entry of dust or water content. When storing the grease or oil, avoid the
direct sunlight, keep it away from a fire, and store it in a dark place.
n NOTE
When the safety data sheet (MSDS/SDS) about the grease or oil that is used for the maintenance wok is needed,
contact YAMAHA or your distributor.
1.13 Handling batteries

Batteries are used for some motors of this machine and the optional uninterruptible power supply (UPS).
Cautions on handling batteries

1. Do not disassemble the battery or touch its inside. Otherwise, electrical shock may result.
2. Do not over-heat or apply a strong impact to the battery. Otherwise, fluid leakage, explosion, or heat generation, etc.
may result. Never use the battery, to which a strong impact has been applied, such as dropping to the floor since its
battery fluid may leak.
3. Only engineers who have the experience and knowledge about electrical work are allowed to replace the battery.
4. The battery may discharge naturally. When purchasing a spare battery, do not store it for a long period and prepare it
one to two months before the scheduled replacement work. Additionally, when storing the battery, avoid a place
where the temperature increases and be sure to store it at room temperature.
n NOTE
When the safety data sheet (MSDS/SDS) about the battery is needed, contact YAMAHA or your distributor.
c CAUTION
For details about how to handle the UPS, see the user's manual prepared by the manufacturer that is supplied with the
UPS.
c CAUTION
When disposing of a battery, dispose of it in compliance with the laws and regulations of the country where the
machine is used. If you have any questions about disposal of the battery, please contact YAMAHA or your distributor.
1.14 Handling heavy objects

This machine (including optional units) may require the operator to handle heavy objects during work. (For
example, magazine or cassette replacement) If you hold up a heavy object in an unnatural posture, this may
cause damage to your back. Additionally, if you fall a heavy object to your feet, this may cause serious
personal injury. Or, falling a heavy object may cause damage to the magazines or internal tray parts.
Cautions on handling heavy objects

1. Be careful not to take an unnatural posture during work. In particular, be aware that you may take an unnatural
posture easily when holding up a heavy object from a low place. It is recommended to hold up a heavy object by
bending and stretching your knee instead of bending your waist or prepare a cart with an appropriate height when
necessary.
2. When a handle is provided, such as magazine and cassette, hold the handle securely and perform the work.
3. To prevent personal injury caused by heavy object dropping, be sure to wear safety shoes.
c CAUTION
When heavy object handling standards are defined at the customer's factory, be sure to follow the standards during
work.
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1.15 Parts and materials to be used
This machine uses not only the surface-mounted components but also the various types of materials such as
trays, wafer components, dicing tapes and so on. In selecting these components and materials, observe the
following.
1. Do not use the flammable (explosive) material.
Safety instructions
2. Do not use the material whose function is impaired by heating.

For example, some flip tip bonders are equipped with a heater inside the unit (e.g. YSB55w : The dicing tape is heated
to approx. 60 degrees.) Do not use the flammable materials or the materials impaired by heat.
3. Do not use the materials that reacts chemically with solders, flux, adhesive and solvents used for cleaning them.
4. Select parts and materials that meet the specifications of the machine.
n NOTE
Check the detailed specifications of the parts and materials with the suppliers beforehand. If you have any questions
about the specifications of the machine, please contact YAMAHA or your distributor.
x
2. Safety message
This section describes information you should always comply with to prevent unforeseen accidents that might
lead to injury of the operator and others or damage the machine. Hazards and injuries that might result from
ignoring safety instructions and operating the machine incorrectly are categorized as follows.
Safety instructions
2.1 Safety message and categories in this manual
This manual uses the following safety alert symbols, signal words, and format styles according to the degree of
hazard.
n Safety alert symbols and signal words
w WARNING
Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury.
These are points most essential for protecting the safety of the machine operator, inspector and service
personnel.
c CAUTION
Indicates a potentially hazardous situation which, if not avoided, may result in minor injury, or material loss or damage
to the machine. These points are important for protecting the safety of the machine and data, etc.
n NOTE
Gives helpful information or key points when operating the machine, in a simple and clear manner.
e EMERGENCY STOP
This mark indicates the emergency stop button must first be pressed before continuing the procedure.
xi
2.2 Typical warning text found in manual
The following are typical warning message text found in the YAMAHA surface mounter or related product
manual.
2.2.1 Safety instruction

Safety instructions
When you see the following cautions or warnings, always read them thoroughly and make sure you fully
understand them.
n Warnings
w WARNING
The signal light (signal tower) installed on the top of the machine is an important device that shows the
operating status of the machine. BEFORE OPERATING THE MACHINE, MAKE SURE THAT EACH LAMP OF THE SIGNAL
TOWER LIGHTS UP CORRECTLY (GREEN DURING OPERATION, YELLOW WHEN ERROR OCCURS OR INTERLOCK IS DETECTED,
AND RED DURING EMERGENCY STOP). NEVER PLACE ANY PART OF THE BODY IN THE HEAD MOVEMENT RANGE WHILE THE
GREEN LIGHT IS ON. (On machines designed to meet EU specifications, green/white/blue lamps are used
instead of green/red/yellow lamps.)
w WARNING
Never allow any part of your body (hands, head) to enter within the machine movement range during
operation.
w WARNING
Be careful when using isopropyl alcohol, since inhaling its fumes over long periods can be hazardous
to health.
n Cautions
c CAUTION
The person operating the machine must have been trained in correct machine operation and safety.
c CAUTION
This machine contains parts generating strong magnetic fields. Great care should be taken when a part of your body
is put inside the machine for the maintenance work. Cautions regarding ferromagnetic fields are described in the
section, “Safety Instructions”, at the beginning of this document. Always thoroughly read this section to fully
understand its contents.
c CAUTION
The exhaust air blow might strike your face, so be sure to wear safety goggles.
xii
2.2.2 Operation and handling precautions
understand them.
n Warnings
Safety instructions
WARNING
Inflammation may occur if grease or lubricant gets in the eyes. Before handling the grease, wear safety
goggles to ensure the grease will not come in contact with the eyes.
w WARNING
Inflammation may occur if the grease or lubricant comes into contact with skin. Be sure to wear
protective gloves to prevent contact with skin.
w WARNING
Do not take orally or eat the grease or lubricant. Eating will cause diarrhea and vomiting.
n Cautions
c CAUTION
Always stop the machine before installing the parts feeder into the machine. Hands or other parts of your body might
otherwise be caught in the moving parts.
c CAUTION
During operation only press the emergency stop button in cases of emergency.
c CAUTION
Always turn off the power with the correct procedure. Using hasty or incorrect procedures to turn off power might
damage the flash disk in the machine.
c CAUTION
When installing push-up pins on the push-up plate, set them in positions where they will not interfere with the conveyor
rails or other parts when the push-up plate is raised.
c CAUTION
When the machine you are using is not equipped with a nozzle station, you must change the nozzle by hand if it is not
a specified nozzle. In this case, always first press the emergency stop button.
c CAUTION
If an abnormality occurs during warm-up, immediately stop the machine, find the cause of the problem and eliminate it.
c CAUTION
When storing the grease after use, tightly close the cap of the grease tube or container to prevent dust and moisture
from entering inside. Store it in a dark place to avoid direct sunlight, and keep away from fire and heating sources.
c CAUTION
After copying board data or system data into a USB flash memory, do not leave that data in the USB flash memory for
a long time. Use the USB flash memory just as a copy medium for backup data. Prepare other backup media
(CD, DVD, MO, etc.) to store backup data more safely.
c CAUTION
You can also clean and grease the ball screw after removing the push-up plate. However, the push-up plate is heavy.
So, take great care during handling.
c CAUTION
A strong air flow is exhausted during the cleaning blow. Always remove all nozzles attached to the heads before
starting the cleaning blow. Starting the cleaning blow while the nozzles are still attached may blow the nozzles away
from the heads causing the nozzles to break or become lost.
xiii
2.2.3 Facilities and environmental condition
understand them.
n Warnings
Safety instructions
w WARNING
Always shut off the power and air supply before replacing parts or performing repairs.
w WARNING
During teaching or when making machine adjustments, always keep alert so that you can stop the
machine whenever needed.
w WARNING
Safety devices (safety interlocks) that stop machine operation should always be in good operating
condition.
w WARNING
The machine should never be used in locations with inflammable gas or in extremely dirty or polluted
environments.
w WARNING
• Persons wearing electro-medical devices such as cardiac pacemakers must be kept away from the
head assembly.
• Persons with implanted magnetic metals must be kept away from the head assembly.
• Do not bring ferrous objects such as metal tools and screws close to the parts where a strong
magnetic field warning is indicated.
• Do not bring magnetic cards or objects vulnerable to magnetic fields close to the head assembly.
w WARNING
To avoid the risk of electrical shock, make sure that the power source is off before connecting the
power cable. Also make sure that the ground cable is securely connected to the machine.
n Cautions
c CAUTION
When disconnecting the air hose, be careful not to allow oil, water or impurities to splash outwards. Additionally, take
great care since a large air exhaust sound is produced when disconnecting the coupler.
c CAUTION
Use a power cable whose conductor cross-section area is greater than xx mm2.
xiv
3. Warning labels
To use the YAMAHA machines safely and correctly, warning labels are attached to the machine body and
peripheral equipment. Check that the information on each warning label is clearly legible and comply with
the instructions.
Safety instructions
3.1 Warning label format and mark description
3.1.1 Warning label format

As shown below, a warning label indicates the degree of hazard by means of a signal word and the color of the
signal word panel. A mark and a pictogram are also used to emphasize the message. Basically, labels attached
to the outside of machines are in 4 languages (English, Chinese, Korean and Japanese) while labels attached to
the inside of the machines are only a pictogram.
Warning label format

Warning message and mark (pictogram) example
Safety alert symbol Signal word
WARNING Signal word panel

Danger : Red
Pinch or crush hazard. Warning : Orange
Caution : Yellow
Mark and pictogram
Message
90K41-000380
91206-L0-00
3.1.2 Meaning of marks

The following 3 types of marks are used on warning labels. Each mark has its own meaning and is typically
used with a pictogram to emphasize the message.
Mark and pictogram

Marks and examples used with pictogram
Warning mark Prohibition mark Instruction mark
WARNING WARNING WARNING
Usage examples
91207-L0-00
Meaning of the above

Definition Shape/Color
examples
Indicates a hazard, how to Yellow triangle with black Risk of electrical shock
avoid the hazard, and potential border. Pictogram is black on
Warning
consequences of ignoring the yellow.
warning.
Indicates a prohibited action to Red circle with slash. Pictogram Do not modify or disassemble
Prohibition avoid the potential hazard. is black and located behind safety cover switch.
slash.
Indicated an action that must Blue circle. Pictogram is white Read the manual to understand
Instruction be taken to avoid the potential on blue. procedure before starting
hazard. operation.
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3.2 Warning labels
Safety instructions
3.2.1 Handling safety covers

Potential
Injury from touching moving parts during machine operation
hazard
To avoid Do not touch or tamper with safety cover switches and do not operate machine if any safety cover
hazard switches were deactivated.
Applicable
All YS series machines, tray changers, etc. Case All case
machines
Potential
Unexpected accidents may occur if safety mechanisms are disabled.
hazard
To avoid Do not remove or disassemble any specified safety mechanism (protective cover, safety cover,
hazard etc.).
Applicable
Z:LEX(YSM20/YSM20W), YS24, YS24X, YSH20, etc. Case All case
machines
Potential
Risk of injury
hazard
To avoid
Be sure to return the cover to its original position before starting the operation.
hazard
Applicable
YSP Case All case
machines
xvi
3.2.2 Pinching or crushing injur y
Safety instructions
Potential · Hands or fingers might be caught between moving parts and covers, causing injury.
hazard · Hands or fingers might be pinched by moving parts, causing injury.
To avoid
Never place hands or fingers in machine during operation such as when handling tray magazines.
hazard
Applicable Z:LEX(YSM20/YSM20W), YSM40/YSM40R, all YS series machines,
Case All case
machines tray changers
Potential
Hands or fingers might be pinched or crushed by clamp plate, causing injury.
hazard
To avoid
Never place hands or fingers in the machine when clamping a mask.
hazard
Applicable • Setup
YCP10,YSP,YSP20 Case
machines • Maintenance
Potential
Injury from tape cutter
hazard
To avoid
Do not put hands into cutter unit while power or compressed air is supplied.
hazard
Applicable
Machines equipped with tape cutter. Case Maintenance
machines
xvii
3.2.3 Effects on human body
Safety instructions
Potential
Electrical shock hazard
hazard
To avoid
Do not touch and disassemble ionizer discharge needles. Keep them away from water.
hazard
Applicable
Machines equipped with ionizer (option) Case All case
machines
To prevent the electric shock or damage.

Do not touch electrodes.
WARNING Do not disassemble this unit.
Keep unit away from water and high
humidity
可造成触电和故障的原因。
别用手触摸电极部位。
警告不可私自拆分部件。
请避免部件接触水分并远离极度潮湿环境。
感電や故障の原因になります。
放電針に手を触れないで下さい。
警告分解はしないで下さい。
電気部に水をかけないで下さい。
Potential
Death, serious injury or equipment malfunction
hazard
To avoid
Observe precautions necessary due to strong magnetic fields.
hazard
Applicable
YS12, YS12P, YS12F, YS24, YS24X, YSH20,YSM40/YSM40R etc. Case All case
machines
Potential
hazard
To avoid
Do not touch power supply inside cover.
hazard
Applicable
All machines Case All case
machines
xviii
Potential
Burn hazard
hazard
Safety instructions
To avoid
Heater becomes very hot during and shortly after operation, so do not touch it.
hazard
YSD,YSH20 machines equipped with heater (option) Case
Potential
hazard
To avoid
Do not touch while power is supplied.
hazard
Applicable Z:LEX(YSM20/YSM20W), YSM40/YSM40R, All YS series machines
Case Maintenance
machines (controller unit) except for inspection equipment
Potential
Loss of eyesight
hazard
To avoid
Do not directly look into laser beam.
hazard
Applicable IT options such as barcode readers (Class 2 laser)
Case All case
machines YS series machines (Class 1 laser)
xix
Potential
Electrical shock
hazard
Safety instructions
To avoid
Keep the ionizer away from eyes. Do not disassemble or touch the discharge needles.
hazard
Applicable
Machines equipped with ionizer (option) Case All case
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
Machines equipped with UPS (option) Case Maintenance
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
machines
xx
3.2.4 Handling each section
Safety instructions
Potential
Solvent may catch fire.
hazard
To avoid
Keep solvents such as alcohol away from fire or flame.
hazard
All solder paste printers Case
Potential
hazard
To avoid
Before opening covers wait at least 100 seconds after turning power off.
hazard
Applicable
All machines Case Maintenance
machines
Potential
Possible skidding or slipping causing injury
hazard
To avoid
Do not step on base section.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xxi
Potential
Damage to machine or injury to person
Safety instructions
hazard
To avoid Before handling the product (equipment) always read manuals and make sure you fully understand
hazard the contents.
Applicable Z:LEX(YSM20, YSM20W), YSM40/YSM40R, all YS series machines,
Case All case
machines etc.
Potential
Exposure to radiation
hazard
To avoid
Keep covers closed during operation.
hazard
Applicable
YSi-X Case All case
machines
Potential
Risk of injury
hazard
To avoid
Do not open any cover without permission from YAMAMA service personnel.
hazard
Applicable
Maintenance parts for linear motors (strong magnetic fields) Case Maintenance
machines
xxii
3.3 Caution labels
Safety instructions
3.3.1 Machine damage
Potential
Adverse effects on component mounting accuracy
hazard
To avoid
Do not touch camera unit or apply impacts to it.
hazard
All machines Case
Potential
Risk of damage
hazard
To avoid
Remove shipping bolts and clamps before using machine.
hazard
Applicable
YS series machine feeder exchange carriage (option) Case Installation
machines
Potential
Machine damage or malfunction
hazard
To avoid
Connect power only at the specified voltage.
hazard
Applicable
All machines Case Installation
machines
Example for machines that must be connected to 200 VAC
Potential
Machine damage or malfunction
hazard
To avoid
Do not use any solvent, such as alcohol.
hazard
Applicable
All inspection machines Case Maintenance
machines
xxiii
Potential
Machine damage
Safety instructions
hazard
To avoid
Make sure push-up pins are arranged within specified area.
hazard
Applicable
Z:LEX(YSM20/YSM20W), YS24, YS24X Case Setup
machines
Potential
Machine damage or fire
hazard
To avoid
Do not use other than specified solvent.
hazard
Potential
Machine damage
hazard
To avoid
Always use gauze rolls of proper size.
hazard
xxiv
Potential
Machine damage
hazard
Safety instructions
To avoid If machine is not to be used for 6 months or more, block off the solvent path to protect solvent
hazard pump.
Applicable
All solder paste printers Case Maintenance
machines
Potential
Might disable machine functions
hazard
To avoid
Periodically replace USP battery since it has a limited service life.
hazard
Applicable
machines
Potential
Machine damage
hazard
To avoid
Read manuals and use correct procedure to operate machine.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xxv
Potential
Could cause machine damage (collisions with head, etc.).
hazard
Safety instructions
To avoid Verify that no objects have been placed on the top cover of the feeder exchange carriage (for
hazard YSM40).
Applicable
Feeder exchange carriage (YSM40) Case Setup
machines
Potential
The carrier tape could make contact with the head, possibly causing machine damage.
hazard
To avoid When a feeder is extracted from its loaded position, be sure that the feeder has been completely
hazard extracted before pressing it back into its loaded position.
Applicable
Z:LEX(YSM20/YSM20W), YSM40/YSM40R Case Setup
machines
Potential
Pallet may drop if setting up parts on the parts supply station.
hazard
To avoid
Remove pallets before setting up parts.
hazard
Applicable
cATS (YSM40/YSM40R) Case Setup
machines
xxvi
Potential
hazard
Safety instructions
To avoid Verify that no objects have been placed on the top cover of the feeder exchange carriage (for
hazard YSM40 and Z:LEX (YSM20)).
Applicable Feeder exchange carriage
Case Setup
machines (YSM40/YSM40R, Z:LEX(YSM20/YSM20W))
Potential
hazard
To avoid Verify that no objects have been placed on the top cover of the feeder exchange carriage (for YSM40
hazard and Z:LEX (YSM20)).
Applicable Feeder exchange carriage
Case Setup
machines (YSM40/YSM40R, Z:LEX(YSM20/YSM20W))
Potential
Machine damage
hazard
To avoid
Do not insert or remove any connector while power is on.
hazard
Applicable
cATS10 (Z:LEX(YSM20/YSM20W) ) Case Setup
machines
xxvii
3.4 Label positions
Warning/caution labels are attached to the YAMAHA products to ensure safe and correct use. Check that the
information on each label is clearly legible and comply with the instructions.
For safety precautions other than those on the labels shown in this section, see the instructions in "1. Safety".
n
Safety instructions
NOTE
When connecting power to this equipment, refer to "Power connection terminals" described in the appendix of the
operator's manual.
n NOTE
The label contents and positions are slightly differ depending on machine model. For the label contents and positions,
refer to the operator's manual for the machine being used.
xxviii
General Contents
Before using the machine

1. Using this manual i
1.1 Available manuals i
1.2 Manual contents i
2. Warranty ii
3. Contents of each chapter iii
4. Page layout iv
Chapter 1 Basic operation

1. Operation screen and various buttons 1-1
1.1 Basic configuration of operation screen 1-1
1.2 Button area's functions 1-2
1.3 Setup screen 1-3
1.4 Data Edit screen 1-4
1.4.1 "Board" screen 1-4
1.4.2 "Fiducial" screen 1-5
1.4.3 "Bad Mark" screen 1-6
1.4.4 "Height" screen (Option) 1-7
1.4.5 "View" screen 1-8
1.4.6 "Mount" screen 1-10
1.4.7 "Parts" screen 1-11
1.4.8 "FOD" screen 1-13
1.4.9 "Code Scan" screen 1-15
1.5 Auto inspection screen 1-16
1.5.1 "Inspection" screen 1-16
1.5.2 "Whole" screen 1-17
1.5.3 "Output" screen 1-19
1.5.5 "Judge" screen 1-20
1.5.6 "Conveyor" screen 1-21
1.6 Unit (manual operation) screen 1-22
1.6.2 "I/O" screen 1-23
1.7 History screen 1-24
2. Starting and ending inspection 1-25

2.1 Starting automatic inspection 1-25
2.1.1 Selecting inspection programs 1-25
2.1.2 Starting automatic inspection 1-26
2.2 When NG detection occurs 1-27
2.2.1 Second judge 1-27
2.3 Temporary change of inspection mode 1-28
2.4 Inspection complete screen 1-29
2.5 Ending automatic inspection 1-30
EPP716B210
Chapter 2 Creating inspection programs
1. Before creating inspection programs 2-1
1.1 Views and libraries 2-1
1.2 Algorithm 2-2
1.3 Selecting Inspection Type 2-4
2. Creating inspection programs 2-6

2.1 Flowchart for creating an inspection program 2-6
2.2 From data conversion to image saving 2-7
2.3 Creating full board images 2-10
2.4 Setting fiducial marks 2-11
2.5 Saving view images 2-16
3. Setting inspection programs 2-17

3.1 Board parameter 2-17
3.2 Fiducial parameters 2-20
3.2.1 Fiducial mark setting items 2-20
3.2.2 Basic parameters 2-22
3.2.3 Sampling conditions parameter 2-24
3.2.4 Managing mark libraries 2-26
3.3 Bad mark parameters 2-27
3.3.1 Bad mark function 2-27
3.3.2 Bad mark settings 2-28
3.4 Height parameters (option) 2-33
3.4.1 Z axis correction 2-33
3.4.2 Datum Height 2-36
3.5 View parameters 2-40
3.5.1 Adding view images 2-40
3.5.2 Creating all views and shortening inspection time 2-41
3.5.3 Manual view creation procedure 2-42
3.5.4 Multiple view operations 2-44
3.6 Mount parameters 2-59
3.6.1 Pasting libraries 2-61
3.6.2 Setting libraries 2-63
3.6.3 Parts adding procedure 2-64
3.7 Foreign object parameter 2-65
3.7.1 Creating the data of inspecting FOD on the board 2-65
3.7.2 Procedure of creating foreign object mask data 2-70
3.8 Code scan 2-76
4. Auto tuning of inspection program 2-78
4.1 Pad information tuning 2-78
4.1.1 General description 2-78
4.1.2 Saving PWB image 2-79
4.1.3 Setting parts information 2-80
4.1.4 Tuning procedure 2-82
Chapter 3 Creating parts libraries

1. Creating new parts libraries 3-1
2. Editing parts libraries 3-8

2.1 Creating new partial areas 3-9
2.1.1 Creating new partial areas procedure 3-9
2.1.2 Partial Shape Edit Dialog 3-13
2.2 Checking libraries 3-15
2.3 Parameters 3-16
2.3.2 Sampling parameters 3-18
2.3.3 Detect parameters 3-20
2.3.4 Judge parameters 3-22
2.3.5 Option parameters 3-25
2.4 All functions 3-26
2.4.1 Sampling condition (based on light sampling type) 3-26
2.4.2 Registering user characters 3-38
2.4.3 Pattern registration 3-44
2.4.4 Step Mask function 3-47
2.4.5 Step tuning 3-48
2.4.6 "Detection" results 3-52
2.4.7 Parts library detail screen 3-53
2.4.8 Utilizing Parts Library 3-55
2.4.9 Utilizing sampling Lib 3-59
2.4.10 Batch replacement 3-61
Chapter 4 Setting Inspection Types

1. Setting Inspection Types 4-1
1.1 Inspection step setting procedure 4-1
1.2 Algorithm list 4-3
2. Description of Algorithm 4-5

2.1 Body 4-5
2.2 Termination 4-7
2.3 Character 4-9
2.4 Shape 4-12
2.5 Compare Luminance 4-14
2.6 Pattern 4-16
2.7 Solder 4-18
2.8 Foreign Object 4-20
2.9 Luminance 4-22
2.10 Lead 4-24
2.11 Laser Measurement (option) 4-26
2.11.1 Datum Height Point 4-26
2.11.2 Body Lifting, Lifted Lead, Chip Tombstoning 4-28
2.12 3D Height (option) 4-30
2.13 Compare Height (option) 4-36
2.14 3D Solder (option) 4-38
2.14.1 Setting procedure 4-38
2.14.2 Description of parameters 4-41
2.15 4D Foreign Object (option) 4-45
Chapter 5 Inspection machine settings

1. Operator access control 5-1
1.1 Registering a new operator 5-1
1.2 Changing registered operator details 5-4
1.3 Editing groups 5-5
1.4 Editing access levels 5-7
2. Machine settings 5-8

2.1 Installation settings 5-9
2.2 Conveyor transfer settings 5-13
2.3 Secondary judgment settings 5-14
2.4 Server settings 5-15
2.5 Library settings 5-17
2.6 Editing signal tower settings 5-18
2.7 Data conversion settings 5-19
2.8 Vision Setting 5-20
2.9 Inspection Mode Setting 5-21
Appendix
1. List of keyboard shortcut keys A-1
2. I/O List A-2

INDEX
Contents
1. Using this manual i

1.1 Available manuals i
1.2 Manual contents i
2. Warranty ii
3. Contents of each chapter iii
4. Page layout iv
The instruction manual of this machine is written for those who operate
this machine.
Please read this manual carefully for correct operations and pay
special attention to safety precautions.
After reading through this manual, please use this manual as an
occasional reference and keep it within reach.
1. Using this manual

1.1 Available manuals
There are several different manuals available including this manual to help users use the machine effectively
depending on their skills, expertise, and applications. Available manuals are shown below.
■ Available manuals
Manuals supplied with machine
The following manuals are supplied with the machine you purchased.
Programming Manual
Operator's Manual
This manual
23000-P7-00
1.2 Manual contents

The contents of each manual are briefly explained below.
■ Contents of manuals supplied with machine
Operator's Manual Programming Manual
This manual is intended for machine operators. It provides This manual is intended for those who program inspection
an overview of the machine and information necessary to data. It describes how to create and edit data needed for
operate the machine. machine operation and board inspection.
Before using the machine Before using the machine
Chapter 1: Part names and functions Chapter 1: Basic operation
Chapter 2: Basic operation Chapter 2: Creating inspection programs
Chapter 3: Daily operation Chapter 3: Creating parts libraries
Chapter 4: Maintenance Chapter 4: Setting inspection items
Chapter 5: Lubrication points Chapter 5: Inspection machine settings
Appendix Specifications, UPS. Appendix
Option Manual Software option manual (CD)
The option manual describes the handling of optional unit The manual for each software option for inspection
of the inspection equipment. equipment is stored on the installation CD.
■ Laser height unit ■ Repair judgment station
■ Marking unit ■ Remote judgment station
c CAUTION
The contents of these manuals are subject to change without prior notice.
i
2. Warranty
The machine you have purchased is warranted against malfunctions as described below.
n Warranty description:
If a failure or breakdown occurs due to defects in workmanship or materials used to manufacture this machine within
one year or 5,000 hours of operation (whichever comes first) after the incoming inspection is complete, then YAMAHA
will repair the defective parts free of charge.
n Warranty period
The warranty period ends when any of the following applies:
1. After one year has elapsed from the time of installation.
2. After 5,000 hours of operation.
n Items not covered by the warranty

The warranty does not cover any of the following conditions:
1. Damage as a result of deterioration due to age or wear (e.g., normal discoloration of painted or plated surfaces, wear
of replaceable parts, etc.).
2. Incidents associated with sensory perceptions which have no bearing on the quality or function of the machine (e.g.,
signal sounds emitted by the controller, rotating sounds of the motor, etc.).
3. Damage caused by the user environment (e.g., impurities in the air supply, dust, debris and oil mist in the machine).
n Exception to warranty repairs

Warranty repairs will not be made if damage is caused by the following:
1. Earthquakes, typhoons, floods, lightning, accidents or fires, other natural or man-made disaster.
2. Modifications or conversions not approved by YAMAHA or its dealers.
3. Use of non-genuine parts, greases or lubricants.
4. Lack of proper maintenance and inspection procedures.
5. Maintenance handled by someone other than the approved dealers.
6. Damage or malfunction due to changes in the machine installation level that may be caused by changes in the
foundation or surrounding environment.
7. The machine was modified or changed in specifications after the incoming inspection is complete.
8. When defective parts replaced free of charge were not returned to the location specified by YAMAHA or YAMAHA
sales representatives within 30 days.
n Note on network connections

A precondition for network connections with the YAMAHA machines is that such connections will be used in closed
networks comprised of this machine and an off-line PC. The customer must take responsibility for connections to
company in-house networks and to external networks. Please acknowledge that YAMAHA can bear absolutely no
responsibility for networks configured by other than this machine and off-line PC nor can accept responsibility for
problems occurring due to network settings and connections.
ii
3. Contents of each chapter

This manual is comprised of the following chapters.

This chapter explains the basic configuration of the YSi V3 software screen.

This section describes how to create a new inspection programs.

This section describes how to create parts libraries and make parameter settings, and explanations on button functions.

This section describes how to set each inspection type.

1. This section describes operator management and machine settings.
2. This section describes the signals on the I/O screen in lists.
Appendix
This section describes keyboard shortcut functions that are available when performing screen operation.
Index
The index at the end of this manual helps you quickly find where necessary items are explained.
iii
4. Page layout
The description below shows a typical page layout used in this manual.
Typical page layout
5. Block settings
A "block" is the inspection range (field-of-view) of the inspection device. Blocks must be set on the board
locations to cover all parts to be inspected. Because the image of each block is acquired and saved, block
settings must be performed on the actual machine. (On the offline software, some buttons are grayed out and
inactive.)
5.1 Basic block setting procedure
Note, Caution
The basic block setting procedure is explained below.
2 Chapter number
n NOTE
When an inspection program created with P-Tool is loaded, there is no need to set blocks because they have already
or Warning been set.
Creating and setting data

n NOTE
After carefully reading the basic procedure, refer to the next section 5.2, "Block setting function details", for creating
all blocks efficiently.
Step Blocks can be automatically created by using the VADMIC editor. Chapter title
1 Open the "Data Edit" screen and set a board in place.
Sub step or When you press the [Data edit] button on the "Main" screen, a "Set PCB?" message appears. At this time,
description of step set a board at the entrance sensor detection position on the conveyor and then press the [Yes] button.
"Data Edit" screen
Figure, picture
or table caption
24219-K0-10
2-15
23001-P7-00
n Step
This describes the procedure for each operation.
n Substep or description of step

This describes steps in detail.
n Figure, picture or table caption

This is the title of the figure, picture or table and appears at the upper left.
n Note, Caution or Warning

These are explained in detail in "Safety" instructions.
iv
Contents
1. Operation screen and various buttons 1-1

1.1 Basic configuration of operation screen 1-1
1.2 Button area's functions 1-2
1.3 Setup screen 1-3
1.4 Data Edit screen 1-4
1.4.1 "Board" screen 1-4
1.4.2 "Fiducial" screen 1-5
1.4.4 "Height" screen (Option) 1-7
1.4.5 "View" screen 1-8
1.4.6 "Mount" screen 1-10
1.4.7 "Parts" screen 1-11
1.4.8 "FOD" screen 1-13
1.4.9 "Code Scan" screen 1-15
1.5 Auto inspection screen 1-16
1.5.1 "Inspection" screen 1-16
1.5.2 "Whole" screen 1-17
1.5.3 "Output" screen 1-19
1.5.5 "Judge" screen 1-20
1.6 Unit (manual operation) screen 1-22
1.6.2 "I/O" screen 1-23
1.7 History screen 1-24
2. Starting and ending inspection 1-25

2.1 Starting automatic inspection 1-25
2.1.1 Selecting inspection programs 1-25
2.1.2 Starting automatic inspection 1-26
2.2 When NG detection occurs 1-27
2.2.1 Second judge 1-27
2.3 Temporary change of inspection mode 1-28
2.4 Inspection complete screen 1-29
2.5 Ending automatic inspection 1-30
1. Operation screen and various buttons
This section describes the basic configuration and operation of the inspection machine software screen.
Please read through this section before operating the machine. 1
1.1 Basic configuration of operation screen
basic operation
The YSi V3 series operation screen can be divided into the "Status area", "Button area", and "Free area" as
shown below.
Operation screen basic configuration
Button area Status area
Free area
24101-P7-10
Status area
Displays the current machine status on the left end, the selected inspection program name in the middle, and the inspection mode and
the number of boards that have been inspected on the right end.
Button area
This area allows selecting the main menus for machine operation. The "Free area" screen will change according to the selected menu
button.
Free area
Displays the operation screen selected by a menu button in the "Button area".
1-1
1.2 Button area's functions
The functions that can be used by pressing each menu button in the "Button area" are described below.
1 The contents of the "Free area" change according to the selected menu button. Each screen that opens by
pressing a menu button is described on the following pages.
Button area
basic operation
1
2
3
4
5
6
7
8
9
10
11
12
13
24102-P7-10
■ Button area
Button name Function
Opens the "Setup" screen used to manage programs. (See 1.3, "Setup screen", in this
1 Setup
chapter.)
Opens the "Data Edit" screen used to edit inspection data. (See 1.4, "Data Edit screen",
2 Data Edit
in this chapter.)
Opens the "Auto Inspection" screen used to perform auto board inspection.
3 Auto
(See 1.5, "Auto Inspection screen", in this chapter.)
Opens the "Unit (manual operation)" screen. I/O can be checked. (See 1.6, "Unit (manual
4 Unit*
operation) screen", in this chapter.)
Displays errors that have occurred and operation history. (See 1.7, "History", in this
5 MIS
chapter.)
Saves inspection programs.
6 Save After editing data on each screen, pressing this [Save] button opens a confirmation
dialog. Press the [OK] button in the confirmation dialog to save the edited data.
Unloads the board in the inspection machine.
7 Change* Also press this button to load a board into the inspection machine when no board is
loaded.
Selects the operator who will be operating the inspection machine. (See Chapter 5, "1.
8 Operator
Operator management", in this manual.)
Opens a screen used to specify inspection machine settings. (See Chapter 5, "2.
9 Machine
Machine settings", in this manual.)
Exits the inspection machine application and Windows.
10 Off
Returns to the Windows screen when using the offline software.
Displays the current inspection machine application language. Select from the drop-down
11 Language
list to change the language.
12 Operation method Displays INLINE/OFFLINE.
13 Version Displays the current inspection machine application version.
* This cannot be used with offline software iPro (option).
1-2
1.3 Setup screen
The "Setup" screen allows you to manage inspection programs and specify settings for all utilities. The items
and buttons displayed on the screen are described below.
"Setup" screen
1
1 2 3
basic operation
5
6
7
8
9
10
11
12
13
14
15
16
17
4 20 19 18
24103-P7-10
Item/button name Function
1 Path Shows the path to the location where inspection programs are stored.
Each inspection program is managed on the inspection mode tabs on the "Setup" screen.
Inspection modes include "Production", "Initial Production" and "Tuning".
2 Inspection mode tabs
(Refer to Chapter 2, "3.1 Board parameter" and "Chapter 5, "2.9 Inspection mode
setting".)
3 Program list Shows a list of inspection programs stored in the path folder.
Changes the selected program in the list. Programs can also be selected by directly
4 Program change
clicking programs in the list.
Loads the inspection program selected in the program list. Programs can also be loaded
5 Select
by directly double-clicking programs in the list.
6 Create Press this button to create a new inspection program.
7 Copy Copies the inspection program selected in the program list.
8 Delete Deletes the inspection program selected in the program list.
9 Rename Renames the selected inspection program.

Imports or exports inspection programs.
10 Board Explorer
To copy or move programs to other storage place, use the export function.
11 Update Info. Re-creates the program list.
Selects mount data (YGX) and converts it to an inspection program. (See Chapter 2,
12 Convert
"2.2 From data conversion to image saving", in this manual.)
13 Search Searches for inspection programs.
14 Warmup *1 Opens a dialog box for warming up the servo motor axes.
15 Light Check *1 Diagnoses the LED lighting intensity.
16 Head Info. Displays the information related to the head.
17 SW Version Displays the software version, running time, machine serial number, etc.
18 Remove Media Allows the connected media to be safely removed.

Press this button to register and edit operators, and set passwords and operator levels,
19 Operator Management
etc. (See Chapter 5, "1. Operator management", in this manual.)
20 System Backup Backs up and restores machine settings.
*1
21 Origin Moves the inspection head, conveyor, and laser unit*2 to their respective origin positions.
*1
This cannot be used with offline software iPro (option).
*2
The laser height unit is optional.
1-3
1.4 Data Edit screen
The items and buttons displayed on the "Data Edit" screen are described below.
1 For instructions on how to set inspection data, refer to Chapter 2, "Creating and setting data", in this manual.
1.4.1 "Board" screen

This screen allows setting the basic items needed to perform board inspection and to create an entire board
image.
basic operation
[Data Edit] - [Board] screen
2 3 4 5
24104-P7-00
In this list, set parameter data such as board size to perform inspection. (See "3.1 Board
1 Board parameter
parameters" in Chapter 3.)
2 Execute* Creates an entire board image.
3 Stop* Stops creating an entire board image.
4 Data Rotate* Rotates inspection data by 90°, 180°, or 270°.
5 Width* Displays the screen for changing the conveyor width.
1-4
1.4.2 "Fiducial" screen
This screen allows setting fiducial marks to use the fiducial function. This fiducial function corrects board outer
1
shape, play due to the board clamp mechanism, and local distortions on the board according to the recogni-
tion results of fiducial marks on the board.
[Data Edit] – [Fiducial] screen
basic operation
1 Mark list Mark type list
2
3
4
Basic tab
Sampling tab
9
7
8
10
5 6 15 14 13 12 11 Mark data list 16 17 18 19 Parameter

24105-P9-10
1 Board/Block/Local The unit for enabling the fiducial function can be selected from board, block, or local.
2 Trace Moves the camera to the mark XY coordinates selected in the mark list.
3 Teach The center of the recognized mark is registered as the fiducial mark position coordinates.
4 Replace Searches for and replaces items registered in the block or local mark list.
+ : Enlarges the fiducial mark image.

5 Zoom - : Reduces the fiducial mark image.
The image can also be enlarged and reduced by rotating the mouse wheel.
Changes the fiducial image lighting. Select the lighting that results in the clearest image
6 Change lighting
from U, H, M, and L.
Displays the marks registered in the library.
7 Library
You can select some marks registered in the library to set them in the mark data list.
8 Set Mark Registers the created fiducial mark in the library.
As the recognized mark is enclosed by dragging the mouse, the parameters corresponding
9 Measure
to "Algorithm Type" of the basic parameters are automatically measured and set.
Saves template data for pattern matching. This button becomes active when pattern
10 Template
matching is selected at "A. Algorithm Type" in the basic parameters.
Indicates the coordinates and luminance at the cursor position.
11 Measure
Measures the distance by dragging on the fiducial image.
12 Detected Displays the area to be detected based on the set sampling conditions in red.
Displays the inspection images that are detected based on the conditions set on the
13 Insp img
[Sampling] tab screen.
14 Image List Allows you to select fiducial mark images saved in the inspection program.
Pressing this button changes the pitch for the camera to move when the arrow buttons
15 0.1mm
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000m)
16 Result display Displays the result of the fiducial mark recognition test.
17 Test Perform a fiducial mark recognition test.
18 Same Mark Carries out the recognition test for all the fiducial marks that use the same mark information.
19 Detail Displays the detailed results of the mark recognition test.
1-5
1.4.3 "Bad Mark" screen
This screen allows you to set bad marks in order to use the bad mark function. The bad mark function affixes
1
the bad mark to a specified location on the board so as to ensure that the inspection is not performed only
when the inspection machine recognizes the bad mark.
[Data Edit] - [Bad Mark] screen

basic operation
1 Mark list Mark type list
Basic tab
Sampling tab
2
3
4
7
8
5 6 11 10 Mark data list 12 13 Parameter

24106-P7-10
1 Board/Block/Local The unit for enabling the bad mark function can be selected from board, block, or local.
2 Trace Moves the camera to the mark XY coordinates selected in the mark list.
3 Teach The center of the recognized mark is registered as the bad mark position coordinates.
4 Replace Searches for and replaces items registered in the block or local mark list.
+ : Enlarges the bad mark image.

