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MANUFACTURING PROCESS
Contents
1. 클린룸(Cleanroom)이란?
클린룸 5대 원칙
M1 350 10 75 2 30 1 10 0
1500cm
3500cm
1500cm
청정도 환기횟수
(Class) (Air circulation, 회/h)
10 400회 이상
100 200~400회
1,000 60~70회
10,000 30~40회
100,000 10~20회
Multi-crystalline silicon
(Solar)
• 단 * 다결정 웨이퍼 비교
10㎛
→ The textured surface not only reduces reflections, but also allows optical path
lengths that are longer than the thickness of the device by allowing light to
slant into the silicon.
◆ Chemical reaction
① 4POCl3 + 3O2 → 2P2O5 + 6Cl2
② 2P2O5 + 5Si → 4P + 5SiO2
③ xSiO2 + yP2O5 → yP2O5xSiO2(PSG)
Pre-deposition
[SEM image]
[SIMS profile]
Pressure Throttle
0 4.5 4.5 4.5 4.5
(Torr) Fully Open
Gas(sccm)
◆ Chemical reaction
SiH4+NH3+N2 → SixNy (Si3N4) + by-product
- Transmits sunlight without reflection at the interface between two media (atmospheric
& silicon wafers) with different refractive index.
- Surface passivation.
- Protecting the sun from moisture and temperature.
λ
Thickness d1= 4𝑛1
• Screen Printer & Dryer Equipment and Process (Rear Al, Front Ag)
[Dry image]
[Printing image]
Human Resources Development Institute 34
2. 결정질 실리콘 태양전지 제조공정 (Metallization)
② Dry
④ Dry
Best: 4%
Mass: 6~8%
- Since the distance traveled by the carrier in the emitter is not constant, the distance
of the finger bar should be designed so that the carrier can be sufficiently collected.
- For the front electrode, the firing process temperature and time are very important.
p type wafer
n+ emitter
Rear Al
electrode
Firing
p++ BSF
Rear Al (Back Surface Filed)
electrode
[Formation of back electrode and BSF by firing process]
• I-V Measurement 장비 및 공정 순서
• IPCE 장비 및 공정 순서
• SEM(전자주사현미경)
Texturing 표면