5 Zoom - : Reduces the bad mark image.
Changes the bad mark image lighting. Select the lighting that results in the clearest
6 Change lighting
image from U, H, M, and L.
7 Library
You can select some bad marks registered in the library to set them in the mark data list.
8 Set Mark Registers the selected mark in the library.
Sets the threshold value used for mark recognition. By pressing this button, a "Bad mark
9 Thresh threshold value setting" screen appears, allowing the user to set the threshold value
when marks are detected and when not detected.
10 Insp img
11 0.1mm
12 Result display Displays the result of the bad mark recognition test.
13 Test Performs the bad mark recognition test.
1-6
1.4.4 "Height" screen (Option)
This screen appears if the optional laser height unit or the 3D projector is installed.
1
Set up the "Z Axis Correction" tab to use the laser height unit or the 3D projector to measure height from the
board so that you can correct the camera head height. The [Datum Height] tab is for setting up the height of
the datum height for the 3D inspection.
[Data Edit] - [Height] screen
basic operation
Example of [Datum Height] tab
1 2 Mark data list Measurement point list
3
4
5
6
Basic tab
Sampling tab
18
19
7 8 17 16 15 14 13 12 11 10 9 Parameter
24127-P7-10
1 Z Axis Correct Corrects the camera head height.
2 Datum Height Sets up the datum height for the 3D inspection.
3 Trace Move the camera to the X and Y coordinates selected by the measurement point list.
4 Teach Teaches the arbitrarily designated measurement point to set up the coordinates.
5 Auto Teach Searches the optimal measurement point and automatically sets up the coordinates.
6 Replace Searches for and replaces items registered in the measurement point list.
+ : Enlarges the view image.

7 Zoom - : Reduces the view image.
Buttons U, H, M and L changes the view image lighting.
8 Change display
Button Z *2 indicates the height of the view image by the gray scale.
9 Measure
Measures the distance by dragging on the parts image.
10 Detected Displays the area to be detected based on the set sampling conditions in red.
11 Insp img
12 Image List Allows you to select view images saved in the inspection program.
13 Detail Displays the height measurement results of the all view point coordinates.
14 All Test Measures the height of the all view point coordinates.
15 Test Measures the height of the designated point.
16 Detection status display Displays the state of detection.
17 0.1mm
18 Library
19 Set Mark Registers the created Z axis correction mark and datum height mark in the library.
*
This can be used if the machine is equipped with a 3D projector (option).
1-7
1.4.5 "View" screen
This screen allows you to register or edit the inspection view coordinates and save the view images.
1 [Data Edit] - [View] screen
View radar View list 12 13 14 15

basic operation
1
2
3
4
5
20
6 21
7 22
23
8 24
25
7
9
View image 10 11 16 17 18 19
24107-P7-20

*1
1 Add View Adds a view at the lower right of the selected view.
*1
2 Delete View Deletes the selected view.
*1
3 Copy View Copies the selected view.
Displays the selected view image. The view image can be changed even by selecting the
4 Trace *1
board image view.
5 Teach *1 Registers the coordinates displayed in the view list.
6 Step Disp Displays step frames on the selected view image.
7 Step Check Displays all steps on the entire board.

9 Change display
10 4D *3, View point *3 Displaces the slant camera images. Press the view point button to change the directions.
11 0.1mm
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
12 View Image OK Displays the lists of the board images saved in the program.
13 View Image PWB Displays the lists of the PWB images for the auto tuning saved in the program.
Displays the list of the parts images judged OK saved after the auto inspection.
To save the OK images, select [Machine Setting] -> [Installation Setting]. On this screen,
14 Parts Image OK
set "Image Auto SAVE" to "Execute". Then select [Machine Setting] -> [Inspection Mode
Setting]. On this screen, set "Image Auto SAVE" to "All Image".
Displays the list of parts images judged NG saved after the auto inspection.
To save the NG images, select [Machine Setting] -> [Installation Setting]. On this screen,
15 Parts Image NG
set "Image Auto SAVE" to "Execute". Then select [Machine Setting] -> [Inspection Mode
Setting]. On this screen, set "Image Auto SAVE" to "Ng Image" or "All Image".
Displays the images selected in the "View Image OK", "View Image PWB", "Parts Image
16 Display
OK" and "Parts Image NG" tabs.
Saves all the view images and mark images newly captured as the "View Image OK" or
17 Create *1 the "View Image PWB". After saving images, always press the [Save] button in the button
area to save the program.
1-8
Select images in the "View Image OK" or the "View Image PWB" list and press this
1
18 Update *1 button to overwrite them. After saving images, always press the [Save] button in the
button area to save the program.
19 Delete Deletes all images with the selected board ID.

*1
20 Auto Automatically creates views while taking the step frame positions and sizes into account.
21 Sort *1 Changes the view numbers so that the camera movement time becomes the shortest.
basic operation
Adds and assigns views to areas on the board to which no views have yet been
22 Fill Area
assigned.
23 Tile* Creates views on the entire board uniformly.
Opens the [Block Deployment] screen. You can use the pitch deployment and rotate
24 Block Dep
deployment to make copies of the view.
25 Regist Img Saves all the parts images.

*1
This cannot be used with offline software iPro (option).
*2
*3
This can be used if the machine is equipped with a 4D angular camera (option).
1-9
1.4.6 "Mount" screen
This screen allows you to set the mounting related data, such as mounting positions or part numbers of parts to
1
be mounted.
[Data Edit] - [Mount] screen

Mount information: The mount information of the board currently selected.
basic operation
1
2
3
4
5
6
7
8
9
10
11
12
View image 13 14 15 16 17 18 19 20 21
Parts information: The information of the mounted parts.
24108-P7-10
1 Add Adds the mount or parts information.

Cuts (deletes) the selected rows and copies them to the clipboard. The data
2 Cut rows below the deleted rows move up. The cut data is kept stored to the
clipboard until inserted or different data is cut or copied.
3 Copy Copies the selected rows to the clipboard.
Mount information
Inserts or overwrites the data that is copied into the Clipboard into/on the
4 Paste inspection program. Pressing this button will display the "Add Ref (Parts)" dialog
box, allowing you to select the addition method.
5 Delete Deletes the selected data rows. The data rows below the deleted rows move up.
6 Replace Searches for or replaces the mount information by setting conditions.
Cuts (deletes) the selected rows and copies them to the clipboard. The data
7 Cut rows below the deleted rows move up. The cut data is kept stored to the
clipboard until pasted or different data is cut or copied.
Parts information Select the row you want to paste the data and press this button. The data copied
9 Paste
to the clipboard is pasted.
11 Replace Searches for or replaces the parts information by setting conditions.
12 Make Parts Creates libraries by following a message of the dialog.
14 Change display Button Z indicates the height of the view image by the gray scale. (When the
machine is equipped with an optional 3D projector.)
Pressing this button changes the pitch for the camera to move when the arrow
15 0.1mm
buttons on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
Other 16 Data Check Checks if the inspection program has any conflict.
17 Lib Non Displays the parts without setting libraries in the parts information list.
18 Lib Set Sets the libraries you have selected to the parts on the "Mount" screen.
19 All Lib Reg Batch-registers the library used in the program.
Opens the [Block Deployment] screen. You can use the pitch deployment and
20 Block Dep
rotate deployment to make copies of the views.
21 Measure
Measures the distance by dragging on the view image.
1-10
1.4.7 "Parts" screen
This screen allows you to edit the data of the parts to be mounted on the board.
[Data Edit] - [Parts] screen

Parts information
Mount
1 2 information
Partial area
information 3 4 5
Inspection item
information
1
basic operation
6
7
8
9
10
11 12 13 14 15 16 17 19 20 18 24 23 22 21 Parameter
24109-P7-00
Item Function
Parts information Displays the parts information currently selected.
Displays the mount information of parts currently selected. Selecting a row will display
Mount information
the images of the reference number.
Partial area information Displays the partial area of the parts library currently selected.
Inspection item information Displays the inspection step of the library partial area selected in "Partial Information".
Parameter Displays the parameters of the step selected in "Inspection Information".
1 Pick Shape Selects the part shape and type from the list to setup.
2 Parts List Displays the list of information on parts mounted on the board.
3 Create Adds library partial area information.
Deletes the selected row (partial area information). The data rows below the deleted
4 Delete
rows move up.
Opens "Partial Shape Edit" dialog box.
5 Shape
You can edit the partial area information such as leads and pins of the parts.
6 Create Adds the inspection step.
Cuts (deletes) the selected rows and copies them to the clipboard. The data rows below
7 Cut the deleted rows move up. The cut data is kept stored to the clipboard until inserted or
different data is cut or copied.
Inserts or overwrites the data that is copied into the Clipboard into/on the inspection
9 Insert data. Pressing this button will display the "Add Step" dialog box, allowing you to select
the addition method.

11 Measure
Measures the distance by dragging on the parts image.
12 Step Changes to display or hide the step frame of the library image.
13 Detected Displays the detected area in red.
14 Insp Img
1-11
+ : Enlarges the parts image.
1
15 Zoom - : Reduces the parts image.
16 Change display
17 3D *1 Displays the 3D image of the parts.

Pressing the Top view point button indicates the top face image.
basic operation
18 Top view point *1, rotate *1

Pressing the rotate button rotates and stops the parts image.
19 4D *2
Displaces the slant camera images. Press the view point button to change the directions.
20 View point *2
21 3D detailed *1 Displays the 3D detailed information of the parts.
A list of images saved to the inspection program appears. Select the image to be
22 Image List
displayed from the image list.
23 0.1mm
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
24 Wide View Displays the wide view.
*1 This can be used if the machine is equipped with a 3D projector (option).

*2 This can be used if the machine is equipped with a 4D angular camera (option).
[Data Edit] – [Parts] screen
■ [Tuning] tab ■ [Utility] tab

1 2 3 4 7 8 9
5 6 10 11 12 13 14 15 16 17 18
24110-P7-20
Tab Button name Description
Tuning 1 Step Tests the selected step and displays the test results on the "Parts" screen.
2 Parts Performs a test of all steps for the selected part, and displays the results.
3 Same Parts Test the same parts as the selected parts and displays the results.
Sets conditions for steps subject to inspection, and performs a test. (See "Multi-
4 Multi
test" in Chapter 3 "2.4.5 Step Tuning", in this manual.)
5 Result display Displays the test results.
"Test Results screen" will be displayed by pressing this button after completing the
6 Detection
test.
7 Register Registers the steps for the selected part in the library.
8 Redeploy Deploys libraries to inspection data under the set conditions.
9 Set Pastes the selected library to parts on the image.
10 Auto Tuning Performs Auto ICP standards tuning.
11 Data Check Checks for inconsistencies in inspection data.
Searches the inspection program used for the specified library.

12 LIB Search
Deploys the library to the relevant program as well.
Utility Sets conditions, and replaces parameters for the relevant step at one time.
13 Replace
(See Chapter 3, "2.5 Replace", in this manual.)
14 Make Parts Creates libraries by following a message of the dialog.
15 Detail Displays details of the selected library.
16 Regist Img Saves the library images.
17 Lib Out Outputs the library in text format.
18 Grouping Makes the lead group of the partial area information.
1-12
1.4.8 "FOD" screen
This screen is for setting to inspect the foreign objects on the board. This function inspects the area other than
1
the parts in the field of view (inspection target area). It detects chip, solder ball, dust, etc. as foreign objects.
Regarding a slit, etc. that may cause a false detection in the burr, register it as FOD mask following the shape
(non-inspection area) and exclude it from the inspection area.
[Data Edit] - [FOD] screen
basic operation
View radar View Info. Mask Info. 1 Inspection Info.
2
3
4
5
6
11
12
13
View Image 14 15 16 17 7 8 9 10 18 19 20 21 22 23 24 Parameter

22128-P7-00
Parameter Button name Description
If selecting the view from the "View Info." and pressing this button, the camera
View Info. 1 Trace
moves to the selected view.
2 Create Adds the inspection step.
Cuts (deletes) the selected rows and copies them to the clipboard. The data rows
3 Cut below the deleted rows move up. The cut data is kept stored to the clipboard until
inserted or different data is cut or copied.
Inspection Info. 4 Copy Copies the selected rows to the clipboard.
Inserts or overwrites the data that is copied into the Clipboard into/on the
5 Insert inspection program. Pressing this button will display the "Add Step" dialog box,
allowing you to select the addition method.
Deletes the selected data rows (Inspection Info.). The data rows below the
6 Delete
deleted rows move up.
7 Edit Opens the "Sampling of Mask area" screen that creates or edits the mask.
When moved the view position manually, the view and the mask position will be
8 Assignment
connected by pressing this button.
Mask Info. Deletes the selected data rows (Mask Info.). The data rows below the deleted
9 Delete rows move up. The selected data can be also specified on the view image by
mouse drag.
In order to teach the new mask, press the button and drag the mask position with
10 Teach
the mouse on the view image screen.
Sets up the parameter of conditions recognizing and judging as the foreign
Parameter ーー
object.
11 Mask Displays the inspection mask listed on the "Mask Info." in blue-green.
Displays the coordinates and the luminance at the cursor position.

12 Measure
Measure the distance by dragging on the view image.
Other 13 Detected Displays the detected area in red.

1-13
Parameter Button name Description
Buttons U, H, M and L change the view image lighting.

15 Change display
1
16 3D *1 Displays the 3D image of the view.
17 0.1mm Not currently used.
A list of images saved to the inspection program appears. Select the image to be
18 Image List
displayed from the image list.
basic operation
Displays the inspection images that are based on the conditions set on the
19 Insp. Img
Other
20 Result display Displays the test results.
21 Test Performs a test of the selected steps.
"Test Results screen" will be displayed by pressing this button after completing
22 Detection
the test.
23 All Test Performs the foreign object detection tests of all views.
24 Detail Displays the foreign object detection test results of the all views.
*
1-14
1.4.9 "Code Scan" screen
The code scan function is used to read QR Codes, etc. on the board. The code scan includes the "Board code
1
scan" that reads per a board and the "Block code scan" that reads per a block. Refer to Chapter 2, "3.8 Code
Scan". This screen allows you to set and edit code scan conditions.
[Data Edit] - [Code Scan] screen
basic operation
1 Code list
2
3
4
5
6
7
8
12 11 10 Code data list 13 14

24111-P7-10
1 Board / Block * Selects the area to set the code scan from the board or block tab.
2 Trace Moves the camera to the mark list XY coordinates.
3 Teach Registers the center of the created inspection area as code scan position coordinates.
4 Find Not used.
5 Delete Not used.

6 Library
7 Set Mark Registers the selected code in the library.
+ : Enlarges the code scan image.

8 Zoom - : Reduces the code scan image.
Changes the code scan image lighting.
9 Change lighting
Select the lighting that results in the clearest code image from U, H, M, and L.
10 Insp Img
Selects the image saved in the inspection program to carry out the code recognition test.
11 Image List Pressing this button will display the "Image List" screen. Select an image and press the
[OK] button.
12 0.1mm
13 Result display Displays the code scan test results.
14 Test Performs the code scan test.
* Board / Block tab will be displayed by selecting [Machine Setting] -> [Server Setting] -> [SPC Text Out] and [SPC DataBase]
and setting them "Use".
1-15
1.5 Auto inspection screen
Press the [Auto] button to perform automatic board inspection.
1 This section describes the screen items and buttons that appear when the [Auto] button is pressed.
1.5.1 "Inspection" screen

This screen allows you to perform and stop automatic inspection. Inspection information is also displayed.
basic operation
[Auto] - [Inspection] screen

■ Actual machine 3 2 1 Information of inspection
5
6
8 9 10 11 12 13 14
■ Offline software “iPro” (option)
15 16
24112-P7-20
Item/button name Description
When selecting the optional software by going [Machine Setting] to [Server Setting],
1 Judgment Mode pressing this button displays the name of that optional software. If it not set up yet, it
displays [Independent judgment].
Selects and displays the inspection results displayed in the results details list. Select the
2 Display Type
display type from the drop-down list.
Displays inspection steps for the inspection results specified in "Display Type". (No steps
3 Result detail
are displayed if the no Ref. Nos. have been set for the steps.)
4 Sub Window Display Selects a sub window display from "Quality Graph" or "View Image".
5 OK Parts Count The number of parts for which an OK inspection result was obtained is displayed.
6 NG Parts Count The number of parts for which an NG inspection result was obtained is displayed.
7 FOD Count Displays the detected foreign object quantity.

After inspecting the board, pressing this button transfers the board to the board exit and
8 PCB Out Stop
stops.
9 Cycle Stop After completing the board inspection, pressing this button stops the inspection machine.
Pressing this button opens [Lot Information input screen].
Edits the production schedule quantity and production quantity. You can edit the
10 Lot Edit
lot number only when you select [Machine Setting] - [Server Setting] -> [Lot Unit
Management] and set "Use".
Changes the temporary inspection mode by pressing this button. (Refer to "2.3
11 Insp. Mode
Temporary changing of inspection mode" in this Chapter.)
12 Run Starts the inspection.
13 Stop Stops the inspection.
14 Buzzer off Stops the buzzer.

This button appears only when running the offline software iPro (option).
15 Image List The button selects the board images saved in the inspection program. Pressing the
button opens the [Image List] screen. Select an image and press the [OK] button.
Inspection result display
16 Displays the board inspection result.
field
1-16
1.5.2 "Whole" screen
This screen displays the inspection state in real-time, such as the number of boards that have been inspected.
1
When the inspection program is changed, information related to that inspection program will be cleared.
The displayed items can be changed by pressing the [Display Change] button on the right side of each item.
[Auto] – [Whole] screen
basic operation
[Display Change] button NG information
24113-P7-10
Item/button name Unit Description
Display Change Changes the displayed item.
Displays the number of inspected boards after the current inspection program is selected.
Inspection Count Sheet
Boards for which inspection is stopped before it is completed will not be counted.
Displays the total number of inspected boards after the inspection machine application
Total Count Sheet
software is started.
Inspection Block Count Block Displays the number of inspected blocks after the current inspection program is selected.
Inspection Parts Count Parts Displays the number of inspected parts after the current inspection program is selected.
Inspection Step Count Step Displays the number of inspected steps after the current inspection program is selected.
Displays the number of boards that inspection machine judged OK after the current
First-Pass Count Sheet
inspection program is selected.
Displays the number of blocks that inspection machine judged OK after the current
First-Pass Block Count Block
Displays the number of parts that inspection machine judged OK after the current
First-Pass Parts Count Parts
NG Board Count Sheet Displays the number of NG boards after the current inspection program is selected.
NG Block Count Block Displays the number of NG blocks after the current inspection program is selected.
NG Parts Count Parts Displays the number of NG parts after the current inspection program is selected.
Displays the total number of NG boards after the inspection machine application was
Total NG Board Count Sheet
started.
NG Count Step Displays the number of NG steps after the current inspection program is selected.
Displays the total number of NG steps after the inspection machine application was
Total NG Count Step
started.
%/Board Number of OK boards / number of inspected boards ×100 (%)
First-Pass Rate %/Block Number of OK blocks / number of inspected blocks ×100 (%)
%/Parts Number of OK parts / number of inspected parts ×100 (%)
%/Block Number of defective blocks / number of inspected blocks × 100 (%)
NG Rate %/Parts Number of NG for each Ref / number of inspected each Ref (number of parts) × 100 (%)
%/Step Number of defective steps / number of inspected steps × 100 (%)
1-17
Item/button name Unit Description
Total NG Rate %/Step Total number of defective steps / total number of inspected steps × 100 (%).
1
Over Judge Rate %/Step "OK continuation" count / number of inspected steps × 100 (%)
Average inspection time × number of inspected boards / (machine's cumulative inspection
Working Rate %/Lot
time – board wait time – board unloading wait time)
Average inspection time × number of inspected boards / machine's cumulative inspection
Operating Rate %/Lot
time
basic operation
Sec/Board Average inspection time per board.
Sec/Block Average inspection time per block.

Cycle Time
Sec/Parts Average inspection time per part.
Sec/Step Average inspection time per step.
1-18
1.5.3 "Output" screen
This screen displays the cycle time for inspected boards for each inspection.
[Auto] – [Output] screen

1
basic operation
24114-P7-10
Item/button name Units Description
This is the time from the start of board inspection until the end of board
Total Inspection Sec
inspection.
This is the time from the point the board is detected by the sensor at the
Carry-in Sec
conveyor entrance board until board clamping is complete.
This is the time from the point board unclamping is started until the board
Carry-out Sec
passes the sensor at the conveyor exit.
This is the length of time spent waiting for the judgment from the Repair
InspectionWaitTime Sec
Judgment Station or secondary judgment.
This is the time from the start of board fiducial recognition until the end of board
Fiducial Recognition Sec
fiducial recognition. This also includes recognition retry time.
This is the time from the start of bad mark recognition until the end of bad mark
Bad Mark Recognition Sec
recognition. This also includes recognition retry time.
This is the length of time spent for recognition of the height to correct the board
Height Correct Sec
height (warp shift).
Code Recognition Sec This is the length of time spent performing a code scan.
Optical Inspection Sec This is the board optical inspection time.
This is displayed when the machine is equipped with a laser unit (option).
Laser Inspection Sec
This is the length of time spent performing laser inspection.
This is displayed when the machine is equipped with a marking unit (option).
Marking Sec
This is the length of time spent performing marking.
1-19
1.5.4 "Bad Mark" screen
This screen allows you to display the bad mark recognition results for each inspection. Recognition results can
1
be checked by selecting the bad mark type from a drop-down list.
[Auto] - [Bad Mark] screen
Bad mark type Recognition results

basic operation
24115-P7-10
1.5.5 "Judge" screen

By enabling the "Second Judge" function in the machine settings, the (Judge) tab is added. This screen displays
board NG results the moment inspection is complete, or after board unloading. Select OK or NG for NG results
displayed in the NG judgment list. The next board is inspected while performing the OK/NG judgment, but the
inspection of the next board will not be complete until the judgment of all NG items is complete. For details,
see "2.2.1 Second judge" in this Chapter.
[Auto] – [Judge] screen
NG image
OK image
Entire image
Displays the inspection result NG step list

24116-P7-20
1-20
1.5.6 "Conveyor" screen
This screen displays the current board transfer status.
[Auto] – [Conveyor] screen

1
basic operation
24117-P7-10
Item Status
Upstream side Lights up green when outputting a board transfer permission signal to the
Busy Out
upstream machine.
Lights up green when inputting a board unloading request signal from the
BA In
upstream machine.
Downstream side Lights up green when inputting a board transfer permission signal from the
Busy In
downstream machine.
Lights up green when outputting a board unloading request signal to the
BA Out
downstream machine.
Conveyor Push Up Lights up green when the push up is up.
Entrance, wait*,
inspection, Lights up green when the board is present at each position.
halfway*, exit
Inspection result Result OK Lights up green when the board inspection result is "OK".
Result NG Lights up green when the board inspection result is "NG".
Other Stopper Lights up green when the board stopper is closed.
Clamp Lights up green when the board clamp is closed.
Wait stopper* Lights up green when the wait stopper is up.
Sub clamp* Lights up green when the sub clamp is closed.
* This appears only if the machine is equipped with the waiting sub stopper unit (option).
1-21
1.6 Unit (manual operation) screen
This section describes manual operation buttons on the "Unit" screen.
1 n NOTE
The "Unit (manual operation)" screen does not work with the optional iPro offline software.
1.6.1 "Conveyor" screen

basic operation
This screen allows you to operate the conveyor unit and so on.
[Unit] - [Conveyor] screen

Display area 2 1 4 5 6
11
3 12
13
14
15
16
7 8 9 10 17 18 19
24119-P7-10
+ : Enlarges the image.

1 Zoom - : Reduces the enlarged image.
2 Change lighting Changes the image lighting. (U, H, M, L)
Pressing the button each time changes the camera movement pitch when the scroll bar
3 0.1mm
arrow is pressed. (0.01 mm, 0.100 mm, 0.500 mm, 5.000 mm)
4 Table The image capturing position can be moved using the arrow buttons.
5 Conveyor Press the [W+] button or [W-] button to change the conveyor width.
Rotates the head of the laser height unit clockwise and counterclockwise.
6 Option Head *1
Pressing the [Luminance] button to measure the laser luminous energy.
7 Width Displays the conveyor width change screen.
8 Cycle Shot Displays the upper left display area for continuous capture.
9 Stopper Moves up or down the board stopper.
10 Clamp Opens or closes the board clamp.
11 Wait Stopper *2 Moves up or down the wait stopper.

*2
12 Sub clamp Opens or closes the sub clamp.
13 Setup Pos. Moves the camera to the setup position.
14 Origin Moves the head, conveyor, and laser* unit to their origin positions.
15 Low Left Rotates the conveyor belt to the left at low speed. Press the button once more to stop.
16 Low Right Rotates the conveyor belt to the right at low speed. Press the button once more to stop.
17 Push Up Raises and lowers the push up plate.

Rotates the conveyor belt to the left.
18 L.Conv.
Press the button once more to stop.
Rotates the conveyor belt to the right.
19 R.Conv.
Press the button once more to stop.
*1
This appears if the machine is equipped with the laser height unit (option).
*2
This appears only if the machine is equipped with the sub stopper unit (option).
1-22
1.6.2 "I/O" screen
This screen allows you to perform I/O signal status checks and turn outputs ON or OFF.
[Unit] – [I/O] screen

1
Output Input
basic operation
1 2
3 4
24120-P7-10
Output Displays the output signal status to each unit.
Input Displays the input signal status from each unit.
1 ON/OFF switch (individual) Turns the output signal for the location selected with the cursor ON or OFF.
2 ON/OFF switch (line) Turns the output signals for the line selected with the cursor ON or OFF.
3 Output signal description Displays the output signal name selected with the cursor, and the meaning of "0" and "1".
4 Input signal description Displays the input signal name selected with the cursor, and the meaning of "0" and "1".
TIP
Refer to Appendix, "2. I/O list" for I/O signal.
1-23
1.7 Histor y screen
The inspection machine operating history can be displayed. Error, operator, board, lot, and light check history
1
can be displayed.
TIP
History for each item is displayed in up to 1,000 lines in order of date, and is deleted starting with oldest line first.
Basic operation
basic operation
History screen
[Error] tab example
[Clear] button
24121-P7-20
Error
Displays errors that occurred at the machine or the task involved. Each error or task is displayed in a single line of data.
Operator
Displays the operator operation history. Each operation is displayed in a single line of data.
Board
Displays the inspection history. History for each board is displayed in a single line of data.
Program Log
Displays production results per lot, with one lot treated as the interval from the loading of a program (board data) until
switching over to the next program.
One data row is used to record one lot.
Light Check
The standard value is displayed in the first line, and the results when the lighting intensity check was performed are
displayed in the second line onward. Each lighting intensity check is displayed in a single line of data.
[Clear] button
Use this button to delete all log data currently displayed on the screen. Data cannot be deleted in rows.
When a confirmation dialog box appears, press the [Yes] button to delete the log data.
c CAUTION
Data cannot be recovered once deleted, so use caution.
1-24
2. Star ting and ending inspection
2.1 Starting automatic inspection 1
c CAUTION
Ensure to complete conveyor unit setup before starting automatic inspection.
basic operation
To set up the conveyor units, refer to "Daily operation" in the operator's manual for the inspection machine being used.
2.1.1 Selecting inspection programs
1 Press the [Setup] button.

The "Program Change" screen opens.
2 Load the program from the inspection program list.

1. Select [Production], [Initial Production] or [Tuning] tabs as needed.
2. To load an inspection program, either select a program from the list and press the [Select] button, or
double-click a program in the list directly.
Selecting inspection programs

Example of Production mode
[Setup] button Select the inspection program.
[Select] button
24122-P7-10
3 Verify the loaded inspection program.

The loaded inspection program name appears in the status area.
1-25
2.1.2 Starting automatic inspection
1
1 Check the inspection program.
Check the inspection program name displayed in the "Status" area of the screen.
2 Press the [Auto] button in the "Button" area.

The "Auto inspection" screen opens to enter automatic inspection mode.
basic operation
3 Press the [Run] button to start inspection.

To stop the automatic inspection, press the [Stop] button.
Automatic inspection flow
[Auto] button
[Run] button
Inspection
[Stop] button
[Buzzer off] button

OK NG
24123-P7-20
[Buzzer OFF] button

Pressing the buzzer OFF button while the buzzer is sounding stops the buzzer.
1-26
2.2 When NG detection occurs
1
2.2.1 Second judge
As the "second judge function" of the machine settings is set enabled, the "Judge" screen appears and the NG
image is displayed when the auto inspection completes the board inspection. Check the images that are
displayed and make the OK/NG judgment. When the image is judged as OK, press the [OK] button. Conversely,
when the images is judged as NG, press the [NG] button. This section describes the contents of the buttons that
basic operation
are displayed on the screen.
TIP
Select [Second judge setting] → [Judgment timing] of the machine settings. Then, you can set timing, at which the
results are displayed on the "Judge" screen.
NG Detection Screen
Optical inspection
OK image NG image 3 4 10
Entire image 1 Inspection result 25 6 7 8 9 11 12

is displayed.
24124-P7-10
1 OK Press this button when the displayed part is judged as OK.
2 NG Press this button when the displayed part is judged as NG.
3 Measure Measures the dimensions on the NG screen.
Displays the inspection image using the lighting that is selected based on the
4 Insp.Img
sampling conditions.
5 Detected Displays the area to be detected based on the set threshold value conditions in red.
6 Contour Displays the contour of the part recognized by the machine.
Displayed if the machine is equipped with a 3D projector (option).

7 3D
Displays the 3D image of NG part.
This appears if the machine is equipped with the 4D angular camera (option).
8 View Point
This displays the NG images photographed by the slant camera in four directions.
Setect [Data Edit] - [Parts] and press the [Option] tab on the lower right of the screen.
9 Light
The button setup on the [NG Image Out] of the [Option] tab screen will be selected.
Changes the NG reason of the NG step. Refer to Chapter 5, "2.3 Secondary
10 NG Reason
judgement settings" for further information.
11 All NG Judges all steps as NG that are judged as NG by the inspection machine.
12 NG steps list Displays the steps that are judged as NG during inspection.
1-27
2.3 Temporar y change of inspection mode
Inspection mode can be changed temporarily by the [Insp. Mode] button on the [Auto] - [Inspection] screen for
1 a temporary operation such as not outputting a test result to neither SPC nor the repair judgment station during
the auto inspection.
Temporary change of inspection mode

Example of changing from Production to Tuning
basic operation
[Insp. Mode] button [Reset] button

22129-P7-00
If performed the temporary change of inspection mode, the confirmation message will be displayed every time
when performing the auto inspection.
Confirmation message when starting the auto inspection
22130-P7-00
When canceling the temporary change, press the [Reset] button on the [Shifted to the temporary inspection
mode] screen or reload the inspection program on the [Setup] screen.
TIP
If performed the temporary change of inspection mode, it is recorded on the [MIS] - [Operators] screen.
1-28
2.4 Inspection complete screen
When board inspection is complete, the inspection result appears in the inspection result display field as "OK"
or "NG". When the "Whole" screen is displayed, inspected parts with "OK" result are indicated with blue dots,
and parts with "NG" result are indicated with red dots. By selecting the "Display Type", steps for the selected
inspection result conditions are displayed in the parts inspection results list. By selecting a parts in the parts
1
inspection results list, the position of the relevant parts is indicated with a cross.
basic operation
Inspection complete screen
Result display type
Inspection result display field Parts inspection results list

24125-P7-10
c CAUTION
Steps for which no Ref No. is set are not displayed in the list.
1-29
2.5 Ending automatic inspection
After board inspections are completed, use the following procedure to exit the automatic inspection.
1 1 Ensure that the inspection is completed.

Ensure that the status is "Waiting".
"Waiting" indicates that inspection is complete, and that the machine is waiting for the next board to be
loaded.
basic operation
2 Press the [Stop] button on the Auto Inspection Screen.

3 In the "Button" area, press the button for the next task.
To end inspection machine operation, press the [Off] button. The following dialog box appears when
the [Off] button is pressed. Follow the instructions on the screen.
Power off dialog box
24126-P7-10
e Pressing the emergency stop button exits the inspection machine application and Windows.
c CAUTION
Use the emergency stop button to stop the machine immediately in times of emergency, and when instructed to do
so in a dialog box. Do not use this button during normal operation.
4 Turn off the power switch of the inspection machine.

When it is okay to turn the power off, turn off the inspection machine main power.
c CAUTION
Be sure to follow the procedure above. Otherwise, ignoring the procedure and turning off the power switch in an
uncontrolled manner could cause the data to disappear or equipment to break.
1-30
Contents
1. Before creating inspection programs 2-1

1.1 Views and libraries 2-1
1.2 Algorithm 2-2
1.3 Selecting Inspection Type 2-4
2. Creating inspection programs 2-6

2.1 Flowchart for creating an inspection program 2-6
2.2 From data conversion to image saving 2-7
2.3 Creating full board images 2-10
2.4 Setting fiducial marks 2-11
2.5 Saving view images 2-16
3. Setting inspection programs 2-17

3.1 Board parameter 2-17
3.2 Fiducial parameters 2-20
3.2.1 Fiducial mark setting items 2-20
3.2.4 Managing mark libraries 2-26
3.3 Bad mark parameters 2-27
3.3.1 Bad mark function 2-27
3.3.2 Bad mark settings 2-28
3.4 Height parameters (option) 2-33
3.4.1 Z axis correction 2-33
3.4.2 Datum Height 2-36
3.5 View parameters 2-40
3.5.1 Adding view images 2-40
3.5.2 Creating all views and shortening inspection time 2-41
3.5.3 Manual view creation procedure 2-42
3.5.4 Multiple view operations 2-44
3.6 Mount parameters 2-59
3.6.1 Pasting libraries 2-61
3.6.2 Setting libraries 2-63
3.6.3 Pars adding procedure 2-64
3.7 Foreign object parameter 2-65
3.7.1 Creating the data of inspecting FOD on the board 2-65
3.7.2 Procedure of creating foreign object mask data 2-70
3.8 Code scan 2-76
4. Auto tuning of inspection program 2-78

4.1 Pad information tuning 2-78
4.1.1 General description 2-78
4.1.2 Saving PWB image 2-79
4.1.3 Setting parts information 2-80
4.1.4 Tuning procedure 2-82
1. Before creating inspection programs
This section describes aspects to be aware of before creating inspection programs.
1.1 Views and libraries

"Views" and "libraries" are the essential elements for creating inspection data, and are explained below.
n View
2
A "view" refers to a single field-of-view captured by the camera and is used as an inspection range. The camera moves to
the set position to perform inspection, and so view frames should be arranged on the board locations to be inspected so
that all parts are covered. If converting mount data (YGX) to inspection machine data, by selecting the "Auto Assign View"
check box in the "CVT" dialog box, views are created automatically based on the step positions. Furthermore, views can
also be created by pressing the [Auto] button in the "view" screen. For details on view creation, refer to section 3.5.3,
"Manual view creation procedure", in this chapter.
Creating inspection programs

TIP
The view size (field of view) may vary depending on the lens and it cannot be changed using the application settings.
While the standard view size is approximately X50.0 x Y37.5 mm (12μm), the view size of approximately X28.8 x Y21.7
mm (7μm) can be installed as an option.
View creation example
24200-P7-10
n Librar y
A "library" is an aggregate of steps that inspect the parts.
A "Step" is the minimum inspection unit to create in each view. The inside of the step frame is inspected according to the
Inspection Type and Algorithm.
An inspection program is created by deploying libraries at the parts mounting position.
2-1
1.2 Algorithm
This section describes the optical algorithm used by YSi Series inspection machines.
YSi Series inspection machines adopt a 3-stage dome lighting method. As the inspection digital color camera is
arranged at the center of the dome lighting, images without shades can be captured. The upper stage consists
of white LED (R·G·B) + infrared ray, and the middle stage and lower stage consist of white LED (R·G·B).
An optimal lighting that can judge the inspection object clearly can be selected from ten types.
In the inspection program, conditions to select a lighting that allows you to clearly see the inspection object
and display the object in red are set. The OK/NG judgment is made by comparing the area that is displayed in
red with the judgment conditions.
2 3-stage dome lighting
U: Upper lighting (IR), H: Upper lighting

M: Middle lighting
L: Lower lighting
23203-P7-00
n Sampling conditions: lighting selection

To display only the inspection object in red and inspect it, select a lighting that allows you to clearly see the inspection
object and set the threshold value.
On the [Data Edit] - [Parts] screen, open the sampling conditions of each step and select "Luminance", "Color" or "Shape".
The following describes the lighting selection when selecting "Luminance".
1. Click the image list buttons to the right of the sampling light and reduced light values fields to display a list of sam-
pling light images.
2. Select a lighting that offers good contrast between the area being inspected and the surrounding area (lighting with
which difference in brightness is clearly visible) from the list of sampling light images, and then press the [OK] button.
3 Adjust the threshold value slide bar to set the threshold value, at which the inspection area is displayed in red.
("Auto threshold value" can be used for "Character" detection.)
4 When you want to set multiple sampling conditions, press the multiple sampling conditions button, change the setting
from "No Use" to "Use", and set new sampling conditions.
Image list
Sampling light example
[Sampling] tab
[Multiple sampling conditions] buttons

Sampling light type
[Light Detail] button

[Image list] button
Threshold slide bar
Sampling light type image list
24201-P7-10
2-2
n "Detect" conditions
Set up the detection conditions for the inspection objects indicated in red.
n "Judge" conditions
Set up the OK or NG judgment criteria for the inspection objects detected under the detection conditions. The parameters
to be set may vary depending on the Inspection Type and Algorithm. For details about Algorithm, see Chapter 4, "Setting
Inspection Type".
Example
[Inspection Type: Missing Component] - [Algorithm: Body] → Makes the judgment using the area ratio.
[Inspection Type: Component Shifting] - [Algorithm: Body] → Makes the judgment using the area ratio or deviation
2
amount.
[Inspection Type: Bridging] - [Algorithm: Foreign Object] → Makes the judgment using the foreign object size or exclu-
sion size.
“Judge” conditions

Inspection Type Algorithm
[Judge] tab
24240-P7-10
2-3
1.3 Selecting Inspection Type
To inspect parts using YSi Series (V3) inspection machines, select the Inspection Type (NG item to be inspected)
and the Algorithm (judgment method) according to the inspection area. For details about how to set Inspection
Type, see Chapter 4, "Setting Inspection Type".
Inspection area Inspection Type Algortithm Sampling example
Body Neighbor bridge Solder ■ Solder
Missing
2
Body
Component
Component
Termination
Shifting
Body
Tilted Component Body

■ Body
Misplaced
Character
Component
Pattern
Upside Down Luminance
Reversed Polarity Shape
Character
Compare Luminance
Pattern ■ Termination
2
Compare Height*
Datum Height Point Laser Measurement* 1
3D Height* 2
Body Lifting Laser Measurement* 1
Body
■ Character
3D Height* 2
Compare Height* 2
Chip Tombstoning Solder
Body
Laser Measurement* 1
3D Height* 2
Compare Height* 2
■ Compare Luminance
Position Correction
Lead group Body
Side
Position Correction
Lead
Shoulder
Bridging Solder
Foreign Object
4D Foreign Object* 3
Lead Shift Luminance
Lead Overhang Lead
Position Correction
Lead
Tip
Exposed Copper Solder
Excess Bond Solder
No Solder Solder
2-4
Inspection area Inspection Type Algortithm Sampling example
Lead group Insufficient Solder Solder ■ Lead
4D Solder* 3
Solder Fillet 3D solder* 2
Black Material Solder
Insufficient Wetting Luminance
Solder
Long Lead
Chip Tombstoning
Lead
Shape
Solder
2
Body

3D Height* 2
Compare Height* 2
Lifted Lead Solder
3D Height* 2
Compare Height* 2
Datum Height Point Laser Measurement* 1
3D Height* 2
THD Pin Hole Foreign Object
Short Lead Solder
Non-lead Solder
Excess Bond Solder
Exposed Copper Solder
Bridging Solder
Foreign Object
4D Foreign Object* 3
Insufficient Solder Solder
4D Solder* 3
Neighbor of parts Solder Beadig Foreign Object
Bond Solder
All existing inspection

Others Compatible
items
* 1 This function is only available for the inspection machine equipped with the laser height unit (option).
* 2 This function is only available for the inspection machine equipped with the 3D projector unit (option) and for the offline software iPro
(option).
* 3 This function is only available for the inspection machine equipped with the 4D angular camera (option).
2-5
2. Creating inspection programs
This section describes how to create inspection programs for inspection machines from mounter mount data.
2.1 Flowchart for creating an inspection program

To utilize the mount data of YAMAHA mounter, press the [Convert] button at the "Setup" screen to convert
mount data to an inspection program. Inspection programs are created by pasting parts libraries to mounting
positions. Mount data for third party mounters is converted to inspection programs after first converting it to
2
YAMAHA mounter data format.
Flowchart for creating an inspection program
■ Conversion from third party mounter data

Font file creation "Common Factory Tools Function" manual
Conversion to YAMAHA mounter data
■ Conversion from YAMAHA mounter data
Convert to inspection program
Auto Manual
* Necessary to register
fiducial marks.
Create full board image Create full board image
See Chapter 2,
"2.3 Creating a full board image".
Set fiducial marks Set fiducial marks
See Chapter 2,
"2.4. Setting fiducial marks".
Save view images Save view images
 See Chapter 2,
"2.5 Save view images".
 See Chapter 2,
"2.2 From data conversion to image saving".
Data tuning See Chapter 4,

"1. Setting inspection items".
Save inspection program
Inspection program complete
23217-P7-10
2-6
2.2 From data conversion to image saving
The mount data (YGX) of YAMAHA mounter is converted into inspection programs using a data conversion
function.
This section describes the procedure up to automatically saving images. See the next Section 2.3 "Creating full
board images" for the procedure to save images manually.
n NOTE
Before performing this operation, it is necessary to refer to Chapter 5, "2.7 Data conversion settings", and set the
required items at the "Data Conversion Setting" screen in the machine settings.
1 Open the "Setup" screen and press the [Convert] button.

A "CVT" screen appears.
2
[Setup] screen

Data conversion
[Convert] button [Convert] button

24205-P7-10
2 Set the conversion conditions.

Select both check boxes to enable the conversion conditions.
LIB Redeploy
By selecting this check box, libraries corresponding to the names of parts to be converted are deployed
to mounting positions based on the library table. If the selection is cleared, or parts name have not
been registered in the library table, steps are created for parts mounting positions without performing
library redeployment.
Auto Assign View

By selecting this check box, views are created and assigned based on steps.
If the selection is cleared, views are not assigned.
2-7
3 Select the file to be converted and press the [Convert] button.
1. A multi-board panel block No. setting confirmation dialog box appears. Press [Yes] or [No] button.
Multi-board panel block No. setting confirmation dialog box
2
24206-P7-00
Yes
Uses reference data. Select to convert data for blocks for which block deployment is complete.
No
Uses offset information. Select to convert data for boards with only one block, or for boards for which
no blocks have been deployed.
2. Where checking "Auto Assign View" in Step 2, the dialog to check the view assignment pops up.
Press [Yes] or [No] button.
View assignment confirmation dialog
24262-P7-00
3. A conversion complete dialog box appears when conversion is completed. Press the [OK] button.
The name of the converted program appears in the status area and the converted inspection
program is added to the program list on the "Tuning" tab.
Complete the conversion

Changed inspection program name “Tuning” tab
Changed inspection program
24263-P7-10
2-8
TIP
The inspection program created by the [Create] button on the "Setup" screen is also added to the program list on the
"Tuning" tab.
4 Capture the board images

1. The capturing of full board image confirmation dialog box appears. Press the [Yes] button.
Capturing of full board image confirmation dialog box

24245-P7-00
2. A conveyor change dialog box appears. Press the [Yes] button to change the conveyor width.
3. When completing changing the conveyor, the dialog show below appears. Set the board as prompt-
ed. Then, press the [Yes] button.
When the board is loaded and clamped, the camera starts capturing the full board image.
Board set confirmation dialog box
24264-P7-00
5 Saving the inspection program

When completing capturing the full board image, capture fiducial marks and view images.
When completing capturing the standard image of the view image, press the [Save] button in the
button area.
2-9
2.3 Creating full board images
If creating a new inspection program, it is necessary to create and save a full board image. Saved full board im-
ages are used only as images for displaying the entire board, and are not used for inspection. This section
describes how to create full board images manually for inspection programs converted from YAMAHA mounter
mount data.
1 Open the [Board] screen.

Press the [Data Edit] button and open the "Board" tab.
2
2 Press the [Width] button to change the conveyor width.
A conveyor width change dialog box appears. Ensure that the conveyor width after changing is the
same as "Board Size Y (mm)", and then press the [OK] button.
n NOTE
If the board size has not been entered in "Board Size X, Y (mm)", enter the correct board size.
Conveyor width change
"Board size Y" parameter
4
24208-P7-10
TIP
If using push up pins set in positions where they will not interfere with the conveyor rails or other parts when the push
up plate is raised.
3 Press the [Change] button.

A confirmation dialog box appears. Place a board at the entrance and press [Yes].
The board is then loaded and clamped at the inspection position.
4 Press the [Execute] button.

The camera head moves at the specified pitch, an image of the board is captured, and a full board
image is created. Press the [Stop] button to cancel image capture.
2-10
2.4 Setting fiducial marks
When inspecting a board, it is necessary to recognize the marks on the board and correct the board outer
shape or play due to the board clamp mechanism, and distortions on the board so that the board is always
inspected at its correct position. There are three types of fiducial marks – “board fiducial”, “block fiducial” and
“local fiducial”. You can use one or more of them as necessary.
This section describes the setup procedure using the 2-point board fiducial.
The board has two fiducial marks that are registered to correct the position of the entire board. One fiducial
mark is Mark 1 at the bottom left (or top left) of the board. The other is Mark 2 at the top right (or bottom right)
of the board. (You can register up to 3 marks.)
After registering the board fiducial marks, register the block fiducial mark or local fiducial mark, if necessary.
2
Example of board fiducial mark

Mark 2
Board
Mark 1 Mark 3
(Register if necessary)
23213-P7-00
1 Open the fiducial mark setting screen.

Press the [Data Edit] button and open the "Fiducial" tab.
[Fiducial] tab screen
Mark list
[Trace] button
[Teach] button
Basic parameters
Sampling parameters
[Measure] button
Parameter list
[Test] button
[Same Mark] button
[Save] button Image zoom Mark data list Recognition results [Detail] button
24210-P7-20
2-11
2 Set fiducial marks
1. Open the "Board" tab and set "Execute".
2. Enter the mark numbers in the Mark 1 and Mark 2 in the mark list. Enter “1” in this example.
Fiducial mark settings

Select a Board tab. Enter the mark number.
Set to "Execute".
2 "Board" tab (board fiducials)

24212-P7-10
Performs positional correction in board units.
"Block" tab (block fiducials)

Performs positional correction in units of individual boards within multi-board panels.
"Local" tab (local fiducials)

Performs positional correction of arbitrary steps such as for each parts and so on.
3 Move the camera to the fiducial mark position.

Select the first mark from the mark list and press the [Trace] button.
The camera then moves to the fiducial mark position.
4 Set the mark data list.

On the row that has the same numbers as the mark numbers you have just set in Mark 1 and Mark 2, set
the “mark name” and “mark type”. Set it to No.1 in this example.
Mark data list settings
Select a "Fiducial".
24214-P7-10
Mark Name
Enter an easily distinguishable name up to nineteen single-byte alphanumeric characters for each mark.
Spaces cannot be entered.
Mark Type
Select "Fiducial" from the drop-down list.
5 Set the sampling light.

Select the “Sampling” tab and press the [Image List] in the [Sampling Light] button. Select an image
that you can see the fiducial mark clearly and press the [OK] button. Select [MR] in this example.
For details, see "Section 3.2.3 Sampling Conditions Parameters" in this Chapter.
Setting the sampling light
[Image list] button

24243-P7-10
2-12
6 Set the threshold values.
1. Press the [Detected] button. Press the [+] button to enlarge the fiducial mark.
2. Use the threshold slide bar to adjust the threshold value so that only the mark is displayed in red.
Setting the threshold value
[+] button

[Detected] button Threshold slide bar
24244-P7-10
7 Press the [Measure] button in the [Base] tab.

Press the [Yes] button at the auto measurement confirmation message that appears.
8 Enclose the mark by dragging the mouse.

Enclose the mark by dragging the mouse inside the mark detection range.
The mark is recognized, and the parameters are set for each recognition type based on the recognition
results, and a test is carried out.
"Mark Size X, Y" enters in this example.
Fiducial mark
Enclose by dragging the mouse. [Measure] button
Set parameter
Detection data Test result

24216-P7-10
9 Check the test results.

If the test result is NG, repeat the procedure from Step 5.
TIP
When the mark is recognized correctly, the recognition center coordinates are displayed at the upper left portion of
the mark screen. After the test has been complete, press the [Teach] button to enter the recognition center coordi-
nates as fiducial mark. When the design coordinates are entered, do not press the [Teach] button.
0 Test the second fiducial mark.

In the same manner as the first fiducial mark, move the camera and perform a test.
Check that the detection result is OK.
2-13
■ Same mark successive test function
The recognition test can take place successively on all the fiducial marks that use the same mark information.
This section describes the procedure.
1 Select the mark information to be tested from the mark data list.
Same mark test
Example of block fiducial mark
2 Mark list
Select mark information. [Same Mark] button

24265-P7-00
2 Press the [Same Mark] button.

The program searches the marks that use the selected mark from the “Board”, “Block” and “Local” mark
lists to carry out the recognition test.

When all the recognition tests is complete, a list of test results appears so that you can check the test
results on each fiducial mark. The fiducial mark with NG results appears in red.
Same mark test results example

Multi-test Result Auto Result Results list NG fiducial mark
24266-P7-00
Multi-test Result
The same mark test results appear.
Auto Result
The recognition results of the fiducial mark of the last board that is auto inspected appear.
2-14
Results list
The positional information, judgment result, NG reason, sampling condition number and detection
data appear on the screen.
4 If judged as NG, perform tuning the parameters.

1. Correct each parameter in the mark information based on the test results.
2. Perform a recognition test again.
5 Repeat the process in Step 4.

Repeat the process in Step 4 until all the marks using the same mark information pass the recognition
2
test.
2-15
2.5 Saving view images
Capture all view images for the board set on the inspection machine, and save as standard image.
TIP
The offline software program iPro (option) is unable to capture view images. However, you can perform data tuning
using the saved images.
1 Open the [View] screen.

Press the [Data Edit] button and open the "View" tab.
2 2 Save the view image.

Select the "View Image OK" tab on the Images and press the [Create] button. The view registered first is
saved as the standard image.
TIP
Regarding the PWB for auto tuning, press the [Create] button after selecting the "View Image PWB" tab on the
Images. Refer to "4. Auto tuning of inspection program", in this chapter for auto tuning.
[Data Edit] - [View] screen

Saving the Standard Image
[View Image OK] tab [View Image PWB] tab
[Save] button
[Change] button View image Standard Image [Create] button
24227-P7-20
3 Save the inspection programs.

Press the [Save] button in the button area. A save confirmation dialog box appears. Press the [OK]
button.
4 Take out the board.

Press the [Change] button in the button area. A board change confirmation dialog box appears.
Follow the instructions that appear on the screen to take out the board.
2-16
3. Setting inspection programs
After creating the inspection programs, it needs detailed setting.
3.1 Board parameter

This screen enables to create full board images and check or set up the board parameters.
This section describes the board parameters.
[Board] screen
Board parameter
2

24247-P7-20
Board parameter
24209-P7-20
2-17
Item Description
1 Basic Info. Enter the board X direction size.

Board Size X (mm)
This is the board flow direction size.
Enter the board Y direction size.
Board Size Y (mm) This is the conveyor width direction size when the board is placed on
the conveyor.
Board Size Height (mm) Enter the board thickness. You can leave this field blank.
Enter a comment on the board in this field.

Comment
Alphanumeric characters can be used. You can leave this field blank.
2
Enter a comment on the board type in this field.
Board Type
Enter a comment on the solder in this field.
Solder Type
Enter the ASSY name to be set for the board ID.
Assy Name
When [Machine Setting] - [Server Setting] → [Lot Unit Management] is

selected and "Use" is set, the ASSY name needs to be entered.
A/B Side Select the panel surface from side A and side B.
Board Origin Offset X (mm) Enter the board origin X direction offset amount.
Board Origin Offset Y (mm) Enter the board origin Y direction offset amount.
Enter the maximum parts height.

Max Parts Height (mm)
(Be sure to enter this parameter when using the Z axis correction.)
2 Product Select the inspection mode from "Production", "Initial Production" or

Information "Tuning". After changing the inspection mode and saving it, the status
area display is changed and the inspection program is changed to the
selected tab.
• Production : Mode for normal production. All histories,etc. can be

Inspection Mode set to output.
• Initial Production: Mode for the auto inspection result confirmation
before the production. The output setting should be
different from that of Production.
• Tuning : Mode for tuning the data when creating a program.
Normally, the inspection results or the history is not
output.
Total Count The total inspection board quantity after being initialized is displayed.
The number of NG boards after selecting the inspection program is

NG Board Count
displayed.
The number of NG blocks after selecting the inspection program is
NG Block Count
displayed.
3 Product Enter the scheduled inspection quantity.

Condition Scheduled Inspection If "0" is entered, inspection is continued as long as boards are loaded.
guantity If a value other than "0" is entered, operation stops when inspection of
the entered board quantity is complete. The next board is not loaded.
The inspected board quantity after selecting the inspection program is
Inspected guantity
displayed. The default value is "0".
When the NG inspection quantity for each board reaches the value
Inspection NG Abort entered here, "Incomplete" is displayed for the inspection result, and
Count auto inspection is stopped. The board moves to the stop setting position
specified in "Conveyor setting" in the machine settings.
4 Inspect Auto Lib Deploy at Data If "Use" is selected, libraries are automatically deployed when the
Condition Load inspection program is loaded.
When selecting "Use", the inspection of the same parts is skipped and
Skip Inspection of No
the next parts are inspected if the inspection of the inspection item
Parts
"Missing Component" is judged NG.
For the parts subject to the “Character Detection” inspection, enter the
number of boards between the inspection intervals.
• Inspect only first parts
After loading the inspection program, the only the first part is inspected.
Inspect Only First Parts
• Inspect for each specified qty
The inspection takes place on every designated numbers of parts.
Set in the [Option] tab of each step whether or not to inspect that
particular part.
Number of Cycle This is valid if "Inspect Only First Parts" is set for "Cycle Inspection".
Inspection Enter the cycle quantity for boards to be inspected.
2-18
Item Description
5 Operating Use Push Up Unit Where using the push-up pin, select either "Normal Use or "Fast Use".
Condition
This becomes effective when selecting "Use Push-up" and "Fast Use".
Push Up Rise Timer (sec) Set the duration of time from recognizing the board and until raising the
push-up plate.
This becomes effective when selecting "Use Push-up" and "Fast Use".
Carry Out Waiting Timer
Set the duration of time from lowering the push-up plate until releasing
(sec)
the board clamp and the conveyor belt to start rotating.
Pass Mode Boards are transferred without performing inspection.
2
Sets the length of time that the conveyor belt is rotated after the board
Conveyor Timer (sec)
unloading sensor confirms that the board has been unloaded.
6 Capture 3D Measurement Mode* Select the 3D measurement mode from either "Normal" or "Fast".
Condition
7 Image This parameter is displayed when selecting [Machine Setting] -

Collection [Installation Setting] - [Image Setting] - [Auto Deletion of Parts Image

Collection] and setting to "Delete Past Image".
Auto Deletion of Parts
If the Auto Deletion of Parts Image Collection is set to use and parts
Image Collection
image collections which spacific days are expired exist when loading
the inspection program, the confirmation message will be displayed. The
parts image collections are deleted by pressing the [Yes] button.
* This appears if the machine is equipped with the 3D projector (option).
2-19
3.2 Fiducial parameters
To use the fiducial functions for positional correction of the entire or part of a board, you need to set up the
fiducial marks and fiducial parameters.
3.2.1 Fiducial mark setting items

This section describes each item for setting the fiducial marks.
Fiducial mark settings
2 Set to "Execute". Select a tab.

Board image
View image
24248-P7-20
"Board" tab (board fiducials)

Performs positional correction in board units.
"Block" tab (block fiducials)

Performs positional correction in units of individual boards within multi-board panels.
"Local" tab (local fiducials)

Performs positional correction of arbitrary steps such as for each parts and so on.
Mark list settings

XY coordinates, mark Nos.
Correction method [Trace] button
[Teach] button
24213-P7-10
Correction method
Select from the drop-down list.
Do not correct:
Fiducial positional correction is not performed.
1 Point:
Performs positional correction with one fiducial mark point. Board X and Y direction displacements
are corrected.
2 Points:
Performs positional correction with two fiducial mark points. Board X and Y direction displacements
and tilt are corrected.
3 Points:
Performs positional correction with three fiducial mark points. Board X and Y direction displacements
and tilt are corrected. Used for boards of material (paper phenol, paper) easily subject to expansion
and contraction or warp such as large boards or flexible boards.
2-20
X, Y
Enter the fiducial mark coordinates. If "2 Points" is selected for the correction method, enter coordinates
for X1, Y1, X2, and Y2. If "3 Points" is selected for the correction method, enter coordinates for X1, Y1, X2,
Y2, X3, and Y3.
• If coordinates have already been entered in such cases as with programs converted from mount
data, use the coordinates as they are. (Recommended)
• If fiducial mark coordinates are unknown, coordinates can be entered by teaching. Click the
fiducial mark on the board image and click the center of the mark in the view image. After setting
the mark parameter, press the [Teach] button when the test result is "OK".
The recognized center coordinates are entered.
Mark
Enter the mark No. This number corresponds to the number in the mark data list.
If "2 Points" is selected for the correction method, enter a number for Mark 1 and Mark 2.
2
If "3 Points" is selected, enter a number for Mark 1, Mark 2, and Mark 3.

n NOTE
• If setting block fiducials, set the fiducial mark in the line for each block No.
• If setting local fiducials, set the respective local fiducial marks.
Set the mark list number for the "Local Fid. No." of "Mount Info." on the "Mount" screen of relevant parts.
TIP
If fiducial marks are unclear, use the U, H, M, or L lighting buttons to change the lighting so that the mark becomes
clearer.
Select "Fiducial"
24267-P7-00
No.
Set the parameter on the row that has the same mark number entered in Marks 1, 2 and 3 in the mark
list.
Mark Name
Mark Type
Select "Fiducial" from the drop-down list.
2-21
3.2.2 Basic parameters
After setting the fiducial marks, you need to set up parameters to recognize those fiducial marks. This section
describes the basic parameters.
Basic parameters
2
[Template] button
24211-P7-10
Algorithm Type
The algorithm type is selected from the following three types. "Form" should normally be selected.
If "Pattern Matching" is set, press the [Template] button, open the [Register Template] screen, and register marks in a
template.
• Pattern Matching
Recognizes the mark based on how closely it matches the image template.
• Form
Recognizes the mark based on the “Mark Size X, Y”, “Circularity”, “Perimeter” and “Std. Area” parameters.
• Edge
Recognizes the mark based on the “Mark Size”, “Perimeter” and “Std. Area” parameters.
Search Area X, Y (mm)
Sets the size of the area in which to search for the mark. Set the mark outline +3.00 mm as a guideline. For example, if
the mark outline is 1 mm as shown below, enter 4 mm. However, if there is a possibility that patterns (resist, silk, etc.)
other than marks may also be detected, narrow the mark detection range value so that only the mark is detected.
Mark search range example
Mark detection range

Mark
1
4 Board
23214-P7-00
Brightness Gain
Adjust this value to brighten the entire image so that the mark is easily recognized.
Brightness Offset
Adjust this value to make the entire image darker so that the mark is enhanced.
2-22
M. Shape Type
A selection can be made from the following three shapes. Select from the drop-down list based on the mark being used.
Shape type Description Example
Circle Select if the mark shape is round.
Square/Rectangle Select if the mark shape is square or rectangular.
Select if the mark is made up from a single object, and the mark shape is other
Special
than a circle, square, rectangle, or equilateral triangle.
2
Mark Size (mm)
Enter the mark outline dimensions. The dimensions can be entered automatically if unknown. Press the [Measure] button
and enclose the mark by dragging the mouse. The recognized outline dimensions are set and a test is performed.
Circularity
Where setting “Circle” in the “Shape Type”, enter the mark circularity.

If the circularity is unknown, you can enter one automatically.
Press the [Measure] button and enclose the mark by dragging the mouse. The recognized circularity is set and the a is
performed.
Perimeter (mm)
Where setting the “Special” in the “Shape Type”, enter the mark perimeter.
If the perimeter is unknown, you can enter one automatically.
Press the [Measure] button and enclose the mark by dragging the mouse. The recognized perimeter is set and the test is
performed.
Standard area (mm 2)
Where setting the “Special” in the “Shape Type”, enter the mark standard area (“Std. Area”).
If the standard area is unknown, you can enter one automatically.
Press the [Measure] button and enclose the mark by dragging the mouse. The recognized standard area is set and the test
is performed.
Tolerance (%)
Set the tolerance (%) of differences between set value and recognized value.
Reference value: 20%
2-23
3.2.3 Sampling conditions parameter
You need to set up the sampling conditions parameters to recognize the marks.
By using “Luminance” as an example, this section describes how to set sampling conditions parameters so as
to recognize the marks.
1 Open the "Sampling" tab and select "Luminance" in the "Light Sampling Type"
area.
Sampling conditions
2
Luminance
[Detail] button
Setting value list
24217-P7-10
2 Press the [Detail] button.

A "Luminance" screen appears.
3 Press the [Sampling Light] button and select the sampling light.
By pressing the [Sampling light] button, a light sampling type screen appears.
1. Select the image in which the fiducial mark appears clearest from the sampling light list.
(Up to two images can be selected.)
2. Press the [OK] button to confirm the data entry.
The display returns to the "Luminance" screen, and the image is displayed with the selected sampling
light.
"Luminance" setup screen

Selecting the sampling light
[Sampling Light] button Noise cut filter
Insp Img
24218-P7-10
4 Press the [Reduced Light] button to select the reduced light.

By pressing the [Reduced Light] button, a light sampling type screen appears. If required, select a single
image to be excluded from the reduced light list. (There is no need to make a selection.)
5 Select a noise cut filter.

This is used to eliminate noise. When noise is present, select the size to be averaged from the drop-down
list.
2-24
6 Press the [Detected] button and set the threshold value.
1. When pressing the [Detected] button, the detection area is displayed in red.
Adjust with the threshold slide bar to set the threshold so that only the marks appears red.
Threshold value setting
Threshold slide bar
Sampling area check screen
Set by dragging the mouse.

2

[Detected] button
24219-P7-10
2. If reduced light is selected at Step 4, set the reduced light magnification. Set the magnification for
the reduced light selected when performing image processing to show only the mark in red. Press
the magnification button and enter the magnification, or drag the gray area on the monitor with the
mouse to set.
Reduced light magnification setting
Reduced light magnification setting button
Set by dragging the mouse.

Sampling area check screen
Reduced light image
24220-P7-10
7 End the sampling conditions setting.

To save the settings, press the [Set] button. To exit the operation without saving the settings, press the
[Close] button.
8 Perform a test.
Press the [Test] button to see that the center of the fiducial mark is detected in a stable manner.
TIP
When the testing recognizes the fiducial marks, the coordinate of the recognized center appears in the upper left of
the fiducial mark screen.
9 Save the inspection program.

Press the [Save] button in the button area to save the inspection program.
2-25
3.2.4 Managing mark libraries
You can register mark settings you have created into libraries or set mark libraries you have registered.
■ Registering mark libraries
1 Select a mark.
Select a mark you want to register from the mark data list.
Registering the library
2 [Library] button
[Set Mark] button

Mark data list
24241-P7-10
2 Press the [Set Mark] button.

A registration confirmation dialog box appears. Press the [Yes] button.
The mark information is then registered into mark library.
■ Setting the mark librar y
1 Select a place where the mark library is set.

Select a row where the mark library is set from the mark data list.
2 Press the [Library] button.

When pressing the [Library] button, the "Marks Library" screen will appear.
Setting the library
[All Set] button [Set] button

24242-P7-10
3 Select a mark and press the [Set] button.

A set confirmation dialog box appears. Press the [Yes] button.
TIP
To set all mark libraries that meet the mark names, press the [All Set] button. All the marks that have the same name in
the mark data list are then overwritten into the mark information in the mark library.
2-26
3.3 Bad mark parameters
3.3.1 Bad mark function

The bad mark function involves affixing a mark (bad mark) to a set location on the board in order to cancel
parts inspection when the mark is recognized by the inspection machine.
Bad mark function
2
Parts are inspected when no bad mark is detected.

X
Parts are not inspected when a bad mark is detected.
23215-P7-00
The following three types of bad mark are available. Use these bad marks accordingly depending on the
purpose.
■ Board bad mark

A bad mark is assigned to each board, and is used to judge whether the inspection machine searches for a bad mark. If,
for example, there is a mix of multi-board panels, some with defective blocks and some without, being transferred on the
conveyor, it will be a waste of time to search for bad marks on all boards even when there are no defective blocks. By
using the board bad mark function, a search is only performed for bad marks if a board bad mark is recognized. When
not recognized, an unconditional parts inspection is performed for all blocks.
■ Block bad marks

Bad marks are set for each block, and block inspection is skipped if the machine detects a bad mark. If, for example, no
parts have been mounted on block B (defective block) on a multi-board panel comprising blocks A, B, C, and D, a bad
mark is affixed to the board for block B. The inspection machine searches for bad marks on all blocks prior to inspection,
inspection of block B on which the bad mark was recognized is canceled, and parts inspection is performed only for
blocks A, C, and D.
TIP
If block bad marks exist in the inspection view field-of view, by performing mark recognition in the same view as step
inspection without performing axis movement only for bad mark recognition during auto inspection, inspection tact
time is reduced. When editing data, the camera moves to all bad mark positions to perform recognition.
■ Local bad marks

Bad marks are set for each part. If the inspection machine detects the bad mark, the inspection of this part is skipped.
2-27
3.3.2 Bad mark settings
This section describes the bad mark screen as well as each item that sets up the bad mark information.
■ Bad mark screen

By pressing the [Data Edit] button and opening the "Bad Mark" tab, the following bad mark setting screen appears.
[Bad Mark] tab screen
2 Mark list
Basic
parameter
Sampling
parameter
[Save] button View image Board image Mark data list Recognition results [Test] button
24221-P7-10
■ Setting items
Bad mark settings
Select a tab.
Set to "Execute".
24222-P7-10
"Board" tab (board bad mark)

Set when using the block bad mark or local bad mark function.
"Block" tab (block bad mark)

Skips inspection of each block.
"Local" tab (local bad mark)

Skips inspection of arbitrary steps.
Mark list settings
XY coordinates Mark 1
[Trace] button
[Teach] button
24223-P7-10
2-28
X1, Y1
Enter the bad mark coordinates. If bad mark coordinates are unknown, coordinates can be entered by
teaching. After clicking the bad mark on the board image, click the center of the bad mark in the
field-of-view image. After setting the mark parameters, press the [Teach] button when the test result is
"OK". The recognized center coordinates are entered.
Mark 1
This number corresponds to the number in the mark data list, and therefore a mark No. for which no
fiducial mark has been set should be entered.
n NOTE
• If setting block bad marks, set the bad mark in the line for each block No.
• If setting local bad marks, set the respective local bad marks. Set the mount information mark list number on the
"Mount" screen of relevant parts.
2
TIP
If the bad mark is difficult to see, press the U, H, M, or L lighting button to change the lighting so that the mark can be

seen clearly.
Select bad mark.

24224-P7-10
No.
Set this parameter on the row that has the same mark number entered in Mark 1 in the mark list.
Mark Name
Mark Type
Select "Bad Mark" from the drop-down list.
TIP
"Fiducial", "Bad Mark", and "Code Scan" can be set in the mark list, and so the mark No. should be changed when
registering.
2-29
After setting the bad marks, you need to set up the parameters to recognize that bad marks. This section
describes the basic parameters.
Basic parameters
2
[Thresh] button
24238-P7-10
Mark Intensity Type

According to the bad mark, select "Detect (Bright) > No Detect (Dark)" or "Detect (Dark) < No Detect (Bright)" from the
drop-down list.
Sets the size of the area in which to search for the mark. The value can be entered from 0.00 to 150.00 (unit: mm).
The presence of bad marks is judged based on whether the inside of the detection range is bright or dark, and therefore a
range to the size as large as the mark is set.
Brightness Gain
Adjust this value to brighten the entire image so that the mark is easily recognized.
Brightness Offset
Adjust this value to make the entire image darker so that the mark is enhanced.
Thresh
Press the [Thresh] button to set the threshold value for mark detection.
2-30
3.3.4 Sampling conditions parameter
You need to set up the sampling conditions parameters to recognize bad marks.
By using "Luminance" as an example, this section describes how to set sampling conditions parameters.
1 Open the "Sampling" tab and select "Luminance" in the "Light Sampling Type"
area.
Sampling conditions
2
Luminance
[Image list] button

4
24239-P7-10
2 Select the sampling light.

1. Press the [Image List] button to open the light sampling type screen.
2. Select the image in which the bad mark appears clearest from the sampling lights list. (Up to two
images can be selected.)
3. Press the [OK] button to confirm the data entry.
3 Select the reduced light.

Press the [Image List] button of the reduced light to open the light sampling type screen. If required,
select a single image to be excluded from the reduced light list. (There is no need to make a selection.)
4 Select a noise cut filter.

This is used to eliminate noise. When noise is present, select the size to be averaged from the drop-down
list.
5 Set the reduced light magnification.

If reduced light is selected at Step 3, enter the reduced light magnification when performing image
processing.
6 Set the threshold value.

Open the [Base] tab. By pressing the [Threshold] button, a [Bad mark threshold value setting] screen
appears. Set the threshold value using the following procedure.
1. Click the bad mark on the screen, and move the camera axis until the mark enters the red box.
2-31
"Bad mark threshold value setting" screen
1 3
2 4
2 5 Threshold value
24226-P7-10
2. Press the [Detect] button to display the luminance when a bad mark exists.
3. Click a position with no bad mark, and move the camera axis to a position with no marks.
4. Press the [No Detect] button to display the luminance when no bad mark exists.
5. When pressing the [Set] button, the intermediate value is set for "J. Thresh" as the threshold value.
When pressing the [Close] button without pressing the [Set] button, the acquired threshold value is
not set.
7 Perform a test.
Press the [Test] button to verify that the system can detect the bad mark.
TIP
When the testing recognizes the bad marks, the coordinate of the recognized center appears in the upper left of the
bad mark screen.

2-32
3.4 Height parameters (option)
This screen appears if the inspection machine is equipped with the optional laser height unit or the 3D
projector.
[Data Edit] - [Height] screen
[Z Axis Correct] tab [Datum Height] tab Measurement point list
2
[Basic] tab
[Sampling] tab

Parameters
[Detail] button
View image Detection status display
[All Test] button Mark data list
[Test] button
24286-P7-10
Where using the laser height unit or the 3D projector to measure the reference surface height to correct the
camera head height, set up the "Z Axis Correction" tab accordingly. Set the reference height of the 3D
inspection in the "Datum Height" tab.
This section describes each of these two procedures.
3.4.1 Z axis correction

If the board to be inspected is warped, adjusting the camera head height (Z axis) by measuring the board height
enables the correct inspection. The setting for Z axis correction is as follows.
1 Set the "Maximum parts height".

Open the [Data Edit] – [Board] screen. Set the "Maximum Parts Height (mm)".
[Data Edit] – [Board] screen

Setting maximum parts height
Set the value here.
24285-P7-10
n NOTE
• If the camera head after the height correction comes down below the maximum parts height, it could interfere
with high parts. Therefore, the height correction is not available for use.
• Where the maximum parts height is 40 mm or lower from the board top surface, the camera (lighting) does not
interfere with parts.
2 Open the [Data Edit] – [Height] screen.
2-33
3 Select the "Z Axis Correction" tab for its setting.
Setting the "Z Axis Correction" tab

2 3
2
4 5
24287-P7-00
1. Select "Execute" from the drop-down list.

2. Select "3D" or "Laser" in the "Measurement unit".
3. Select the mark number used for "Mark No." (Setting is necessary only when selecting "3D".)
4. Select the number of correction points in "Correction Method".
Do not correct:
Camera head height correction is not performed.
1 Point:
Perform height correction with one measurement point.
2 Points:
Perform height correction with two measurement points.
3 Points:
Perform height correction with three measurement points.
5. Enter the correction coordinates of the position without the part.
1 Point:
[X: 1/2 board size X, Y: 1/2 board size Y]
2 Points:
[X: 1/3 board size X, Y: 1/2 board size Y], [X: 2/3 board size X, Y: 1/2 board size Y]
3 Points:
[X: 1/4 board size X, Y: 1/2 board size Y], [X: 2/4 board size X, Y: 1/2 board size Y],
[X: 3/4 board size X, Y: 1/2 board size Y]
4 Set the mark information.

Set this data only when selecting "3D" in "Measurement unit".
1. Set up the mark data list.
Set "Mark name" and "Mark type" in the row of the same number as the "Mark No." you have set in
the "Z Axis Correction" tab.

Z axis correction
Select Z axis correction.

24288-P7-00
• Mark name
Enter an easily distinguishable name up to nineteen single-byte alphanumeric characters for each
mark. Spaces cannot be entered.
• Mark type
Select "Z Axis Correction" from the drop-down list.
2-34
2. Set "Search Area X, Y (mm)" of the basic parameters.
The system calculates the average of the 3D heights in the set range to determine the "Z axis
correction" value.
Basic parameter
Z axis correction
24289-P7-00
2
5 Measure the heights.

Press the [Test] button to measure the height of the set measurement points.
TIP
When detected, the measurement results appear at the top left of the view screen.

n NOTE
When the camera head correction (Z axis correction) take place during the automatic inspection, the recognition
time appears in "Height Correction Recognition" of the [Auto] – [Output] screen.
2-35
3.4.2 Datum Height
This section describes how to set the datum height of the 3D inspection. Two measurement types are available
for your use as necessary – "Measurement by Parts" and "Measurement by View ."
■ Measurement by Parts
This function measures the height of the colored board in the image during the parts inspection to determine
the part unit datum height.
2 2 Select the "Datum Height" tab for its setting.

1. Select "Measurement by Parts" from the drop-down list.
2. Select the mark number to be used for "Mark No.".
Datum Height tab settings

Measurement by Parts
Select "Measurement by Parts". Select mark number.

24290-P7-00
3 Set up the mark data list.

Set "Mark name" and "Mark type" in the row of the same number as the "Mark No." you have set in the
"Datum Height" tab.

Select Datum Height.
24291-P7-00
• Mark name
Enter an easily distinguishable name up to nineteen single-byte alphanumeric characters for each
mark. Spaces cannot be entered.
• Mark type
Select "Datum Height" from the drop-down list.
4 Set the basic parameters.
Basic parameter
24292-P7-00

Set the range to sample the board colors.
Brightness Gain
Adjust this value to brighten the entire image so that the board color is easily recognized.
Brightness Offset
Adjust this value to make the entire image darker so that the board color is enhanced.
2-36
5 Set the sampling conditions parameters.
Set the light so that the board color can be seen clearly. For details, see "3.2.3 Sampling conditions
parameters" in this Chapter.
Example of setting sampling conditions parameters


24293-P7-00
6 Press the [Detected] button to check the state of sampling.

Check the board top surface is displayed in red.
Checking sampling status

[Detected] button
24295-P7-10

2-37
■ Measurement by View
Teach the point of height measurement for each view. The height of each point is measured to define it as the
datum height for each view.

2 Select the "Datum Height" tab for its setting.
1. Select "Measurement by View " from the drop-down list.
2. Select the number of correction points in "Correction Method".
2
1 Points:
The height of one measurement point is determined to the standard.
2 Points:
The height of two measurement point is determined to the standard.
3 Points:
The height of three measurement point is determined to the standard.
3. Select the mark number used for "Mark No."
Datum Height tab settings

Measurement by View
2 3
Measurement point list
24294-P7-00
3 Set up the mark data list.

See the procedure in Step 3 of "Parts unit measurement" described above and set the mark data list.
Setting mark data and parameter and checking sampling status

Measurement by view
4
6
7 Mark data list

24296-P7-10

See the procedure in Step 4 of "Parts unit measurement" described above and set the basic parameters.
2-38
5 Press the [Teach] button.
The camera moves over to the measurement point.

See the procedure in Step 5 of "Parts unit measurement" described above and set the sampling
conditions parameters.
7 Press the [Detected] button to check the state of sampling.

Check the board top surface is displayed in red.
2
8 Press the [Auto Teach] button to search the measurement points.
A confirmation dialog box appears. Press the [Yes] button to perform.
The system searches the optimum measurement point in the order from View 1 to set the coordinates
automatically.
The system sets the coordinate of only the point that the system has searched successfully. The
coordinate value turns blue when it is changed.

The coordinate value of the point of unsuccessful search appears in red.
TIP
• The system stays away from the points where the inspection parts frame is present.
• The measurement points to be searched differ from one correction method to another.
1 Point: Searches around the view center.
2 Point: Searches two diagonal points.
3 Point: Searches in a manner that the area of the triangle formed by the three points is larger.
n NOTE
An error message appears if the system does not find the measurement points in a view. Follow the instructions
provided.
9 Check the search results.

1. When finishing the search, the "Datum height measurement results" list appears. Check the locations
of the measurement points that appear in orange or red.
2. Press the [Close] button to return to the [Height] screen.
Checking the search results

Measurement by View
"Measurement result of the datum height" list
0 [All Test] button
24297-P7-10
0 Measure the heights.

Press the [Test] button to measure the height of the set measurement points.
Press the [All Test] button when measure the height of the all view measurement points at once.
q Save the inspection program.

2-39
3.5 View parameters
A "view" is the camera field-of-view used by the inspection machine to inspect a board. In the view settings,
views are set for locations on the board to be inspected, and the board images for each view are saved. When
performing automatic inspection, the inspection head moves to the set coordinates to perform inspection. View
settings cannot be specified with the optional iPro offline software.
TIP
With the offline software iPro (option), saved images are used to perform the tuning. Furthermore, saved images are
also displayed in the Repair Station (option) OK images.
2 3.5.1 Adding view images

Where the inspection program has "Standard Image", view images can be added to use for tuning. This section
describes how to add view images.

2 Carry-in a board, whose images are to be added.

3 Press the [Create] button.
1. Select the "View Image OK" tab on Images and press the [Create] button.
2. A dialog for image additional confirmation appears. Press the [Yes] button.
View images are saved and the board ID will be the date and time of the saving.
TIP
Regarding the PWB for auto tuning, press the [Create] button after selecting the "View Image PWB" tab on the
Images. Refer to "4. Auto tuning of inspection program", in this chapter for auto tuning.

Saving additional images
[View Image OK] tab [View Image PWB] tab
View image Added view image [Create] button
24257-P7-20

Press the [Save] button in the button area to save the inspection programs.
2-40
3.5.2 Creating all views and shortening inspection time
Create views automatically for data which steps already exist, or change the view No. to shorten the inspection
head movement time.

2 Use the auto creation function buttons in the lower right of the screen.
2
Auto Creation function buttons

Auto Creation function buttons
24229-P7-20
[Auto] button
Allocates views to include all steps considering step position and size, and adds a view No. to minimize the axis
movement time.
[Tie] button
Creates views uniformly for the entire board.
[Sort] button
Changes the view No. to minimize the axis movement time.
[Fill Area] button
Adds and assigns views to areas on the board to which no views have yet been assigned.
n NOTE
If editing views with the auto creation function, save the view images.
2-41
3.5.3 Manual view creation procedure
If unable to convert to an inspection program due to such reasons as having no CAD data, it is necessary to
create views for positions at which inspection is to be performed, and create inspection steps inside these
views. This section describes how to create views. Views cannot be created with the optional iPro offline
software.

2 Carry-in a board.
2 3 Move view 1 to the inspection position.
View 1 is created in the lower left of the view radar and is displayed in yellow.
Use the following method to move view 1 to the inspection position.
• Select view 1 and drag with the mouse.
• Use the scroll bar.

• Press the [0.1mm] movement pitch button to change the pitch, and then adjust with the scroll bar
arrow buttons.
To shorten the camera movement time, allocate views from the edge of the board.
View image
Move view 1. [Add View] button
View 1
Scroll bar [0.1mm] movement pitch button

24231-P7-20
4 Press the [Add View] button to add a view.

An add view dialog box appears. Select the sequence of inspection and press the [OK] button.
The added view is overlap-displayed at the lower right portion of the currently selected view in red.
Adding the view
24258-P7-00
n NOTE
Each view is displayed in color appearing in the following order: yellow → red → green → blue → pink → purple → light blue.
2-42
5 Move to the position at which the added view is to be inspected.
Move the added view to the desired inspection position by dragging it on the screen or using the scroll
bars or arrows.
View image
Adding views
2
8

7
View 1 Added view

24232-P7-10
n NOTE
In order to avoid losing sight of the inspection area, an added view should be positioned so that it partially overlaps
the adjacent view.
6 Create views for all inspection positions.

Repeated Steps 4 to 5 to create views so that all locations to be inspected on the board are covered.
7 Save the view image.

Press the [Create] button. A confirmation message appears. Press the [Yes] button. All view images are
captured, and then they are saved as "Standard Image".

2-43
3.5.4 Multiple view operations
Multiple views selected on the view radar display can be copied, deleted, and rotated at the same time.
n Selecting multiple views
1 Press the [Data Edit] button and open the "View" tab.
2 Select multiple views.
Enclose the multiple views to be selected in the view radar by dragging the mouse. The selected views
are shaded red and yellow. This time, the red-colored view is displayed in the view screen.
2 n NOTE
By clicking the target multiple views in the view radar while holding down the keyboard [Ctrl] button, views can be
selected or cleared. This time, the view selected first is displayed in the view screen.
View image
Selecting multiple views
Selected view
Red view image

24233-P7-20
2-44
n Deleting multiple views
1 Select the views to be deleted.

Select multiple views to be deleted in the view radar.
2 Press the [Delete View] button.

Press the [Yes] button at the confirmation message that appears. To cancel, press the [No] button.
[Delete View] button
[Delete View] button

2

24234-P7-20
2-45
■ Block input and copy of multiple views
Use the [Block Deploy] button to copy multiple views such as for creating views on a multi-board panel. This
function enables to conveniently deploy information to other blocks in such event as adding, deleting or
moving parts.
This section describes the "Block Deploy" function by using the multi-board shown below as an example.
Example of board
2 Block 7 Block 8
Block 5 Block 6
Block 3 Block 4
Block 1 Block 2
Selecting Mount information

mount information
24270-P7-10
● Rotate Deploy (Block Base)

Rotate Deploy includes the "Block Base" and the "Parts Teach". Use the "Block Base" if the board design values are known
and use the "Parts Teach" if they are unknown.
The following procedure describes the "Block Base" with an example of how to copy the information of Block 1 to Block 3
1 Open the [Block Deployment] screen.

Press the [Block Deploy] button on the [View] screen to open the [Block Deployment] screen.
[Block Deployment] screen
[Block Deployment] screen [Block Base] button

[View] screen
[Block Deploy] button

24271-P7-00
2-46
2 Select the copy origin block.
Select the block to be copied from the block offset information list.
Select Block 1 in this step. The mount information of the selected block is displayed in red.
Selecting the block
Select the block.

3
Selected mount
information
24272-P7-10
3 Press the [Block Base] button.

The "Block base" screen is displayed.
4 Check the "base block number".

Check that the block number selected in step 2 is displayed.
“Block Base”screen
24273-P7-10
5 Enter the shift values.

Enter the shift values (pitch of the block) of X and Y directions for the copy destination.
6 Select the rotation angle.

Select the rotation angle from the "Rotation" drop-down list.
Select "0" in this step.
2-47
7 Press the [OK] button to perform the deployment.
The deployed block appears on the full board image with the block offset information added in the
block information list.
Deployment completion screen

Added block offset information
2
Deployed mount information 8 9

24275-P7-10
8 Have the deployed data reflect on the inspection program.

1. Press the [Set] button.
2. A confirmation dialog box appears. Press the [Yes] button.
The deployed block offset data is set to the inspection program.
9 Check the reflected data.

1. Press the [Close] button on the [Block Deployment] screen to return to the [View] screen.
2. Check that the copied view appears on the view radar and confirm that the view data is added to
the view list.
[View] screen
Copied view Added view data
24276-P7-10
2-48
● Rotate Deploy (Parts Teach)
If the relative distance between the copy origin block and copy destination block is unknown, the "Rotate Deploy"
provides a function of "Parts Teach" to measure the distance while align the parts frame to help you copy.
This section describes the "Parts Teach" function with an example that copies Block 1 to Block 3.
1 Select the copy origin block.

Select the block to be copied from the block offset information list.
In this example, select Block 1. The mount information of the selected block is displayed in red.
2
Selecting the block
Select the block.

2
Selected mount
information
24277-P7-10
2 Press the [Parts Teach] button.

The [Parts Teach] screen appears.
3 Enter the "Copy base Position" and "Paste base Position" by teaching.
1. Press the [Teach] button of "Copy base Position" to open the [Teach_Trace] screen.
2. Select the rotation angle from the "Rotate" drop-down list. In this example, select "0" degree.
3. Check that the parts on the view align with the parts frame.
If the parts frame is not in alignment, use the mouse drag or the scroll bars to adjust the position.
Once confirming the position, press the [Teach] button.
4. Press the [Teach] button of "Paste base Position" to open the [Teach_Trace] screen.
5. Click on the copy destination block on the full board image. The copy destination block image
appears. Use the mouse drag or the scroll bars to adjust the position. Once confirming the position,
press the [Teach] button.
[Parts Teach] screen

[Teach] button of "Copy base Position"
View image
Full board image
4 [Teach] button of "Paste base Position" [Teach] button

Select the rotation angle
24278-P7-00
2-49
The copied block appears on the full board image with the block offset information added in the block
information list.

Added block offet information
2
Deployed mount information 5 6

24279-P7-00


the view list.
[View] screen
Copied view Added view data 7
24280-P7-10
7 Update images.
Press the [Update] button of "Image List" to update the images.

2-50
● Pitch deployment
The following procedure describes how to deploy the information in Blocks 1 and 2 over Blocks 3 to 8.
1 Press the [Block Deploy] button.

A [Block Deployment] screen appears.
2 Select the block to be deployed form the block offset information list.
While holding down the [Shift] key, press the [Select Row] button in the block.
In this example, press the [Select Row] button in Blocks 1 and 2. The [Select Row] button is highlighted
while the mount information of the selected blocks is displayed in red.
Selecting blocks
[Block Deployment] screen [Select Row] button Block offset information list
2

[View] screen
Selected mount information [Block Deploy] button

24235-P7-20
2-51
3 Set deployment options.
Tick the check boxes as necessary.
Block bad mark deployment

To deploy block bad mark information, tick the checkbox.
Local fiducial deployment

To deploy local fiducial mark information, tick the checkbox.
4 Press the [Pitch Deploy] button.

A [Pitch Deployment] screen appears.
2 [Pitch Deployment] screen

Example of deployment in Y direction
[Pitch Deployment] screen [Pitch Deploy] button
3
24236-P7-20
5 Enter the number of copies and the pitch.

Enter the block quantity of the X and Y directions that are copied in the "Number XY" boxes, and enter
the block pitches X and Y in the "Pitch XY (mm)" boxes.
n NOTE
When setting the pitch to create multiple views on a multi-board panel, enter the view pitch data by board design.
(Units: mm)
6 Set the priority direction.

Select the direction to be copied from the "Prior Direction" drop-down list.
Prior direction
X direction Y direction
23216-P7-00
2-52
The copied block appears on the full board image with the block information added in the block
information list.

Copied mount information Added block offset information

89
2468-P7-10


the view list.
[View] screen
Copied view Added view data 0
24269-P7-00
0 Update images.
Press the [Update] button of "Image List" to update the images.
q Save the inspection programs.

2-53
● Mount data update
The mount data update function enables to deploy data information to other blocks such as adding, deleting or moving
parts.
By using parts addition as an example, this section describes the mount data update function.
1 Add parts on the [Mount] screen.

While referring to "Section 3.5.3 Parts adding procedure", which will come up later in this Chapter, to
add parts to the mount information.
2
Adding parts
[Mount] tab Added part
Added part [Block Dep.] button

24281-P7-10
2 Press the [Block Deploy] button.

A [Block Deployment] screen appears.
3 Select the block you have added parts to from the block list.
Select block.
Selected block Added part 4

24282-P7-10
4 Set deployment options.

Tick the check boxes as necessary.
Block bad mark deployment

To deploy block bad mark information, tick the checkbox.
Local fiducial deployment

To deploy local fiducial mark information, tick the checkbox.
2-54
5 Press the [Update Mount Data] button to deploy to other blocks.
A confirmation dialog box appears. Press the [Yes] button to perform.
Performing mount data update

[Update Mount Data] button
24283-P7-10

1. When the [Set] button is pressed, a confirmation dialog box appears. Press the [Yes] button.
Update completion screen

Deployed mount information
[Set] button [Close] button

24284-P7-10
7 Update images.
Open the [View] screen and press the [Update] button of the "Image List" to update the image.

2-55
● Setting the block offset information
Add the block offset information can to the inspection program that the mount information has the block information and
does not have the block offset information on the multi-board panel. By this setting, the deploying to other block and the
changing the block pitch are available after the information in the block is edited.

Example Mount information of block 1 Block offset information
(including block information)
2
Mount information from block 2 to 8

(including block information)
242B9-P7-00
1 Add the block offset information.

Press the [Create] button on the [Block Dep.] screen. A row is added to the block offset information list.
2 Enter the block offset information.

1. Select the added row. The mount information of the relevant block is displayed in red.
2. Enter the offset "X", "Y" and "Angle".
Adding the block offset information
Added block offset

information
Enter the
offset.
Mount information
of relevant block
(displayed in red)
242C0-P7-00
2-56
3 Enter the block offset information in all the blocks.
Repeat the step 1 to step 2 and enter the block offset information in all the blocks that have no block
offset information.
4 Reflect the added block offset information on the inspection program.

The added block offset information is saved in the inspection program.
Setting the block offset information

2

[Set] button
242C1-P7-00
TIP
When deploying the information such as added, deleted and moved parts to other blocks, use the [Update Mount
Data] button. Refer to "● Mount data update" previously described in this chapter for the mount data update
function.
2-57
● Deleting the block offset information
When deleting the unnecessary block offset information, use the [Block delete] button.
1 Select the block offset information to be deleted.

Select the block offset information to be deleted on the block offset information list.
2 Press the [Block delete] button.

The dialog of selecting the method of the deletion is displayed. Select the method of the deletion and
press the [OK] button. The selected block offset information and the mount information are deleted.
2
Deleting the block offset information
Select the block offset to be

deleted.
[Block delete] button
242C2-P7-00
No inter val
Deletes the selected block offset information and the mount information and changes the block
numbers subsequent to the deleted blocks to the consecutive numbers.
Delete Error
Deletes the selected block offset information and the mount information, however the block
numbers subsequent to the deleted blocks are not changed.
2-58
3.6 Mount parameters
Mount parameters are used to display or edit the mount information on parts to be inspected using the loaded
inspection programs.
In the inspection programs created by converting YAMAHA mount data (YGX), the parts libraries of the inspec-
tion machine are deployed at the mounting positions of the parts. It is necessary for parts in which the libraries
are not deployed to set the relevant libraries from the parts libraries, or create new libraries and register and
deploy them.
n NOTE
2
A parts library is database, into which combinations of inspection steps by parts are saved.
Mount parameters
Mount information

1
3
Parts information
24250-P7-20
1. Selecting view
When selecting the view using the view radar, the selected view image is displayed.
2. Selecting parts
• After the selecting a part, clicking on the parts frame of the view image causes the step frame (library) to display in red.
At the same time, the mount information and the relevant parts in the parts information list are selected.
• Double-click the parts frame of the view image to move to the parts tab. The inspection steps of this part will appear.
3. Mount information button, parts information button
The mount information button enables among others to add, delete and copy the mount information in the mount
information list.
This parts information button enables among others to create, delete and copy parts in the parts information list.
For details on these buttons, see "1.4.5 [Mount] screen" in Chapter 1.
2-59
Example of parts information list
1
2
3
4
2 5
24202-P7-00
■ Cell colors
LIB name LIB parts name Description
1 Colorless Colorless The LIB name and LIB parts name are defined and registered in the library.
2 Colorless Skin beige While the LIB name is defined, the LIB parts name is not defined yet.
3 Skin beige Skin beige Neither the LIB name nor the LIB parts name is defined.
While both the LIB name and LIB parts name are defined, the LIB parts name is not
4 Colorless Orange
registered in the library yet.
The LIB name is not defined.
5 Skin beige Orange
While the LIB parts name is defined, it is not registered in the library.
While both the LIB name and the LIB parts name are defined, neither of them is
6 Orange Orange
registered in the library.
2-60
3.6.1 Pasting libraries
Paste standard libraries to parts for which libraries have not been deployed.
1 Press the [Data Edit] button and open the "Mount" tab.
2 Select the parts view you want to paste the library on.
Use the view radar to select the view that has the parts you want to paste.
3 Select relevant parts and press the [LIB Set] button.

After selecting the relevant parts on the view image, pressing the [LIB Set] button opens the [Library
2
Selection] screen will appear.
4 Select the library you want to paste and press the [Paste] button.
Pasting libraries
Select library.

2
[Lib Set] button [Paste] button

24251-P7-20
If the relevant library does not exist, select a similar library.

Details example names of standard library names are described below.
Standard library
Lib parts name examples
Example 1: resistor, capacitor, tantalum capacitor Example 2: SOP
(4 pins, pitch: 1.27, lead opposing side width:
3.5 mm, parts body width: 2.9 mm)
R1005 TANTALC1005 SOP4-P1.27-3.5W2.9

Parts type Dimensions Parts type Dimensions Parts type Parts body width
Pitch
No. of pins Lead opposing side width
23217-P7-00
• Lead opposing side width (distance from lead tip to lead tip of the other side)
W : Square parts with leads on 2 sides or leads on 4 sides
L : Parts with leads on 4 sides, distance in longer direction
■ Typical codes
Parts type Code Parts type Code
Resistor R Network resistor NR
Capacitor C Transistor TR
Mini transistor MTR Diode D
Tantalum capacitor TANTALC Aluminum capacitor ALC
Crystal XL Integrated circuit SOP/QFP/BGA/CSP
TIP
For details about how to create a new library, see "Section 1. Creating new parts libraries" in Chapter 3.
2-61
5 Paste the library on the parts.
1. Move the mouse pointer over the view image. This makes the library is displayed in yellow. Align the
library with the parts you want to paste on, left-click the mouse.
Pasting libraries
2
Align the library (yellow) with the parts. 7

24203-P7-10
6 Repeat the above steps.

Repeat steps 4 and 5 to paste the library on all the parts that the library has not deployed yet.
7 Complete the paste process.

Press the [Close] button on the [Library Selection] screen to complete the paste process.
8 Check the pasted data.

Check that the information of the parts which the library is pasted on is added to the "Parts information"
list and that the "Parts No." of "Parts information" is entered in "Parts No." of the relevant parts in the
"Mount information".
Confirming completion of pasting

Input parts No.
Pasted library Added parts information

24204-P7-10
2-62
3.6.2 Setting libraries
This section describes how to set libraries in the parts information.
1 Press the [Data Edit] button to open the "Mount" tab.

2 Select the parts you want to set the library in.
From the "Parts Information" list, select the parts you want to set the library in.
3 Press the [LIB Set] button.

A [Library Selection] screen appears.
4 Select the library you want to set and press the [Set] button. 2
Setting libraries
Select library.

32 [Set] button 5
24215-P7-10
5 Press the [Close] button to close the [Library Selection] screen.

6 Check the set data.
Check that the "LIB name" and "LIB parts name", which you have just set the library in, bear the parts
library name.
Confirming completion of setting
Check the data here.

24261-P7-00
2-63
3.6.3 Parts adding procedure
This section describes how to add parts that are not included in the mount information.
1 Select the view.

From the view radar, select the view of the parts you want to add.
2 Press the [Add] button.

One new row is added beneath the top row of the view.
2
Adding mount information
Select View. Added row [Add] button

24254-P7-20
3 Add the "Ref. No.".

Add the Ref. No. (reference number) to the added parts.
4 Enter mount coordinates.

Enter the correct coordinate in the added parts.
TIP
The position can also be changed by moving the part on the screen.
5 Enter [Angle].
Enter the mounting angle to the added parts.
6 Enter "Parts No.".

If the parts relevant to the "Parts Information" list, enter that particular parts number. If not, press the
[Create Parts] button to create the parts libraries.
TIP
For details on creating parts, see "1. Creating new parts libraries" in Chapter 3.
Entering mount information.

3 45 6
[Make Parts] button
24255-P7-10
2-64
3.7 Foreign object parameter
Set the parameter to inspect the foreign objects on the board. It inspects the area other than the parts in the
field of view (inspection target area). It detects chip, solder ball, dust, etc. as foreign objects. Regarding a slit,
etc. that may cause a false detection in the burr, register it as FOD mask following the shape (non-inspection
area) and exclude it from the inspection target area.
This function can be used in all views if creating a data for detecting the foreign objects (step data). Therefore
it is easy to create data. The Algorithm includes "Optical luminance" detection and "3D Height" detection.
[Data Edit] - [FOD] screen

View radar View Info. Inspection Info.

View image Mask Info. Parameter
24298-P7-00
3.7.1 Creating the data of inspecting FOD on the board

This section describes how to create the data of inspecting the foreign objects.
The following is an example of inspecting the chips scattered on the board as foreign objects with "3D Height"
detection.
1 Open the [Data Edit] - [FOD] screen.

2 Select "Execute" from the Inspection Info. drop-down list.
3 Create the step for inspecting the foreign objects.
1. Press the [Create] button on the Inspection Info. to open the [Create the new step data] screen.
2. Select the inspection type for inspecting the foreign objects. Select "Datum Height Point" and "FOD"
to inspect with "3D Height" detection in this step as an example.
3. The step for inspecting foreign objects is created by pressing the [OK] button.
The Algorithm is also set automatically.
Creating step for inspecting foreign objects
Select “Execute”. Algorithm
[Create] button
Select inspection type.
24299-P7-00
2-65
4 Set the "Sampling"parameter of the "FOD" step.
1. Select the "Light Sampling Type". Select "Height" as the "3D Height" detection is used for an example
in this section.
2. Set the range of the height to detect foreign objects.
When using the sampling slide bar

i. Press the [Detected] button.
ii. Move the sampling height slide bar and adjust it to display only the detected objects in red.
The adjusted values are entered in "Height Threshold Max." and "Height Threshold Min.".
2 Sampling parameter
Setting with sampling height slide bar
[Detected] button [Sampling] tab Select “Height”.
Height Threshold Max./Min. Sampling height slide bar

242A0-P7-00
TIP
‧ Parts inspection area is set as a non-inpection area automatically and parts are not detected as foreign objects.
‧ Colors on the view image
Black: Displays the non-inspection area. This area is not inspected.
Gray : Displays the inspection target area. The targets matching the conditions in this area are detected as foreign
objects.
Red : Displays the area detected as a foreign object. Calculates the shape in the area and judges if it is NG as a
foreign object.
When using the [Sampling] button

i. Press the [Sampling] button and open the "Spuit Sampling Setting" screen.
ii. Select the "Size of Syringe" and the "Sampling Color" as needed.
iii. Click the position to sample on the view image. The position which height is same as the clicked
position is displayed in the sampling color selected in ii.
iv. Press the [Set] button to save the setting.
Sampling parameter
Setting with the [Sampling] button
[Set] button [Sampling] button
Click the detected position. Noise Cut

242A1-P7-00
TIP
When sampling again, press the [Clear] button or the [All Clear] button. If pressing the [Clear] button once, the area
sampled by one click is deleted. When deleting all the sampling areas at once, press the [All Clear] button.
3. Set the "Noise Cut" as needed.
2-66
5 Set the "Detect"parameter of the "FOD" step.
Detect parameter
Inspection item: Foreign object
2
242A2-P7-00
Foreign Object Level

The area which contour luminance differences of the detected area is this value or more is the
inspection target. It is not required to set "3D Height" detection for an example in this section.
Area Detection size

The area of this value or more is the inspection target. If selecting "Manual", enter the Min Detect

Sizes. Normally select "Auto".
n NOTE
Unlike the parts inspection step, the "Datum Height Point" step is not required to select the "Measuring Method" from
the "Detect" parameter. Height is corrected using the information created on the "Datum Height" sub tab of "Height"
tab unconditionally.
6 Set the "Judge"parameter of the "FOD" step.

Judge parameter
242A3-P7-00
Judge Size Condition

Select the judge condition of foreign object from the drop-down list.
• Both-Side-Size
If the both of long side and narrow side of the detected object are longer than
the setting value of "long side and narrow side of the foreign object" and shorter than
the setting value of "long side and narrow side of the excepted size", it is ragarded as a foreign
object and judged NG.
• One-Side-Size
If either of long side or narrow side of the detected object is longer than the setting value of
"long side and narrow side of the foreign object" and shorter than the setting value of "long side
and narrow side of the excepted size", it is ragarded as a foreign object and judged NG.
FOD Long Side, Narrow Side (mm)≥

If long side and narrow side of the detected object are longer than the setting value, it is regarded
as a foreign object.
Exclude Size Long Side, Narrow Side(mm) >

If long side and narrow side of the detected object are longer than the setting value, it is not
regarded as a foreign object and excluded from the inspection target.
TIP
"Datum Height Point" step does not have the "Judge" parameter.
2-67
7 Set the "Option" parameter
Option parameter
2 OK jump
242A4-P7-00
When the judgement result is "OK", set the step of the next inspection.
"Step skip" is available by this setting.
NG jump
When the judgement result is "NG", set the step of the next inspection.
"Maltiple step inspection" and "different condition inspection" are available by this setting.
For instence, set the "Light Sampling Type" of the jump destination step 3 to "Luminance" in regard to
step 2 that the "Light Sampling Type" is set to"Height". If the foreign object is detected in step 2 and
judged NG, jump to step 3 and reinspect the "Luminance" (See below).
NG jump inspection area

If the "NG jump" is set to other than "Don't use", select the inspection area to reinspect in the step of
the jump destination.
Normal (All of view):
Inspect the view of all area with the different condtion in the jump destination step (step 3 of the
figure below).
Judged area as NG:
Inspect the area that foreign objects are detected in step origin (step 2 of the figure below) only
with the different condtion in the jump destination step (step 3 of the figure below).
NG jump
Inspection area
Step 2 inspected by height
Step 3 inspected by luminance Set step 2 to“Next Step”
■ Normal (All of view) ■ Judged area as NG
FOD View View of all areas FOD detected area
Jump
Jump
Detect FOD in step 2. Inspect view of all areas Detect FOD in step 2. In step 3, inspect area that
with different condition FODs are detected in step 2
in step 3. only, with different condition.
242A5-P7-00
NG Reason
Enter the NG reason to display when judged NG in automatic inspection.
2-68
Mask Type
If not using the mask function, select "Disable" and if using it, select "Exclude" or "Other Parts Exclude".
Select "Disable" for an example in this section as the mask function is not used.
NG Image Out
Set the light of image to send to the repair judgement station (option) as needed.
8 Perfom the FOD test.

Press the [Test] button to perform the FOD test.
When the target foreign object is not recognized or the false recognition is found in the area where
there is no foreign object, check each parameter referring to the detected data displayed on the
screen.
Step test
2

Detected
data
[Test] button [All Test] button

242A6-P7-00
n NOTE
Regarding the object that may be a foreign object detected by the test, the detail data can be found by pressing
the [Detection] button. The relevant position is displayed in red on the view image by selecting the detected data list.
[Detection] screen
Displayed in red
Select here.
[Detail] button
[Detection] button
242A7-P7-00
n NOTE
When testing all views at once, press the [All Test] button. The test results of each view can be found on detail screen.
TIP
The inspection area differs from the foreign object inspection by the [Test] or [All test] button (hereafter "Manual test")
and by the automatic inspection. The following is the description with the assumption that the inspection area of view
1 and view 2 are overlapped.
• Manual test : Foreign object inspection is performed on view of all areas of view 1 and view 2.
• Automatic inspection : View 1 is inspected on view of all areas and the area inspected on view 1 is not inspected on view 2.
2-69
3.7.2 Procedure of creating foreign object mask data
When detecting a foreign object on the optical light to detect slope area, a slit edge, etc. are also detected and
may cause the false detection. The area where is not obviously required to inspect can be excluded by setting
the foreign object mask.
Example of exclusion area from inspection
Exclusion areas
from inspection
2
242A8-P7-00
■ Newly creating a foreign object mask data

The following is the procedure of creating a foreign object mask on the area to be excluded from inspection.
1 Open the [Data Edit] - [FOD] screen.

2 Select the view that has an area to be excluded from the inspection.
Click the view that has an area to be excluded from the inspection on the view radar. The clicked view
image is displayed on the view image.
TIP
The image of the relevant view can be also displayed by selecting the relevant view from the "View Info." and
pressing the [Trace] button
3 Open the "Sampling of Mask area" screen.

Press the [EDIT] button on the "Mask Info." and open the "Sampling of Mask area" screen.
[Sampling of Mask area] screen
2 1 [Trace] button View Info.
View image 3 [Sampling of Mask area] screen

[Edit] button
242A9-P7-00
2-70
4 Select the category of the Library to Detect FOD mask.
Select "User" from the "Category" drop-down list.
c CAUTION
Standard sampling library cannot be edited.
5 Create the sampling condition to sample the mask area.

1. Press the [Create] button and open the "Addition of New Sampling Library" screen.
2. Enter the name of the sampling condition in the "Name".
2
3. Enter "Comment" as needed.
4. The screen to set the sampling condition is displayed by pressing the [OK] button.
TIP
If sampling by changing the existing sampling condition, select it from the "Light" drop-down list and press the [EDIT]
button. The screen to set the sampling condition is displayed.

Creating the sampling condition
4
[Create] button
Light
[Edit] button
Enter the name.
242B0-P7-00
6 Select the "Light Sampling Type".

Select from "Luminance", "Color", "Shape", "Compatible", or "Height". Select "Color" for an example in this
section.
7 Select the "Sampling Light".

Press the [Sampling Light] button and select one image which contrast of the mask area is strong from
the Sampling Light list.
Selecting the sampling Light

Light Sampling Type: Color
Select the
Light Sampling Type.
[Sampling Light] button
Select the
image.
242B1-P7-00
2-71
8 Set the sampling condition.
Set the sampling condition by the threshold slide bar or [Sampling] button.
This section describes the procedure of setting by the [Sampling] button.
1. Press the [Sampling] button and open the "Spuit Sampling Setting" screen.
2. Select the "Size of Syringe" and the "Sampling Color" as needed.
3. Click the position to sample on the view image. The position which color is same as the clicked
position is displayed in the sampling color selected in 2.
4. Press the [Set] button to save the setting after all the areas to be masked turned the selected
sampling color.
2 5. Set the "Noise Cut" as needed.
Setting the sampling condition

Noise Cut
[Set] button
Threshold slide bar 9
Click the area to be masked.
242B2-P7-00
TIP
9 Register the sampling condition.

1. The confirmation dialog box will be displayed by pressing the [Save] button.
2. Register it by pressing the [Yes] button. The "Sampling of Mask area" screen appears again.
The name entered in step 5 is displayed in the "Light" field of the "Sampling of Mask area" screen.
TIP
When deleting the registered sampling condition, select the [Data Edit] - [Parts] and press the [Sampling Lib] button to
display the "Sampling Library" screen. Select the sampling condition to be deleted from the "Light" drop-down list and
press the [Delete] button.
2-72
0 Detect the masked area.
Press the [Detect] button and detect the masked area following the sampling condition. The detected
area is displayed in green and the data list is displayed on the "Sampling of Mask area" screen.
q Select the mask data to be set.

If clicking the area where the mask data is created on the view image, the checkbox of the "Set"
column of the relevant data is ticked.
Detecting and selecting the mask data
2
Detected area is displayed in green frame. Sampling condition registered in9

Mask data list
Selecting data
Clicked area turns red. 0 [All Select] button

242B3-P7-00
n NOTE
• The multiple selection is available if holding down the [Ctrl] key and clicking the areas to be created the mask
data on the view image.
• Ticking the checkbox of the "Set" column on the list of the "Sampling of Mask area" is also available.
• If selecting all the mask data on the list, press the [All Select] button.
w Change the detected area size as needed.

1. Hold down the [Ctrl] key and click the areas that change the size on the view image.
2. Press the [Size Change] button and open the "Change of Mask size" screen.
3. If entering the size to be changed and pressing the [OK] button, the size of the selected area is
changed.
Changing the area size

Example of expanding areas 0.5mm larger
Selecting areas
Before
Areas are expanded 0.5mm larger.

After
Enter the size.
[Size Change] button

242B4-P7-00
n NOTE
• When enlarging the area size, enter the positive value. When reducing the size, enter the negative value.
• If ticked the multiple checkboxes of the mask data, the size of area where the cursor is selecting only is changed.
2-73
e Set the selected mask data.
1. When setting the specified area as it is, press the [Region Set] button.
When setting the specified area as the circumscription rectangle, press the [Rect Set] button.
2. When the confirmation dialog box is displayed, press the[Yes] button.
The "Sampling of Mask area" screen is closed and the data to have been set is entered in the "Mask
Info." of the "FOD" screen. The relevant area on the view image is displayed in blue green.
Setting the mask data
2
■ [FOD] screen region set was performed
Set mask data

■ [FOD] screen Rect Set was performed
[Region Set] button [Rect Set] button

242B5-P7-00
Creating the new FOD mask data is completed.
■ Assignment of FOD mask data

FOD mask data is controled by the independent IDs and the IDs are linked to each view radar. If changed the view
position manually, the mask on the view is not displayed and other mask may be displayed on the new view position.
In this case, press the [Assignment] button and automatically calculate the positional relation between the all views and
the all mask data to link them again.
Assignment of the mask data
■ Linking before
View 1 assignment
Board A
View 1
C
Mask A
View 1 Change position Mask C
D
Mask B
Perform the assignment

■ Linking after
assignment
A
C View 1
Mask B
View 1
Mask D
D
B
[Assignment] button
242B6-P7-00
TIP
If performed the automatic View assignment by pressing the [Auto] button or the [Fill Area] button on the [Data Edit]
- [View] screen, the assignment of the FOD mask data will be performed automatically.
2-74
■ Deleting the FOD mask data
Unnecesary FOD mask data can be deleted by pressing the [Delete] button. Select the unnecesary mask data on the mask
data list or the view image and press the [Delete] button. If deleting the multiple data at once, select the unnecesary
mask area by dragging and press the [Delete] button.
Deleting the mask data

Example of deleting multiple data
Selected row
2
Specify the area (displayed in pink)
by dragging. [Select row] button

[Delete] button
242B7-P7-00
TIP
If deleting the consecutive data on the mark data list, hold down the [Shift] key and press the [Select row] buttons of
the first row and the last row. If deleting the non-consecutive multiple data, hold down the [Ctrl] key and press the
[Select row] buttons of the rows to be deleted.
■ Teaching the FOD mask data

Regarading the rectangle mask data, the data can be set by teaching.
Teaching procedure:
1. Press the [Teach] button.
2. Specify the mask area by dragging on the view image. The specified rectangle area is set as the mask data.
Teaching the mask data
Specify the area by dragging.
[Teach] button
Set mask data
Rectangle mask
242B8-P7-00
2-75
3.8 Code scan
The code scan includes the "Board code scan" and the "Block code scan". The function of the board code scan
is to read the QR code, etc. on the board and sets it as the board ID. The board ID is used when outputting the
SPC data and the inspection result to the repair judgement station (option). The block code scan is used when
tracing with the offline software "iProDB" (option) by recognizing the QR codes of each block on the board and
outputting as the SPC data. The code scan function is not available for use on the optional iPro offline software.
Setting the code scan
2
Example of board code scan
Full board image 2 Select “Execute”. 6
7 0
24259-P7-10
1 Press the [Data Edit] button and open the "Code Scan" tab.
2 Select the code scan to be performed.
"Board" tab (Board code)
The code is recognized per board.
"Block" tab (Block code)

The code is recognized per block.
TIP
• The "Block" tab is displayed by selecting [Machine setting] - [Server Setting] screen and selecting "Use" from the
"SPC Text Out" and the "SPC Database" drop-down lists.
• The block code scan can be performed only on the inspection program that the multiple blocks exist.
3 Set the code scan function to "Execute".

4 Move the camera to the center of the code.
Click the center of the mark on the entire board screen. And, the camera moves over to the center of
the code.
5 Press the [Teach] button.

A teach confirmation dialog box appears. Press the [Yes] button.
6 Enter the mark number for Mark 1.

Enter the number that is not used by the fiducial or bad mark.
2-76
7 Set the code information.
Set "Mark name" and "Mark type" in the row of the same number that you have set in Step 5.
• Mark name
Enter a code name up to nineteen single-byte alphanumeric characters for each mark. Spaces
cannot be entered.
(You do not have to enter one.)
• Mark type
Select "Code scan" from the drop-down list.
2
Basic parameters
Code scan

24260-P7-10
Code Algorithm Type

According to the inspection object, select any of three types shown below.
QR code :Select this when recognizing the QR code.
D-matriX :Select this when recognizing the Data matrix.
Barcode :Select this when recognizing the barcode.
Cell Number
Select the number of QR code or D-matrix cells.

Enter the size to search the codes.
Brightness Gain
Perform the adjustment to make the entire portion brighter so as to easily recognize the code.
Brightness Offset
Perform the adjustment to make the entire portion darker so as to enhance the code.
Barcode Type
This is displayed only when "Code Algorithm Type" is set at "Barcode".
Select the barcode type from the drop-down list. When selecting "Auto", the recognition process is
performed with all barcode types.
Check Digit
This is displayed only when "Code Algorithm Type" is set at "Barcode".
If check digits are present, select "Enabled". If not, select "Disable".
Mark Angle
Selects code angles.

Set the lighting so that the code can be seen. For details, see Chapter 4, "3.2.3 Sampling conditions
parameter".
0 Press the [Test] button.

Check that the recognized code is displayed normally.
2-77
4. Auto tuning of inspection program
4.1 Pad information tuning
4.1.1 General description

Detect the pad position and the size from the saved PWB image. Use the information and adjust the
Component Shifting tolerance of the parts inspection data based on IPC standards.
2 Pad information tuning
■ Sampling pad information ■ Adjusting Component Shifting ■ Adjusting step frame aligning
based on IPC standards with pad size
Previous Adjusted
tolerance tolerance Previous step frame

Pad
Component Step frame Adjusted step frame

23219-P7-00
The Component Shifting tolerance adjustment is called "IPC Rank Tuning".

Automatically adjust the Component Shifting tolerance with the pad information obtained from the PWB image
and with IPC-A-610 Revision D(2005/2). The adjustment standards include 3 classes.
The following is the definition of each class.
• Class 1:General electronic products (Standard: Lenient)
• Class 2:Electronic products for specific use (Standard: Average)
• Class 3:High-performance electronic products (Standard: Strict)
Currently, the inspection items that the "IPC Rank Tuning" is available are "Component Shifting" and "Lead
Overhang" only.
The step frame adjustment aligning with pad size is called "Step Dimensions Tuning".
Automatically adjust the pad position, the step position of the inspection items to align with the size, and the
size with the pad information obtained from the PWB image.
Currently, the inspection items that the "Step Dimensions Tuning" is available are the following 6 items; "No
Solder", "Exposed Copper", "Insufficient Solder", "Black Material", "Insufficient Wetting" and "Bridging".
2-78
4.1.2 Saving PWB image
It is required to save the PWB image on the inspection program beforehand in order to use the pad information
tuning.
1 Load a PWB into the inspection machine and clamp it.

1. Press the [Change] button on the button area.
2. After the confirmation dialog box is displayed, place the PWB on the entrance and press the [Yes]
button. The PWB is loaded and clamped at the inspection position.
2
2 Save the PWB image on the inspection program.
1. Open the [Data Edit] - [View] screen.
2. Open the [View Image PWB] tab.
3. Press the [Create] button. The PWB image is saved as the "Standard Image".

Saving the PWB image
[View Image PWB] tab
[Save] button
[Change] button View image Standard Image [Create] button

242C3-P7-00

Press the [Save] button on the button area. After the confirmation dialog box is displayed, press the [Yes]
button to save the inspection program.
4 Remove the PWB.

Press the [Change] button on the button area. After the confirmation dialog box is displayed, remove
the PWB following the on-screen guidance.
2-79
4.1.3 Setting parts information
It is necessary to set the required parameters for the parts information in order to use the function.
1 Open the [Data Edit] - [Parts] screen.

2 Select the shape of the part used for the function.
1. Press the [Pick Shape] button on the "Parts Info." to open the "Pick Shape" screen.
2. Select the shape and the type of the part used for the function.
Tuning is performed according to the selected part type.
2 Selecting the shape

Example of SOP
[Parts] tab
242C4-P7-00
3 Set the required parameters on the partial Info.

1. Select "Body" from the "Partial Info".
2. Press the [Shape] button to open the "Partial Shape Edit Dialog" screen.
3. Set the [Body Sizes X, Y and Z (mm)].
Teaching the Body Sizes X and Y is also available by pressing the [Size Teaching] button and
dragging the body area on the part image.
Setting the body size

Example of SOP
Select “Body”. [Size Teaching] button
[Shape] button
242C5-P7-00
4. Press the [Close] button and return to the "Parts" screen.
2-80
5. Select the "Lead Group" from the "Partial Info.".
6. Press the [Shape] button to open the "Partial Shape Edit Dialog" screen.
7. Set the "Lead (mm)" for the lead part and "Termination (mm)" for the chip part.
Setting the lead size

Example of SOP
Select “Lead Group”.

[Shape] button
242C6-P7-00
8. Press the [Close] button and return to the "Parts" screen.
TIP
Refer to Chapter 3, "2.1.2 Partial Shape Edit Dialog" for further information.
2-81
4.1.4 Tuning procedure
This section describes the tuning procedure. The tuning screen is on the [Data Edit] - [Parts] screen.
1 Open the "Tuning" screen.

Open the [Data Edit] - [Parts] - [Tuning] tab and press the [Auto Tuning] button.
The "Tuning" screen is displayed.
[Tuning] screen
2
Tuning Condition Data list of tuning target parts
Detail list of tuning result [Tuning] tab [Auto Tuning] button

242C7-P7-00
2 Set the conditions of sampling the pad from the PWB image.
Select "Standard" or "User" from the "Category" drop-down list on the "Tuning Condition".
If newly create the sampling conditions, select "User". This section describes the procedure of newly
creating the sampling conditions.
Newly creating the sampling condition
Select “User”. [Create] button Enter the name.
[Edit] button
242C8-P7-00
1. Press the [Create] button and open the "Addition of New Sampling Library" screen.
2. Enter the name of the sampling condition in the "Name".
3. Enter "Comment" as needed.
4. The screen to set the sampling condition is displayed by pressing the [OK] button.
TIP
If sampling by changing the existing sampling condition, select it from the "Light" drop-down list and press the [EDIT]
button. The screen to set the sampling condition is displayed.
2-82
5. Select the "Light Sampling Type" from "Luminance", "Color", or "Shape".
Select "Luminance" for an example in this section.
6. Press the [Sampling Light] button and select the image which contrast of the pad is strong from the
Sampling Light list. (Up to 2 images can be selected.)
Selecting the Sampling Light

Light Sampling Type: Luminance
Select the Light Sampling Type.
[Sampling Light]
button
2
Select image.

242C9-P7-00
7. Set the sampling condition by the threshold slide bar or "Sampling" button.
This section describes the procedure of setting by the [Sampling] button.
i. Press the [Sampling] button and open the "Spuit Sampling Setting" screen.
ii. Select the "Size of Syringe" and the "Sampling Color" as needed.
iii. Click the pad area on the view image. The position which luminance is same as the clicked position
is displayed in the sampling color selected in ii .
iv. Press the [Set] button to save the setting after all the pad areas turned the selected sampling color.
Setting the sampling condition

[Set] button
8
Threshold slide bar

9
Click the pad area.
242D0-P7-00
TIP
8. Set the "Reduced Light", "Noise Cut" and "Reduced Light Ratio" as needed.
9. Press the [Save] button to register the sampling condition.
The confirmation dialog box will be displayed. Press the [Yes] button to register.
TIP
When deleting the registered sampling condition, open the [Data Edit] - [Parts] screen and press the [Sampling Lib]
button to display the "Sampling Library" screen. Select the sampling condition to be deleted from the "Light" drop-
down list and press the [Delete] button.
2-83
3 Set the tuning conditions.
Select each item from the drop-down lists.
Setting the Tuning Conditions
Tuning conditions
2 Target Parts
All Parts : Tunes all the parts in the inspection program.
242D1-P7-00
Selected Parts : Tunes the currently editing parts only.

NG Tuning Parts : Tunes the parts that failed in the previous tuning.
IPC Rank Tuning
Don't Execute : Tuning based on IPC stadards is not executed.
Class 1 : Tunes the Component Shifting tolerance in class 1 standard (Lenient).
Class 2 : Tunes the Component Shifting tolerance in class 2 standard (Average).
Class 3 : Tunes the Component Shifting tolerance in class 3 standard (Strict).
Step Dimensions Tuning
Don't Execute : Tuning is not executed.
Fit to the pad shape : Align the step position and the size of the target inspection item with the pad.
4 Execute the tuning.

1. The confirmation dialog box is displayed by pressing the [Execute] button.
2. The tuning starts by pressing the [Yes] button.
3. After the tuning is completed, the confirmation dialog box is displayed. Press the [Yes] button.
Executing the tuning
[Execute] button
242D2-P7-00
2-84
5 Check the tuning result.
The part that the tuning was successful is displayed in blue and the part that the tuning was failed is
displayed in red on the Tuning Result list. The reason for the failure is displayed in "Error Detail". Correct
the error on the "Parts" screen.
1. If selecting the part that the tuning was successful to check, the data of before and after changing
the each inspection type step of relevant parts are displayed on the Tuning Result list.
2. If selecting the insection type, the status after changing the size can be checked on the view image.
Checking the Tuning Result
2
Successful part (blue) Failed part (red) Cause of failure

Select a part.
Changing
the display
Select the inspection type. Data of before and after changing

242D3-P7-00
6 Set the tuning result to the inspection program.

1. The part that the tuning was successful only can reflect the corrected data part to the inspection
program by pressing the [Set] button.
2. After the setting is completed, the confirmation dialog box is displayed. Press the [OK] button.
The display of the parts that the setting is comleted is changed to "Updated".
Setting the Tuning Result
Setting is updated.
[Reset] button [Set] button

242D4-P7-00
n NOTE
Regarding the parts that the setting is compeleted, the tuning is not executed by pressing the [Execute] button again.
If tuning again, press the [Reset] button.
2-85
Contents
1. Creating new parts libraries 3-1
2. Editing parts libraries 3-8

2.1 Creating new partial areas 3-9
2.1.1 Creating new partial areas procedure 3-9
2.1.2 Partial Shape Edit Dialog 3-13
2.2 Checking libraries 3-15
2.3 Parameters 3-16
2.3.2 Sampling parameters 3-18
2.3.3 Detect parameters 3-20
2.3.4 Judge parameters 3-22
2.3.5 Option parameters 3-25
2.4 All functions 3-26
2.4.1 Sampling condition (based on light sampling type) 3-26
2.4.2 Registering user characters 3-38
2.4.3 Pattern registration 3-44
2.4.4 Step Mask function 3-47
2.4.5 Step tuning 3-48
2.4.6 "Detection" results 3-52
2.4.7 Parts library detail screen 3-53
2.4.8 Utilizing Parts Library 3-55
2.4.9 Utilizing sampling Lib 3-59
2.4.10 Batch replacement 3-61
1. Creating new par ts libraries
This section describes how to create libraries that inspect parts. As libraries are created for all parts,
inspection programs are finished. As the libraries are saved and they are added to the library
correspondence table, libraries are deployed during conversion of inspection programs from the next time.
This section describes how to create parts libraries newly by using IC parts with mount information as an
example.
TIP
For parts yet to have mount information, first add mount information to them before creating the library. See "Section
3.6.3 Parts adding procedure" in Chapter 2 for the detailed procedure for adding mount information.
Flow diagram for newly creating parts libraries
3
Creating a new library
Open the [Mount] screen.

 Step1
Creating parts libraries

No Create parts mount
Is there mount information? information.
 Section
Yes "3.6.3 Parts adding procedure"
in Chapter 2
No
Is there a library?
Yes
Select parts without library.

 Step2
Enter the part sizes.

 Step3
Press the [Make Parts] button

to create a library.
 Step4
Register the library.

 Step5
Completed
23300-P7-20
3-1
1 Open the [Data Edit] - [Mount] screen.
2 Select parts without a library.
Click on the parts without a library on the view image. And, the corresponding row of "Parts Information"
is selected.
3
Select parts without a library.

24341-P7-20
3 Enter the part sizes.

Enter the parts sizes into the "Size X, Y" column in the corresponding row.
If parts sizes are already there, no data entry is necessary.
Entering parts sizes
Enter sizes X and Y. [Make Parts] button

24381-P7-00
4 Create parts libraries.

1. Press the [Create Parts] button to open the [Create Parts] screen.
3-2
2. Select "IC (4 Dir)" and press the [Next] button.
Parts creation 1
24342-P7-10
3
3. Select "QFP" and press the [Next] button.

Parts creation 2
24343-P7-10
4. Select the shape and press the [Next] button.
Parts creation 3
24344-P7-10
3-3
5. Set the parts size and press the [Next] button.
Enter the parts size directly or drag the parts body on the parts image to set the parts size.
Parts creation 4
3
24345-P7-10
6. Set the pad tip-tip and press the [Next] button.

Enter the pad tip-tip directly or drag between the pad tips on the parts image to set the pad tip-tip.
Parts creation 5
24346-P7-10
3-4
7. Set the lead tip-tip and press the [Next] button.
Enter the lead tip-tip directly or drag between lead tips on the parts image to set the lead tip-tip.
Parts creation 6
3
24347-P7-10
8. Set the lead size and press the [Next] button.

Enter the lead size directly or drag one lead on the parts image to set the lead size.
Parts creation 7
24348-P7-10
3-5
9. Set the lead pitch and press the [Next] button.
Enter the lead pitch directly or drag the lead pitch on the parts image to set the lead pitch.
Parts creation 8
3
24349-P7-10
10. Set the number of leads and press the [Next] button.
Enter the number of leads directly or drag all the lead on one side on the parts image to set the
number of leads.
Parts creation 9
24350-P7-10
3-6
11. Set the pad width and press the [Next] button.
Enter the pad width directly or drag the pad width on the parts image to set the pad width.
Parts creation 10
3
24351-P7-10

5 Press the [Finish] button to register the library.
1. A confirmation dialog box appears. Change the "LIB Name" and "LIB Parts Name" as necessary.
2. Press the [Yes] button to register the library.
24352-P7-10
3-7
2. Editing par ts libraries
A library consists of partial areas and Inspection Type of each area. This section describes how to edit
libraries you have created.
"Partial Information" of a library includes "Body", "Lead Group" and other items. Selecting one partial area
causes the corresponding Inspection Type to appear in the "Inspection Information" list. See "1.3 Selecting
Inspection Type" in Chapter 2 for more details on the Inspection Type of each partial area.
[Parts] screen
Partial Info. [Shape] button Inspection Info.
3
24361-P7-10
■ Partial information and Inspection information
Partial Information list Inspection Information list
Body Displays the steps necessary to inspect the parts body.
Displays the steps necessary to inspect one lead.

Lead group
To edit the number of leads or position information, press the [Shape] button.
THD Displays the steps necessary to inspect the THD parts.
Neighbor of parts Displays the steps necessary to inspect the neighbor of parts.
Others Displays the steps necessary to inspect others.
3-8
2.1 Creating new partial areas
2.1.1 Creating new partial areas procedure

To add a partial area to be inspected, you need to add the information of that particular partial area into "Parts
Information".
The following describes how to create partial areas newly by using "Lead Group" as an example.
1 Select the parts you want to add the inspection area to.
On the view image on the [Mount] screen, double click on the parts you want add the inspection area
to. The screen moves over to the [Parts] screen.
2 Press the [Create] button on "Partial Area Information".

An add inspection area dialog box appears.
3 Select the partial area you want to add. Press the [OK] button.
The selected partial area is added to "Partial Area Information". Select "Lead Group" in this example.
Adding inspection area 3

[Parts] screen 2

Select partial.
24362-P7-10
3-9
4 Press the [Create] button in "Inspection Information".
[Create the new step data] screen appears.
5 Select the Inspection Type to be added newly. Press the [OK] button.
The selected Inspection Type (for one pin) is created in "Inspection Type Information" and the step
appears at the center of the parts.
Creating the new step data
Added partial 4
3
Select Inspection Type.

24363-P7-10
6 Press the [Shape] button in "Partial Information".

The [Partial Shape Edit Dialog] screen appears.
Partial Shape Edit Dialog
Partial Shape Edit Dialog [Shape] button Created Inspection Types
Displayed step
24364-P7-10
3-10
7 Set the "Lead Type".
From the drop-down list, select the direction where the lead is present. Select "Vertical" in this example.
8 Enter the "Lead Pitch (mm)" and the "Lead Count/Direction".

9 Press the [Auto Set] button.
The confirmation dialog box appears. If pressing the [Yes] button, the lead reference position is adjusted
relevant to the lead count and the lead pitch.
Auto setting of the lead reference position
[Auto Set] button
8
3

The values after the automatic adjustment are entered. Lead reference (red: “+”)
24365-P7-10
0 Move the step to the position to be inspected and change the size.
1. Move the step to the position to be inspected by dragging and adjust the size.
2. Press the [Close] button to close the "Partial Shape Edit Dialog" screen.
Moving the step and changing the size
Move the step by dragging and change the size.

24367-P7-10
3-11
q Set each parameter.
Set the tab parameters of "Base", "Sampling Conditions", "Detect Conditions", "Judge Conditions" and
"Option"
TIP
The parameters differ based on the Inspection Type and the Algorithm.
See "Chapter 4 Setting Inspection Type" for more details on parameter setting for each Inspection Type.
Setting each parameter
Set each parameter.
3
w r
24368-P7-10
w Perform a step test.

Press the [Test] button in the "Tuning" tab to perform a step test.
If not judged correctly, review each parameter while referring to the displayed test results.
e Repeat Steps 10 to 12 for all the steps.

Select the step from "Inspection Type Information". Repeat Steps 10 to 12.
r Register the created data

Press the [Save] button in the "Tuning" tab and a dialog box appears.
Check the contents. If all right, press the [Yes] button to register the data in the library.
3-12
2.1.2 Partial Shape Edit Dialog
The shape information is for editing the positions of the leads, pins or the like of parts. Select "Body", "Lead
Group", or "Neighbor of Parts" from "Partial Information". Then, press the [Shape] button. The [Partial Shape
Edit Dialog] screen appears, allowing you to edit each item. The item contents may vary depending on the
partial information you have selected.

Lead Group
Select Lead Group. [Shape] button [Flattery] button [Size Teaching] button

Partial Shape Edit Dialog [Datum Teaching] button [Auto Set] button
24353-P7-20
[Flatter y] button
If pressing this button after moving the lead reference point by [Datum Teaching] button, the lead reference point moves
to the automatic adjustment position.
[Size Teaching] button
Teaches the part and the lead sizes by dragging on the part image.
[Auto Set] button
If pressing [Auto Set] button when changing the number of leads of the lead group, the lead reference point will be
adjusted considering the part size, number of leads and the lead pitch. It is set by pressing the [Yes] button in the dialog
box.
[Datum Teaching] button
Teaches the lead reference point by moving the step on the part image.
Lead Type
Select a direction that leads exist.
Pin Location
Select the pin location from "Symmetric to Rotation", "Reverse" or "Asymmetry".
Pin Offset Type
Select "Normal" or "Reverse". Select "Reverse" for parts with terminals located at four corners.
Lead Thickness (mm)
Enter the lead thickness.
Lead (mm)
Appears when selecting the lead part.
If created the part data by pressing the [Make Parts] button, the lead width and the length when created are displayed.
Termination (mm)
Appears when selecting the chip part.
If created the part data by pressing the [Make Parts] button, the termination width and the length when created are
displayed.
3-13
Pad (mm)
If created the part data by pressing the [Make Parts] button, the pad width and the length when created are displayed.
Lead Offset X (mm)
Enter the X coordinate value of the lead offset from the center of the parts.
Lead Offset Y (mm)
Enter the Y coordinate value of the lead offset from the center of the parts.
Lead Offset
■ Example of 4 direction leads ■ Example of upper and lower

and symmetry part leads and asymmetry part
Upper lead offset
3
(red [+])
Lead offset (red [+]) Lower lead offset (red [+])

24369-P7-10
Lead Pitch (mm)

Enter the lead pitch.
Lead Count/Direction
Enter the number of leads of each side.
Start Pin Number
Set the first pin number of each side.
Mask Pin Offset Number
Enter the pin number that is not inspected.
Mask Pin Count Type
Select "Use" or "Don't use". Select "Use" when counting the mask pin number.
■ Body ■ Neighbor of Parts
24354-P7-10
Body Sizes X, Y and Z (mm)

If pressing the [Size Teaching] button and dragging the body on the part image, the values will be entered in the Body
Sizes X and Y.
Neighbor Type
Select the inspection direction from "Vertical Directions" or "Horizontal Directions". If not setting it, select "Not Set".
Pin Location
Select the pin location from "Point Symmetry" or "Asymmetry".
3-14
2.2 Checking libraries
The libraries for inspecting general, standard parts were set up at shipment. The settings may need to be
changed for use according to the actual inspection parts. This section describes how to perform a test (multi-
test) of deployed parts libraries so as to change the settings.
1 Select parts of the library to be checked.

Select relevant parts on the "Mount" screen and open the "Parts" screen.
2 Perform a multi-test.
Press the [Multi] button in the "Tuning" tab to perform a multi-test.
For details about the multi-test, see "Multi-Test" in "2.4.5 Step Tuning" of this Chapter.
3 Change each parameter.

Click the step that is judged NG and select relevant step. Change the parameters, such as step detec-
tion conditions or judgment conditions so that the parts are judged correctly.
For details about how to set Inspection Type, see Chapter 4, "Setting Inspection Type".
3
TIP
When pressing the [Analysis] button, the "Detection value graph" screen appears. The test results of the step with the
same conditions as the selected step are displayed graphically on this screen. Refer to this graph when correcting the
parameters.
3-15
2.3 Parameters
This section describes each parameter of steps that are the minimum unit of libraries. The contents of the
parameters may vary depending on the Inspection Type and Algorithm. For details about how to set parameters
for each Inspection Type, see Chapter 4 "Setting Inspection Type". Check each parameter on the [Data Edit] –
[Parts] screen.

Sets the step basic information.
Basic parameters
Example of Inspection Type "Missing Component" - Algorithm "Body"
3
24301-P7-10
Inspection Type Algorithm Basic parameter Description
Step Displays the step number selected in "Inspection Information".

Displays the Inspection Type of the selected step.
Inspection Type To change the Inspection Type, select a desired type from the drop-
down list.
Displays the Algorithm of the selected step.
Algorithm To change the Algorithm, select a desired Algorithm from the drop-
down list.
Displays the center X coordinate for the selected step.
Step Center X (mm)* 1
Common Common The step center X coordinate can also be entered.
Displays the center Y coordinate for the selected step.
Step Center Y (mm)* 1
The step center Y coordinate can also be entered.
Displays the step entry angle.
Entry Angle
To change, select from the drop-down list.
Displays the X width for the selected step. The X width can also be
Step Size X (mm)
entered.
Displays the Y width for the selected step. The Y width can also be
Step Size Y (mm)
entered.
Component Body
Parts Position Align Always "Enable"
Shifting Termination
• Part center symmetry
The position to compare luminance is the symmetric position
Reversed Compare
referencing the center of the part.
Polarity Luminance
• Any position
Designate any position to compare luminance.
Compared position
• Part center symmetry
The position to compare height is the symmetric position
Body Lifting Compare
referencing the center of the part.
Lifted Lead Height* 2
• Any position
Designate any position to compare height.
Reversed Compare This appears when selecting "Any position" in "Compared position".
Polarity Luminance Compared positions Enter the X/Y coordinate of the position for "Compare Luminance".
Body Lifting Compare X and Y(mm) This appears when selecting "Any position" in "Compared position".
Lifted Lead Height* 2 Enter the X/Y coordinate of the position for "Compare Height".
3-16
Inspection Type Algorithm Basic parameter Description
Pin No. Displays the pin number of the selected lead.
Both End Pin Offset Select "Use" or "Don't Use" in "Both End Pin Offset".
Both End Pin Offsets This appears when selecting "Use" in "Both End Pin Offset".
Lead group Lead group
X and Y(mm) Enter the X/Y offset amount of the pin at both ends.
common common
Both End Pin Size Select "Use" or "Don't Use" in "Both End Pin Size".
Both End Pin Sizes X This appears when selecting "Use" in "Both End Pin Size".
and Y(mm) Enter the X/Y sizes of the pin at both ends.
Lifted lead Solder
Lifted lead Laser Use: Inspects all the pins.
Pin Expand
Datum Height Measurement* 3 Don't use: Inspects only the pin at the step position.
Point 3D Height* 2
* 1 The step center X/Y coordinate means the distance from the step center of Step Number 1 of "Body" of "Partial Information".
* 2 This function is only available for the inspection machine equipped with the 3D projector unit (option) and for the offline software iPro (option).
* 3 This function is only available for the inspection machine equipped with the laser height unit (option).
3-17
2.3.2 Sampling parameters
Set the lighting and threshold values to display the inspection target object in red.
Select the light that the contrast of the inspection target object is strong in order to recognize the inspection
target object.
Sampling parameters
Light Sampling Type: Luminance Light Sampling Type: Color
1
2
6
5
7
3 8
4 4
3
9
*
Light Sampling Type: Shape Light Sampling Type: Height
10
3
4
* This appears if the machine is equipped with the projector (option).

Light Sampling Type: Compatible
12
11
24302-P7-10
1 Multiple sampling conditions button

When setting multiple sampling conditions, select the number that is grayed out and set "Use".
For details, see "Multiple setting of sampling conditions" in "Section 2.4.1 Sampling conditions (based on light sampling
type)" in this Chapter.
2. Light Sampling Type
Selects the sampling type used when performing inspection.
Luminance: Samples the area with the specified luminance to set it as inspection object.
Color: Samples the area with the specified color to set it as inspection object.
Example: Detecting exposed copper and foreign object, etc.
Shape: Samples the area with the specified shape to set it as inspection object.
Example: Fillet solder quantity inspection
Height* : Samples the area with the set height to set it the inspection object.
Compatible: Used for tuning of inspection programs created with version V2.1.
3. Setting list (luminance and height*)
Sets the Sampling Light, Reduced Light, Noise Cut, Reduced Light Ratio, Thresh Upper Limit, Thresh Lower limit, Height
Threshold Max.* and Height Threshold Min.*.
3-18
4. Threshold slide bar
Uses the mouse to drag the threshold slide bar to adjust only the detection object appears in red.
5. [Sampling Light] button (color and shape)
This is used to set the sampling light for inspection. By pressing this button, a sampling light selection dialog box
appears. Select the image in which the contrast of the object being inspected is strongest, and then press the [OK]
button. The selected sampling light is set in the "Sampling Light" field.
6. Noise Cut (luminance, color and shape)
Selects the size for cutting the influence of noise. Regarding the luminance and the height*, the "Noise Cut" is in the set
value list.
7. [Detail] button (luminance, color and shape)
This button is used to set the sampling light or reduced light. Press this button to open the setup screen, allowing you to
select the lighting or set the threshold value.
See "Light detail setting" in "Section 2.4.1 Sampling conditions (based on light sampling type) in this chapter for more
details of the setting screen.
8. [Sampling Lib] button (luminance, color and shape)
Press this button to open the [Sampling Library] screen, allowing you to set the saved sampling conditions or register the
set sampling conditions. For details, see "2.4.9 Utilizing sampling Lib" in this Chapter.
9. [Sampling] button (color, shape and height*)
3
Pressing this button opens the "Spuit Sampling Setting" screen. Select the size of syringe and press the [Sampling] button.

Then, click on the area to detect on the parts image to make it appear in red. For details, see "Light detail settings" in
"Section 2.4.1 Sampling conditions (based on light sampling type)" in this chapter.
10. Sampling height slide bar (height*)
While holding the [3D] button and [Detected] button, use the mouse to drag this slide bar to adjust only the detection
object appears in red.
11. Light Type
Select the light type from the drop-down list.
12. [Light List] button
Select the image for inspection from the displayed "Light List".
3-19
2.3.3 Detect parameters
Set the inspection conditions for the inspection object displayed in red.
TIP
The displayed parameters differ depending on the Inspection Type and the Algorithm. For details on parameter
settings for each type, see Chapter 4, "Setting Inspection Type".
Detect parameters
Example of Inspection types "Missing Component" and "Bridging"
■ Inspection Type "Missing Component" ■ Inspection Type "Bridging" [Set Area] button
Algorithm "Body" Algorithm "Foreign Object"
3 Inspection Type Algorithm Detect parameter Description

24303-P7-20
Area Detection Select "Auto" or "Manual" to set the minimum size of the inspection
size object.
Min Detect Sizes This is displayed when "Manual" is selected in "Area Detection size".
X and Y (mm) Set minimum detection sizes X and Y for the object to be inspected.
Position Align
Select the reference position to align.
Type
This becomes enabled when selecting a setting other than "Don't
use" in "Position Align Type".
Common Common The position is corrected according to the "Component Shifting"
inspection results of this part.
• STD.
Position Align-
The inspection position of the step is corrected.
Method
• Change Step Size
The inspection position of the step is corrected, however it is not
corrected toward the outer periphery of the part.
• Mask Align
Only the mask position set in the Option parameter is corrected.
Missing Set an area to be inspected. The area where the step frame is
Body
Component Search Area (mm) enlarged by the set value in the vertical and horizontal directions is
Reversed Polarity Shape inspected.
This is displayed when "Manual" is selected in "Area Detection size"

Component
Termination Measure Method Select to measure either the inside distance of the termination or the
Shifting
outside of it.
Compare
Reversed Polarity Luminance
Compare Height* 1
Select the method of calculating the luminance at the time of
Upside Down
inspection.
Lead Shift
Luminance
Insufficient
Measure Method
Wetting
Datum Height Laser
Select the method to obtain the datum height.
Point Measurement* 2
Body Lifting
3D Height* 1
Chip Tombstoning Select the method to calculate the height measurement value
Compare Height* 1
Lifted Lead
This is displayed when "Manual" is selected in "Area Detection size"
Character Sizes X
Character Set minimum detection sizes X and Y for the object to be inspected.
Misplaced and Y(mm)
If the size is unknown, select "AUTO".
Component
Set the registered pattern index number.
Reversed Polarity
Pattern Pattern Index The inspection is performed while comparing to the pattern index
number set here. For details, see "2.6 Pattern" in Chapter 4.
3-20
Inspection Type Algorithm Detect parameter Description
Foreign Object
Bridging
4D Foreign Object*3 Foreign Object Enter the luminance difference between the object to be detected as
Pin Hole Level foreign object and the surrounding in a range of 0 to 255.
Foreign Object
Solder Beadig
Datum Height Select the laser beam reflection direction (angle) when the laser unit
Point Measure Angle is rotated to measure the height. When selecting "AUTO", the laser
Laser
Body Lifting reflection direction is the outer direction of the parts.
Measurement* 2
Chip Tombstoning
Retry Set whether to retry the height measurement or not.
Lifted Lead
Select the method of measuring datum height.
• Inside Step Frame
Datum Height The height in the step is determined to the standard.
3D Height* 1 Measuring Method
Point • Using Height Information
The height set in the "Datum Height" sub tab of the "Height" tab
is determined to the standard.
• Point measurement
3
Measures the height of the coordinate position of the step center.
Measure Type
Body Lifting • Line measurement
Laser
Chip Tombstoning Measures the height along the longitudinal centerline of the step.
Measurement* 2
Lifted Lead This is displayed if "Line measurement" is selected for the Measure
Sampling Pitch
Type.
(mm)
Sets the pitch to perform height measurement by Laser unit.

*1
This function is only available for the inspection machine equipped with the 3D projector unit (option) and for the offline
software iPro (option).
*2
This function is only available for the inspection machine equipped with the laser height unit (option).
*3
This function is only available for the inspection machine equipped with the 4D angular camera (option).
[Set Area] button

Registers patterns to be used for the "Pattern" inspection. For details, see "2.4.3 Pattern registration" in this Chapter.
3-21
2.3.4 Judge parameters
Set the criteria of the OK/NG judgment for the inspection objects detected by the detection conditions.
TIP
settings for each type, see Chapter 4 "Setting Inspection Type".
Judge parameter
Example of Inspection Types “Component Shifting” and “Misplaced Component”
■ Inspection Type: “Component Shifting” ■ Inspection Type: “Misplaced Component”
Algorithm: “Body” Algorithm: “Character”
[All set] [OCR Reg.]
3
button button
24304-P7-20
Inspection Type Algorithm Judge parameter Description

When the ratio of the detected area to the step area is the set value
Required Area Ratio (%) ≥
or above, this is judged OK.
Permissible Area Ratio When the ratio of the detected area to the step area is the set value
(%) ≤ or below, this is judged OK.
Common Common
Set the tolerable deviation amount that the side of the recognized
area protrudes from the step frame. The detection area within the
Offset Limits N - W (mm)
tolerable deviation amount is subject to the area calculation. Make
the settings according to the parts size and pattern design.
Body When the θ-shifting of the detected parts is the set value or less,
Alignment (Deg)
this is judged OK.
Sets the minimum distance between the terminations that is to be
Component Min distance (mm)
judged OK.
Shifting Termination
Sets the maximum distance between the terminations that is to be
Max distance (mm)
judged OK.
Position Shift Check When the detected component shifting exceeds the tolerable
Long Lead Shape Tolerances X and Y (mm) dimension, this is judged NG.
Inspection Character
Enter the character string described on the correct parts.
String
Select the character type described on the correct parts from
OCR Type "Alphanumeric", "Letters", or "Numbers".
Regarding alphabet, only capital letters can be recognized.
• Full
When the recognized character strings all perfectly match the
Character inspection character string, this is judged OK.
Match Type
• Partial
When the recognized character string include the inspection
Misplaced character string, this is judged OK.
Component
• Characters score
Judged based on the recognized score.
Char Judge Type
Reversed • First candidate
Polarity Judges based on the character with highest score.
This is displayed when "Characters Score" is selected in "Char
Judge Type".
After the step test has been completed, press the [Measurement
Character
Result] button to display the list of characters that is recognized. The
list displays the characters scores for the respective characters.
Min Score
Enter the minimum score that can be judged OK.
After the step test is completed, press the [Measurement Result]
button to display the list of characters that is recognized. The list
Pattern
displays the characters scores for the respective characters.
3-22
Character • NON
Performs inspection only by the "Entry Angle" of the basic tab.
This also inspects the mount angles.
Misplaced • Permit 180 degree
Component Select this setting for parts such as chip resistors that have no
Permissible Rotation
Pattern problem even when rotated 180 degrees.
• Permit All
Reversed
Select this setting when only the presence of character string
Polarity
entered in "Inspection Character String" regardless of the character
angles.
Character User Font Group Specify the font group to be referred to.
• Size
Performs the inspection by comparing the dimensions of the
recognition area with the step dimensions.
• Circularity
Inspects how much the perimeter of the detected area is
3
misaligned with the true circle.
Inspection Shape
• Convexity
Inspects the smoothness of the perimeter of the detected area.
• Aspect ratio
Inspects the aspect ratio (%) of the recognition area. The reference
Reversed direction (vertical or horizontal) of comparison differs based on the
Shape
Polarity selection of "Entry Angle".

These settings are enabled when selecting a setting "Size" in
"Inspection Shape".
Tolerances X and Y
When the recognition area is within the dimensions, for which the
(mm)
dimensional tolerance has been increased or decreased for the step
size, this is judged OK.
Enter the minimum match ratio for the system that is to be judged as
Min Match Ratio (%)
OK.
Enter the maximum match ratio for the system that is to be judged
Max Match Ratio (%)
OK.
Reversed Compare Set which is brighter the luminance of that particular step (main) or
Polarity Luminance its object position (sub).
Light intensity type
Set which is brighter the luminance on the top surface or the
Upside Down Luminance
luminance on the back surface of that particular part.
Reversed Compare Set the minimum luminance difference between the step (main) and
Required Difference
Polarity Luminance the symmetrical position (sub).
Upside Down Luminance Required Level ≥ Set the minimum luminance difference that is judged OK.
4D Foreign
Bridging • Judge by both sizes
Object *1
When both sizes X and Y of the foreign object are NG, this is
Bridging Judge Size Condition judged NG.
Pin Hole Foreign Object • Judge by either size
Solder Beadig When size X or Y of the foreign object is NG, this is judged NG.
4D Foreign
Bridging
Object *1
FOD Sizes Sets the minimum sizes X and Y for the system to judge one as a
Bridging
X and Y (mm) ≥ foreign object.
Pin Hole Foreign Object
Solder Beadig
4D Foreign
Bridging
Object *1
Exclude Sizes Sets the minimum sizes X and Y that are excluded from the foreign
Bridging
X and Y (mm) > object judgment.
Pin Hole Foreign Object
Solder Beadig
Sets the maximum luminance level for the system that is to be
Lead Shift Luminance Permissible Level ≤
judged OK.
Both side level ≥ Set the minimum luminance level at both ends and the maximum
luminance level at the center.
Insufficient
Luminance When the inspection at all these three locations turns out to be NG,
Wetting Central level ≤
this is judged NG.
When any one of them is OK, this is judged OK.
3-23
Set which is higher the height of step (main) or symmetrical position

Height and low type
Reversed Compare height (sub).
Polarity Height *2 Set the minimum height difference between the step (main) and the
symmetrical position (sub).
Required Difference
When the difference between the measured height of the inspection
Laser (mm) ≥
object and the datum height is at the set value or above, this is
Measurement *3
Body Lifting judged OK.
Chip Laser
object and the datum height is at the set value or below, this is
Tombstoning Measurement *3
Permissible Difference judged OK.
Lifted Lead (mm) ≤ Set the maximum height difference between the step and the
Compare
symmetrical position. When the measured height difference is at the
Height *2
set value or below, this is judged OK.
Body Lifting
Required Height (mm) ≥ object and the datum height is at the set value or above, this is
Chip judged OK.
3
3D Height *2
Tombstoning When the difference between the measured height of the inspection
Permissible Height
object and the datum height is at the set value or below, this is
Lifted Lead (mm) ≤
judged OK.
Wetting Required Area When the ratio of the detected wetting area to the step area is the
Ratio (%) ≥ set value or above, this is judged OK.
No Wetting Permissible When the detected no wetting area is the set value or below, this is
Solder Fillet 3D Solder *2

Area Ratio (%) ≤ judged OK.
When the detected solder volume is at the set value or above, this is
Required Volume (%) ≥
judged OK.
Insufficient Required Area Ratio When the ratio of the detected area to the step area is the set value
4D Solder *1
Solder (%) ≥ or above, this is judged OK.
*1
*2
This function is only available for the inspection machine equipped with the 3D projector unit (option) and for the offline software iPro
(option).
*3
[All Set] button

Pressing this button sets the selected displacement value for other directions also.
[OCR Reg.] button
This button appears when selecting the "Character" from Algorithm.
Registers an original character font as the character recognition font for each user. For details on the character
registration method, see section 2.4.2, "Registering user characters", in this chapter.
3-24
2.3.5 Option parameters
These parameters specify option settings for inspection steps.
TIP
settings for each type, see Chapter 4 "Setting Inspection Type".
Option parameters
Example of Inspection Type "Missing Component" - Algorithm "Body"
[Mask Add] button
3
[Mask Teach] button

24305-P7-10
Inspection item Algorithm Item Description
Specify the step No. to be inspected next when the judgment result
OK Jump
is "OK".
Specify the step No. to be inspected next when the judgment result
NG Jump
is "NG".
Enter the NG (fail) reason to display during automatic inspection
when the judgment result is "NG".
NG Reason
Maximum number of characters: 14 alphanumeric characters or 14
full-width characters. The space can not be entered.
• Disable
Does not perform inspection mask function.
• Include
Mask Type Always detects areas enclosed with a mask.
Common Common • Exclude
Does not include areas enclosed by mask in the inspection.
For details, see section 2.4.4, "Mask function", in this manual.
This appears when selecting "Include" or "Exclude" in "Mask Type".
Mask Shape Select the mask type from "Rectangular" and "Circle".
If not used, select "No Use".
Mask Center Offsets Sets the X and Y offset values from the step center to the mask
X and Y (mm) center.
Mask Sizes X and Y
Sets the mask sizes in the X and Y directions.
(mm)
Sets the lighting when sent images to the Repair Judgement Station
Ng Image Out
(option).
Misplaced
For the inspection step with this parameter set to "Enabled", the
Component Inspect Only First
Character inspection perform under the conditions "Inspect Only First Part" of
Reversed Parts
"Board" tab.
Polarity
[Mask Add] button

When selecting "Include" or "Exclude" in the "Mask Type", pressing this button to add a mask. Up to three masks are
added.
[Mask Teach] button
When pressing this button enables to edit masks such as moving a mask or changing sizes.
For details on operation, refer to "2.4.4 Step Mask function" in this Chapter.
3-25
2.4 All functions
2.4.1 Sampling condition (based on light sampling type)

To recognize the inspection object to be inspected, there are four kinds of methods available, "Luminance",
"Color", "Shape" and "Height (option)". Select the lighting to be used for the inspection and set the threshold
value to display the inspection object in red.
■ Luminance
Samples detection objects in region of specified luminance, and uses them as the object of inspection.
Open the "Sampling" tab and select "Luminance" for the "Light Sampling Type".
1 Selects the sampling light.

Sampling light is the lighting used for inspection. Use the following procedure to select the sampling
light.
1. Press the [Detail] button to open the "Luminance" screen.
3
2. Press the [Sampling Light] button to open a sampling light type screen, and select up to two images
that show the inspection object with strong contrast. The name of the selected images and compos-
ite image of the selected images appears in the lower right. This image is used for inspection.
3. Press the [OK] button to save the settings.

Sampling light
Select Luminance. Sampling tab
[Sampling Light] button [Detail] button
Select the image(s).
Image name
Composite image
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3-26
2 Selects the reduced light.
Reduced light is lighting for images excluded from images used for inspection. (Reduced lighting does
not have to be selected.) Use the following procedure to select the reduced light.
1. Press the [Reduced Light] button at the "Luminance" screen to open the light sampling type screen.
2. Select one image with strong contrast other than the object to be inspected and press the [OK]
button.

Reduced light

Image name
Select the image. Selected image

24307-P7-10

1. Press the [Sampling] button.
2. Click the location to be detected in the upper left image. The clicked luminance is plotted with red
dots in the upper right image.
3. Select the "Sampling Type" - [Remove] radio button, and click the location that is not to be detect-
ed. The clicked luminance is plotted with blue dots in the upper right image.

Threshold value
Click the detection location. Detected location (red)
Undetected location (blue)

Undetected location
Sampling Type
[Sampling] button
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4. Press the [Sampling] button again to end sampling.
3-27
5. Press the [Detected] button to verify the area sampled and shown in red in the upper left image.
The luminance area shown in gray in the drawing upper right is sampled and shown in red. Move the
threshold slide bar and drag the gray area to change the angle (if reduced light is selected) so that
only the detection object is shown in red. If the gray area is changed and the angle changed, the
reduced light magnification is also changed.

Threshold value
Threshold slide bar
[Reduced Light] button
Drag this to change.
Sampling image
3
[Detected] button
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TIP
Adjustment is also possible without performing sampling by adjusting the threshold slide bar or changing the angle of
the gray area. The reduced light magnification value can be changed by pressing the [Reduced Light] button and
entering the magnification directly.
4 Press the [Set] button to save the settings.

By pressing the [Set] button, the display returns to the "Step" screen.
3-28
■ Color
Samples detection objects in region of specified color, and uses them as the object of inspection.
Open the "Sampling Conditions" tab. Select "Color" from "Sampling Light Type" to set each parameter.

1. Press the [Detail] button to open the [Color] screen.
2. Press the [Sampling Light] button. From the sampling light list, select one image that shows the
inspection object with strong contrast.
3. Press [OK] Button to save the settings.

Sampling light
Select Color.

[Detail] button
[Sampling Light] button
Select the image.
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3-29
1. To delete the existing threshold value settings, press the [All Clear] button.
3. Click the location to be detected in the upper left image. The location with same color as the
clicked location is shown in red.
4. When a most area of the part being sampled turns red, press the [Sampling] button again to end
sampling.
5. Move the three threshold slide bars to adjust the threshold value until only the inspection object is
shown in red. The area shown in red with Green Ratio, Red Ratio, and Luminance images is shown in
red in the upper left of the image.

Threshold value
3 Click the detection location.

Threshold slide bar
[Sampling] button [All Clear] button

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TIP
Without performing sampling, you can adjust it with the threshold slide bar.
3-30
■ Shape
The area is sampled for the inclination, such as fillet, and then it is determined to the inspection object.
Open the "Sampling" tab and select "Shape" from "Light Sampling Type" to set each parameter.

1. Press the [Detail] button to open the [Shape] screen.
2. Press the [Sampling Light] button on the "Shape" screen to select one image that shows the
inspection object with strong contrast from the sampling light list. (Hb+Mg+Lr Ver2 should normally be
selected.)
3. Press the [OK] button.
Light Sampling Type: Shape

Sampling light
Select Shape.

[Sampling Light] button [Detail] button
Select the image.
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3-31
1. To cancel the existing threshold value settings, press the [All Clear] button.
3. Click the location to be detected in the upper left image.
The location with the same inclination as the clicked location is shown in red.
4. When most of the part being sampled turns red, press the [Sampling] button again to end sampling.
5. Move the three threshold slide bars to adjust the threshold value until only the inspection object is
shown in red. The area shown in red with Green Ratio, Red Ratio, and Luminance images is shown in
red in the upper left of the image.
Light Sampling Type: Shape

Threshold value
3 Click the detection location.
Threshold slide bar

[Sampling] button [All Clear] button

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TIP
Without performing sampling, you can adjust it with the threshold slide bar.
3-32
■ Height (option)
The area with the set height is sampled on the data captured by the machine equipped with a 3D projector (op-
tion), and then it is determined to the inspection object.
1 Select [Height] from [Light Sampling Height].

2 Set the sampling height.
Operate the sampling height slide bar or press the [Sampling] button to set this parameter.
Using the slide bar:

1. Press the [3D] button.
2. Press the [Detected] button.
3. Move the sampling height slide bar to make the adjustment so that only the detection object is
displayed in red.
The adjusted values enter "Sampling Height Upper Limit" and "Sampling Height Lower Limit".
3
Light Sampling Type: Height
Setting with the sampling height slide bar
[Detected] button Select Height.

[3D] button Sampling height slide bar
Sampling Height Upper Limit / Lower Limit
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[3D] button image
Detected (red)
Sampling Height Upper Limit
Sampling Height Lower Limit
Solder Solder
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3-33
When using the [Sampling] button
1. Press the [Sampling] button to open the [Spuit Sampling Setting] screen.
2. Press [All Clear] button when deleting the existing sampling height settings.
4. Click the location to be detected on the part screen. The location with same height as the clicked
location is shown in the sampling color selected in 3.
5. When all the areas to be detected turned the sampling color, press the [Set] button to save the
settings.
Light Sampling Type: Height

Setting by the [Sampling] button
[All Clear] button
3
[Set] button
[Sampling] button
Click the detection location. Noise cut

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TIP
3 Set the noise cut as needed.

If the noise affects adversely, select the size to shut off the noise.
3-34
■ Multiple setting of sampling conditions
By setting up to 5 different sampling conditions for a single step, sampling can be performed under the optimal conditions.
When newly setting
1 Open the "Sampling" tab on the [Parts] screen.

2 Set the multiple sampling conditions to [Use].
Select the multiple sampling conditions buttons [2], [3], [4], and [5] for the number of sampling condi-
tions to be set, and then set "Use".
3 Set the parameters of the multiple sampling conditions.

See "2.4.1 Sampling conditions (based on light sampling type)" in this Chapter to set the parameters of
each multiple sampling conditions.
Multiple setting of sampling conditions

When newly setting
3
[Sampling] tab
Select “Use”. [Multiple setting of

sampling conditions] buttons

Set each parameter.
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When setting by editing the existing sampling conditions
1 Open the "Sampling" tab on the [Parts] screen.

2 Copy the existing sampling conditions.
1. Select the [Multiple setting of sampling condition] button of the existing sampling conditions and right-click.
2. When the context menu appears, select "Copy".
3 Paste the copied sampling conditions.

1. Select the [Multiple setting of sampling condition] button to be pasted and right-click.
2. If selecting "Paste" from the displayed context menu, the copied sampling conditions will be pasted.

When setting by editing the existing sampling conditions
[Sampling] tab Select “Copy”.
Select “Paste”.
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4 Edit the sampling conditions as needed.

c CAUTION
Auto inspection inspects all sampling conditions. When any of the sampling condition is judged OK, the inspection
result becomes "OK". When testing by pressing the [Step] button on the [Parts] - [Turning] tab screen, the test is
performed only with the selected sampling conditions.
3-35
■ Light detail settings
By pressing the [Light Detail] button on the luminance, color, and shape screens, the following light detail
settings screens are displayed. This section describes all items set at these screens.
Sampling conditions parameters

Light detail settings screens
Light Sampling Type: Luminance Light Sampling Type: Color
2 3 4 5 6 2 4
3
Light Sampling Type: Shape 8 9
10 11
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1. Sampling
Size of Syringe
Select the size of the syringe used for sampling.
Sampling Type
Sets whether to sample a detected point, or excluded point.
[Sampling] button
Press this button and click the screen to display values (luminance, color, shape) for the clicked location in a graph.
[Clear] button
Clears the last sampled data.
[All Clear] button
Clears all sampled data.
2. [Sampling Light] button (luminance, color, shape)
Sets the sampling light. By pressing the [Sampling Light] button, a sampling light type dialog box appears. Select the
image with strong contrast other than the inspection area from the image list, and then set it.
Luminance : The image is selected from ten types, including H RGB, M RGB, L RGB, and Uir (infrared).
Up to two images can be selected.
Color : The image is selected from three types: H, M, L.
Shape : The image is selected from four types: Hr+Mg+Lb, Hb+Mg+Lr, Hb+Mr+Lg, Hb+Mg+Lr Ver2
Hb+Mg+Lr Ver2 should normally be selected.
3-36
3. [Reduced Light] button (luminance)
Sets the reduced light. (Reduced light does not have to be selected.)
If setting the reduced light, a sampling light type dialog box appears when the button is pressed Select an image from the
image list in which the area to be reduced with strong contrast.
Luminance : The image is selected from ten types, including H RGB, M RGB, L RGB, and Uir (infrared).
4. Threshold slide bar
Adjust the threshold by dragging with the mouse.
5. Noise Cut
Selects the size for cutting the influence of noise.
6. Reduced Light
Sets the reduced light magnification selected when processing image calculations. By pressing this button, a dialog box
appears, allowing an arbitrary value to be entered for the reduced light magnification.
7. Threshold value range
The position for the luminance level displayed in gray is shown in red when the [Detected] button is pressed. If reduced
3
light is set, the reduced light magnification is adjusted by dragging the gray area.
8. [Insp. Img] button
The inside of the step in the upper left image is displayed with image to be inspected.
9. [Detected] button
Displays the detected area in red.

10. [Set] button
Sets the content set here.
11. [Close] button
Closes the "Luminance" screen without saving settings.
3-37
2.4.2 Registering user characters
In the "Character" detection of "Algorithm", the inspection is performed while comparing the character with
that has been registered in "character template" beforehand.
This function registers characters that are not registered in "character template" to make the "Character"
detection specific to the parts possible.
■ Registering new characters

This section describes how to register new characters in "Character Template".
1 Create the "Character" step.

1. Select "Body" in "Partial Information" and press the [Create] button in "Inspection Information".
2. Select "Misplaced Component" or "Reversed Polarity" and press the [OK] button. The new step is created.
3. Set the Algorithm to "Character".
Creating a "Character" step
3
An example of Misplaced Component
Select "Body" [Create] button
Tick the checkbox of "Misplaced Component".

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2 Set the sampling conditions.

1. Drag the mouse on the parts image to enclose the characters to be recognized.
2. Set the sampling conditions parameters.
Normally, set "Sampling Light Type" to the luminance and auto threshold value to "Use".
Setting "Sampling" parameters

Character
Enclose the characters to be recognized. Select "Luminance" Auto Thresh

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3-38
3 Open the "Judge" tab.
4 Press the [OCR Reg.] button.
An "OCR data registration" screen appears.
"OCR data registration" screen

[Judge] tab
[OCR Reg.] button

3

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5 Perform OCR recognition.

1. Use the threshold slide bar to set the threshold value and show the characters in red.
2. Select the character type from "Cap.&Num.", "Cap.", or "Num." (alphanumeric, alphabet, numeric.)

OCR recognition settings
Display characters in red.
Set the threshold value.
Select the character type.

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3. Press the [Recog. OCR] button to display the recognition result for the recognized characters.

OCR recognition results
Display the recognized

characters.
[Recog OCR] button
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3-39
6 Select the characters to be registered.
1. Click the characters to be registered. If selecting multiple characters, click the detection field while
holding down the [Ctrl] key. The selected character(s) are displayed on the [Set Edit Image] button.
2. Press the [Set Edit Image] button to display the character image on the "Edit Template" screen.

Character selection
Display the selected character(s). "Edit Template" screen
3
Select the character(s). [Set Edit Image] button
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After checking the box for "Auto Mask" and pressing the [Set Image Edit] button, the "Exclude" mask is set in the cell
that is adjacent to the recognized characters.
7 Correct the character image in the "Edit Template" screen.

1. Select the size and shape of the cell to be edited in the "Pen Type" field.
2. Select the mode from the mode field. Click the cell to be edited, and arrange the characters to be
registered.
The cell that is clicked after selecting "Set" is added to the registered characters.
The cell that is clicked after selecting "Reset" is deleted from the registered characters.
The cell that is clicked after selecting "Mask Set" is set to the mask (exclude).
The cell that is clicked after selecting "Mask Reset" is cancelled from the mask (exclude).

OCR recognition character image correction
Click a cell and arrange the character.
Select the pen type.
Select the mode.
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3-40
8 Register the corrected image.
1. Enter the character to be registered in "Register Char." The characters that can be registered are as
follows.
Alphabet characters: A to Z
Numeric characters: 0 to 9
2. Specify the "User Font Group". If adding to a group that has also been registered, select from the
drop-down list. If registering a new group, enter the group name directly.

Character registration
Display the image to

be registered.
Enter the character to

be registered.
3
[Save] button

Specify the group to be registered.
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3. Check the image to be registered, and press the [Save] button.

The confirmation dialog box appears. Check the contents. If all right, press the [Yes] button.
The following message appears when registration is complete. Press the [OK] button to close the
dialog box and return to the original screen.

Registration complete message
9
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9 Close the [OCR Data Registration] screen.

Press the [Close] button to return to the [Parts] screen.
0 Save the registered character data.

TIP
If registering a library for a part containing step data ("Character" detection) using a user template, the user template
is also registered in the library.
3-41
■ Editing registered characters
When registering user characters, characters that have already been registered can be edited and then regis-
tered in a template. The procedure is as follows.
1 Select the character to be edited.

1. Select "All" for the "Displayed Font Type", and select the character to be edited at "Disp Char."
2. Select the character to be edited from the font list.

Select the character to be edited.
3
Select the displayed font type
and display character.
Select the font.

24325-P7-10
2 Press the [Set Edit Image] button at the bottom right of the screen.
The selected character is displayed in the "Edit Template" screen.
3 Edit the image.

Select the pen type and mode to edit the image.
4 Register the character.

When editing is complete, set the character to be registered and the user font group, and then press
the [Save] button. When registration is complete, the character is displayed in the registered template
character list.

Registered image editing
Correct the image.
Set the image to be

registered and group.
[Save] button
[Set Edit Image] button
5
Display the registered character.
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3-42
5 Close the [OCR Data Registration] screen.
6 Save the registered character data.

■ Registered character matching

This section describes the procedure for checking how well the selected character matches the registered character.
1 Perform OCR recognition.

1. Use the threshold slide bar to show the characters in red.
2. Press the [OCR Reg.] button to have the OCR recognize the characters.
2 Select the character to check for a match.
3
3 Press the [Cal. Match] button
The match between the character to be checked and the registered character is displayed.

Match check

Select the character.
[Cal. Match] button
Displays the match.

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2.4.3 Pattern registration
In the "Pattern" of "Algorithm", the inspection is performed while comparing the pattern with the
pattern information that has been registered beforehand.
As the patterns specific to the parts are registered, the "Pattern" recognition becomes possible.
1 Create the "Pattern" step.

1. Select "Body" in "Partial Information" and press the [Create] button in "Inspection Information".
2. Select "Misplaced Component" or "Reversed Polarity" and press the [OK] button. The new step is then
created.
3. Set the Algorithm to "Pattern".
Creating the "Pattern" step

Example of Misplaced Component
Select "Body" [Create] button
3
Tick the checkbox of "Misplaced Component".

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2 Set the sampling conditions.

1. Drag the mouse on the parts image to enclose the characters to be recognized.
2. Set the light sampling type to "Luminance" and select a sampling light.
Setting "Sampling" parameters

Pattern
Enclose the area to be recognized. Select "Luminance". Select Sampling Light.

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3-44
3 Open the [Set Area] screen.
1. Open the "Detect" tab.
2. Press the [Set Area] button. The [Set Area] (pattern registration) – [Set Area] (creating new) tab
appears.
4 Create the pattern newly.

1. Enclose the area where the pattern is registered.
2. Enter characters to be registered in the "Pattern String" area. The number of characters to be
registered is the same as the number of recognition characters.
TIP
Where registering the polarity mark as a pattern, select the [Polarity Mark Registration] radio button. Enter the number
of polarity marks to be registered in "Number of Registered Polarity marks".
3. Press the [Set Area] button to move to the [Set Area] tab.
"Set Area" screen

"Input Image" tab
[Input Image] tab Enter pattern character string. [Detect] tab 3

Enclose the registration area. [Set Area] button 3
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5 Press the [Write Pattern] button.

The pattern you have created is then registered.
"Set Area" screen

"Set Area" tab
[Set Area]
button
[Write Pattern] button
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3-45
6 Check the registered pattern data.
The "Regist Pattern" tab appears. Check the contents.
"Set Area" screen

"Regist Pattern" tab
[Regist Pattern] tab
3
7
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7 Close the [Set Area] screen.

8 Save the registered pattern data.

TIP
For details about how to set the parameter of the steps, see "2.6 Pattern recognition" in Chapter 4.
3-46
2.4.4 Step Mask function
The step mask function involves creating a mask area inside a step, and specifying whether or not to detect the
created mask area when performing inspections.
For example, when "Inspection Type" is "Missing Component" and "Algorithm" is "Body", and the main body
cannot be recognized correctly due to print characters on the parts, create the inspection object mask at the
character position and perform the inspection.
Additionally, when "Inspection Type" is "Component Shifting" and "Algorithm" is "Termination", and the
termination and main body are detected at the same time, create the mask beyond the inspection at the center
of the main body and perform the inspection.
This section describes how to create the mask beyond the inspection at the center of the main body when the
termination and main body are detected at the same time during "Termination" of chip parts.
TIP
The mask function is enabled in "Algorithm" shown below.
Body, Termination, Compare Luminance, Character, Solder, Lead, Luminance, and Shape
1 Select the [Termination] step.
3
Select "Exclude" for the "Mask Type" in the option parameters. By selecting "Exclude", the mask area is
never detected.
2 Press the [Mask Teach] button.

The mask frame (blue) is displayed inside the step frame (red).

"Option" tab
Selecting the mask type
[Option] tab
Step frame (red) Mask frame (blue) Set to "Exclude". [Mask Teach] button
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3 Align the mask frame size and position.

Drag the mask frame with the mouse to align the size and position with the target area.
The size and position can also be aligned by entering values for "Mask Center Offset X, Y" and "Mask Size
X, Y" in the option parameters.
The following figures show check examples of "Termination" detection with the mask beyond the
inspection set at the main body position of chip capacitor.
Mask setting image example
M lighting Mask type: Disable Mask type: Exclude

Test result: NG Test result: OK
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3-47
2.4.5 Step tuning
It is necessary to perform tuning for all parameters in order that the test result for created steps is correct. To
check the step test result, use the buttons in the "Tuning" tab in the lower right of the "Parts" screen - "Tuning"
tab. To review settings, see Chapter 4, "Setting inspection items", in this manual.
■ Multi-test
The multi-test function is used to perform a step test under set conditions.
For example, the "Same Lib Parts Name" is specified as such times as when creating a new library, a test is
performed for all of the same libraries on the board, and parameters are tuned based on the test result.
1 Press the [Multi] button at the "Tuning" tab.

A "Multi-test Result" window appears at the top of the screen.
"Multi-test Result" screen

"Multi-test Result" screen
3 [Condition] button
[Execute] button
[Multi] button
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2 Press the [Condition] button and set the test conditions.

By pressing the [Condition] button, a "Test Condition Setting" dialog box appears. Select each item from
the respective drop-down list boxes, and press the [OK] button when setting is complete.
"Test Condition Setting" dialog box
[OK] button
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Test Subject
Step : Tests all steps.
Parts : Tests steps for the selected parts.
Inspection Type : Tests the steps for the selected inspection type.
Algorithm : Tests the steps for the selected algorithm.
NG Reason : Tests steps with selected NG reason.
3-48
Test condition
All : Tests all steps.
Same Lib Parts Name : Tests steps with same selected Lib parts name.
Same Parts Name : Tests steps with same selected parts name.
Same Ref. No. : Tests steps with same selected Ref. No.
Test range
All : Tests all steps.
Only Piece of Board : Tests steps in individual boards of the selected multi-board panel No.
Only Selected Parts : Tests steps for the selected part.
OK/NG Jump
Jump No Use : Tests all steps.
Jump Use : Tests while jumping items according to the [OK/NG Jump] setting.
View image List Test

Skip : Tests only standard images, and does not test images in the view image list.
3
All : Test standard images and all the images in the view image list.
Exec OK Parts : Tests standard images and all the images in the OK view image list.
Exec NG Parts : Tests all the images in the NG view image list.
Parts image List Test

Skip : Tests only standard images, and does not test images in the parts image list.

All : Test standard images and all the images in the parts image list.
Exec OK Parts : Tests standard images and all the images in the OK parts image list.
Exec NG Parts : Tests all the images in the NG parts image list.
Update Info.
Exist : Updates the display of the target parts images during test execution.
No Exist : Does not update the display of the target parts images during test execution.
3 Press the [Execute] button to perform a multi-test.

A list of test results appears when the test is complete, allowing the test results and detection values for
each step to be referenced. Steps with NG result appear in red.
Multi-test results example

Example of Ref. No. unit display
Multi-Test Result NG Parts Count [Analysis] button
Auto Result
NG Steps NG Steps Count Results list [Close] button
SPC Analysis
Change the display.

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3-49
Multi-Test Results
The results of the test performed by pressing the [Multi] button in the "Tuning" tab appear.
Auto Results
After performing the automatic inspection, the results of parts that the inspection machine has
judged NG appear.
SPC Analysis
This parameter becomes valid if you go to "Machine Setting" – "Server Setting" – "SPC Text Out" and
select "Use". For details, see "■ SPC Analysis" in this Chapter.
Changes the display.

Display by Ref. No.
Ref. No. unit (part unit) test results are displayed in the left side list of the inspection list. By selecting
parts from the list, the selected row is highlighted in blue, and the step test result for the applicable
part is displayed in the right side list of the inspection list. Select a step and check the step position
and parameters.
Display by Step:
Displays the test results for all tested steps. Select a step and check the step position and param-
3 eters.
NG Parts Count
Displays the number of parts for which the test result is NG.
NG Steps Count
Displays the number of steps for which the test result is NG.
[Analysis] button
By selecting a display item, the test result for the relevant item is displayed in a graph. Refer to this
when setting parameters for data tuning.
5 Select the NG steps and perform tuning.

1. Correct the parameters of the NG steps based on the test results.
2. Press the [Execute] button to perform a multi-test again.
6 Repeat the processes in Step 5.

Repeat the processes in Step 5 until the testing all the steps result OK.
7 Register the library.

Press the [Save] button in the "Tuning" tab to register the library.
8 Press the [Close] button to exit the multi-test.
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■ SPC analysis
This function analyzes the SPC data (inspection results) generated after the automatic inspection and displays
the results in a graph format. This enables to set the optimum standard values for judgment.
1 Press the [Select File] button in the "SPC Analysis".

The [Select SPC Folder] dialog box appears.
2 Select the SPC file you want the system to read out and press the [OK] button.
The system reads out only pieces of the SPC data that have the same LIB parts name as that of the parts
being selected on the [Parts] screen.
SPC analysis screen

SPC analysis Select SPC file. [Select File] button
3
[Select All] button [Reload] button

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You can press the [Select All] button to select all in the SPC file.
Update the displayed SPC data, press the [Reload] button.
3 Display the data in a graph format.

Select the step you want to check and press the [Analysis] button.
4 Set the standard value for judgment.

Set the standard value for judgment while considering the actual graph values.
Graph display
[ Analysis] button
Select step. Standard value for judgment
Legends
Step information
on board
Judgment conditions
Graph Actual values Select display item. 1 2 3

24377-P7-00
1. [3 σ ] button
Displays the 3 σ value on the graph.
2. [Minimum / Maximum] button
Displays the minimum and maximum values on the graph.
3. [Apply] button
After correcting the "Judgment Conditions" value, pressing the [Apply] button has it reflected on the inspection
program.
To save it in the library, press the [Register] button in the "Tuning" tab.
3-51
2.4.6 "Detection" results
After completing the step test, go to [Parts] – [Tuning] tab and press the [Detection] button. The [Test results]
screen appears while displaying the data in the area detected in the step.
[Test Results] screen

2 3
■ Example of Algorithm “Lead”
1
3
[Detection] button
■ Example of Algorithm “Character”
[Detection] button
24378-P7-10
1. Detect Cnt.
Displays the detected counts.
2. Area (%) (Lead)
Displays the recognized "area" in percentage (%).
3. X width and Y width (mm) (Lead)
Lead: Displays the widths of the [X Width] and [Y Width] of the recognized area.
4. Detected characters and the scores
Displays the recognized characters and the scores. The characters and the scores matched with the Inspection Character
String are displayed in blue.
TIP
The contents to be displayed on the [Test Results] screen may vary depending on the Algorithm.
3-52
2.4.7 Parts librar y detail screen
Go to [Inspection Data] – [Parts] screen and press the [Detail] button in the "Utility" tab there, and the detail
screen of the library appears. This screen enables to edit the registered libraries.
This section describes the main functions of the parts library detail screen.
Parts library detail screen

1 2 3 4 5 6
10
8
11
7
3
12

13 14 15 16 17 18 19 20 21 22
24382-P7-00
1. Parts librar y list

Shows a list of the registered parts libraries.
Example of parts library configuration
Parts library
LIB name CHIP_C CHIP_R CHIP_Q CHIP_D IC
LIB parts name 1005C 1005R Q1508-1-2P D1610-2P-S SOP3025-8P

1608C 1608R Q2014-1-2P D1610-2P-B SOP5040-16P
Ta-3015 2012R SOP-6440-24P
AL-6060 0603R QFP-6464-48P
AL-5050
23301-P7-10
2. Parts Info.
Displays the parts information of the selected parts library.
3. Partial Info.
Displays the partial areas of the selected parts library.
4. Buttons for Partial Info.
This button enables to create or delete partial areas and edit the shape of lead parts.
See "1.4.7 Parts Screen" in Chapter 1 for the functions of each button. See "2.1 Creating new partial areas" for the
procedure for creating new partial areas.
5. Inspection Info.
Displays the inspection steps of the library partial areas selected from the partial area information.
6. Buttons for Inspection Info.
This button enables to create new inspection steps and duplicate and delete inspection steps.
See "1.4.7 Parts Screen" in Chapter 1 for the functions of each button.
3-53
7. Parameter
This button is used to display and edit the parameters of the steps selected from the inspection item information.
See "2.3 Parameters" in this Chapter for more details of each parameter.
8. [Create] button
• Registering new LIB names
Select the "Parts Library" from the list of parts libraries and press this button. The [Register New Library] screen
appears. Enter the library name to be registered and press the [Save] button.
• Registering new LIB parts names
Select a library name or a library parts name selected from the list of parts library and press this button. The [Register
New Parts] screen appears. Enter the library parts name to be registered and press the [Save] button.
9. [Copy] button
This button is used to copy library data.
• Copying from LIB name to LIB name and copying from LIB parts name to LIB parts name
Select the library from the copy origin and press the [Copy] button. The [Select copy destination library] dialog box
appears. Press the [Yes] button. Then, select the copy destination library name. The confirmation dialog box appears
3
and press the [Yes] button.
• Copying from LIB parts name to LIB name
Select the library parts name of the copy origin and press the [Copy] button. The [Select copy destination library]
dialog box appears. Press the [Yes] button. Then, select the copy destination library name. The [Copy Parts] dialog box
appears. Enter the library parts name of the copy destination and press the [Save] button.
10. [Delete] button

This button is used to delete libraries. Select the library you want to delete and press this button.
11. [Search] button
This button is used to search library parts name.
12. [Explorer] button
This button is used to import and export libraries.
13. [Text Out] button
This button is used to generate the output of a library in the text format.
To define or change the output destination, go to [Machine Setting] – [Library Setting] screen. There, select from "Library
Text Out Path".
14. [Images] button
Select the library and press this button. The [Library Image List] screen appears. This screen enables you to check OK
images and NG images of the library currently selected.
15. [Replace] button
This button is used to define conditions and batch replaces the parameters of the corresponding step. For details, see
"2.4.10 Batch Replacement" in this Chapter.
16. [Update] button
This button is used to update the library control file.
17. Part image
This button is used to display the parts images of the selected parts library.
18. Zoom
This button is used to enlarge or reduce the parts images.
19. Change lighting
Pressing the U, H, M or L light button to change the light for parts image.
20. [Step Disp] button
This button is used to switch whether to show or hide the step frame of a library image.
21. [Save] button
This button is used to save the changes made on the library detail screen.
22. [Close] button
This button is used to close the library detail screen without saving the changes.
3-54
2.4.8 Utilizing Parts Librar y
The collection of the created part steps (Library) can be registered to the Parts Library. The registered library
can be deployed to the inspection program.
■ Registering the librar y

The following describes the procedure of registering the created part library to the Parts Library.
1 Select the parts to be registered to the library.

Select the relevant parts on the "Mount" screen and open the "Parts" tab.
2 Register the library to the Parts Library.

1. Press the [Register] button on the "Tuning" tab.
[Parts] tab

[Tuning] tab [Register] button
24386-P7-00
2. The confirmation dialog is displayed. Check the registration and press the [Yes] button.
The selected parts and the library are registered to the Parts Library.
Confirmation dialog
■ When newly creating the library and registering ■ When registering to the existing library
24387-P7-00
3-55
■ Deploying the librar y
Deploying the library is the function to paste the library data to the parts on the board.
The following describes the procedure of deploying the library.
TIP
Refer to Chapter 2, "3.6.1 Pasting libraries" for the procedure of pasting individual libraries.
1 Open the [Data Edit] - [Parts] screen.

2 Press the [Redeploy] button on the [Tuning] tab.
The [Deploy Library Data] screen appears.
[Deploy Library Data] screen
3 3
24388-P7-00
3 Specify the deployment destination parts.

Deploy All
In regard to all the parts, the parts matching with the LIB part name from the registered library are
deployed.
Deploy by Lib Parts Name Key

Deploys to the parts of the selected LIB name and LIB part name.
Deploy to Selected Parts

Deploys to the parts of the selected parts name.
4 Specify the deployment origin library.

It is required to specify the deployment origin library only when selected other than "Deploy ALL" in
step 3. Select from the drop-down list or pressing the [Select] button to open the "Library Selection"
screen.
5 Select the Condition of Deployment as needed.

No changes to OCR
If ticking the checkbox, the setting of the "Inspection Character String" of the Judge parameter of
the "Character" step is not changed when deploying.
Set LIB Parts from librar y table file

If ticking the checkbox, the LIB part name will be deployed from the library table file.
6 Execute the deployment.

1. Press the [Execute] button and deploy the library data.
2. After the deployment is completed, the confirmation dialog appears. Press the [OK] button.
3-56
■ Librar y data by parts name
Use the library data per parts name to manage the resistor part, etc. that differs the multiplier in the same
library. The targets are the "Inspection Character String" and the "User Font Group" used for the Inspection Type
"Misplaced Component" or "Reversed Polarity" and the Algorithm "Character". Register and manage them in the
same library by parts name. When deploying the library, the "Inspection Character String" and the "User Font
Group" relevant to the parts name to be deployed are set. Therefore it is not required to deploy the library by
parts name.
TIP
If ticked the checkbox of the "No changes to OCR" on the "Condition of Deployment" when deploying the library, the
setting of the "Inspection Character String" on the "Judge" parameter of the "Character" step is not changed. Thus the
library data for parts name is not deployed as well.
Library by parts name

Parts Library
3
Common parameter
Part B
Library data by parts name

103
Part A Character string
(multiplier) 102

Part B Character string
(multiplier) 103
Part C Character string

(multiplier) 1001
23302-P7-10
New registration of the librar y by parts name

The library by parts name is automatically registered when registering to the library. However it can be added and edited
on the "Data List by Parts Name" screen.
1 Select the library parts name registering the data by parts name.
Select the library parts name registering the data by parts name on the detail screen of the parts library.
2 Open the "Data List by Parts Name" screen.

1. Select the step that the "Algorithm" is the "Character" on the "Inspection Info.".
2. Open the "Judge" tab and press the [By Parts] button. The "Data List by Parts Name" screen appears.
[Data List by Parts Name] screen

Select the library parts name. [Data List by Parts Name] screen Select the step “Character”.
[Judge] tab
[By Parts]
button
24384-P7-00
n NOTE
The [By Parts] button appears on the "Judge" tab only when the "Algorithm" is "Character".
3-57
3 Register the data by parts name.
1. Press the [Add] button. "Editing of Parts Name" screen appears.
2. Enter the parts name to be added and press the [OK] button. The entered parts name is added on
top of the list.
3. When registering the Inspection Character String, double-click the "Inspection Character String" field
of the added parts and enter Inspection Character String. Regarding the User Font Group, enter it in
the "User Font Group" field.
Registering the data by parts name

Example of Inspection Character String
Enter the parts name.
Enter the Inspection Character String.
3
[Add] button
[Save] button
[Close] button
24385-P7-00
4 Save the registered data by parts name.

1. Press the [Close] button and close the "Data List by Parts Name" screen.
2. Press the [Save] button on the parts library detail screen to save the registered data.
Deleting the librar y data by parts name

If selecting the data to be deleted on the "Data List by Parts Name" screen and press the [Delete] button, the confirmation
dialog will appear. The selected data is deleted by pressing the [OK] button.
Deleting the library data by parts name
Select the data to be deleted.
24389-P7-00
3-58
2.4.9 Utilizing sampling Lib
The sampling Lib (library) is a database that saves the sampling conditions for steps and utilizes them.
The sampling Lib is divided into the "Standard" and "User categories. When the machine is shipped, the
"Standard" category stores the standard sampling conditions used for various partial areas so that you can
select a partial area and set the data in the step.
You also can create new sampling conditions and save them in the [User] category to utilize them.
■ Setting sampling conditions

This section describes how to set the saved sampling conditions in steps.
1 Select the step, to which sampling conditions are set.

1. Select relevant parts on the "Mount" screen and open the "Parts" tab.
2. Select the target step from "Partial Information" to "Inspection Information".
2 Open the "Sampling" tab and press the [Sampling Lib] button.
The "Sampling Library" screen appears.
3 Select the sampling conditions to be set.

Select the inspection objects from the "Light Settings" drop-down list. 3
Setting sampling conditions

Select inspection objects. [Sampling] tab 1
[Sampling Lib] button
Step image of the selected inspection object. [Set] button
Light setting of the selected inspection object.

24360-P7-20
4 Press the [Set] button.

The lighting settings you have selected are then set to the step.
3-59
■ Registering sampling conditions
This section describes how to register newly created sampling conditions in the [User] category.
1 Select the step, to which sampling conditions are newly set.

2 Open the "Sampling" tab and press the [Sampling Lib] button.
The "Sampling Library" screen appears.
3 Select the category. Enter the name and the comment.

1. Select "User" in the "Category" drop-down list.
2. Enter the name and the comments in "Current Light Settings". There is no problem even when the
comment filed is blank.
Registering sampling libraries
Select "User". [Sampling] tab 1
3
[Sampling Lib] button
[Save] button Enter name and comments.

24359-P7-20
4 Press the [Save] button.

A save confirmation dialog box appears. Press the [Yes] button to register the current lighting settings.
When completing the registration, the registered step image and the light setting appear.
Registration completion screen.
Registered step image
Registered light setting
24379-P7-10
3-60
2.4.10 Batch replacement
This function is used to set conditions for steps being replaced, and batch replace item values for applicable
steps with specified values.
c CAUTION
All applicable steps are changed when the [Replace] button is pressed, and therefore care should be taken when
specifying conditions and replacement settings.
1 Press the [Replace] button in the "Utility" tab.

A "Replace" screen appears.
"Replace" screen
Number of search items Number of steps
Search items List of steps subject to replacement
3
[Parts] tab

[Execute] button
[Get Light] button Number of replacement items [Utility] tab

Replacement items [Replace] button Replacement details list
24339-P7-20
2 Specify "Find what".

Enter the step condition to be changed in the [Find What] screen in the upper left.
Select "NONE" in the value fields for items that are not to be searched.
Ensure that the number displayed in "The number of items in the Finding list" matches the number of
items to be found.
TIP
The contents in the "Find what" area may vary depending on the selections in "Inspection Type" to "Algorithm".
3 Check the "Step List to be Replaced".

Steps to be replaced are displayed in the "Step List to be Replaced" in the upper right of the screen.
Ensure that the number displayed in "The number of steps" matches the number of steps to be replaced.
3-61
4 Specify "Replace with".
Enter the value following the change in the "Replace with" screen in the lower left. Select "NON" in the
value field for items that are not to be changed.
If wishing to specify the selected step sampling conditions for "Replace with", press the [Get Light]
button. Values are entered automatically.
Ensure that the number displayed in "The number of items in the Replacing list" matches the number of
items to be replaced.
TIP
The items to be displayed in the "Replace with" area may vary depending on the selections in "Inspection Type" to
"Algorithm".
5 Check the replacement details list.

Items to be replaced are displayed in the replacement details list in the lower right of the screen. Check
whether the content set in "Before replacement" and "After replacement" is correct.
6 Press the [Execute] button.

Press the [Yes] button at the confirmation message that appears. To cancel, press the [No] button. Press
3
the [OK] button at the change complete message that appears.
7 Press the [Close] button to end deployment.

3-62
Contents
1. Setting Inspection Types 4-1

1.1 Inspection step setting procedure 4-1
1.2 Algorithm list 4-3
2. Description of Algorithm 4-5

2.1 Body 4-5
2.2 Termination 4-7
2.3 Character 4-9
2.4 Shape 4-12
2.5 Compare Luminance 4-14
2.6 Pattern 4-16
2.7 Solder 4-18
2.8 Foreign Object 4-20
2.9 Luminance 4-22
2.10 Lead 4-24
2.11 Laser Measurement (option) 4-26
2.12 3D Height (option) 4-30
2.13 Compare Height (option) 4-36
2.14.1 Setting procedure 4-38
2.14.2 Description of parameters 4-41
2.15 4D Foreign Object (option) 4-45
1. Setting Inspection Types
To perform the inspection correctly, select Inspection Type and Algorithm suitable for the inspection in each
step, and then set the parameters.
Steps are classified into Body, Lead Group, and Neighbor of Parts, etc. in the "Partial Information" area and
they are displayed in the "Inspection Informtion" list.
1.1 Inspection step setting procedure

This section describes the common setting flow of the inspection step. The parameters to be displayed may vary
depending on the Inspection Type and Algorithm. Therefore check each setting procedure.

Example of Inspection Type "Component Shifting" - Algorithm "Body"
Partial information Inspection Type Algorithm
Setting Inspection Types

Detected data Test result judgment [Step] button
24428-P7-20
1 Set the Sampling conditions.

Set the Sampling conditions to display the inspection object in red. For details, see "2.4.1 Sampling
condition (based on light sampling type)" in Chapter 3.
2 Set the Detect conditions.

Set the Detect conditions for the inspection objects that appear red.
For details, see relevant item of "2. Description of Algorithm" in this Chapter.
3 Set the Judge conditions.

Set the criteria of the OK/NG judgment for the inspection objects detected by the detection conditions.
For details, see relevant item of "2. Description of Algorithm" in this Chapter.
4 Perform a step test.

Press the [Step] button in the "Tuning" tab to perform a step test.
If the test results are not judged correctly, review each parameter while referring to the detection data
displayed on the screen.
4-1
■ Meaning of Detected data
Inspection data Meaning
Correction amounts that are corrected through the position correction in the
Position Align dx=, dy=
inspection step.
Light No Sampling condition number that is inspected.
dx, dy Center deviation amounts between the step frame and detection area.
Distance Distance of detected object (Unit: mm)
Angle θ-deviation amount of detected object (Unit: mm)
Area Ratio (%) of detected area to the step area
Aspect Ratio Aspect ratio (%) of the recognized area
a. Recognized characters.
Detect b. This becomes the datum height of the height inspection when using Laser
Measurement or 3D Height.
Score Recognition score of recognized characters
Offset Height of detected object
Main Position Luminance of the inspection step position (main part)
Luminance at the position (sub part) compared to the inspection step position (main
Sub Position
4
part)
Position 1 Height of the inspection step position (main part)
Height at the position (sub part) compared to the inspection step position (main
Position 2
part)
Difference in luminance between the main part and sub part.
Difference In case of "Compare Height", it is the height difference between the main part and
the sub part
Max Length X Max. X width of detected foreign object
Max Length Y Max. Y width of detected foreign object
Foreign Level Brightness level of the maximum foreign level
Level Brightness level of detected object
Size X, Y X and Y sizes of detected object (Unit: mm)
Wetting Area Detected wetting area (Unit: %)
No Wetting Area Detected no wetting area (Unit: %)
Solder Volume Detected solder volume (Unit: %)
4-2
1.2 Algorithm list
The following shows the list of Inspection Types and Algorithms by inspection area. According to the purpose
of the inspection, select appropriate Inspection Type and Algorithm. For details about settings, see "Section to
be referred to".
Inspection area Inspection Type Algorithm Section to be referred to.
Body Neighbor Bridge Solder "2.7" in this Chapter
Missing Component Body "2.1" in this Chapter

Component Shifting Termination "2.2" in this Chapter
Body "2.1" in this Chapter
Tilted Component Body "2.1" in this Chapter

Misplaced Component Character "2.3" in this Chapter
Pattern "2.6" in this Chapter
Upside Down Luminance "2.9" in this Chapter

Reversed Polarity Shape "2.4" in this Chapter
Character "2.3" in this Chapter
Compare Luminance "2.5" in this Chapter
Pattern "2.6" in this Chapter

2
Compare Height* "2.13" in this Chapter
Datum Height Point Laser Measurement* 1 "2.11.1" in this Chapter
2
3D Height* "2.12.1" in this Chapter
4
Body Lifting Laser Measurement* 1 "2.11.2" in this Chapter

2
Compare Height* 2 "2.13" in this Chapter

Chip Tombstoning Solder "2.7" in this Chapter

1
Laser Measurement* "2.11.2" in this Chapter
3D Height* 2 "2.12.2" in this Chapter

2
Lead group Position Correction Side Body "2.1" in this Chapter
Position Correction Shoulder Lead "2.10" in this Chapter

Bridging Solder "2.7" in this Chapter
Foreign Object "2.8" in this Chapter
4D Foreign Object "2.15" in this Chapter
Lead Shift Luminance "2.9" in this Chapter
Lead Overhang Lead "2.10" in this Chapter
Position Correction Tip Lead "2.10" in this Chapter
Exposed Copper Solder "2.7" in this Chapter
Excess Bond Solder "2.7" in this Chapter
No solder Solder "2.7" in this Chapter

Insufficient Solder Solder "2.7" in this Chapter
3
4D Solder* "2.16" in this Chapter
Solder Fillet 3D Solder* 2 "2.14" in this Chapter
Black Material Solder "2.7" in this Chapter

Insufficient Wetting Luminance "2.9" in this Chapter
Solder "2.7" in this Chapter

Long Lead Lead "2.10" in this Chapter
Shape "2.4" in this Chapter
4-3
Inspection area Inspection Type Algorithm Section to be referred to.
Lead group Chip Tombstoning Solder "2.7" in this Chapter

1

2
Lifted Lead Solder 2.7" in this Chapter
1
2
Compare Height* 2 "2.13" in this Chapter

1
Datum Height Point Laser Measurement* "2.11.1" in this Chapter

THD Pin Hole Foreign Object "2.8" in this Chapter
Short Lead Solder "2.7" in this Chapter
Non-lead Solder "2.7" in this Chapter
Excess Bond Solder "2.7" in this Chapter
Exposed Copper Solder "2.7" in this Chapter

Bridging Solder "2.7" in this Chapter
Foreign Object "2.8" in this Chapter
4D Foreign Object* 3 "2.15" in this Chapter
4
Insufficient Solder Solder "2.7" in this Chapter
3
4D Solder* "2.16" in this Chapter
Neighbor of parts Solder Beadig Foreign Object "2.8" in this Chapter
Bond Solder "2.7" in this Chapter

Others Compatible All existing Inspection Types –
*1
*2
This function is only available for the inspection machine equipped with the 3D projector unit (option) and for the
offline software iPro (option).
*3
4-4
2. Description of Algorithm
This section describes how to set detection conditions parameters and judgment conditions parameters for
each Algorithm.
2.1 Body
The component body is detected to make the judgment using the area.
Applicable Inspection Types :Missing Component, Component Shifting, Tilted Component, Body Lifting,
Chip Tombstoning, Position Correction Side
1 Set the Detect parameters.

Detect parameters
Algorithm: Body
<Example of Inspection Type “Missing Component”>

24401-P7-20
Search Area (mm)

Set this search area when inspecting the area wider than the step size. Normally, set this to "0".
Applicable Inspection Type : Missing Component
Area Detection Size

Select the minimum detection size setting to recognize component from "Manual" or "Auto".
When selecting "Manual", enter the minimum detection size. Normally, set this to "Auto".
Applicable Inspection Types : Missing Component, Component Shifting, Tilted Component, Body
Lifting, Chip Tombstoning, Position Correction Side
Position Align Type

Select the reference position to correct the position.
Position Align Method

This setting is enabled when selecting a setting other than "Don't Use" in "Position Align Type".
• STD:
The step inspection position is corrected.
• Change Step Size:
While the step inspection position is corrected, the position correction is not performed toward the
outer periphery of the component.
• Mask Align:
Corrects only the mask position set by the Option parameter.
4-5
2 Set the Judge parameters.
Judge parameters
Algorithm: Body
24402-P7-20

When the ratio of the detected area to the step area is this value or more, this is judged as OK.
Applicable Inspection Types : Missing Component, Component Shifting, Tilted Component, Body Lifting
Chip Tombstoning, Position Correction Side
Permissible Area Ratio (%) ≤
4 When the ratio of the detected area to the step area is this value or less, this is judged as OK.
Reference value: 120%
Applicable Inspection Types : Component Shifting, Body Lifting, Chip Tombstoning, Position
Correction Side
Offset Limit N to W (mm)

Sets the offset limit for each side of the recognized area to come out of the step frame.
When the detected side exceeds the value set here, this is judged as NG.
Applicable Inspection Types : Component Shifting, Tilted Component, Position Correction Side
Alignment (Deg)
When the θ -deviation of the detected component is the set value or less, this is judged as OK.
Applicable Inspection Type : Component Shifting
3 Press the [Step] button to perform a step test.

Step test
Algorithm: Body
Detected data
[Step] button
24403-P7-10
4-6
2.2 Termination
The termination distance of the chip component is measured and the component position is recognized to
inspect the Component Shifting.
Applicable Inspection Type: Component Shifting

Detect parameters
Algorithm: Termination
24404-P7-20
4
Area Detection Size
Select the minimum detection size setting to detect the termination from "Manual" or "Auto".
Measure Method
This appears when you select "Manual" from "Area Detection Size".
Specify whether to measure the distance between the insides or between the outsides of the

termination. Normally, specify this to [OUT]
Position Align Type


• STD:
• Change step size:
• Mask Align:
4-7
Judge parameters
24405-P7-20
Min distance (mm)

When the distance between the terminations is the set value or more, this is judged as OK.
Max distance (mm)

When the distance between the terminations is the set value or less, this is judged as OK.
Position Shift Check Tolerances X, Y (mm)
4
Sets the allowable range of the deviation. When the deviation amount exceeds this set amount, this is
judged as NG.
Alignment (Deg)
When the θ -deviation of the detected termination is the set value or less, this is judged as OK.
3 Press the [Step] button to perform a step test.

Step test
<Inspection Type: Component Shifting>
Detected data
[Step] button
24406-P7-20
4-8
2.3 Character
The characters printed on the component are recognized to make the judgment.
Applicable Inspection Types: Misplaced Component, Reversed Polarity

Detect parameters
Algorithm: Character
24413-P7-20
Area Detection Size
4
Select the setting of the character size to be recognized from "Manual" or "Auto".
When selecting "Manual", enter the character size. Normally, set this to "Auto".
Position Align Type


• STD:
• Mask Align:
4-9
Judge parameters
24414-P7-20
Inspection Character String

Enter the character string to be inspected. Up to 14 characters can be entered.
OCR Type
Select the character type entered in "Inspection Character String" from "Cap.&Num.", "Cap.", or "Num."
(alphanumeric, alphabet, numeric).
For alphabetic characters, only upper-case characters can be recognized.
4
Match Type
• Full: It is judged OK if the detected character string completely matches the inspection
character string.
• Partial: It is judged OK if the detected character string includes the inspection character string.
For example, when you want to inspect only "7" and "9" of the character string "3793", enter "79" and set
"Partial". If the specified character string cannot be recognized, this is determined as NG.
Char Judge Type

• Characters Score: Judged based on the score of the recognized characters.
• First Candidate: Judged based on the highest score of all characters.
Min Score
After the step test has been completed, press the [Measurement Result] button to display the list of
characters that is recognized. The list displays the characters scores for the respective characters.
The character recognition inspection is performed at the designated angle.
• Non: Performs recognition inspection only at the set angle registered in the step. Normally,
set this to "None".
• Permit 180°: Select this setting for component such as chip resistors that have no problem even
when rotated 180°.
• Permit All: Select this setting when only the presence of the set characters needs to be checked
regardless of the character string angle.
However, since the images are rotated during image processing, the inspection time
increases.
The character recognition angle is set using "Entry Angle" of the basic parameters. The angles are those
rotated counterclockwise from 0° as shown in the figure below.
Character recognition angle
0° 90° 180° 270°

1 234
1 23 4
12 3 4
1234
23401-P7-00
User Font Group
Specify the registered user font group.
4-10
Step test
<Example of Inspection Type “Misplaced Component”>
Detected data
[Step] button
24415-P7-20
4-11
2.4 Shape
The "Shape" detection includes 2 types of the body shape detection and lead shape detection.
The component body shape is detected to inspect if the conponent is mounted with correct polarity. The lead
shape is detected to inspect for deformation caused by Lifted Lead, etc.
Applicable Inspection Types: Reversed Polarity, Long Lead

Detect parameters
Algorithm: Shape
<Example of Inspection Type “Long Lead”>
4
24429-P7-20
Search Area (mm)

Set this search area when inspecting the area wider than the step size. Normally, set this to "0".
Applicable Inspection Type: Reversed Polarity
Area Detection Size

Select the minimum detection size setting to detect the inspection object from "Manual" or "Auto".
Position Align Type


• STD:
• Mask Align:
4-12
Judge parameters
Algorithm: Shape
<Example of lnspection Type “Long Lead”>
24430-P7-20
Position Shift Check Tolerances X, Y (mm)

Sets the allowable range of the deviation. When the deviation amount exceeds this set amount, this is
judged NG.
Applicable Inspection Type: Long Lead
Inspection Shape
Select the shape you want to inspect from four types shown below.
• Size: Performs the inspection by comparing the detected size with the step size.
• Circularity (roundness): Inspects how much the detected circular components are close to the
perfect roundness.
• Convexity: Inspects the smoothness of the contour of the detected area.
• Aspect ratio: Inspects the percentage of the aspect ratio of the detected area.

The "Entry Angle" in the basic parameters dictates the reference direction (either
vertical or horizontal).
4
Applicable Inspection Type: Reversed Polarity, Long Lead
Tolerances X, Y (mm)

These settings are enabled when "Size" is selected in "Inspection Shape".
When the maximum dimension of the recognition area is within the dimension, for which the dimensional
tolerance has been increased or decreased for the step size, this is judged as OK.
Min Match Ratio, Max Match Ratio (%)

These settings are enabled when selecting a setting other than "Size" in "Inspection Shape".
Enter the minimum and maximum shape match ratio of the inspection object to be judged as OK.

Step test
Algorithm: Shape
<Example of Inspection Type “Long Lead”>
Detected data
[Step] button
24431-P7-10
4-13
2.5 Compare Luminance
The Reversed Polarity is inspected using the difference in luminance between the step position and object
position.

Detect parameters
Algorithm: Compare Luminance
24410-P7-20
4
Measure Method
Select the luminance calculation method suitable for the portion to be inspected from the drop-down list.
• Mean: Calculates the average luminance in the step frame.
• Minimum: Calculates the minimum luminance in the step frame.
• Maximum: Calculates the maximum luminance in the step frame.
• Deviation: Calculates the standard deviation of the luminance in the step frame.
• Max-Min: Calculates the difference between the maximum luminance and the minimum
luminance in the step frame.
• MinMean: Calculates the average luminance in a range of 25% of the step frame as the minimum
luminance portion in the step frame is determined to be the center.
• MaxMean: Calculates the average luminance in a range of 25% of the step frame as the maximum
Position Align Type


• STD:
• Mask Align:
4-14
Judge parameters
Red Step (Main) Blue Step (Sub)

24411-P7-20
Light Intensity Type

• Main (Bright) > Sub (Dark): Select this setting when the step position is brighter than the object
position.
• Main (Dark) < Sub (Bright): Select this setting when the step position is darker than the object
position.
4
Required Difference
Sets the minimum luminance difference between the step position and the object position.
When the detected luminance difference is the set value or more, this is determined as OK.


Step test
Detected data
[Step] button
24412-P7-20
4-15
2.6 Pattern
This function detects the pattern and compares it with the registered pattern to see whether the correct compo-
nent is mounted.
Applicable Inspection Types: Misplaced Component, Reversed Polarity

Detect parameters
Algorithm: Pattern
24432-P7-20
4 Position Align Type


• STD:
Pattern Index
Enter the registered pattern index number.
To find the pattern index number, go to "Pattern Registration" – "Pattern Control" tab and see "Pattern
Index" there.

Judge parameters
Algorithm: Pattern
24433-P7-20
Min Score
Comparing the detected pattern with the registered pattern, it is judged OK if the match ratio is the set
value or more.
4-16
The "Pattern" recognition inspection is performed at the designated angle.
• Non: Performs recognition inspection only at the set angle registered in the step. Normally,
set this to "None".
• Permit 180°: Select this setting for component such as chip resistors that have no problem even
when rotated 180°.
• Permit All: Select this setting when only the presence of the set pattern needs to be checked
regardless of the pattern angle.
However, since the images are rotated during image processing, the inspection time
increases.
The "Pattern" recognition angle is set using "Entry Angle" of the basic parameters. The angles are those
rotated counterclockwise from 0° as shown in the figure below.
“Pattern” recognition angle
0° (Registration angle) 90° 180° 270°
1234
1234
12 3 4
1234
23435-P7-00
4
Step test

Algorithm: Pattern
Detected data
[Step] button
24434-P7-10
4-17
2.7 Solder
The solder is detected to perform OK/NG judgment. The luminance or the height (option) is sampled for
detecting the solder.
Inspection Types sampled by luminance:
Neighbor Bridge, Bridging, Excess Bond, No Solder, Insufficient Solder, Black Material, Bond, Non-lead,
Exposed Copper, Insufficient Wetting
Inspection Types sampled by height:
Lifted Lead, Chip Tombstoning, Short Lead

Detect parameters
Algorithm: Solder
<Example of Inspection Type “Lifted Lead”>
4 24416-P7-20
Area Detection Size

Select the minimum detection size setting to recognize solder from "Manual" or "Auto".
Position Align Type


• STD:
• Mask Align:
4-18
Judge parameters
Algorithm: Solder
24417-P7-20

When the ratio of the detected area to the step area is the set value or more, this is judged OK.
Applicable Inspection Types: Lifted Lead, Chip Tombstoning, Excess Bond, No Solder, Insufficient
Solder, Short Lead, Bond, Insufficient Wetting
4
When the ratio of the detected area to the step area is the set value or less, this is judged OK.
Applicable Inspection Types: Lifted Lead, Chip Tombstoning, Excess Bond, Black Material, Non-lead,
Exposed Copper, Bond, Insufficient Wetting


When the detected side exceeds the value set here, this is judged NG.
Applicable Inspection Types: Neighbor Bridge, Bridging, Excess Bond

Step test
Algorithm: Solder
Detected data
[Step] button
24418-P7-20
4-19
2.8 Foreign Object
This function checks the X and Y sizes of the detected inspection object to judge whether it is foreign object or
not.
Applicable Inspection Types: Bridging, Pin Hole, Solder Beadig

Detect parameters
Algorithm: Foreign object
<Example of Inspection Type “Bridging”>
4
24419-P7-20

Set the luminance difference level between the object to be detected as foreign object and the
surrounding within the range of 0 to 255.
Area Detection Size

Select the minimum detection size setting to recognize the inspection objects from "Manual" or "Auto".
Position Align Type


• STD:
• Mask Align:
4-20
Judge parameters
Algorithm: Foreign object
24420-P7-10

Select the conditions to judge an object as a foreign object from the drop-down list.
• Both-Side-Size: When the both sizes in the X and Y directions of the detected object are longer than
the set value of the "FOD Sizes X, Y" and shorter than the set value of "Exclude
Sizes X, Y", this is judged NG as a foreign object.
4
• One-Side-Size: When the size either in the X or the Y direction of the detected object is longer than
the set value of the "FOD Sizes X, Y" and shorter than the set value of "Exclude Sizes
X, Y", this is judged NG as a foreign object.
FOD Sizes X, Y (mm) ≥

When the sizes in the X and Y directions of the detected object are the set value or longer, this is judged

Exclude Sizes X, Y (mm) >

When the sizes in the X and Y directions of the detected object are longer than the set value, this is not
judged as a foreign object and excluded from the judgment object.

Step test
Algorithm: Foreign Object
Detected data
[Step] button
24421-P7-20
4-21
2.9 Luminance
This judgment is performed based on the measured luminance value to see if the component is mounted upside
down, the leads are warped or the solder is insufficiently wetted.
Applicable Inspection Types: Upside Down, Lead Shift, Insufficient Wetting

Detect parameters
Algorithm: Luminance
<Example of Inspection Type “Upside Down”>
24425-P7-20
4 Measure Method
Select the luminance calculation method suitable for the portion to be inspected from the drop-down list.
• Mean: Calculates the average luminance in the step frame.
• Minimum: Calculates the minimum luminance in the step frame.
• Maximum: Calculates the maximum luminance in the step frame.
• Deviation: Calculates the standard deviation of the luminance in the step frame.
• Max-Min: Calculates the difference between the maximum luminance and the minimum
luminance in the step frame.
• MinMean: Calculates the average luminance in a range of 25% of the step frame as the minimum
• MaxMean: Calculates the average luminance in a range of 25% of the step frame as the maximum
Position Align Type


• STD:
• Mask Align:
4-22
Judge parameters
Algorithm: Luminance
24426-P7-20
Light Intensity Type

Front (Bright) > Back (Dark): Select this setting when the component top face is bright and the
component back face is dark.
Front (Dark) < Back (Bright): Select this setting when the component top face is dark and the
component back face is bright.
4
Applicable Inspection Type: Upside Down
Required Level ≥
When the detected luminance level is the set value or more, this is determined as OK.
Applicable Inspection Type: Upside Down

Permissible Level ≤
When the detected luminance level is the set value or less, this is determined as OK.
Applicable Inspection Type: Lead Shift
Both side level ≥, Central level ≤

These parameters set the minimum luminance levels at both ends and the maximum luminance level at
the center.
If the detected luminance levels of all the three locations are NG, it is judged NG. If any one of them is
OK, it is judged OK.
Applicable Inspection Type: Insufficient Wetting

Step test
Algorithm: Body
Detected data
[Step] button
24427-P7-20
4-23
2.10 Lead
The lead is detected to perform the OK/NG judgment based on the deviation amount.
Applicable Inspection Types: Position Correction Shoulder, Lead Overhang, Position Correction Tip, Long Lead

Detect parameters
Algorithm: Lead
<Example of Inspection Type “Lead Overhang”>
24422-P7-20
4
Area Detection Size
Select the minimum detection size setting to detect the leads from "Manual" or "Auto".
Position Align Type


• STD:
• Mask Align:
4-24
Judge parameters
Algorithm: Lead
24423-P7-20

When the detected side exceeds the value set here, this is judged as NG.
Applicable Inspection Types: Lead Overhang, Position Correction Shoulder, Position Correction Tip,
Long Lead

When the ratio of the detected area to the step area is the set value or more, this is judged as OK.
Applicable Inspection Types: Position Correction Shoulder, Position Correction Tip
4
When the ratio of the detected area to the step area is the set value or less, this is judged as OK.

Applicable Inspection Types: Position Correction Shoulder, Position Correction Tip, Long Lead

Step test
Algorithm: Lead
Detected data
[Step] button
24424-P7-20
4-25
2.11 Laser Measurement (option)
This is the Algorithm that uses the optional laser height unit to inspect the height.
When performing the height inspection, two steps are created to perform the inspection. In the first step, the
height (board top surface) that becomes the datum height is measured. In the next step, the height of the
inspection object position is measured. The OK/NG judgment is performed with this difference determined to
the height of the inspection object position.
TIP
See the "Laser height unit" in the YSi-V Option Manual for the details of the laser height unit.
2.11.1 Datum Height Point

With the "Datum Height Point" step created, measure the height that becomes the datum height.
Inspection Type: Datum Height Point

Algorithm: Laser Measurement
Datum Height Point Laser Measurement
4
[Datum Height Point] step (red)

24445-P7-20

Detect parameters
<Inspection Type: Datum Height Point>
24441-P7-20
4-26
Measure Method
Select the method to calculate the datum height from four types shown below.
• Spot: Measures the height of the center coordinate position of the step to make it the
datum height.
• Scan Maximum: Measures the heights along the center line in the longitudinal direction while
scanning. The maximum height becomes the datum height.
• Scan Mean: Measures the heights along the center line in the longitudinal direction while
scanning. The average height becomes the datum height.
• Scan Minimum: Measures the heights along the center line in the longitudinal direction while
scanning. The minimum height becomes the datum height.
Measure Angle
Select the laser beam reflection direction (angle) when the laser unit is rotated to measure the height.
When selecting "AUTO", the laser reflection direction is the out direction of the component.
Retr y
This parameter sets whether to retry the height measurement.
Position Align Type


• STD: The step inspection position is corrected.
2 Measure the datum height.

Press the [Step] button in the "Tuning" tab to measure the heights.
If unable to measure the height correctly, review each parameter and measurement position based on
the displayed measurement data.
4
Step test

<Inspection Type: Datum Height Point> Measurement data
[Step] button
24442-P7-20
4-27
2.11.2 Body Lifting, Lifted Lead, Chip Tombstoning
Creating the step to measure the height at the inspection object position, this function measures the height. The
OK/NG judgment is performed with this difference between the datum heights.
Inspection Type: Example of Lifted Lead

Lifted Lead Laser Measurement
[Lifted Lead] step (red)
4
24446-P7-10

Detect parameters
24443-P7-20
Measure Type
Select "Point measurement" or "Line measurement" from the drop-down list.
• Point measurement: Measures the height of the center coordinate position of the step.
• Line measurement: Measures the heights along the center line in the longitudinal direction of the
step while scanning.
Measure Angle
Select the laser beam reflection direction (angle) when the laser unit is rotated to measure the height.
When selecting "AUTO", the laser reflection direction is the out direction of the component.
Sampling Pitch (mm)
This is displayed when "Line measurement" is selected in "Measure Type". Set the pith for the height measurement.
Reference value: 0.001mm
Retr y
This parameter sets whether to retry the height measurement.
When selecting "Use", the measurement is performed as follows.
• When "Point measurement" is selected in "Measure Type", the retry measurement is performed by
rotating the head 180°.
• When "Line measurement" is selected in "Measure Type", the retry measurement is performed by the
head that scans on the return path.
4-28
Position Align Type


Judge parameters
24444-P7-20
4
Required Difference (mm) ≥
When the difference between the measured height at the object position and the datum height
("Datum Height Point" step height) is the set value or more, this is judged OK.
Permissible Difference (mm) ≤

When the difference between the measured height at the object position and the datum height

("Datum Height Point" step height) is the set value or less, this is judged OK.

Step test
<Example of Inspection Type “Lifted Lead”> Detected data
[Step] button
24447-P7-10
4-29
2.12 3D Height (option)
This is the Algorithm that uses the optional 3D projector to inspect the heights.
When performing the height inspection, the height that becomes the datum height (board top face) is measured
to become the datum height of that particular component. Steps are made at the respective inspection object
positions. The OK/NG judgment is performed with the difference from the datum height is determined to the
height of the inspection object position.
2.12.1 Datum Height Point

Create one "Datum Height Point" step within the Inspection information of the partial information "Body" to
measure the height that becomes the datum height.
As "Datum Height Point" step is performed prior to the Inspection Types and make it the datum height of the
component, create it prior to the other Inspection Types of the corresponding component.
Inspection Type: Datum Height Point

Algorithm: 3D Height
Datum Height Point 3D Height
4
[Datum Height Point] step (red)

24448-P7-10

Detect Parameters
<Inspection Type: Datum Height Point>
A
B
C
D
24453-P7-10
A. Measuring Method
Select "Inside Step Frame" or "Use Height Information" in "Measuring Method".
4-30
■ Inside Step Frame
The height in the step frame is the standard. The setting method includes the following 3 types
depending on the "Mask type" setting of the "Option" parameter.
1. When setting "Mask Type" to "Disable"

Measure the height with the whole step areas and without mask areas.
Setting method:
Move the "Datum Height Point" step to an arbitrary position in the Datum Height Point area to
adjust the step size to suit its position.
Measuring Method
Inside Step Frame
When setting “Mask Type” to “Disable” [Datum Height Point] step
Select “Disable”.
24454-P7-10

2. When setting "Mask Type" to "Exclude"
Measure the height excluding the specified mask areas from the step areas.
Up to 3 mask areas can be specified. The shape to be specified should be rectangle or circle.
4
Setting method:
i. Set the "Datum Height Point" step larger than the component.

ii. Press the [Mask Teach] button on the "Option" tab and display the mask frame.
iii. Drag the mask frame and align it with the area to be excluded.
The aligned values are entered to the "Mask Center Offsets X, Y" and "Mask Sizes X,Y".
iv. Press the [Detected] button and check that only the detected datum height is displayed in
red.
Measuring Method
Inside Step Frame
When setting "Mask Type" to "Exclude"
Area of measuring the height [Detected] button Select “Exclude”.
[Datum Height Point] step (red) Mask frame (blue) [Mask Teach] button
24455-P7-00
4-31
3. When setting "Mask Type" to "Other Step Mark"
Measure the height excluding the area (shown in red in the figure below) of the other steps
(both the component and the other components) from the step areas.
Setting method:
Set the "Datum Height Point" step larger than the component.
Measuring Method
Inside Step Frame
When setting "Mask Type" to "Other Step Mark" Other components
Select “Other Step Mask”.

The component [Datum Height Point] step frame
(Step other than [Datum Height Point] step)
24456-P7-00
B. Measure Method
This appears when selecting "In Step Frame" from "Measuring Method".
Select the method to calculate the datum height from the following 5 types.
4 • Mean: The average height of the specified areas in the step frame determines the datum height.
• Maximum: The maximum height of the specified areas in the step frame determines the datum height.
• Minimum: The minimum height of the specified areas in the step frame determines the datum height.
• Median: The median height of the specified areas in the step frame determines the datum height.
• Mode: The most common height of the specified areas in the step frame determines the datum height.
TIP
If a component is in the datum step, select "Other Step Mask". If not selecting it, the component height will affect the
datum height and the datum height will be inappropriate.
■ Using height information

The height set in the "Datum Height" sub tab in the "Height" tab becomes the datum height.
Setting method:
1. Press the [Detected] button to see that only the height detected to be the standard appears
red.
2. If not detected correctly, review the sampling conditions parameters of "Datum Height Point" in
the "Height" tab.
Measuring Method
Use height information
[Detected] button
Detected datum height

24436-P7-10
TIP
For the method of setting the "Datum Height" sub tab in the "Height" tab, see "3.4.2 Datum Height" in Chapter 2.
4-32
C. Position Align Type
D. Position Align Method

2 Measure the datum height.

Press the [Step] button in the "Tuning" tab to measure the heights.
If unable to measure the height correctly, review each parameter and measurement position based on
the displayed measurement data.
Step test
<Inspection Type “Datum Height Point”>
Measuring Method: Use Height Information
Measurement
data
4
[Step] button

24437-P7-10
4-33
2.12.2 Body Lifting, Lifted Lead, Chip Tombstoning
Creating the step to measure the height at the inspection object position, this function measures the height. The
OK/NG judgment is performed with this difference between the datum heights.
Inspection Type: Example of Body Lifting

Body Lifting 3D Height
4
[Body Lifting] step (red)
24449-P7-10

Detect parameters
<Example of Inspection Type “Body Lifting”>
24438-P7-20
Measure Method:
Select the method to calculate the height measurement value from five types shown below.
• Mean: The average height in the step frame determines the measurement value.
• Maximum: The maximum height in the step frame determines the measurement value.
• Minimum: The minimum height in the step frame determines the measurement value.
• Median: The median height in the step frame determines the measurement value.
• Mode: The height appearing most frequently in the step frame determines the measurement value.
Position Align Type


4-34
1. Press the [3D] button to display the 3D image of the component.
2. Set the Judge parameters.
Check that a purple surface appears at the height of the set judgment value.
Judge parameters
Permissible Height [Judge] tab
Required Height [3D] button 3

24439-P7-20
4
Required Height (mm) ≥
When the difference between the detected height at the object position and the datum height ("Datum
Height Point" step height) is the set value or more, this is judged OK.
Permissible Height (mm) ≤

When the difference between the detected height at the object position and the datum height ("Datum

Height Point" step height) is the set value or less, this is judged OK.

Step test
Detected data
Permissible Height
Required Height
Body height
(1.287mm in this example)
Datum height
24440-P7-20
4-35
2.13 Compare Height (option)
This function uses the optional 3D projector to detect the step height and the object position. Comparing the
two detections inspects whether the body or the lead is lifted.
Applicable Inspection Types: Reversed Polarity, Body Lifting, Chip Tombstoning, Lifted Lead

Detect parameters
Algorithm: Compare Height
4
24450-P7-10
Setting method:
Select the method of obtaining the height measurement value from the drop-down list.
• Mean: Obtain the average height in the step frame.
• Maximum: Obtain the maximum height in the step frame.
• Minimum: Obtain the minimum height in the step frame.

• Median: Obtain the median height in the step frame.
• Mode: Obtain the height that appears most frequently in the step frame.
Position Align Type


4-36
Judge parameters
Step (red) Symmetrical position (blue)

24451-P7-10
Height and low type

• Main (High) > Sub (Low) : Select if the step position is higher than the symmetrical position.
• Main (Low) < Sub (High) : Select if the step position is lower than the symmetrical position.
4
Required Difference (mm) ≥

Set the minimum height difference between the step position and the symmetrical position.
When the measured height difference is the set value or above, this is judged OK.

Permissible Difference (mm) ≤
Set the maximum height difference between the step position and the symmetrical position.
When the measured height difference is at the set value or below, this is judged OK.
Applicable Inspection Types: Body Lifting, Chip Tombstoning, Lifted Lead

Step test
Detected data
[Step] button
24452-P7-10
4-37
2.14 3D Solder (option)
"3D solder" detection uses the optional 3D projector and samples only the solder fillet formed on the lead or
the termination side. It compares the sampled area and the area standard and judges OK or NG. "3D Solder"
detection includes 3 inspections of "Wetting Inspection", "No Wetting Inspection" and "Volume Inspection". The
individual inspection and the multiple inspection can be selected as needed.
2.14.1 Setting procedure

The following describes the setting to inspect the solder fillet on the "3D Solder" detection with the "Wetting
Inspection" as an example. Create the "3D Solder" step beforehand.
Creating “3D Solder” step

Inspection Type: Solder Fillet
3D Solder
1. Select “Lead Group”. Solder Fillet 2. Press the [Create] button.
4
Created “3D Solder” step. 3. Tick the checkbox of “Solder Fillet”.

24457-P7-00
1 Set the Sampling parameters.

Select the item of inspection and set each parameter as needed. Select "Wetting Inspection" as an
example.
Selecting the item of inspection

Example of Wetting Inspection
“Sampling” tab Select “Wetting Inspection”.
24458-P7-00
4-38
Parameter setting procedure:
1. Press the [3D] button.
2. Press the [Sampling] button and open the [Spuit Sampling Setting] screen.
3. Press the [All Clear] button and reset the existing parameters.
5. Click the position to detect on the component image. The position which condition is same as the
clicked position is displayed in the sampling color selected in 4.
6. Press the [Set] button to save the setting after all the areas to be detected turned the selected
sampling color. The parameters required for the fillet detection is set automatically.
Setting the parameters

Setting by the [Sampling] button
Click here. [All Clear] button [Set] button
4
[Sampling]
button
[3D] button

24459-P7-00
TIP
TIP
Adjustment is also available with the slide bar instead of the [Sampling] button. Refer to "2.14.2 Description of
parameters" in this chapter.

Detect Parameters
Algorithm: 3D Solder
24460-P7-00
Area Detection Size

Select the minimum detect size setting to recognize the solder fillet from "Manual" or "Auto".
When selecting "Manual", enter the minimum detect size. Normally, set this to "Auto".
Position Align Type


• STD:
4-39
Judge parameters
<Example of Wetting Inspection>
24461-P7-00
Wetting Required Area Ratio (%) ≥

When the ratio of the detected wetting area to the step area is the set value or above, this is judged OK.

Press the [Step] button on the "Tuning" tab to perform a step test.
If the test results are not judged correctly, review each parameter while referring to the detected data
4 Step test
<Example of Wetting Inspection>
Detected data
[Step] button
24462-P7-00
4-40
2.14.2 Description of parameters
The following describes the parameters of each inspection regarding the "3D Solder" detection.
■ Wetting Inspection
Judges the amount of solder per the area by sampling the area where the fillet is formed.
• Height Thresholds Max. and Min.
Adjust the "Height Thresholds Max. and Min." with the sampling height slide bar in order to sample only the solder joints.
Wetting Inspection
Sampling: Height Thresholds Max. and Min.
The component area other than

Thresholds Max. and Min. is excluded.
Component
Pad
Solder Fillet Board

Height Thresholds Max. and Min. Sample within the range of this height.
4
24463-P7-00
• Sampling Slopes Max. and Min. (Deg.)

Adjust the slope slide bar and set the range to sample the slope.
Wetting Inspection

Sampling: Sampling Slopes Max. and Min.
Component
Pad
Solder Fillet Board

Sampling Slopes Max. and Min. Sample only the slope within the range.
24464-P7-00
4-41
• Sampling Direction
Drag the fanwise direction and specify the direction of the solder wetting direction.
• Sampling Direction Max (Deg.) : Central angle of the sampling direction
• Sampling Direction Tolerance (Deg.) : Spreading angle centering the sampling direction
Wetting Inspection
Sampling: Sampling Direction and Tolerance Component
Undetected
Detected
Pad
Sampling Direction and Tolerance Sample only the solder surface Insufficient Wetting Board
having slope of this direction. Solder
24465-P7-00
• Wetting Required Area Ratio (%) ≥

When the ratio of the detected wetting area to the step area is the set value or above, this is judged OK.
4 ■ No Wetting Inspection
Judges the poor wetting per the area by sampling the area of the adverse slope near the lead or the termination
side (Originally this should not occur).
n NOTE
As No Wetting Inspection samples the adverse slope, spread the step temporarily to the opposite side of the component
(see the figure below) and setting each parameter. Then return to the original size aligning with the inspection position.
Example of “3D Solder” step for No Wetting Inspection

■ Step size when setting the parameter ■ Step size when inspecting
Enlarge the step. Align the step with the inspection position.
24470-P7-00
• Height Thresholds Max and Min

Adjust the "Height Thresholds Max. and Min." with the sampling height slide bar in order to sample only the solder joints.
No Wetting Inspection
Sampling: Height Thresholds Max. and Min.
Sample within the range of this height.
The component area other than

Thresholds Max. and Min. is excluded.
Height Thresholds
Max. and Min.
Pad
Component Solder Fillet Board

24466-P7-00
4-42
• Sampling Slopes Max and Min (Deg.)
Adjust the slope slide bar and set the range to sample the adverse slope.
Sampling: Sampling Slopes Max and Min
Component
Insufficient Wetting Solder
Pad
Board
Sampling Slopes Max and Min Sample only the slope within the range.
24467-P7-00
• Sampling Direction
Drag the fanwise direction and specify the direction of the solder wetting direction.
• Sampling Direction Max (Deg.) : Central angle of the sampling direction
• Sampling Direction Tolerance (Deg.) : Spreading angle centering the sampling direction
Sampling: Sampling Direction and Tolerance Component
4

Detected
Pad
Sampling Direction and Tolerance Sample only the solder surface (no Insufficient Wetting Board
wetting surface) having adverse slope. Solder
24468-P7-00
• No Wetting Permissible Area Ratio (%) ≤

When the detected no wetting area is the set value or below, this is judged OK.
Judge: No Wetting Permissible Area Ratio
Detected No Wetting Area No Wetting Permissible Area Ratio
24469-P7-00
4-43
■ "Solder"Volume Inspection
Judges that the amount of the solder is the specified volume or more by detecting the solder volume from the
height information in the step.
• Height Thresholds Max. and Min.
Set the range of the solder height to sample with the sampling height slide bar. Set the sampling height lower than the
component termination or lead so that the termination or lead area is not sampled incorrectly.
Volume Inspection
Sampling: Height Threshold Max. and Min.
Specify the solder height to be sampled.
Component
Pad
Solder Fillet Board

Height Threshold Max. and Min.
24471-P7-00
• Required Volume (%) ≥
4 If the detected solder volume is the set value or above, this is judged OK.
Volume Inspection
Judge: Required Volume
Detected solder volume Required Volume
Detected
solder area
24472-P7-00
n NOTE
The required volume (%) is set with the percentage of the standard volume (%). The standard volume is calculated
with Step dimension X (mm) × Step dimension Y (mm) × Lead Thickness (mm). The value is regarded as 100%. Set the
Lead Thickness on the "Partial Shape Edit Dialog" of the "Lead Group" on the Partial Info.
Setting the Lead Thickness

Select Lead Group. Lead Thickness
[Shape] button
24473-P7-00
4-44
2.15 4D Foreign Object (option)
The inspection of the position difficult to see on the top-viewing image is available by detecting the foreign
object between leads with the 4D image captured by the optional 4D angular camera. It judges OK or NG by
the X and Y sizes of the detected target object.
Applicable Inspection Type: Bridging
TIP
• This Algorithm is available if the Ref angles are 0 degree, 90 degrees, 180 degrees, and 270 degrees.
• This Algorithm is not available for the union view.
• As the 4D image may be shifted due to warping or deflection of board, jointly use the Z-axis correction function.
1 Create the "4D Foreign Object" step.

1. Newly create the "Bridging" step.
2. Select "4D Foreign Object" from the Algorithm.
3. Set the "Pin Expand" to "Don't use" on the "Basic" tab. The "4D Foreign Object" step is changed to one
step per lead direction.
4. Adjust the step size by dragging so that all the leads per side are entered in the step frame.
Create "4D Foreign Object" step

Inspection Type: Bridging
Bridging 4D Foreign Object
4
[Basic] tab

“4D Foreign Object” step that the sizes were adjusted Set to “Don’t use”.
24474-P7-00
n NOTE
If the position is higher than the board surface such as a component surfece, 4D image changes depending on the
relative position of the 4D angular camera and the inspection step position. Create the step near the board surface.
4-45
1. Check that the "Luminance" is selected in the "Light Sampling Type".
2. Press the [Inspection Direction] button and open the "Select the Inspecting direction." screen.
3. Select the image of direction that the inspection area can be seen most clearly and press the [OK]
button.
4. Press the [Detected] button and display the detection range in red.
5. Move the threshold slide bar and set the threshold that displays only the target object in red.
Sampling parameters
Algorithm: 4D Foreign Object
Luminance
Select the image of direction

that inspection area can be
seen most clearly.
4
Threshold slide bar
[Detected] button Noise Cut

24475-P7-00

Detect parameters
24476-P7-00

Set the luminance difference level between the object to be detected as foreign object and the
surrounding within the range of 0 to 255.
Area Detection Size

Select the minimum detection size setting to recognize the inspection objects from "Manual" or "Auto".
Position Align Type

4-46
• STD:
• Mask Align:

Judge parameters
24477-P7-00
4
Select the conditions to judge an object as a foreign object from the drop-down list.
• Both-Side-Size: When the both sizes in the X and Y directions of the detected object are longer than
the set value of the "FOD Sizes X, Y" and shorter than the set value of "Exclude
Sizes X, Y", this is judged NG as a foreign object.
• One-Side-Size: When the size either in the X or the Y direction of the detected object is longer than
the set value of the "FOD Sizes X, Y" and shorter than the set value of "Exclude Sizes

X, Y", this is judged NG as a foreign object.
FOD Sizes X, Y (mm) ≥

When the sizes in the X and Y directions of the detected object are the set value or longer, this is judged
Exclude Sizes X, Y (mm) >

When the sizes in the X and Y directions of the detected object are longer than the set value, this is not
judged as a foreign object and excluded from the judgment object.

Step test
<Inspection Type: Bridging>
Detected
data
[Step] button
24478-P7-00
4-47
2.16 4D Solder (option)
4D Solder detects the solder on fillet or pad of with the 4D image captured by the optional 4D angular camera.
It judges the amount of solder depending on the detected solder area.
Applicable Inspection Type: Insufficient Solder
TIP
• This Algorithm is available if the Ref angles are 0 degree, 90 degrees, 180 degrees, and 270 degrees.
• This Algorithm is not available for the union view.
• As the 4D image may be shifted due to warping or deflection of board, jointly use the Z-axis correction function.
n NOTE
If the position is higher than the board surface such as a component surfece, 4D image changes depending on the
relative position of the 4D angular camera and the inspection step position. Create the step near the board surface.

1. Check that the "Luminance" is selected in the "Light Sampling Type".
2. Press the [Inspection Direction] button and open the "Select the Inspecting direction." screen.
3. Select the image of direction that the inspection area can be seen most clearly and press the [OK]
button.
4. Press the [Detected] button and display the detection range in red.
5. Move the threshold slide bar and set the threshold that displays only the target solder in red.
4 Sampling parameters
Luminance
Select the image of direction

that inspection area can be
seen most clearly.
Threshold slide bar
[Detected] button Noise Cut

24479-P7-00
4-48
Detect parameters
24480-P7-00
Area Detection Size

Select the minimum detection size setting to recoginize solder from "Manual" or "Auto".
Position Align Type


• STD:
4
• Mask Align:

Judge parameters
24481-P7-00
Required Area Ratio (%)≥

When the ratio of the detected area to the step area is the set value or more, this is judged OK.

Step test
<Inspection Type: Insufficient Solder>
Detected
data
[Step]
button
24482-P7-00
4-49
Contents
1. Operator access control 5-1

1.1 Registering a new operator 5-1
1.2 Changing registered operator details 5-4
1.3 Editing groups 5-5
1.4 Editing access levels 5-7
2. Machine settings 5-8

2.1 Installation settings 5-9
2.2 Conveyor transfer settings 5-13
2.3 Secondary judgment settings 5-14
2.4 Server settings 5-15
2.5 Library settings 5-17
2.6 Editing signal tower settings 5-18
2.7 Data conversion settings 5-19
2.8 Vision Setting 5-20
2.9 Inspection Mode Setting 5-21
1. Operator access control
All machine operations are restricted by password. This section describes operator registration and editing,
password setting, and level setting and editing.
n NOTE
The settings described here can also be specified or edited by administrators with level 10 authority.
It is recommended that operator registration and work level editing be carried out before using the machine.
1.1 Registering a new operator

This section describes how to register a new operator.
1 Press the [Operator] button to open the "ID WINDOW" screen.

2 Specify the group name and operator name, and then enter a password.
1. Select "ADMINISTRATORS" from the "GROUP NAME" drop-down list, and select "Administrator" (level
10) from the "OPERATOR NAME" list.
2. Enter a password and press the [OK] button. (If no password is set, press the [OK] button.)
"ID WINDOW" screen
Select "Administrators".
Select "Administrator".
Inspection machine settings
24501-P7-20
5-1
3 Press the [Operator Management] button on the Setup screen.
The "Operator Management" screen appears.
4 Press the [Operator Setting] button.

The "Operator Setting" screen appears.
"Operator setting" screen
2 4
5
24502-P7-10
1. GROUP NAME
Two group names "Administrators" and "Operators" are registered by default. New groups can be registered as needed by
the administrator or the registered groups can be deleted. Refer to "1.3 Editing groups" explained later on.
2. Operator list
This list shows the operator names and their access levels registered in each group.
TIP
In each group, an operator is registered by default, such as "Administrator" or "Default Operator".
3. [INS] button
Pressing this button opens the "EDIT OPERATOR" screen. Register a new operator and set the password and access level.
4. [EDIT] button
Press this button when you want to change a registered operator name, access level, and/or password.
c CAUTION
The "Administrator" and "Default Operator" names that are registered by default cannot be changed.
5. [DEL] button
Use this button to delete a registered operator. Select the operator you want to delete and then press this button.
c CAUTION
The "Administrator" and "Default Operator" that are registered by default cannot be deleted.
5-2
5 Press the [INS] button to register an operator.
The "EDIT OPERATOR" screen appears. Set each item as explained below.
"EDIT OPERATOR" screen
3 6
24503-P7-10
1. OPERATOR NAME
Register the name of an operator who will use the inspection machine. Enter the operator name using alphanumeric
characters. The number of input characters is not limited, but about only 35 alphanumeric characters will appear in the
"OPERATOR NAME" box of the [EDIT OPERATOR] screen.
n NOTE
The following characters can be used in operator names.
abcdefghijklmnopqrstuvwxyzABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789_
Double quotation marks ( " ) and commas ( , ) cannot be used.
2. OPERATOR ID
Not Use
5
3. LEVEL (access level)
Machine operating restrictions are classified by level. Select the applicable level from the drop-down list.
TIP
If changing the previously set work level, see section, "1.4 Editing the level", described later.

n NOTE
The Level 0 operation range is the most restrictive, while the Level 10 operation range allows full access.
4. PASSWORD
Set the password required by the operator being registered to log in to the machine.
Enter a password of up to 31 alphanumeric characters. Only 31 characters will be set even if you enter more than 31
characters.
TIP
No password can be set for pre-registered "Default Operator".
5. VERIFICATION OF PASSWORD
To prevent typing mistakes, again enter the password you have just entered in the "PASSWORD" box.
6. GROUP
Set the operator name in a group.
Select the group where the operator name should be registered. You can select "Administrators" or "Operators" or any
group you have registered, by checking the corresponding check box.
TIP
For details on group registration, see section, "1.3 Editing groups", described later.
6 Press the [OK] button to save the settings.

The display then returns to the "EDIT OPERATOR" screen. Check that the added operator name now
appears in the "OPERATOR NAME" list and then press the [Close] button.
The addition of the operator is then complete.
5-3
1.2 Changing registered operator details
The access level and password of a registered operator can be changed. Also refer to the previous section "1.1
Registering a new operator" for on-screen operation.

2 Press the [Operator Setting] button.

The "Operator Setting" screen appears.
3 Select the group name and then the operator.

After selecting the group, select the operator whose contents you want to change from the "OPERATOR
NAME" list.
4 Press the [EDIT] button.

The "EDIT OPERATOR" screen changes to allow editing the setting. Change the setting of each item.
TIP
The "Administrator" is allowed to change all operators' passwords.
5 Press the [OK] button to save the settings.
5
5-4
1.3 Editing groups
This section describes how to rename or add a group, or add or delete an operator.

2 Press the [Group Setting] button.

The "Group edit" screen appears.
"Group Edit" screen
24504-P7-10
1. GROUP NAME, Heads

This shows a list of the registered groups and the number of operators registered in each group.
2. [INS] button 5
This button is used to add a new group. From the operator list in the group, put a check mark on a member to be
registered into a new group, enter the name in the "GROUP NAME" box, and then press the [OK] button.

"Group Edit" screen
Enter group name.
Put a check mark on a

member to be registered.
24505-P7-10
5-5
3. [EDIT] button
This button is used to change the registered group name, registered operator in the group, and operator level. A list of
registered operators and operators registered by default are displayed in the "EDIT OPERATOR" screen. Operators with
"Entry" check box selected belong to the selected group.
• To change the group name:
Enter a new name in the "GROUP NAME" box.
• If adding an operator to a group
Select the "Entry" check box for the operator to be added to the group. Clear the "Entry" check box for the operator to
be removed from the group. The same operator can be registered in multiple groups.
c CAUTION
The "Administrator" operator in the "Administrators" group cannot be unregistered (check mark cannot be removed).
The "Default Operator" in the "Operators" group cannot be unregistered (check mark cannot be removed).
• To change the access level:

Click the "LEVEL" field to display a drop-down list, and select the level.
c CAUTION
The "Administrator" and "Default Operator" access levels cannot be changed.
"Group Edit" screen
Enter a new name to change

the current group name.
Select the group.
5
Place a check mark next to

the operator you want to
add to the group.
Select a level from the list that drops down.

24506-P7-10
4. [DEL] button
Use this button to delete a registered group. Select the group you want to delete and press this button. When a confirma-
tion dialog box appears, press the [OK] button.
n NOTE
If an operator was only registered in the group you have deleted, that operator is automatically registered in the
"Operators" group that is registered by default.
c CAUTION
The pre-registered "Administrators" and "Operators" groups cannot be deleted.
5-6
1.4 Editing access levels
This section describes how to set work levels for each type of work. The level can only be set by operators with
level equal to or higher than the work level.

2 Press the [Level] button.

The "LEVEL EDIT" screen appears.
"LEVEL EDIT" screen
5
24507-P7-10
3 Set the level for each item.

Select the applicable item, and set the level from the "LEVEL" field drop-down list.

Editing each item
Select item you want to set.
Select the level.
24508-P7-10
4 Press the [OK] button when setting is complete.

The display returns to the [Operator Management] screen. Press the [Close] button to close the screen.
5-7
2. Machine settings
Press the [Machine] button in the button area to specify default settings for all machine functions and to specify
detailed settings. This section describes the tree view items and operation buttons in the machine settings screen.
The settings that appear when tree view items are selected are described from section 2.1, "Installation settings".
c CAUTION
• Administrator privileges are required to change machine settings.
• All machine settings and parameters are set before the machine is shipped (or installed). The machine may not
operate correctly if changes are made to the machine settings, and therefore caution is advised.
• After changing machine settings, press the [Setup] screen - [System Backup] button to save the system backup.
• If checking the settings, or when it is necessary to specify the settings again, refer to the following description.
"Machine settings" screen
Tree view
Setting items
[Apply] button
5
24509-P7-20
■ Tree view items and operation buttons

Item Details
Machine
Installation Setting Specifies machine installation settings. (See "2.1 Installation settings", in this chapter.)
Information
Conveyor Setting Sets the board loading and unloading positions. (See "2.2 Conveyor transfer settings", in this chapter.)
Second Judge Specifies secondary judgment settings. NG reasons can also be edited.
Setting (See "2.3 Secondary judgment settings", in this chapter.)
Specifies option software settings and data save path settings.
Server Setting
(See "2.4 Server settings", in this chapter.)
Lib Setting Specifies library settings. (See "2.5 Library settings", in this chapter.)
Specifies settings when the machine is equipped with optional Repair Station or marking unit.
• If the machine is equipped with a Repair Station, the board ID when transmitting
Board ID Setting inspection results is specified.
• If the machine is equipped with a marking unit, the board ID written on the board is specified.
Refer to the respective operation manuals for details.
Specifies signal tower and buzzer settings based on the machine operation and inspection
Signal Tower Edit
status. (See "2.6 Editing signal tower settings", in this chapter.)
Data Conversion Sets conditions when converting mount data (YGX) to inspection machine data.
Setting (See "2.7 Data conversion settings", in this chapter.)
Vision Setting Sets the camera, image processing, etc (See "2.8 Vision Setting", in this chapter.)
X-Ray Mode Set if the machine is equipped with the X-Ray inspection device. Set the parameter regarding the X-Ray.
Inspection Mode Perform each setting regarding the inspection mode. (See "2.9 Inspection Mode Setting", in
Setting this chapter.)
Special
Function Setting Special functions can be added, and the use or non-use of functions can be specified.
Setting
Detail Setting Specifies details for special settings.
[Apply] button Press the [Apply] button to save the changed content.
c CAUTION
If settings are changed, press the [Apply] button to save the settings. If a message appears, follow the instructions provided.
5-8
2.1 Installation settings
This section describes the installation settings of the inspection machine.

"Setting" → "Machine Information" → "Installation Setting" 1/4
Basic
24510-P7-20
Item Details
Basic Brand Displays the brand name of this machine.
Machine Type Displays the machine type.
Sub Machine Type Displays the sub machine type.
Serial No. Displays the machine serial No.
Enter the machine name appended to data sent to the Repair

Machine Name
Station (option).
OS Language Sets the OS language used.
Head Variation Sets the type of the head installed on the machine.
Line Name Enter the line name which inspection machine was installed.
Select the process of setting this inspection machine from "After

Process Type
Print", "After Mount", or "After Reflow".
5-9
Conveyor
24511-P7-20
Item Details
Conveyor Fixed Conveyor Displays the standard conveyor when changing the conveyor width.
AUTO Width If "ON" is displayed, the conveyor width is changed when reading the program.
Adjustment If "OFF" is displayed, the conveyor width is not changed automatically.
Conveyor Variation Sets the conveyor type from "single-lane" or "dual-lane".
ConvFlowDirection Displays the conveyor flow direction.
Waiting Sub Stopper

Where using the sub stopper unit, set to [Use].
Unit Setting
Inspect Board Size (mm) Enter the board size X (mm) that can be inspected.
Exit Pos Waiting

Sets the board size X (mm) that can wait at the exit position.
Board Size (mm)
5
Conveyor Transfer Mode Operate in the "Normal" mode.
2nd Main Stopper

Where the second main stopper unit is installed, set to "Use".
Unit Setting
Inspect Separate
Set the width X of the area for the first inspection.
Position X (mm)
2nd Main Stopper
Set the position of the second stopper from the main stopper.
offset X (mm)
Exit Stopper Unit
Where the exit stopper unit is installed, set to "Use".
Setting
Board Cooling (sec) Sets the waiting time at the conveyor entrance for board cooling.
Board Waiting Timer Specifies the conveyor idling time until the board is clamped after hitting the stopper
(msec) when performing board loading.
Carry Out Timer
Specifies the conveyor idling time when unloading boards.
(msec)
Upper Handing *2 Sets the specification for the transfer of board signals with the upstream machine.*
Lower Handing *2 Sets the specification for the transfer of board signals with the downstream machine.*
Stops the machine and sets the timing of the message output when an NG board
occurs during automatic inspection.
Select from "No Use", "Before Export", and "After Export".
• No Use
NG Stop This function is not used.
• Before Export
Displays a message at the inspection position.
• After Export
Displays a message after unloading the board from the machine.
Set the board transfer mode from "Normal", "Demo Return" and "Demo Fixed".
• Normal
Select this mode for the normal automatic inspection.
• Demo Return
Conveyor Spec Select this mode to transfer the same board to perform the automatic inspection
continuously.
• Demo Fixed
Select this mode to perform the automatic inspection continuously
while not transferring the same board.
*1 Signals during auto inspection can be checked on the [Auto Inspection] - [Conveyor] tab screen.
5-10
1
2
3
Item Details
Maker
1 Maker Unit Sets "USE" when the marking unit is installed.
(Option)
Ink Check Interval
Sets the friction check interval with the number of boards.
(markings)
Head up wait time
Sets the waiting time until the head moves up.
(msec)
Head down wait time
Sets the waiting time until the head moves down.
(msec)
Laser height
2 Laser Unit Sets "USE" when the laser height unit is installed.
unit (Option)
Slant
3 Camera 4D Angular Camera Sets "USE" when the slant view camera is installed.
(Option)
Capture Opt Slant Select "Execute" when capturing optical slant images during the
Image in Auto automatic inspection.
3D Projector
4 3D Projector *3 Where equipped with the 3D projector unit, select "Use".
(Option)
Unit ID North *3 Selects "ID1" when used.
Unit ID South
Unit ID East *3
*3
Selects "ID3" when used.
Selects "ID2" when used.

5
Unit ID West *3 Selects "ID0" when used.

*1 Offline iPro also needs the settings.
5-11
3
1
4
2
5
6
24519-P7-00
Item Details
1 Function Setting Running Mode Select the operating mode from "Inline" and "Offline".
Counter is initialized When set to "Use", the production information is initialized when loading the
after program loading inspection data.
Selects the steps to be skipped when an NG occurs.
• NON
Inspection is not skipped.
Inspection skip of NG
• Ref unit
parts
Skips the steps after the same Ref. No. to start the inspection from the next parts.
• Pin unit
Skips the steps after the same pin No. to start the inspection from the next pin.
Color Theme Select the display color of the screen from the drop-down list.
2 Image Setting Sets the image save destination.

• Save to Board Data
Image Collection Saves the images into the inspection program.
Mode • Save to Library
Saves the images as library images. These images can be referred to from
other inspection program.
Selects the file format for saving images from "JPG", "BMP", or "PNG". "JPG"
5
should normally be selected. If "BMP" is selected, inspection images can be
OK/NG Image Quality saved as is, however, the time required to save images is longer than that for
"JPG", and more space is required. Inspection will stop if there is insufficient
backup space, and therefore caution is advised.
Image Auto SAVE *1 Select "Execute" when saving the inspection image automatically.
Sets the maximum OK number of boards saving to a program. The number can
MAX OK Collection
be entered without limitation.
Sets the maximum NG number of boards saving to a program without limitation.
MAX NG Collection
The number can be entered directly.
Auto Deletion of Parts Select "Delete Past Image" when deleting the Parts Image Collection after the
Image Collection specified days are past.
Displayed when selecting "Delete Past Image" from the "Auto Deletion of Parts
Past Day
Image Collection". Set the Past Day (Default: 30 days).
Periodic Light
3 Cycle Set to perform a periodic lighting check. Select from "No Use", "Daily", or "Weekly".
Check *2
Specifies the lighting check start time when "Daily" or "Weekly" is selected for
Start Time
the "Cycle".
Specifies the day on which the lighting check is performed when "Weekly" is
Week
selected for the "Cycle".
Auto Calibration
4 Auto Calibration 3D Select "Execute" when using the 3D automatic calibration.
3D
Exec Cycle (-1H) Set the interval of the 3D automatic execution within one hour after starting up
(mm) the inspection machine.
Exec Cycle (1H-) Set the interval of the 3D automatic execution after one hour after starting up
(mm) the inspection machine.
Tolerance (µm) Set the tolerance during the calibration.
Waiting Timer for

5 Vision Displays the time until image capturing is started after the camera has moved.
Sampling (mm)
Hard Disk Capacity Enter the hard disk space to display the message of the hard disk capacity
6 Warning Level
Warning warning.
Warning Level Unit Select the "Warning Level Unit" from Ratio (%) or Capacity (GB).
*1 The images are saved into the NgImage folder under the inspection data folder.
*2 When "Periodic Light Check" is set, the lighting is analyzed before performing the auto inspection of the first board after the set period has elapsed..
5-12
2.2 Conveyor transfer settings
This section describes the setting items in relation to the board loading and unloading positions and so on.

"Setting" → "Machine Information" → "Conveyor Setting"
1 2
24512-P7-10
Item Details
Auto Manual
1 Board Transfer control
(When performing automatic inspection) (When performing manual inspection)
IN Sets the board entrance.
OUT Sets the board exit.
NG CONT Sets the board exit when NG results continue.
Cancel Sets the board exit when inspection is canceled.
Downstream signals are monitored when the check box is selected.

2 Monitor Post-Process
This parameter sets the time for monitoring the downstream signal for "Time Out".
An alarm goes off if not receiving the "Busy In" signal from the downstream within the set
Time Out (sec)
time duration of Time Out.
5-13
2.3 Secondar y judgment settings
By setting "Second Judge Func" to "Use", a "Judge" tab is added to the "Auto" screen, and an OK or NG result is
judged for all NG steps when board inspection is complete. Furthermore, by registering the NG reason and
color in the "NG Reason List", the NG reasons used when performing judgment can be changed. The position
of the parts on the board image displays with a line in the registered color. For details on the "Judge" tab, see
section 2.2.1, "Second judge", in Chapter 1.

"Setting" → "Machine Information" → "Second Judge Setting"
2 1
24513-P7-10
Item/button name Details
1 Second Judge Func Select "Use" to use the secondary judgment function.
Select the timing at which secondary judgment is performed from
5
"After Carry out" or "After Inspection".
• After Carry out
2 Judgment timing Performs judgment after unloading the board from the inspection
machine.
• After Inspection
Performs judgment after performing automatic inspection.
By selecting this check box, OK/NG judgment is possible in step
3 Judgment by Step
units. If not selected, judgment is performed in parts units.

Press this button to register a new NG reason.
By selecting a registered NG reason and pressing this button, a
4 Add New
new entry row is added below the selected NG reason.
NG Reason List Enter a new NG reason in the added row, and then select a color.
Press this button to delete a registered NG reason.
5 Delete
Select the NG reason to be selected and press the [Delete] button.
5-14
2.4 Ser ver settings
This section describes the setting items in relation to option software and server paths.

"Setting" → "Machine Information" → "Server Setting"
1
2
3
5 4
6
9
7
10
11
24514-P7-20
Item Details
Repair Station
1 Repair Station Sets whether to use the Repair Station.
(option) *1
5
Selects the data to be sent to the Repair Station from "All", "Only
Send Condition
OK", or "Only NG".
Select the transmission file format from "CSV Format" and "XML
Format".
Select the same file format you have selected here as the send file
Send File Format
format for the file format received by the repair station. For sending
3D images and slant view images to the repair station, select the

XLM file format.
NG Image Folder Set this parameter to "Use" when using the NG image folder.
Sets whether to manage by lot No. By setting to "Use", data is

Management by
displayed in lot Nos. in the "Wait Judge List " used at the Repair
LotNo
Station.
This is displayed when "Management by LotNo" is set to "Use".
Sets whether to notify iPro Macro (option) of the lot end. By setting
Notify Lot End
to "Use", data is gathered if receiving lot end notifications when iPro
Macro (option) is started.
Repair Station Path: Remote Judgment Path Press the [Browse] button and specify the folder to save the repair
2
(option) *1 station judgment data.
Remote Judge Remote Judgment
3 Sets whether to use remote judgment.
(option) *2 Station
Remote Judgment Path: Remote Judgment Press the [Browse] button and specify the folder to save the remote
4
Path (option) *2 station judgment data.
Selects the light to save the image used in Repair Station and
Remote Judgement Station.
• Only Used Light
Saves images with lighting used for inspection.
Repair Station &
5 Select Light • All Light
Remote Judge
Saves images with all lightings (U, H, M, L).
• Only One Light
Saves M lighting images. If M lighting is not used, L lighting
images are saved.
5-15
Item Details
By setting to "Use", inspection results data is automatically saved to

6 SPC Data Setup SPC Text Out the specified folder. Refer to "Select the folder to save the SPC" for
details on the save destination folder.
Selects the lighting used when saving images.
• Only Used Light
Saves images with lighting used for inspection.
• All Light
Select Light
Saves images with all lightings (U, H, M, L).
• Only One Light
Saves M lighting images. If M lighting is not used, L lighting
images are saved.
Select the image size when saving from "Standard" or "1/2
Filesize Reduction
Reduction".
Set when setting "SPC Text Out" to "Use". Press the [Browse]
7 SPC file path for the production button and specify the destination folder for saving the SPC data.
The data is saved to "iProDB (option)".
Set when setting "SPC Text Out" to "Use". Press the [Browse]
8 SPC file path for the tuning button and specify the destination folder for saving the SPC tuning
data. The data is not saved to "iProDB (option)".
Enabled when setting "SPC Text Out" to "Use". If using "iProDB
9 DB Setting SPC DataBase
(option)", select "Use".
Enabled when setting "SPC DataBase" to "Use". Enter the host
Host Name name or IP address of the computer that iProDB (option) software
was installed.
Enabled when setting "SPC DataBase" to "Use". Enter the Port
Port Number
Number (Default: 5432).
Enabled when setting "SPC DataBase" to "Use". Enter the
DataBase Name
DataBase Name (Default: spcData).
If using inspection programs saved to a location other than the
"Machine" folder, select the "Use Server Data" check box, and then
10 Loading Setting of Program
press the [Browse] button to specify the save destination folder for
inspection programs.
When synchronizing with the specified personal computer, check on
[Time Matching] and press the [Browse] button to specify the time
reference destination.
5
11 Time Matching
For the specified personal computer with the login user name set,
check on [Login by User Name], and then set the login user name
and password.
*1 : For details on the Repair Station, see the "Repair Station Manual" contained in the application CD.
*2 : For details on the Remote Judgment Station, see the "Remote Judgment Station Manual" contained in the application CD.
5-16
2.5 Librar y settings
This section describes the setting items in relation to parts libraries.

"Setting" → "Machine Information" → "Lib Setting"
1
[Path setting] buttons
2
24515-P7-20
Item Details
Select "Use" if setting the library save destination to a location other

1 Load setting of library Use Lib Server
than the "Machine" folder.
Displays the library save location when "Use" is selected for "Use
Server Path Lib Server". If wishing to change the save location or settings, press
the path setting button on the right.
If using a shape data table file linking mounter parts names and Lib
2 Shape data table file Use library table file
parts name when converting data, select "Use".
Displays the shape data table file save location referenced when
Library table file path "Use" is selected for "Use library table file". If wishing to change the
save location or settings, press the path setting button on the right.
Displays the save destination where the table that corresponds the
User Parts format device manufacturer's part numbers to the part names used by the
table file path mounting data is saved. To set or change the storage place, press
the path setting button and make the selections.
Condition of By selecting this check box, the inspection character string for
5
3 No changes to OCR
Deployment character recognition when deploying libraries is not changed.
Set LibParts from Deploys Lib parts name from the library table when deploying
library table file libraries.
Displays the data save destination when text output button is
4 Library Text Out Path pressed at the library details screen. If wishing to change the save
location or settings, press the path setting button on the right.
5-17
2.6 Editing signal tower settings
This section describes the settings for the signal tower. The signal tower has the first lamp, second lamp and
third lamp from top to bottom.
Settings are specified for the first lamp to the third lamp.
Signal tower display settings
The signal tower display settings are specified for all inspection machine statuses. Select either "No Control", "OFF",
"ON", or "BRINK" from the drop-down list for the three lamps. Refer to the following table for details on the items that
can be set.
Buzzer settings
The buzzer settings are specified for all inspection machine statuses. Select either "No Control", "OFF", "ON",
"INTERMITTENT" or "BEEP" from the drop-down list for the three lamps.

"Setting" → "Machine Information" → "Signal Tower Edit"
Signal tower display settings Buzzer setting
24516-P7-20
5 Color
Item
Lamp color display

Status
Waiting for Board Waiting for board loading

Auto inspecting During automatic inspection
Waiting for Judgment Waiting for judgment from secondary judgment screen
Exception of Auto Other than automatic inspection
Machine Error During machine error
Emergency Stop Emergency stop condition
Returning to origin Returning to origin
Warmup Performing a warmup
Reserved CycleStop Awaiting cycle stop
Manual Operation During manual operation
Pause Operation paused
Warning During machine warning
Waiting for External Judgment Waiting for judgment from Remote Judgment Station (option)
Information Displaying Information massage
Question Message Displaying Question Massage
TIP
Regarding items setting the parameters to "No Control", the state of signal tower and the buzzer remains unchanged
even if the inspection machine is changed to the status.
5-18
2.7 Data conversion settings
This section describes the detailed setting items for creating an inspection program from the mount data.
TIP
For details on data conversion operation, see section 2.2, "From data conversion to image saving", in Chapter 2.

"Setting" → "Machine Information" → "Data Conversion Setting"
24517-P7-10
Item Details
YGX Data Path Specifies the folder in which the YGX data to be converted is saved.
Mounter Flow Dir Selects the mounter flow direction.
Fixed Conveyor Selects the mounter fixed side conveyor.
Board OriginX(mm) Enter the board origin X coordinate to be converted.
Board OriginY(mm) Enter the board origin Y coordinate to be converted.
Specifies whether to set the library table "Parts Name" or "Comment" as the
Sharp Find Key
inspection data parts name when converting data.
Skip Data Conversion Sets whether to convert parts skipped in YGX data to inspection machine data.
5-19
2.8 Vision Setting
This section describes the setting items regarding the camera and the image processing.

"Setting" → "Machine Information" → "Vision Setting"
24520-P7-00
Item Details
5
When using Height Linearity, select "Use". 3D height measurement
Height Linearity accuracy such as connector or aluminum electrolytic capacitor is
1 Vision Setting improved by using this function.
When using 3D Noise Cut, select the noise cut processing from the
3D Noise Cut
drop-down list.
2 Vision Board Displays the Vision Board setting.

3 Camera Setting Displays the camera parameter setting.
5-20
2.9 Inspection Mode Setting
This section describes the setting items regarding the Inspection Mode Setting.

"Setting" → "Machine Information" → "Inspection Mode Setting"
24521-P7-00
Details
Item
Production Initial Production Tuning
Mode name can be entered and changed.
Name If the field is blank, the default name ("Production", "Initial Production", or "Tuning") is
displayed.
If clicking the field, the inspection mode area color of the status area can be changed (Default
Color
color: white).
Regarding the automatic saving of inspection image, select "Don't use", "Ng Image", or "All
Image".
• Don't use
Automatic saving of inspection image is not performed.
Image Auto Save
• Ng Image
Saves NG image and fiducial mark image when NG occurred.
• All Image
Saves all view images and fiducial mark images.
When outputting SPC data, select "SPC file path for the production" or "SPC file path for the
SPC Text Out
tuning".
5
Save OK Image Tick the checkbox when saving the image which inspection result is "OK".
Save NG Image Tick the checkbox when saving the image which inspection result is "NG".
Repair Station Data Output *1 Select "Use" when sending the data to the Repair Judgement Station.
Remote Judgement Station

Select "Use" when sending the data to the Remote Judgement Station.
Data Output *2
Second Judge *3 Select "Use" when performing Second Judge.
MARKING *4 Select "Use" when using Marking Unit.
*1 The setting of this function is enable only when selecting "Use" from "Repair Station" on [Machine Information] - [Server Setting] screen.
*2 The setting of this function is enable only when selecting "Use" from "Remote Judgement Station" on [Machine Information] - [Server Setting] screen.
*3 The setting of this function is enable only when selecting "Use" from "Second Judge Func" on [Machine Information] - [Second Judge Setting] screen.
*4 The setting of this function is enable if the inspection machine is equipped with the marking unit (option).
5-21
Appendix
Appendix
Contents
1. List of keyboard shortcut keys A-1
2. I/O List A-2

1. List of keyboard shor tcut keys
The following shortcut keys can be used at the [Data Edit] – [Mount], [Parts] screen or [Auto Inspection] –
[Judge] screen.
Appendix
List of shortcut key functions
F1 Ins
Del
F Home
End
Ctrl Fn C V ← → ↑ ↓
23002-P7-00
■ Shortcut function list
Shortcut keys Applicable screen Function
Fn + Home Moves the cursor to the first step in the selected view.
[Data Edit] - [Step] screen
Fn + End Moves the cursor to the last step in the selected view.
Deletes the mount data or step data of the selected step (red
Del
rectangle).
Ctrl + F Displays a search dialog box.
Copies the mount data or step data of the selected step (red
Ctrl + C
rectangle) into the clipboard.
On the [Mount] screen, the mount data copied on the clipboard
is inserted in the row next to the selected row.
Ctrl + V Data Edit]-[Mount], [Parts] screen
On the [Parts] screen, a dialog box appears, showing how to
insert data.
On the [Mount] screen, the selected library (red) is moved in
the arrow direction.
On the [Parts] screen, the selected step (red bold line
← → ↑ ↓
rectangular) is moved in the arrow direction.
Press the button to change the movement pitch.
This parameter selects more than one step.
Ctrl + Step click Clicking the selected step while holding down the Ctrl key
Data Edit]-[Parts] screen
will cancel the selection.
F1 Selects all steps of the selected parts.
This is the same operation as pressing the [OK] button on the

Ins
operation screen.
[Auto Inspection]–[Judge] screen.
This is the same operation as pressing the [NG] button on the
Del
operation screen.
A-1
2. I/O List
The following describes the output and input signals on [Unit] - [I/O] screen.
Appendix
[I/O] screen
List description
Address Type Bit number
Output Signal Input Signal

24000-P7-00
■ Output Signal List

Address Type Bit number Signal description Status
T010003 OTHERS 7 READY-OUT 0 ：NOT READY 1 ：READY
T010004 OTHERS 0 OP.PANEL (READY) 0 ：OFF 1 ：ON
T010006 CONVEYOR 0~7 CONV MOTOR SPEED ---
T01000A CONVEYOR 0 CONV MOTOR ERROR CLEAR ---
1 CONVEYOR ON 0 ：OFF 1 ：ON
2 CONVEYOR REVERSE 0 ：NORMAL 1 ：REVERSE
T01000B CONVEYOR 0 PCB CLAMP1
1 PCB CLAMP2
2 PUSH UP
0 ：OFF 1 ：ON
3 MAIN STOPPER
4 SUB STOPPER
5 2ND MAIN STOPPER
T01000D OTHERS 0 BLUE/YELLOW LAMP (ERROR)
WHITE/RED LAMP
1
(EMERGENCY STOP)
2 GREEN/GREEN LAMP(RUN)
3 LAMP 5 0 ：OFF 1 ：ON
4 LAMP 6
5 LAMP 7
6 BUZZER
T01000E CONVEYOR 0 CONV SENSOR TUNING 0 ：OFF 1 ：ON
4 BUSY OUT (GATE OUT) 1 ：REQUEST
5 SMEMA BOARD AVAILABLE OUT 1 ：ACTION
6 OK SIGNAL
0 ：OFF 1 ：ON
7 NG SIGNAL
T130070 HEAD 0 Z AXIS BRAKE 0 ：OFF 1 ：ON
T130070 Marker 2 OP.MARKER HEAD 0 ：DOWN 1 ：UP
T130170 Marker 7 MARKER CAP 0 ：CLOSE 1 ：OPEN
A-2
■ Input Signal List
Bit
Address Type Signal description Status
number
N010028 OTHERS 0 OP.PANEL FRONT (READY) 0 ：OFF 1 ：ON
N01002B CONVEYOR 0 CONV MOTOR ERROR DETECT 0 ：NOT DETECT 1 ：DETECT
Appendix
ORIGIN & 1 ：NOT
N01002C 7 LANE1 W-AXIS ORIGIN 0 ：DETECT
LIMIT DETECT
N01002C CONVEYOR 4 PUSH UP UPPER

0 ：NOT DETECT 1 ：DETECT
6 MAIN STOPPER (RAIL2)
N01002E CONVEYOR 4 SUB STOPPER

5 PUSH UP LOWER
N01002F CONVEYOR 0 MAIN STOPPER (RAIL1)
1 CONVEYOR WAITING
2 CONVEYOR PCB DETECT
3 CONVEYOR WORKOUT
4 CONVEYOR ENTRANCE
5 CONVEYOR EXIT
6 2ND MAIN STOPPER (RAIL2)
7 2ND MAIN STOPPER (RAIL1)
N010030 INTERLOCK 2 AIR PRESSURE 0 ：ERROR 1 ：NORMAL
N010030 CONVEYOR 0 PU PIN DETECT 0 ：NOT DETECT 1 ：DETECT
N010032 CONVEYOR 0 BUSY IN (GATE IN)

1 BA IN
ORIGIN &
N010038 0 Y-AXIS ORIGIN 1 ：NOT
LIMIT 0 ：DETECT
DETECT
1 YT-AXIS OVER TRAVEL-
N010038 OTHERS 2 EMERGENCY STOP (HEAD)
3 EMERGENCY STOP (Y-AXIS OT-)
4 EMERGENCY STOP (SPARE) 0 ：NOT DETECT 1 ：DETECT

5 EMERGENCY STOP (C/R GOOD)
EMERGENCY STOP
6
(SERVO CONTROLLER 1)
1 ：NOT
7 EMERGENCY STOP (FRONT SW) 0 ：DETECT
DETECT
EMERGENCY STOP
N010039 OTHERS 0
(FRONT COVER SW) 0 ：NOT DETECT 1 ：DETECT
1~7 EMERGENCY STOP (SPARE)
N01003A OTHERS 0~7 EMERGENCY STOP (SPARE) 0 ：NOT DETECT 1 ：DETECT
ORIGIN & 1 ：NOT

N01003B 7 X-AXIS ORIGIN 0 ：DETECT
LIMIT DETECT
N01003B OTHERS 2 BASE CONTACTOR OK

0 ：NOT CONTACT 1 ：CONTACT
3 HEAD CONTACTOR OK
1 ：RELAY
6 SAFETY RELAY OK 0 ：RELAY OFF
ON
ORIGIN &
N01003E 1 X-AXIS OVER TRAVEL -
LIMIT
1 ：NOT
5 X-AXIS OVER TRAVEL + 0 ：DETECT
DETECT
7 Y-AXIS OVER TRAVEL +
A-3
Bit
Address Type Signal description Status
number
N01003F CONVEYOR 0 FAN ALARM FRONT LEFT SIDE 1
1 FAN ALARM LEFT SIDE PANEL 2 0 ：RUN 1 ：STOP
4 FAN ALARM REAR LEFT SIDE

Appendix
N130000 Marker 2 MARKER HEAD UP
3 MARKER HEAD MIDDLE 0 ：NOT DETECT 1 ：DETECT
4 MARKER HEAD DOWN
5 MAKER CAP OPEN 0 ：CLOSE 1 ：OPEN
6 MAKER CAP CLOSE 0 ：OPEN 1 ：CLOSE
N130000 HEAD 0 2D 24V MONITOR

0 ：OFF 1 ：ON
1 3D 24V MONITOR
N130100 HEAD 0 CAMERA FVAL
1 SERVO TRIGER
2 2D UH TEMP. MONITOR
3 DLP_ERROR
0 ：OFF 1 ：ON
4 2D L TEMP. MONITOR
5 CAM. 12V MONITOR
6 2D M TEMP. MONITOR
7 CAMERA TRIGER
N13012A HEAD 0~7 HEAD ERROR DETAIL
N13012B HEAD 0~7 HEAD ERROR DETAIL
N130130 HEAD 0~7 DLP1 ERROR DETAIL
N130132 HEAD 0|~7 DLP2 ERROR DETAIL 0-65535
A-4
INDEX C
Cell colors 2-60
[Detail] button 3-19
"Detection" results 3-52
INDEX
CE marking i Displaying 3D Top image 1-12
3D button 1-12,1-14 Change 1-2 Dummy feeder v
3D detailed button 1-12 Changing registered operator details 5-4 E

3D projector 3-33,4-30,4-36,5-11 character template 3-38 Editing access levels 5-7
3-stage dome lighting method 2-2 Checking libraries 3-15 Editing groups 5-5
4D angular camera 1-28,5-11 Code scan 2-76 Editing parts libraries 3-8
4D button 1-8,1-12 Code Scan screen 1-15 Editing registered characters 3-42
4D Foreign Object 4-45 Contents of each chapter iii Editing signal tower settings 5-18
4D Solder 4-48 Convert 1-3 Ending the automatic inspection 1-31

Conveyor screen 1-21,1-22 Example of parts library configuration
A
Conveyor transfer settings 5-13 3-53
Adding view images 2-40
[Create Parts] button 3-2 F
Algorithm 2-2,4-5
Create the new step data 3-10 Fiducial mark setting items 2-20
Algorithm list 4-3
Creating all views 2-41 Fiducial mark types
All Set button 3-24
Creating full board images 2-10 block fiducials 2-12
[Analysis] button 3-50,3-51
Creating new partial areas 3-9 board fiducials 2-12
[Assignment] button 2-74
Creating new parts libraries 3-1 local fiducials 2-12
[Auto Teach] button 2-39
Cycle Stop 1-16 Fiducial parameters 2-20
Auto creation function buttons 2-41
Fiducial screen 1-5
D
Auto Deletion of Parts Image Collection
[Flattery] button 3-13
2-19,5-12 Data Check 1-10
Flowchart for creating an inspection
Auto inspection screen 1-16 data conversion function 2-7
program 2-6
Auto Result 3-50 Data conversion settings 5-19
"FOD" screen 1-13
Auto Result tab 2-14 Data Edit screen 1-4
foreign object mask 2-70
[Auto Set] button 3-11,3-13 Data List by Parts Name 3-57
Foreign object parameter 2-65
Auto tuning 2-78 Data Rotate 1-4
Free area 1-1
[Auto Tuning] button 1-12,2-82 Date Edit screen 1-4
From data conversion to image saving
Datum Height 2-36,4-30
B 2-7
Measurement by Parts 2-36
Bad mark function 2-27
Measurement by View 2-38 G
Bad Mark screen 1-6,1-20
Datum Height Point 4-26 GROUP 5-3
Bad mark settings 2-28
"Datum Height Point" step 4-26 Grouping 1-12
Bad mark types
[Datum Teaching] button 3-13 [Group Setting] button 5-5
Block bad marks 2-27
DB Setting 5-16 H
Board bad mark 2-27
Deleting multiple views 2-45 Handling the X-ray unit viii
Local bad marks 2-27
Basic parameters 2-22 Deleting the block offset information 2-58 Height Linearity 5-20
Block code scan 2-76 Deploying the library 3-56 Height parameters 2-33
[Block delete] button 2-58 Description of Algorithm 4-5 "Height" screen 1-7
3D Height 4-30 History 1-24
Block input and copy of multiple views
3D Solder 4-38
2-46 I
No Wetting Inspection 4-42
Mount data update 2-54 inspection area
Volume Inspection 4-44
Pitch deployment 2-51 Body 2-4
Wetting Inspection 4-38,4-41
Rotate Deploy (Block Base) 2-46 Lead group 2-4
Body 4-5
Rotate Deploy (Parts Teach) 2-49 Neighbor of parts 2-5
Character 4-9
Board code scan 2-76 Others 2-5
Compare Height 4-36
Board parameter 1-4,2-17 THD 2-5
Compare Luminance 4-14
Board screen 1-4 Foreign Object 4-20 Inspection area 2-4,4-3
Body 4-3 Laser Measurement 4-26 Inspection complete screen 1-29,1-30
Button area 1-1,1-2 Lead 4-24 Inspection Information 3-8
Luminance 4-22 inspection mode 1-3,1-27,2-18
Button Z 1-7,1-12,1-14
Pattern 4-16
Buzzer settings 5-18 Initial Production Mode 1-3,2-18
Shape 4-12 Production Mode 1-3,2-18
[By Parts] button 3-57
Solder 4-18 Tuning Mode 1-3,2-18
Termination 4-7
S-1
Inspection Mode Setting 5-21 O S
Inspection screen 1-16 OCR Reg. button 3-24 Safety ii
INDEX
Inspect Only First Part 2-18,3-25 Offset Limit 3-22 Safety message xi
Installation settings 5-9 Operation screen 1-1 Same Mark 1-5
I/O List A-2 [Operator Setting] button 5-2 Same mark successive test function 2-14
Input Signal List A-3 Operator access control 5-1 Sampling 4-1
Output Signal List A-2
OPERATOR NAME 5-3 [Sampling] button 2-66,2-72,2-83,3-19,3-
I/O screen 1-23
optical inspection 2-2 27,3-34
J Origin 1-3,1-22 Sampling condition (based on light
Judge screen 1-20 Others 4-4 sampling type) 3-26
Judgment Mode 1-16 Output screen 1-19 Color 3-29
Judgment timing 5-14 Height (option) 3-33
P
K Pad information tuning 2-78
Luminance 3-26
Shape 3-31
keyboard shortcut keys A-1 IPC Rank Tuning 2-78
[Sampling Lib] button 3-19
L Step Dimensions Tuning 2-78
[Sampling Light] button 3-19
laser height unit 4-26,5-11 Page layout iv
Save 1-2
Lead group 2-5,4-3,4-4 [Partial Shape Edit Dialog] screen 3-10
Saving PWB image 2-79
LEVEL 5-3 Partial Information 3-8
Saving view images 2-16
[Level] button 5-7 Parts adding procedure 2-64
Secondary judgment settings 5-14
Library 2-1 Parts Image NG 1-8
Second judge 1-28
Library data by parts name 3-57 Parts Image OK 1-8
Select 1-3
Library settings 5-17 Parts library detail screen 3-53
Selecting inspection programs 1-26
Light Check 1-3,1-24,5-12 [Parts] screen 3-16
Selecting multiple views 2-44
Light detail settings 3-36 Basic parameters 3-16
Detect parameters 3-20 Server settings 5-15
[Light List] button 3-19
Judge parameters 3-22 [Set Area] button 3-21
Light Sampling Type 3-18
Option parameters 3-25 Setting fiducial marks 2-11
Load setting of library 5-17
Sampling parameters 3-18 Setting Inspection Types 4-1
Lot Edit 1-16 Parts screen 1-11 Setting libraries 2-63
M PASSWORD 5-3 Setting the block offset information 2-56
Machine settings 5-8 Pasting libraries 2-61 Setup screen 1-3
Managing mark libraries 2-26 Pattern registration 3-44 Shortening inspection time 2-41
Registering mark libraries 2-26 PCB Out Stop 1-16 Signal tower display settings 5-18
Setting the mark library 2-26
[Pick Shape] button 2-80 [Size Teaching] button 2-80,3-13
Manual contents i
Pin Expand 4-45 slant camera 1-28,5-11
Manuals supplied with machine i
Program change 1-3 solder fillet 4-38
Manual view creation procedure 2-42
Program list 1-3 SPC analysis 3-51
[Mask Add] button 3-25
R SPC Data Setup 5-16
Mask Teach button 3-25
[Recog. OCR] button 3-39 Special Setting 5-8
Meaning of Detected data 4-2
[Rect Set] button 2-74 standard library 2-61
Mount parameters 2-59
[Reduced Light] button 3-37 Starting automatic inspection 1-26,1-27
Mount screen 1-10
[Region Set] button 2-74 Status area 1-1
Multiple sampling conditions button 3-18
Registered character matching 3-43 Step Mask function 3-47
Registering a new operator 5-1 T
3-35
Registering the library 3-55 Thresh 1-6
Multi-test 3-48
Registering user characters 3-38 [Thresh] button 2-30
N
"Regist Pattern" tab 3-46 [Threshold] button 2-31
Neighbor of parts 4-4
Rotating 3D image 1-12 tuning 3-48
Newly creating a foreign object mask
Tuning tab 1-12
data 2-70
NG Reason List 5-14
NG steps list 1-28
S-2
U
Unit screen 1-22
INDEX
Utility tab 1-12
Utilizing sampling Lib 3-59
Registering sampling conditions 3-60
Setting sampling conditions 3-59
V
View 2-1
View Image OK 1-8
View Image PWB 1-8,2-16,2-40,2-79
View parameters 2-40
View point button 1-8,1-12
View screen 1-8
Vision Setting 5-20
W
Warning labels xv
Warranty ii
When NG detection occurs 1-28
Whole screen 1-17
Width 1-4,1-22
[Write Pattern] button 3-45
Z
Z axis correction 2-33
S-3
Programming Manual November 2016
Version 2.10
V3

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High-speed High-precision Hybrid AOI

1.1 To ensure safety

1.1.1 Defining safety

1.1.2 Causes of injuries and accidents

1.2 Using safety gear

1.3.2 Restricting machine operation with passwords

Air supply / exhaust switch

OFF position OFF position

• Do not turn off the compressed air during operation.

1.5 Cautions during power outages

1.6 Cautions regarding ferromagnetic fields

1.7 Handling the internal tape cutter

Prevention of hand entry

Dummy feeder (Wide-size)

Dummy feeder (8mm-size)

Prevention of hand entry

Upper muzzle plate

Board conveyance plane

Lower muzzle plate

Upper clearance Lower clearance Remarks

YS100, YS88 8.0 to 38.5mm 1.0 to 31.0mm

YS12, YS12P, YS12F, YS24,

YSM40/YSM40R 0 to 44.0mm 0 to 39.0mm

Z:LEX(YSM20/YSM20W) 0 to 36.0mm 4 to 40.0mm

YSB55w 0 to 10mm 6mm (fixed)

YSP 0 to 6.6mm 0 to 26.4mm

YSi-V 0 to 48.0mm 0 to 102mm

To prevent accidents caused by solvents

1.11 Handling the laser

Knowledge and information about laser

To prevent accidents caused by laser

Cautions on handling grease and oil

1.13 Handling batteries

Cautions on handling batteries

1.14 Handling heavy objects

Cautions on handling heavy objects

2. Do not use the material whose function is impaired by heating.

n Safety alert symbols and signal words

2.2.1 Safety instruction

3.1.1 Warning label format

Warning label format

WARNING Signal word panel

Mark and pictogram

3.1.2 Meaning of marks

Mark and pictogram

Warning mark Prohibition mark Instruction mark

WARNING WARNING WARNING

Meaning of the above

3.2.1 Handling safety covers

To prevent the electric shock or damage.

Example for machines that must be connected to 200 VAC

Before using the machine

3. Contents of each chapter iii

Chapter 1 Basic operation

2. Starting and ending inspection 1-25

2. Creating inspection programs 2-6

3. Setting inspection programs 2-17

Chapter 3 Creating parts libraries

2. Editing parts libraries 3-8

Chapter 4 Setting Inspection Types

2. Description of Algorithm 4-5

Chapter 5 Inspection machine settings

2. Machine settings 5-8